JPWO2020195744A1 - - Google Patents
Info
- Publication number
- JPWO2020195744A1 JPWO2020195744A1 JP2021508962A JP2021508962A JPWO2020195744A1 JP WO2020195744 A1 JPWO2020195744 A1 JP WO2020195744A1 JP 2021508962 A JP2021508962 A JP 2021508962A JP 2021508962 A JP2021508962 A JP 2021508962A JP WO2020195744 A1 JPWO2020195744 A1 JP WO2020195744A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019060411 | 2019-03-27 | ||
| PCT/JP2020/010002 WO2020195744A1 (en) | 2019-03-27 | 2020-03-09 | Work processing sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2020195744A1 true JPWO2020195744A1 (en) | 2020-10-01 |
Family
ID=72610493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021508962A Pending JPWO2020195744A1 (en) | 2019-03-27 | 2020-03-09 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2020195744A1 (en) |
| KR (1) | KR20210148068A (en) |
| CN (1) | CN113226754A (en) |
| TW (1) | TWI842853B (en) |
| WO (1) | WO2020195744A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022156835A (en) * | 2021-03-31 | 2022-10-14 | マクセル株式会社 | Adhesive tape for workpiece processing |
| JP2022156837A (en) * | 2021-03-31 | 2022-10-14 | マクセル株式会社 | Adhesive tape for workpiece processing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137028C (en) * | 1998-11-20 | 2004-02-04 | 琳得科株式会社 | Pressure-sensitive adhesive piece and its application method |
| JP4828009B2 (en) * | 1998-11-20 | 2011-11-30 | リンテック株式会社 | Adhesive sheet and method of using the same |
| JP4707805B2 (en) * | 2000-08-08 | 2011-06-22 | 三井化学株式会社 | Adhesive film for protecting semiconductor wafer surface and method for protecting semiconductor wafer surface using the same |
| JP5318435B2 (en) * | 2008-02-29 | 2013-10-16 | 日東電工株式会社 | Adhesive sheet for semiconductor wafer back grinding and semiconductor wafer back grinding method using this back grinding adhesive sheet |
| JP6085076B2 (en) * | 2009-03-16 | 2017-02-22 | リンテック株式会社 | Adhesive sheet, semiconductor wafer processing method, and semiconductor chip manufacturing method |
| WO2014020962A1 (en) * | 2012-08-03 | 2014-02-06 | リンテック株式会社 | Dicing sheet and method for manufacturing device chip |
| EP3007212B1 (en) * | 2013-05-29 | 2022-04-13 | Mitsui Chemicals Tohcello, Inc. | Semiconductor wafer protection film and production method for semiconductor device |
| KR102447759B1 (en) * | 2014-12-02 | 2022-09-27 | 린텍 가부시키가이샤 | Adhesive sheet, and method for manufacturing processed article |
| JP6404475B2 (en) * | 2015-07-03 | 2018-10-10 | 三井化学東セロ株式会社 | Semiconductor wafer surface protective film and semiconductor device manufacturing method |
| JP6885966B2 (en) * | 2016-11-01 | 2021-06-16 | リンテック株式会社 | Manufacturing method of dicing die bonding sheet and semiconductor chip |
| JP6224284B1 (en) * | 2017-03-08 | 2017-11-01 | リンテック株式会社 | Adhesive film |
-
2020
- 2020-03-09 CN CN202080007508.8A patent/CN113226754A/en active Pending
- 2020-03-09 KR KR1020217008158A patent/KR20210148068A/en not_active Application Discontinuation
- 2020-03-09 WO PCT/JP2020/010002 patent/WO2020195744A1/en active Application Filing
- 2020-03-09 JP JP2021508962A patent/JPWO2020195744A1/ja active Pending
- 2020-03-12 TW TW109108152A patent/TWI842853B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020195744A1 (en) | 2020-10-01 |
| CN113226754A (en) | 2021-08-06 |
| TW202101550A (en) | 2021-01-01 |
| TWI842853B (en) | 2024-05-21 |
| KR20210148068A (en) | 2021-12-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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| A621 | Written request for application examination |
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| A521 | Request for written amendment filed |
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| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
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