MY168172A - Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device - Google Patents

Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device

Info

Publication number
MY168172A
MY168172A MYPI2013001032A MYPI2013001032A MY168172A MY 168172 A MY168172 A MY 168172A MY PI2013001032 A MYPI2013001032 A MY PI2013001032A MY PI2013001032 A MYPI2013001032 A MY PI2013001032A MY 168172 A MY168172 A MY 168172A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
manufacturing
adhesive sheet
substrate
higher measured
Prior art date
Application number
MYPI2013001032A
Inventor
Kasuga Hidemasa
Yamai Atsufumi
Machii Satoru
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of MY168172A publication Critical patent/MY168172A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

AN ADHESIVE SHEET (10) FOR MANUFACTURING A SEMICONDUCTOR DEVICE IS DISCLOSED THAT INCLUDES A SUBSTRATE AND A THERMOSETTING ADHESIVE LAYER PROVIDED ON ONE SURFACE OF THE SUBSTRATE, AND DETACHABLY ADHERES TO A LEAD FRAME (20) OR A WIRING SUBSTRATE OF THE SEMICONDUCTOR DEVICE, WHEREIN THE ADHESIVE LAYER HAS: A PRE-HEATING ADHESIVE STRENGTH A OF 0.07 N/20 MM OR HIGHER MEASURED IN A SPECIFIC DETACHMENT TEST A; A POST-HEATING ADHESIVE STRENGTH B OF 0.58 N/20 MM OR HIGHER MEASURED IN A SPECIFIC DETACHMENT TEST B; AND A POST-HEATING ADHESIVE STRENGTH C OF 1.17 N/20 MM OR HIGHER MEASURED IN A SPECIFIC DETACHMENT TEST C. (FIG. 2)
MYPI2013001032A 2012-03-26 2013-03-25 Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device MY168172A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012070403A JP5937398B2 (en) 2012-03-26 2012-03-26 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
MY168172A true MY168172A (en) 2018-10-11

Family

ID=49363266

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013001032A MY168172A (en) 2012-03-26 2013-03-25 Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device

Country Status (5)

Country Link
JP (1) JP5937398B2 (en)
KR (1) KR101485660B1 (en)
CN (1) CN103360969B (en)
MY (1) MY168172A (en)
TW (1) TWI494408B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018088185A1 (en) 2016-11-09 2019-06-24 株式会社フジクラ Cleaning tool
KR102032767B1 (en) 2017-05-12 2019-10-17 (주)인랩 QFN semiconductor package, method of fabricating the same and mask sheet for manufacturing the same
JP6909171B2 (en) * 2018-02-12 2021-07-28 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
JP7240376B2 (en) * 2018-03-30 2023-03-15 リンテック株式会社 Laminate for preventing warp of cured sealant, and method for manufacturing cured sealant
WO2019187249A1 (en) * 2018-03-30 2019-10-03 リンテック株式会社 Multilayer body for preventing warp of cured sealed body and method for producing cured sealed body
CN113169076A (en) * 2018-12-24 2021-07-23 深圳市柔宇科技股份有限公司 Electronic device and method of manufacturing the same
CN109666434B (en) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 Adhesive, preparation method, adhesive film containing adhesive, preparation method and application
CN109825220A (en) * 2018-12-27 2019-05-31 新纶科技（常州）有限公司 Adhesive layer, stretching dehesion adhesive tape and preparation method thereof
JP7458374B2 (en) * 2019-03-26 2024-03-29 リンテック株式会社 release sheet
KR20210048012A (en) * 2019-10-22 2021-05-03 주식회사 엘지화학 Adhisive compound for semiconductor and film using the same
KR102313245B1 (en) 2021-01-04 2021-10-14 (주)인랩 Masking tape for semiconductor packaging

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839019B2 (en) * 1996-08-23 1998-12-16 日本電気株式会社 Method for manufacturing semiconductor device
JP3951411B2 (en) * 1998-02-17 2007-08-01 株式会社プライムポリマー Crystalline propylene block copolymer composition for automobile parts
CN1280883C (en) * 2002-04-03 2006-10-18 株式会社巴川制纸所 Binding sheet for mfg. semiconductor device
JP4562118B2 (en) * 2003-12-19 2010-10-13 日東電工株式会社 Manufacturing method of semiconductor device
JP2006165495A (en) 2004-05-18 2006-06-22 Mitsui Chemicals Inc Adhesive resin composite and its use
JP4863690B2 (en) * 2005-10-31 2012-01-25 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof
JP4654062B2 (en) * 2005-03-30 2011-03-16 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
EP1894662A2 (en) * 2006-08-29 2008-03-05 Nitto Denko Corporation Adhesive sheet for water jet laser dicing
JP4270282B2 (en) * 2007-01-23 2009-05-27 セイコーエプソン株式会社 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP2013201404A (en) 2013-10-03
JP5937398B2 (en) 2016-06-22
KR101485660B1 (en) 2015-01-22
TW201348387A (en) 2013-12-01
CN103360969B (en) 2015-10-14
TWI494408B (en) 2015-08-01
KR20130109070A (en) 2013-10-07
CN103360969A (en) 2013-10-23

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