PH12015500230B1 - Dicing sheet and method for manufacturing device chips - Google Patents
Dicing sheet and method for manufacturing device chips Download PDFInfo
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- PH12015500230B1 PH12015500230B1 PH12015500230A PH12015500230A PH12015500230B1 PH 12015500230 B1 PH12015500230 B1 PH 12015500230B1 PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 B1 PH12015500230 B1 PH 12015500230B1
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- PH
- Philippines
- Prior art keywords
- pressure sensitive
- sensitive adhesive
- adhesive layer
- dicing sheet
- mass parts
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 201
- 239000010410 layer Substances 0.000 claims abstract description 152
- 239000000203 mixture Substances 0.000 claims abstract description 76
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 69
- 150000001875 compounds Chemical class 0.000 claims abstract description 66
- 238000003860 storage Methods 0.000 claims abstract description 66
- 238000012360 testing method Methods 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 239000004971 Cross linker Substances 0.000 claims description 44
- 229920001577 copolymer Polymers 0.000 claims description 20
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 14
- 239000005977 Ethylene Substances 0.000 claims description 14
- 238000004132 cross linking Methods 0.000 claims description 12
- 229920000098 polyolefin Polymers 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 46
- 239000011347 resin Substances 0.000 description 46
- 239000011248 coating agent Substances 0.000 description 45
- 238000000576 coating method Methods 0.000 description 45
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 41
- 239000004065 semiconductor Substances 0.000 description 40
- -1 acrylic ester Chemical class 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 19
- 239000000178 monomer Substances 0.000 description 16
- 238000007789 sealing Methods 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- 239000005056 polyisocyanate Substances 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 241001050985 Disco Species 0.000 description 4
- 239000013032 Hydrocarbon resin Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920006270 hydrocarbon resin Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000005865 ionizing radiation Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000006841 cyclic skeleton Chemical group 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000000638 stimulation Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- TXTIIWDWHSZBRK-UHFFFAOYSA-N 2,4-diisocyanato-1-methylbenzene;2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CC1=CC=C(N=C=O)C=C1N=C=O TXTIIWDWHSZBRK-UHFFFAOYSA-N 0.000 description 1
- GUVXYYRRJCHAJL-UHFFFAOYSA-N 2-[8-(oxiran-2-yl)octyl]oxirane Chemical compound C1OC1CCCCCCCCC1CO1 GUVXYYRRJCHAJL-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 241000566113 Branta sandvicensis Species 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 101100016034 Nicotiana tabacum APIC gene Proteins 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- ARUKYTASOALXFG-UHFFFAOYSA-N cycloheptylcycloheptane Chemical compound C1CCCCCC1C1CCCCCC1 ARUKYTASOALXFG-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DKGCZVJEVNZACI-UHFFFAOYSA-N n-[[5-[[bis(oxiran-2-ylmethyl)amino]methyl]-5-methylcyclohexa-1,3-dien-1-yl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1C(CN(CC2OC2)CC2OC2)=CC=CC1(C)CN(CC1OC1)CC1CO1 DKGCZVJEVNZACI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
As a dicing sheet which comprises a pressure sensitive adhesive layer having an excellent pressure sensitive adhesive property even when the adherend surface is a surface of a device-related member, in particular a non-flat surface of a device-related non-flat surface member, and which is unlikely to cause a trouble due to pressure sensitive adhesive aggregates, there is provided a dicing sheet (1) comprising a base film (2) and a pressure sensitive adhesive layer (3) laminated on at least one surface of the base film (2), wherein: the pressure sensitive adhesive layer (3) is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and an energy ray polymerizable compound (B); the pressure sensitive adhesive layer (3) has a thickness of 25 mm or less; and the pressure sensitive adhesive leyer (3) has a storage elastic modulus at 23oC of 0.12 MPa or less before energy ray irradiation and a holding time of 15,000 seconds or more, wherein the holding time is measured when a test for measuring a holding power of the pressure sensitive adhesive layer (3) before energy ray irradiation is performed in accordance with JIS Z0237:2009. There is also provided a method for manufacturing a device chips using the dicing sheet (1).
Description
> 9 interfacial adhesion property to the pressure sensitive adhesive layer 3, and therefore is unlikely to cause delamination at the interface between the base film 2 and the pressure sensitive adhesive layer 3 when used as a dicing sheet.
The ethylene-based copolymer film and the polyolefin-based film contain less amount of components that negatively affect the properties as those of a dicing sheet (for example, in a polyvinyl chloride-based film or the like, a plasticizer contained in the film may transfer from the base film 2 to the pressure sensitive adhesive layer 3 and may further be distributed in a surface of the pressure sensitive adhesive layer 3 opposite to the surface facing the base film 2, thereby to deteriorate the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 to the adherend). Therefore, a problem is unlikely to occur such as that the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 to the adherend is deteriorated. That is, the ethylene-based copolymer film and the polyolefin-based film have an excellent chemical stability.
The base film 2 may also contain various additives, such as pigment, fire retardant, plasticizer, antistatic, glidant and filler, in the film that contains the above resin-based material as the main material. Examples of the pigment include titanium dioxide and carbon black.
Examples of the filler include organic material such as melamine resin, inorganic material such as fumed silica, and metal-based material such as nickel particle. The content of such additives is not particularly limited, but may have to be within a range in which the base film 2 exerts a desirable function and does not lose the flatness and/or the flexibility.
When ultraviolet ray is used as an energy ray that is irradiated to harden the pressure sensitive adhesive layer 3, it is preferred that the base film 2 has transparency for the ultraviolet ray. When electron ray is used as the energy ray, it is preferred that the base film 2 has transparency for the electron ray.
It is preferred that a component having one or more types selected from the group consisting of a carboxyl group and ion and salt thereof is present at a surface of the base film 2 at the side of the pressure sensitive adhesive layer 3 (referred also to as a "base film adhering surface" hereinafter). The above component in the base film 2 and components relating to the pressure sensitive adhesive layer 3 (there may be exemplified components that constitute the pressure sensitive adhesive layer 3 and components, such as a cross-linker (D), that are used when forming the pressure sensitive adhesive layer 3) may interact chemically with each other thereby to reduce the possibility of occurrence of delamination therebetween.
A specific approach for allowing such a component to be present at the base film adhering
Sa SSSSEEEEEEEEELELLELL———————— > 10 surface is not particularly limited. For example, such a specific approach may include configuring the base film 2 itself of an ethylene(meth)acrylic acid copolymer film, an ionomer resin film or the like, for example, and employing a resin having one or more types selected from the group consisting of a carboxyl group and ion and salt thereof, as a resin to be a material that constitutes the base film 2. Another approach for allowing the above component to be present at the base film adhering surface may be such that a polyolefin-based film is used as the base film 2, for example, and the side of the base film adhering surface is subjected to corona treatment and/or provided with a primer layer. In addition, one or more types of coating films may be provided on the opposite surface of the base film 2 to the base film adhering surface.
The thickness of the base film 2 is not limited as long as the dicing sheet 1 can function appropriately in each of the previously described steps. The thickness may preferably be within a range of 20 pm or more and 450 um or less, more preferably 25 um or more and 400 pum or less, and most preferably 50 pm or more and 350 um or less.
The fracture elongation of the base film 2 in the present embodiment may preferably be 100% or more as a value measured at 23°C and a relative humidity of 50%, and most preferably 200% or more and 1,000% or less. Here, the fracture elongation is an elongation percentage of the length of a test piece when the test piece fractures to the original length in a tensile test in accordance with JIS K7161: 1994 (ISO 527-1 1993). The base film 2 having a fracture elongation of 100% or more as described above is unlikely to fracture during the expanding step, and the device chips formed by cutting the device-related member can be easily separated from one another.
The tensile stress at a strain of 25% of the base film 2 in the present embodiment may preferably be 5 N/10 mm or more and 15 N/10 mm or less, and the maximum tensile stress may preferably be 15 MPa or more and 50 MPa or less. Here, the tensile stress at a strain of 25% and the maximum tensile stress are to be measured by a test in accordance with
JIS K7161: 1994. If the tensile stress at a strain of 25% is less than 5 N/10 mm and/or the maximum tensile stress is less than 15 MPa, then, when the dicing sheet 1 is fixed to a frame such as a ring frame after a device-related member is applied to the dicing sheet 1, a concern is that a play may occur because the base film 2 is yielding, and such a play may cause errors in transportation. If, on the other hand, the tensile stress at a strain of 25% exceeds 15 N/10 mm and/or the maximum tensile stress exceeds 50 MPa, a concern is that a problem may readily occur such as that the dicing sheet 1 itself is released from the ring frame in the expanding step. Note that the fracture elongation, the tensile stress at a strain of 25% and
SSL
> 11 the maximum tensile stress as described above refer to values measured in the longitudinal direction of an original sheet of the base film 2. 2. Pressure sensitive adhesive layer
The pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is to be formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and an energy ray polymerizable compound (B), and if necessary may further contain a storage elastic modulus adjuster (C), a cross-linker (D) and the like. (1) Acrylic-based polymer (A)
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains an acrylic-based polymer (A).
In the pressure sensitive adhesive layer 3 formed of this pressure sensitive adhesive composition, the acrylic-based polymer (A) may be contained as a cross-linked product obtained by a cross-linking reaction of at least a part of the acrylic-based polymer (A) and a cross-linker (D) to be described later.
Conventionally known acrylic-based polymer may be used as the acrylic-based polymer (A). In view of the film-forming ability at the time of coating, the weight-average molecular weight (Mw) of the acrylic-based polymer (A) may preferably be 10,000 or more and 2,000,000 or less, and more preferably 100,000 or more and 1,500,000 or less. The glass-transition temperature Tg of the acrylic-based polymer (A) may preferably be within a range of ~70°C or more and 30°C or less, and further preferably —60°C or more and 20°C or less. The glass-transition temperature can be calculated using the Fox equation.
The above acrylic-based polymer (A) may be a homopolymer formed of one type of acrylic-based monomer, a copolymer formed of plural types of acrylic-based monomers, or a copolymer formed of one or more types of acrylic-based monomers and monomer or monomers other than the acrylic-based monomers. Specific types of a compound to be an acrylic-based monomer are not particularly limited, and specific examples thereof include (meth)acrylic acid, itaconic acid, (meth)acrylic ester, and derivatives thereof (such as acrylonitrile). Specific examples of the (meth)acrylic ester include: (meth)acrylate having a chain-like skeleton, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate; (meth)acrylate having a cyclic skeleton, such as cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl
> 12 (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate and imide acrylate; (meth)acrylate having a hydroxyl group, such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; and (methacrylate having a reactive functional group other than hydroxyl group, such as glycidyl (meth)acrylate and N-methylaminoethyl (meth)acrylate.
Examples of a monomer other than the acrylic-based monomer include olefin such as ethylene and norbornene, vinyl acetate, and styrene. When the acrylic-based monomer is alkyl (meth) acrylate, it is preferred that the carbon number of the alkyl group is within a range of 1 to 18.
When the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains a cross-linker (D) that is reactive in cross-linking with the acrylic-based polymer (A) as will be described later, the type of a reactive functional group possessed by the acrylic-based polymer (A) is not particularly limited, and may appropriately be determined on the basis of the type of the cross-linker (D) and the like. For example, when the cross-linker (D) is a polyisocyanate compound, examples of the reactive functional group possessed by the acrylic-based polymer (A) include hydroxyl group, carboxyl group and amino group. Such a polar functional group has a function of reacting with the cross-linker (D) as well as an effect of improving the compatibility between the acrylic-based polymer (A) and a storage elastic modulus adjuster (C) to be described later. When the cross-linker (D) is a polyisocyanate compound, hydroxyl group having high reactivity with the isocyanate group may preferably be employed as the reactive functional group. A method of introducing hydroxyl group as the reactive functional group into the acrylic-based polymer (A) is not particularly limited. One example thereof may be causing the acrylic-based polymer (A) to contain in its skeleton a constitutional unit based on an acrylate having hydroxyl group, such as 2-hydroxyethyl (meth) acrylate.
When the acrylic-based polymer (A) has a reactive functional group, in view of making it easy to allow the holding power of the pressure sensitive adhesive layer 3 before energy ray irradiation (referred also to as a "holding power before irradiation", details thereof will be described later) to be within an appropriate range, the mass ratio of the reactive functional group to the total monomer may preferably be about 1 mass% or more and 20 mass% or less, and more preferably 2 mass% or more and 10 mass% or less, in terms of the monomer for forming the acrylic-based polymer (A).
(2) Energy ray polymerizable compound (B)
Specific configuration of the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment is not particularly limited as long as the energy ray polymerizable compound (B) has an energy ray polymerizable group and is capable of polymerization reaction when irradiated by an energy ray such as ultraviolet ray and electron ray. Polymerization of the energy ray polymerizable compound (B) reduces the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 thereby to improve the workability in the picking-up step.
The type of the energy ray polymerizable group is not particularly limited.
Specific examples thereof include a functional group having an ethylenic unsaturated bond, such as vinyl group and (meth)acryloyl group. When the pressure sensitive adhesive composition contains the cross-linker (D), in view of reducing the possibility of functionally overlapping with a site of the cross-linker (D) that performs cross-linking reaction, the energy ray polymerizable group may preferably be a functional group having an ethylenic unsaturated bond, and in particular a (meth)acryloyl group may be more preferable from the viewpoint of the high reactivity when the energy ray is irradiated.
The molecular weight of the energy ray polymerizable compound (B) is not particularly limited. If the molecular weight is unduly small, a concern is the volatilization in the production process, which may deteriorate the stability of the composition of the pressure sensitive adhesive layer 3. Therefore, the molecular weight of the energy ray polymerizable compound (B) may preferably be 100 or more as a weight-average molecular weight (Mw), more preferably 200 or more, and most preferably 300 or more.
It is preferred that at least a part of the energy ray polymerizable compound (B) has a molecular weight of 4,000 or less as a weight-average molecular weight (Mw) and also has a property as the storage elastic modulus adjuster (C) to be described later. Examples of such a energy ray polymerizable compound (B) having a property as the storage elastic modulus adjuster (C) include a compound comprising one or more types selected from the group that consists of a monofunctional monomer and a multifunctional monomer each having an energy ray polymerizable group and an oligomer of such a monomer.
Specific composition of the above compound is not particularly limited. Specific examples of the above compound include: alkyl (meth)acrylate having a chain-like skeleton,
such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butyleneglycol di(meth)acrylate and 1,6-hexanediol di(meth)acrylate; alkyl (meth)acrylate having a cyclic skeleton, such as dicyclopentadiene dimethoxy di(meth)acrylate and isobornyl (meth)acrylate; and acrylate-based compound, such as polyethylene glycol di(meth)acrylate, oligoester (meth)acrylate, urethane (meth)acrylate oligomer, epoxy modified (meth)acrylate, polyether (meth)acrylate and itaconic acid oligomer.
Among them, the acrylate-based compound is preferred because of its high compatibility to the acrylic-based polymer (A).
The number of the energy ray polymerizable groups included in one molecule of the energy ray polymerizable compound (B) is not limited, but may preferably be 2 or more, more preferably 3 or more, and most preferably 5 or more.
When the. energy ray polymerizable compound (B) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment has a property as the storage elastic modulus adjuster (C), the content of the energy ray polymerizable compound (B) may preferably be 50 mass parts or more and 300 mass parts or less, and more preferably 75 mass parts or more and 150 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A). In the present description, the "mass parts" representing the content of each component refer to an amount as that of a solid content. The content of the energy ray polymerizable compound (B) within such a range can make it easy to set a storage elastic modulus at 23°C of the pressure sensitive adhesive layer 3 within a range to be described later in a state before the energy ray irradiation, and can also make it easy to appropriately reduce the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 through the energy ray irradiation.
Examples of a case in which the energy ray polymerizable compound (B) is not a material having a property as the storage elastic modulus adjuster (C) include a case in which the energy ray polymerizable compound (B) is an acrylic-based polymer that has a constitutional unit having an energy ray polymerizable group at the main chain or the side chain. In this case, the energy ray polymerizable compound (B) has a property as the acrylic-based polymer (A), and advantages are therefore such that the composition for forming the pressure sensitive adhesive layer 3 can be simplified and that the existing density of the energy ray polymerizable groups can easily be controlled in the pressure sensitive adhesive layer 3.
> 15
The energy ray polymerizable compound (B) having a property as the acrylic-based polymer (A) as described above can be prepared, for example, by a method as below. That is, an acrylic-based polymer which is a copolymer configured to include: a constitutional unit based on (meth)acrylate that contains a functional group such as hydroxyl group, carboxyl group, amino group, substituted amino group and epoxy group; and a constitutional unit based on alkyl (meth)acrylate, and a compound of which one molecule has: a functional group that can react with the above functional group; and an energy ray polymerizable group (e.g., a group having an ethylenic double bond), may be reacted together thereby to add the energy ray polymerizable group to the above acrylic-based polymer.
Examples of the energy ray for hardening the energy ray polymerizable compound : (B) include ionizing radiation, i.e., X-ray, ultraviolet ray, electron ray or the like. Among them, ultraviolet ray may be preferred because the introduction of irradiation equipment is relatively easy.
When ultraviolet ray is used as the ionizing radiation, near-ultraviolet rays including rays of wavelengths of about 200 to 380 nm may be used in view of easy management. The amount of ultraviolet ray may be appropriately selected in accordance with the type of the energy ray polymerizable compound (B) and the thickness of the pressure sensitive adhesive layer 3, and may ordinarily be about 50 to 500 mJ/cm? preferably 100 to 450 mJ/cm’, and more preferably 200 to 400 mJ/cm®. The illuminance of ultraviolet ray may ordinarily be about 50 to 500 mW/cm®, preferably 100 to 450 mW/cm?, and more preferably 200 to 400 mW/cm’. The ultraviolet ray source is not particularly restricted, and examples thereof to be used include a high-pressure mercury lamp, a metal halide lamp, and a UV-LED.
When electron ray is used as the ionizing radiation, the accelerating voltage may be appropriately selected in accordance with the type of the energy ray polymerizable compound (B) and the thickness of the pressure sensitive adhesive layer 3, and may preferably be about 10 to 1,000 kV in general. The amount of irradiated ray may be set within a range in which the energy ray polymerizable compound (B) is appropriately hardened, which may ordinarily be a range of 10 to 1,000 krad. The electron ray source is not particularly restricted, and examples thereof to be used include various electron ray accelerators, such as of
Cockcroft-Walton type, Van de Graaff type, resonance transformer type, insulated core transformer type, linear type, dynamitron type, and high-frequency type.
. (3) Storage elastic modulus adjuster (C)
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may contain a storage elastic modulus adjuster (C). The storage elastic modulus adjuster (C) may have a weight-average molecular weight of 4,000 or less. The composition thereof is not particularly limited as long as it can reduce a storage elastic modulus at 23°C of the pressure sensitive adhesive layer 3. before the energy ray irradiation (also referred to as a "storage elastic modulus before irradiation").
The storage elastic modulus adjuster (C) may be configured of one type of compound or may also be configured of a plurality of compounds. In view of more stably reducing the storage elastic modulus before irradiation of the pressure sensitive adhesive layer 3, the weight-average molecular weight of the storage elastic modulus adjuster (C) may preferably be 2,500 or less, and most preferably 2,000 or less. The lower limit of the weight-average molecular weight of the storage elastic modulus adjuster (C) is not particularly limited, but if it is unduly low, a concern is that the composition stability of the above pressure sensitive adhesive composition will be deteriorated because the storage elastic modulus adjuster (C) may readily volatilize. Therefore, the weight-average molecular weight of the storage elastic modulus adjuster (C) may preferably be 300 or more, more preferably 500 or more, and most preferably 700 or more. The weight-average molecular weight can be measured using a GPC apparatus (HLC-8220, available from TOSOH CORPORATION) and a column (TSK-GEL GMHXL, available from TOSOH CORPORATION).
As previously described, the energy ray polymerizable compound (B) contained in the composition for forming the pressure sensitive adhesive layer 3 may have a property as the storage elastic modulus adjuster (C), or may otherwise contain the storage elastic modulus adjuster (C) separately. Examples of such a separately contained storage elastic modulus adjuster (C) include tackifier resin and long-chain alkyl acrylic oligomer.
The content of the storage elastic modulus adjuster (C) may preferably be 50 mass parts or more, more preferably 75 mass parts or more, and most preferably 100 mass parts or more, relative to 100 mass parts of the acrylic-based polymer (A) in view of stably exerting its function. To maintain the cohesive property of the pressure sensitive adhesive contained in the pressure sensitive adhesive layer 3 to an appropriate degree, the content of the storage elastic modulus adjuster (C) may preferably be 500 mass parts or less, more preferably 400 mass parts or less, and most preferably 350 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
When the storage elastic modulus adjuster (C) contains tackifier resin, the type of the tackifier resin is not particularly limited. It may be a rosin-based tackifier resin, such as polymerized rosin, esterified rosin and disproportionated rosin and hydrogenated resin thereof, or a terpene-based tackifier resin, such as a-pinene resin, or a petroleum-based resin, such as hydrocarbon resin. Aromatic tackifier resin may also be used, such as coumarone resin, alkylphenol resin and xylene resin.
Different types of these tackifier resins may be used in combination thereby to enhance the compatibility of the storage elastic modulus adjuster (C) to the acrylic-based polymer (A), so that preferable properties may be obtained. Examples of such cases include a case in which the composition for forming the pressure sensitive adhesive layer 3 contains, as the storage elastic modulus adjuster (C), a polymerized rosin ester (C1) and at least one of a hydrogenated rosin ester (C2) and a hydrocarbon resin (C3). When the above tackifier resins are contained, the content of the polymerized rosin ester (C1) in the composition for forming the pressure sensitive adhesive layer 3 may preferably be 20 mass parts or less, more preferably 5 mass parts or more and 18 mass parts or less, and most preferably 7 mass parts or more and 15 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
In view of enhancing the cohesive property of the pressure sensitive adhesive contained in the pressure sensitive adhesive layer 3, the sum of the content of the hydrogenated rosin ester (C2) and the content of the hydrocarbon resin (C3) in the composition for forming the pressure sensitive adhesive layer 3 may preferably be 50 mass parts or more, more preferably 70 mass parts or more and 200 mass parts or less, and most preferably 90 mass parts or more and 170 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
The long-chain alkyl acrylic oligomer is an oligomer obtained by oilgomerization of alkyl (meth)acrylate having a carbon number of about 4 or more and 18 or less, and the specific configuration of the alkyl group portion is not particularly limited. Specific examples of monomer for forming such oligomer include butyl acrylate. (4) Cross-linker (D)
As previously described, the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment may contain a cross-linker (D) that is reactive with the acrylic-based polymer (A). In this case, the pressure sensitive adhesive layer 3 according to the present embodiment may contain a cross-linked product obtained by the cross-linking reaction of the acrylic-based polymer (A) and the cross-linker (D).
The content of the cross-linker (D) is not particularly limited. In order that the above cross-linked product can readily be formed, the content of the cross-linker (D) may preferably be 0.02 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A). Examples of the type of the cross-linker (D) include: epoxy-based compound, isocyanate-based compound, metal chelate-based compound and polyimine compound such as aziridine-based compound; melamine resin; urea resin; dialdehydes; methylol polymer; metal alkoxide; and metal salt. Among them, polyisocyanate compound and/or polyepoxy compound are preferred as the cross-linker (D) because the cross-linking reaction can be easily controlled, etc.
The polyisocyanate compound is a compound having two or more isocyanate groups in one molecule. Examples thereof include: aromatic polyisocyanate, such as tolylene diisocyanate, diphenylmethane diisocyanate and xylylene diisocyanate; alicyclic isocyanate compound, such as dicyclohexylmethane-4,4'-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate and hydrogenated xylylene diisocyanate; and isocyanate having a chain-like skeleton, such as hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate and lysine isocyanate.
There may also be used biuret products and isocyanurate products of these compounds, and modified products such as adduct products that are reaction products of these compounds and non-aromatic low molecule active hydrogen-containing compounds such as ethylene glycol, trimethylol propane and castor oil. One type of the above polyisocyanate compound may be used, or plural types may also be used.
The polyepoxy compound is a compound having two or more epoxy groups in one molecule. Examples thereof include 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,3-bis(N,N-diglycidylaminomethyl)toluene, ~~ N,N,N',N',-tetraglycidyl-4,4-diaminodiphenylmethane,
N,N,N',N',-tetraglycidyl-m-xylenediamine, 1,6-diglycidyl-n-hexane, bisphenol A-type epoxy compound, and bisphenol F-type epoxy compound.
When the pressure sensitive adhesive layer 3 according to the present embodiment has a cross-linked product based on the acrylic-based polymer (A) and the cross-linker (D), the crosslink density related to the cross-linked product contained in the pressure sensitive adhesive layer 3 may be adjusted thereby to control properties of the pressure sensitive adhesive layer 3, such as the holding power before irradiation. This crosslink density can be adjusted such as by varying the content of the cross-linker (D) contained in the composition for forming the pressure sensitive adhesive layer 3. Specifically, when the cross-linker (D) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 is an isocyanate-based composition, the content thereof may be adjusted to 5 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A) thereby to make it easy to control the properties of the pressure sensitive adhesive layer 3, such as the holding power before irradiation, within appropriate ranges. In view of enhancing this controllability, the content of the cross-linker (D) comprising an isocyanate-based compound may more preferably be 10 mass parts or more, and most preferably 20 mass parts or more, relative to 100 mass parts of the acrylic-based polymer (A). The upper limit of the content of the cross-linker (D) comprising an isocyanate-based compound is not particularly limited, but if the content is unduly large, it may be difficult to control the storage elastic modulus : before irradiation within a range to described later, depending on the content of the storage elastic modulus adjuster (C). Therefore, the upper limit of the content of the cross-linker (D) comprising an isocyanate-based compound may preferably be 50 mass parts or less, and more preferably 40 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
When the cross-linker (D) contained in the pressure sensitive adhesive composition ~ for forming the pressure sensitive adhesive layer 3 is an epoxy-based composition, the content thereof may be adjusted to 0.02 mass parts or more relative to 100 mass parts of the acrylic-based polymer (A) thereby to make it easy to control the properties of the pressure sensitive adhesive layer 3, such as the holding power before irradiation, within appropriate ranges. In view of enhancing this controllability, the content of the cross-linker (D) comprising an epoxy-based compound may more preferably be 0.05 mass parts or more, and most preferably 0.1 mass parts or more, relative to 100 mass parts of the acrylic-based polymer (A). The upper limit of the content of the cross-linker (D) comprising an epoxy-based compound is not particularly limited, but if the content is unduly large, it may be difficult to control the storage elastic modulus before irradiation within a range to described later, depending on the content of the storage elastic modulus adjuster (C). Therefore, the upper limit of the content of the cross-linker (D) comprising an epoxy-based compound may preferably be 0.4 mass parts or less, and more preferably 0.3 mass parts or less, relative to 100 mass parts of the acrylic-based polymer (A).
When the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment contains the cross-linker (D), an appropriate cross-linking promoter may preferably be contained therein depending on the type of the cross-linker (D) and the like. For example, when the cross-linker (D) is a polyisocyanate compound, the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 may preferably contain an organometallic compound-based cross-linking promoter, such as an organotin compound. (5) Other components
The pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment may contain, in addition to the above components, photopolymerization initiator, coloring material such as colorant and pigment, flame retardant, and filler.
The photopolymerization initiator will now be described relatively in detail.
Examples of the photopolymerization initiator include photo initiators, such as benzoin compound, acetophenone compound, acyl phosphine oxide compound, titanocene compound, thioxanthone compound and peroxide compound, and photo sensitizers, such as amine and quinone. Specifically, there may be exemplified 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl,
B-chloroanthraquinone, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide, and the like.
When ultraviolet ray is used as the energy ray, the photopolymerization initiator may be compounded thereby to reduce the irradiation time and irradiation amount. (6) Physical properties and shape, etc. 1) Storage elastic modulus before irradiation
The pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment has a storage elastic modulus at 23°C before the energy ray irradiation (storage elastic modulus before irradiation) of 0.12 MPa or less. The storage elastic modulus before irradiation satisfies this range thereby to allow the pressure sensitive adhesive layer 3 to readily wet an adherend surface and spread thereon even if the adherend surface is a non-flat surface of a device-related non-flat surface member, so that the pressure sensitive adhesive layer 3 can be obtained to have an excellent pressure sensitive adhesion property. In view of more stably enhancing the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3, the storage elastic modulus before irradiation may preferably be 0.09 MPa or less, and more preferably 0.06 MPa or less.
The lower limit of the storage elastic modulus before irradiation is not particularly limited, but if it is unduly low, it may be difficult to control the holding power before irradiation within an appropriate range to be described later. In view of stably achieving to control the holding power before irradiation within the appropriate range, the storage elastic modulus before irradiation may preferably be 0.01 MPa or more, and more preferably 0.02
MPa or more. ’ The storage elastic modulus before irradiation can be controlled such as by varying the molecular weight and the content of the acrylic-based polymer (A), the degree of its crosslinking, and the type and the content of the storage elastic modulus adjuster.
The above storage elastic modulus before irradiation can be measured using a known viscoelasticity measuring apparatus (e.g., ARES, available from TA Instruments). At the time of measurement, as will be described in examples, it is preferred to use, as an object to be measured, a lamellar body comprising a material that constitutes the pressure sensitive adhesive layer 3 and having a thickness of about 1 mm, in view of reducing the variation in measurement results. ii) Holding power before irradiation
In the present description, the holding power before irradiation means a holding power of the pressure sensitive adhesive layer 3 before the energy ray irradiation, which is measured in accordance with JIS Z0237: 2009 (ISO 29862-29864 2007). The degree of holding power may be evaluated by a holding time, i.e., a time before a test piece is peeled off and drops from a test plate. The measuring method and calculating method are as defined in the above standard.
The pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment has a holding time of 15,000 seconds or more, which is measured when a test for measuring the holding power before irradiation is performed. The holding time being 15,000 seconds or more may not readily cause the cohesive fracture in the pressure sensitive adhesive layer 3 of the dicing sheet 1 even when the dicing sheet 1 is expanded in the expanding step. Accordingly, troubles may not readily occur, such as that a desired tension is not applied to the dicing sheet 1 in the expanding step so that the closely disposed plural mold chips are not appropriately separated from one another. : The longer the holding time is, the lower the possibility that the above troubles occur is. Therefore, the holding time may more preferably be 20,000 seconds or more.
Since the upper limit of the holding time is 70,000 in accordance with the above standard, the holding time of the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment may most preferably be 70,000 seconds. iii) Thickness
The thickness of the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is 25 um or less. There may be a tendency that, as the pressure sensitive adhesive layer 3 becomes thin, the amount of the pressure sensitive adhesive aggregates formed when dicing the device-related member decreases. Accordingly, troubles due to the pressure sensitive adhesive aggregates attaching to a device chip or the like are unlikely to occur. The lower limit of the thickness of the dicing sheet is not particularly limited, but if it is unduly thin, a concern is that problems occur such as that the variation in the pressure sensitive adhesion property of the pressure sensitive adhesive layer 3 may be large. Therefore, the thickness of the pressure sensitive adhesive layer 3 may preferably be 2 um or more, and more preferably 5 pm or more. iv) Release sheet
For the purpose of protecting the pressure sensitive adhesive layer 3 before the pressure sensitive adhesive layer 3 is applied to a device-related member as the adherend, the dicing sheet 1 according to the present embodiment may be configured such that a release surface of a release sheet is provisionally applied to a surface of the pressure sensitive adhesive layer 3 opposite to the surface facing the base film adhering surface. The release sheet may be arbitrarily configured, and examples thereof include a plastic film that has been subjected to release treatment using a release agent. Specific examples of the plastic film include a film of polyester, such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and a film of polyolefin, such as polypropylene and polyethylene.
Examples of the release agent to be used include silicone-based, fluorine-based and long-chain alkyl-based ones, among which the silicone-based release agent is preferred because a stable property can be obtained at low cost. The thickness of the release sheet may ordinarily be about 20 um or more and 250 pm or less, but is not limited thereto. 3. Method for manufacturing dicing sheet
The method for manufacturing the dicing sheet 1 is not particularly limited in detail as long as the pressure sensitive adhesive layer 3 formed of the previously described pressure sensitive adhesive composition can be laminated on one surface of the base film 2. As one example, the pressure sensitive adhesive layer 3 can be formed through: preparing a composition for coating that contains the previously described pressure sensitive adhesive composition and if necessary further contains some solvent; applying the composition for coating to one surface of the base film 2 using a coater, such as die coater, curtain coater, spray coater, slit coater and knife coater, to form a coating film; and drying the coating film on the one surface. Properties of the composition for coating are not particularly limited as long as the coating can be performed, and the component for forming the pressure sensitive adhesive layer 3 may be contained therein as a solute or as a dispersed material.
When the composition for coating contains the cross-linker (D), conditions for the above drying (such as temperature and time) may be changed, or a heating process may be separately provided, thereby to progress the cross-linking reaction of the acrylic-based polymer (A) and the cross-linker (D) in the coating film, so that a cross-linked structure is formed with a desired existing density in the pressure sensitive adhesive layer 3. To sufficiently progress this cross-linking reaction, after the pressure sensitive adhesive layer 3 is laminated on the base film 2 using the above method or the like, curing may be performed, such as that the obtained dicing sheet 1 is stationarily placed in an environment of 23°C and a relative humidity of 50% for several days, for example.
Another example of a method for manufacturing the dicing sheet 1 may include: applying the composition for coating to the previously described release surface of the release sheet to form a coating film; drying it to form a laminated body comprising the pressure sensitive adhesive layer 3 and the release sheet; and applying a surface of the pressure sensitive adhesive layer 3 of this laminated body opposite to the surface facing the release sheet to the base film adhering surface of the base film 2, so that a laminated body of the dicing sheet 1 and the release sheet is obtained. The release sheet of this laminated body may be released as a process material, or may keep protecting the pressure sensitive adhesive layer 3 before the dicing sheet is applied to a semiconductor package. 4. Method for manufacturing device chips
As a specific example of a case in which the dicing sheet 1 according to the present embodiment is used to manufacture mold chips from a semiconductor package, a method for manufacturing device chips from a device-related member will hereinafter be described.
As described above, a semiconductor package is an electronic component collected body configured such that semiconductor chips are placed on respective bases of a collected body of bases and these semiconductor chips are collectively sealed with resin. In general, . such a semiconductor package has a board surface and a resin sealing surface, and the thickness thereof may be about 200 to 2,000 um. The resin sealing surface has an arithmetic mean roughness Ra of about 0.5 to 10 um, which may be coarse compared with that of a silicon mirror wafer (Ra: 0.005 um). In addition, to allow for easy release from a mold of a sealing apparatus, the sealing material may contain a release component. Therefore, when the dicing sheet is applied to the resin sealing surface of the semiconductor package, there is a tendency that a sufficient fixing property cannot be exerted.
When the dicing sheet 1 according to the present embodiment is used, the surface at the side of the pressure sensitive adhesive layer 3 (i.e., the surface of the pressure sensitive adhesive layer 3 opposite to the base film 2) is applied to the resin sealing surface of the semiconductor package. If a release sheet is applied to the surface of the dicing sheet 1 at the side of the pressure sensitive adhesive layer 3, the release sheet is to be released to expose the surface at the side of the pressure sensitive adhesive layer 3, so that the surface may be applied to the resin sealing surface of the semiconductor package. In general, peripheral portion of the dicing sheet 1 is applied, via the pressure sensitive adhesive layer 3 provided at that portion, to a circular jig referred to as a ring frame for transportation and/or fixation to an apparatus. Since the storage elastic modulus before irradiation of the pressure sensitive adhesive layer 3 is controlled within an appropriate range, the pressure sensitive adhesive can readily wet the adherend surface, which is the resin sealing surface of the semiconductor package, and spread thereon, so that an excellent adhesion property can be obtained.
Therefore, when the dicing sheet 1 according to the present embodiment is used, the chip fly is unlikely to occur during the dicing step. While the size of mold chips formed in the dicing step is ordinarily 5 mmx5 mm or less, and may even be about 1 mmx1 mm in recent years, the pressure sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment has an excellent pressure sensitive adhesion property, and can respond to the dicing at such a fine pitch.
By carrying out the dicing step as described above, a plurality of mold chips can be obtained from the semiconductor package. After completion of the dicing step, for easy pickup of the plurality of mold chips closely disposed on the dicing sheet 1, the expanding step is performed to elongate the dicing sheet 1 in a direction or directions in the main surface.
The degree of this elongation may appropriately be set in consideration of the space which the closely disposed mold chips should have and the tensile strength of the base film 2, etc. The pressure sensitive adhesive layer 3 according to the present embodiment has a high holding power before irradiation. Accordingly, troubles may not readily occur such as that the closely disposed plurality of mold chips are not appropriately separated from each other because cohesive fracture or the like of the pressure sensitive adhesive layer 3 occurs in the elongation in the expanding step so that a desired tension cannot be given to the dicing sheet
After the closely disposed mold chips have been appropriately separated from each other by carrying out the expanding step, pickup of the mold chips on the pressure sensitive adhesive layer 3 is performed by a general-purpose means such as a suction collet. The picked-up mold chips are provided to the subsequent step such as a transportation step.
After completion of the dicing step and before initiating the picking-up step, energy ray irradiation may be performed from the side of the base film 2 of the dicing sheet 1 according to the present embodiment thereby to progress the polymerization reaction of the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive layer 3 of the dicing sheet, so that the workability in the picking-up step can be enhanced. The timing when this energy ray irradiation is carried out is not particularly limited as long as it is after completion of the dicing step and before initiating the picking-up step.
As heretofore described, the method for manufacturing device chips according to the present embodiment is unlikely to cause the chip fly. Therefore, the yield rate may not readily deteriorate in the dicing step in which the device-related member is divided into a plurality of device chips. Hence, the device chips obtained through the manufacturing method according to the present embodiment using the dicing sheet 1 according to the present embodiment can be advantageous in cost. The chip fly not only causes device chips to fly away but also may lead to a problem such as that the device chips flying away come into collision with other device chips not flying away to break the other device chips manufactured in the same lot. Therefore, the device chips manufactured through the method } for manufacturing device chips according to the present embodiment are excellent in their quality because the possibility of having such a problem is reduced.
The embodiments heretofore explained are described to facilitate understanding of the present invention and are not described to limit the present invention. Therefore, it is intended that the elements disclosed in the above embodiments include all design changes and equivalents to fall within the technical scope of the present invention.
The present invention will hereinafter be described further specifically with reference to examples, etc, but the scope of the present invention is not limited to these examples, etc.
oe 26 .
Example 1 (1) Preparation of composition for coating
A composition for coating in a state of solution (solvent: toluene) was prepared having a composition as follows: 1) as the acrylic-based polymer (A), 100 mass parts as a solid content of copolymer (weight-average molecular weight: 800,000, glass-transition temperature Tg: —45°C) obtained by copolymerization of 90 mass parts of butyl acrylate and 10 mass parts of acrylic acid, ii) as the energy ray polymerizable compound (B), 100 mass parts as a solid content of a UV-curable component (UV-5806, available from The Nippon Synthetic Chemical
Industry Co., Ltd., containing photopolymerization initiator) containing decafunctional urethane acrylate; and iii) as the cross-linker (D), 5 mass parts as a solid content of a cross-linker component (Coronate L, available from NIPPON POLYURETHANE INDUSTRY CO.,
LTD.) containing trimethylol propane tolylene diisocyanate (TDI-TMP).
Among the components contained in the obtained composition for coating, the component having a property as the storage elastic modulus adjuster (C) is the UV-curable component. The content thereof was 100 mass parts relative to 100 mass parts of the acrylic-based polymer (A). (2) Production of dicing sheet
A release sheet (SP-PET381031, available from LINTEC Corporation) was prepared having a silicone-based release agent layer formed on one main surface of a polyethylene terephthalate base film of a thickness of 38 um. The previously described composition for coating was applied to the release surface of the release sheet using a knife coater so that the thickness of the pressure sensitive adhesive layer to be finally obtained would be 10 pm.
The coating film thus obtained with the release sheet was caused to pass through an environment of 100°C for 1 minute thereby to dry the coating film, and a laminated body comprising the release sheet and the pressure sensitive adhesive layer (thickness: 10 um) was obtained. The thickness of the pressure sensitive adhesive layer was measured using a fixed pressure thickness measuring instrument (PG-02, available from TECLOCK corporation).
The base film adhering surface was provided as one surface of a base film comprising an ethylene-methacrylic acid copolymer (EMAA) film (tensile stress at strain of 25%: 10.8 N/10 mm, maximum tensile stress: 25.5 MPa, fracture elongation: 525%) having a thickness of 140 um, and the surface at the side of the pressure sensitive adhesive layer of the above laminated body was applied to the base film adhering surface. A dicing sheet comprising the base film and the pressure sensitive adhesive layer as illustrated in FIG. 1 was thus obtained in a state of being further laminated thereon with the release sheet.
Example 2
A composition for coating in a state of solution (solvent: toluene) was prepared having a composition as follows: i) as the acrylic-based polymer (A), 100 mass parts as a solid content of copolymer (weight-average molecular weight: 800,000, glass-transition temperature Tg: —53°C) obtained . by copolymerization of 97.5 mass parts of butyl acrylate, 2 mass parts of acrylic acid and 0.5 mass parts of 2-hydroxyethyl acrylate; i1) as the energy ray polymerizable compound (B), 200 mass parts as a solid content of a UV-curable component (EXL-810TL, available from Dainichiseika Color & Chemicals
Mfg. Co., Ltd., containing photopolymerization initiator) containing trifunctional or tetrafunctional urethane acrylate (weight-average molecular weight: 5,000); 11) as the tackifier resin, 100 mass parts as a solid content of a tackifier resin component comprising a mixture of 4 mass parts of polymerized rosin ester (Cl) (weight-average molecular weight: 900), 25 mass parts of hydrogenated rosin ester (C2) (weight-average molecular weight: 900) and 24 mass parts of hydrocarbon resin (C3) (weight-average molecular weight: 1,200); and iv) as the cross-linker (D), 5 mass parts as a solid content of a cross-linker component (Coronate L, available from NIPPON POLYURETHANE INDUSTRY CO.,
LTD.) containing TDI-TMP. } Among the components contained in the obtained composition for coating, the component having a property as the storage elastic modulus adjuster (C) is the tackifier resin component. The content thereof was 100 mass parts relative to 100 mass parts of the acrylic-based polymer (A).
Thereafter, the same procedure as that in Example 1 was performed, and a dicing sheet was thus obtained.
Example 3
A similar procedure to that in Example 2 was performed except that the content of the UV-curable component contained in the composition for coating was 300 mass parts and the content of the cross-linker component was 7.5 mass parts, and a dicing sheet was thus obtained. The content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating according to
Example 3 was 100 mass parts relative to 100 mass parts of the acrylic-based polymer (A).
Example 4
A similar procedure to that in Example 1 was performed except that the content of the UV-curable component contained in the composition for coating was 120 mass parts thereby the content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating was changed to 120 mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Example 5
A similar procedure to that in Example 1 was performed except that the content of the UV-curable component contained in the composition for coating was 75 mass parts thereby the content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating was changed to 75 mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Example 6
A similar procedure to that in Example 1 was performed except that the thickness of the pressure sensitive adhesive layer was changed from 10 pm to 20 pum, and a dicing sheet was thus obtained.
Example 7
A similar procedure to that in Example 1 was performed except that the thickness of the pressure sensitive adhesive layer was changed from 10 um to 25 pm, and a dicing sheet was thus obtained.
Example 8
A similar procedure to that in Example 1 was performed except that the content of
~ 2
SPECIFICATION 3 caoo3 on
DICING SHEET AND METHOD FOR MANUFACTURING DEVICE CHIPS 2 re 8
TECHNICAL FIELD: ro YG rood "
The present invention relates to a dicing sheet used when dicing a device-related member such as a semiconductor package which is configured such that a plurality of semiconductor chips are sealed with resin, and also to a method for manufacturing device chips using the dicing sheet.
A semiconductor component in which a semiconductor chip is sealed with resin (referred to as a "mold chip" in the present description) may ordinarily be manufactured as follows. First, semiconductor chips are placed on respective bases of a collected body, such as TAB tape, configured such that a plurality of the bases are connected in series or in a matrix state, and these semiconductor chips are collectively sealed with resin to obtain an electronic component collected body (referred to as a "semiconductor package" in the present description). Next, a pressure sensitive adhesive sheet comprising a base film and a pressure sensitive adhesive layer (referred to as a "dicing sheet" in the present description) is applied to a surface of the semiconductor package at the side of the sealing resin thereby to fix the semiconductor package to the dicing sheet. This semiconductor package fixed to the dicing sheet is then cut and separated (diced) into pieces, and a member is produced in which a plurality of mold chips are closely disposed on the dicing sheet (dicing step).
Subsequently, the dicing sheet in that member is expanded (elongated in a direction or directions in the main surface) to increase the space between the mold chips disposed on the dicing sheet (expanding step). The mold chips thus separated from one another on the dicing sheet are individually picked up to depart from the dicing sheet (picking-up step) and transported to the next step.
The workability in the picking-up step may be improved if a step is performed to reduce the pressure sensitive adhesion property of the above pressure sensitive adhesive layer - after the dicing step has been completed and before the picking-up step is performed. For the step of reducing the pressure sensitive adhesion property, the pressure sensitive adhesive
0 29 the UV-curable component contained in the composition for coating was 110 mass parts thereby the content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating was changed to 110 mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Example 9
A similar procedure to that in Example 1 was performed except that the type of a film constituting the base film was changed from the EMAA film as a type of an ethylene-based copolymer film in Example 1 to a polypropylene film (thickness: 140 pm, tensile stress at strain of 25%: 17 N/10 mm, maximum tensile stress: 30 MPa, fracture elongation: 600%) as a type of a polyolefin-based film, and a dicing sheet was thus obtained.
Example 10
A similar procedure to that in Example 1 was performed except that the cross-linker component contained in the composition for coating was changed to a cross-linker component (TETRAD-C, available from MITSUBISHI GAS CHEMICAL COMPANY, INC., solid content concentration: 100 mass%) as the cross-linker (D) containing 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane and that the content thereof was 0.07 mass parts as a solid content relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Comparative Example 1
A similar procedure to that in Example 1 was performed except that the type of the
UV-curable component contained in the composition for coating was changed to the
UV-curable component contained in the composition for coating according to Example 2 (content: 100 mass parts relative to 100 mass parts of the acrylic-based polymer (A)) so that the composition for coating would not contain a component having a property as the storage elastic modulus adjuster (C), and that the thickness of the pressure sensitive adhesive layer was changed from 10 pm to 30 pm, and a dicing sheet was thus obtained.
Comparative Example 2
A similar procedure to that in Comparative Example 1 was performed except that
> 30 a the thickness of the pressure sensitive adhesive layer was changed from 30 pm to 10 um, and a dicing sheet was thus obtained.
Comparative Example 3
A similar procedure to that in Example 1 was performed except that the content of the UV-curable component contained in the composition for coating was 150 mass parts thereby the content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating was changed to 150 mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Comparative Example 4
A similar procedure to that in Example 1 was performed except that the UV-curable component contained in the composition for coating was changed to a component containing pentaerythritol tetraacrylate (weight-average molecular weight: 704) (EBECRYLA40, available from DAICEL-ALLNEX LTD), and a dicing sheet was thus obtained.
Comparative Example 5
A similar procedure to that in Example 2 was performed except that the content of the cross-linker component was 2.5 mass parts, and a dicing sheet was thus obtained.
Comparative Example
A similar procedure to that in Example 1 was performed except that the thickness of the pressure sensitive adhesive layer was changed from 10 pm to 30 pm, and a dicing sheet was thus obtained.
Comparative Example 7
A similar procedure to that in Comparative Example 2 was performed except that the content of the UV-curable component contained in the composition for coating was 200 : mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Co 31 .
Comparative Example 8 ; A similar procedure to that in Example 1 was performed except that the content of the UV-curable component contained in the composition for coating was 140 mass parts thereby the content of a component having a property as the storage elastic modulus adjuster (C) among the components contained in the composition for coating was changed to 140 mass parts relative to 100 mass parts of the acrylic-based polymer (A), and a dicing sheet was thus obtained.
Table 1 collectively shows compositions, etc. of the compositions for coating prepared to manufacture the dicing sheets according to the above examples and comparative examples. The meaning of each abbreviated name of the type of component in Table 1 is as follows: -Acrylic-based polymer (A) "Polymer 1": Component used in Example 1, etc. "Polymer 2"; Component used in Example 2, etc. : -UV-curable component "UV1": Component used in Example 1, etc. "UV2": Component used in Example 2, etc. "UV3": Component used in Comparative Example 4 -Cross-linker component "L1": Component used in Example 1, etc. "L2": Component used in Example 10
The numerical number in a column for the content of each component in Table 1 means mass parts relative to 100 mass parts of the acrylic-based polymer (A). In addition, the thickness of the pressure sensitive adhesive layer of the dicing sheet according to each of the examples and the comparative examples is shown in Table 2.
Table 1 eT ee [Cinta frets of ove Teo Fo fe pe fo]
Fr er re ee
Lo 32
Exemplary Test 1 : Measurement of storage elastic modulus
Release sheets (SP-PET382120, available from LINTEC Corporation) were prepared each having a silicone-based release agent layer of a thickness of 0.1 um formed on one main surface of a polyethylene terephthalate base film of a thickness of 38 pm.
Respective compositions for coating prepared in the examples and the comparative examples were applied to the release surfaces of the above release sheets using a knife coater so that the thicknesses of the pressure sensitive adhesive layers to be finally obtained would be 40 pm.
The coating films thus obtained with the release sheets were caused to pass through an environment of 100°C for 1 minute thereby to dry the coating films, and a plurality of laminated bodies were prepared each comprising the pressure sensitive adhesive layer (thickness: 40 um) formed of each composition for coating and the release sheet. Using these laminated bodies, the pressure sensitive adhesive layers formed of each composition for coating were applied to one another so as to have a thickness of 800 um, and the obtained laminated body of the pressure sensitive adhesive layers was punched into a circular form . having a diameter of 10 mm. A sample was thus obtained for measuring the viscoelasticity of the pressure sensitive adhesive layers formed of each composition for coating. A viscoelasticity measuring apparatus (ARES, available from TA Instruments) was used to apply a strain to the above sample at a frequency of 1 Hz to measure the storage elastic moduli within a range of —50°C to 150°C, and the storage elastic modulus before irradiation was obtained as a value of the storage elastic modulus at 23°C. Measurement results are listed in Table 2.
Exemplary Test 2
Measurement of holding power
Test for measuring the holding power before irradiation was performed in accordance with JIS Z0237: 2009 for each of the dicing sheets produced in the examples and the comparative examples. Measurement results of the holding time and presence or . absence of positional displacement after the test for measurement are listed in Table 2 (when dropping occurs in the testing time, it is indicated).
Exemplary Test 3
Evaluation of occurrence status of pressure sensitive adhesive aggregates
A glass epoxy plate (obtained by impregnating glass fibers with epoxy resin and curing the epoxy resin) was used as substitute for a semiconductor substrate. Transfer molding was performed using a resin for semiconductor package (KE-G1250, available from
KYOCERA Chemical Corporation) under the condition below to form a sealing resin having ‘6 a size of 50 mmx50 mm and a thickness of 600 pm on the glass epoxy plate, and a member simulating a semiconductor package as the device-related member (referred hereinafter to as a "test member") was thus obtained.
Condition for transfer molding
Sealing apparatus: MPC-06M Trial Press, available from APIC YAMADA
CORPORATION
Temperature of injecting resin: 180°C
Pressure of resin injection: 6.9 MPa
Time of resin injection: 120 seconds
The arithmetic mean roughness Ra of the surface of the obtained test member at the side of the sealing resin was 2 um.
Each of the dicing sheets produced in the examples and the comparative examples was applied to the surface of the test member at the side of the sealing resin using a tape . mounter (Adwill RAD-2500m/12, available from LINTEC Corporation), and a ring frame for dicing (2-6-1, available from DISCO Corporation) was attached to the peripheral portion of the surface at the side of the test member in the obtained laminated body of the test member and the dicing sheet (a portion at which the surface of the dicing sheet at the side of the pressure sensitive adhesive layer is exposed). Subsequently, the test member was diced under the condition below into chip-like members (the number of the members: 100) each simulating a device chip of 5 mm square.
Dicing condition -Dicing apparatus: DFD-651, available from DISCO Corporation -Blade: ZBT-5074 (Z1110LS3), available from DISCO Corporation -Thickness of blade: 0.17 mm -Protruding amount of blade edge: 3.3 mm -Rotation speed of blade: 30,000 rpm . -Cutting rate: 50 mm/min -Depth of cutting into base film: 50 pm -Cutting water amount: 1.0 L/min -Cutting water temperature: 20°C oo 34
An optical microscope was used to observe the side surface of each of four members arbitrarily selected from the obtained chip-like members, and the number of pressure sensitive adhesive aggregates attached to the side surface and having a size of 30 pm or more was counted. The occurrence status of the pressure sensitive adhesive aggregates was evaluated on the basis of the obtained number in accordance with the criteria of 5-levels as below:
Level 5: 20 or less . Level 4: 21 to 40
Level 3: 41 to 60
Level 2: 61 to 80
Level 1: 81 or more
Evaluation results are listed in Table 2.
Exemplary Test 4
Measurement of the number of chip fly in the dicing step
The same procedure as that in Exemplary Test 3 was performed to produce a test member comprising the sealing resin of a size of 50 mmx50 mm and a thickness of 600 um.
The arithmetic mean roughness Ra of the surface of the obtained test member at the side of the sealing resin was 2 pm. } Each of the dicing sheets produced in the examples and the comparative examples was applied to the surface of the test member at the side of the sealing resin using a tape mounter (Adwill RAD-2500m/12, available from LINTEC Corporation), and a ring frame for dicing (2-6-1, available from DISCO Corporation) was attached to the peripheral portion of the surface at the side of the test member in the obtained laminated body of the test member and the dicing sheet (a portion at which the surface of the dicing sheet at the side of the pressure sensitive adhesive layer is exposed). Subsequently, the test member was diced into chip-like members (the number of the members: 2,500) each simulating a device chip of 1 mm square under the same condition as that in Exemplary Test 3 except that the dicing pitch was changed from 5 mm to 1 mm and that the cutting rate was 100 mm/min and the rotation speed of blade was 50,000 rpm.
After the dicing, the number of semiconductor components flying away from the dicing sheet was visually counted. Measurement results are listed in Table 2.
Exemplary Test 5
Test of suitability for expanding
0 35
For the dicing sheet attached thereto with a plurality of device chips, obtained by performing the dicing under the condition of Exemplary Test 4, ultraviolet ray irradiation . . . 2 1 (illuminance: 230 mW/cm?, light amount: 190 mJ/ecm®) was performed from the side of the base film, and thereafter expanding of the dicing sheet was performed by pulling down the peripheral portion of the dicing sheet with the ring frame by 10 mm at a speed of 5 mm/s using an expanding apparatus (SE-100, a JCM product).
After being maintained in the expanded state for 1 hour, the dicing sheet was visually checked whether displacement occurred or not at the portion of the dicing sheet (peripheral portion) applied to the ring frame, and evaluation was performed in accordance with the criteria below:
Good: Displacement was not confirmed.
NG: Displacement was recognized.
Evaluation results are listed in Table 2.
Table 2 : Evaluation
Thickness Storage Holding power of Number of pressure elastic occurrence chip fly sensitive modulus Of prosoure [Number/250 adhesive ME . Displace Ca lve 03 layer [um] [MEa) flotding ment. of amomesive, . [s1 applied position
Example 2 J 30] 0.031 § 70,000) None [I ~~ 5 FO |] [Example 3] 10 1002 fo 000] Wome [50
Example 5 1 10 J] 0.039 F 70,000) Nome J 5 { 0
Example 6 | 20 [| 0.034 70,000) None [| 4 ~~ 1 0 [Trample TI oes 0.053 [70,000] mone 5 0
Example OJ 10 J 0.034 70,000) None I 5 1 0 [Example TO] 10 | 0.028 fo. 000] Nene | 5 [0
Co g tive - -
Co Toor oon wee [0
Comparati - 5 (oiagte tr] ro Joos luzoo] pees |] oo
Com ti cy
Co [ew [ew
C ati
Cl [eo ow [ee
Tw [ee fee] ee | 0
Example 6
Comparative ee oe [ee ew
Comparative = eT [ee [eee] ee
As understood from Table 2, it can be said that the dicing sheets according to the . examples satisfying the condition in the present invention are unlikely to cause troubles in both of the dicing step and the expanding step. Furthermore, it can also be said that the oo 36 device chips are unlikely to cause troubles due to pressure sensitive adhesive aggregates.
The dicing sheet according to the present invention can be suitably used as a dicing sheet for a device-related member, in particular for a device-related non-flat surface member having a non-flat surface as the adherend surface.
Description of Reference Numerals 1... Dicing sheet 2... Base film 3... Pressure sensitive adhesive layer layer of the dicing sheet is designed in general such that the pressure sensitive adhesion property is reduced by a specific stimulation. For example, irradiation of energy ray such as ultraviolet ray and electron ray may be employed as the specific stimulation.
In the dicing step and the subsequent expanding step among the series of steps, the semiconductor package and the mold chips obtained by dicing the semiconductor package are required to maintain a state of attaching to the dicing sheet. To this end, it is preferred that the pressure sensitive adhesive layer of the dicing sheet has a high pressure sensitive adhesion property to the semiconductor package and the mold chips before energy ray irradiation (unless otherwise stated in the present description, the "pressure sensitive adhesion property” means a pressure sensitive adhesion property of the pressure sensitive adhesive layer of the dicing sheet before energy ray irradiation). Here, when an adherend for the dicing sheet is a semiconductor package, the surface roughness of the adherend surface is larger than that in a case where a semiconductor substrate such as a semiconductor wafer is to be an adherend.
Therefore, if a dicing sheet for a semiconductor substrate or the like as the adherend is diverted to a dicing sheet for a semiconductor package as the adherend, the pressure sensitive adhesion property to the adherend will be insufficient, and a trouble may occur such that some of mold chips individually cut from the semiconductor package are released and fly from the dicing sheet (chip fly).
Such a problem of chip fly may occur not only in a semiconductor package but in the dicing step for other device-related members. A "device-related member" as used in the present description means an intermediate product which is manufactured in a process for manufacturing a device and undergoes the dicing step. Examples of the device-related member which is likely to cause the above chip fly include a member having a large surface roughness of the adherend surface, such as a member having a substrate comprising a porous ceramic-based material, and a member provided with irregularities on the adherend surface, such as a member configured such that one or more members having a certain thickness, such as spacers, are attached to a semiconductor substrate.
For the purpose of reducing the possibility of occurrence of the above chip fly, as described in Patent Literature 1, for example, a tackifier resin may be contained in the pressure sensitive adhesive layer of a pressure sensitive adhesive sheet for fixing a semiconductor substrate.
Problems to be solved by the Invention
However, even in the pressure sensitive adhesive sheet having such a feature for fixing a semiconductor substrate, in order to reduce the possibility of occurrence of the chip fly when the dicing step is performed for a device-related member having, as the adherend surface, a rough surface or an irregular surface as described above (referred collectively to as a "non-flat surface" in the present description) (such a device-related member will be referred to as a "device-related non-flat surface member" in the present description), the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet may have to have a thickness of about 25 pm or more in general thereby to readily wet the adherend surface of the device-related non-flat surface member and spread thereon so that the pressure sensitive adhesion property to the adherend surface is enhanced.
Here, when the device-related member is diced, a blade used in the dicing cuts not only the device-related member but the pressure sensitive adhesive layer applied to the device-related member. However, if the pressure sensitive adhesive layer has a large thickness as described above, the amount of the pressure sensitive adhesive layer removed by the blade increases, so that aggregates formed of components, such as the pressure sensitive adhesive, which have constituted the removed pressure sensitive adhesive layer, (referred to as a "pressure sensitive adhesive aggregates" in the present description) tend to be attached to the end portion of an individual member obtained by the dicing step cutting the device-related member into pieces (such an individual member may also be referred to as a "device chip" in the present description). If such pressure sensitive adhesive aggregates remain on the device chip, then, in the subsequent step, a trouble may readily occur such as that the device chip is attached to other member via the pressure sensitive adhesive aggregates.
In particular, when dicing a device-related non-flat surface member such as a semiconductor package, a blade may be used which has a larger thickness than that of a blade used when dicing a semiconductor substrate such as a silicon wafer, so that the pressure sensitive adhesive aggregates as described above may readily be formed. Therefore, the possibility of a trouble will be high due to the pressure sensitive adhesive aggregates attaching to the device chip.
An object of the present invention is to provide a dicing sheet which comprises a pressure sensitive adhesive layer having an excellent pressure sensitive adhesion property even when the adherend surface is a surface of a device-related member, in particular a non-flat surface of a device-related non-flat surface member, and which is unlikely to cause a trouble due to pressure sensitive adhesive aggregates. Another object of the present invention is to provide a method for manufacturing device chips using the dicing sheet.
Means for solving the Problems
To achieve the above objects, the present inventors had studies and have obtained a knowledge that: a pressure sensitive adhesive layer of a dicing sheet can be configured to have a thickness of 25 pm or less and further to have, in a state before energy ray irradiation, a storage elastic modulus at 23°C of 0.12 MPa or less and a holding time of 15,000 seconds or more measured by a test for a holding power performed in accordance with JIS Z0237: 2009, thereby to have an excellent pressure sensitive adhesion property without cohesive fracture; and the pressure sensitive adhesive aggregates can be reduced in their generation amount in the dicing step.
The present invention accomplished on the basis of such a knowledge is, first, a dicing sheet comprising a base film and a pressure sensitive adhesive layer laminated on at least one surface of the base film, and the dicing sheet is characterized in that: the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and an energy ray polymerizable compound (B); the pressure sensitive adhesive layer has a thickness of 25 pum or less; and the pressure sensitive adhesive layer has a storage elastic modulus at 23°C of 0.12 MPa or less before energy ray irradiation and a holding time of 15,000 seconds or more, wherein the holding time is measured when a test for measuring a holding power of the pressure sensitive adhesive layer before energy ray irradiation is performed in accordance with JIS Z0237: 2009 (Invention 1).
Since the thickness of the pressure sensitive adhesive layer is 25 um or less, pressure sensitive adhesive aggregates are unlikely to be formed in the dicing step.
Moreover, even when the adherend surface is a non-flat surface of a device-related non-flat surface member, the storage elastic modulus of the pressure sensitive adhesive layer at 23°C before energy ray irradiation is 0.12 MPa or less, and the dicing sheet can thus have an excellent pressure sensitive adhesion property to the adherend surface. In addition, the above holding time is 15,000 seconds or more, so that cohesive fracture will not occur in the pressure sensitive adhesive layer. Due to having the pressure sensitive adhesive layer with such excellent properties, the above dicing sheet according to the present invention is unlikely to cause any trouble in the dicing step and/or expanding step.
> 6
In the above invention (Invention 1), it is preferred that the pressure sensitive adhesive composition contains 50 mass parts or more of a storage elastic modulus adjuster (C) having a weight-average molecular weight of 4,000 or less relative to 100 mass parts of the acrylic-based polymer (A) (Invention 2). Such a pressure sensitive adhesive composition allows to more stably reduce the storage elastic modulus of the pressure sensitive adhesive layer at 23°C before energy ray irradiation.
In the above invention (Invention 1, 2), it is preferred that at least a part of the energy ray polymerizable compound (B) has a property as a storage elastic modulus adjuster (C) (Invention 3). This allows to reduce the number of components of the pressure sensitive adhesive composition, thus being preferable in production management.
In the above invention (Invention 1 to 3), it is preferred that the pressure sensitive adhesive composition contains 0.02 mass parts or more of a cross-linker (D) that is reactive in cross-linking with the acrylic-based polymer (A) relative to 100 mass parts of the acrylic-based polymer (A) (Invention 4). This allows the above holding time to be easily set to 15,000 seconds or more.
In the above invention (Invention 1 to 4), it is preferred that the base film comprises at least one of an ethylene-based copolymer film and a polyolefin-based film (Invention 5).
The base film comprising an ethylene-based copolymer film can readily satisfy the mechanical characteristics that are needed as those of the base film of the dicing sheet according to the present invention. The ethylene-based copolymer film and the polyolefin-based film are materials that are relatively difficult to relax stresses, but can form a dicing sheet in which troubles are unlikely occur in the expanding step owing to the combination with the pressure sensitive adhesive layer according to the present invention, and the users can receive the benefit of properties, such as stable availability and excellent chemical stability, which are possessed by the polyolefin-based film.
In the above invention (Invention 1 to 5), it is preferred that a surface of the pressure sensitive adhesive layer opposite to the base film is to be applied to a surface of a device-related member (Invention 6). Even if the adherend for the pressure sensitive adhesive layer according to the above invention is a surface of a device-related member, an excellent pressure sensitive adhesion property can be exhibited.
Second, the present invention provides a method for manufacturing device chips, comprising: applying a surface at the side of the pressure sensitive adhesive layer of the dicing sheet as described in any one of the above inventions (Inventions 1 to 6) to a surface of a device-related member; and cutting the device-related member on the dicing sheet into pieces to obtain a plurality of device chips (Invention 7).
The above dicing sheet has an excellent pressure sensitive adhesion property even if the adherend is a surface of a device-related member. Therefore, using this dicing sheet can prevent troubles from occurring in manufacturing steps for device chips, in particular the dicing step and/or expanding step.
Since the dicing sheet according to the present invention is configured such that the thickness of the pressure sensitive adhesive layer is 25 pm or less, pressure sensitive adhesive aggregates are unlikely to be formed in the dicing step, and troubles due to the pressure sensitive adhesive aggregates do not readily occur. Moreover, even when the adherend surface is a non-flat surface of a device-related non-flat surface member, the pressure sensitive adhesive layer has an excellent pressure sensitive adhesion property to the adherend surface. Therefore, the chip fly does not readily occur during the dicing step even though the thickness of the pressure sensitive adhesive layer is 25 um or less, as described above.
Furthermore, cohesive fracture is unlikely to occur in the pressure sensitive adhesive layer, and troubles thus may not readily occur such as that the device chips attached to the sheet are not appropriately separated from each other because a desired tension is not given to the dicing sheet in the expanding step.
Therefore, by using the dicing sheet according to the present invention, it is possible to manufacture device chips with high productivity so that troubles based on the attached pressure sensitive adhesive aggregates are unlikely to occur.
FIG. 1 is a schematic cross-sectional view of a dicing sheet according to an embodiment of the present invention.
Mode(s) for Carrying out the Invention
Embodiments of the present invention will be described hereinafter.
As shown in FIG. 1, a dicing sheet 1 according to an embodiment of the present invention comprises a base film 2 and a pressure sensitive adhesive layer 3 laminated on at least one surface of the base film 2. 1. Base film
Constitutional materials for the base film 2 of the dicing sheet 1 according to the present embodiment are not particularly limited as long as the base film 2 does not fracture such as in the expanding step to be performed after the dicing step. The base film 2 may ordinarily be constituted of a film that comprises a resin-based material as the main material.
Specific examples of the film include: ethylene-based copolymer film such as ethylene-vinyl : acetate copolymer film, ethylene-(meth)acrylic acid copolymer film and ethylene-(meth)acrylic ester copolymer film; polyolefin-based film such as low-density polyethylene (LDPE) film, linear low-density polyethylene (LLDPE) film, high-density polyethylene (HDPE) film and other polyethylene films, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film and norbornene resin film; polyvinyl chloride-based film such as polyvinyl chloride film and vinyl chloride copolymer film; polyester-based film such as polyethylene terephthalate film and polybutylene terephthalate film; polyurethane film; polyimide film; polystyrene film; polycarbonate film; and fluorine resin film. There may also be used a modified film thereof, such as a cross-linked film and an ionomer film. The above base film 2 may be a film comprising one type thereof, or may also be a laminated film comprising a combination of two or more types thereof. The "(meth)acrylic acid" as used in the present description means both acrylic acid and methacrylic acid. The same applies to other similar terms.
It is preferred that the film constituting the base film 2 comprises at least one of an ethylene-based copolymer film and a polyolefin-based film.
The ethylene-based copolymer film is easy to control its mechanical characteristics in a wide range such as by changing the copolymerization ratio. Therefore, the base film 2 comprising the ethylene-based copolymer film may easily fulfill the mechanical characteristics that are needed as those of the base film of the dicing sheet 1 according to the present embodiment. In addition, the ethylene-based copolymer film has a relatively high
Claims (8)
1. Adicing sheet comprising a base film and a pressure sensitive adhesive layer laminated on at least one surface of the base film, wherein: = 3 B ; 2 i. the pressure sensitive adhesive layer is formed of a pressure sendifive T 2 adhesive composition that contains an acrylic-based polymer (A) and’an 3 energy ray polymerizable compound (B); 2 ) 4 wo the pressure sensitive adhesive layer has a thickness of 25 pm or less; and > i " the pressure sensitive adhesive layer has a storage elastic modulus at 23°C of
0.12 MPa or less before energy ray irradiation and a holding time of 15,000 seconds or more, wherein the holding time is measured when a test for measuring a holding power of the pressure sensitive adhesive layer before energy ray irradiation is performed in accordance with JIS Z0237: 2009.
2. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive layer has a storage elastic modulus at 23°C of 0.06 MPa or less before energy ray irradiation.
3. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive composition contains 50 mass parts or more of a storage elastic modulus adjuster (C) having a weight-average molecular weight of 4,000 or less relative to 100 mass parts of the acrylic-based polymer (A).
4. The dicing sheet as recited in claim 1, wherein at least a part of the energy ray polymerizable compound (B) has a property as a storage elastic modulus adjuster (C).
5. The dicing sheet as recited in claim 1, wherein the pressure sensitive adhesive composition contains 0.02 mass parts or more of a cross-linker (D) that is reactive in cross-linking with the acrylic-based polymer (A) relative to 100 mass parts of the acrylic-based polymer (A).
6. The dicing sheet as recited in claim 1, wherein the base film comprises at least one of an ethylene-based copolymer film and a polyolefin-based film.
. . on 38 RN :
7. The dicing sheet as recited in claim 1, wherein a surface of the pressure sensitive adhesive layer opposite to the base film is to be applied to a surface of a device-related member.
8. A method for manufacturing device chips, comprising: applying a surface at the side of the pressure sensitive adhesive layer of the dicing sheet as recited in claim 1 to a surface of a device-related member; and cutting the device-related member on the dicing sheet into pieces to obtain a plurality of device chips.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012172653 | 2012-08-03 | ||
| PCT/JP2013/062772 WO2014020962A1 (en) | 2012-08-03 | 2013-05-02 | Dicing sheet and method for manufacturing device chip |
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| PH12015500230B1 true PH12015500230B1 (en) | 2015-04-06 |
| PH12015500230A1 PH12015500230A1 (en) | 2015-04-06 |
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| PH12015500230A PH12015500230A1 (en) | 2012-08-03 | 2015-02-02 | Dicing sheet and method for manufacturing device chips |
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| JP (1) | JP5414953B1 (en) |
| CN (1) | CN104508801B (en) |
| MY (1) | MY172228A (en) |
| PH (1) | PH12015500230A1 (en) |
| TW (1) | TWI564363B (en) |
| WO (1) | WO2014020962A1 (en) |
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| WO2015141555A1 (en) * | 2014-03-17 | 2015-09-24 | リンテック株式会社 | Dicing sheet and process for producing chips using said dicing sheet |
| JP6522617B2 (en) * | 2014-07-31 | 2019-05-29 | リンテック株式会社 | Dicing sheet, method of manufacturing dicing sheet, and method of manufacturing mold chip |
| EP3433876B1 (en) * | 2016-03-24 | 2023-09-13 | Siltectra GmbH | A splitting method |
| JP2018019022A (en) * | 2016-07-29 | 2018-02-01 | 日東電工株式会社 | Dicing tape integrated semiconductor rear face film and method of manufacturing semiconductor device |
| JPWO2020195744A1 (en) * | 2019-03-27 | 2020-10-01 | ||
| JP2020164786A (en) * | 2019-03-29 | 2020-10-08 | 住友ベークライト株式会社 | Pressure sensitive adhesive tape |
| CN110465888B (en) * | 2019-09-17 | 2021-01-15 | 泉州运城制版有限公司 | Installation method of grinding wheel of plate roller grinding machine |
| JP7276555B1 (en) | 2021-11-08 | 2023-05-18 | 大日本印刷株式会社 | Adhesive tape for semiconductor processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4369584B2 (en) * | 2000-01-21 | 2009-11-25 | 日東電工株式会社 | Adhesive sheet for semiconductor wafer holding protection |
| JP4781633B2 (en) * | 2004-03-29 | 2011-09-28 | リンテック株式会社 | Adhesive sheet |
| WO2007105611A1 (en) * | 2006-03-15 | 2007-09-20 | Shin-Etsu Polymer Co., Ltd. | Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure, semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method |
| JP4991348B2 (en) * | 2006-04-06 | 2012-08-01 | リンテック株式会社 | Adhesive sheet |
| JP4991350B2 (en) * | 2007-02-28 | 2012-08-01 | リンテック株式会社 | Adhesive sheet |
| JP2012069586A (en) * | 2010-09-21 | 2012-04-05 | Nitto Denko Corp | Dicing die-bonding film, manufacturing method of dicing die-bonding film, and manufacturing method of semiconductor device |
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2013
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- 2013-05-02 CN CN201380040183.3A patent/CN104508801B/en active Active
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Also Published As
| Publication number | Publication date |
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| MY172228A (en) | 2019-11-18 |
| JPWO2014020962A1 (en) | 2016-07-21 |
| CN104508801B (en) | 2017-11-10 |
| JP5414953B1 (en) | 2014-02-12 |
| TW201408750A (en) | 2014-03-01 |
| PH12015500230A1 (en) | 2015-04-06 |
| CN104508801A (en) | 2015-04-08 |
| WO2014020962A1 (en) | 2014-02-06 |
| TWI564363B (en) | 2017-01-01 |
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