JP2022157810A - Support sheet, composite sheet for resin film formation, kit, and manufacturing method of chip with resin film - Google Patents

Abstract

To provide a support sheet capable of eliminating the influence of slackness of a manufacturing processing sheet due to heating and cooling and improving the recognition of a chip of a pickup device, a composite sheet for resin film formation and a kit including the support sheet and a resin film forming layer, and a manufacturing method of a chip with a resin film.SOLUTION: A support sheet (10) is used for heating a workpiece or chips obtained by dividing the workpiece. In the support sheet (10), when a support sheet (10) having a sample size: 20 mm long and 5 mm wide is subjected to a thermo-mechanical analysis (TMA) in a tensile mode in either a machine direction (MD) or perpendicular direction (CD), an amount of displacement (A130) at 130°C is 500 μm or less, and an average displacement (A23→130) per 1°C when the temperature is raised from 23°C to 130°C is smaller than an absolute value (|B130→50|) of an average displacement amount per 1°C at slow cooling from 130°C to 50°C.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a support sheet, a resin film-forming composite sheet and kit comprising the support sheet and a resin film-forming layer, and a method for manufacturing a resin film-coated chip.

A work such as a semiconductor wafer, an insulator wafer, or a semiconductor device panel has a circuit formed on one surface (circuit surface) thereof, and has projecting electrodes such as bumps on that surface (circuit surface). There is A laminate is obtained by attaching the work to a support sheet (for example, a dicing sheet). The laminate is heated and then cooled while the peripheral portion of the support sheet is attached to a fixing jig such as a ring frame. The workpiece attached to the support sheet is divided to obtain chips. After that, the chip may be picked up from the support sheet (see Patent Document 1).

In the manufacturing process of a semiconductor device using a mounting method called a so-called face down method, a protective film forming film is used to protect the back surface of a chip formed by dicing the work. A protective film-forming composite sheet is used in which a film-forming film and a support sheet are combined. In addition, a film-like adhesive is used to bond the back surface of a chip to a lead frame, an organic substrate, or the like. Bonding sheets are also used. The protective film-forming film and the film-like adhesive are used by being attached to the back surface of the work.

In the present specification, the protective film-forming film or film-like adhesive is hereinafter referred to as the resin film-forming layer, and the protective film-forming composite sheet or dicing die bonding sheet is hereinafter referred to as the resin film-forming composite sheet. A protective film formed from a protective film-forming film or a bonding film formed from a film-like adhesive is referred to as a resin film.

In manufacturing a chip with a resin film, a resin film forming layer for forming a protective film or a bonding film is attached to the back surface of a work. The resin film-forming layer may be attached to the back surface of the workpiece in the form of a resin film-forming composite sheet in which the resin film-forming layer is laminated on a support sheet. The resin film forming layer may be attached to the back surface of the work without being laminated on the support sheet, and then attached to the support sheet.

If necessary, the resin film forming layer attached to the back surface of the work is thermally cured on the support sheet to form a resin film. When the resin film-forming layer attached to the back surface of the work is thermally cured on the support sheet, the support sheet, the resin film-forming layer, and the work are laminated in this order in the thickness direction. One laminated composite sheet is heated with the perimeter of the sheet attached to a ring frame and then cooled. After that, in a dicing process on the support sheet, the work may be divided, the resin film may be cut, and chips with the resin film may be picked up (see Patent Document 2).

Alternatively, the resin film forming layer attached to the back surface of the work is divided in the dicing process on the support sheet, the work is divided, the resin film is cut, and chips with the resin film forming layer are formed. The film-forming layer is thermally cured to obtain a chip with a resin film. When the resin film-forming layer attached to the back surface of the chip is thermally cured on the support sheet, the support sheet, the resin film-forming layer, and the chip are laminated in this order in the thickness direction. The four-laminate composite sheet is heated and cooled with the perimeter of the sheet attached to the ring frame. After that, the chip with the resin film is picked up.

WO2015/190230 WO2015/178346

For example, the semiconductor wafers described in Patent Documents 1 and 2 had a diameter of 8 inches, a thickness of 100 μm, and a mass of about 7.4 g. It explains that the semiconductor wafer is diced into a chip size of 9 mm×9 mm to form chips.

In manufacturing chips with resin films, semiconductor wafers with larger diameters are adopted, and the number and size of protruding electrodes on the semiconductor wafers are increasing. The load applied to the sheet tends to increase, and the chip size tends to decrease.

When a conventional composite sheet for forming a resin film or a support sheet is used, the sheet for manufacturing processing such as the first laminated composite sheet or the fourth laminated composite sheet is adhered to the ring frame while the peripheral edge portion of the sheet for manufacturing processing is adhered to the ring frame. When the sheet is heated, the manufacturing processing sheet is loosened by the load of a work such as a semiconductor wafer or the load of a plurality of chips, and the position of the resin film-coated chip may be displaced. Further, in the dicing process after heating the manufacturing processing sheet, the position of the resin film-coated chip may be displaced. As a result, when the chip size is smaller, there may occur a problem of recognition failure of the resin film-coated chip during pickup.

The present invention provides a support sheet capable of eliminating the influence of slackness of a manufacturing processing sheet due to heating and cooling and improving the recognition of a chip of a pickup device, and a resin film forming composite comprising the support sheet and a resin film forming layer. An object of the present invention is to provide a sheet, a kit, and a method for manufacturing a chip with a resin film.

The present invention provides the following support sheet, resin film-forming composite sheet and kit, and resin film-coated chip manufacturing method.

[1] A support sheet used for heating a workpiece or a chip obtained by dividing a workpiece,
When the support sheet is subjected to thermomechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode under the following conditions:
The displacement amount (A ₁₃₀ ) at 130° C. is 500 μm or less,
The average displacement per 1°C when the temperature is raised from 23°C to 130°C ( _A23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C (|B _130→50 |), support sheet.

<Conditions for thermomechanical analysis (TMA)>
Sample size: length 20mm, width 5mm
Chuck interval: 15mm
Load: 0.8 g, temperature increase rate: 10° C./min from 23° C. to 130° C. and maintained for 30 minutes. After that, it is cooled from 130° C. to 50° C. with a load of 0.8 g and a cooling rate of 1° C./min. The amount of displacement [μm] during that time is measured.

[2] When the support sheet is subjected to thermomechanical analysis (TMA) under the above conditions in a machine direction (MD) tensile mode and a vertical direction (CD) tensile mode,
Displacement amount (A ₁₃₀ ) at 130° C. is 500 μm or less,
The average displacement per 1°C when the temperature is raised from 23°C to 130°C ( _A23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C (|B _130→50 |), the support sheet according to [1].

[3] When the support sheet is subjected to thermomechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode under the conditions described above,
The support sheet according to [1] or [2], wherein the average amount of displacement (A _23→130 ) per 1° C. when the temperature is raised from 23° C. to 130° C. is a positive value.
[4] When the support sheet is subjected to a thermomechanical analysis (TMA) under the above conditions in a machine direction (MD) tensile mode and a vertical direction (CD) tensile mode,
The support sheet according to [3], wherein the average amount of displacement per 1°C (A _23→130 ) when the temperature is raised from 23°C to 130°C is a positive value.

[5] When the support sheet is subjected to thermo-mechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode at the conditions described above,
The average amount of displacement per 1° C. (A _60→130 ) when the temperature is raised from 60° C. to 130° C. relative to the average amount of displacement per 1° C. (A _23→130 ) when the temperature is raised from 23° C. to 130° C. is less than 1, the support sheet according to [3] or [4].
[6] When the support sheet is subjected to a thermomechanical analysis (TMA) under the above conditions in a machine direction (MD) tensile mode and a vertical direction (CD) tensile mode,
The average amount of displacement per 1° C. (A _60→130 ) when the temperature is raised from 60° C. to 130° C. relative to the average amount of displacement per 1° C. (A _23→130 ) when the temperature is raised from 23° C. to 130° C. is less than 1, the support sheet according to [5].

[7] The support sheet consists of only a base material, or comprises a base material and a pressure-sensitive adhesive layer provided on one surface of the base material, wherein the base material The support sheet according to any one of [1] to [6], wherein the constituent material contains a polyolefin resin.
[8] The support sheet consists of only a base material, or comprises a base material and a pressure-sensitive adhesive layer provided on one surface of the base material, wherein the base material is , a stretched film, the support sheet according to any one of [1] to [7].
[9] The support sheet according to any one of [1] to [8], wherein the support sheet is roll-shaped.

[10] A resin film-forming composite sheet comprising the support sheet according to any one of [1] to [8] and a resin film-forming layer provided on one surface of the support sheet.
[11] The resin film-forming composite sheet of [10], wherein the resin film-forming layer is a protective film-forming film.
[12] The composite sheet for resin film formation according to [10] or [11], wherein the composite sheet for resin film formation is roll-shaped.

[13] Supporting a first laminate in which a first release film, a resin film-forming layer and a second release film are laminated in this order, a workpiece to which the resin film-forming layer is adhered, and the resin film-forming layer A kit comprising the support sheet according to any one of [1] to [9], which is used for.
[14] The kit according to [13], wherein the resin film-forming layer is a protective film-forming film.
[15] The kit according to [13] or [14], wherein the first laminate is roll-shaped.

[16] A method for manufacturing a chip with a resin film comprising a chip and a resin film provided on the back surface of the chip, comprising:
The resin film-forming layer in the resin film-forming composite sheet according to any one of [10] to [12] is attached to the back surface of the work, or the back surface of the work is attached to [13] to [15]. ], and the resin film-forming layer and the workpiece are laminated in the thickness direction to produce a first laminated film. Furthermore, by attaching the support sheet in the kit to the resin film-forming layer in the first laminated film, the resin film-forming layer and the workpiece are formed on the support sheet in this order, and their thicknesses a step of producing a first laminated composite sheet configured by being laminated in a direction;
The first laminated composite sheet is heated in a state where the peripheral edge portion of the first laminated composite sheet is attached to a fixing jig to cure the resin film-forming layer to form the resin film, thereby supporting the support. a step of producing a second laminated composite sheet in which the resin film and the workpiece are laminated in this order on the sheet in the thickness direction thereof;
The second laminated composite sheet is cooled, and then the work in the second laminated composite sheet is divided on the support sheet, and the resin film is cut to form a plurality of resin film-coated chips. creating a third laminated composite sheet secured on a support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.

[17] A method for manufacturing a chip with a resin film comprising a chip and a resin film provided on the back surface of the chip, comprising:
The resin film-forming layer in the resin film-forming composite sheet according to any one of [10] to [12] is attached to the back surface of the work, or the back surface of the work is attached to [13] to [15]. ], and the resin film-forming layer and the workpiece are laminated in the thickness direction to produce a first laminated film. Furthermore, by attaching the support sheet in the kit to the resin film-forming layer in the first laminated film, the resin film-forming layer and the workpiece are formed on the support sheet in this order, and their thicknesses a step of producing a first laminated composite sheet configured by being laminated in a direction;
A plurality of chips with a resin film forming layer are fixed on the supporting sheet by dividing the work in the first laminated composite sheet and cutting the resin film forming layer on the supporting sheet. a step of making a fourth laminated composite sheet;
With the peripheral edge portion of the fourth laminated composite sheet attached to a fixing jig, the fourth laminated composite sheet is heated and cooled to harden the resin film forming layer in the fourth laminated composite sheet. forming the resin film on the support sheet to form a third laminated composite sheet in which a plurality of resin-film-coated chips are fixed on the support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.

According to the present invention, there is provided a support sheet capable of eliminating the effects of slackness of a manufacturing processing sheet due to heating and cooling and eliminating chip recognition failures of a pickup device; Composite sheets and kits, and methods of manufacturing resin-film-coated chips are provided.

It is a sectional view showing typically an example of a support sheet concerning an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically an example of the composite sheet for resin film formation which concerns on embodiment of this invention. FIG. 4 is a cross-sectional view schematically showing another example of the composite sheet for resin film formation according to the embodiment of the present invention. FIG. 4 is a cross-sectional view schematically showing still another example of the resin film-forming composite sheet according to the embodiment of the present invention. FIG. 4 is a cross-sectional view schematically showing still another example of the resin film-forming composite sheet according to the embodiment of the present invention. 1 is a cross-sectional view schematically showing an example of a kit according to an embodiment of the present invention; FIG. FIG. 2A is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 2A is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 2A is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 2A is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 2A is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining part of another example of the method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining part of another example of the method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining part of another example of the method for manufacturing a chip with a resin film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining part of another example of the method for manufacturing a chip with a resin film according to an embodiment of the present invention;

<<Support Sheet>>
A support sheet according to an embodiment of the present invention is a support sheet used for heating a workpiece or chips obtained by dividing the workpiece,
When the support sheet is subjected to thermomechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode under the following conditions:
The displacement amount (A ₁₃₀ ) at 130° C. is 500 μm or less,
The average displacement per 1°C when the temperature is raised from 23°C to 130°C ( _A23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C (|B _130→50 |).

<Conditions for thermomechanical analysis (TMA)>
Sample size: length 20mm, width 5mm
Chuck interval: 15mm
Load: 0.8 g, temperature increase rate: 10° C./min from 23° C. to 130° C. and maintained for 30 minutes. After that, it is cooled from 130° C. to 50° C. with a load of 0.8 g and a cooling rate of 1° C./min. The amount of displacement [μm] during that time is measured.

A positive value of displacement in the thermo-mechanical analysis (TMA) means that the support sheet has elongated, and a negative value of displacement means that the support sheet has contracted.

The support sheet according to this embodiment has a displacement amount (A ₁₃₀ ) at 130° C. of 500 μm or less. Here, the amount of displacement (A ₁₃₀ ) at 130°C was measured when the temperature was raised from 23°C to 130°C and the temperature reached 130°C.
When the amount of displacement (A ₁₃₀ ) at 130° C. is 500 μm or less, sagging of the support sheet during heating can be reduced. The displacement (A ₁₃₀ ) at 130° C. is preferably 450 μm or less, more preferably 400 μm or less, even more preferably 360 μm or less. The displacement (A ₁₃₀ ) at 130° C. is preferably greater than −50 μm, more preferably greater than 0 μm, further preferably greater than 21 μm, further preferably greater than 43 μm, particularly preferably greater than 64 μm. .

For example, in the case of a support sheet having a property that the displacement (A ₁₃₀ ) is a negative value and has a property of greatly shrinking, at high temperatures, the adhesive force with a fixing jig such as an adhesive layer for a jig is weakened, and the work is There is a risk that the support sheet will peel off from the fixing jig and fall off due to the weight of . However, when the temperature drops, the adhesive strength of the adhesive layer for jigs and other fixing jigs is restored, so the absolute value of the average displacement per 1°C when slowly cooled from 130 to 50°C (| B _130→50 |) may be large. Therefore, the average displacement per 1°C when the temperature is raised from 23°C to 130°C (A _23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C ( |B _130→50 |).

Here, the average amount of displacement (A _23→130 ) per 1° C. when the temperature is raised from 23° C. to 130° C. can be obtained by the following equation.
A _{23 → 130} = (A ₁₃₀ - A ₂₃ )/107 = A ₁₃₀ /107 [μm/°C]

Amount of displacement (A ₂₃ ) at 23° C.=0 μm
Displacement at 130°C (A ₁₃₀ ) [μm]

Here, the average amount of displacement (B _130→50 ) per 1° C. when slowly cooled from 130° C. to 50° C. can be obtained from the following equation.
B _{130 → 50} = (B ₅₀ - B ₁₃₀ )/80 [μm/°C]
It should be noted that B _130→50 is usually a negative value because it is not assumed that the support sheet will stretch when slowly cooled.

Here, the absolute value (|B _130→50 |) of the average displacement amount per 1° C. when slowly cooled from 130° C. to 50° C. can be obtained by the following equation.
|B _130→50 |=|B ₅₀ −B ₁₃₀ |/80 [μm/° C.]

Displacement (B ₁₃₀ ) [μm] after holding at 130° C. for 30 minutes
Amount of displacement at ₅₀ °C after slow cooling (B50) [μm]

Since the average amount of displacement (A _23→130 ) is smaller than the absolute value of the average amount of displacement (|B _130→50 |), positional change of the chip on the support sheet due to heating and cooling can be reduced. It is possible to eliminate the recognition failure of the chip of the pick-up device.

When the support sheet is subjected to thermomechanical analysis (TMA) in a tensile mode in either the machine direction (MD) or the vertical direction (CD) under the following conditions, from the average displacement (A _23→130 ), the average displacement The value obtained by subtracting the absolute value of (|B _130→50 |) [(A _23→130 )−|B _130→50 |] is a negative value and should be −0.10 to −5 μm/° C. is preferred, -0.40 to -4 µm/°C is more preferred, and -0.75 to -3 µm/°C is even more preferred.

Phenomenon in which the support sheet slowly expands due to the same load (work load) being applied to the base material of the support sheet for a long time when the temperature is raised to 130°C and held without temperature change. _than the _value [(A _{23 →130} )−|B _130→50 |] is important. This is because when the first laminated composite sheet or the fourth laminated composite sheet is actually held at 130 ° C., the resin film-forming layer, the adhesive layer, and the curing agent in the first laminated composite sheet or the fourth laminated composite sheet Since the adhesive layer for tools is viscous at high temperatures, the phenomenon that the support sheet slowly expands reduces the stress in the entire first laminated composite sheet or the fourth laminated composite sheet and does not easily affect slackness. It's for.

Here, the value of [(A _23→130 )−|B _{130 →50} |] in the machine direction (MD) is changed to the value of [(A _23→130 )−| ] value” can be obtained as a “balance evaluation value between MD and CD”.
The balance evaluation value of MD and CD is preferably 3.0 or less, more preferably 2.5 or less, still more preferably 2.0 or less, and particularly preferably 1.8 or less. If the evaluation value of the balance between MD and CD is greater than the above upper limit, in a situation where the shrinkage behavior of the support sheet is restricted by a fixing jig such as a ring frame, after heating and cooling, only one direction, either MD or CD A force tending to excessively shrink is generated in the support sheet, and wrinkles (a wavy shape of the support sheet) are likely to be formed in the support sheet near the fixing jig. When the wrinkles are to be formed, a force is generated in a direction in which the supporting sheet or the resin film-forming composite sheet is peeled off from the fixing jig (that is, the direction perpendicular to the plane of the fixing jig such as the ring frame). Therefore, the supporting sheet and the composite sheet for forming a resin film are more likely to be peeled off from the fixing jig and fall off starting from the peeling. However, it is considered that such a possibility can be further reduced by setting the balance evaluation value of MD and CD to be equal to or less than the upper limit value.

The above requirements may be met when the support sheet is subjected to thermo-mechanical analysis (TMA) in either machine direction (MD) or vertical (CD) tensile mode under the conditions described above.

When the support sheet is subjected to thermomechanical analysis (TMA) under the above conditions in a machine direction (MD) tensile mode and a vertical direction (CD) tensile mode, it preferably satisfies all of the above requirements.

That is, when the support sheet is subjected to thermomechanical analysis (TMA) in the machine direction (MD) tensile mode under the above conditions, the displacement (A ₁₃₀ ) at 130 ° C. is 500 μm or less, and the vertical direction (CD) It is preferable that the amount of displacement (A ₁₃₀ ) at 130° C. is 500 μm or less when thermomechanical analysis (TMA) is performed in a tensile mode.
When the support sheet is subjected to a thermomechanical analysis (TMA) in a tensile mode in the machine direction (MD) under the above conditions, the average displacement (A _23→130 ) is the absolute value of the average displacement (|B _130→50 |), and when thermomechanical analysis (TMA) is performed in a tensile mode in the vertical direction (CD), the average displacement (A _{23 → 130} ) is the absolute value of the average displacement (|B _{130 → 50} |).

Generally, the machine direction (MD) of the support sheet refers to the direction in which the resin flows when molding the support sheet. The vertical direction (CD) of the support sheet refers to the direction perpendicular to the machine direction (MD) of the support sheet. When the support sheet is in the form of a roll, the longitudinal direction of the support sheet is the machine direction (MD) and the width direction of the support sheet is the vertical direction (CD), regardless of whether the support sheet is stretched or not. do.
Even if the support sheet is sheet-shaped, the flow directions of the resin can be distinguished from each other by optical analysis such as analysis of two-dimensional X-ray diffraction images.

When the support sheet comprises a base material and an adhesive layer, the amount of displacement when the support sheet is subjected to thermomechanical analysis (TMA) is greatly affected by the characteristics of the base material. The machine direction (MD) of the substrate and the vertical direction (CD) of the support sheet shall be the vertical direction (CD) of the substrate.

The support sheet of the present embodiment has a temperature rise from 23 ° C. to 130 ° C. when the support sheet is subjected to thermomechanical analysis (TMA) under the above conditions in either the machine direction (MD) or vertical direction (CD) tensile mode. It is preferable that the average amount of displacement (A _23→130 ) per 1° C. is a positive value.
Adhesion to fixing jigs is weak at high temperatures. If the average displacement (A _23→130 ) is a negative value, the support sheet may shrink and may come off the fixing jig due to the weight of the workpiece or chip at high temperatures. When the average amount of displacement (A _23→130 ) is a positive value, it is possible to eliminate the risk of the support sheet peeling off from the fixing jig and falling off.

Here, the average amount of displacement (A _23→130 ) per 1° C. when the temperature is raised from 23° C. to 130° C. is obtained by the above formula (A _23→130 =A ₁₃₀ /107 [μm/° C.]). can be done.

The average displacement (A _23→130 ) is more preferably 0.20 μm/° C. or more, still more preferably 0.40 μm/° C. or more, and particularly preferably 0.60 μm/° C. or more. .

If the average displacement (A _23→130 ) is a positive value when the support sheet is subjected to thermomechanical analysis (TMA) under the above conditions in either the machine direction (MD) or the vertical direction (CD) tensile mode Just do it.

When the support sheet is subjected to thermomechanical analysis (TMA) in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode under the above conditions, the average displacement (A _23→130 ) is both positive. is preferably the value of

When the support sheet was subjected to thermomechanical analysis (TMA) under the above conditions in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode, the average displacement (A _23→130 ) was It is more preferably 0.20 µm/°C or more, still more preferably 0.40 µm/°C or more, and particularly preferably 0.60 µm/°C or more.

When the support sheet is subjected to thermal mechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode under the conditions described above, the average The ratio of the average amount of displacement (A _60→130 ) per 1° C. when the temperature is raised from 60° C. to 130° C. to the amount of displacement (A _23→130 ) is preferably less than 1.
After 60° C. in the temperature rise, the support sheet tends to become flexible as a material.
When the ratio of the average displacement amount (A _60→130 ) to the average displacement amount (A _23→130 ) is less than 1, the elongation behavior of the support sheet is suppressed after 60° C. in the temperature rise, The slackness after the final cooling is likely to be suppressed.

The average amount of displacement (A _23→130 ) per 1° C. when the temperature is raised from 23° C. to 130° C. can be obtained by the following equation.
A _{23 → 130} = (A ₁₃₀ - A ₂₃ )/107 = A ₁₃₀ /107 [μm/°C]

Amount of displacement (A ₂₃ ) at 23° C.=0 μm
Displacement at 130°C (A ₁₃₀ ) [μm]

Here, the average amount of displacement (A _60→130 ) per 1° C. when the temperature is raised from 60° C. to 130° C. can be obtained from the following equation.
A _{60 → 130} = (A ₁₃₀ - A ₆₀ )/70 [μm/°C]

Displacement at 60°C (A ₆₀ ) [μm]
Displacement at 130°C (A ₁₃₀ ) [μm]

Therefore, the average displacement amount per 1 °C when the temperature is raised from 60 ° C. to ₁₃₀ ° C. (A _{60 → 130} ) ratio [(A _60→130 )/(A _23→130 )] can be obtained from these equations.

The ratio of the average amount of displacement (A _60→130 ) to the average amount of displacement (A _23→130 ) [(A _60→130 )/(A _23→130 )] is preferably less than 1.0. It is more preferably 99 or less, and even more preferably 0.98 or less. The ratio of the average amount of displacement (A _60→130 ) to the average amount of displacement (A _23→130 ) [(A _60→130 )/(A _23→130 )] is preferably 0.10 or more, It is more preferably 0.20 or more, still more preferably 0.30 or more, and particularly preferably 0.90 or more.

Phenomenon in which the support sheet slowly expands due to the same load (work load) being applied to the base material of the support sheet for a long time when the temperature is raised to 130°C and held without temperature change. Rather, the ratio of the average displacement amount (A _60→130 ) to the average displacement amount (A _23→130 ) when the temperature changes by heating and slow cooling [(A _60→130 )/(A _{23 → 130} )] is important. This is because when the first laminated composite sheet or the fourth laminated composite sheet is actually held at 130 ° C., the resin film-forming layer, the adhesive layer, and the jig in the first laminated composite sheet or the fourth laminated composite sheet Since the pressure-sensitive adhesive layer has viscosity at high temperatures, the phenomenon in which the support sheet slowly expands is due to the fact that the stress in the first laminated composite sheet or the fourth laminated composite sheet as a whole is relaxed, and slackness is less likely to be affected. be.

When the support sheet is subjected to thermomechanical analysis (TMA) in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode under the above conditions, the average displacement with respect to the average displacement amount (A _{23 → 130} ) Preferably, the ratio of the amounts (A _60→130 ) are both less than one.

When the support sheet is subjected to thermomechanical analysis (TMA) in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode under the above conditions, the average displacement with respect to the average displacement amount (A _{23 → 130} ) The ratio [(A _60→130 )/(A _23→130 )] of the amount (A _60→130 ) is preferably less than 1, more preferably 0.99 or less. is more preferably 0.98 or less. The ratio of the average displacement (A _60→130 ) to the average displacement (A _23→130 ) [(A _60→130 )/(A _23→130 )] is preferably 0.10 or more. Both are preferably 0.20 or more, and more preferably 0.30 or more.

The support sheet of the present embodiment has a resin film-forming layer attached to the back surface of a work, and the resin film-forming layer and the work are laminated in this order on the support sheet in their thickness direction. The first laminated composite sheet is heated in a state where the peripheral edge portion of the first laminated composite sheet is attached to a fixing jig, and the resin film and the work are formed on the support sheet. are laminated in this order in the thickness direction to form a second laminated composite sheet, the second laminated composite sheet is cooled, and then the work is divided on the support sheet, The resin film is cut to form a third laminated composite sheet in which a plurality of resin film-coated chips are fixed on the support sheet, and the resin film-coated chips in the third laminated composite sheet are picked up. , can be suitably used in a method for manufacturing a chip with a resin film. Since the support sheet according to the embodiment of the present invention has the above configuration, the first laminated composite sheet is heated while the peripheral edge portion of the first laminated composite sheet is attached to the fixing jig, After that, even if the second laminated composite sheet is cooled, the influence of the slackness of the third laminated composite sheet can be eliminated, and the recognizability of the chip of the pick-up device can be improved.

Further, the support sheet of the present embodiment has a resin film-forming layer attached to the back surface of the work, and the resin film-forming layer and the work are laminated in this order on the support sheet in the thickness direction thereof. A fourth laminated composite sheet in which the workpiece is divided, the resin film-forming layer is cut, and a plurality of chips with the resin film-forming layer are fixed on the support sheet in the first laminated composite sheet. A sheet is formed, and the fourth laminated composite sheet is heated in a state in which the peripheral edge portion of the fourth laminated composite sheet is attached to a fixing jig to form a plurality of sheets on the support sheet. forming a third laminated composite sheet to which a plurality of resin film-coated chips are fixed, cooling the third laminated composite sheet, and then picking up the resin film-coated chips in the third laminated composite sheet; It can be suitably used in a method for manufacturing a chip with a film. Since the support sheet according to the embodiment of the present invention has the above configuration, the fourth laminated composite sheet is heated while the peripheral edge portion of the fourth laminated composite sheet is attached to the fixing jig, After that, even if the third laminated composite sheet is cooled, the influence of the slackness of the third laminated composite sheet can be eliminated, and the recognizability of the chip of the pick-up device can be improved.

Since the support sheet according to the embodiment of the present invention has the above configuration, even when the mass of the work is 20 g or more, it is possible to improve the recognition of the chip of the pickup device, and the mass of the work is Even when the weight is 30 g or more, the chip recognizability of the pick-up device can be improved.

As used herein, the term "workpiece" refers to a wafer or semiconductor device panel.
The "wafer" includes element semiconductors such as silicon, germanium, and selenium, and compound semiconductors such as GaAs, GaP, InP, CdTe, ZnSe, and SiC; sapphire, glass, lithium niobate, and tantalic acid. An insulator wafer made of an insulator such as lithium is exemplified.
A "semiconductor device panel" refers to an assembly in which a plurality of semiconductor devices each having at least one electronic component sealed with a sealing resin layer are arranged side by side in a plane.
A circuit is formed on one surface of these workpieces, and in this specification, the surface of the workpiece on which the circuit is formed is referred to as a "circuit surface". The surface opposite to the circuit surface of the workpiece is called the "back surface".
The workpiece is divided into chips by means of dicing or the like. In this specification, as in the case of the workpiece, the surface of the chip on which the circuit is formed is called the "circuit surface", and the surface opposite to the circuit surface of the chip is called the "back surface".
Both the circuit surface of the workpiece and the circuit surface of the chip are provided with projecting electrodes such as bumps and pillars. The projecting electrodes are preferably made of solder.

The support sheet may consist of one layer (single layer), or may consist of two or more layers. When the support sheet is composed of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.

The support sheet is preferably transparent and may be colored depending on the purpose.
When the resin film-forming layer has energy ray-curable properties, the support sheet is preferably one that allows energy rays to pass therethrough.

Examples of the support sheet include those comprising a substrate and a pressure-sensitive adhesive layer provided on one surface of the substrate; those comprising only a substrate; and the like. When the support sheet has a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is arranged between the substrate and the resin film-forming layer in the resin film-forming composite sheet.

When a support sheet comprising a substrate and an adhesive layer is used, the adhesiveness and peelability between the support sheet and the resin film-forming layer can be easily adjusted in the resin film-forming composite sheet.
When a support sheet consisting of only a substrate is used, a resin film-forming composite sheet can be produced at low cost.

An example of the support sheet of this embodiment will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view schematically showing an example of the support sheet of this embodiment. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there are cases where the main parts are enlarged for convenience, and the dimensional ratios of each component are the same as the actual ones. not necessarily.

A support sheet 10 shown in FIG. 1 has a pressure-sensitive adhesive layer 12 provided on one surface 11a of a substrate 11 (which may be referred to as “first surface 11a” in this specification).

Next, each layer constituting the support sheet 10 will be described in more detail.

○ Substrate The substrate is sheet-like or film-like, and examples of its constituent materials include various resins.
Examples of the resin include polyethylenes such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); Polyolefin; ethylene-based copolymers such as ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-norbornene copolymer (ethylene Polyvinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers (resins obtained using vinyl chloride as a monomer); Polystyrene; Polycycloolefin; Polyethylene terephthalate, polyethylene Polyesters such as naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalenedicarboxylate, and wholly aromatic polyesters in which all constituent units have aromatic cyclic groups; Poly(meth)acrylate; Polyurethane; Polyurethane acrylate; Polyimide; Polyamide; Polycarbonate; Fluororesin;

The constituent material of the base material preferably contains a polyolefin resin. Among these, polyolefins other than polyethylene are preferable, and polypropylene is more preferable.

Examples of the resin include polymer alloys such as mixtures of the polyester and other resins. The polymer alloy of the polyester and the resin other than polyester is preferably one in which the amount of the resin other than the polyester is relatively small.
Further, as the resin, for example, a crosslinked resin in which one or more of the resins exemplified above are crosslinked; Also included are resins.

The number of resins constituting the base material may be one, or two or more, and if two or more, the combination and ratio thereof can be arbitrarily selected.

The substrate may consist of one layer (single layer) or may consist of a plurality of layers of two or more layers. The combination of these multiple layers is not particularly limited.

The thickness of the substrate is preferably 50-300 μm, more preferably 60-100 μm. When the thickness of the base material is within such a range, the flexibility of the support sheet and the resin film-forming composite sheet and the suitability for application to a work are further improved.
Here, the "thickness of the base material" means the thickness of the entire base material. means.

The substrate may contain various known additives such as fillers, colorants, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc., in addition to the main constituent materials such as the resins.

The substrate is preferably transparent, and may be colored depending on the purpose, or may be deposited with other layers.

In order to adjust the adhesion with the pressure-sensitive adhesive layer or resin film forming layer provided thereon, the base material is roughened by sandblasting, solvent treatment, or the like; corona discharge treatment, electron beam irradiation treatment, plasma treatment, Ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, oxidation treatment such as hot air treatment; lipophilic treatment; hydrophilic treatment, etc. may be applied to the surface. Further, the substrate may have a primer-treated surface.

The base material may have tackiness on at least one surface by containing a specific range of components (eg, resin, etc.).

○ Manufacturing method of base material The base material can be manufactured by a known method. For example, a substrate containing a resin can be produced by molding a resin composition containing the resin.

The substrate is preferably a stretched film. The orientation direction of the substrate may be only the machine direction (MD) of the substrate or only the perpendicular direction (CD) of the substrate, and the machine direction (MD) and perpendicular direction (CD) biaxial Drawing is more preferred.

Since the substrate is a stretched film, the residual stress of the stretched film can reduce the average displacement (A _23→130 ) and the average displacement (A _60→130 ) of the support sheet. In particular, since the residual stress of the stretched film has a large effect of reducing the average displacement (A _60→130 ), the displacement at 130° C. (A ₁₃₀ ) and the ratio [(A _60→130 )/(A _{23 →130} )] can be reduced.

The stretching of the substrate is preferably under heating conditions. The temperature conditions for heating are adjusted according to the constituent material of the base material. For example, when the constituent material of the substrate is polypropylene, the heating temperature condition is preferably 100 to 140°C, more preferably 105 to 135°C, and even more preferably 110 to 130°C. .

The heating time condition is preferably 15 to 120 s, more preferably 30 to 100 s, even more preferably 45 to 80 s.

The stretching tension is preferably 1.0 to 6.0 N/m, more preferably 1.3 to 5.0 N/m, and further preferably 1.6 to 4.0 N/m. preferable.

O Adhesive Layer The adhesive layer is sheet-like or film-like and contains an adhesive resin.
Examples of the adhesive resin include acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polyvinyl ether, polycarbonate, and ester resin. Among these, acrylic resins are preferable from the viewpoint of adjusting the adhesion between the resin film forming layer and the resin film.

The pressure-sensitive adhesive layer may consist of one layer (single layer) or may consist of two or more layers. The combination of these multiple layers is not particularly limited.

The thickness of the pressure-sensitive adhesive layer is not particularly limited, but it is preferably 1 to 100 μm, more preferably 1 to 60 μm, because it becomes easier to adjust the adhesion between the resin film-forming layer and the resin film. more preferably 1 to 30 μm, even more preferably 1 to 15 μm, and particularly preferably 1 to 9 μm.
Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer. means the thickness of

The pressure-sensitive adhesive layer is preferably transparent and may be colored depending on the purpose.
When the resin film-forming layer has energy ray-curable properties, the pressure-sensitive adhesive layer preferably transmits energy rays.

The pressure-sensitive adhesive layer may be either energy ray-curable or non-energy ray-curable. The energy ray-curable pressure-sensitive adhesive layer can adjust physical properties before and after curing. For example, by curing the energy ray-curable adhesive layer before picking up a resin film-coated chip, which will be described later, the resin film-coated chip can be picked up more easily.

As used herein, the term "energy ray" means an electromagnetic wave or charged particle beam that has energy quanta. Examples of energy rays include ultraviolet rays, radiation, electron beams, and the like. Ultraviolet rays can be applied by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet light source. The electron beam can be generated by an electron beam accelerator or the like.
As used herein, "energy ray-curable" means the property of curing by irradiation with energy rays, and "non-energy ray-curable" means the property of not curing even when irradiated with energy rays. do.
In addition, "non-curing" means the property of not being cured by any means such as heating or irradiation with energy rays.

When the pressure-sensitive adhesive layer is energy ray-curable, the energy ray-curable pressure-sensitive adhesive composition includes, for example, a non-energy ray-curable adhesive acrylic resin (I -1a) (hereinafter sometimes abbreviated as “adhesive resin (I-1a)”) and an energy ray-curable compound (I-1); non-energy ray-curable Energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the adhesive resin (I-1a) (hereinafter abbreviated as “adhesive resin (I-2a)” a pressure-sensitive adhesive composition (I-2) containing the adhesive resin (I-2a); and a pressure-sensitive adhesive composition (I-3) containing the above-mentioned adhesive resin (I-2a) and an energy ray-curable compound. be done.

When the pressure-sensitive adhesive layer is non-energy ray-curable, the non-energy ray-curable pressure-sensitive adhesive composition includes, for example, a pressure-sensitive adhesive composition containing the non-energy ray-curable adhesive resin (I-1a). (I-4) and the like.

[Non-energy ray-curable adhesive resin (I-1a)]
The adhesive resin (I-1a) is an adhesive acrylic resin having a functional group such as a hydroxyl group.
Examples of the acrylic resin include acrylic polymers having structural units derived from hydroxyl group-containing monomers and structural units derived from (meth)acrylic acid alkyl esters.
Examples of the (meth)acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is linear or branched. is preferred.

The acrylic resin is a resin containing structural units derived from a (meth)acrylic acid ester, which is a monomer. As used herein, "derived from" means that the monomer has undergone a structural change necessary for it to polymerize.
In this specification, "(meth)acrylic acid" is a concept that includes both "acrylic acid" and "methacrylic acid". The same is true for (meth)acrylic acid and similar terms.

The acrylic polymer may further have a structural unit derived from a functional group-containing monomer other than the hydroxyl group-containing monomer, in addition to the structural unit derived from the hydroxyl group-containing monomer and the structural unit derived from the (meth)acrylic acid alkyl ester. .
Examples of the functional group-containing monomer include, for example, the functional group acting as a starting point for crosslinking by reacting with a crosslinking agent described later, or isocyanate group, glycidyl group, etc. in the unsaturated group-containing compound described later. Examples include those capable of introducing unsaturated groups into side chains of acrylic polymers by reacting with functional groups.

Examples of the functional group-containing monomer include hydroxyl group-containing monomers as well as carboxy group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

The acrylic polymer may further have structural units derived from other monomers in addition to structural units derived from (meth)acrylic acid alkyl esters and structural units derived from functional group-containing monomers.
The other monomer is not particularly limited as long as it is copolymerizable with (meth)acrylic acid alkyl ester or the like.
Examples of the other monomers include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile and acrylamide.

The pressure-sensitive adhesive composition (I-1), the pressure-sensitive adhesive composition (I-2), the pressure-sensitive adhesive composition (I-3) and the pressure-sensitive adhesive composition (I-4) (hereinafter, including these pressure-sensitive adhesive compositions and abbreviated as "adhesive compositions (I-1) to (I-4)"), the acrylic resin such as the acrylic polymer may have only one structural unit, or , may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the ratio of the amount of structural units derived from the functional group-containing monomer to the total amount of the structural units is preferably 1 to 35% by mass.

The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) or the pressure-sensitive adhesive composition (I-4) may be only one type, or may be two or more types. , two or more thereof, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (I-1) or the pressure-sensitive adhesive composition (I-4), the content ratio of the pressure-sensitive adhesive resin (I-1a) to the total weight of the pressure-sensitive adhesive layer is preferably 5 to 99% by mass, and may be, for example, 25 to 98% by mass, 45 to 97% by mass, or 65 to 96% by mass.

[Energy ray-curable adhesive resin (I-2a)]
The adhesive resin (I-2a) is obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound is capable of bonding with the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group. It is a compound having a group.
Examples of the energy ray polymerizable unsaturated group include (meth)acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like, and (meth)acryloyl group is preferred.
Groups capable of bonding with functional groups in the adhesive resin (I-1a) include, for example, an isocyanate group and a glycidyl group capable of bonding with a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding with a carboxy group or an epoxy group. etc.

Examples of the unsaturated group-containing compound include (meth)acryloyloxyethyl isocyanate, (meth)acryloylisocyanate, glycidyl (meth)acrylate, and the like.

The pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) or (I-3) may be only one type, may be two or more types, or may be two or more types. , the combination and ratio thereof can be arbitrarily selected.

In the adhesive layer formed from the adhesive composition (I-2) or (I-3), the content ratio of the adhesive resin (I-2a) with respect to the total weight of the adhesive layer is 5 to It is preferably 99% by mass.

[Energy ray-curable compound]
The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) or (I-3) is a monomer or oligomer having an energy ray-polymerizable unsaturated group and curable by energy ray irradiation. is mentioned.

Among energy ray-curable compounds, monomers include, for example, trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4 -polyvalent (meth)acrylates such as butylene glycol di(meth)acrylate, 1,6-hexanediol (meth)acrylate; urethane (meth)acrylates; polyester (meth)acrylates; polyether (meth)acrylates; meth)acrylate and the like.
Among energy ray-curable compounds, examples of oligomers include oligomers that are polymers of the above-exemplified monomers.

The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) or (I-3) may be only one kind, may be two or more kinds, or may be two or more kinds. In that case, their combination and ratio can be arbitrarily selected.

In the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (I-1) or (I-3), the content ratio of the energy ray-curable compound with respect to the total weight of the pressure-sensitive adhesive layer is 1 to 95 mass. %.

[Crosslinking agent]
The adhesive compositions (I-1) to (I-4) preferably further contain an isocyanate cross-linking agent.

The cross-linking agent reacts with the hydroxyl groups to cross-link the adhesive resins (I-1a) or the adhesive resins (I-2a).

In the adhesive compositions (I-1) to (I-4), the content of the cross-linking agent is 0.01 to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (I-1a). For example, it may be any one of 1 to 40 parts by mass, 5 to 35 parts by mass, and 10 to 30 parts by mass.
Examples of the cross-linking agent include those similar to “(cross-linking agent)” mentioned in the protective film-forming composition (III-1) described later.

[Photoinitiator]
Adhesive compositions (I-1), (I-2) and (I-3) (hereinafter, these adhesive compositions are collectively referred to as "adhesive compositions (I-1) to (I-3) ”) may further contain a photopolymerization initiator. The adhesive compositions (I-1) to (I-3) containing a photopolymerization initiator undergo sufficient curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator include those similar to the “(photopolymerization initiator)” exemplified in the protective film-forming composition (III-1) described below.

The photopolymerization initiators contained in the pressure-sensitive adhesive compositions (I-1) to (I-3) may be only one type, or may be two or more types. Any combination and ratio thereof can be selected.

In the adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the energy ray-curable compound.
In the adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the adhesive resin (I-2a). .
In the adhesive composition (I-3), the content of the photopolymerization initiator is 0.01 to 0.01 with respect to 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable compound. It is preferably 20 parts by mass.

[Other additives]
The pressure-sensitive adhesive compositions (I-1) to (I-4) may contain other additives that do not fall under any of the above components within the range that does not impair the effects of the present invention.
Examples of other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers. , a reaction retardant, a cross-linking accelerator (catalyst), and other known additives.
In addition, the reaction retarder is, for example, the action of a catalyst mixed in the adhesive compositions (I-1) to (I-4) during storage, the pressure-sensitive adhesive compositions (I-1) to ( In I-4), it is a component that suppresses the progress of an unintended cross-linking reaction. Examples of the reaction retarder include those that form a chelate complex by chelating the catalyst, more specifically those having two or more carbonyl groups (-C(=O)-) in one molecule. mentioned.

The other additives contained in the pressure-sensitive adhesive compositions (I-1) to (I-4) may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

The content of other additives in the pressure-sensitive adhesive compositions (I-1) to (I-4) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive compositions (I-1) to (I-4) may contain a solvent. Since the pressure-sensitive adhesive compositions (I-1) to (I-4) contain a solvent, the coating suitability to the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; cyclohexane, n-hexane, and the like. aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol.

The solvents contained in the pressure-sensitive adhesive compositions (I-1) to (I-4) may be one kind, or may be two or more kinds, and when there are two or more kinds, combinations thereof and ratio can be selected arbitrarily.

The solvent content of the pressure-sensitive adhesive compositions (I-1) to (I-4) is not particularly limited, and may be adjusted as appropriate.

○ Production method of adhesive composition The adhesive compositions such as adhesive compositions (I-1) to (I-4) contain the adhesive resin and, if necessary, components other than the adhesive resin. , obtained by blending each component for constituting the pressure-sensitive adhesive composition.
There are no particular restrictions on the order of addition of each component when blending, and two or more components may be added at the same time.
The method of mixing each component at the time of blending is not particularly limited, and may be selected from known methods such as a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves. It can be selected as appropriate.
The temperature and time at which each component is added and mixed are not particularly limited as long as each compounded component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30°C.

○Method for producing pressure-sensitive adhesive layer The pressure-sensitive adhesive layer can be formed using a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin. For example, the pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition to the surface on which the pressure-sensitive adhesive layer is to be formed, and drying it as necessary. The content ratio of the components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the content ratio of the components in the pressure-sensitive adhesive layer.

Coating of the pressure-sensitive adhesive composition may be performed by a known method, for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, screen coater. , Meyer bar coater, kiss coater and the like.

Drying conditions for the pressure-sensitive adhesive composition are not particularly limited. However, when the pressure-sensitive adhesive composition contains a solvent, it is preferable to heat and dry it. The solvent-containing pressure-sensitive adhesive composition is preferably dried by heating, for example, at 70 to 130° C. for 10 seconds to 5 minutes.

◇Manufacturing Method of Supporting Sheet When a pressure-sensitive adhesive layer is provided on a substrate, for example, the pressure-sensitive adhesive composition may be applied onto the substrate and dried as necessary. Further, for example, the adhesive composition is applied on the release film and dried as necessary to form an adhesive layer on the release film, and the exposed surface of the adhesive layer is applied to the substrate. You may laminate|stack an adhesive layer on a base material by bonding together to one surface of. In this case, the release film may be removed either during the manufacturing process or during the use process of the resin film-forming composite sheet.

The support sheet 10 is preferably roll-shaped.
When the support sheet 10 is in a roll shape, the longitudinal direction of the support sheet 10 is the machine direction (MD), and the width direction of the support sheet 10 is the vertical direction (CD), regardless of whether or not the support sheet 10 is stretched. be.

<<Composite sheet for resin film formation>>
A resin film-forming composite sheet according to an embodiment of the present invention includes the support sheet 10 according to the above-described embodiment of the present invention, and a resin film-forming layer provided on one surface of the support sheet 10. .
An example of the resin film-forming composite sheet of the present embodiment will be described below with reference to the drawings.

FIG. 2 is a cross-sectional view schematically showing an example of the resin film-forming composite sheet of the present embodiment.
In the drawings after FIG. 2, the same constituent elements as those shown in already explained figures are given the same reference numerals as in the already explained figures, and detailed explanations thereof will be omitted.

The resin film-forming composite sheet 101 shown here includes a support sheet 10 and a resin film provided on one surface (in this specification, sometimes referred to as a "first surface") 10a of the support sheet 10. and a forming layer 13 .
The support sheet 10 includes a substrate 11 and an adhesive layer 12 provided on one surface (first surface) 11 a of the substrate 11 . In the resin film-forming composite sheet 101 , the pressure-sensitive adhesive layer 12 is arranged between the substrate 11 and the resin film-forming layer 13 .

That is, the resin film-forming composite sheet 101 is configured by laminating a substrate 11, an adhesive layer 12, and a resin film-forming layer 13 in this order in the thickness direction thereof.
The first surface 10a of the support sheet 10 is the same as the surface 12a of the pressure-sensitive adhesive layer 12 on the side opposite to the substrate 11 side (in this specification, this may be referred to as the "first surface").

The resin film-forming composite sheet 101 further includes a jig adhesive layer 16 and a release film 15 on the resin film-forming layer 13 .
In the resin film-forming composite sheet 101, the resin film-forming layer 13 is laminated on the entire surface or substantially the entire surface of the first surface 12a of the adhesive layer 12, and the adhesive layer 12 side of the resin film-forming layer 13 is opposite to the adhesive layer 12 side. A jig adhesive layer 16 is laminated on a part of the surface (in this specification, sometimes referred to as "first surface") 13a, that is, a region in the vicinity of the peripheral edge. Further, of the first surface 13a of the resin film-forming layer 13, the region where the jig-forming adhesive layer 16 is not laminated and the surface of the jig-forming adhesive layer 16 opposite to the resin film forming layer 13 side A release film 15 is laminated on 16a (which may be referred to as a "first surface" in this specification). A support sheet 10 is provided on a surface 13b of the resin film forming layer 13 opposite to the first surface 13a (in this specification, this may be referred to as a "second surface").

Not only in the case of the composite sheet for resin film formation 101, but also in the composite sheet for resin film formation of the present embodiment, the release film has an arbitrary configuration. It may or may not be provided.

The jig adhesive layer 16 is used to fix the resin film-forming composite sheet 101 to a fixing jig 18 such as a ring frame.
The jig adhesive layer 16 may have, for example, a single-layer structure containing an adhesive component, or may contain a sheet serving as a core material and an adhesive component provided on both sides of the sheet. You may have a multi-layer structure comprising a layer that

The adhesive constituting the jig adhesive layer 16 preferably has desired adhesive strength and removability, and examples thereof include acrylic adhesives, rubber adhesives, silicone adhesives, and urethane adhesives. , polyester-based adhesives, polyvinyl ether-based adhesives, and the like can be used. Among these, it has high adhesiveness to the fixing jig 18 such as a ring frame, and effectively suppresses peeling of the composite sheet for protective film formation from the fixing jig 18 such as a ring frame in a dicing process or the like. An acrylic pressure-sensitive adhesive that can be used is preferred. In addition, a base material as a core material may be interposed in the middle of the thickness direction of the pressure-sensitive adhesive layer for jig.

The adhesive layer for jigs can be formed using an adhesive composition for jigs containing an adhesive resin. For example, the adhesive layer for jigs can be formed on the target site by applying the adhesive composition for jigs to the surface on which the adhesive layer for jigs is to be formed and drying it. Examples of the adhesive composition for jigs include compositions similar to the adhesive compositions (I-1) to (I-4). In the pressure-sensitive adhesive composition for jigs, the content ratio of the components that do not vaporize at room temperature is usually the same as the content ratio of the components in the pressure-sensitive adhesive layer for jigs.

On the other hand, the thickness of the jig adhesive layer is preferably 5 to 200 μm, particularly preferably 10 to 100 μm, from the viewpoint of adhesion to the fixing jig 18 such as a ring frame.

In the composite sheet for resin film formation 101, the back surface of the work is attached to the first surface 13a of the resin film forming layer 13 in a state in which the release film 15 is removed, and the first surface of the adhesive layer 16 for jig is attached. 16a is used by being attached to a fixing jig 18 such as a ring frame.

FIG. 3 is a cross-sectional view schematically showing another example of the resin film-forming composite sheet of the present embodiment.
The resin film-forming composite sheet 102 shown here differs in the shape and size of the resin film-forming layer, and the adhesive layer for jig is not on the first surface of the resin film-forming layer, but on the first surface of the adhesive layer. It is the same as the composite sheet for resin film formation 101 shown in FIG. 2 except that it is laminated.

More specifically, in the resin film-forming composite sheet 102, the resin film-forming layer 23 is a partial region of the first surface 12a of the adhesive layer 12, that is, the width direction of the adhesive layer 12 ( left-to-right direction). Furthermore, a jig adhesive is applied to a region of the first surface 12a of the adhesive layer 12 where the resin film forming layer 23 is not laminated so as to surround the resin film forming layer 23 from the outside in the width direction without contact. An agent layer 16 is laminated. A surface 23 a of the resin film forming layer 23 opposite to the adhesive layer 12 side (in this specification, may be referred to as a “first surface”) and a first adhesive layer 16 of the jig adhesive layer 16 . A release film 15 is laminated on the surface 16a. A support sheet 10 is provided on a surface 23b of the resin film forming layer 23 opposite to the first surface 23a (in this specification, this may be referred to as a "second surface").

FIG. 4 is a cross-sectional view schematically showing still another example of the resin film-forming composite sheet of the present embodiment.
The resin film-forming composite sheet 103 shown here is the same as the resin film-forming composite sheet 102 shown in FIG. 3 except that the jig layer 16 is not provided.

FIG. 5 is a cross-sectional view schematically showing still another example of the resin film-forming composite sheet of the present embodiment.
The resin film-forming composite sheet 104 shown here is the same as the resin film-forming composite sheet 101 shown in FIG.

The support sheet 20 consists of the base material 11 only.
That is, the resin film-forming composite sheet 104 is configured by laminating the substrate 11 and the resin film-forming layer 13 in the thickness direction thereof.
A surface (first surface) 20 a of the support sheet 20 on the resin film forming layer 13 side is the same as the first surface 11 a of the substrate 11 .
The base material 11 has adhesiveness at least on its first surface 11a.

The composite sheet for forming a resin film of the present embodiment is not limited to those shown in FIGS. 2 to 5, and part of the configuration of those shown in FIGS. Alternatively, it may be deleted, or another configuration may be added to what has been described so far.

○Resin film-forming layer The resin film-forming layer is used by attaching it to the back surface of the workpiece in the method of manufacturing a chip with a resin film. The resin film-forming layer is preferably a protective film-forming film used to protect the back surface of the work or chips obtained by dividing the work.

By using the resin film-forming composite sheet or the kit comprising the support sheet and the resin film-forming layer, a chip and a resin film provided on the back surface of the chip can be obtained by a method for manufacturing a chip with a resin film, which will be described later. and a chip with a resin film can be manufactured.

When the resin film-forming layer is a protective film-forming film, by using the protective film-forming composite sheet or the kit comprising the support sheet and the protective film-forming film, a resin film-coated chip manufacturing method described later can be used. , and a protective film provided on the back surface of the chip.

Furthermore, a substrate device can be manufactured by using the chip with the resin film.
As used herein, the term "substrate device" means a chip with a resin film that is flip-chip connected to connection pads on a circuit board at protruding electrodes on the circuit surface of the chip. For example, if a semiconductor wafer is used as the wafer, the substrate device may be a semiconductor device.

The resin film-forming layer is preferably thermosetting. The resin film-forming layer can be formed using a resin film-forming composition. In particular, when the resin film-forming layer is a thermosetting protective film-forming film, the protective film-forming film can be formed using a protective film-forming composition described below. It can be formed using the composition (III-1) for

<Protective film forming composition (III-1)>
Examples of the resin film-forming composition include a protective film-forming composition (III-1) containing a polymer component (A) and a thermosetting component (B) (in the present specification, “protective film-forming (sometimes abbreviated as "composition for use (III-1)").

[Polymer component (A)]
The polymer component (A) is a polymer compound for imparting film-forming properties, flexibility, etc. to the thermosetting protective film-forming film.
The protective film-forming composition (III-1) and the polymer component (A) contained in the thermosetting protective film-forming film may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

A polymer component may also correspond to a curable component. As used herein, when the protective film-forming composition contains components corresponding to both the polymer component and the curable component, the protective film-forming composition contains the polymer component and the curable component. consider it to be.

As the polymer component, acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin, etc. can be used. An acrylic resin is preferably used as the polymer component.

The weight average molecular weight (Mw) of the polymer component is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,200,000. When the weight-average molecular weight of the polymer component is equal to or higher than the above lower limit, the adhesion to the support sheet 10 tends to decrease, and the adhesion between the support sheet and the protective film can be reduced. Adhesiveness of a support sheet and a protective film formation film can be improved as the weight average molecular weight of a polymer component is below the said upper limit.

The glass transition temperature (Tg) of the polymer component is preferably -60 to 50°C, more preferably -50 to 40°C, particularly preferably -40 to 30°C.
When the glass transition temperature of the polymer component is at least the above lower limit, the adhesion between the support sheet and the protective film can be reduced. When the glass transition temperature of the polymer component is equal to or lower than the above upper limit, the adhesion between the support sheet and the protective film-forming film can be improved, and cracks occur when the protective film-forming film is bent in a rolled form. risk of occurrence is reduced.

From the viewpoint of adhesiveness, adhesiveness and film-forming properties, the preferred content of the polymer component is 5 to 50 parts by mass, 10 to 45 parts by mass, and 14 to 40 parts by mass with respect to the total weight of the protective film forming film 100. , 18 to 35 parts by mass.

The glass transition temperature (Tg) of the resin constituting the polymer component can be obtained by calculation using the following Fox equation.
1/Tg=(W1/Tg1)+(W2/Tg2)+...+(Wm/Tgm) (Wherein, Tg is the glass transition temperature of the resin constituting the polymer component, and Tg1, Tg2,... Tgm are It is the glass transition temperature of the homopolymer of each monomer that is the raw material of the resin that constitutes the polymer component, and W1, W2, ... Wm is the mass fraction of each monomer, where W1 + W2 + ... + Wm = 1 is.)
For the glass transition temperature of the homopolymer of each monomer in the Fox formula, values described in Polymer Data Handbook, Adhesive Handbook, Polymer Handbook, etc. can be used. For example, the glass transition temperatures of homopolymers are 10° C. for methyl acrylate, 105° C. for methyl methacrylate, −54° C. for n-butyl acrylate, −70° C. for 2-ethylhexyl acrylate, 41° C. for glycidyl methacrylate, and 41° C. for 2-hydroxyethyl Acrylates are at -15°C.

Monomers constituting the acrylic resin include (meth)acrylic acid ester monomers and derivatives thereof. For example, alkyl (meth)acrylates having 1 to 18 carbon atoms in the alkyl group, specifically methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (Meth)acrylate and the like. Also, (meth)acrylates having a cyclic skeleton, specifically cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, imide (meth)acrylate and the like. Furthermore, functional group-containing monomers include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, etc. having a hydroxyl group; and glycidyl (meth) acrylate having an epoxy group. etc. As the acrylic resin, an acrylic polymer containing a structural unit having a hydroxyl group is preferable because it has good compatibility with the curable component described later. The acrylic polymer may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, or the like.

(Curable component)
A thermosetting component (B) is used as the curable component, for example. Thereby, the protective film-forming film can be made thermosetting.

By using a thermosetting protective film-forming film, even if the protective film-forming film is thickened, it can be thermally cured easily. In the heat curing process, batch curing of a large number of works is possible.

A thermosetting resin and a thermosetting agent are used as the thermosetting component. As the thermosetting resin, for example, an epoxy resin is preferable.

A conventionally well-known epoxy resin can be used as the epoxy resin. Specific examples of epoxy resins include polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and hydrogenated products thereof, orthocresol novolak epoxy resins, dicyclopentadiene type epoxy resins, biphenyl type epoxy resins, and bisphenol A. epoxy resins, bisphenol F type epoxy resins, phenylene skeleton type epoxy resins, and other epoxy compounds having two or more functional groups in the molecule. These can be used individually by 1 type or in combination of 2 or more types.

The preferred content of the thermosetting component is preferably 1 to 75 parts by mass, more preferably 2 to 60 parts by mass, more preferably 3 to 50 parts by mass, based on 100 parts by mass of the protective film-forming film. More preferably, it may be 4 to 40 parts by mass, 5 to 35 parts by mass, or 6 to 30 parts by mass.
When the content of the thermosetting resin is at least the above lower limit, the protective film can obtain sufficient adhesion to the work, and the protective film has excellent performance to protect the work. Excellent storage stability when stored as a body.

Thermosetting agents function as curing agents for thermosetting resins, especially epoxy resins. Preferred heat curing agents include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. The functional groups include phenolic hydroxyl groups, alcoholic hydroxyl groups, amino groups, carboxyl groups and acid anhydrides. Among these, phenolic hydroxyl groups, amino groups and acid anhydrides are preferred, and phenolic hydroxyl groups and amino groups are more preferred.

Specific examples of phenol-based curing agents include polyfunctional phenol resins, biphenols, novolac-type phenol resins, dicyclopentadiene-type phenol resins, Zyloc-type phenol resins, and aralkyl phenol resins. A specific example of the amine curing agent is DICY (dicyandiamide). These can be used individually by 1 type or in mixture of 2 or more types.

The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, based on 100 parts by mass of the thermosetting resin. When the content of the thermosetting agent is at least the above lower limit, sufficient curing and adhesion can be obtained, and when it is at most the above upper limit, the moisture absorption rate of the protective film is suppressed and the adhesion reliability between the workpiece and the protective film is improved. do.

The protective film-forming composition (III-1) may contain an energy ray-curable component. As the energy ray-curable component, a low-molecular weight compound (energy ray-polymerizable compound) that contains an energy ray-polymerizable group and polymerizes and cures when irradiated with an energy ray such as an ultraviolet ray or an electron beam can be used. Specific examples of such energy ray-curable components include trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, and 1,4-butylene glycol. Acrylate compounds such as diacrylates, 1,6-hexanediol diacrylates, polyethylene glycol diacrylates, oligoester acrylates, urethane acrylate oligomers, epoxy modified acrylates, polyether acrylates and itaconic acid oligomers. Such compounds have at least one polymerizable double bond in the molecule and usually have a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000. A preferable content of the energy ray-curable component is preferably 1 to 30 parts by mass, more preferably 5 to 25 parts by mass, based on 100 parts by weight of the protective film-forming film.

As the energy ray-curable component, an energy ray-curable polymer in which an energy ray-polymerizable group is bonded to the main chain or side chain of the polymer component may be used. Such an energy ray-curable polymer has both a function as a polymer component and a function as a curable component.

The main skeleton of the energy ray-curable polymer is not particularly limited, and may be an acrylic polymer commonly used as a polymer component, or may be polyester, polyether, or the like. It is particularly preferable to use an acrylic polymer as the main skeleton because it is easy to control.

The energy ray-polymerizable group bonded to the main chain or side chain of the energy ray-curable polymer is, for example, a group containing an energy ray-polymerizable carbon-carbon double bond, specifically a (meth)acryloyl group, or the like. can be exemplified. The energy ray-polymerizable group may be bonded to the energy ray-curable polymer via an alkylene group, alkyleneoxy group, or polyalkyleneoxy group.

The weight average molecular weight (Mw) of the energy ray-curable polymer is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. The glass transition temperature (Tg) of the energy ray-curable polymer is preferably -60 to 50°C, more preferably -50 to 40°C, and most preferably -40 to 30°C.

The energy ray-curable polymer includes, for example, an acrylic resin containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, an epoxy group, a substituent reacting with the functional group, and an energy ray-polymerizable carbon. - Obtained by reacting with a polymerizable group-containing compound having 1 to 5 carbon double bonds per molecule. Substituents that react with the functional group include an isocyanate group, a glycidyl group, a carboxyl group, and the like.

Polymerizable group-containing compounds include (meth)acryloyloxyethyl isocyanate, meta-isopropenyl-α,α-dimethylbenzyl isocyanate, (meth)acryloylisocyanate, allyl isocyanate, glycidyl (meth)acrylate; (meth)acrylic acid, etc. is mentioned.

Acrylic resins are (meth)acrylic monomers or derivatives thereof having functional groups such as hydroxyl groups, carboxyl groups, amino groups, substituted amino groups, epoxy groups, and other (meth)acrylic acid ester monomers copolymerizable therewith. or a derivative thereof.

(Meth)acrylic monomers or derivatives thereof having functional groups such as hydroxyl group, carboxyl group, amino group, substituted amino group and epoxy group include, for example, 2-hydroxyethyl (meth)acrylate having a hydroxyl group, 2-hydroxy propyl (meth)acrylate; acrylic acid, methacrylic acid and itaconic acid having a carboxyl group; glycidyl methacrylate and glycidyl acrylate having an epoxy group;

Other (meth)acrylic acid ester monomers copolymerizable with the above monomers or derivatives thereof include, for example, alkyl (meth)acrylates in which the alkyl group has 1 to 18 carbon atoms, specifically methyl (meth)acrylate. , ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate and the like; (meth)acrylates having a cyclic skeleton, specifically cyclohexyl (meth)acrylate, benzyl (meth)acrylate, isobornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate and the like. The acrylic resin may be copolymerized with vinyl acetate, acrylonitrile, styrene, or the like.

Even when an energy ray-curable polymer is used, the energy ray-polymerizable compound described above may be used in combination, or a polymer component may be used in combination.

The protective film-forming film can contain the following components in addition to the above polymer component and curable component.

(coloring agent)
The protective film-forming film preferably contains a coloring agent. By adding a coloring agent to the protective film-forming film, when the semiconductor device is incorporated in equipment, it is possible to shield infrared rays and the like generated from surrounding devices and prevent the semiconductor device from malfunctioning due to them. In a semiconductor device or semiconductor chip with a protective film, the product number, etc. is usually printed on the surface of the protective film by a laser marking method. A sufficient contrast difference can be obtained between the exposed portion and the non-exposed portion, and the visibility is improved. Organic or inorganic pigments and dyes are used as colorants. Pigments are preferred from the viewpoint of heat resistance and the like. Examples of pigments include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited to these. Among them, carbon black is particularly preferable from the viewpoint of handling property and dispersibility. One colorant may be used alone, or two or more colorants may be used in combination.

The content of the colorant is preferably 0.05 to 35 parts by mass, more preferably 0.1 to 25 parts by mass, particularly preferably 0.1 to 25 parts by mass, based on 100 parts by mass of the total solid content constituting the protective film-forming film. 2 to 15 parts by mass.

(Curing accelerator)
A curing accelerator is used to adjust the curing speed of the protective film-forming film. A curing accelerator is preferably used, particularly in the thermosetting component (B), when an epoxy resin and a thermosetting agent are used in combination.

Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine and triphenylphosphine; Tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate, triphenylphosphine tetraphenylborate and the like are included. These can be used singly or in combination of two or more.

The curing accelerator is contained in an amount of preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the curable component. By containing the curing accelerator in an amount within the above range, it has excellent adhesion properties even when exposed to high temperature and high humidity conditions, and achieves high adhesion reliability even when exposed to severe reflow conditions. can do.

(coupling agent)
A coupling agent may be used to improve the adhesion reliability of the protective film to the workpiece. Moreover, by using a coupling agent, the water resistance can be improved without impairing the heat resistance of the protective film obtained by curing the protective film-forming film.

As the coupling agent, a compound having a group that reacts with the functional group of the polymer component, the curable component, etc. is preferably used. A silane coupling agent is desirable as the coupling agent. Such coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-(methacryloxypropyl ) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropylmethyldiethoxysilane, N- Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane silane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, and the like. These can be used singly or in combination of two or more.

The coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass, with respect to the total 100 parts by mass of the polymer component and the curable component. included at a rate of If the content of the coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, outgassing may occur.

(filler)
By blending the filler into the protective film forming film, it is possible to adjust the thermal expansion coefficient of the protective film after curing. Adhesion reliability between the work and the protective film can be improved. An inorganic filler is preferred as the filler. In addition, it is also possible to reduce the moisture absorption rate of the protective film after curing.

Preferable inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, beads obtained by spheroidizing these powders, single crystal fibers and glass fibers. Among these, silica filler and alumina filler are preferred. The above inorganic fillers may be used alone or in combination of two or more. The content of the inorganic filler can be 1 to 85 parts by mass, 5 to 80 parts by mass, or 10 to 75 parts by mass with respect to 100 parts by mass of the total solid content constituting the protective film-forming film. It can be 20 to 70 parts by mass, or 30 to 66 parts by mass.
By setting the content of the inorganic filler to the above upper limit or less, it is possible to reduce the risk of cracks occurring when the protective film forming film is rolled and bent, and the content of the inorganic filler is less than or equal to the above lower limit. By doing so, the heat resistance of the protective film can be improved.

(Photoinitiator)
When the protective film-forming film contains an energy ray-curable component, the energy ray-curable component is cured by irradiating energy rays such as ultraviolet rays when using the film. At this time, by including a photopolymerization initiator in the composition, the polymerization curing time and the amount of light irradiation can be reduced.

Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, α-hydroxycyclohexylphenyl ketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl -1-[4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and β-chloroanthraquinone. A photoinitiator can be used individually by 1 type or in combination of 2 or more types.

The mixing ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, per 100 parts by mass of the energy ray-curable component. If it is at least the above lower limit value, satisfactory protective performance can be obtained by photopolymerization, and if it is at most the above upper limit value, the formation of residues that do not contribute to photopolymerization is suppressed, and the curability of the protective film-forming film is sufficiently improved. can be

(crosslinking agent)
A cross-linking agent can also be added in order to adjust the adhesion and cohesiveness of the protective film-forming film to the workpiece. Examples of cross-linking agents include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

Examples of the organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. and a terminal isocyanate urethane prepolymer obtained by reacting with a polyol compound.

Examples of organic polyvalent isocyanate compounds include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane -2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, trimethylolpropane adduct tolylene diisocyanate and lysine Isocyanates can be mentioned.

Examples of the organic polyvalent imine compounds include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri -β-aziridinylpropionate and N,N'-toluene-2,4-bis(1-aziridinecarboxamido)triethylene melamine.

The crosslinking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the total amount of the polymer component and the energy ray-curable polymer. Used in part ratio.

(general-purpose additive)
In addition to the above, various additives may be added to the protective film-forming film, if necessary.
Various additives include tackifiers, leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents and the like.

(solvent)
The protective film-forming composition preferably further contains a solvent. A protective film-forming composition containing a solvent is easy to handle.
Although the solvent is not particularly limited, preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol), and 1-butanol. esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone;
The solvent contained in the protective film-forming composition may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The solvent contained in the protective film-forming composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the composition can be more uniformly mixed.

A protective film-forming film obtained by applying and drying a protective film-forming composition comprising the components described above has adhesiveness and curability, and is pressure-bonded to a work in an uncured state. You may heat a protective film formation film, when pressure-bonding. After curing, it can finally provide a protective film with high impact resistance, has excellent adhesiveness, and can maintain a sufficient protective function even under severe conditions of high temperature and high humidity. The protective film-forming film may have a single-layer structure, or may have a multi-layer structure as long as it contains one or more layers containing the above components.

The thickness of the protective film-forming film is not particularly limited, but may be 3 to 300 μm, 3 to 200 μm, 5 to 100 μm, 7 to 80 μm, 10 It can be ~70 μm, it can be 12-60 μm, it can be 15-50 μm, it can be 18-40 μm, it can be 20-30 μm.
When the thickness of the protective film-forming film is at least the above lower limit value, the protective performance of the protective film can be made sufficient, and when it is at most the above upper limit value, costs can be reduced.

○Method for Producing Resin Film-Forming Composition A resin film-forming composition such as the protective film-forming composition (III-1) is obtained by blending each component for constituting the composition.
There are no particular restrictions on the order of addition of each component when blending, and two or more components may be added at the same time.
When a solvent is used, the solvent may be mixed with any compounding component other than the solvent and used by diluting this compounding component in advance, or any compounding component other than the solvent may be diluted in advance. You may use by mixing a solvent with these compounding ingredients, without preserving.
The method of mixing each component at the time of blending is not particularly limited, and may be selected from known methods such as a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves. It can be selected as appropriate.
The temperature and time at which each component is added and mixed may be appropriately adjusted in consideration of the conditions under which each compounded component is unlikely to deteriorate, but the temperature is preferably 15 to 30°C.

◇Method for producing a composite sheet for forming a resin film In the composite sheet for forming a resin film, the above layers are laminated so as to have a corresponding positional relationship, and the shapes of some or all of the layers are adjusted as necessary. Therefore, it can be manufactured. The method for forming each layer is as described above.

It is possible to directly form a resin film-forming layer by further coating the resin film-forming composition on the pressure-sensitive adhesive layer laminated on the substrate. In this way, a new layer (hereinafter abbreviated as "second layer") is formed on any layer (hereinafter abbreviated as "first layer") laminated on the base material, When forming a continuous two-layer laminated structure (in other words, a laminated structure of a first layer and a second layer), a composition for forming the second layer is applied onto the first layer. Then, if necessary, a method of drying can be applied.
However, the second layer is formed in advance on a release film using a composition for forming it, and the side opposite to the side of the formed second layer that is in contact with the release film It is preferable to form a continuous two-layer laminated structure by bonding the exposed surface of the first layer to the exposed surface of the first layer. At this time, the composition is preferably applied to the release-treated surface of the release film. The release film may be removed as necessary after the laminated structure is formed.
Here, the case of laminating the resin film-forming layer on the pressure-sensitive adhesive layer is taken as an example, but for example, when laminating a layer (film) other than the resin film-forming layer on the pressure-sensitive adhesive layer, the target lamination Any structure can be selected.

In this way, all the layers other than the base material constituting the composite sheet for resin film formation can be formed in advance on a release film and laminated on the surface of the desired layer by lamination. A resin film-forming composite sheet may be produced by appropriately selecting a layer that employs such a step as leverage.

The composite sheet for resin film formation is usually stored with a release film attached to the surface of the outermost layer (for example, the resin film formation layer) on the side opposite to the support sheet. Therefore, a resin film-forming layer is formed on the release film by applying a resin film-forming composition onto the release film (preferably the release-treated surface) and drying it as necessary. The remaining layers are laminated by any of the above-described methods on the exposed surface of the resin film-forming layer opposite to the side in contact with the release film, and the release film is not removed and the laminate is left as it is. By doing so, a composite sheet for resin film formation with a release film is obtained.

When the resin film-forming layer is a protective film-forming film, the protective film-forming composite sheet comprising the support sheet and the protective film-forming film is obtained.

The resin film-forming composite sheet may be in the form of a sheet, and preferably in the form of a roll.

<< Kit >>
A kit according to an embodiment of the present invention includes a first laminate in which a first release film, a resin film-forming layer, and a second release film are laminated in this order; and the support sheet used to support the resin film forming layer.
An example of the kit 1 of this embodiment will be described below with reference to the drawings.

FIG. 6 is a cross-sectional view schematically showing an example of the kit 1 of this embodiment.
The kit 1 of the present embodiment comprises a first laminate 5 in which a first release film 151, a resin film forming layer 13 and a second release film 152 are laminated in this order, and a workpiece to which the resin film forming layer 13 is adhered. and a support sheet 10 used to support the resin film forming layer 13, and the support sheet 10 is the support sheet according to the embodiment of the present invention described above.

The resin film forming layer 13 shown here has a first release film 151 on one surface (in this specification, sometimes referred to as a “first surface”) 13a. A second peeling film 152 is provided on the other surface (in this specification, sometimes referred to as a "second surface") 13b on the opposite side.

When the resin film-forming layer is a protective film-forming film, by using the kit 1 including the support sheet 10 and the protective film-forming film, the chip and the chip can be manufactured by a method for manufacturing a chip with a resin film, which will be described later. and a protective film provided on the back surface.

Such a resin film forming layer 13 is suitable for storage as a roll, for example. That is, the first laminate is preferably roll-shaped.

The resin film-forming layer 13 can be formed using the resin film-forming composition described above.

Both the first release film 151 and the second release film 152 may be known ones.
The first release film 151 and the second release film 152 may be the same as each other, or may be different from each other, for example, the release force required to separate them from the resin film forming layer 13 may be different. good too.

In the resin film forming layer 13 shown in FIG. 6, either one of the first release film 151 and the second release film 152 is removed, and the resulting exposed surface becomes the surface to be adhered to the back surface of the work (not shown). Then, the remaining other of the first peeling film 151 and the second peeling film 152 is removed, and the resulting exposed surface becomes the sticking surface of the support sheet.

FIG. 6 shows an example in which the release films are provided on both sides (the first surface 13a and the second surface 13b) of the resin film-forming layer 13. It may be provided only on one surface, that is, only on the first surface 13a or only on the second surface 13b.

The kit 1 of the present embodiment uses both the resin film-forming layer 13 and the support sheet 10, so that both the application of the resin film-forming layer to the workpiece and the subsequent application of the support sheet can be performed in an in-line process. Here, "in-line process" means "a process performed in a device in which a plurality (multiple units) of devices that perform one or more steps are connected, or in the same device. It includes the transfer that connects the work, and the work is transferred one by one between one process and the next process.

<<Method for manufacturing a chip with a resin film>>
The support sheet according to the embodiment of the present invention described above, the resin film-forming composite sheet including the support sheet, and the kit 1 including the support sheet include a chip, a resin film provided on the back surface of the chip, can be used in a method for manufacturing a chip with a resin film.

<Manufacturing method 1>
A manufacturing method according to a first embodiment is a method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip,
The resin film-coated chip manufacturing method includes attaching the resin film-forming layer in the resin film-forming composite sheet according to the embodiment of the present invention to the back surface of the work, thereby forming the resin film-forming layer on the support sheet. a step of producing a first laminated composite sheet in which a film-forming layer and the work are laminated in this order in their thickness direction;
The first laminated composite sheet is heated in a state where the peripheral edge portion of the first laminated composite sheet is attached to a fixing jig to cure the resin film-forming layer to form the resin film, thereby supporting the support. a step of producing a second laminated composite sheet in which the resin film and the workpiece are laminated in this order on the sheet in the thickness direction thereof;
The second laminated composite sheet is cooled, and then the work in the second laminated composite sheet is divided on the support sheet, and the resin film is cut to form a plurality of resin film-coated chips. creating a third laminated composite sheet secured on a support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.
Hereinafter, the manufacturing method according to the first embodiment may be referred to as "manufacturing method 1" in this specification.

7A to 7E are cross-sectional views for schematically explaining manufacturing method 1. FIG. Here, manufacturing method 1 will be described, taking as an example the case of using the resin film-forming composite sheet 101 shown in FIG. 2 having the support sheet 10 shown in FIG.

In the step of producing the first laminated composite sheet of manufacturing method 1, as shown in FIG. , the resin film forming layer 13 and the workpiece 9 are laminated in this order on the support sheet 10 in the thickness direction to produce the first laminated composite sheet 501 . The first surface 13a of the resin film forming layer 13 in the resin film forming composite sheet 101 is adhered to the back surface 9b of the work 9. As shown in FIG.

The adhesion of the resin film-forming layer 13 in the resin film-forming composite sheet 101 to the workpiece 9 can be performed by a known method. For example, the resin film forming layer 13 may be attached to the workpiece 9 while being heated.

Next, in the step of producing the second laminated composite sheet of manufacturing method 1, the peripheral portion of the first laminated composite sheet 501 is attached to a fixing jig 18 such as a ring frame via the jig adhesive layer 16. While attached, the first laminated composite sheet 501 is heated (FIG. 7B). As a result, the resin film forming layer 13 is cured to form the resin film 13', so that the support sheet 10, the resin film 13' and the workpiece 9 are formed in this order in the thickness direction as shown in FIG. 7C. A second laminated composite sheet 502 that is laminated is produced.

Reference numeral 13a' indicates the surface of the resin film 13' which was the first surface 13a of the resin film forming layer 13 (in this specification, it may be referred to as the "first surface"). A reference numeral 13b' indicates a surface of the resin film 13' which was the second surface 13b of the resin film forming layer 13 (in this specification, it may be referred to as a "second surface").

Curing of the resin film-forming layer 13 can be performed by heating the resin film-forming layer 13 if the resin film-forming layer 13 is thermosetting.

When the resin film-forming layer 13 is a protective film-forming film, the resin film-forming layer 13 shown in FIG. Alternatively, the resin film 13' shown in FIG. 7C may be laser-marked by irradiating the laser through the support sheet 10 (transmitting the support sheet 10).

Next, in the step of producing the third laminated composite sheet of manufacturing method 1, the second laminated composite sheet 502 is cooled, and then, as shown in FIG. The inner work 9 is divided and the resin film 13' is cut. The workpiece 9 is divided into individual pieces to form a plurality of chips 90 .

The division of the workpiece 9 and the cutting of the resin film 13' may be performed by a known method. For example, by dicing such as blade dicing, laser dicing by laser irradiation, or water dicing by spraying water containing an abrasive, division of the workpiece 9 and cutting of the resin film 13′ can be performed continuously.
The resin film 13' is cut along the outer circumference of the chip 90 regardless of the cutting method.

By dividing the workpiece 9 and cutting the resin film 13' in this manner, the chip 90 and the resin film after cutting provided on the rear surface 90b of the chip 90 (in this specification, simply "resin film") are formed. ) 130' are obtained. Reference numeral 130b' denotes a surface of the resin film 130' after cutting which was the second surface 13b' of the resin film 13' (in this specification, it may be referred to as a "second surface"). there is

In the step of producing the third laminated composite sheet of manufacturing method 1, the third laminated composite sheet 503 in which the plurality of resin film-coated chips 901 are fixed on the support sheet 10 is produced as described above.

Next, in the picking up step of manufacturing method 1, as shown in FIG. 7E, chip 901 with a resin film in third laminated composite sheet 503 is picked up by separating from support sheet 10 .

In the manufacturing method 1 according to the embodiment of the present invention, since the support sheet 10 has the above configuration, the peripheral edge portion of the first laminated composite sheet 501 is heated while being attached to the fixing jig, and then heated. Even if the second laminated composite sheet 502 is cooled, the influence of the slackness of the third laminated composite sheet 503 can be eliminated, and the recognizability of the chip of the pick-up device can be improved.

In the picking up step, separation occurs between the second surface 130b' of the resin film 130' in the resin film-attached chip 901 and the first surface 12a of the adhesive layer 12 in the support sheet 10.

Here, a case is shown in which the chip 901 with the resin film is separated in the arrow P direction by using the separating means 7 such as a vacuum collet. Note that the cross-sectional representation of the detachment means 7 is omitted here.
Chip 901 with a resin film can be picked up by a known method.

When the pressure-sensitive adhesive layer 12 is energy ray-curable, the pressure-sensitive adhesive layer 12 is cured by irradiating the pressure-sensitive adhesive layer 12 with energy rays in the step of picking up to obtain a cured product (not shown). ) is formed, the chip 901 with the resin film may be separated from the support sheet 10 . In this case, peeling occurs between the resin film 130′ in the resin film-attached chip 901 and the cured product of the adhesive layer 12 in the support sheet 10 in the picking up step.
In this case, since the adhesive force between the cured product of the adhesive layer 12 and the resin film 130′ is smaller than the adhesive force between the cured product of the adhesive layer 12 and the base material 11, Chip 901 can be easily picked up.

In the present specification, even after the energy ray-curable pressure-sensitive adhesive layer is cured with energy rays, as long as the laminate structure of the substrate and the cured product of the energy ray-curable pressure-sensitive adhesive layer is maintained, This laminated structure is called a "support sheet".

On the other hand, when the adhesive layer 12 is non-energy ray curable, the chip 901 with the resin film can be separated from the adhesive layer 12 as it is, and the curing of the adhesive layer 12 is not required, which simplifies the process. The chip 901 with the resin film can be picked up in the same process.

In the pick-up step, such resin film-coated chips 901 are picked up for all target resin film-coated chips 901 .

In the manufacturing method 1, the target resin film-attached chip 901 is obtained by performing the steps up to the picking up step.

The description of the manufacturing method 1 so far has been about the manufacturing method 1 in the case of using the composite sheet 101 for resin film formation provided with the support sheet 10 shown in FIG. The resin film-forming composite sheet of the present embodiment other than the resin film-forming composite sheet 101, such as the resin film-forming composite sheet 102, the resin film-forming composite sheet 103, or the resin film-forming composite sheet 104 shown in FIG. good.

<Manufacturing method 2>
A manufacturing method according to a second embodiment is a method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip,
The resin film-forming layer in the kit 1 according to the embodiment of the present invention is attached to the back surface of the work, and the resin film-forming layer and the work are laminated in the thickness direction. 1 laminated film is prepared, and the adhesive layer of the support sheet in the kit 1 is attached to the resin film-forming layer in the first laminated film, thereby forming the resin film-forming layer on the support sheet. and a step of producing a first laminated composite sheet in which the works are laminated in this order in the thickness direction;
The first laminated composite sheet is heated in a state where the peripheral edge portion of the first laminated composite sheet is attached to a fixing jig to cure the resin film-forming layer to form the resin film, thereby supporting the support. a step of producing a second laminated composite sheet in which the resin film and the workpiece are laminated in this order on the sheet in the thickness direction thereof;
The second laminated composite sheet is cooled, and then the work in the second laminated composite sheet is divided on the support sheet, and the resin film is cut to form a plurality of resin film-coated chips. creating a third laminated composite sheet secured on a support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.
Hereinafter, the manufacturing method according to the second embodiment may be referred to as "manufacturing method 2" in this specification.

8 and 7A to 7E are cross-sectional views for schematically explaining manufacturing method 2. FIG. Here, manufacturing method 2 will be described, taking as an example the case where the kit 1 of FIG. 6 including the support sheet 10 shown in FIG. 1 is used.

In the step of producing the first laminated composite sheet of manufacturing method 2, first, the resin film-forming layer 13 in the kit 1 is attached to the back surface 9b of the work 9, so that as shown in FIG. A first laminated film 601 is prepared by laminating the resin film forming layer 13 and the workpiece 9 in their thickness direction. Also in this case, as in the case of manufacturing method 1, the first surface 13a of the resin film forming layer 13 in the first laminate 5 is attached to the back surface 9b of the work 9 .

Here, the case where the first peeling film 151 is removed from the first laminate 5 of the kit 1 shown in FIG. Alternatively, the second peeling film 152 may be removed from the resin film forming layer 13 of the kit 1 shown in FIG. A circular punching blade is applied to the first laminate 5 of the kit 1 shown in FIG. The first surface 13 a of the obtained circular resin film forming layer 13 may be attached to the back surface 9 b of the workpiece 9 by removing it together with the release film 151 .

The adhesion of the resin film forming layer 13 to the workpiece 9 can be performed by a known method. For example, the resin film forming layer 13 may be attached to the workpiece 9 while being heated.

Next, by attaching the adhesive layer 12 of the support sheet 10 in the kit 1 to the resin film formation layer 13 in the first laminated film 601, the resin film formation layer 13 and the workpiece 9 are formed on the support sheet 10 in this order. , and a first laminated composite sheet 501 is prepared by laminating these in the thickness direction.

The second release film 152 is removed from the resin film forming layer 13 in the first laminated film 601 . Then, as shown in FIG. 7A, one surface 10a of the support sheet 10 is adhered to the second surface 13b of the resin film forming layer 13, which is newly exposed. The jig adhesive layer 16 may be provided after that.
The support sheet 10 shown here includes a substrate 11 and an adhesive layer 12 provided on one surface 11a of the substrate 11. The adhesive layer 12 in the support sheet 10 is It is attached to the resin film forming layer 13 . The first surface 12 a of the adhesive layer 12 on the resin film forming layer 13 side is the same as the first surface 10 a of the support sheet 10 .

The first laminated composite sheet 501 in manufacturing method 2 is the same as the first laminated composite sheet 501 in manufacturing method 1 .

In the production method 2, the step of producing the second laminated composite sheet can be performed by the same method as the step of producing the second laminated composite sheet in the production method 1.

In the production method 2, the step of producing the third laminated composite sheet can be performed by the same method as the step of producing the third laminated composite sheet in the production method 1.

In the manufacturing method 2, the picking up step can be performed by the same method as the picking up step of the manufacturing method 1.

Also in the manufacturing method 2 according to the embodiment of the present invention, since the support sheet 10 has the above configuration, the peripheral edge portion of the first laminated composite sheet 501 is heated while attached to the fixing jig, and then heated. Even if the second laminated composite sheet 502 is cooled, the influence of the slackness of the third laminated composite sheet 503 can be eliminated, and the recognizability of the chip of the pick-up device can be improved.

<Manufacturing method 3>
A manufacturing method according to the third embodiment is a method for manufacturing a chip with a resin film, which includes a chip and a resin film provided on the back surface of the chip,
The resin film-forming layer in the resin film-forming composite sheet according to the embodiment of the present invention is attached to the back surface of the work, or the resin film-forming layer in the composite sheet for resin film formation according to the embodiment of the present invention is attached to the back surface of the work, or in the kit 1 according to the embodiment of the present invention. to produce a first laminated film in which the resin film-forming layer and the workpiece are laminated in the thickness direction thereof, and further, in the first laminated film, By attaching the adhesive layer of the support sheet in the kit 1 to the resin film-forming layer, the resin film-forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof. a step of making a first laminated composite sheet;
A plurality of chips with a resin film forming layer are fixed on the supporting sheet by dividing the work in the first laminated composite sheet and cutting the resin film forming layer on the supporting sheet. a step of making a fourth laminated composite sheet;
With the peripheral edge portion of the fourth laminated composite sheet attached to a fixing jig, the fourth laminated composite sheet is heated and cooled to harden the resin film forming layer in the fourth laminated composite sheet. forming the resin film on the support sheet to produce a third laminated composite sheet in which a plurality of resin-film-coated chips are fixed on the support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.
Hereinafter, the manufacturing method according to the third embodiment may be referred to as "manufacturing method 3" in this specification.

9A to 9C and FIGS. 7D to 7E are cross-sectional views for schematically explaining manufacturing method 3. FIG. Here, manufacturing method 3 will be described, taking as an example the case of using the resin film-forming composite sheet 101 shown in FIG. 2 having the support sheet 10 shown in FIG.

In the step of producing the first laminated composite sheet of manufacturing method 3, as shown in FIG. , the resin film forming layer 13 and the workpiece 9 are laminated in this order on the support sheet 10 in the thickness direction to produce the first laminated composite sheet 501 .
The first laminated composite sheet 501 in FIG. 9A is the same as the first laminated composite sheet 501 in FIG. 7A.

Next, in the step of producing the fourth laminated composite sheet of manufacturing method 3, as shown in FIG. Cut 13. The workpiece 9 is divided into individual pieces to form a plurality of chips 90 .

The division of the workpiece 9 and the cutting of the resin film forming layer 13 may be performed by a known method. For example, by dicing such as blade dicing, laser dicing by laser irradiation, or water dicing by spraying water containing an abrasive, the work 9 is divided and the resin film forming layer 13 is cut, regardless of the cutting method. It is cut along the periphery of the chip 90 .

By dividing the workpiece 9 and cutting the resin film forming layer 13 in this way, the chip 90 and the resin film forming layer after cutting provided on the rear surface 90b of the chip 90 (in this specification, simply " A plurality of resin film forming layer-attached chips 902 are obtained. Reference numeral 130b denotes a surface of the resin film-forming layer 130 after cutting, which was the second surface 13b of the resin film-forming layer 13 (in this specification, may be referred to as a "second surface"). there is

In the step of producing the fourth laminated composite sheet of manufacturing method 3, the fourth laminated composite sheet 504 in which the plurality of chips 902 with resin film forming layers are fixed on the support sheet 10 is produced as described above. .

Next, in the step of producing the third laminated composite sheet of manufacturing method 3, as shown in FIG. , the fourth laminated composite sheet 504 is heated and cooled to cure the resin film-forming layer 130 in the fourth laminated composite sheet 504 to form the resin film 130', as shown in FIG. 7D.

In the manufacturing method 3, the third laminated composite sheet 503 is the same as the third laminated composite sheet 503 in the manufacturing method 1.

In manufacturing method 3, the picking up step can be performed in the same manner as the picking up step of manufacturing method 1.

Also in the manufacturing method 3 according to the embodiment of the present invention, since the support sheet 10 has the above configuration, the peripheral edge portion of the fourth laminated composite sheet 504 is attached to the fixing jig 18 such as a ring frame. , and then cooling the third laminated composite sheet 503, the effect of the slackness of the third laminated composite sheet 503 can be eliminated, and the recognizability of the chip of the pick-up device can be improved.

The description of the manufacturing method 3 so far has been about the manufacturing method 3 in the case of using the resin film-forming composite sheet 101 including the support sheet 10 shown in FIG. The resin film-forming composite sheet of the present embodiment other than the resin film-forming composite sheet 101, such as the resin film-forming composite sheet 102, the resin film-forming composite sheet 103, or the resin film-forming composite sheet 104 shown in FIG. good.

In the step of producing the first laminated composite sheet of manufacturing method 3, the kit 1 shown in FIG. As shown in FIG. 8, the resin film forming layer 13 and the workpiece 9 are laminated in the thickness direction to form a first laminated film 601. Further, the resin film in the first laminated film 601 is The first laminated composite sheet 501 may be produced by attaching the adhesive layer 12 of the support sheet 10 in the kit 1 to the forming layer 13 .

◇ Substrate device manufacturing method (use of chip with resin film)
After obtaining a chip with a resin film by the above-described manufacturing method, a substrate is manufactured in the same manner as a conventional substrate device manufacturing method, except that this chip with a resin film is used in place of a conventional chip with a resin film. You can manufacture equipment.

For example, when the resin film-forming layer is a protective film-forming film and the resin film-coated chips are protective film-coated chips, the protective film-coated chips obtained using the protective film-forming film are picked up from the support sheet. and a flip-chip connecting step of electrically connecting the protruding electrodes on the chip with the resin film to the connecting pads on the circuit board by bringing the protruding electrodes on the chip into contact with the connecting pads on the circuit board. A manufacturing method having

When the resin film-forming layer is a film-like adhesive and the chip with the resin film is a chip with a film-like adhesive, the chip with the resin film-forming layer obtained using the film-like adhesive is removed from the support sheet. A manufacturing method having a connecting step of bonding a chip with a resin film obtained by picking up onto a circuit board via the film-like adhesive is mentioned.

The present invention will be described in more detail below with reference to specific examples. However, the present invention is by no means limited to the examples shown below.

[Example 1]
In Example 1, the support sheet 10 shown in FIG. 1 and the resin film-forming composite sheet 101 shown in FIG. 2, in which the resin film-forming layer is a protective film-forming film, were produced as follows.

(1) Preparation of first laminate containing protective film-forming film The following components (a) to (g) are mixed and diluted with methyl ethyl ketone so that the solid content concentration is 50% by mass to form a protective film. A composition was prepared for

(a) Polymer component: (meth)acrylic acid ester copolymer (10 parts by mass of n-butyl acrylate, 70 parts by mass of methyl acrylate, 5 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate are copolymerized Copolymer obtained by weight average molecular weight: 800,000, glass transition temperature: -1 ° C.) 120 parts by mass (solid content conversion, the same applies hereinafter)
(b-1) Thermosetting component: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER828”, epoxy equivalent 184 to 194 g / eq) 60 parts by mass (b-2) Thermosetting component: bisphenol A-type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER1055”, epoxy equivalent 800 to 900 g / eq) 10 parts by mass (b-3) Thermosetting component: dicyclopentadiene type epoxy resin (Dainippon Ink and Chemicals Co., Ltd., product name "Epiclon HP-7200HH", epoxy equivalent 255 to 260 g / eq) 30 parts by mass (c) Thermally active latent epoxy resin curing agent: Dicyandiamide (manufactured by ADEKA Co., Ltd.: Adeka Hardner EH3636AS, active hydrogen Amount 21 g/eq) 3 parts by mass (d) Curing accelerator: 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., product name “Curesol 2PHZ”) 3 parts by mass (e) Filler: silica Filler (manufactured by Admatechs Co., Ltd., product name "SC2050MA" average particle size: 0.5 μm) 290 parts by mass (f) Coloring agent: carbon black (manufactured by Mitsubishi Chemical Corporation, product name "#MA650", average particle size: 28 nm) 1.2 parts by mass (g) Silane coupling agent: (manufactured by Shin-Etsu Chemical Co., Ltd., product name “KBM-403”) 2 parts by mass

A first release film (manufactured by Lintec Co., Ltd., product name "SP-PET381031") in which a silicone-based release agent layer is formed on one side of a polyethylene terephthalate (PET) film with a thickness of 38 μm, and a PET film with a thickness of 38 μm. A second release film (product name "SP-PET381130", manufactured by Lintec Corporation) having a silicone-based release agent layer formed on one side thereof was prepared.

First, the protective film-forming composition was applied onto the release surface of the first release film with a knife coater and dried to form a protective film-forming film having a thickness of 25 μm. After that, the release surface of the second release film is superimposed on the protective film-forming film and the two are laminated to form a laminate comprising the first release film, the protective film-forming film (thickness: 25 μm), and the second release film. got a body This laminate was long and wound up into a roll.

(2) Preparation of a second laminate containing a support sheet The following components (h) and (i) are mixed and diluted with methyl ethyl ketone so that the solid content concentration is 25% by mass, and the pressure-sensitive adhesive composition is prepared. prepared.

(h) Adhesive main agent: (meth)acrylic acid ester copolymer (a copolymer obtained by copolymerizing 60 parts by weight of 2-ethylhexyl acrylate, 30 parts by weight of methyl methacrylate and 10 parts by weight of 2-hydroxyethyl acrylate , weight average molecular weight: 600,000) 100 parts by mass (i) Crosslinking agent: xylene diisocyanate adduct of trimethylolpropane (manufactured by Mitsui Takeda Chemicals, product name “Takenate D110N”) 20 parts by mass

As the release film, a release film (product name “SP-PET381031” manufactured by Lintec Corporation) was prepared by forming a silicone-based release agent layer on one side of a PET film having a thickness of 38 μm.

A polypropylene film 1 (thickness: 80 μm) having a non-load stretch rate of 99% in the MD direction/99% in the CD direction, a tensile modulus of elasticity in the MD direction of 370 MPa/350 MPa in the CD direction, and a melting point of 138° C. was used as the base material of the support sheet. prepared. The polypropylene film 1 was stretched only in the MD direction at a temperature of 120° C. for 1 minute under a tension of 2 N/m to prepare a substrate. The methods for measuring the expansion ratio without load, the tensile modulus and the melting point are as shown in the test examples described later (the same applies hereinafter).

First, the pressure-sensitive adhesive composition described above was applied onto the release surface of the release film using a knife coater and dried at 100° C. for 1 minute to form a pressure-sensitive adhesive layer having a thickness of 5 μm. After that, the base material was attached to the pressure-sensitive adhesive layer to obtain a second laminate consisting of the support sheet of Example 1 consisting of the base material and the pressure-sensitive adhesive layer and the release film. This laminate was long. After that, the laminate was wound up to obtain a roll-shaped wound body.

(3) Preparation of third laminate including jig adhesive layer 16 The following components (j) and (k) were mixed and diluted with toluene so that the solid content concentration was 15% by mass. A jig adhesive composition was prepared.

(j) Adhesive main agent: (meth) acrylic acid ester copolymer (copolymer obtained by copolymerizing 69.5 parts by mass of butyl acrylate, 30 parts by mass of methyl acrylate, and 0.5 parts by mass of 2-hydroxyethyl acrylate Combined, weight-average molecular weight: 500,000) 100 parts by mass (k) Cross-linking agent: tolylene diisocyanate-based cross-linking agent (Coronate L, manufactured by Tosoh Corporation) 5 parts by mass

First and second release films (manufactured by Lintec Co., Ltd., product name "SP-PET381031") formed by forming a silicone-based release agent layer on one side of a 38 μm thick PET film, and polyvinyl chloride as a core material A film (manufactured by Okamoto Co., Ltd., thickness: 50 μm) was prepared.

First, on the release surface of the first release film, the aforementioned adhesive composition for a jig was applied with a knife coater and dried to form a first adhesive layer having a thickness of 5 μm. . After that, the core material was attached to the first adhesive layer to obtain a laminate A composed of the core material, the first adhesive layer, and the first release film. This laminate A is long and wound up to form a roll.

Next, on the release surface of the second release film, the aforementioned adhesive composition for a jig was applied with a knife coater and dried to form a second adhesive layer having a thickness of 5 μm. . After that, the exposed surface of the core material in the laminate A is attached to the second adhesive layer, and the first release film/first adhesive layer/core material/second adhesive layer/second A third laminate consisting of a release film was obtained. This laminate was long and wound up into a roll.

(4) Production of Fourth Laminate The second release film was peeled off from the first laminate obtained in (1) above to expose the protective film-forming film. On the other hand, the release film was peeled off from the second laminate obtained in (2) above to expose the pressure-sensitive adhesive layer. The first laminate and the second laminate are laminated together so that the protective film-forming film is in contact with the pressure-sensitive adhesive layer, and the support sheet composed of the substrate and the pressure-sensitive adhesive layer, the protective film-forming film, and the second laminate are bonded together. 1 was laminated to obtain a fourth laminate. The fourth laminate was long and wound up into a roll.

(5) Preparation of protective film-forming composite sheet The second release film is peeled off from the third laminate obtained in (3) above, leaving the first release film, and the inside of the adhesive layer for jig is The rim was cut in half and the inner circular portion was removed. At this time, the diameter of the inner peripheral edge of the adhesive layer for jig was set to 345 mm.

The first release film was peeled off from the fourth laminate obtained in (4) above, and the exposed protective film-forming film and the adhesive layer for a jig exposed in the third laminate were superimposed on each other. crimped. After that, the outer peripheral edge of the protective film-forming composite sheet was cut in half, leaving the first release film in the third laminate, and the outer portion was removed. At this time, the diameter of the outer peripheral edge of the protective film-forming composite sheet was 370 mm.

In this way, the support sheet in which the pressure-sensitive adhesive layer (thickness: 5 μm) is laminated on the base material, the protective film-forming film laminated on the pressure-sensitive adhesive layer side of the support sheet, and the protective film-forming film Example 1 comprising an annular jig adhesive layer laminated on the peripheral edge portion opposite to the support sheet, and a release film laminated on the opposite side of the jig adhesive layer to the protective film forming film A composite sheet for forming a protective film was obtained. The protective film-forming composite sheet had a continuous release film in the protective film-forming composite sheet.

[Examples 2 to 6, Comparative Example 1]
The polypropylene film 1 (thickness: 80 μm) was prepared as a base material for the support sheet. Thereafter, the polypropylene film 1 was subjected to stretching treatment in the direction, temperature, time, and tension shown in Table 1, to prepare each base material in the same manner as in Example 1, support sheet and A composite sheet for forming a protective film was produced.

[Comparative Example 2]
A polypropylene film 2 (thickness: 80 μm) having a non-load stretch rate of 100% in the MD direction/100% in the CD direction, a tensile modulus of elasticity in the MD direction of 450 MPa/440 MPa in the CD direction, and a melting point of 155° C. was used as the base material of the support sheet. prepared. A substrate was prepared in the same manner as in Example 1, except that the polypropylene film 2 was stretched only in the MD direction at a temperature of 120 ° C. for 1 minute with a tension of 1 N / m. And a composite sheet for forming a protective film was produced.

[Test Example 1] <Measurement of stretch ratio without load>
The polypropylene film 1 and the polypropylene film 2 used in Examples and Comparative Examples were each cut into a size with a short side of 22 mm and a long side of 110 mm so that the short side was in the CD direction and the long side was in the MD direction. was used as a test piece in the MD direction. Of the length 110 mm, the test piece is marked with 100 mm in the center in the length direction as the distance between measurements, and one end (5 mm part of the end) in the length direction of the test piece is marked with a mass of 2.2 g. Installed the clip.

Clips were used to suspend the specimens in the oven. After heating for 2 hours at 130°C and 30% RH in the oven, the test piece was removed from the oven and cooled to 23°C. After that, the distance between the marked measurements of the test piece was measured again, and the stretch ratio (%) without load of the base material was calculated based on the following formula.
Expansion rate without load (%) = (distance between measurements after heating/distance between measurements before heating) x 100

In addition, the polypropylene film 1 and the polypropylene film 2 used in Examples and Comparative Examples were each cut into a size with a short side of 22 mm and a long side of 110 mm so that the short side was in the MD direction and the long side was in the CD direction. , and this was used as a test piece in the CD direction. For this test piece in the CD direction, the expansion rate (%) without load was calculated in the same manner as described above.

[Test Example 2] <Measurement of tensile modulus>
The polypropylene film 1 and the polypropylene film 2 used in Examples and Comparative Examples were each cut into a test piece of 15 mm × 140 mm, and measured according to JIS K7127: 1999, tensile elastic modulus (Young's modulus) at 23 ° C. was measured. Specifically, the test piece is set to a chuck distance of 100 mm with a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-IS 500N"), and then pulled at a speed of 200 mm / min. A test was performed to measure the tensile modulus (MPa). The tensile modulus was measured in both the MD and CD directions of the base material.

[Test Example 3] <Measurement of melting point>
The melting points of the polypropylene film 1 and the polypropylene film 2 used in Examples and Comparative Examples were measured using a thermogravimetry device (manufactured by PerkinElmer, product name "Pyris1"). Specifically, the substrate was heated from 50° C. to 250° C. at 10° C./min, DSC (differential scanning calorimetry) was measured, and the temperature at which an endothermic peak was observed was taken as the melting point.

[Test Example 4] <Looseness evaluation>
The release film was peeled off from the protective film-forming composite sheets produced in Examples and Comparative Examples, and the resulting protective film-forming composite sheet was coated on a silicon wafer (#6000 polishing, diameter: 12 inches, as shown in FIG. 7A. , thickness: 300 μm, mass: 50 g) and a ring frame (made of stainless steel, inner diameter: 350 mm). In that state, only the ring frame was held so that the silicon wafer surface was horizontal, and the protective film-forming film was cured by heating in an environment of 130 ° C. for 2 hours to form a protective film, and then cooled to room temperature. .

The difference between the height of the lower end face of the protective film forming composite sheet positioned below the ring frame and the height of the lower end face of the protective film forming composite sheet positioned below the silicon wafer ( The sinking amount (mm) was measured and evaluated as slackness. Evaluation criteria are as follows. Table 1 shows the results.
A (excellent): less than 1.2 mm B (good): 1.2 mm or more and less than 3.0 mm C (defective): 3.0 mm or more

As a result, the protective film-forming composite sheets of Examples 1 to 6 were evaluated as A (excellent), and the protective film-forming composite sheets of Comparative Examples 1-2 were evaluated as B (good). there were.

[Test Example 5] <Thermal mechanical analysis (TMA)>
Strip-shaped test pieces having a length of 20 mm and a width of 5 mm were cut out from the supporting sheets of the examples and the comparative examples with the MD direction as the long side direction. Using a thermomechanical analyzer (“TMA-4000SA” manufactured by Bruker AXS Co., Ltd.), chuck spacing: 15 mm, load: 0.8 g, temperature increase rate: 10 ° C./min from 23 ° C. to 130 ° C. and held for 30 minutes. After that, it was cooled from 130° C. to 50° C. with a load of 0.8 g and a cooling rate of 1° C./min. The amount of displacement [μm] during that time was measured at a sampling rate of 1 s ⁻¹ .

Strip-shaped test pieces having a length of 20 mm and a width of 5 mm were cut out from the supporting sheets of the examples and the comparative examples with the CD direction as the long side direction. Similarly, using a thermomechanical analyzer (“TMA-4000SA” manufactured by Bruker AXS Co., Ltd.), chuck spacing: 15 mm, load: 0.8 g, temperature increase rate: 10 ° C./min from 23 ° C. to 130 ° C. and held for 30 minutes. After that, it was cooled from 130° C. to 50° C. with a load of 0.8 g and a cooling rate of 1° C./min. The amount of displacement [μm] during that time was measured at a sampling rate of 1 s ⁻¹ .

The average amount of displacement per 1° C. (A _60→130 ) when the temperature is raised from 60° C. to 130° C. relative to the average amount of displacement per 1° C. (A _23→130 ) when the temperature is raised from 23° C. to 130° C. The ratio of [(A _60→130 )/(A _23→130 )] was obtained by the following procedure.

The average amount of displacement (A _23→130 ) per 1° C. when the temperature was raised from 23° C. to 130° C. was determined by the following equation.
A _{23 → 130} = (A ₁₃₀ - A ₂₃ )/107 = A ₁₃₀ /107 [μm/°C]

The average displacement amount (A _60→130 ) per 1° C. when the temperature was raised from 60° C. to 130° C. was obtained by the following equation.
A _{60 → 130} = (A ₁₃₀ - A ₆₀ )/70 [μm/°C]

Amount of displacement (A ₂₃ ) at 23° C.=0 μm
Displacement at 60°C (A ₆₀ ) [μm]
Displacement at 130°C (A ₁₃₀ ) [μm]

The average amount of displacement (B _130→50 ) per 1° C. when slowly cooled from 130° C. to 50° C. was determined by the following equation.
B _{130 → 50} = (B ₅₀ - B ₁₃₀ )/80 [μm/°C]

The absolute value (|B _130→50 |) of the average displacement amount per 1° C. when slowly cooled from 130° C. to 50° C. was determined by the following equation.
|B _130→50 |=|B ₅₀ −B ₁₃₀ |/80 [μm/° C.]

Displacement (B ₁₃₀ ) [μm] after holding at 130° C. for 30 minutes
Amount of displacement at ₅₀ °C after slow cooling (B50) [μm]

A value [(A _23→130 )−|B _130→50 |] was obtained by subtracting the absolute value of the average displacement (|B _130→50 |) from the average displacement (A ₂₃ →130 ).

Table 1 shows the evaluation results of the above thermomechanical analysis (TMA).

Here, the value of [(A _23→130 )−|B _{130 →50} |] in the machine direction (MD) is changed to the value of [(A _23→130 )−| ] value” was subtracted, and the absolute value of the value was obtained as the “balance evaluation value of MD and CD”. Table 1 shows the calculation results.
The balance evaluation value of MD and CD is preferably 3.0 or less, more preferably 2.5 or less, still more preferably 2.0 or less, and particularly preferably 1.8 or less. When the MD and CD balance evaluation values are small, the support sheet and the resin film-forming composite sheet are peeled off from the fixing jig after heating and cooling, and the possibility of falling off starting from this can be reduced.

[Test Example 6] <Evaluation of Chip Recognition>
(Manufacturing of semiconductor chips with protective film)
A tape mounter (manufactured by Lintec Corporation, product name: Adwill (registered trademark) RAD2500) is used to form a protective film on the polished surface of a silicon wafer (#6000 polishing, diameter: 12 inches, thickness: 300 μm, mass: 50 g). The protective film-forming film side surface of the composite sheet is attached, and a first laminated composite sheet is formed by laminating the protective film-forming film and the silicon wafer in this order in the thickness direction on the support sheet. Then, the peripheral portion of the first laminated composite sheet was fixed to a ring frame for wafer dicing (made of stainless steel, inner diameter 350 mm) (Fig. 7A). Next, only the ring frame is held so that the silicon wafer surface is horizontal, and heated in an oven manufactured by Espec Co., Ltd. at 130 ° C. for 2 hours (FIG. 7B) to cure the protective film-forming film and support the support. A second laminated composite sheet was formed on the sheet by laminating a protective film and a silicon wafer in this order in the thickness direction, and the second laminated composite sheet was cooled to 23 ° C. (Fig. 7C ).

Then, using a dicing device (DFD6361 manufactured by Disco Co., Ltd.), the silicon wafer and the protective film are cut on the support sheet under the conditions of 30 mm / s and 40000 rpm to make a chip size of 3 mm × 3 mm. It was diced to form a third laminated composite sheet in which a plurality of protected chips were fixed on a support sheet (Fig. 7D). The depth of cut during dicing was such that the support sheet was cut by 20 μm. As a dicing blade, ZH05-SD2000-D1-90 CC manufactured by Disco Co., Ltd. was used.
Using a pick-up die bonding machine ("BESTEM D-510" manufactured by Canon Machinery Co., Ltd.), 500 chips were recognized by the auto-trace function, and all 500 chips were recognized as A (excellent) When the number of recognizable chips was less than 500, it was evaluated as B (bad). Table 1 shows the results.

Similarly, using a dicing device (DFD6361, manufactured by Disco Co., Ltd.), a silicon wafer and a protective film of 3 mm × 1.5 mm are placed on a support sheet under the conditions of cutting speed: 30 mm / s and rotation speed: 40000 rpm. It is diced into chip size to form a third laminated composite sheet in which a plurality of protective film-coated chips are fixed on a support sheet (Fig. 7D). The depth of cut during dicing was such that the support sheet was cut by 20 μm.
Similarly, using a pick-up die bonding device ("BESTEM D-510" manufactured by Canon Machinery), 500 chips were recognized by the auto-trace function, and it was confirmed that all 500 chips could be recognized. Excellent), and less than 500 recognizable chips were evaluated as B (bad). Table 1 shows the results.

When chip recognizability was evaluated by dicing into a chip size of 3 mm×3 mm, in Comparative Examples 1 and 2, the number of recognizable chips was less than 500, which was B (defective). In Examples 1 to 6, the number of recognizable chips was 500, which was A (excellent).

When chip recognizability was evaluated by dicing into a chip size of 3 mm x 1.5 mm, in Comparative Examples 1 and 2, the number of recognizable chips was less than 500, which was B (defective). In Examples 2, 4 to 6, the number of recognizable chips was 500, which was A (excellent).

INDUSTRIAL APPLICABILITY The present invention can be used to manufacture various substrate devices including semiconductor devices.

1... Kit, 5... First laminate,
10, 20... support sheet, 10a... one surface (first surface) of the support sheet,
11... Base material, 12... Adhesive layer,
13, 23... Resin film forming layer 13'... Resin film 13b'... The other surface (second surface) of the resin film 130... Resin film forming layer after cutting 130'... Resin film after cutting,
101, 102, 103, 104... Composite sheet for resin film formation,
501... First laminated composite sheet, 502... Second laminated composite sheet, 503... Third laminated composite sheet, 504... Fourth laminated composite sheet,
DESCRIPTION OF SYMBOLS 16... Adhesive layer for jig, 15... Release film, 15... Release film, 151... First release film, 152... Second release film, 18... Fixing jig,
601... First laminated film,
9 Work 9b Back surface of workpiece 90 Chip 90b Back surface of chip 901 Chip with resin film 902 Chip with resin film forming layer

Claims (17)

A support sheet used for heating a workpiece or a chip obtained by dividing a workpiece,
When the support sheet is subjected to thermomechanical analysis (TMA) in either machine direction (MD) or perpendicular (CD) tensile mode under the following conditions:
The displacement amount (A ₁₃₀ ) at 130° C. is 500 μm or less,
The average displacement per 1°C when the temperature is raised from 23°C to 130°C ( _A23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C (|B _130→50 |), support sheet.
<Conditions for thermomechanical analysis (TMA)>
Sample size: length 20mm, width 5mm
Chuck interval: 15mm
Load: 0.8 g, temperature increase rate: 10° C./min from 23° C. to 130° C. and maintained for 30 minutes. After that, it is cooled from 130° C. to 50° C. with a load of 0.8 g and a cooling rate of 1° C./min. The amount of displacement [μm] during that time is measured. When the support sheet is subjected to thermomechanical analysis (TMA) under the conditions in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode,
Displacement amount (A ₁₃₀ ) at 130° C. is 500 μm or less,
The average displacement per 1°C when the temperature is raised from 23°C to 130°C ( _A23→130 ) is the absolute value of the average displacement per 1°C when slowly cooled from 130°C to 50°C (|B _130→50 |). When thermo-mechanical analysis (TMA) of said support sheet under said conditions in either machine direction (MD) or perpendicular (CD) tensile mode,
The support sheet according to claim 1 or 2, wherein the average amount of displacement per 1°C ( _A23→130 ) when the temperature is raised from 23°C to 130°C is a positive value. When the support sheet is subjected to thermomechanical analysis (TMA) under the conditions in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode,
4. The support sheet according to claim 3, wherein the average amount of displacement ( _A23→130 ) per 1[deg.]C when the temperature is raised from 23[deg.]C to 130[deg.]C is a positive value. When thermo-mechanical analysis (TMA) of said support sheet under said conditions in either machine direction (MD) or perpendicular (CD) tensile mode,
The average amount of displacement per 1° C. (A _60→130 ) when the temperature is raised from 60° C. to 130° C. relative to the average amount of displacement per 1° C. (A _23→130 ) when the temperature is raised from 23° C. to 130° C. 5. Support sheet according to claim 3 or 4, wherein the ratio of is less than 1. When the support sheet is subjected to thermomechanical analysis (TMA) under the conditions in the machine direction (MD) tensile mode and the vertical direction (CD) tensile mode,
The average amount of displacement per 1° C. (A _60→130 ) when the temperature is raised from 60° C. to 130° C. relative to the average amount of displacement per 1° C. (A _23→130 ) when the temperature is raised from 23° C. to 130° C. is less than 1. The support sheet consists of only a substrate, or comprises a substrate and a pressure-sensitive adhesive layer provided on one surface of the substrate, wherein the constituent material of the substrate is , a support sheet according to any one of claims 1 to 6, which contains a polyolefin resin. The support sheet consists of only a substrate, or comprises a substrate and a pressure-sensitive adhesive layer provided on one surface of the substrate, wherein the substrate is a stretched film The support sheet according to any one of claims 1 to 7, wherein the support sheet is The support sheet according to any one of claims 1 to 8, wherein the support sheet is roll-shaped. A composite sheet for forming a resin film, comprising: the support sheet according to any one of claims 1 to 8; and a resin film-forming layer provided on one surface of the support sheet. 11. The composite sheet for resin film formation according to claim 10, wherein the resin film-forming layer is a protective film-forming film. The composite sheet for resin film formation according to claim 10 or 11, wherein the composite sheet for resin film formation is roll-shaped. Used to support a first laminate in which a first release film, a resin film-forming layer and a second release film are laminated in this order, a work to which the resin film-forming layer is adhered, and the resin film-forming layer. A kit comprising a support sheet according to any one of claims 1 to 9, wherein the kit comprises: The kit according to claim 13, wherein the resin film-forming layer is a protective film-forming film. 15. A kit according to claim 13 or 14, wherein said first laminate is in roll form. A method for manufacturing a chip with a resin film comprising a chip and a resin film provided on the back surface of the chip,
The resin film-forming layer in the composite sheet for resin film formation according to any one of claims 10 to 12 is attached to the back surface of the work, or the back surface of the work is attached to any one of claims 13 to 15. The resin film-forming layer in the kit according to item 1 is attached to prepare a first laminated film in which the resin film-forming layer and the work are laminated in the thickness direction thereof, and By attaching the support sheet in the kit to the resin film-forming layer in the first laminated film, the resin film-forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof. a step of making a first laminated composite sheet composed of
The first laminated composite sheet is heated in a state where the peripheral edge portion of the first laminated composite sheet is attached to a fixing jig to cure the resin film-forming layer to form the resin film, thereby supporting the support. a step of producing a second laminated composite sheet in which the resin film and the workpiece are laminated in this order on the sheet in the thickness direction thereof;
The second laminated composite sheet is cooled, and then the work in the second laminated composite sheet is divided on the support sheet, and the resin film is cut to form a plurality of resin film-coated chips. creating a third laminated composite sheet secured on a support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet. A method for manufacturing a chip with a resin film comprising a chip and a resin film provided on the back surface of the chip,
The resin film-forming layer in the composite sheet for resin film formation according to any one of claims 10 to 12 is attached to the back surface of the work, or the back surface of the work is attached to any one of claims 13 to 15. The resin film-forming layer in the kit according to item 1 is attached to prepare a first laminated film in which the resin film-forming layer and the work are laminated in the thickness direction thereof, and By attaching the support sheet in the kit to the resin film-forming layer in the first laminated film, the resin film-forming layer and the workpiece are laminated in this order on the support sheet in the thickness direction thereof. a step of making a first laminated composite sheet composed of
A plurality of chips with a resin film forming layer are fixed on the supporting sheet by dividing the work in the first laminated composite sheet and cutting the resin film forming layer on the supporting sheet. a step of making a fourth laminated composite sheet;
With the peripheral edge portion of the fourth laminated composite sheet attached to a fixing jig, the fourth laminated composite sheet is heated and cooled to harden the resin film forming layer in the fourth laminated composite sheet. forming the resin film on the support sheet to form a third laminated composite sheet in which a plurality of resin-film-coated chips are fixed on the support sheet;
and picking up the resin film-coated chips in the third laminated composite sheet by separating them from the support sheet.

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