JP6482818B2 - Dicing sheet - Google Patents

Description

  The present invention relates to a dicing sheet to which an object to be cut is attached when an object to be cut such as a semiconductor wafer is cut and separated into element pieces.

  Semiconductor wafers such as silicon and gallium arsenide and various packages (hereinafter, these may be collectively referred to as “objects to be cut”) are manufactured in a large diameter state. It is cut and separated (diced).

  The object to be cut subjected to this dicing process is a dicing comprising a base film and a pressure-sensitive adhesive layer provided thereon for the purpose of ensuring the handleability of the object to be cut and chips in the dicing process and subsequent processes. The sheet is attached in advance to the surface of the workpiece on the side opposite to the side on which the cutting tool for cutting is close. In such a dicing sheet, a polyolefin film or a polyvinyl chloride film is usually used as a base film.

  In general full-cut dicing as a specific method of the dicing process, the object to be cut is cut by a rotating round blade (dicing blade). In full-cut dicing, the pressure-sensitive adhesive layer is cut beyond the material to be cut and the part of the base film is also cut so that the material to be cut with the dicing sheet attached is surely cut over the entire surface. There is a case.

  At this time, the dicing waste which consists of a material which comprises an adhesive layer and a base film may generate | occur | produce from a dicing sheet, and the chip | tip obtained may be contaminated with the dicing waste. One form of such dicing waste is thread-like dicing waste that adheres on the dicing line or near the cross section of the chip separated by dicing. Such a thread-like dicing waste has a problem that it is particularly prominent when the object to be cut is cut by two different types of dicing blades in the step-cut method.

  When the chip is sealed with a large amount of thread-like dicing waste as described above attached to the chip, the thread-like dicing waste attached to the chip is decomposed by the heat of sealing, and this pyrolyzate destroys the package. Or a device with a built-in chip may cause malfunction. Since this thread-like dicing waste is difficult to remove by washing, the yield of the dicing process is significantly reduced due to the occurrence of thread-like dicing waste.

  In addition, when dicing a package in which a plurality of chips are sealed with a cured resin as an object to be cut, a dicing blade having a thicker blade width is used than when dicing a semiconductor wafer. The depth of cut becomes deeper. For this reason, the amount of the base film that is cut and removed during dicing increases as compared with the case of the semiconductor wafer, and as a result, the amount of thread-like dicing waste generated tends to increase. Thus, when dicing is performed using a dicing sheet, it is required to prevent the generation of thread-like dicing waste.

  The workpiece to be cut after the dicing process is then subjected to a cleaning process, an expanding process, a pick-up process, and the like. Therefore, the dicing sheet is also required to have excellent expandability in the expanding process.

  For the purpose of suppressing the generation of such dicing waste, Patent Document 1 discloses that a base film consists of at least two layers in a semiconductor dicing tape formed by applying an adhesive to one side of a base film. The melting point of the resin of the layer in contact with the adhesive layer of the base film is 130 to 240 ° C., and at least one layer is in contact with the lower surface of the layer in contact with the adhesive layer. A sticky adhesive tape for semiconductor dicing is disclosed, wherein the hydrogenated butadiene copolymer is a resin composition layer comprising 20 to 400 parts by mass.

  Patent Document 2 discloses a dicing film in which an adhesive layer is laminated on a base material layer containing random propylene and an olefin-based elastomer as a film imparted with expandability in an expanding process.

JP 2005-174963 A JP2011-216595A

  However, in the base film of Patent Document 1, generation of thread-like dicing waste cannot be sufficiently prevented. Moreover, although the dicing film of patent document 2 is excellent in the expandability in an expanding process, generation | occurrence | production of a thread-like dicing waste was not fully prevented.

  By the way, a dicing sheet may stick to a semiconductor wafer under heating conditions. For this reason, when a dicing sheet that is weak against heat is used, it may be difficult to peel off due to softening due to heat, or may be fixed on a work table (die). Furthermore, if the dicing sheet is deformed such as distortion or warpage due to heat, the thinned semiconductor wafer may be deformed. For this reason, heat resistance is also required for the dicing sheet.

  This invention is made | formed in view of the above actual conditions, and it aims at providing the dicing sheet which was hard to produce the chip | tip by dicing and was excellent in heat resistance and expansibility.

  In order to achieve the above object, the present invention is a dicing sheet comprising a dicing sheet base material and an adhesive layer laminated on one surface of the dicing sheet base material, wherein the dicing sheet base material is , An ethylene / α, β-unsaturated carboxylic acid copolymer (A), (i) a structural unit derived from α-olefin, and (ii) a structure derived from glycidyl (meth) acrylate or glycidyl unsaturated ether Provided is a dicing sheet comprising a layer composed of a resin composition for a dicing sheet substrate containing a multi-component copolymer (B) having at least units and a polyolefin (C) (Invention 1). ).

  In the said invention (invention 1), the said resin composition for dicing sheet base materials is said ethylene * alpha, beta- unsaturated carboxylic acid type copolymer (A) 40 mass%-99 mass%, and said multi-component copolymer Combined (B) more than 0% by mass and 20% by mass or less, and the polyolefin (C) 1% by mass to 40% by mass or less (provided that the ethylene / α, β-unsaturated carboxylic acid copolymer) (A), the total of the multicomponent copolymer (B) and the polyolefin (C) is 100% by mass), the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multicomponent copolymer The content ratio of the structural unit derived from the (ii) glycidyl (meth) acrylate or glycidyl unsaturated ether with respect to the total mass of the polymer (B) and the polyolefin (C) exceeds 0% by mass and is 1.0% by mass or less. Prefer to be There (invention 2).

  In the above inventions (Inventions 1 and 2), the copolymerization ratio of α, β-unsaturated carboxylic acid in the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is 5% by mass to 20% by mass. % (Invention 3).

  In the above inventions (Inventions 1 to 3), the α, β-unsaturated carboxylic acid constituting the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is (meth) acrylic acid. Is preferred (Invention 4).

  In the said invention (invention 1-4), it is preferable that the said polyolefin (C) is at least 1 chosen from random polypropylene, homopolypropylene, low density polyethylene, and linear low density polyethylene (invention 5).

  In the said invention (invention 1-5), the said multi-component copolymer (B) is a ternary copolymer which has the structural unit derived from (iii) vinyl ester or unsaturated carboxylic acid ester further. Preferred (Invention 6).

  In the said invention (invention 1-6), the said dicing sheet base material is equipped with the functional layer which consists of at least one layer arrange | positioned at one side of the layer comprised from the resin composition for dicing sheet base materials. Preferred (Invention 7).

  The dicing sheet according to the present invention hardly generates chips due to dicing, and is excellent in heat resistance and expandability.

Hereinafter, embodiments of the present invention will be described.
The dicing sheet according to the present embodiment includes a dicing sheet base material and an adhesive layer laminated on one surface of the dicing sheet base material. A dicing sheet base material contains the layer comprised from the resin composition for dicing sheet base materials (The case where it consists only of the layer comprised from the resin composition for dicing sheet base materials is included).

Hereinafter, the ethylene / α, β-unsaturated carboxylic acid copolymer (A) may be simply referred to as “copolymer (A)”.
Moreover, in this specification, the notation of "-" showing a numerical range is the meaning containing the value of the lower limit and upper limit of a numerical range.
Further, “(meth) acrylic acid” is a notation that includes both “acrylic acid” and “methacrylic acid”, and “(meth) acrylate” refers to both “acrylate” and “methacrylate”. It is a notation used inclusive.

<Resin composition for dicing sheet substrate>
The resin composition for a dicing sheet substrate of the present embodiment includes an ethylene / α, β-unsaturated carboxylic acid copolymer (A), (i) a structural unit derived from α-olefin, and (ii) glycidyl. The multicomponent copolymer (B) which has at least the structural unit derived from (meth) acrylate or glycidyl unsaturated ether, and polyolefin (C) are contained.

  Since the resin composition for a dicing sheet base material has the above-described configuration, the resulting dicing sheet is less likely to generate chips due to dicing, and is excellent in heat resistance and expandability. That is, even if the dicing sheet substrate obtained by molding the resin composition for the dicing sheet substrate is cut, chips are not easily generated, and both high heat resistance and high expandability can be achieved.

  In the following, “(i) a multi-component copolymer (B) having at least a structural unit derived from α-olefin and (ii) a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether” is specified. Also referred to as “multi-component copolymer”.

  Further, “(ii) glycidyl (meth) acrylate or glycidyl unsaturated relative to the total mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), multi-component copolymer (B), and polyolefin (C)” The “content ratio of structural units derived from ether” is also simply referred to as “glycidyl concentration” or “G concentration”.

[Ethylene / α, β-unsaturated carboxylic acid copolymer (A)]
The resin composition for a dicing sheet substrate of the present embodiment contains at least one ethylene / α, β-unsaturated carboxylic acid copolymer.

  The ethylene / α, β-unsaturated carboxylic acid-based copolymer is an at least binary copolymer obtained by copolymerizing ethylene and α, β-unsaturated carboxylic acid, and further includes a third copolymer component. A copolymerized ternary or multi-component copolymer may be used. However, the ethylene / α, β-unsaturated carboxylic acid copolymer (A) has a structure different from that of the multi-component copolymer (B) [specific multi-component copolymer]. This ethylene / α, β-unsaturated carboxylic acid copolymer may be used alone or in combination of two or more ethylene / α, β-unsaturated carboxylic acid copolymers. Good.

  Examples of the unsaturated carboxylic acid constituting the ethylene / unsaturated carboxylic acid binary copolymer include acrylic acid, methacrylic acid, ethacrylic acid, itaconic acid, itaconic anhydride, fumaric acid, crotonic acid, maleic anhydride, and maleic anhydride. Examples thereof include unsaturated carboxylic acids having 4 to 8 carbon atoms such as acids. In particular, acrylic acid or methacrylic acid is preferable.

When the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is a ternary or higher multicomponent copolymer, the monomer (third copolymerization component) forming the multicomponent copolymer is ethylene. In addition to the unsaturated carboxylic acid copolymerizable with ethylene, an unsaturated carboxylic acid ester (for example, methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, (Meth) acrylic acid alkyl esters such as isooctyl acrylate, methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, dimethyl maleate, diethyl maleate), vinyl esters (eg, vinyl acetate, vinyl propionate, etc.), unsaturated Hydrocarbons (eg, propylene, butene, 1,3-butadiene, pentene, 1,3-pentadiene) 1-hexene, etc.), oxides such as vinyl sulfuric acid and vinyl nitric acid, halogen compounds (eg, vinyl chloride, vinyl fluoride, etc.), vinyl group-containing primary and secondary amine compounds, carbon monoxide, sulfur dioxide, etc. (A) may be copolymerized with at least one copolymer component selected from these groups.
Especially, as said 3rd copolymerization component, unsaturated carboxylic acid ester is preferable and (meth) acrylic-acid alkylester (The preferable carbon number of an alkyl part is 1-4) is more preferable.

  The form of the copolymer may be any of a block copolymer, a random copolymer, and a graft copolymer. Among them, as a copolymer, in terms of reactivity with glycidyl (meth) acrylate or glycidyl unsaturated ether and industrially available, binary random copolymer, ternary random copolymer, binary A graft copolymer of a random copolymer or a graft copolymer of a ternary random copolymer is preferable, and a binary random copolymer or a ternary random copolymer is more preferable. The binary random copolymer and the ternary random copolymer may be mixed and used.

  Specific examples of ethylene / α, β-unsaturated carboxylic acid copolymers include binary copolymers such as ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer, ethylene / methacrylic acid / acrylic acid, etc. Examples include terpolymers such as isobutyl copolymer. In addition, a commercially available product marketed as an ethylene / α, β-unsaturated carboxylic acid copolymer may be used. As the commercially available product, for example, the Nuclel series (registered trademark) manufactured by Mitsui DuPont Polychemical Co., Ltd. ) Etc. can be used.

  The content ratio (mass ratio) of structural units derived from the α, β-unsaturated carboxylic acid in the ethylene / α, β-unsaturated carboxylic acid copolymer is preferably 1% by mass to 20% by mass, and more. Preferably it is 5 mass%-20 mass%. When the content ratio of the structural unit derived from the α, β-unsaturated carboxylic acid is 1% by mass or more, preferably 5% by mass or more, it is advantageous in ensuring uniform expandability. In addition, when the content ratio of the structural unit derived from the α, β-unsaturated carboxylic acid is 20% by mass or less, the reaction with the glycidyl compound does not become excessively strong, and a rapid increase in the resin viscosity is suppressed, thereby improving the moldability. It can hold | maintain and the gel generation | occurrence | production in a composition can be prevented.

  The content ratio (mass ratio) of structural units derived from the α, β-unsaturated carboxylic acid ester in the ethylene / α, β-unsaturated carboxylic acid copolymer is preferably 1% by mass to 20% by mass, More preferably, it is 5 mass%-15 mass%. The content ratio of the structural unit derived from the α, β-unsaturated carboxylic acid ester is preferably 1% by mass or more, particularly preferably 5% by mass or more from the viewpoint of expandability. Further, the content ratio of the structural unit derived from the α, β-unsaturated carboxylic acid ester is preferably 20% by mass or less, and more preferably 15% by mass or less from the viewpoint of preventing blocking and fusion. .

The melt flow rate (MFR) of the ethylene / α, β-unsaturated carboxylic acid copolymer is preferably in the range of 2 g / 10 min to 500 g / 10 min, particularly 2 g / 10 min to 150 g / 10 min, 2 g / 10 minutes to 120 g / 10 minutes are preferred. When the melt flow rate is within the above range, it is advantageous in terms of film formability.
In addition, MFR is a value measured by 190 degreeC and the load of 2160g by the method based on JISK7210-1999.

  The content of the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is determined depending on the copolymer (A), multi-component copolymer (B), and polyolefin (in the resin composition for a dicing sheet substrate). The total content of C) is preferably 40% by mass to 99% by mass. The ethylene / α, β-unsaturated carboxylic acid copolymer (A) content ratio of 40% by mass or more indicates that the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is a dicing sheet. It shows that it contains as a main component of the resin composition for base materials. Further, when the content ratio of the ethylene / α, β-unsaturated carboxylic acid copolymer (A) is 99% by mass or less, generation of chips during dicing can be easily suppressed.

  A total of 100 of the copolymer (A), the multi-component copolymer (B) and the polyolefin (C) in the resin composition for a dicing sheet substrate of the ethylene / α, β-unsaturated carboxylic acid copolymer (A) The content with respect to mass% is more preferably 60 mass% to 99 mass%, further preferably 65 mass% to 93.5 mass%, and is preferably 75 mass% to 93.5 mass%. Particularly preferred.

[Multi-component copolymer (B)]
The resin composition for a dicing sheet substrate of the present embodiment contains at least one kind of multi-component copolymer (B). When the resin composition for a dicing sheet base material contains the multi-component copolymer (B), it is excellent in chip control and more excellent in heat resistance.

  The resin composition for a dicing sheet substrate of the present embodiment is a multicomponent copolymer having (i) a constituent unit derived from an α-olefin and (ii) a constituent unit derived from glycidyl (meth) acrylate or a glycidyl unsaturated ether. The polymer (B) is 0.5% by mass with respect to a total of 100% by mass of the copolymer (A), the multi-component copolymer (B), and the polyolefin (C) in the resin composition for a dicing sheet substrate. It is preferable to contain -7 mass%.

  The multi-component copolymer (B) is a copolymer obtained by copolymerizing at least (b1) an α-olefin (preferably ethylene) and (b2) glycidyl (meth) acrylate or glycidyl unsaturated ether, When it has only the structural unit (i) derived from b1) and the structural unit (ii) derived from (b2), it is a binary copolymer.

In addition to (b1) and (b2), the multi-component copolymer (B) may further contain one or more kinds of copolymer components as long as the object of the present invention is not hindered. It may be a ternary or quaternary or higher copolymer obtained by copolymerization.
Other copolymer components that the multi-component copolymer (B) may have are not particularly limited, and examples thereof include (b3) vinyl ester or unsaturated carboxylic acid ester.

  In addition to the structural unit (i) derived from (b1) and the structural unit (ii) derived from (b2), the multi-component copolymer (B) further comprises a structural unit (iii) derived from (b3) It is preferably a coalescence.

  (B1) “α-olefin” which is a copolymer component of the multi-component copolymer (B) is an α-olefin having 2 to 10 carbon atoms (for example, ethylene, propylene, 1-butene, 1-pentene, 1-pentene, Hexene, 4-methyl-1-pentene, 3-methyl-1-butene, 1-octene, etc.), among which ethylene and propylene are preferable.

  As (b2) “glycidyl (meth) acrylate or glycidyl unsaturated ether” which is a copolymer component of the multi-component copolymer (B), glycidyl acrylate, glycidyl methacrylate, vinyl glycidyl ether, allyl glycidyl ether, 2-methylallyl glycidyl An ether etc. can be mentioned. Among these, glycidyl (meth) acrylate is preferable.

  Examples of the (b3) “vinyl ester” which is a preferred copolymer component of the multi-component copolymer (B) include vinyl acetate and vinyl propionate.

  (B3) “Unsaturated carboxylic acid ester” which is a preferred copolymer component of the multi-component copolymer (B) is α, β- in the ethylene / α, β-unsaturated carboxylic acid copolymer (A). And esters of unsaturated carboxylic acids, preferably lower alkyl esters of 2 to 5 carbon atoms of the α, β-unsaturated carboxylic acid, more preferably isobutyl or n-butyl of the α, β-unsaturated carboxylic acid. Or an alkyl ester having 4 carbon atoms.

  Specific examples of unsaturated carboxylic acid esters include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, n-butyl acrylate, isooctyl acrylate, methyl methacrylate, isobutyl methacrylate, dimethyl maleate and the like. An ester compound is mentioned. Among them, acrylic acid or lower alkyl esters of methacrylic acid (2 to 5 carbon atoms) such as methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, n-butyl acrylate, methyl methacrylate, and isobutyl methacrylate. preferable. Further, n-butyl ester or isobutyl ester of acrylic acid or methacrylic acid is preferable. Among them, alkyl ester of acrylic acid having 4 carbon atoms is preferable, and isobutyl ester is particularly preferable.

  The proportion (mass ratio) of (i) α-olefin-derived structural units in the multi-component copolymer (B) is preferably 40% by mass to 99% by mass with respect to the total mass of the multi-component copolymer (B). More preferably, it is 50 mass%-98 mass%.

  The ratio (mass ratio) of the structural unit derived from (ii) glycidyl (meth) acrylate or glycidyl unsaturated ether in the multi-component copolymer (B) is 0 with respect to the total mass of the multi-component copolymer (B). 0.5 mass% to 20 mass% is preferable, and 1 mass% to 15 mass% is more preferable. (Ii) When the ratio of the structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether is 0.5% by mass or more, the effect of improving heat resistance and chip suppression is great, and (ii) glycidyl (meth) acrylate Alternatively, when the proportion of the structural unit derived from the glycidyl unsaturated ether is 20% by mass or less, the reaction with the unsaturated carboxylic acid does not become too strong, the rapid increase of the resin viscosity can be suppressed, and the moldability can be maintained. It is possible to prevent gel generation in the object.

Further, in the present embodiment, (ii) glycidyl (meth) based on the total mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), multi-component copolymer (B), and polyolefin (C). The content ratio (glycidyl concentration) of structural units derived from acrylate or glycidyl unsaturated ether is preferably more than 0% by mass and 1.0% by mass or less, more preferably more than 0% by mass and 0.5% by mass. % Or less, more preferably 0.03% by mass to 0.36% by mass, further preferably 0.12% by mass to 0.36% by mass, and still more preferably 0.14% by mass to 0.3% by mass. It is 34 mass%, Most preferably, it is 0.14 mass%-0.34 mass%, Most preferably, it is 0.18 mass%-0.30 mass%.
When the glycidyl concentration exceeds 0% by mass, the effect of suppressing the generation of chips is improved, and when it is 1.0% by mass or less, the reaction between the multi-component copolymer (B) and the unsaturated carboxylic acid becomes appropriate. In addition, the resin viscosity is appropriately increased and it is easy to maintain good moldability, or the gel generation in the composition is easily suppressed.

  In the multi-component copolymer (B), the ratio (mass ratio) of structural units derived from the (iii) vinyl ester or unsaturated carboxylic acid ester is 0 mass relative to the total mass of the multi-component copolymer (B). % To 49.5% by mass, more preferably 0% to 40% by mass.

  When the multi-component copolymer (B) is a ternary copolymer having the structural unit (iii) derived from (b3), (iii) vinyl ester or unsaturated carboxylic acid in the multi-component copolymer (B) The proportion (mass ratio) of the structural units derived from the ester is preferably 1% by mass to 40% by mass with respect to the total mass of the multi-component copolymer (B). (Iii) When the ratio of the structural unit derived from the vinyl ester or the unsaturated carboxylic acid ester is 40% by mass or less, moderate flexibility is obtained, and stickiness is suppressed, and good blocking property and anti-fusing property are obtained. Is obtained.

  The multi-component copolymer (B) may be either a random copolymer or a graft copolymer. In general, a random copolymer is preferred because of the uniformity of the reaction with the ethylene / α, β-unsaturated carboxylic acid copolymer. Such a random copolymer is obtained, for example, by radical copolymerization at high temperature and high pressure.

The melt flow rate (MFR) of the multi-component copolymer (B) is preferably in the range of 0.01 g / 10 min to 1000 g / 10 min, particularly preferably in the range of 0.1 g / 10 min to 200 g / 10 min. When the melt flow rate is within the above range, the degree of crosslinking is improved, which is advantageous in terms of heat resistance and chip control.
In addition, MFR is a value measured by 190 degreeC and the load of 2160g by the method based on JISK7210-1999.

  The number average molecular weight (Mn) of the multi-component copolymer (B) is preferably in the range of 7000 to 100,000, more preferably in the range of 8,000 to 50,000, and particularly preferably 10,000 to 30,000. When the number average molecular weight is within the above range, the processability and heat resistance are excellent. The number average molecular weight (Mn) of the multi-component copolymer (B) can be determined by the method described later.

  The content of the multi-component copolymer (B) is 100% by mass in total of the copolymer (A), the multi-component copolymer (B), and the polyolefin (C) in the resin composition for a dicing sheet substrate. The content is preferably more than 0% by mass and 20% by mass or less. When the content ratio of the multi-component copolymer (B) exceeds 0% by mass, excellent chip control is exhibited and heat resistance is further improved. On the other hand, when the content is 20% by mass or less, the reaction with the ethylene / α, β-unsaturated carboxylic acid copolymer is appropriately controlled, a good viscosity is maintained, and the generation of gel in the composition is suppressed. The effect will be better.

  The content of the multi-component copolymer (B) in the resin composition for a dicing sheet substrate is more preferably more than 0% by mass and 10% by mass or less, and more preferably 0.5% by mass to 7% by mass. Is more preferably 0.5% by mass to 7% by mass, still more preferably 0.5% by mass to 5% by mass, and particularly preferably 1% by mass to 5% by mass. It is preferably 2% by mass to 5% by mass.

[Polyolefin (C)]
The resin composition for a dicing sheet substrate of the present embodiment contains at least one polyolefin. By containing polyolefin (C), the dispersibility of other components improves and the resin composition for dicing sheet base materials with favorable heat resistance is obtained.

  The resin composition for a dicing sheet substrate of the present embodiment comprises a polyolefin (C), a copolymer (A), a multi-component copolymer (B), and a polyolefin (C) in the resin composition for a dicing sheet substrate. It is preferable to contain 1 mass%-40 mass% with respect to a total of 100 mass%.

  The polyolefin (C) is an α-olefin having 2 to 10 carbon atoms (for example, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-butene. , 1-octene, etc.) homopolymers or copolymers, and the like, and those produced by various methods using various catalysts can be used. More specific examples of the polyolefin (C) include polyethylene, polypropylene, polybutene-1, and poly-4-methyl-1-pentene.

  Of the polyethylene, preferred are low density polyethylene (LDPE) and linear low density polyethylene (LLDPE). Among the linear low density polyethylene, particularly preferred is a wire produced with a homogeneous catalyst such as a metallocene catalyst. Low density polyethylene. The polyethylene may be an ethylene / α-olefin copolymer obtained by copolymerization of ethylene and an α-olefin.

  Examples of the ethylene / α-olefin copolymer include random, block, and alternating copolymers of ethylene and α-olefin (preferably having 4 to 12 carbon atoms, more preferably 5 to 10 carbon atoms). It is done. Preferably, a homopolymer and a random copolymer are suitable.

  Examples of the polypropylene include a polymer selected from a propylene homopolymer and a propylene-based copolymer obtained by copolymerization of propylene and another monomer.

  Examples of the propylene-based copolymer include random, block, and alternating copolymers of propylene and α-olefin (preferably having 2 to 10 carbon atoms, more preferably 4 to 8 carbon atoms). Preferably, a homopolymer and a random copolymer are suitable.

  Among these, as the polyolefin, random polypropylene, homopolypropylene, low density polyethylene, and linear low density polyethylene are preferable from the viewpoint of heat resistance.

The polyethylene has a melt flow rate (MFR) of preferably 0.1 g / 10 min to 100 g / 10 min, particularly preferably 1 g / 10 min to 80 g / 10 min.
The melt flow rate (MFR) of the polypropylene is preferably 0.5 g / 10 min to 100 g / 10 min, particularly preferably 1 g / 10 min to 50 g / 10 min, and more preferably 1 g / 10 min to 20 g / 10. Minutes are preferred.
In addition, MFR is a value measured by 230 degreeC and the load of 2160g by the method based on JISK7210-1999.

Density of the polyethylene is ^preferably from ^{880kg / m 3 ~960kg / m 3} , 900kg / m 3 ~940kg / m 3 and more preferably.
Density of the polypropylene is ^{preferably 870kg / m 3 ~930kg / m 3} , 880kg / m 3 ~920kg / m 3 and more preferably.

  Content of polyolefin (C) is a mass reference | standard with respect to a total of 100 mass% of the copolymer (A), the multicomponent copolymer (B), and polyolefin (C) in the resin composition for dicing sheet base materials. It is preferable that it is 1 mass%-40 mass%. When the content ratio of the polyolefin (C) is 1% by mass or more, heat resistance is further improved, and when it is 40% by mass or less, dispersibility with other components is further improved.

  In the resin composition for a dicing sheet substrate, the polyolefin (C) is more preferably 1% by mass to 30% by mass, further preferably 6% by mass to 28% by mass, and 6% by mass to 27% by mass. % Is particularly preferable, and 6% by mass to 20% by mass is most preferable.

  What is preferable as the resin composition for a dicing sheet substrate of the present embodiment is an ethylene / α, β-unsaturated carboxylic acid copolymer (A) 40% by mass to 99% by mass, and (i) derived from α-olefin. And (ii) a multi-component copolymer (B) having at least a constituent unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether, and more than 0% by mass and 20% by mass or less, and polyolefin (C) 1% (However, the total of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C) is included) (Ii) glycidyl based on the total mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C). Meth) content ratio of the constituent unit derived from acrylate or glycidyl unsaturated ether is a resin composition is 1.0 wt% greater than 0 mass%.

  More preferable as the resin composition for a dicing sheet substrate of the present embodiment is an ethylene / α, β-unsaturated carboxylic acid copolymer (A) of 60% by mass to 99% by mass, and (i) an α-olefin. A multi-component copolymer (B) having at least a constituent unit derived from (ii) glycidyl (meth) acrylate or a glycidyl unsaturated ether, and more than 0% by mass to 10% by mass or less, and polyolefin (C) 1 (However, the total of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C)). (Ii) with respect to the total mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C). Glish Le (meth) acrylate or the content ratio of the constituent unit derived from glycidyl unsaturated ether is a resin composition is 1.0 wt% greater than 0 mass%.

  What is more preferable as the resin composition for a dicing sheet substrate of the present embodiment is an ethylene / α, β-unsaturated carboxylic acid copolymer (A) of 65% by mass to 93.5% by mass, and (i) α. -Olefin-derived structural unit, and (ii) 0.5% by mass to 7% by mass of a multi-component copolymer (B) having at least a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether, and polyolefin ( C) 6% to 28% by mass (provided that the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C )), The ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C) with respect to the total mass. (Ii) The content ratio of the constituent unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether is a resin composition is 0.12 wt% ～0.36 wt%.

  The most preferable resin composition for a dicing sheet substrate of the present embodiment is an ethylene / α, β-unsaturated carboxylic acid copolymer (A) 75% by mass to 93.5% by mass, and (i) α -Olefin-derived structural unit, and (ii) 0.5% by mass to 5% by mass of a multi-component copolymer (B) having at least a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether, and a polyolefin ( C) 6% by mass to 20% by mass (provided that the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C )), The ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C) with respect to the total mass. (Ii) chestnut The content ratio of the constituent unit derived from Jill (meth) acrylate or glycidyl unsaturated ether is a resin composition is 0.12 wt% ～0.36 wt%.

The resin composition for a dicing sheet substrate of the present embodiment can be obtained by melt-mixing (A) an ethylene / (meth) acrylic acid copolymer, a multi-component copolymer (B), and a polyolefin (C). it can. In melt mixing, a commonly used mixing apparatus such as a screw extruder, a roll mixer, a Banbury mixer, or the like can be used. Further, the melt mixing may be performed by simultaneously blending the three components (A) to (C). Among them, the multi-component copolymer (B) and the polyolefin (C) are preferably melt-mixed in advance, and the melt mixture obtained by this melt-mixing and (A) the ethylene / (meth) acrylic acid copolymer are further melted. It is a method of mixing. According to this method, since the multi-component copolymer (B) is diluted with the polyolefin (C), the reaction with the (A) ethylene / (meth) acrylic acid copolymer does not occur locally and proceeds uniformly. Therefore, there is an advantage that a composition having excellent properties can be produced with good quality stability. On the other hand, according to a method in which (A) ethylene / (meth) acrylic acid copolymer and multi-component copolymer (B) are first melt mixed and then polyolefin (C) is mixed, the reaction is locally There is a risk that the gel will progress.
When the three components (A) to (C) are melted and mixed at the same time, it is desirable to melt and mix them using a single screw extruder or a twin screw extruder.

The melt flow rate (MFR) of the resin composition for a dicing sheet substrate of the present embodiment containing the three components (A) to (C) is in the range of 0.1 g / 10 min to 3.0 g / 10 min. Preferably, the range of 0.1 g / 10 minutes to 2.5 g / 10 minutes is more preferable, and the range of 0.1 g / 10 minutes to 2.0 g / 10 minutes is more preferable. When the melt flow rate is 0.1 g / 10 min or more, the molding processability is excellent, and when the melt flow rate is 3.0 g / 10 min or less, generation of chips is prevented from suppressing deterioration. Moreover, when MFR is the said range, compared with the resin composition containing an ionomer, when processing a resin composition with a roll, the roll release property which a resin composition leaves | separates from a roll is favorable.
In addition, MFR is a value measured by 190 degreeC and the load of 2160g by the method based on JISK7210-1999.

  The resin composition for a dicing sheet substrate of the present embodiment can contain other resins (D) and various additives within a range that does not impair the object of the present invention.

[Other resins (D)]
Examples of the other resin (D) include conventionally known ethylene / α, β-unsaturated carboxylic acid copolymer (A), multi-component copolymer (B), and polyolefin (C). Resin can be used.

  Examples of the other resin (D) include a high density ethylene resin, a low density ethylene resin, a medium density ethylene resin, an ultra low density ethylene resin, an ethylene / cyclic olefin copolymer, and an ethylene / α-olefin.・ Cyclic olefin copolymer, ethylene / α-olefin / non-conjugated polyene copolymer, ethylene / α-olefin / conjugated polyene copolymer, ethylene / aromatic vinyl copolymer, ethylene / α-olefin / aromatic vinyl Olefin resins such as copolymers, ethylene / unsaturated carboxylic anhydride copolymers, ethylene / α-olefin / unsaturated carboxylic anhydride copolymers, ethylene / vinyl acetate copolymers, ethylene / acrylic acid ester copolymers A copolymer, an ethylene / methacrylic acid ester copolymer, an ethylene / unsaturated carboxylic acid binary copolymer, Tylene / unsaturated carboxylic acid / unsaturated carboxylic acid ester terpolymer ionomer, ethylene / unsaturated carboxylic acid ester terpolymer, urethane resin, silicone resin, acrylic resin, methacrylic acid Resin, cyclic olefin (co) polymer, α-olefin / aromatic vinyl compound / aromatic polyene copolymer, ethylene / α-olefin / aromatic vinyl compound / aromatic polyene copolymer, ethylene / aromatic vinyl compound・ Aromatic polyene copolymer, styrene resin, acrylonitrile / butadiene / styrene copolymer, styrene / conjugated diene copolymer, acrylonitrile / styrene copolymer, acrylonitrile / ethylene / α-olefin / non-conjugated polyene / styrene copolymer Polymer, acrylonitrile, ethylene, α-olefin, conjugation Liene / styrene copolymer, methacrylic acid / styrene copolymer, ethylene terephthalate resin, fluororesin, polyester carbonate, polyvinyl chloride, polyvinylidene chloride, polystyrene thermoplastic elastomer, polyurethane thermoplastic elastomer, 1,2 polybutadiene -Based thermoplastic elastomers, trans-polyisoprene-based thermoplastic elastomers, chlorinated polyethylene-based thermoplastic elastomers, liquid crystalline polyesters, polylactic acid, and the like. These may be used alone or in admixture of two or more. it can. These other resins (D) can be blended in a proportion of, for example, 20 parts by mass or less with respect to 100 parts by mass in total of (A), (B), and (C).

  As other resin (D) added to the resin composition for a dicing sheet base material, the ionomer of the resin mentioned above can also be used with other resins other than the ionomer. By containing an ionomer, heat resistance and the effect of preventing threading of cutting waste are improved while maintaining processability and expandability.

The ionomer of the ethylene / unsaturated carboxylic acid binary copolymer and the ionomer of the ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid ternary copolymer have a content ratio of the structural unit derived from the unsaturated carboxylic acid of 1 The range is preferably from mass% to 35 mass%, more preferably from 5 mass% to 25 mass%, particularly preferably from 5 mass% to 20 mass%. That the content rate of the structural unit guide | induced from unsaturated carboxylic acid is 1 mass% or more means containing this structural unit actively.
Moreover, as a content rate of the structural unit guide | induced from ethylene, the range of 65 mass%-99 mass% is preferable, More preferably, it is the range of 80 mass%-95 mass% or less.

  Examples of the unsaturated carboxylic acid constituting the binary copolymer or the ternary copolymer include acrylic acid, methacrylic acid, maleic acid, fumaric acid, maleic anhydride, maleic acid monoester, and the like. In particular, acrylic acid or methacrylic acid is preferable.

  Examples of the unsaturated carboxylic acid ester constituting the terpolymer include, for example, methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, isooctyl acrylate, methyl methacrylate, ethyl methacrylate, methacrylic acid. Examples include (meth) acrylic acid alkyl esters such as isobutyl acid, dimethyl maleate, and diethyl maleate. Among them, (meth) acrylic acid alkyl ester (preferably having 1 to 4 carbon atoms in the alkyl moiety) is more preferable.

  As the metal ion for neutralizing the carboxyl group in the binary copolymer or ternary copolymer serving as the base polymer of the ionomer, ions such as magnesium, zinc, sodium and potassium are preferable, and zinc ion is more preferable. Further, these metal ions may be mixed and used for neutralization. The ionomer is neutralized with the metal ions in the range of 100% or less of the carboxyl group in the binary copolymer, and the degree of neutralization is preferably 90% or less, more preferably 20% to 85%.

  The form of the copolymer serving as the base polymer of the ionomer may be any of a block copolymer, a random copolymer, and a graft copolymer, but a binary random copolymer, a ternary random copolymer, It is preferable to use a graft copolymer of a binary random copolymer or a graft copolymer of a ternary random copolymer, and more preferably a binary random copolymer or a ternary random copolymer.

The ethylene / unsaturated carboxylic acid ester copolymer is preferably an ethylene / (meth) acrylic acid alkyl ester copolymer.
Examples of the (meth) acrylic acid alkyl ester constituting the ethylene / (meth) acrylic acid alkyl ester copolymer include, for example, methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, isooctyl acrylate, and methacrylic acid. Preferable examples include methyl acid, ethyl methacrylate, and isobutyl methacrylate.

  As the resin composition for a dicing sheet substrate in the present embodiment, an ethylene / α, β-unsaturated carboxylic acid copolymer (A), (i) a structural unit derived from an α-olefin, and (ii) Multi-component copolymer (B) having at least a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether, polyolefin (C), ionomer of ethylene / unsaturated carboxylic acid copolymer, or ethylene / unsaturated carboxylic acid It preferably contains an ionomer (D) of an acid / unsaturated carboxylic acid ester copolymer, an ethylene / (meth) acrylic acid copolymer (A), (i) a structural unit derived from an α-olefin, and (Ii) a multi-component copolymer (B) having at least a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether, and poly And olefin (C), and ionomers of ethylene (meth) ionomer or an ethylene-acrylic acid copolymer (meth) acrylic acid (meth) acrylic acid ester copolymer, and more preferably contains.

  As specific examples of the resin composition for a dicing sheet substrate in the present embodiment, an ethylene / isobutyl methacrylate copolymer (A), an ethylene / glycidyl methacrylate / n-butyl acrylate copolymer (B), A composition comprising a homopolypropylene (C) and an ionomer of an ethylene / methacrylic acid copolymer or an ionomer of an ethylene / acrylic acid copolymer, or an ethylene / methacrylic acid copolymer (A) and an ethylene / glycidyl methacrylate A composition containing an n-butyl acrylate copolymer (B), a homopolypropylene (C), and an ionomer of an ethylene / methacrylic acid copolymer or an ethylene / methacrylic acid / butyl acrylate copolymer. be able to.

  The ionomer is preferably more than 0 parts by weight and less than 20 parts by weight, more preferably more than 0 parts by weight and less than 15 parts by weight with respect to a total of 100 parts by weight of the (A), (B) and (C). More preferably, it can be blended at a ratio of 1 to 15 parts by mass, most preferably 3 to 7 parts by mass.

  In addition, the content ratio of (A) to (D) in the resin composition for a dicing sheet substrate is 65% by mass to 93.5% by mass of an ethylene / α, β-unsaturated carboxylic acid copolymer (A). And (i) α-olefin-derived structural unit, and (ii) multi-component copolymer (B) having at least a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether (B) 0.5% by mass to 7% Mass% and polyolefin (C) 6 mass% to 28 mass% (provided that the total of copolymer (A), multi-component copolymer (B), and polyolefin (C) is 100 mass%) ), And (ii) glycidyl (meth) acrylate or ethylene / α, β-unsaturated carboxylic acid copolymer (A), multi-component copolymer (B), and polyolefin (C) based on the total mass of the composition Glycidyl-free The content ratio of the constituent unit derived from the sum ether is 0.12 mass% ～0.36 wt%, preferably further contains 1% to 15% by weight relative to the total weight of the composition of an ionomer (D).

〔Additive〕
Examples of the additives include antioxidants, heat stabilizers, light stabilizers, ultraviolet absorbers, pigments, dyes, lubricants, antiblocking agents, antistatic agents, antifungal agents, antibacterial agents, flame retardants, and flame retardant aids. Examples thereof include an agent, a crosslinking agent, a crosslinking aid, a foaming agent, a foaming aid, an inorganic filler, and a fiber reinforcing material.

  Examples of the antistatic agent include a low molecular weight antistatic agent and a high molecular weight antistatic agent, but a high molecular weight antistatic agent is preferable, and the high molecular weight antistatic agent has a sulfonate in the molecule. Examples thereof include vinyl copolymers, alkyl sulfonates, alkyl benzene sulfonates, and betaines.

  Further, mention may be made of inorganic protonic acid salts of polyether, polyamide elastomer, polyester elastomer, polyether amide or polyether ester amide. Examples of the salt of the inorganic proton acid include alkali metal salts, alkaline earth metals, zinc salts, and ammonium salts.

  Examples of the polyether ester amide include a block copolymer composed of a polyamide block and a polyoxyalkylene glycol block, and these blocks are ester-bonded.

  The polyamide block in the polyether ester amide is, for example, dicarboxylic acid (eg, succinic acid, succinic acid, adipic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, etc.) and diamine ( Examples: ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, decamethylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 1,3-bis (aminomethyl) ) Cyclohexane, 1,4-bis (aminomethyl) cyclohexane, methylenebis (4-aminocyclohexane), m-xylylenediamine, p-xylylenediamine, etc.), ε-caprolactam, ω-dodecalactam, etc. Lactam It is obtained by ring-opening polymerization, polycondensation of aminocarboxylic acids such as 6-aminocaproic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, or copolymerization of the lactam, dicarboxylic acid and diamine. Is. Such polyamide segments are nylon 4, nylon 6, nylon 46, nylon 66, nylon 610, nylon 612, nylon 6T, nylon 11, nylon 12, nylon 6/66, nylon 6/12, nylon 6/610, nylon 66/12, nylon 6/66/610, and nylon 11 and nylon 12 are particularly preferable. The molecular weight of the polyamide block is, for example, about 400 to 5000.

  Examples of the polyether block include polyoxyethylene glycol, polyoxypropylene glycol, polyoxytetramethylene glycol, polyoxyalkylene glycols such as polyoxyethylene / polyoxypropylene glycol, and mixtures thereof. These molecular weights are, for example, about 400 to 6000, and more preferably about 600 to 5000.

  Commercially available products may be used as the antistatic agent. Specific examples include irgastat P-16, P-18, P-20, and P-22 manufactured by BASF Japan, Sanyo Kasei. Examples include Pelestat 230, Pelestat HC250, Pelestat 300, Pelestat 2450, Peletron PVH, Mitsui DuPont Entila MK400, MK440, SD100, etc.

  When the antistatic agent is (A), (B) and (C) are melt-mixed, a predetermined amount is melt-mixed, or (A), (B) and (C) a predetermined amount is added to the resin composition. These antistatic agents can be dry blended and melt mixed.

  When the antistatic agent is contained, the content of the antistatic agent in the film substrate exceeds 5 parts by mass with respect to a total of 100 parts by mass of (A), (B) and (C). 30 parts by mass is preferable, and more than 5 parts by mass and more preferably 20 parts by mass.

  Moreover, from a viewpoint of heat resistance improvement, the crosslinking reaction may be accelerated | stimulated by performing the electron beam irradiation for the resin composition for dicing sheet base materials of this embodiment as needed.

<Dicing sheet base material>
The dicing sheet substrate of the present embodiment includes a layer composed of the resin composition for a dicing sheet substrate of the present embodiment. Since the dicing sheet base material of the present embodiment includes a layer composed of the resin composition for the dicing sheet base material of the present embodiment, chips due to dicing are hardly generated and the heat resistance and expandability are excellent.

  A layer composed of the resin composition for a dicing sheet substrate of the present embodiment or a dicing sheet substrate composed only of the layer is, for example, conventionally known by using the resin composition for a dicing sheet substrate of the present embodiment. It can be produced by various molding methods such as T-die casting molding method, T-die nip molding method, inflation molding method, extrusion laminating method, and calendar molding method.

  The structure of the dicing sheet base material is not particularly limited, and may include a single layer structure or two or more layers as long as it includes a layer formed from the resin composition for a dicing sheet base material of the present embodiment. A multilayer structure may be used. When the dicing sheet base material has a multilayer structure, for example, the dicing sheet base material may have a structure in which a plurality of layers composed of the resin composition for the dicing sheet base material of the present embodiment are laminated, or the dicing sheet base material of the present embodiment. The structure which laminated | stacked the functional layer on the layer comprised from the resin composition for water may be sufficient. The functional layer refers to a layer having a function such as further improving the expandability of the dicing sheet substrate, but is not limited to the function.

  It is preferable that the dicing sheet base material of this embodiment is a multilayer structure provided with the functional layer which consists of at least one layer arrange | positioned at one side of the layer comprised from the resin composition for dicing sheet base materials. Thereby, it becomes possible to obtain the effect that the expandability of the dicing sheet base material is further improved. The functional layer may have a single layer configuration or a multilayer configuration. When laminating functional layers, the layer composed of the resin composition for a dicing sheet substrate of the present embodiment is configured to be the outermost layer (exposed surface) so that chips are not easily generated during wafer dicing. It is preferable.

  When laminating a functional layer, the dicing sheet substrate may be formed as a co-extrusion laminate of a layer composed of a resin composition for a dicing sheet substrate and a functional layer by a co-extrusion molding machine. Moreover, it is good also as a multilayer structure by thermally bonding the resin composition for dicing sheet base materials of this embodiment to the surface of a functional layer using an extrusion coating molding machine.

In order to improve the adhesive force on the surface of the dicing sheet substrate, a known surface treatment such as a corona discharge treatment may be performed on the surface of the dicing sheet substrate.
Moreover, from a viewpoint of heat resistance improvement, a crosslinking reaction may be accelerated | stimulated by performing electron beam irradiation to the dicing sheet base material of this embodiment as needed.

  The resin constituting the functional layer that can be laminated on the dicing sheet substrate of the present embodiment is an ethylene / unsaturated carboxylic acid copolymer, an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid alkyl ester terpolymer. , An ethylene / unsaturated carboxylic acid alkyl ester copolymer, an ethylene / vinyl ester copolymer, an ethylene / unsaturated carboxylic acid alkyl ester / carbon monoxide copolymer, or an unsaturated carboxylic acid graft product thereof. As a representative example, a simple substance or a blend consisting of a plurality of arbitrary substances can be given.

  Among the above, since the expandability is high and the adhesiveness to the layer composed of the resin composition for a dicing sheet substrate is high, the resin constituting the functional layer is an ethylene / unsaturated carboxylic acid copolymer and It is preferably at least one ethylene / unsaturated carboxylic acid alkyl ester copolymer. More specifically, it is preferably at least one of an ethylene- (meth) acrylic acid ester copolymer and an ethylene- (meth) acrylic acid copolymer.

  In the ethylene- (meth) acrylic acid copolymer, in addition to the structural units derived from ethylene and acrylic acid and / or methacrylic acid, it contains structural units derived from other compounds within a range not impairing the effects of the present invention. May be. In the ethylene- (meth) acrylic acid copolymer, the mass ratio of the structural units derived from (meth) acrylic acid is preferably 1 to 10% by mass with respect to the mass of all monomers.

  The thickness of the dicing sheet base material of the present embodiment is 150 μm or less from the viewpoint of expandability when the dicing sheet base material has a single layer configuration of a layer composed of a resin composition for a dicing sheet base material. Is preferable, and it is preferable that it is 80 micrometers or more from a viewpoint of parting property.

  In the case of a multi-layer configuration in which the dicing sheet substrate of the present embodiment has a functional layer composed of at least one layer disposed on one surface of a layer composed of the resin composition for a dicing sheet substrate, The thickness of the layer composed of the resin composition for a dicing sheet substrate is usually about 10 μm to 140 μm, preferably 20 μm to 120 μm, and more preferably 30 μm to 100 μm. If the layer comprised from the resin composition for dicing sheet base materials is said thickness, it will be hard to produce chips stably at the time of dicing. On the other hand, the thickness of the functional layer is usually about 10 μm to 150 μm, preferably 40 μm to 120 μm, and more preferably 50 μm to 100 μm from the viewpoint of expandability.

<Adhesive layer>
For example, a semiconductor wafer to be subjected to dicing is attached and fixed to the pressure-sensitive adhesive layer of the dicing sheet according to the present embodiment. Although the thickness of an adhesive layer is based also on the kind of adhesive which comprises an adhesive layer, it is preferable that they are 3 micrometers-100 micrometers, and it is more preferable that they are 3 micrometers-50 micrometers.

  In the case where the dicing sheet substrate of the present embodiment has a multilayer structure including at least one functional layer disposed on one surface of the layer composed of the resin composition for a dicing sheet substrate, dicing is performed. The layer composed of the resin composition for sheet base material is preferably arranged closer to the pressure-sensitive adhesive layer than the functional layer, and adheres to the layer composed of the resin composition for dicing sheet base material. More preferably, the agent layer is disposed. In this case, it is possible to more effectively prevent chips from being generated during dicing.

  As a method of laminating the pressure-sensitive adhesive layer and the dicing sheet substrate, the pressure-sensitive adhesive may be a known method such as a gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, spray coater, etc. Use a method of directly applying the adhesive, or applying a pressure-sensitive adhesive on the release sheet by the above-mentioned known method to provide a pressure-sensitive adhesive layer, and then sticking it to the dicing sheet substrate to transfer the pressure-sensitive adhesive layer. Can do.

  A conventionally well-known adhesive can be used as an adhesive which comprises an adhesive layer. Examples of the pressure-sensitive adhesive include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based pressure-sensitive adhesives; radiation curable pressure-sensitive adhesives; Especially, when the peelability of the film for semiconductor manufacture from a semiconductor wafer etc. is considered, it is preferable that an adhesive layer contains an ultraviolet curing adhesive.

  Examples of the acrylic pressure-sensitive adhesive that can constitute the pressure-sensitive adhesive layer include a homopolymer of (meth) acrylic acid ester and a copolymer of (meth) acrylic acid ester and a copolymerizable monomer. Specific examples of (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, (meth) acrylate-2-ethylhexyl, octyl (meth) acrylate, (Meth) acrylic acid alkyl esters such as (meth) acrylic acid isononyl; (meth) acrylic acid hydroxyalkyl esters such as hydroxyethyl (meth) acrylate, hydroxybutyl (meth) acrylate and hydroxyhexyl (meth) acrylate; (Meth) acrylic acid glycidyl ester and the like are included.

  Specific examples of the copolymerizable monomer with (meth) acrylic acid ester include (meth) acrylic acid, itaconic acid, maleic anhydride, (meth) acrylic acid amide, (meth) acrylic acid N-hydroxymethylamide, ( Examples include meth) acrylic acid alkylaminoalkyl esters (for example, dimethylaminoethyl methacrylate, t-butylaminoethyl methacrylate, etc.), vinyl acetate, styrene, acrylonitrile and the like.

  Although the ultraviolet curable adhesive which can comprise an adhesive layer is not specifically limited, The said acrylic adhesive, an ultraviolet curing component, and a photoinitiator are contained. Further, the ultraviolet curable pressure-sensitive adhesive may contain an acrylic pressure-sensitive adhesive having a carbon-carbon double bond in the side chain, a photopolymerization initiator, and, if necessary, an ultraviolet curable component. Furthermore, you may add additives, such as a crosslinking agent, a tackifier, a filler, anti-aging agent, a coloring agent, etc. to an ultraviolet curable adhesive agent as needed.

  Examples of the ultraviolet curable component contained in the ultraviolet curable pressure-sensitive adhesive include a monomer, oligomer, or polymer that has a carbon-carbon double bond in the molecule and can be cured by radical polymerization. Specific examples of ultraviolet curing components include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol (meth) acrylate, neopentyl glycol Esters of (meth) acrylic acid and polyhydric alcohols such as di (meth) acrylate and dipentaerythritol hexa (meth) acrylate, and oligomers thereof; 2-propenyl di-3-butenyl cyanurate, 2-hydroxyethylbis ( Examples include isocyanurates such as 2-acryloxyethyl) isocyanurate, tris (2-methacryloxyethyl) isocyanurate, tris (2-methacryloxyethyl) isocyanurate, urethane acrylate oligomers, and the like.

  Specific examples of the photopolymerization initiator contained in the ultraviolet curable adhesive include benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether and benzoin isobutyl ether; aromatic ketones such as α-hydroxycyclohexyl phenyl ketone; benzyl Aromatic ketals such as dimethyl ketal; polyvinyl benzophenone; thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, and diethylthioxanthone. A photoinitiator can be used individually or in combination of 2 or more types. When the pressure-sensitive adhesive layer contains a photopolymerization initiator, the curing reaction can be efficiently advanced while suppressing the curing reaction time or the radiation irradiation amount.

  Examples of the crosslinking agent contained in the ultraviolet curable adhesive include a polyisocyanate compound, a melamine resin, a urea resin, a polyamine, and a carboxyl group-containing polymer.

<Peeling sheet>
It is preferable to attach a release sheet to the surface of the pressure-sensitive adhesive layer (the surface opposite to the dicing sheet substrate side; the pressure-sensitive adhesive surface). By sticking the release sheet, the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer can be kept smooth. In addition, handling and transportation of the dicing sheet substrate on which the pressure-sensitive adhesive layer is laminated can be facilitated, and labeling can be performed on the release sheet.

  The release sheet can be paper or a synthetic resin film such as polyethylene, polypropylene, polyethylene terephthalate, or the like. Moreover, in order to improve the peelability from an adhesive layer, the surface which contact | connects the adhesive layer of a peeling sheet may be given mold release processes, such as a silicone process and a fluorine process, as needed. The thickness of the release sheet is usually about 10 μm to 200 μm, preferably about 10 μm to 100 μm.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. The ethylene unit content is the content ratio of structural units derived from ethylene, the methacrylic acid unit content is the content ratio of structural units derived from methacrylic acid, and the glycidyl methacrylate unit content is the content ratio of structural units derived from glycidyl methacrylate. The n-butyl acrylate unit content indicates the content ratio of structural units derived from n-butyl acrylate. In addition, the composition of the raw material used for the Example and the comparative example, the physical property, and the measuring method of the physical property of the obtained sheet | seat and a film are as follows.

  In the following examples, among the following raw materials, the melt flow rate for (A1) to (A8), (B1), (B2), (D1), (D2), (R1), (R3) and (R4) (MFR) is measured at 190 ° C. and a load of 2160 g in accordance with JIS K7210-1999, and the melt flow rate (MFR) for (C1) to (C3) and (R2) is in accordance with JIS K7210-1999. At 230 ° C. and a load of 2160 g.

The number average molecular weight was measured under the following conditions using gel permeation chromatography (150C GPC, manufactured by Waters) and determined in terms of standard polystyrene.
Column: Tosoh TSKgel GMHHR-H (S) HT x 2 and Tosoh TSKgel G2000HHR (particle size 20 μm) HT x 1 connected in series Eluent: Orthodichlorobenzene (o-DCB)
Flow rate: 1.0 ml / min
Detector: RI
Column oven temperature: 135 ° C

<1. Raw materials>
[(A) Ethylene / (meth) acrylic acid copolymer]
-(A1) to (A5) ethylene / methacrylic acid copolymer-
(A1) Ethylene unit content: 85% by mass, methacrylic acid unit content: 15% by mass, MFR (190 ° C., 2160 g load): 60 g / 10 min (A2) Ethylene unit content: 91% by mass, methacrylic acid unit Content: 9% by mass, MFR (190 ° C., 2160 g load): 3.0 g / 10 min (A3) Ethylene unit content: 89% by mass, methacrylic acid unit content: 11% by mass, MFR (190 ° C., 2160 g) Load): 8 g / 10 min (A4) Ethylene unit content: 85 mass%, methacrylic acid unit content: 15 mass%, MFR (190 ° C., 2160 g load): 25 g / 10 min (A5) Ethylene unit content: 90% by mass, methacrylic acid unit content: 10% by mass, MFR (190 ° C., 2160 g load): 35 g / 10 min

-(A6) to (A8) ethylene / methacrylic acid / isobutyl acrylate copolymer-
(A6) Ethylene unit content: 85% by mass, methacrylic acid unit content: 10% by mass, isobutyl acrylate unit content: 5% by mass, MFR (190 ° C., 2160 g load): 60 g / 10 min (A7) ethylene Unit content: 80% by mass, methacrylic acid unit content: 10% by mass, isobutyl acrylate unit content: 10% by mass, MFR (190 ° C., 2160 g load): 58 g / 10 min (A8) ethylene unit content: 80% by mass, methacrylic acid unit content: 10% by mass, isobutyl acrylate unit content: 10% by mass, MFR (190 ° C., 2160 g load): 36 g / 10 min

[(B) Multi-component copolymer]
(B1) α-olefin / glycidyl copolymer ethylene / glycidyl methacrylate / n-butyl acrylate copolymer (ethylene unit content: 67% by mass, glycidyl methacrylate unit content: 5% by mass, containing n-butyl acrylate unit) Amount: 28% by mass), MFR (190 ° C., 2160 g load): 12 g / 10 min, number average molecular weight (Mn): 26400
(B2) α-olefin / glycidyl copolymer ethylene / glycidyl methacrylate copolymer (ethylene unit content: 88 mass%, glycidyl methacrylate unit content: 12 mass%), MFR (190 ° C., 2160 g load): 3 g / 10 minutes, number average molecular weight (Mn): 17000

[(C) Polyolefin]
(C1) Homopolypropylene [Prime Polypro F113G manufactured by Prime Polymer Co., Ltd., density: 910 kg / m ³ , MFR: 3.0 g / 10 min]
(C2) Random polypropylene [Prime Polypro F219DA manufactured by Prime Polymer Co., Ltd., density: 910 kg / m ³ , MFR: 8.0 g / 10 min]
(C3) Linear low-density polyethylene [Evolue SP2320 manufactured by Prime Polymer Co., Ltd., density: 920 kg / m ³ , MFR: 1.9 g / 10 min]

[(D) Other resins]
(D1) Ionomer base polymer of ethylene / methacrylic acid copolymer: ethylene / methacrylic acid copolymer [ethylene unit content: 90 mass%, methacrylic acid unit content: 10 mass%], metal cation source: zinc, medium Consistency: 70%, MFR (190 ° C., 2160 g load): 1 g / 10 min (D2) Ionomer base polymer of ethylene / methacrylic acid / acrylic acid ester copolymer: ethylene / methacrylic acid / butyl acrylate copolymer [ Ethylene unit content: 80% by mass, methacrylic acid unit content: 10% by mass, butyl acrylate: 10% by mass], metal cation source: zinc, degree of neutralization: 70%, MFR (190 ° C., 2160 g load): 1g / 10min

[(R1) to (R4) Laminating Resin]
(R1) Ethylene / methacrylic acid copolymer [= (A2)]
Ethylene unit content: 91% by mass, methacrylic acid unit content: 9% by mass, MFR (190 ° C., 2160 g load): 3.0 g / 10 min (R2) Low density polyethylene (LDPE)
Density: 920 kg / m ³ , MFR: 1.6 g / 10 min (R3) Ethylene / vinyl acetate copolymer (EVA)
Ethylene unit content: 81% by mass, vinyl acetate unit content: 19% by mass, MFR (190 ° C., 2160 g load): 2.5 g / 10 min (R4) ionomer Base polymer: ethylene / methacrylic acid copolymer [ethylene Unit content: 89% by mass, methacrylic acid unit content: 11% by mass], metal cation source: zinc, degree of neutralization: 65%

<2. Evaluation method>
About each dicing sheet base material (cast film) or dicing sheet of Examples and Comparative Examples manufactured by the methods described later, appearance evaluation, chip property evaluation (chip generation suppression evaluation), heat resistance evaluation, workability evaluation, and expansion Sex evaluation was performed.

(1) Appearance evaluation of base material The dicing sheet base materials prepared in Examples and Comparative Examples were visually observed and evaluated based on the following evaluation criteria. The lump is an irregular defect generated on the surface and inside of the dicing sheet substrate.
-Evaluation criteria-
A: There is no minute lump on the substrate, and there is no feeling of unevenness.
B: Although there is no fine lump on a base material, there exists a non-uniform feeling.
C: Since there is a minute lump on the base material and there is a non-uniform feeling, problems may occur during dicing.

(2) Chip evaluation (chip generation suppression evaluation)
The adherend was pasted on the surface of the pressure-sensitive adhesive layer of the dicing sheet prepared in Examples and Comparative Examples (the surface of the pressure-sensitive adhesive layer exposed by peeling the release sheet), and a dicing apparatus (Tokyo Seimitsu Co., Ltd., AWD-4000B). And dicing was performed under the following conditions.
Work (adherent): BGA type package module (manufactured by Kyocera Chemical Co., KE-G1250)
・ Work size: 550mm × 440mm
・ Thickness: 1.55mm
・ Dicing blade: ZllOOLG2S3T manufactured by DISCO
・ Blade rotation speed: 30,000rpm
Dicing speed: 100 mm / sec. Depth of cut: 20 μm cut from the surface of the dicing sheet substrate (the surface layer of a dicing sheet substrate having a two-layer or three-layer structure). Dicing size: 5 mm × 5 mm

Among vertical and horizontal dicing lines, the number of filaments generated in one vertical (MD direction) line near each center was measured using a digital microscope (manufactured by Keyence Corporation, VHX-100, magnification: 100 times). I counted. Based on the following evaluation criteria, the chip property was evaluated from the amount of the number of the filamentous waste found.
-Evaluation criteria-
A: The number of filamentous waste is 5 or less B: The number of filamentous waste exceeds 5 and less than 10 C: The number of filamentous waste is 10 or more

(3) Heat resistance evaluation The heat resistance evaluation was evaluated from the shrinkage ratio of the dicing sheet substrate during heating and the presence or absence of blocking. The shrinkage was measured using a 100 μm thick T-die film manufactured by the method described later.

(3-1) Shrinkage The dicing sheet base materials produced in the examples and comparative examples were each cut into 5 cm wide × 10 cm long to obtain evaluation films. In the central portion of the evaluation film in the horizontal direction, a marked line having a length of 60 mm was written in the vertical direction. When the dicing sheet base material has a three-layer structure, the dicing sheet base material is cut into 5 cm wide × 15 cm long to make an evaluation film, and the length in the vertical direction at the center in the horizontal direction on the back surface of the film. A 60 mm mark was entered.

Each film for evaluation was allowed to stand in a 100 ° C. environment for 10 minutes, then the length of the marked line was measured, and the shrinkage was calculated from the following formula. Based on the obtained shrinkage rate, evaluation was performed according to the following evaluation criteria.
Shrinkage [%] = 100 − [(100 ° C., length of marked line after standing for 10 minutes / 60 mm) × 100]
-Evaluation criteria-
A: Shrinkage is less than 0.5%.
B: Shrinkage is 0.5% or more and less than 2.0%.
C: Shrinkage is 2.0% or more.

(3-2) Presence / absence of blocking Each of the dicing sheet base materials prepared in Examples and Comparative Examples was cut into a width of 5 cm and a length of 15 cm to obtain evaluation films. Ten evaluation films were stacked, a load of 300 g was placed on the center of the upper surface of the stacked films, and the film was left in a 90 ° C. environment for 30 minutes. After being allowed to stand, the number of blocking films (the number of films adhered to adjacent films) was measured and evaluated according to the following evaluation criteria.
-Evaluation criteria-
A: 0 sheets, no blocking B: Partial blocking C: All 10 sheets blocked

In addition, blocking evaluation was performed from the following two viewpoints.
a) Table / Table One set was formed such that the surface layers of the evaluation film were in contact with each other. One set of the obtained films for evaluation was stacked in the vertical direction (total of 10 sheets), a load of 300 g was placed on the central portion of the stacked film, and left in a 90 ° C. environment for 30 minutes. After standing, the number of blocking films was measured and evaluated according to the above evaluation criteria.

b) Table / inside A set of the film for evaluation was overlapped so that the surface layer surface and the inner layer surface were in contact with each other. The inner layer surface of the evaluation film is the back surface of the surface layer when the dicing sheet substrate has a single layer configuration, the second layer surface in the case of a two layer configuration, and the third layer surface in the case of a three layer configuration. It was. One set of the obtained films for evaluation was stacked in the vertical direction (total of 10 sheets), a load of 300 g was placed on the central portion of the stacked film, and left in a 90 ° C. environment for 30 minutes. After standing, the number of blocking films was measured and evaluated according to the above evaluation criteria.

(4) Processability evaluation The melt flow rate (MFR) of the surface layer of the dicing sheet base material produced in the examples and comparative examples was measured at 190 ° C. and a load of 2160 g in accordance with JIS K7210-1999. The results are shown in Table 2.

(5) Extensibility evaluation The extensibility evaluation was evaluated from the expansion rate of the dicing sheet.
The dicing sheets produced in the examples and comparative examples were cut into squares of 300 mm in length (MD direction of the film) × 300 mm in width (TD direction of the film) to obtain evaluation films. On the obtained film for evaluation, a 141 mm square was drawn using an oil-based pen (hereinafter referred to as “measuring object 1”).

Measurement object 1 was set on a wafer expansion device for 8-inch wafers (wafer expansion device TEX-218G GR-8 manufactured by Technovision). At this time, the stage center of the wafer expansion apparatus was set so that the center of the square drawn on the measurement object 1 was aligned. Next, the stage was pulled up by 15 mm and the evaluation film was expanded, and then allowed to stand for 60 seconds, and the length (side length) of each side of the square of the measuring object 1 was measured. The elongation percentage (%; = side length after expansion / side length before expansion × 100) was calculated for each of the obtained four side lengths, and the average value was defined as the expansion ratio [%].
The allowable range of the expansion rate is 103% or more.
-Evaluation criteria-
A: Expansion rate is 105% or more B: Expansion rate is 103% or more and less than 105% C: Expansion rate is less than 103%

[Example 1]
(1) Preparation of Resin Composition for Dicing Sheet Substrate (A1) An ethylene / methacrylic acid copolymer, (B1) an α-olefin / glycidyl copolymer, and ( C1) Homopolypropylene was charged at the ratio shown in Table 1 and dry blended.
Then, the resin composition 1 for dicing sheet base materials was obtained by throwing into the resin inlet and melt-kneading at a die temperature of 180 ° C.
In Table 1, “%” is based on mass (mass%).

  The “G concentration” in the “(B)” column of Table 1 is “(()) with respect to the total mass of (A), (B), and (C) in the resin composition for a dicing sheet substrate of Example or Comparative Example. ii) “content ratio of structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether”. Specifically, the content ratio of the structural unit derived from glycidyl methacrylate (B1) or (B2) with respect to the total mass of (A), (B), and (C) is shown.

  The “B amount” in the “(B)” column of Table 1 is 100% by mass in total of the copolymer (A), the multi-component copolymer (B) and the polyolefin (C) in the resin composition for a dicing sheet substrate. The content of (B1) ethylene / glycidyl methacrylate / n-butyl acrylate copolymer or (B2) ethylene / glycidyl methacrylate copolymer in the composition is shown.

(2) Production of a dicing sheet substrate -Production of a single-layer dicing sheet substrate-
The obtained resin composition 1 for a dicing sheet substrate was molded using a 40 mmφ cast film molding machine at a processing temperature of 180 ° C. to prepare a cast film having a thickness of 100 μm. The obtained cast film was used as the dicing sheet substrate 1 of Example 1, and the above-described appearance evaluation, heat resistance evaluation, and workability evaluation were performed. The results are shown in Table 2.

(3) Preparation of pressure-sensitive adhesive On the other hand, 100 parts by mass of a copolymer (Mw: 500,000) obtained by copolymerizing 95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid, a urethane acrylate oligomer (Mw: 8000) 120 parts by mass, 5 parts by mass of an isocyanate curing agent (Nippon Polyurethane Co., Coronate L), and 4 parts by mass of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 184) are mixed to form an energy ray curable pressure-sensitive adhesive composition. Got.

(4) Production of dicing sheet The obtained energy ray-curable pressure-sensitive adhesive composition was subjected to a release treatment surface of a release sheet (Lintec Corporation, SP-PET38111 (S)) subjected to silicone release treatment, and the film thickness after drying was reduced. The adhesive layer is applied to 10 μm, dried at 100 ° C. for 1 minute to form an adhesive layer, and this is attached to the dicing sheet substrate, whereby the adhesive layer is transferred onto the substrate film, and the dicing sheet It was. The obtained dicing sheet was used as the dicing sheet of Example 1, and chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed. The results are shown in Table 2.

[Examples 2 to 9]
In the preparation of the resin composition 1 for a dicing sheet substrate, the materials shown in Table 1 are (A1) an ethylene / methacrylic acid copolymer, (B1) an α-olefin / glycidyl copolymer, and (C1) a homopolypropylene. And except having changed into the ratio shown in Table 1, it carried out similarly to Example 1, and obtained the resin compositions 2-9 for dicing sheet base materials of Examples 2-9.

  Next, in the production of the dicing sheet substrate 1, Examples 2 to 9 were performed in the same manner as in Example 1 except that the dicing sheet substrate resin composition 1 was changed to the dicing sheet substrate resin compositions 2 to 9. Dicing sheet base materials 2 to 9 were prepared.

About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
Moreover, the dicing sheet was produced like Example 1 except using the said dicing sheet base materials 2-9. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

Example 10
(A1) Ethylene / methacrylic acid copolymer, (B1) α-olefin / glycidyl copolymer, and (C1) homopolypropylene are charged into the resin inlet of the 30 mmφ twin screw extruder in the proportions shown in Table 1. And dry blended.
Then, the resin composition 10 for dicing sheet base materials was obtained by throwing into the resin inlet and melt-kneading at a die temperature of 180 ° C.

-Production of dicing sheet base material with two layers-
Using the resin composition 10 for a dicing sheet base material and the resin shown in “Second layer” in Table 1, a two-layer film having a layer composed of the resin composition 10 for a dicing sheet base material as a surface layer is produced. did. For the production of the two-layer film, a 40 mmφ3 type three-layer cast molding machine was used, and the die temperature was set to 180 ° C. using a nip molding method. The thicknesses of the surface layer and the second layer were the thicknesses shown in the “μm” column of the “second layer (inner layer)” column of Table 1.

The two-layer film thus obtained was used as the dicing sheet substrate 10 of Example 10, and the appearance evaluation, heat resistance evaluation and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
A dicing sheet was produced in the same manner as in Example 1 except that the dicing sheet substrate 10 was used. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Examples 11 to 20]
In the preparation of the resin composition 10 for a dicing sheet substrate, (A1) an ethylene / methacrylic acid copolymer, (B1) an α-olefin / glycidyl copolymer, and (C1) a homopolypropylene are materials shown in Table 1. And except having changed into the ratio shown in Table 1, the resin composition 11-20 for dicing sheet base materials of Examples 11-20 was obtained similarly.

Subsequently, in preparation of the dicing sheet base material 10, the resin composition 10 for dicing sheet base materials is changed into the resin compositions 11-20 for dicing sheet base materials, and the thickness of a surface layer and a 2nd layer is set to the thickness shown in Table 1. Dicing sheet base materials 11 to 20 of Examples 11 to 20 were produced in the same manner except that the changes were made.
About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
Moreover, the dicing sheet was produced like Example 1 except using the said dicing sheet base materials 11-20. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Examples 21 to 24]
In the preparation of the resin composition 10 for a dicing sheet substrate, (A1) ethylene / methacrylic acid copolymer is shown in Table 1 as (A5) ethylene / methacrylic acid copolymer or (A8) ethylene / methacrylic acid / methacrylic acid. In place of the butyl ester copolymer, (B1) α-olefin / glycidyl copolymer and (C1) homopolypropylene were changed to the materials shown in Table 1 and the ratios shown in Table 1, and (D ) Resins 21 to 24 for dicing sheet substrates of Examples 21 to 24 were obtained in the same manner except that other resins were newly added at the ratios shown in Table 1 and the ratios shown in Table 1. .

  Subsequently, in preparation of the dicing sheet base material 10, the resin composition 10 for dicing sheet base materials is changed into the resin compositions 21-24 for dicing sheet base materials, and the thickness of a surface layer and a 2nd layer is set to the thickness shown in Table 1. Dicing sheet base materials 21 to 24 of Examples 21 to 24 were produced in the same manner except that the changes were made.

About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
Moreover, the dicing sheet was produced like Example 1 except using the said dicing sheet base materials 21-24. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

  In addition, about the content ratio of each component (A)-(D) in Examples 21-24, while showing the value when the sum total of (A)-(C) is 100 mass% in Table 1, Table 1 is shown. The value converted with the total of (A) to (D) as 100% by mass is also shown in parentheses.

Example 25
The resin composition 25 for a dicing sheet base material of Example 25 was obtained in the same manner as the preparation of the resin composition 1 for a dicing sheet base material of Example 1.

-Fabrication of three-layer dicing sheet substrate-
Dicing sheet base material using resin composition 25 for dicing sheet base material, resin shown in “second layer (inner layer)” in Table 1, and resin shown in “third layer (inner layer)” in Table 1 A three-layer film having a layer composed of the resin composition 25 for the surface layer as a surface layer was produced. For the production of the three-layer film, a 40 mmφ three-kind three-layer cast molding machine was used, and the die temperature was set to 180 ° C. using a nip molding method. The thicknesses of the surface layer, the second layer, and the third layer were the thicknesses shown in the “μm” column of the “second layer (inner layer)” column or the “third layer (inner layer)” column of Table 1.

The thus obtained three-layer film was used as a dicing sheet substrate 25 of Example 25, and appearance evaluation, heat resistance evaluation and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
A dicing sheet was produced in the same manner as in Example 1 except that the dicing sheet substrate 25 was used. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Examples 26 to 30]
In the same manner as in the preparation of the resin composition 1 for a dicing sheet substrate of Example 1, the resin compositions 26 to 30 for dicing sheet substrates of Examples 26 to 30 were obtained.

  In preparation of the dicing sheet base material 25 of Example 25, the resin compositions 26 to 30 for the dicing sheet base material were used instead of the resin composition 25 for the dicing sheet base material, and the second and third layers of resin were used. Dicing sheet base materials 26 to 30 of Examples 26 to 30 were obtained in the same manner except that the resin shown in Table 1 was changed and the thickness of each layer was changed to the thickness shown in Table 1.

About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
Moreover, the dicing sheet was produced like Example 1 except using the said dicing sheet base materials 26-30. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Comparative Examples 1-3]
In preparation of the dicing sheet base material 10 of Example 10, the ethylene / methacrylic acid copolymer of (A3), (A4) or (A2) shown in Table 1 is used instead of the resin composition 10 for dicing sheet base material. Dicing sheet base materials 101 to 103 of Comparative Examples 1 to 3 were produced in the same manner except that they were used.

About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
A dicing sheet was produced in the same manner as in Example 1 except that the dicing sheet base materials 101 to 103 were used. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Comparative Example 4]
(A4) Ethylene / methacrylic acid copolymer and (C1) homopolypropylene were charged into the resin inlet of a 30 mmφ twin-screw extruder in the proportions shown in Table 1 and dry blended.
Then, the resin composition 104 for dicing sheet base materials was obtained by throwing into the resin inlet and melt-kneading at a die temperature of 180 ° C.

  In the production of the dicing sheet substrate 10 of Example 10, the dicing sheet of Comparative Example 4 was similarly used except that the dicing sheet substrate resin composition 104 was used instead of the dicing sheet substrate resin composition 10. A substrate 104 was obtained.

About the obtained dicing sheet base material, appearance evaluation, heat resistance evaluation, and workability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.
A dicing sheet was produced in the same manner as in Example 1 except that the dicing sheet substrate 104 was used. About the obtained dicing sheet, chip property evaluation (chip generation suppression evaluation) and expandability evaluation were performed in the same manner as in Example 1. The results are shown in Table 2.

[Comparative Example 5]
(A1) Ethylene / methacrylic acid copolymer and (B) α-olefin / glycidyl copolymer were charged into the resin inlet of a 30 mmφ twin screw extruder at the ratio shown in Table 1 and dry blended.
Thereafter, it was introduced into the resin inlet and melt-kneaded at a die temperature of 180 ° C., but gelled and became unworkable. Therefore, the comparative example 5 is not evaluated.

  As shown in Table 2, in the examples, generation of chips was suppressed, and heat resistance and expandability were excellent. On the other hand, in the comparative example, it was not possible to achieve both suppression of chip generation, high heat resistance, and high expandability.

Claims (6)

A dicing sheet comprising a dicing sheet base material and an adhesive layer laminated on one surface of the dicing sheet base material,
The dicing sheet substrate is
An ethylene / α, β-unsaturated carboxylic acid copolymer (A);
(I) a multi-unit copolymer (B) having at least a structural unit derived from an α-olefin, and (ii) a structural unit derived from glycidyl (meth) acrylate or glycidyl unsaturated ether;
Polyolefin (C),
A layer composed of a resin composition for a dicing sheet substrate containing a functional layer composed of at least one layer disposed on one surface of a layer composed of the resin composition for a dicing sheet substrate ,
The ratio of the structural unit derived from (ii) glycidyl (meth) acrylate or glycidyl unsaturated ether in the multi-component copolymer (B) is 0.5% by mass relative to the total mass of the multi-component copolymer (B). ~ 20% by weight,
The functional layer comprises an ethylene / unsaturated carboxylic acid copolymer, an ethylene / unsaturated carboxylic acid / unsaturated carboxylic acid alkyl terpolymer, an ethylene / unsaturated carboxylic acid alkyl ester copolymer, an ethylene / vinyl. It comprises at least one selected from an ester copolymer, an ethylene / unsaturated carboxylic acid alkyl ester / carbon monoxide copolymer, and an unsaturated carboxylic acid graft product thereof,
The dicing sheet, wherein the functional layer has a thickness of 30 μm or more and 150 μm or less. The dicing sheet substrate resin composition is:
40% by mass to 99% by mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A),
The multi-component copolymer (B) more than 0% by mass and 20% by mass or less;
1% by mass to 40% by mass of the polyolefin (C),
(However, the total of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B) and the polyolefin (C) is 100% by mass),
The (ii) glycidyl (meth) acrylate or glycidyl-free polymer with respect to the total mass of the ethylene / α, β-unsaturated carboxylic acid copolymer (A), the multi-component copolymer (B), and the polyolefin (C). The dicing sheet according to claim 1, wherein the content ratio of the structural unit derived from the saturated ether is more than 0% by mass and 1.0% by mass or less. The ethylene · alpha, beta-alpha in-unsaturated carboxylic acid copolymer (A), beta-content ratio of the constituent unit derived from the unsaturated carboxylic acid is 5% by mass to 20% claim 1 or 2. The dicing sheet according to 2 . The ethylene · alpha, beta-unsaturated carboxylic acid copolymer (A) constituting the alpha, the beta-unsaturated carboxylic acids, (meth) according to any one of claims 1 to 3, which is acrylic acid Dicing sheet. The dicing sheet according to any one of claims 1 to 4 , wherein the polyolefin (C) is at least one selected from random polypropylene, homopolypropylene, low-density polyethylene, and linear low-density polyethylene. The said multi-component copolymer (B) is a ternary copolymer which has the structural unit derived from (iii) vinyl ester or unsaturated carboxylic acid ester further, The any one of Claims 1-5 . Dicing sheet.