MY161110A - Temporary adhesive tape for protecting a semiconductor wafer surface - Google Patents

Temporary adhesive tape for protecting a semiconductor wafer surface

Info

Publication number
MY161110A
MY161110A MYPI2014702618A MYPI2014702618A MY161110A MY 161110 A MY161110 A MY 161110A MY PI2014702618 A MYPI2014702618 A MY PI2014702618A MY PI2014702618 A MYPI2014702618 A MY PI2014702618A MY 161110 A MY161110 A MY 161110A
Authority
MY
Malaysia
Prior art keywords
temporary adhesive
layer
thickness
elasticity modulus
protecting
Prior art date
Application number
MYPI2014702618A
Inventor
Hirotoki Yokoi
Tomoaki Uchiyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY161110A publication Critical patent/MY161110A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A TEMPORARY ADHESIVE TAPE FOR PROTECTING A SEMICONDUCTOR WAFER SURFACE, WHICH HAS A TEMPORARY ADHESIVE LAYER ON A SUBSTRATE FILM, IN WHICH THE SUBSTRATE FILM HAS A TOTAL THICKNESS OF 50 TO 200 µM AND A RATIO OF HIGH-ELASTICITY MODULUS LAYER THICKNESS TO LOW-ELASTICITY MODULUS LAYER THICKNESS IS 1:9 TO 5:5, IN WHICH A HIGH-ELASTICITY MODULUS LAYER IS DISPOSED ON A BACK SURFACE OF THE TEMPORARY ADHESIVE LAYER, AND IS A LAYER COMPOSED OF POLYPROPYLENE OR LINEAR POLYETHYLENE WITH A THICKNESS OF 10 µM OR MORE, IN WHICH A LOW-ELASTICITY MODULUS LAYER IS COMPOSED OF AN ETHYLENE/VINYL ACETATE COPOLYMER HAVING A VINYL ACETATE CONTENT OF 5 TO 20% BY MASS AND AN MFR OF 0.8 TO 10 G/10-MIN, IN WHICH A THICKNESS OF THE TEMPORARY ADHESIVE LAYER IS 10 TO 50 µM, EITHER A TEMPORARY ADHESIVE FORCE TO AN SUS 280 POLISHED SURFACE UPON PEELING UNDER HEATING AT 50°C OR A TEMPORARY ADHESIVE FORCE THERETO AFTER IRRADIATION WITH A 500-MJ ULTRAVIOLET BEAM IS 1.0 N/25-MM OR LESS, AND IS 50% OR LESS OF A TEMPORARY ADHESIVE FORCE PRIOR TO HEATING OR PRIOR TO IRRADIATION WITH THE ULTRAVIOLET BEAM.
MYPI2014702618A 2012-03-19 2013-03-12 Temporary adhesive tape for protecting a semiconductor wafer surface MY161110A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012062725 2012-03-19
JP2012278733A JP5367903B2 (en) 2012-03-19 2012-12-20 Adhesive tape for semiconductor wafer surface protection

Publications (1)

Publication Number Publication Date
MY161110A true MY161110A (en) 2017-04-14

Family

ID=49222532

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702618A MY161110A (en) 2012-03-19 2013-03-12 Temporary adhesive tape for protecting a semiconductor wafer surface

Country Status (7)

Country Link
JP (1) JP5367903B2 (en)
KR (1) KR20140138693A (en)
CN (1) CN104185896B (en)
MY (1) MY161110A (en)
SG (1) SG11201405798SA (en)
TW (1) TWI462987B (en)
WO (1) WO2013141072A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016160276A (en) * 2015-02-26 2016-09-05 積水化学工業株式会社 Adhesive tape
JP5855299B1 (en) * 2015-03-02 2016-02-09 古河電気工業株式会社 Semiconductor wafer surface protecting adhesive tape and method for processing semiconductor wafer
CN108028190A (en) * 2015-10-29 2018-05-11 古河电气工业株式会社 The processing method of semiconductor wafer surface protection adhesive tape and semiconductor crystal wafer
EP3376528B1 (en) 2015-11-09 2022-09-14 Furukawa Electric Co., Ltd. Mask-integrated surface protection tape
CN107533964B (en) * 2015-11-09 2021-06-15 古河电气工业株式会社 Mask-integrated surface protection film
JP6611252B2 (en) * 2016-03-28 2019-11-27 リンテック株式会社 Semiconductor processing sheet
JP6851689B2 (en) * 2016-05-18 2021-03-31 日東電工株式会社 Back grind tape
KR101676025B1 (en) * 2016-06-30 2016-11-15 (주) 화인테크놀리지 Ultraviolet-curable adhesive sheet for grinding of back side after half-cut of a semiconductor wafer formed of circuit and Bumps
CN106398579B (en) * 2016-11-09 2022-06-10 宁波启合新材料科技有限公司 Adhesive tape for process protection
EP3786246A4 (en) * 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. Pressure-sensitive adhesive film and method for producing electronic device
WO2020137980A1 (en) * 2018-12-25 2020-07-02 積水化学工業株式会社 Adhesive tape
KR102099071B1 (en) * 2019-05-09 2020-05-18 길화소재 주식회사 Adhesive film for protecting semiconductor wafer and preparation method thereof
CN113583582A (en) * 2020-04-30 2021-11-02 华为技术有限公司 Protection film, protection film subassembly, display screen subassembly and terminal
CN113136148B (en) * 2021-03-06 2022-11-01 通瓦化学(上海)有限公司 Wafer grinding adhesive tape base material and preparation method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW578222B (en) * 2002-01-11 2004-03-01 Mitsui Chemicals Inc Semiconductor wafer surface protective adhesive tape and backside process method of semiconductor wafer using the same
JP4666565B2 (en) * 2003-10-06 2011-04-06 日東電工株式会社 Protective sheet for processing semiconductor wafer and method for grinding back surface of semiconductor wafer
JP4452127B2 (en) * 2004-06-01 2010-04-21 三井化学株式会社 Semiconductor wafer surface protecting adhesive film and semiconductor wafer protecting method using the adhesive film
TWI286828B (en) * 2004-11-12 2007-09-11 Mitsui Chemicals Inc Film-shaped adhesive and semiconductor package using the same
JP5328193B2 (en) * 2008-03-25 2013-10-30 グンゼ株式会社 Multilayer backgrind substrate film, backgrind film, and method for producing the same
JP5315750B2 (en) * 2008-03-31 2013-10-16 大日本印刷株式会社 Adhesive film
JP4851613B2 (en) * 2009-12-22 2012-01-11 古河電気工業株式会社 Adhesive tape for semiconductor wafer surface protection

Also Published As

Publication number Publication date
JP5367903B2 (en) 2013-12-11
CN104185896A (en) 2014-12-03
JP2013225647A (en) 2013-10-31
CN104185896B (en) 2016-11-16
WO2013141072A1 (en) 2013-09-26
SG11201405798SA (en) 2014-11-27
TW201339277A (en) 2013-10-01
KR20140138693A (en) 2014-12-04
TWI462987B (en) 2014-12-01

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