SG11201907214VA - Curable resin film and sheet for forming a first protective film - Google Patents

Curable resin film and sheet for forming a first protective film

Info

Publication number
SG11201907214VA
SG11201907214VA SG11201907214VA SG11201907214VA SG11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA SG 11201907214V A SG11201907214V A SG 11201907214VA
Authority
SG
Singapore
Prior art keywords
curable resin
forming
resin film
sheet
film
Prior art date
Application number
SG11201907214VA
Inventor
Masanori Yamagishi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201907214VA publication Critical patent/SG11201907214VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

A curable resin film is a film for forming a first protective film on a surface having a bump of a semiconductor wafer by being attached to the surface, and being cured, in which a visible light transmittance of the curable resin film before curing is 5 45% or less, and an infrared transmittance of the curable resin film before curing is 33% or more. A sheet for forming a first protective film includes a first supporting sheet, and the curable resin film on one surface of the first supporting sheet. Fig. 2 10
SG11201907214VA 2017-02-09 2018-01-26 Curable resin film and sheet for forming a first protective film SG11201907214VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017022165 2017-02-09
PCT/JP2018/002484 WO2018147097A1 (en) 2017-02-09 2018-01-26 Curable resin film and sheet for forming first protective film

Publications (1)

Publication Number Publication Date
SG11201907214VA true SG11201907214VA (en) 2019-09-27

Family

ID=63108082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201907214VA SG11201907214VA (en) 2017-02-09 2018-01-26 Curable resin film and sheet for forming a first protective film

Country Status (8)

Country Link
JP (1) JP6388752B1 (en)
KR (1) KR102430167B1 (en)
CN (1) CN110249414B (en)
MY (1) MY192914A (en)
PH (1) PH12019501814A1 (en)
SG (1) SG11201907214VA (en)
TW (1) TWI663642B (en)
WO (1) WO2018147097A1 (en)

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CN112868095A (en) * 2019-02-26 2021-05-28 琳得科株式会社 Thermosetting resin film and first protective film-forming sheet
JPWO2020175421A1 (en) * 2019-02-26 2021-12-23 リンテック株式会社 Thermosetting resin film and first protective film forming sheet
JP6803498B1 (en) * 2019-03-29 2020-12-23 三井化学東セロ株式会社 Manufacturing method of electronic device
JP7326101B2 (en) * 2019-10-07 2023-08-15 リンテック株式会社 Protective film forming film and protective film forming composite sheet
JP7326103B2 (en) * 2019-10-07 2023-08-15 リンテック株式会社 Protective film forming film and protective film forming composite sheet
JP7256851B2 (en) * 2019-12-27 2023-04-12 リンテック株式会社 Manufacturing method of kit and semiconductor chip
WO2023136053A1 (en) * 2022-01-12 2023-07-20 リンテック株式会社 Sheet for forming first protective membrane, method for manufacturing semiconductor device, and use of sheet
JP7260017B1 (en) 2022-01-31 2023-04-18 大日本印刷株式会社 Adhesive tape for semiconductor processing

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JP3788652B2 (en) * 1997-01-13 2006-06-21 三菱化学株式会社 Near-infrared absorbing resin molded product
JP4044543B2 (en) * 2000-05-12 2008-02-06 富士通株式会社 Manufacturing method of semiconductor chip
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JP2002252245A (en) * 2001-02-22 2002-09-06 Mitsubishi Electric Corp Method for manufacturing semiconductor device
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JP2011231137A (en) * 2010-04-23 2011-11-17 Hitachi Chem Co Ltd Epoxy resin composition for seal-filling semiconductor and semiconductor device
JP2011253940A (en) * 2010-06-02 2011-12-15 Sony Chemical & Information Device Corp Wafer dicing method, connecting method, and connecting structure
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JP5996901B2 (en) * 2011-09-02 2016-09-21 株式会社日本触媒 Light selective transmission filter, resin sheet, and solid-state image sensor
JP6405556B2 (en) * 2013-07-31 2018-10-17 リンテック株式会社 Protective film forming film, protective film forming sheet and inspection method
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WO2015111632A1 (en) * 2014-01-22 2015-07-30 リンテック株式会社 Protective-membrane-forming film, sheet for forming protective membrane, compound sheet for forming protective membrane, and inspection method
CN113980535A (en) * 2014-10-29 2022-01-28 琳得科株式会社 Protective film forming film, composite sheet for protective film formation, and method for manufacturing semiconductor chip with protective film
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JP6506117B2 (en) * 2015-06-25 2019-04-24 リンテック株式会社 Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective
JP6506118B2 (en) * 2015-06-25 2019-04-24 リンテック株式会社 Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective

Also Published As

Publication number Publication date
JP6388752B1 (en) 2018-09-12
JPWO2018147097A1 (en) 2019-02-14
TW201834044A (en) 2018-09-16
KR102430167B1 (en) 2022-08-05
CN110249414B (en) 2023-04-04
WO2018147097A1 (en) 2018-08-16
PH12019501814A1 (en) 2020-09-14
CN110249414A (en) 2019-09-17
KR20190116352A (en) 2019-10-14
TWI663642B (en) 2019-06-21
MY192914A (en) 2022-09-15

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