PH12016502286A1 - Composite sheet for forming protective film - Google Patents
Composite sheet for forming protective filmInfo
- Publication number
- PH12016502286A1 PH12016502286A1 PH12016502286A PH12016502286A PH12016502286A1 PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1 PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1
- Authority
- PH
- Philippines
- Prior art keywords
- protective film
- composite sheet
- forming protective
- supporting sheet
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
Abstract
This composite sheet (3) for forming a protective film is provided with: a supporting sheet (4); and a protective film forming film (1) that is laminated on a first surface of the supporting sheet (4). A second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra1) of 0.2 mm or more, and the second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra2) of 0.25 mm or less after being heated at 130oC for 2 hours.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106757 | 2014-05-23 | ||
PCT/JP2015/064202 WO2015178346A1 (en) | 2014-05-23 | 2015-05-18 | Composite sheet for forming protective film |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12016502286A1 true PH12016502286A1 (en) | 2017-02-13 |
Family
ID=54554016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12016502286A PH12016502286A1 (en) | 2014-05-23 | 2016-11-16 | Composite sheet for forming protective film |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6319433B2 (en) |
KR (1) | KR102378063B1 (en) |
CN (1) | CN106463373B (en) |
PH (1) | PH12016502286A1 (en) |
SG (1) | SG11201609543VA (en) |
TW (2) | TWI675900B (en) |
WO (1) | WO2015178346A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015178346A1 (en) * | 2014-05-23 | 2015-11-26 | リンテック株式会社 | Composite sheet for forming protective film |
WO2017145938A1 (en) * | 2016-02-22 | 2017-08-31 | リンテック株式会社 | Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor device |
KR102233439B1 (en) * | 2016-03-02 | 2021-03-30 | 후루카와 덴키 고교 가부시키가이샤 | Wafer processing tape |
JP7008620B2 (en) * | 2016-03-04 | 2022-01-25 | リンテック株式会社 | Sheet for semiconductor processing |
KR102313074B1 (en) * | 2016-03-24 | 2021-10-14 | 린텍 가부시키가이샤 | Composite sheet for forming support sheet and protective film |
TWI721158B (en) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | Protective film forming film and composite sheet for forming protective film |
TWI778960B (en) * | 2016-04-28 | 2022-10-01 | 日商琳得科股份有限公司 | Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film |
TWI722170B (en) * | 2016-04-28 | 2021-03-21 | 日商琳得科股份有限公司 | Film for forming protective film and composite sheet for forming protective film |
CN110235222B (en) * | 2017-02-02 | 2023-07-14 | 株式会社力森诺科 | Method for producing electronic component, resin composition for temporary protection, and resin film for temporary protection |
JP6298226B1 (en) * | 2017-03-30 | 2018-03-20 | リンテック株式会社 | Composite sheet for protective film formation |
CN109789666A (en) * | 2017-03-30 | 2019-05-21 | 琳得科株式会社 | Composite sheet is used in protective film formation |
JP2019079961A (en) * | 2017-10-25 | 2019-05-23 | リンテック株式会社 | Semiconductor processing sheet |
WO2019203021A1 (en) * | 2018-04-18 | 2019-10-24 | リンテック株式会社 | Workpiece processing sheet |
CN114830300A (en) * | 2019-12-23 | 2022-07-29 | 昭和电工材料株式会社 | Dicing die-bonding integrated film, quality control method thereof, and method for manufacturing semiconductor device |
JP2022157810A (en) | 2021-03-31 | 2022-10-14 | リンテック株式会社 | Support sheet, composite sheet for resin film formation, kit, and manufacturing method of chip with resin film |
JP2023144842A (en) | 2022-03-28 | 2023-10-11 | リンテック株式会社 | Composite sheet for resin film formation, kit, and method for manufacturing workpiece processed product with resin film |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58149048A (en) * | 1982-03-02 | 1983-09-05 | Sony Corp | Cover film for use in color hard copy printing paper |
ATE534142T1 (en) | 2002-03-12 | 2011-12-15 | Hamamatsu Photonics Kk | METHOD FOR SEPARATING A SUBSTRATE |
JP4128058B2 (en) * | 2002-09-24 | 2008-07-30 | 三井化学株式会社 | Adhesive film and method of using the same |
JP5165829B2 (en) * | 2004-02-26 | 2013-03-21 | 日東電工株式会社 | Rolled wafer processing adhesive sheet |
JP4642436B2 (en) * | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
JP2007109808A (en) * | 2005-10-12 | 2007-04-26 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer dicing die bond |
JP4762671B2 (en) | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer dicing method |
JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
JP2011151362A (en) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
WO2011096350A1 (en) * | 2010-02-02 | 2011-08-11 | 三井化学東セロ株式会社 | Surface protective film |
EP2542635A1 (en) * | 2010-03-01 | 2013-01-09 | 3M Innovative Properties Company | Translucent film for protecting rough surfaces |
JP5483713B2 (en) * | 2010-05-12 | 2014-05-07 | 日東電工株式会社 | Surface protection film |
JP5391158B2 (en) * | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | Wafer sticking adhesive sheet and wafer processing method using the same |
JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
JP5889892B2 (en) * | 2011-06-14 | 2016-03-22 | デンカ株式会社 | Method for manufacturing adhesive sheet and electronic component |
JP5363662B2 (en) * | 2011-09-30 | 2013-12-11 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP5583725B2 (en) * | 2012-09-20 | 2014-09-03 | リンテック株式会社 | Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method |
WO2015178346A1 (en) * | 2014-05-23 | 2015-11-26 | リンテック株式会社 | Composite sheet for forming protective film |
-
2015
- 2015-05-18 WO PCT/JP2015/064202 patent/WO2015178346A1/en active Application Filing
- 2015-05-18 CN CN201580025643.4A patent/CN106463373B/en active Active
- 2015-05-18 SG SG11201609543VA patent/SG11201609543VA/en unknown
- 2015-05-18 JP JP2016521094A patent/JP6319433B2/en active Active
- 2015-05-18 KR KR1020167031951A patent/KR102378063B1/en active IP Right Grant
- 2015-05-20 TW TW104116042A patent/TWI675900B/en active
- 2015-05-20 TW TW108127491A patent/TWI741336B/en active
-
2016
- 2016-11-16 PH PH12016502286A patent/PH12016502286A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI675900B (en) | 2019-11-01 |
TWI741336B (en) | 2021-10-01 |
CN106463373A (en) | 2017-02-22 |
WO2015178346A1 (en) | 2015-11-26 |
TW201940624A (en) | 2019-10-16 |
SG11201609543VA (en) | 2016-12-29 |
JP6319433B2 (en) | 2018-05-09 |
CN106463373B (en) | 2020-01-03 |
JPWO2015178346A1 (en) | 2017-04-20 |
KR20170008749A (en) | 2017-01-24 |
TW201602303A (en) | 2016-01-16 |
KR102378063B1 (en) | 2022-03-23 |
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