MY172228A - Dicing sheet and method for manufacturing device chips - Google Patents

Dicing sheet and method for manufacturing device chips

Info

Publication number
MY172228A
MY172228A MYPI2015700132A MYPI2015700132A MY172228A MY 172228 A MY172228 A MY 172228A MY PI2015700132 A MYPI2015700132 A MY PI2015700132A MY PI2015700132 A MYPI2015700132 A MY PI2015700132A MY 172228 A MY172228 A MY 172228A
Authority
MY
Malaysia
Prior art keywords
pressure sensitive
sensitive adhesive
adhesive layer
dicing sheet
energy ray
Prior art date
Application number
MYPI2015700132A
Inventor
Nakanishi Hayato
Nishida Takuo
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY172228A publication Critical patent/MY172228A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

As a dicing sheet which comprises a pressure sensitive adhesive layer having an excellent pressure sensitive adhesion property even when the adherend surf ace is a surface of a device-related member, in particular a non-flat surface of a device-related non-flat surface member, and which is unlikely to cause a trouble due to pressure sensitive adhesive aggregates, there is provided a dicing sheet ( 1) comprising a base film ( 2) and a pressure sensitive adhesive layer (3) laminated on at least one surface of the base film (2), wherein: the pressure sensitive adhesive layer ( 3) is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and an energy ray polymerizable compound (B); the pressure sensitive adhesive layer ( 3) has a thickness of 25 ?m or less; and the pressure sensitive adhesive layer (3) has a storage elastic modulus at 23?C of 0.12 MPa or less before energy ray irradiation and a holding time of 15,000 seconds or more, wherein the holding time is measured when a test for measuring a holding power of the pressure sensitive adhesive layer (3) before energy ray irradiation is performed in accordance with JIS Z0237: 2009. There is also provided a method .for manufacturing device chips using the dicing sheet (1).
MYPI2015700132A 2012-08-03 2013-05-02 Dicing sheet and method for manufacturing device chips MY172228A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03

Publications (1)

Publication Number Publication Date
MY172228A true MY172228A (en) 2019-11-18

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700132A MY172228A (en) 2012-08-03 2013-05-02 Dicing sheet and method for manufacturing device chips

Country Status (6)

Country Link
JP (1) JP5414953B1 (en)
CN (1) CN104508801B (en)
MY (1) MY172228A (en)
PH (1) PH12015500230A1 (en)
TW (1) TWI564363B (en)
WO (1) WO2014020962A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141555A1 (en) * 2014-03-17 2015-09-24 リンテック株式会社 Dicing sheet and process for producing chips using said dicing sheet
JP6522617B2 (en) * 2014-07-31 2019-05-29 リンテック株式会社 Dicing sheet, method of manufacturing dicing sheet, and method of manufacturing mold chip
EP3433876B1 (en) * 2016-03-24 2023-09-13 Siltectra GmbH A splitting method
JP2018019022A (en) * 2016-07-29 2018-02-01 日東電工株式会社 Dicing tape integrated semiconductor rear face film and method of manufacturing semiconductor device
JPWO2020195744A1 (en) * 2019-03-27 2020-10-01
JP2020164786A (en) * 2019-03-29 2020-10-08 住友ベークライト株式会社 Pressure sensitive adhesive tape
CN110465888B (en) * 2019-09-17 2021-01-15 泉州运城制版有限公司 Installation method of grinding wheel of plate roller grinding machine
JP7276555B1 (en) 2021-11-08 2023-05-18 大日本印刷株式会社 Adhesive tape for semiconductor processing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (en) * 2000-01-21 2009-11-25 日東電工株式会社 Adhesive sheet for semiconductor wafer holding protection
JP4781633B2 (en) * 2004-03-29 2011-09-28 リンテック株式会社 Adhesive sheet
KR101426572B1 (en) * 2006-03-15 2014-08-05 신에츠 폴리머 가부시키가이샤 Holding jig, semiconductor wafer grinding method
JP4991348B2 (en) * 2006-04-06 2012-08-01 リンテック株式会社 Adhesive sheet
JP4991350B2 (en) * 2007-02-28 2012-08-01 リンテック株式会社 Adhesive sheet
JP2012069586A (en) * 2010-09-21 2012-04-05 Nitto Denko Corp Dicing die-bonding film, manufacturing method of dicing die-bonding film, and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
TW201408750A (en) 2014-03-01
JP5414953B1 (en) 2014-02-12
CN104508801A (en) 2015-04-08
JPWO2014020962A1 (en) 2016-07-21
WO2014020962A1 (en) 2014-02-06
CN104508801B (en) 2017-11-10
TWI564363B (en) 2017-01-01
PH12015500230B1 (en) 2015-04-06
PH12015500230A1 (en) 2015-04-06

Similar Documents

Publication Publication Date Title
MY172228A (en) Dicing sheet and method for manufacturing device chips
PH12016500005B1 (en) Dicing sheet
MY159804A (en) Dicing tape for processing semiconductor
MY186486A (en) Dicing sheet
WO2013025443A3 (en) Radiation curable pressure sensitive adhesive sheet
JP2010215906A5 (en)
MY163349A (en) Adhesive tape and solar assembly and article made thereof
TW200801155A (en) Pressure-sensitive adhesive sheet and method for processing semiconductor wafer or semiconductor substrate
PH12015500991A1 (en) Adhesive sheet
MY181765A (en) Heat-resistant adhesive sheet for semiconductor testing
WO2008152956A1 (en) Photocurable pressure-sensitive adhesive composition
MY156758A (en) Multilayer adhesive sheet and method for manufacturing electronic component
EP2687570A3 (en) Pressure-Sensitive Adhesive Sheet, Electric or Electronic Device Member Laminate and Optical Member Laminate
EP3029121A3 (en) Surface protective pressure-sensitive adhesive sheet
MY161110A (en) Temporary adhesive tape for protecting a semiconductor wafer surface
JP2011168727A5 (en)
MX2016004011A (en) Articles and methods comprising polyacrylate primer with nitrogen-containing polymer.
MY183013A (en) Sheet for semiconductor processing
PH12014501759A1 (en) Sealing sheet for solar cell
MY178423A (en) Pressure sensitive adhesive sheet and method of manufacturing processed device-related member
TW201129471A (en) Surface protective sheet
WO2013049775A3 (en) Scintillation detection device with pressure sensitive adhesive
MY184455A (en) Base film for dicing sheet and dicing sheet
SG11201808291YA (en) Semiconductor processing sheet
TW201129470A (en) Surface protective sheet