WO2021166991A1

WO2021166991A1 - Back-surface-protection-film forming composite, method for manufacturing first laminated body, method for manufacturing third laminated body, and method for manufacturing semiconductor device equipped with back surface protection film

Info

Publication number: WO2021166991A1
Application number: PCT/JP2021/006067
Authority: WO
Inventors: 康喜中石
Original assignee: リンテック株式会社
Priority date: 2020-02-21
Filing date: 2021-02-18
Publication date: 2021-08-26
Also published as: CN115136294A; KR20220142447A; JPWO2021166991A1; TW202141595A

Abstract

A back-surface-protection-film forming composite (1) that is formed by laminating a back-surface-protection-film forming film (13) on a protection layer (12) is used for a method for manufacturing a first laminated body, said method including: a first lamination step for bonding the back-surface-protection-film forming film (13) to a back surface of a semiconductor substrate to obtain a second laminated body in which the semiconductor substrate, the back-surface-protection-film forming film (13), and the protection layer (12) are laminated in that order; a curing step for curing the back-surface-protection-film forming film (13) of the second laminated body to obtain a back surface protection film; and a transportation step for transporting the second laminated body from the first lamination step to the curing step, whereby the first laminated body includes the semiconductor substrate, the back surface protection film, and the protection layer (12) that are laminated in that order.

Description

A composite for forming a back surface protective film, a method for manufacturing a first laminate, a method for manufacturing a third laminate, and a method for manufacturing a semiconductor device with a back surface protective film.

The present invention relates to a composite for forming a back surface protective film, a method for producing a first laminate, a method for producing a third laminate, and a method for producing a semiconductor device with a back surface protective film.
The present application claims priority based on Japanese Patent Application No. 2020-028103 filed in Japan on February 21, 2020, the contents of which are incorporated herein by reference.

In recent years, semiconductor devices to which a mounting method called a face down method has been applied have been manufactured. In the face-down method, a semiconductor chip having electrodes such as bumps on the circuit surface is used, and the electrodes are bonded to the substrate. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed.

A resin film containing an organic material is formed on the back surface of the exposed semiconductor chip as a back surface protective film, and may be incorporated into a semiconductor device as a semiconductor chip with a back surface protective film. The back surface protective film is used to prevent cracks from occurring in the semiconductor chip after the dicing step or packaging (for example, Patent Documents 1 and 2).

Such a semiconductor chip with a back surface protective film is manufactured, for example, through the steps shown in FIGS. 1A to 1G. That is, the back surface protective film forming film 13 is laminated on the back surface 8b of the semiconductor wafer (also referred to as “semiconductor substrate”) 8 having a circuit surface (FIG. 1A), and the back surface protective film forming film 13 is heat-cured or energized. The back surface protective film 13'is linearly cured (FIG. 1B), the back surface protective film 13'is laser-marked (FIG. 1C), the support sheet 10 is laminated on the back surface protective film 13'(FIG. 1D), and the semiconductor wafer 8 and the semiconductor wafer 8 and A method is known in which the back surface protective film 13'is diced to obtain a semiconductor chip 7 with a back surface protective film (FIGS. 1E and 1F), and the semiconductor chip 7 with a back surface protective film is picked up from the support sheet 10 (FIG. 1G). There is.

Japanese Patent No. 4271597 Japanese Patent No. 5363662

The laminate obtained in the lamination step of FIG. 1A is conveyed to the curing step of forming the back surface protective film 13'in FIG. 1B by thermosetting or energy ray curing the film 13 for forming the back surface protective film. When the laminating step and the curing step are performed by separate devices, the laminated body obtained in the laminating step adsorbs the suction surface having the suction holes of the transport arm to the back surface protective film forming film surface of the laminated body. It is transported in a state of being transported, accommodated in a cassette, and transported to an apparatus for performing a curing process. In this case, the back surface protective film forming film may be contaminated or deformed while being transported by being housed in the transport arm and the cassette.

Even when the laminating step and the curing step are performed by connecting the device for attaching the back surface protective film forming film and the device for curing the back surface protective film forming film, the device for attaching the back surface protective film forming film can be used. It is necessary to transport the laminated body to an apparatus for curing the back surface protective film forming film, and at that time, the back surface protective film forming film may be contaminated or deformed.

When the process from the laminating step to the curing step is performed by the same device, it can be performed by, for example, a device provided with a film pasting table for forming a back surface protective film, a unit for curing, and a transport arm. Specifically, the work (also referred to as “semiconductor substrate”) put into the apparatus is conveyed to the back surface protective film forming film affixing table by the conveying arm, and is previously outside or immediately before the apparatus on the back surface side of the work. A film for forming a back surface protective film processed into a size suitable for the work in the apparatus is attached to the structure to form a laminated body.

The suction surface having the suction holes of the transport arm is attracted to the film surface for forming the back surface protective film of the laminate, and the laminate is transported to the unit to be cured. Heat is applied to the laminate conveyed to the unit to be cured, or energy rays are irradiated, and the film for forming the back surface protective film becomes the back surface protective film.

When the inventor of the present application observed the surface of the back surface protective film forming film after being transported by the transport arm, it was found that deformation (unevenness) due to the suction holes of the transport arm occurs. In addition, there is a possibility that dust and dirt may adhere to the back surface protective film forming film during transportation and contaminate it. If the above-mentioned deformation (unevenness) or adhesion of dust or dirt occurs, there is a possibility that the reliability of the semiconductor device may be lowered.

The present invention has been made in view of the above circumstances, and in the method of manufacturing a semiconductor device with a back surface protective film, when a film for forming a back surface protective film is attached to the back surface of a semiconductor substrate and then transported, the back surface protective film is conveyed. A composite for forming a back surface protective film capable of preventing contamination and deformation of the forming film, a method for producing a first laminate using the composite for forming a back surface protective film, a method for producing a third laminate, and back surface protection. An object of the present invention is to provide a method for manufacturing a semiconductor device with a film.

In order to solve the above problems, the present invention has the following aspects.
[1] A back surface protective film forming composite in which a protective layer and a back surface protective film forming film are laminated, and the back surface protective film forming film is attached to the back surface of a semiconductor substrate to form the semiconductor. The first laminating step of obtaining a second laminated body in which the substrate, the back surface protective film forming film, and the protective layer are laminated in this order, and the back surface protective film forming film of the second laminated body are cured. The semiconductor substrate, the back surface protective film, and the protective layer, which include a curing step of forming the back surface protective film and a transfer step of transporting the second laminate from the first lamination step to the curing step. A composite for forming a back surface protective film, which is used in a method for producing a first laminated body in which and are laminated in this order.
[2] A back surface protective film forming composite in which a protective layer and a back surface protective film forming film are laminated, and the back surface protective film forming film is attached to the back surface of a semiconductor substrate to form the semiconductor. A support sheet is attached to the first laminating step of obtaining a second laminated body in which the substrate, the back surface protective film forming film, and the protective layer are laminated in this order, and the protective layer of the second laminated body. Then, a second laminating step of obtaining a third laminated body in which the semiconductor substrate, the film for forming the back surface protective film, the protective layer, and the support sheet are laminated in this order, and the first laminating. A composite for forming a back surface protective film used in a method for producing a third laminate, which comprises a transport step of transporting the second laminate from a step to the second lamination step.
[3] A method for producing a first laminated body in which a semiconductor substrate, a back surface protective film, and a protective layer are laminated in this order, for forming a back surface protective film according to [1] on the back surface of the semiconductor substrate. A first laminating step of attaching the back surface protective film forming film of a composite to obtain a second laminate in which the semiconductor substrate, the back surface protective film forming film, and the protective layer are laminated in this order. A curing step of curing the back surface protective film forming film of the second laminated body to form a back surface protective film, and a transporting step of transporting the second laminated body from the first laminating step to the curing step. A method for producing a first laminated film, including.
[4] A method for manufacturing a third laminated body in which a semiconductor substrate, a film for forming a back surface protective film, a protective layer, and a support sheet are laminated in this order. A second laminate in which the semiconductor substrate, the back surface protective film forming film, and the protective layer are laminated in this order by attaching the back surface protective film forming film of the back surface protective film forming composite. A support sheet is attached to the protective layer of the second laminated body in the first laminating step of obtaining the semiconductor substrate, the back surface protective film forming film, the protective layer, and the support sheet. A third laminating step including a second laminating step of obtaining a third laminated body laminated in this order, and a transporting step of transporting the second laminated body from the first laminating step to the second laminating step. How to make a body.
[5] A support sheet is attached to the protective layer of the first laminate manufactured by the manufacturing method according to [3], and the semiconductor substrate, the back surface protective film, the protective layer, and the support sheet are attached. A second lamination step of obtaining a fourth laminate laminated in this order, and a step of dicing the semiconductor substrate and the back surface protective film of the fourth laminate to obtain a semiconductor device with a back surface protective film. A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor device with a back surface protective film from the support sheet.
[6] The film for forming the back surface protective film of the third laminate produced by the production method according to [4] is cured to form a back surface protective film, and the semiconductor substrate, the back surface protective film, and the protection are obtained. A curing step of obtaining a fourth laminate in which the layers and the support sheet are laminated in this order, and dicing the semiconductor substrate and the back surface protective film of the fourth laminate to obtain a semiconductor device with a back surface protective film. And the process to do
A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor device with a back surface protective film from the support sheet.
[7] A step of dicing the semiconductor substrate and the back surface protective film forming film of the third laminate manufactured by the production method according to [4] to obtain a semiconductor device with a back surface protective film forming film. , A curing step of curing the back surface protective film forming film to obtain a back surface protective film,
A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor with a back surface protective film or a semiconductor device with a back surface protective film from the support sheet.

[8] Use for forming a back surface protective film of the back surface protective film forming complex according to [1] or [2].
[9] The film for forming the back surface protective film is formed of an uncured curable resin composition, and the protective layer is formed of a cured curable resin or a thermoplastic resin, [1] or [2]. The back surface protective film forming composite according to the above, the production method according to any one of [3] to [7], or the use according to [8].

According to the present invention, in the method for manufacturing a semiconductor device with a back surface protective film, it is possible to prevent contamination and deformation of the back surface protective film forming film when the film for forming the back surface protective film is attached to the back surface of the work and then transported. A method for producing a back surface protective film, a method for producing a first laminate using the back surface protective film forming composite, a method for producing a third laminate, and a method for producing a semiconductor device with a back surface protective film are provided. NS.

It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the manufacturing method of the conventional semiconductor chip with a back surface protective film schematically. It is a schematic cross-sectional view which shows an example of the complex for forming a back surface protective film. It is a schematic cross-sectional view which shows an example of the complex for forming a back surface protective film. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of embodiment of the manufacturing method of the 1st laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is a schematic cross-sectional view which shows an example of the support sheet 10 which provided the pressure-sensitive adhesive layer 102 on the base material 101. It is a schematic cross-sectional view which shows an example of the complex for forming a back surface protective film. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 4th laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 4th laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the 4th laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in another example of embodiment of the manufacturing method of 4th laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in another example of embodiment of the manufacturing method of 4th laminated body schematically. It is schematic cross-sectional view which shows a part of the steps in another example of embodiment of the manufacturing method of 4th laminated body schematically. It is the schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is the schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is the schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is the schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is the schematic cross-sectional view which shows a part of the steps in the example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows a part of the steps in another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically.

FIG. 2 is a cross-sectional view schematically showing an embodiment of the back surface protective film forming complex of the present invention.
FIG. 3 is a cross-sectional view schematically showing another embodiment of the back surface protective film forming complex of the present invention.
In addition, in the drawings used in the following description, in order to make the features easy to understand, the featured parts may be enlarged for convenience, and the dimensional ratio of each component may not be the same as the actual one. No.

The back surface protective film forming composite 1 shown in FIG. 2 has a protective layer 12 and a back surface protective film forming film 13 in this order.

In the back surface protective film forming composite 1 of the present embodiment, the back surface protective film forming film 13 is attached to the back surface of the work, and the work, the back surface protective film forming film 13, and the protective layer 12 are formed therein. In the first laminating step of obtaining the second laminated body laminated in order, the support sheet is attached to the protective layer 12 of the second laminated body, and the work, the back surface protective film forming film 13, and the protective layer are attached. A second laminating step of obtaining a third laminated body in which the 12 and the support sheet are laminated in this order, and a transport step of transporting the second laminating body from the first laminating step to the second laminating step. It is used in the method for producing the third laminated body including. By having the protective layer 12 in the back surface protective film forming composite 1 of the present embodiment, it is possible to prevent contamination and deformation of the back surface protective film forming film 13 (before curing) in the transport step.

Further, in the back surface protective film forming composite 1 of the present embodiment, the back surface protective film forming film 13 is attached to the back surface of the work, and the work, the back surface protective film forming film 13, and the protective layer 12 are attached. A first laminating step of obtaining a second laminated body laminated in this order, a curing step of curing the back surface protective film forming film 13 of the second laminated body to form a back surface protective film, and the first laminating. It is used in a method for producing a first laminated body in which the work, a back surface protective film, and a protective layer 12 are laminated in this order, which includes a transporting step of transporting the second laminated body from a step to the curing step. By having the protective layer 12 in the back surface protective film forming composite 1 of the present embodiment, it is possible to prevent contamination and deformation of the back surface protective film forming film 13 (before curing) in the transport step.

The back surface protective film forming composite 2 shown in FIG. 3 has a release film 151, a protective layer 12, and a back surface protective film forming film 13 in this order.

In the back surface protective film forming composite 2 of the present embodiment, the back surface protective film forming film 13 is attached to the back surface of the work, and the work, the back surface protective film forming film 13, and the protective layer 12 are peeled off. It is supported by the first laminating step of obtaining a fifth laminated body in which the film 151 is laminated in this order, and the protective layer 12 of the second laminated body obtained by peeling the release film 151 from the fifth laminated body. The third including a second laminating step of attaching a sheet to obtain the third laminated body and a transporting step of transporting the second laminated body from the first laminating step to the second laminating step. It is used in a method for manufacturing a laminate. By having the protective layer 12 in the back surface protective film forming composite 2 of the present embodiment, it is possible to prevent contamination and deformation of the back surface protective film forming film 13 (before curing) in the transport step.

Further, in the back surface protective film forming composite 2 of the present embodiment, the back surface protective film forming film 13 is attached to the back surface of the work, and the work, the back surface protective film forming film 13, and the protective layer 12 are attached. The first laminating step of obtaining a fifth laminated body in which the release film 151 is laminated in this order, and the formation of a back surface protective film of the second laminated body obtained by peeling the release film 151 from the fifth laminated body. A method for producing the first laminate, which comprises a curing step of curing the film 13 to form a back surface protective film and a transport step of transporting the second laminate from the first lamination step to the curing step. Used. By having the protective layer 12 in the back surface protective film forming composite 2 of the present embodiment, it is possible to prevent contamination and deformation of the back surface protective film forming film 13 (before curing) in the transport step.

The back surface protective film forming complex 1 and the back surface protective film forming complex 2 of the present embodiment have at least a back surface protective film forming film during the period from the first laminating step to the second laminating step. It is particularly preferably used in the method for producing the third laminated body, which is carried out by connecting the sticking device and the sticking device of the support sheet, or by using the same device.

Further, on the back surface protective film forming composite 1 and the back surface protective film forming composite 2 of the present embodiment, the back surface protective film forming film is attached at least between the first laminating step and the curing step. It is preferably used in a method for producing a first laminate, which is carried out by connecting an apparatus and an apparatus for curing a film for forming a back surface protective film, or by using the same apparatus.

The thickness of the back surface protective film forming complex 1 is not particularly limited, but is preferably 30 to 550 μm, more preferably 35 to 450 μm, and even more preferably 40 to 400 μm. When the thickness of the back surface protective film forming complex 1 is at least the above lower limit value, the strength of the back surface protective film can be increased. When the thickness of the back surface protective film forming complex 1 is not more than the above upper limit value, the back surface protective film is easily diced.
The thickness of the back surface protective film forming complex 2 is not particularly limited, but is preferably 30 to 550 μm, more preferably 35 to 450 μm, and even more preferably 40 to 400 μm. When the thickness of the back surface protective film forming composite 2 is at least the above lower limit value, the strength of the back surface protective film can be increased. When the thickness of the back surface protective film forming complex 2 is not more than the above upper limit value, the back surface protective film is easily diced.

Next, each layer constituting the back surface protective film forming complex of the present embodiment will be described.

〇 Film for forming a back surface protective film In the back surface protective film forming composite of the present embodiment, the back surface protective film forming film is used as a back surface protective film of a wafer by being attached to a wafer (that is, a work) and cured. Be done. The back surface protective film forming film has curability and may be an energy curable film or a thermosetting film.

In the present specification, "energy curable" means a property of being cured by irradiating with energy rays, and "thermosetting" means a property of being cured by applying heat.

In the present specification, the "energy ray" means an electromagnetic wave or a charged particle beam having an energy quantum. Examples of energy rays include ultraviolet rays, radiation, electron beams and the like. Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.

The thickness of the back surface protective film forming film is not particularly limited, but is preferably 3 to 300 μm, more preferably 5 to 250 μm, and even more preferably 7 to 200 μm. When the thickness of the back surface protective film forming film is at least the above lower limit value, the strength of the back surface protective film can be further increased. When the thickness of the back surface protective film forming film is not more than the above upper limit value, the back surface protective film is easily diced.

(Composition for forming a back surface protective film)
The composition of the back surface protective film forming composition for forming the back surface protective film forming film preferably contains a binder polymer component and a curable component. That is, it is preferable that the back surface protective film forming composition is a (uncured) curable resin composition, and the back surface protective film forming film is formed of such a curable resin composition.

(Binder polymer component)
A binder polymer component is used to impart sufficient adhesiveness and film-forming property (sheet forming property) to the back surface protective film forming film. As the binder polymer component, conventionally known acrylic polymers, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber-based polymers and the like can be used.

The weight average molecular weight (Mw) of the binder polymer component is preferably 10,000 to 2 million, more preferably 100,000 to 1.2 million. If the weight average molecular weight of the binder polymer component is too low, the adhesive force between the back surface protective film forming film and the support sheet becomes high, and transfer failure of the back surface protective film forming film may occur. If it is too high, the back surface protective film is formed. The adhesiveness of the film for use may deteriorate and transfer to a chip or the like may not be possible, or the back surface protective film may peel off from the chip or the like after transfer. That is, when the weight average molecular weight of the binder polymer component is at least the above lower limit value, the adhesive strength between the back surface protective film forming film and the support sheet becomes high, and it is possible to suppress the occurrence of transfer failure of the back surface protective film forming film. .. When the weight average molecular weight of the binder polymer component is not more than the above upper limit value, the adhesiveness of the back surface protective film forming film is lowered, and it is possible to prevent the binder polymer component from being unable to be transferred to a chip or the like. In addition, when the weight average molecular weight of the binder polymer component is not more than the above upper limit value, it is possible to prevent the back surface protective film from peeling off from the chip or the like after transfer.
In the present specification, the "weight average molecular weight" is a standard polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography (GPC) unless otherwise specified.

As the binder polymer component, an acrylic polymer is preferably used. The glass transition temperature (Tg) of the acrylic polymer is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and particularly preferably −40 to 30 ° C. If the glass transition temperature of the acrylic polymer is too low, the peeling force between the back surface protective film forming film and the support sheet may increase, causing transfer failure of the back surface protective film forming film. If it is too high, the back surface protective film forming film may occur. The adhesiveness of the film may be reduced and transfer to a chip or the like may not be possible, or the back surface protective film may be peeled off from the chip or the like after transfer. That is, when the glass transition temperature of the acrylic polymer is at least the above lower limit value, the peeling force between the back surface protective film forming film and the support sheet becomes large, and it is possible to suppress the occurrence of transfer failure of the back surface protective film forming film. When the glass transition temperature of the acrylic polymer is not more than the above upper limit value, the adhesiveness of the back surface protective film forming film is lowered, and it is possible to suppress that the acrylic polymer cannot be transferred to a chip or the like. In addition, when the glass transition temperature of the acrylic polymer is not more than the above upper limit value, it is possible to prevent the back surface protective film from peeling off from the chip or the like after transfer.
The glass transition temperature of the acrylic polymer is determined, for example, by differential scanning calorimetry (DSC).

Examples of the monomer constituting the acrylic polymer include a (meth) acrylic acid ester monomer or a derivative thereof. For example, alkyl (meth) acrylates having an alkyl group having 1 to 18 carbon atoms, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl. Examples include (meth) acrylate. Further, a (meth) acrylate having a cyclic skeleton, specifically, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, Examples thereof include dicyclopentenyloxyethyl (meth) acrylate and imide (meth) acrylate. Further, examples of the monomer having a functional group include hydroxymethyl (meth) acrylate having a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and the like; and glycidyl (meth) having an epoxy group. Examples include acrylate. As the acrylic polymer, an acrylic polymer containing a monomer having a hydroxyl group is preferable because it has good compatibility with a curable component described later. Further, the acrylic polymer may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and the like.

In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid, for example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is a "(meth) acryloyl group". Is a concept that includes both an "acryloyl group" and a "methacryloyl group".

Further, as a binder polymer component, a thermoplastic resin for maintaining the flexibility of the back surface protective film after curing may be blended. As such a thermoplastic resin, one having a weight average molecular weight of 1,000 to 100,000 is preferable, and one having a weight average molecular weight of 3,000 to 80,000 is more preferable. The glass transition temperature of the thermoplastic resin is preferably −30 to 120 ° C., more preferably −20 to 120 ° C. Examples of the thermoplastic resin include polyester resin, thermoplastic urethane resin, phenoxy resin, polybutene, polybutadiene, polystyrene and the like. These thermoplastic resins can be used alone or in admixture of two or more. By containing the above-mentioned thermoplastic resin, the back surface protective film forming film follows the transfer surface of the back surface protective film forming film, and the generation of voids and the like can be suppressed.

(Curable component)
As the curable component, one or more selected from a thermosetting component and an energy ray curable component is used.

As the thermosetting component, a thermosetting resin and a thermosetting agent are used. As the thermosetting resin, for example, an epoxy resin is preferable.

As the epoxy resin, a conventionally known epoxy resin can be used. Specific examples of the epoxy resin include polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, and bisphenol. Examples thereof include epoxy compounds having bifunctionality or higher in the molecule, such as A-type epoxy resin, bisphenol F-type epoxy resin, and phenylene skeleton-type epoxy resin. These can be used alone or in combination of two or more.

In the film for forming the back surface protective film, the thermosetting resin is preferably 1 to 1000 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass with respect to 100 parts by mass of the binder polymer component. included. If the content of the thermosetting resin is less than 1 part by mass, sufficient adhesiveness may not be obtained, and if it exceeds 1000 parts by mass, the peeling force between the back surface protective film forming film and the pressure-sensitive adhesive sheet or base film. May cause transfer failure of the back surface protective film forming film. That is, when the content of the thermosetting resin is at least the above lower limit value, sufficient adhesiveness can be obtained. When the content of the thermosetting resin is not more than the above upper limit value, the peeling force between the back surface protective film forming film and the pressure-sensitive adhesive sheet or the base film becomes high, and transfer failure of the back surface protective film forming film occurs. Can be suppressed.

The thermosetting agent functions as a curing agent for thermosetting resins, especially epoxy resins. Preferred thermosetting agents include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.

Specific examples of the phenol-based curing agent include polyfunctional phenol resins, biphenols, novolak-type phenol resins, dicyclopentadiene-based phenol resins, zylock-type phenol resins, and aralkyl phenol resins. Specific examples of the amine-based curing agent include DICY (dicyandiamide). These can be used alone or in combination of two or more.

The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the thermosetting resin. If the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and if it is excessive, the hygroscopicity of the film for forming the back surface protective film may increase and the reliability of the semiconductor device may be lowered. That is, when the content of the thermosetting agent is not more than the above lower limit value, the thermosetting agent is sufficiently cured and sufficient adhesiveness is obtained. When the content of the thermosetting agent is not more than the above upper limit value, the hygroscopicity of the film for forming the back surface protective film is increased, and it is possible to suppress the deterioration of the reliability of the semiconductor device.

As the energy ray-curable component, a low molecular weight compound (energy ray-polymerizable compound) containing an energy ray-polymerizable group and polymerizing and curing when irradiated with energy rays such as ultraviolet rays and electron beams can be used. Specifically, as such an energy ray-curable component, trimethylolpropantriacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol. Examples thereof include acrylate-based compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate-based oligomer, epoxy-modified acrylate, polyether acrylate and itaconic acid oligomer. Such compounds have at least one polymerizable double bond in the molecule and usually have a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000. The blending amount of the energy ray-polymerizable compound is preferably 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass with respect to 100 parts by mass of the binder polymer component.

Further, as the energy ray-curable component, an energy ray-curable polymer in which an energy ray-curable group is bonded to the main chain or side chain of the binder polymer component may be used. Such an energy ray-curable polymer has both a function as a binder polymer component and a function as a curable component.

The main skeleton of the energy ray-curable polymer is not particularly limited, and may be an acrylic polymer that is widely used as a binder polymer component, or may be polyester, polyether, or the like. Since it is easy to synthesize and control the physical properties, it is particularly preferable that the energy ray-curable polymer has an acrylic polymer as a main skeleton.

The energy ray-polymerizable group bonded to the main chain or side chain of the energy ray-curable polymer is, for example, a group containing an energy ray-polymerizable carbon-carbon double bond, specifically, a (meth) acryloyl group or the like. Can be exemplified. The energy ray-polymerizable group may be bonded to the energy ray-curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.

The weight average molecular weight (Mw) of the energy ray-curable polymer to which the energy ray-polymerizable group is bonded is preferably 10,000 to 2 million, more preferably 100,000 to 1.5 million. The glass transition temperature (Tg) of the energy ray-curable polymer is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and particularly preferably −40 to 30 ° C.

The energy ray-curable polymer reacts, for example, an acrylic polymer containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group with a polymerizable group-containing compound that reacts with the functional group. You can get it. Examples of the polymerizable group-containing compound include compounds having 1 to 5 substituents that react with the functional group and an energy ray-polymerizable carbon-carbon double bond for each molecule. Examples of the substituent that reacts with the functional group include an isocyanate group, a glycidyl group, a carboxyl group and the like.

Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate; (meth) acrylic acid and the like. Can be mentioned.

The acrylic polymer is a (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group or a derivative thereof, and another (meth) acrylic acid ester monomer copolymerizable therewith. Alternatively, it is preferably a copolymer composed of a derivative thereof.

Examples of the (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof include 2-hydroxyethyl (meth) acrylate having a hydroxyl group and 2-hydroxy. Propyl (meth) acrylate; acrylic acid having a carboxyl group, methacrylic acid, itaconic acid; glycidyl methacrylate having an epoxy group, glycidyl acrylate and the like can be mentioned.

As another (meth) acrylic acid ester monomer or a derivative thereof that can be copolymerized with the above monomer, for example, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically a methyl (meth) acrylate. , Ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like; (meth) acrylate having a cyclic skeleton, specifically cyclohexyl (meth) acrylate, Examples thereof include benzyl (meth) acrylate, isobornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, and imide acrylate. Moreover, vinyl acetate, acrylonitrile, styrene and the like may be copolymerized with the said acrylic polymer.

Even when an energy ray-curable polymer is used, the above-mentioned energy ray-polymerizable compound may be used in combination, or a binder polymer component may be used in combination. Regarding the relationship between the blending amounts of these three in the back surface protective film forming film in the present embodiment, the energy ray-polymerizable compound is preferable with respect to 100 parts by mass of the total mass of the energy ray-curable polymer and the binder polymer component. Is contained in an amount of 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass. When the content of the energy ray-polymerizable compound is within the above numerical range, the curability of the back surface protective film forming composition can be further enhanced.

When the thermosetting component and the energy ray-curable component are used in combination, the mass ratio of the thermosetting component and the energy ray-curable component is preferably, for example, 5:95 to 95: 5, and 10:90 to 90:10. Is more preferable, and 15:85 to 85:15 is even more preferable. When the mass ratio of the thermosetting component and the energy ray-curable component is within the above numerical range, the curability of the back surface protective film forming composition can be further enhanced.

By imparting energy ray curability to the back surface protective film forming film, the back surface protective film forming film can be cured easily and in a short time, and the production efficiency of the chip with the back surface protective film is improved. Since the energy ray-curable back surface protective film forming film is cured in a short time by energy ray irradiation, the back surface protective film can be easily formed and can contribute to the improvement of production efficiency.

The back surface protective film forming film can contain the following components in addition to the above binder polymer component and curable component.

(Colorant)
The back surface protective film forming film preferably contains a colorant. By blending a colorant in the back surface protective film forming film, it is possible to shield infrared rays and the like generated from surrounding devices when the semiconductor device is incorporated into a device, and prevent the semiconductor device from malfunctioning due to them. .. In addition, by blending a colorant in the back surface protective film forming film, the visibility of characters when a product number or the like is printed on the back surface protective film obtained by curing the back surface protective film forming film is improved. .. That is, in a semiconductor device or a semiconductor chip on which a back surface protective film is formed, a product number or the like is usually printed on the surface of the back surface protective film by a laser marking method (a method of scraping off the back surface protective film surface with laser light). When the back surface protective film contains a colorant, a sufficient contrast difference between a portion of the back surface protective film that has been scraped off by the laser beam and a portion that has not been scraped off can be sufficiently obtained, and visibility is improved. As the colorant, organic or inorganic pigments and dyes are used. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. As the black pigment, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon and the like are used, but the black pigment is not limited thereto. From the viewpoint of increasing the reliability of the semiconductor device, carbon black is particularly preferable. As the colorant, one type may be used alone, or two or more types may be used in combination. The high curability of the back surface protective film forming film in the present embodiment is particularly preferably exhibited when a colorant is used and the transparency of ultraviolet rays is reduced. Examples of such a colorant include a colorant that reduces the transparency of visible light, a colorant that reduces the transparency of infrared rays and ultraviolet rays, and a colorant that reduces the transparency of visible light, infrared rays, and ultraviolet rays. In addition to the above-mentioned black pigments, such colorants are particularly those having absorbency or reflectivity in the wavelength region of visible light, the wavelength region of infrared rays and ultraviolet rays, and the wavelength region of visible light, infrared rays and ultraviolet rays. Not limited.

The blending amount of the colorant is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 0.5 to 25 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film. It is 1 to 15 parts by mass. When the blending amount of the colorant is at least the above lower limit value, infrared rays and the like can be sufficiently shielded. When the blending amount of the colorant is not more than the above upper limit value, the curability of the back surface protective film forming composition can be further enhanced.

(Curing accelerator)
The curing accelerator is used to adjust the curing rate of the back surface protective film forming film. The curing accelerator is preferably used when the epoxy resin and the thermosetting agent are used in combination, especially in the curable component.

Preferred curing accelerators are tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; Examples thereof include tetraphenylborone salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These can be used alone or in combination of two or more.

The curing accelerator is contained in an amount of preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the curable component. By containing the curing accelerator in an amount in the above range, it has excellent adhesive properties even when exposed to high temperature and high humidity, and achieves high reliability even when exposed to severe reflow conditions. be able to. If the content of the curing accelerator is low, sufficient adhesive properties cannot be obtained due to insufficient curing, and if it is excessive, the curing accelerator has high polarity. The reliability of the semiconductor device is lowered by moving to and segregating.

(Coupling agent)
The coupling agent may be used to improve any one or more of the adhesiveness, adhesion and cohesiveness of the back surface protective film to the chip of the back surface protective film forming film. Further, by using the coupling agent, the water resistance of the back surface protective film formed by curing the back surface protective film can be improved without impairing the heat resistance of the back surface protective film.

As the coupling agent, a compound having a group that reacts with a functional group of a binder polymer component, a curable component, or the like is preferably used. As the coupling agent, a silane coupling agent is desirable. Examples of such a coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ- (methacryloxypropyl). ) Trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N- Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfan, methyltrimethoxy Examples thereof include silane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These can be used alone or in combination of two or more.

The coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass with respect to 100 parts by mass of the total of the binder polymer component and the curable component. Is included in the ratio of. If the content of the coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgas. That is, when the content of the coupling agent is at least the above lower limit value, the above effect can be obtained. When the content of the coupling agent is not more than the above upper limit value, the generation of outgas can be suppressed.

(Inorganic filler)
By blending the inorganic filler into the film for forming the back surface protective film, it is possible to adjust the coefficient of thermal expansion of the back surface protective film after curing. Therefore, the reliability of the semiconductor device can be improved by optimizing the coefficient of thermal expansion of the back surface protective film after curing for the semiconductor chip. It is also possible to reduce the hygroscopicity of the back surface protective film after curing.

Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride and the like, spherical beads, single crystal fibers, glass fibers and the like. Among these, silica filler and alumina filler are preferable. The inorganic filler can be used alone or in combination of two or more. The content of the inorganic filler can be usually adjusted in the range of 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film.

(Photopolymerization initiator)
When the film for forming a back surface protective film contains an energy ray-curable component as the above-mentioned curable component, the energy ray-curable component is cured by irradiating with energy rays such as ultraviolet rays when using the film. At this time, by incorporating the photopolymerization initiator in the composition for forming the back surface protective film, the polymerization curing time and the amount of light irradiation can be reduced.

Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, α-hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl Examples thereof include -1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and β-chloranthraquinone. The photopolymerization initiator may be used alone or in combination of two or more.

The blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray-curable component. If it is less than 0.1 part by mass, satisfactory transferability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated, and the back surface protective film forming film is formed. Curability may be insufficient. That is, when the blending ratio of the photopolymerization initiator is at least the above lower limit value, sufficient photopolymerization is performed and satisfactory transferability can be obtained. When the blending ratio of the photopolymerization initiator is not more than the above upper limit value, the formation of residues that do not contribute to photopolymerization can be suppressed, and the curability of the back surface protective film forming film can be further enhanced.

(Crosslinking agent)
A cross-linking agent can also be added to adjust the initial adhesive force and cohesive force of the back surface protective film forming film. Examples of the cross-linking agent include an organic polyvalent isocyanate compound and an organic polyvalent imine compound.

Examples of the organic polyvalent isocyanate compound include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimerics of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting with a polyol compound.

Examples of the organic polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, and diphenylmethane. -2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, trimethylpropane adduct tolylene diisocyanate and lysine Isocyanate can be mentioned.

Examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylpropan-tri-β-aziridinyl propionate, and tetramethylolmethane-tri. Examples thereof include -β-aziridinyl propionate and N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) triethylene melamine.

The cross-linking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the total amount of the binder polymer component and the energy ray-curable polymer. Used in proportions of parts. When the content of the cross-linking agent is within the above numerical range, the initial adhesive force and the cohesive force of the back surface protective film forming film can be further enhanced.

(General-purpose additive)
In addition to the above, various additives (general-purpose additives) may be added to the back surface protective film forming film, if necessary. Examples of various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents and the like.

(solvent)
The composition for forming a back surface protective film preferably further contains a solvent. The composition for forming a back surface protective film containing a solvent has good handleability.
The solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
The solvent contained in the back surface protective film forming composition may be only one type, may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.
The content of the solvent is preferably 5 to 95% by mass, more preferably 7 to 93% by mass, still more preferably 10 to 90% by mass, based on the total mass of the composition for forming the back surface protective film. When the content of the solvent is at least the above lower limit value, the handleability of the back surface protective film forming composition can be further improved. When the content of the solvent is not more than the above upper limit value, the curability of the back surface protective film forming composition can be further enhanced.

The solvent contained in the back surface protective film forming composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the back surface protective film forming composition can be mixed more uniformly.

The back surface protective film forming film obtained by applying and drying the back surface protective film forming composition composed of the above components has adhesiveness and curability, and is a work (semiconductor) in an uncured state. It can be easily adhered by pressing it against a wafer, chip, etc.). When pressing, the back surface protective film forming film may be attached while being heated. After curing, a back surface protective film having high impact resistance can be finally provided, the adhesive strength is excellent, and a sufficient protective function can be maintained even under severe high temperature and high humidity conditions. The back surface protective film forming film may have a single-layer structure, or may have a multi-layer structure as long as it contains one or more layers containing the above components.

(Manufacturing method of composition for forming back surface protective film)
The composition for forming a back surface protective film can be obtained by blending each component for forming the composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or diluting any of the compounding components other than the solvent in advance. You may use it by mixing the solvent with these compounding components without leaving.
The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of adding and mixing each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.

(Manufacturing method of film for forming backside protective film)
The back surface protective film forming film can be formed by using a back surface protective film forming composition containing the constituent material. For example, the back surface protective film forming film can be formed on a target portion by applying the back surface protective film forming composition to the surface to be formed of the back surface protective film forming film and drying it if necessary. The ratio of the contents of the components that do not vaporize at room temperature in the composition for forming the back surface protective film is usually the same as the ratio of the contents of the components of the film for forming the back surface protective film. In addition, in this specification, "room temperature" means a temperature which is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 25 ° C.

The composition for forming the back surface protective film may be applied by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, and a knife coater. , A method using various coaters such as a screen coater, a Meyer bar coater, and a knife coater.

The drying conditions of the back surface protective film forming composition are not particularly limited, but when the back surface protective film forming composition contains a solvent described later, it is preferable to heat dry the composition. The composition for forming a back surface protective film containing a solvent is preferably dried at 70 to 130 ° C. for 10 seconds to 5 minutes, for example. The composition for forming a back surface protective film containing a solvent is more preferably dried at 80 to 130 ° C. for 20 seconds to 4 minutes, and dried at 90 to 130 ° C. for 30 seconds to 3 minutes. Is even more preferable. When the heating temperature at the time of heating and drying is at least the above lower limit value, the composition for forming a back surface protective film can be sufficiently cured. When the heating temperature at the time of heating and drying is not more than the above upper limit value, deterioration of the work can be suppressed. When the drying time for heat-drying is at least the above lower limit value, the composition for forming a back surface protective film can be sufficiently cured. When the drying time at the time of heating and drying is not more than the above upper limit value, the productivity of the back surface protective film forming film can be improved.

〇 Protective layer In the back surface protective film forming composite of the present embodiment, the protective layer is used as a layer for protecting the back surface protective film forming film. Specifically, the back surface protective film forming film in the back surface protective film forming composite is attached to the back surface of the semiconductor substrate, and the semiconductor substrate, the back surface protective film forming film, and the protective layer are formed. The first laminating step of obtaining the second laminated body laminated in this order, the semiconductor substrate, the back surface protective film forming film, and the back surface protective film forming film by attaching a support sheet to the protective layer of the second laminated body. The second laminating body is conveyed from the first laminating step to the second laminating step in a second laminating step of obtaining a third laminated body in which the protective layer and the support sheet are laminated in this order. In the transport step in the method for producing the third laminate including the transport step, the protective layer prevents contamination and deformation of the back surface protective film forming film (before curing).

Further, the back surface protective film forming film in the back surface protective film forming composite is attached to the back surface of the semiconductor substrate, and the semiconductor substrate, the back surface protective film forming film, and the protective layer are laminated in this order. The first laminating step of obtaining the second laminated body, the curing step of curing the back surface protective film forming film of the second laminated body to form the back surface protective film, and the curing from the first laminating step. In the transport step in the method for manufacturing the first laminate in which the semiconductor substrate, the back surface protective film, and the protective layer are laminated in this order, the step includes a transport step of transporting the second laminate. The layer prevents contamination and deformation of the back surface protective film forming film (before curing).

The thickness of the protective layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 2 to 95 μm, and even more preferably 3 to 90 μm. When the thickness of the protective layer is at least the above lower limit value, contamination and deformation of the back surface protective film forming film can be further suppressed. When the thickness of the protective layer is not more than the above upper limit value, the handleability of the back surface protective film forming complex can be further improved.
The thickness of the protective layer can be determined, for example, by observing the cut surface obtained by cutting the back surface protective film forming complex in the thickness direction using a microscope or the like.

The protective layer is not particularly limited, and examples thereof include an energy ray-curable film and a base material. As the energy ray-curable film, a cured energy ray-curable film described in the back surface protective film forming film can be used. When an uncured energy ray-curable film is used as the protective layer, it is preferable to use a film of a different type from the film for forming the back surface protective film. Further, as the protective layer, the following energy ray-curable film for the protective layer can also be used. Hereinafter, the energy ray-curable film for the protective layer and the base material for the protective layer that can be used as the protective layer will be described.

(Energy ray-curable film for protective layer)
The energy ray-curable film for the protective layer other than the energy ray-curable film described in the back surface protective film forming film is not particularly limited, and for example, an energy ray-curable urethane-containing resin can be used.
Examples of the energy ray-curable urethane-containing resin include an energy ray-curable resin containing a urethane (meth) acrylate resin or a urethane polymer and an energy ray-polymerizable monomer as main components.
The energy ray-curable film for the protective layer is preferably cured before the first laminating step of the present embodiment.

(Base material)
A resin film is preferable as a base material that can be used as a protective layer.
Examples of the resin film include polyethylene films such as low-density polyethylene (LDPE) films and linear low-density polyethylene (LLDPE) films, ethylene / propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene. Film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene / vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic Examples thereof include acid copolymer films, ethylene / (meth) acrylic acid ester copolymer films, polystyrene films, polycarbonate films, polyimide films, and fluororesin films.
The base material used in one aspect of the present invention may be a single-layer film composed of one type of resin film, or may be a laminated film in which two or more types of resin films are laminated.
Further, in one aspect of the present invention, a sheet obtained by subjecting the surface of a base material such as the above-mentioned resin film to a surface treatment may be used as a protective layer.

These resin films may be crosslinked films.
Further, colored resin films or printed ones can also be used. Further, the resin film may be a sheet obtained by extruding a thermoplastic resin or may be a stretched resin film, or a curable resin thinned and cured by a predetermined means to form a sheet. May be used.

Among these resin films, a substrate having excellent heat resistance and a glass transition temperature of 70 ° C. or higher is preferable.
Examples of the film having excellent heat resistance include a polyester film, a polycarbonate film, a polyphenylene sulfide film, a cycloolefin resin film, a polyimide resin film, a film formed by casting and curing an ultraviolet curable resin, and two or more of these. A laminated body and the like can be mentioned.

When a base material is used, only the base material may be used as the protective layer, or a sheet having an adhesive layer or a release agent layer on the base material may be used as the protective layer. When a sheet having an adhesive layer or a release agent layer on the base material is used as the protective layer, in the back surface protective film forming composite, the pressure-sensitive adhesive layer or the release agent layer is the back surface protective film forming film and the base material. It is preferable that they are laminated between them.

The pressure-sensitive adhesive layer can be appropriately selected from the pressure-sensitive adhesive layers described in the support sheet described later according to the type of the base material and the film for forming the back surface protective film.
The release agent layer may be appropriately selected from among silicone-based, olefin-based, long-chain alkyl-based, alkyd-based, and fluorine-based release agent layers according to the type of the base material and the film for forming the back surface protective film. can.

〇 Release film As the release film 151 in the back surface protective film forming composite 2 of the present embodiment, a protective film is preferable. The protective film is usually composed of a base film and an adhesive layer laminated on the base film. The base film can be made of, for example, a thermoplastic resin. Examples of the thermoplastic resin include polyolefin resins such as polyethylene resins and polypropylene resins; polyester resins such as polyethylene terephthalate and polyethylene naphthalate; polycarbonate resins; (meth) acrylic resins. The pressure-sensitive adhesive layer can be made of an acrylic type, a rubber type, a urethane type, or a silicone type. The release film of the present embodiment has re-peelability after being attached.

<< Manufacturing method of the third laminate >>
6A to 6E are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a third laminated body using the back surface protective film forming complex 1. The method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 25 in which the work 14, the back surface protective film forming film 13, the protective layer 12, and the support sheet 10 are laminated in this order. The back surface protective film forming film 13 of the back surface protective film forming composite 1 is attached to the back surface 14b of the work 14, and the work 14, the back surface protective film forming film 13, and the protective layer 12 are attached to each other. A first laminating step (FIGS. 6B and 6C) for obtaining a second laminated body 24 laminated in this order, and a transporting step of transporting the support sheet 10 to the second laminating body 24 (FIGS. 6B and 6C). 6C to 6D) and a second laminating step (FIGS. 6D and 6E) of attaching the support sheet 10 to the protective layer 12 are included in this order.

7A to 7F are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a third laminated body using the back surface protective film forming complex 2. The method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 25 in which the work 14, the back surface protective film forming film 13, the protective layer 12, and the support sheet 10 are laminated in this order. The back surface protective film forming film 13 of the back surface protective film forming composite 2 is attached to the back surface 14b of the work 14, and the work 14, the back surface protective film forming film 13, the protective layer 12, and the protective layer 12 are attached. The support sheet 10 is attached to the protective layer 12 after the first laminating step (FIGS. 7B and 7C) of obtaining a laminate in which the release film 151 is laminated in this order and the release film 151 from the laminate. The transfer step (FIGS. 7C to 7E) of transporting to the second laminating step and the second laminating step (FIGS. 7E and 7F) of attaching the support sheet 10 to the protective layer 12 are included in this order.

<< Manufacturing method of the first laminated body >>
4A to 4D are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a first laminated body using the back surface protective film forming complex 1. The method for manufacturing the first laminated body of the present embodiment is a method for manufacturing the first laminated body 23 in which the work 14, the back surface protective film 13', and the protective layer 12 are laminated in this order, and the work 14 is manufactured. The back surface protective film forming film 13 of the back surface protective film forming composite 1 was attached to the back surface 14b, and the work 14, the back surface protective film forming film 13, and the protective layer 12 were laminated in this order. Transport for transporting the second laminated body 24 to the first laminating step (FIGS. 4B and 4C) for obtaining the laminated body 24 and the curing step for curing the back surface protective film forming film 13 to form the back surface protective film 13'. The steps (FIGS. 4C to 4D) and the curing step (FIG. 4D) of curing the back surface protective film forming film 13 of the second laminated body 24 to form the back surface protective film 13'are included in this order.

5A to 5E are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a first laminated body using the back surface protective film forming complex 2. The method for manufacturing the first laminated body of the present embodiment is a method for manufacturing the first laminated body 23 in which the work 14, the back surface protective film 13', and the protective layer 12 are laminated in this order, and the work 14 is manufactured. The back surface protective film forming film 13 of the back surface protective film forming composite 2 is attached to the back surface 14b, and the work 14, the back surface protective film forming film 13, the protective layer 12, and the release film 151 are attached in this order. The first laminating step (FIGS. 5B and 5C) for obtaining the laminated laminate, the step of peeling the release film 151 from the laminate to obtain the second laminate 24, and the back surface of the second laminate 24. The transport step (FIGS. 5D to E) in which the protective film forming film 13 is cured to form the back surface protective film 13', and the back surface protective film forming film 13 of the second laminated body 24 are cured to form the back surface. The curing step (FIG. 5E) of forming the protective film 13'is included in this order.

Hereinafter, common items will be described for the manufacturing method of the first laminated body and the manufacturing method of the third laminated body. In this embodiment, a semiconductor wafer is used as the work 14 shown in FIGS. 4A, 5A, 6A, and 7A. One surface of the semiconductor wafer is a circuit surface, and bumps are formed. Further, in order to prevent the circuit surface and bumps of the semiconductor wafer from being crushed during backside grinding of the semiconductor wafer and dimples and cracks on the back surface of the wafer, the circuit surface and bumps of the semiconductor wafer are protected from the circuit surface. It is protected by a tape 17. The circuit surface protection tape 17 is a back surface grinding tape, and the back surface of the semiconductor wafer, which is the work 14, (that is, the back surface of the work) is a ground surface. Although not shown in the method for manufacturing the first laminated body shown in FIGS. 4A to 4D and 5A to 5E, the circuit surface and bumps of the semiconductor wafer are also circuit surfaces in the manufacturing method for the first laminated body. It is preferably protected by a protective tape 17. In this case, it is preferable to peel off the circuit surface protection tape at any stage before the curing step represented by FIG. 4D or FIG. 5E.

The work 14 is not limited as long as it has a circuit surface on one side and the other surface can be said to be the back surface. As the work 14, a semiconductor wafer having a circuit surface on one side or individual electronic components are sealed with a sealing resin, and one side has a terminal forming surface (in other words, a circuit surface) of a semiconductor device with terminals. An example includes a semiconductor device panel composed of a semiconductor device assembly with terminals.

As the circuit surface protection tape 17, for example, the surface protection sheet disclosed in JP-A-2016-192488 and JP-A-2009-141265 can be used. The circuit surface protection tape 17 includes an adhesive layer having an appropriate removability. The pressure-sensitive adhesive layer may be formed of a general-purpose weak adhesive type pressure-sensitive adhesive such as rubber-based, acrylic-based, silicone-based, urethane-based, and vinyl ether-based. Further, the pressure-sensitive adhesive layer may be an energy ray-curable pressure-sensitive adhesive that is cured by irradiation with energy rays and can be peeled off again.

In the method for producing the third laminated body, the first laminating step (FIGS. 6B to C or 7B to D) and the second laminating step (FIGS. 6D to E or 7E to F) are performed. It may be performed by separate devices (hereinafter, also referred to as method 1).
In the method for manufacturing the third laminated body, an apparatus for attaching the back surface protective film forming film between the first laminating step and the second laminating step (FIGS. 6B to E or 7B to F). It is preferable that the device for attaching the support sheet is connected to the device, or the device is used in the same device (hereinafter, also referred to as method 2).

In the method for producing the first laminated body, the first laminating step (FIGS. 4B to C or 5B to D) and the curing step (FIG. 4D or 5E) may be performed by separate devices. Good (hereinafter, also referred to as method 3).
In the method for producing the first laminated body, an apparatus for attaching a back surface protective film forming film and a back surface protective film during the period from the first laminating step to the curing step (FIGS. 4B to D and 5B to E). It is preferable to perform the process by connecting devices for curing the forming film or in the same device (hereinafter, also referred to as method 4).

In the method 2, between the first laminating step and the second laminating step, the second laminated body in which the back surface protective film forming film 13 and the protective layer 12 are laminated on the work 14 is housed in the cassette. Without doing so, the sheets can be conveyed one by one to the second laminating step shown in FIGS. 6D to 6E or 7E to 7F.
In the method 4, between the first laminating step and the curing step, the second laminated body in which the back surface protective film forming film 13 and the protective layer 12 are laminated on the work 14 is not housed in the cassette. , 4D, or 5E can be transported one by one to the curing step shown in FIG. 5E.
By performing in the same device, the device space can be further reduced. By connecting a device for attaching the back surface protective film forming film and a device for attaching the support sheet (or a device for curing the back surface protective film forming film), a conventional device can be used without designing from scratch. It can be dealt with by remodeling, and the initial cost can be reduced. Since the second laminated body is not housed in the cassette and transported to the outside of the apparatus, the production efficiency can be improved and the contamination of the second laminated body can be suppressed.

The back surface protective film forming film 13 and the protective layer 12 used in the first laminating step may be processed into the shape of the work in advance, or may be processed in the same apparatus immediately before the first laminating step. May be good.

Further, the back surface protective film forming film 13 and the protective layer 12 may be processed as follows after performing the first laminating step. When the back surface protective film forming composite 1 is used, in the first laminating step, the back surface protective film forming film 13 of the back surface protective film forming complex 1 is attached to the back surface of the work 14, and the work 14 and the back surface protective film forming composite 1 are attached. After obtaining a second laminate in which the back surface protective film forming film 13 and the protective layer 12 are laminated in this order, the back surface protective film forming film 13 and the protective layer 12 are processed into the shape of a work. ..

When the back surface protective film forming composite 2 is used, in the first laminating step, the back surface protective film forming film 13 of the back surface protective film forming composite 2 is attached to the back surface of the work 14, and the release film 151 is used. To obtain a laminate in which the work 14, the back surface protective film forming film 13, and the protective layer 12 are laminated in this order, the back surface protective film forming film 13 and the protective layer 12 are formed on the work. Processed into a shape.

Further, in another embodiment, from the sticking start point of the first laminating step to the sticking completion point of the second laminating step (or from the sticking start point of the first laminating step to the curing completion point of the curing step). The transport distance of the work 14 up to) can be designed to be 7,000 mm or less, and the device space can be reduced. Transport of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step (or the sticking start point of the first laminating step to the curing completion point of the curing step). The distance can be 6500 mm or less, 6000 mm or less, 4500 mm or less, or 3000 mm or less. The lower limit of the transport distance of the work 14 is not particularly limited, but may be, for example, 100 mm.

Further, in still another embodiment, the curing of the curing step is completed from the start of pasting of the first laminating step to the completion of pasting of the second laminating step (or from the start of pasting of the first laminating step). The transport time of the work 14 up to (hour) can be reduced to 400 s or less, and the process time can be shortened. Transport of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step (or from the start of sticking of the first laminating step to the completion of curing of the curing step). The time can be 300 s or less, 250 s or less, 200 s or less, or 150 s or less. The lower limit of the transport time of the work 14 is not particularly limited, but may be, for example, 10 s.

The speed at which the exposed surface of the back surface protective film forming film 13 is attached to the work 14 in the first laminating step in the first laminating body manufacturing method and the third laminating body manufacturing method, and the third laminating body manufacturing method. In the second laminating step, the speed at which the support sheet 10 is attached to the exposed surface of the protective layer 12 can be 100 mm / sec or less, 80 mm / sec or less, or 60 mm / sec or less. It can be 40 mm / sec or less. When the sticking speed in the first laminating step and the sticking speed in the second laminating step are equal to or less than the upper limit value, the adhesion between the work 14 and the back surface protective film forming film 13 can be determined. The adhesion between the protective layer 12 and the support sheet 10 can be improved.
The sticking speed in the first laminating step and the sticking speed in the second laminating step can be 2 mm / sec or more, 5 mm / sec or more, or 10 mm / sec or more. You can also do it. The production efficiency of the first laminated body 23 and the third laminated body 25 is improved by the sticking speed in the first laminating step and the sticking speed in the second laminating step being equal to or higher than the above lower limit value. At the same time, the transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step (or from the start of sticking of the first laminating step to the completion of curing of the curing step) is set. , 400 s or less.

In the method for producing the first laminated body and the method for producing the third laminated body of the present embodiment, the device for attaching the back surface protective film forming film and the device for attaching the support sheet (or the back surface protective film forming film are cured). The device) and can be connected, or can be performed in the same device.
The same device can be implemented by, for example, a device including a back surface protective film forming film sticking table, a support sheet sticking table (or a curing unit), and a transport arm.
Specifically, the work put into the apparatus is conveyed to the back surface protective film forming film attachment table by the transport arm, and the back surface protective film forming film of the back surface protective film forming complex 1 is placed on the back surface side of the work. It is affixed (first laminating step).

The suction surface having the suction holes of the transport arm is attracted to the protective layer surface of the laminated body obtained in the first laminating step, and the second laminating step (or the film for forming the back surface protective film) to which the support sheet is attached is cured. (Transfer process).

After the above transfer step, by attaching the support sheet to the protective layer, a third laminated body in which the work, the back surface protective film forming film, the protective layer, and the support sheet are laminated in this order is obtained (second). Laminating process).
Further, after the transfer step, the film for forming the back surface protective film is cured to obtain a first laminated body in which the work, the back surface protective film, and the protective layer are laminated in this order (curing step).

By using the back surface protective film forming composite 1 of the present embodiment, it is possible to prevent contamination and deformation of the back surface protective film forming film 13 in the transfer step.

The device preferably includes 1 to 5 tables for attaching a film for forming a back surface protective film, and more preferably 1 to 3 tables. When the number of the back surface protective film forming film sticking tables in the apparatus is not less than the lower limit value of the above range, the production efficiency is increased, and when it is not more than the upper limit value, the space of the apparatus can be reduced.

The device preferably includes 1 to 5 support sheet attachment tables, and more preferably 1 to 3 tables. When the number of support sheet attachment tables in the device is at least the lower limit of the above range, the production efficiency is increased, and when it is at least the upper limit, the space of the device can be reduced.

It is preferable that the device is provided with a transfer arm according to each transfer path. When the ratio of the number of transport arms to the total number of tables is 1 or more, the production efficiency can be improved. Further, when two or more tables are provided, if the ratio of the number of transfer arms to the total number of tables is more than 0 and less than 1 (for example, the total number of transfer arms is 1 for two tables), the space of the device is reduced. Is possible.

Specific examples of connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet include a device having a mechanism for attaching the back surface protective film forming film and a mechanism for attaching the support sheet. Examples thereof include a method in which the devices are made continuous and the second laminated body in which the back surface protective film forming film 13 is attached to the work 14 is conveyed one by one by using a conveying arm between the mechanisms.
Specific examples of connecting a device for attaching the back surface protective film forming film and a device for curing the back surface protective film forming film include a device having a mechanism for attaching the back surface protective film forming film and a back surface protective film forming device. A method in which devices having a mechanism for curing a film for curing are continuously connected, and a second laminated body in which a film 13 for forming a back surface protective film is attached to a work 14 is conveyed one by one by using a conveying arm between the mechanisms. Can be mentioned.

In the method for producing the first laminated body and the method for producing the third laminated body of the present embodiment, the first laminating step is preferably performed by the following method. In the following, the case where the back surface protective film forming film 13 and the protective layer 12 used in the first laminating step are processed into the shape of the work in advance or processed in the same apparatus immediately before the first laminating step is performed. Give an explanation.
A band-shaped back surface protective film forming composite 3 represented by FIG. 9 having a release film 152 on the outermost surface of the back surface protective film forming film 13 of the back surface protective film forming composite 2 of the present embodiment is prepared.
The strip-shaped back surface protective film forming complex 3 is preferably rolled and stored.
First, the release film 152 is peeled off, and the back surface protective film forming film 13 and the protective layer 12 are cut into the shape of the work 14. Then, the laminated body composed of the back surface protective film forming film 13 and the protective layer 12 on the outer peripheral portion is removed by winding.

When the protective layer 12 is not provided, the winding of the outer peripheral portion described above involves winding only the back surface protective film forming film 13. Since the back surface protective film forming film 13 is thin and fragile, cutting may occur during winding, and winding of the outer peripheral portion may not be successful.
When the back surface protective film forming composite 3 of the present embodiment is used, the above-mentioned winding of the outer peripheral portion involves winding the laminated body composed of the back surface protective film forming film 13 and the protective layer 12. By having the protective layer 12, the laminated body becomes thicker and stronger, so that the possibility of cutting during winding is reduced, and the outer peripheral portion can be wound efficiently.

The back surface protective film forming composite 2 of the present embodiment, which has been cut into the shape of the work, is attached to the back surface of the work 14, and the work 14, the back surface protective film forming film 13, and the protective layer 12 are attached. And the release film 151 are laminated in this order to obtain a laminated body. As described above, the release film 151 remains strip-shaped because it has not been cut. By winding the strip-shaped release film 151, the release film 151 is peeled off to obtain a second laminated body 24 in which the work 14, the back surface protective film forming film 13, and the protective layer 12 are laminated in this order.

In the second laminating step shown in FIG. 6D or FIG. 7E in the method for manufacturing the third laminated body, the support sheet 10 is laminated on the protective layer 12. The support sheet 10 is, for example, a circular polyolefin film having a thickness of 80 μm and a diameter of 270 mm, and may be provided with an adhesive layer for jigs on the outer peripheral portion. In the present embodiment, the work 14 may be fixed to the fixing jig 18 together with the back surface protective film forming film 13 and the protective layer 12. Then, the support sheet 10 may be laminated on the protective layer 12 and fixed to the fixing jig 18 (FIG. 6E or FIG. 7F).

<Support sheet>
Examples of the support sheet 10 used in one aspect of the present invention include a sheet composed of only the base material 101 and a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer 102 on the base material 101.
The support sheet included in the third laminated body of one aspect of the present invention is a release sheet for preventing dust or the like from adhering to the surface of the back surface protective film forming film, or the surface of the back surface protective film forming film in a dicing step or the like. It plays the role of a dicing sheet or the like for protection.

The thickness of the support sheet is appropriately selected depending on the intended use, but is preferably 10 to 500 μm, more preferably 10 to 500 μm, from the viewpoint of imparting sufficient flexibility to the composite sheet and improving the adhesiveness to the silicon wafer. Is 20 to 350 μm, more preferably 30 to 200 μm.
The thickness of the support sheet includes not only the thickness of the base material constituting the support sheet but also the thickness of those layers and the film when the pressure-sensitive adhesive layer is provided.

As the base material 101 constituting the support sheet 10, the base material described in the protective layer can be used.
Further, in one aspect of the present invention, a sheet obtained by subjecting the surface of a base material such as the above-mentioned resin film to a surface treatment may be used as a support sheet.

Among these resin films, a base material containing a polypropylene film is preferable from the viewpoint that it has excellent heat resistance, has expandability because it has appropriate flexibility, and easily maintains pickup suitability.
The base material containing the polypropylene film may have a single-layer structure composed of only the polypropylene film or a multi-layer structure composed of the polypropylene film and another resin film.
When the film for forming the back surface protective film is thermosetting, the resin film constituting the base material has heat resistance, thereby suppressing damage due to heat of the base material and suppressing the occurrence of defects in the manufacturing process of the semiconductor device. can.

When a sheet composed of only the base material is used as the support sheet, the surface tension of the surface of the base material in contact with the surface of the back surface protective film forming film is preferable from the viewpoint of adjusting the peeling force within a certain range. Is 20 to 50 mN / m, more preferably 23 to 45 mN / m, and even more preferably 25 to 40 mN / m.

The thickness of the base material constituting the support sheet is preferably 10 to 500 μm, more preferably 15 to 300 μm, and further preferably 20 to 200 μm.

(Adhesive sheet)
Examples of the pressure-sensitive adhesive sheet used as the support sheet 10 in one aspect of the present invention include those having a pressure-sensitive adhesive layer 102 formed from a pressure-sensitive adhesive on a base material 101 such as the above-mentioned resin film.
FIG. 8 is a schematic cross-sectional view showing an example of a support sheet 10 in which the pressure-sensitive adhesive layer 102 is provided on the base material 101.
When the support sheet 10 includes the pressure-sensitive adhesive layer 102, the pressure-sensitive adhesive layer 102 of the support sheet 10 is laminated on the protective layer 12 in the second laminating step.

Examples of the pressure-sensitive adhesive which is a material for forming the pressure-sensitive adhesive layer include a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin, and the pressure-sensitive adhesive composition further contains a general-purpose additive such as the above-mentioned cross-linking agent and pressure-sensitive adhesive. You may.
Examples of the adhesive resin include acrylic resin, urethane resin, rubber resin, silicone resin, vinyl ether resin, and the like when focusing on the structure of the resin, and when focusing on the function of the resin. For example, an energy ray-curable pressure-sensitive adhesive, a heat-foaming type pressure-sensitive adhesive, an energy ray-foaming type pressure-sensitive adhesive, and the like can be mentioned.
In one aspect of the present invention, the pressure-sensitive adhesive layer 102 of the support sheet is preferably a strong pressure-sensitive adhesive layer in order to ensure adhesion to the protective layer. It may be an energy ray-curable pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing an energy ray-curable resin.

Further, from the viewpoint of adjusting the peeling force within a certain range, an adhesive containing an acrylic resin is preferable.
As the acrylic resin, an acrylic polymer having a structural unit (x1) derived from alkyl (meth) acrylate is preferable, and the structural unit (x1) and the structural unit (x2) derived from the functional group-containing monomer are used. The acrylic copolymer having is more preferable.

The alkyl group of the alkyl (meth) acrylate has preferably 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 8 carbon atoms.
Examples of the alkyl (meth) acrylate include the same alkyl (meth) acrylates described in the above-mentioned binder polymer component section.
The alkyl (meth) acrylate may be used alone or in combination of two or more.
The content of the structural unit (x1) is usually 50 to 100% by mass, preferably 50 to 99.9% by mass, and more preferably 60 to 99 with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 70 to 95% by mass.

Examples of the functional group-containing monomer include a hydroxy group-containing monomer, a carboxy group-containing monomer, an epoxy group-containing monomer, and the like, and specific examples of each monomer are the same as those exemplified in the binder polymer component portion. can give.
In addition, these may be used alone or in combination of 2 or more types.
The content of the structural unit (x2) is usually 0 to 40% by mass, preferably 0.1 to 40% by mass, and more preferably 1 to 30 with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 5 to 20% by mass.

The acrylic resin used in one embodiment of the present invention is obtained by reacting an acrylic copolymer having the above-mentioned structural units (x1) and (x2) with a compound having an energy ray-polymerizable group. It may be an energy ray-curable acrylic resin.
The compound having an energy ray-polymerizable group may be a compound having a polymerizable group such as a (meth) acryloyl group or a vinyl group.

When a pressure-sensitive adhesive containing an acrylic resin is used, it is preferable to contain a cross-linking agent together with the acrylic resin from the viewpoint of adjusting the peeling force within a certain range.
Examples of the cross-linking agent include isocyanate-based cross-linking agents, imine-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, carbodiimide-based cross-linking agents, and the like, from the viewpoint of adjusting the peeling force within a certain range. Isocyanate-based cross-linking agents are preferred.
The content of the cross-linking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, based on the total mass (100 parts by mass) of the acrylic resin contained in the pressure-sensitive adhesive. It is more preferably 0.5 to 10 parts by mass, and even more preferably 1 to 8 parts by mass.

The support sheet 10 may be composed of one layer (single layer) or may be composed of two or more layers. When the support sheet is composed of a plurality of layers, the constituent materials and the thicknesses of the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.

In the present specification, not only in the case of the support sheet, "a plurality of layers may be the same or different from each other" means "all layers may be the same or all layers are different". It means that only some of the layers may be the same, and further, "multiple layers are different from each other" means that "at least one of the constituent materials and thicknesses of each layer is different from each other". Means.

The support sheet may be transparent, opaque, or colored depending on the purpose.
For example, when the back surface protective film forming film has energy ray curability, the support sheet preferably allows energy rays to pass through.
For example, in order to optically inspect the back surface protective film forming film via the support sheet, the support sheet is preferably transparent.

In the present embodiment, the circuit surface of the work 14 is protected by the circuit surface protection tape 17, and after the second laminating step, the circuit surface protection tape 17 is peeled off from the circuit surface of the work 14. Can include steps. In the present embodiment, the circuit surface protection tape 17 has an adhesive layer on the side that is adhered to the circuit surface. The type of the pressure-sensitive adhesive layer is not limited as long as it has an appropriate removability to the work, and is formed of a general-purpose pressure-sensitive adhesive such as rubber-based, acrylic-based, silicone-based, urethane-based, and vinyl ether-based. You may. Further, it may be formed from an energy ray-curable pressure-sensitive adhesive that is cured by irradiation with energy rays and becomes removable. When the pressure-sensitive adhesive layer is formed of an energy ray-curable pressure-sensitive adhesive, in the peeling step, the pressure-sensitive adhesive layer of the circuit surface protection tape 17 is irradiated with energy rays to cure the pressure-sensitive adhesive layer and peel it off again. By enabling this, the circuit surface protection tape 17 can be easily peeled off from the circuit surface of the work 14.

The method for producing the third laminated body of the present embodiment may include a step of irradiating the back surface protective film forming film 13 with a laser from the side of the support sheet 10 to perform laser marking. In the method for producing the third laminated body of the present embodiment, since the support sheet 10 is laminated on the protective layer 12, when a laser is irradiated from the side of the support sheet 10 through the support sheet and the protective layer, a film for forming a back surface protective film is formed. The surface of the 13 in contact with the protective layer 12 can be laser-marked.
The method for producing the first laminated body of the present embodiment may include a step of irradiating the back surface protective film forming film 13 or the back surface protective film 13'with a laser to perform laser marking.

By using the back surface protective film forming composite 1 of the present embodiment in the method for producing the first laminated body and the method for producing the third laminated body, contamination and deformation of the back surface protective film forming film 13 are prevented. .. Therefore, contamination and deformation of the back surface protective film 13'obtained by curing the back surface protective film forming film 13 are also prevented. When the back surface protective film forming film 13 or the back surface protective film 13'is contaminated and deformed (when the surface has irregularities), when laser marking is performed by irradiating the laser through the support sheet 10, printing is defective. Will occur, and the problem of poor visibility after printing will occur.
By using the back surface protective film forming composite 1 of the present embodiment in the method for producing the first laminated body and the method for producing the third laminated body, the back surface protective film forming film 13 (back surface protective film 13') can be obtained. Contamination and deformation are suppressed, and as a result, the above-mentioned printing defects are suppressed, and visibility after printing is improved.

<< Manufacturing method of the fourth laminated body >>
In the method for producing the fourth laminated body of the present embodiment, the back surface protective film forming film 13 of the third laminated body 25 produced by the method for producing the third laminated body is cured to obtain the back surface protective film 13'. This is a method for manufacturing a fourth laminated body 26 in which a work 14, a back surface protective film 13', a protective layer 12, and a support sheet 10 are laminated in this order, including a curing step.
Further, in the method for manufacturing the fourth laminated body of the present embodiment, the support sheet 10 is attached to the protective layer 12 of the first laminated body 23 manufactured by the method for manufacturing the first laminated body, and the work 14 and the work 14 are attached. This is a method for manufacturing a fourth laminated body 26, which includes a second laminating step of obtaining a fourth laminated body in which the back surface protective film 13', the protective layer 12, and the support sheet 10 are laminated in this order.

10A to 10C are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a fourth laminated body. The method for manufacturing the fourth laminated body of the present embodiment is a peeling step of peeling the circuit surface protection tape 17 from the circuit surface of the work 14 after the second laminating step in the method for manufacturing the third laminated body. FIG. 10A), a step of irradiating the back surface protective film forming film 13 with a laser from the side of the support sheet 10 to perform laser marking (FIG. 10B), and curing the back surface protective film 13 to cure the back surface protective film 13 Includes a curing step (FIG. 10C). In the present embodiment, a thermosetting film for forming a back surface protective film is used, and in the curing step of the present embodiment, the film is thermoset at 130 ° C. for 2 hours.

When the thermosetting film for forming a back surface protective film is heat-treated and heat-cured to form a back surface protective film, the curing conditions are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. It is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.

For example, the heating temperature at the time of thermosetting is preferably 100 to 200 ° C, more preferably 110 to 180 ° C, and particularly preferably 120 to 170 ° C. The heating time during the thermosetting is preferably 0.5 to 5 hours, more preferably 0.5 to 3 hours, and particularly preferably 1 to 2 hours. In the case of thermosetting in the curing step, the order of the peeling steps is preferably before the curing step in consideration of the heat resistance of the circuit surface protection tape 17.

11A to 11C are schematic cross-sectional views schematically showing another example of the embodiment of the method for manufacturing the fourth laminated body. The method for manufacturing the fourth laminated body of the present embodiment is a peeling step of peeling the circuit surface protection tape 17 from the circuit surface of the work 14 after the second laminating step in the method for manufacturing the third laminated body. FIG. 11A), a curing step (FIG. 11B) in which the back surface protective film forming film 13 is cured to form the back surface protective film 13', and the back surface protective film 13'is irradiated with a laser from the side of the support sheet 10 to obtain a laser. Includes a marking step (FIG. 11C).

12A and 12B are schematic cross-sectional views schematically showing another example of the embodiment of the method for manufacturing the fourth laminated body. The method for producing the fourth laminated body of the present embodiment includes a second laminating step of attaching a support sheet to the first laminated body 23 produced by the method for producing the first laminated body. The step of peeling off the circuit surface protection tape 17 and the step of irradiating the laser from the side of the support sheet 10 to perform laser marking may be included in the step of manufacturing the first laminated body 23, and FIG. 12A , B may be included in the process of manufacturing the first laminated body 23 to the fourth laminated body 26.

<< Manufacturing method of semiconductor device with back surface protective film >>
12C to 12C and 13A to 13C are schematic cross-sectional views schematically showing an example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film. In the method for manufacturing a semiconductor device with a back surface protective film of the present embodiment, the work 14, the back surface protective film 13', and the protective layer 12 of the fourth laminated body 26 manufactured by the method for manufacturing the fourth laminated body are diced. The step of forming the semiconductor device 22'with the back surface protective film (FIGS. 12C, 12D, 13A, and 13B) and the step of picking up the semiconductor device 22'with the back surface protective film from the protective layer 12 (FIGS. 12E, 12E, 13C) and is included.

14A to 14D are schematic cross-sectional views schematically showing another example of the embodiment of the method for manufacturing a semiconductor device with a back surface protective film. In the method for manufacturing the semiconductor device with the back surface protective film of the present embodiment, the back surface protective film forming film 13, the work 14 and the protective layer 12 of the third laminate 25 manufactured by the method for manufacturing the third laminate are diced. Then, the step of forming the semiconductor device 22 with the back surface protective film forming film (FIGS. 14A and 14B) and the curing step of curing the back surface protective film forming film 13 to form the back surface protective film 13'(FIG. 14C). The step (FIG. 14D) of picking up the semiconductor device 22'with the back surface protective film from the support sheet 10 (protective layer 12) is included.

The dicing in the above-mentioned method for manufacturing a semiconductor device can be performed by each dicing such as blade dicing using a blade, laser dicing by laser irradiation, or water dicing by spraying water containing an abrasive. In these dicings, the protective layer, the back surface protective film (film for forming the back surface protective film), and the work are cut together on the support sheet. ..

Further, the dicing in the above-mentioned manufacturing method of the semiconductor device can also be performed by stealth dicing (registered trademark). In stealth dicing (registered trademark), first, a planned division portion is set inside the wafer, and the inside of the wafer is modified by irradiating a laser beam so as to focus on this focal point. Form a layer. Unlike other parts of the wafer, the modified layer of the wafer is altered by irradiation with laser light, and its strength is weakened. Therefore, when a force is applied to the wafer, cracks extending in both sides of the wafer are generated in the modified layer inside the wafer, which serves as a starting point for dividing (cutting) the wafer. Next, a force is applied to the wafer to divide the wafer at the site of the modified layer to prepare chips. At this time, for example, the wafer on which the modified layer is formed, which is held on the support sheet via the protective layer and the back surface protective film (film for forming the back surface protective film), is protected by the support sheet, the protective layer, and the back surface. A chip with a back surface protective film can be produced by applying a force to the wafer by stretching the film (film for forming a back surface protective film) in a direction parallel to the surface of the wafer.

In the method for manufacturing a semiconductor device with a back surface protective film of the present embodiment, the back surface protective film forming film 13 is thermosetting, and in the step of forming the back surface protective film of the present embodiment, for example, the back surface protective film forming film 13 Is thermoset at 130 ° C. for 2 hours.

As described above, the curing conditions for forming the back surface protective film by thermosetting the thermosetting film for forming the back surface protective film are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. The method is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.

In the method for manufacturing a semiconductor device with a back surface protective film of the present embodiment, the back surface protective film forming film 13 is energy ray curable, and in the step of forming the back surface protective film, energy rays are applied to the back surface protective film forming film 13. It may be a step of irradiating and curing the energy ray.

The curing conditions when the energy ray-curable back surface protective film forming film is energy ray-cured to form the back surface protective film are particularly limited as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. However, it may be appropriately selected depending on the type of the energy ray-curable back surface protective film forming film.
For example, the illuminance of the energy ray at the time of energy ray curing of the energy ray curable back surface protective film forming film is preferably ^{4 to 280 mW / cm 2.} The amount of light of the energy rays at the time of curing is preferably ^{3 to 1000 mJ / cm 2.}

As the energy ray-curable back surface protective film forming film, for example, those disclosed in International Publication No. 2017/188200 and International Publication No. 2017/188218 can also be used.

When the protective layer 12 is not provided, the semiconductor device 22'with the back surface protective film is picked up from the support sheet 10. When a thermosetting film is used as the back surface protective film forming film 13, the adhesive force between the back surface protective film 13'after curing and the support sheet 10 becomes large, which may make picking up difficult. In this case, it is necessary to adjust the composition of the pressure-sensitive adhesive component of the support sheet.
On the other hand, when the back surface protective film forming composite 1 of the present embodiment is used, the semiconductor device 22'with the back surface protective film picks up from the protective layer 12. In this case, if the adhesive strength between the protective layer 12 and the support sheet 10 is sufficiently increased, pickup can be easily performed without optimizing the adhesive strength between the semiconductor device 22'with the back surface protective film and the protective layer 12. Can be done.

Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.

<Evaluation of deformation suppression of film for forming backside protective film in transfer process>
The wafers with the composite for forming the back surface protective film obtained in Examples 1 to 3 and Comparative Example 1 described later were set on a table at a set temperature of 40 ° C. with the semiconductor wafer side facing down, and left for 1 minute. At this time, the measured value of the surface temperature of the table was 37 to 38 ° C. Using a standard 8 "I-type robot arm (suction area at the tip of the arm: diameter 34 mm) having suction holes from the upper side of the wafer with the back surface protective film forming composite, 30 wafers with the back surface protective film forming composite are used. The wafer was adsorbed and held for a minute at a vacuum source of −80 kPa or less. After that, the wafer with the composite for forming the back surface protective film was set on a table at room temperature with the semiconductor wafer side facing down, and the adsorption of the robot arm was stopped. The upper surface of the wafer with the composite for forming the back surface protective film was visually confirmed, and the wafer in which no adsorption trace was visible was designated as A, and the wafer in which the adsorption trace was visible was designated as B.

(Manufacturing of film for forming backside protective film)
A first release sheet (Lintec Corporation: SP-PET5011, thickness 50 μm) in which a silicone-based release agent layer is formed on one side of a polyethylene terephthalate (PET) film, and a silicone-based release agent on one side of the PET film. A second release sheet (manufactured by Lintec Corporation: SP-PET38131, thickness 38 μm) on which a layer was formed was prepared.

A coating solution for a film for forming a back surface protective film is applied on the peeled surface of the first release sheet with a knife coater, and then dried in an oven at 120 ° C. for 2 minutes to form a back surface protective film having a thickness of 40 μm. A film was formed. Next, the peeling surface of the second release sheet was overlapped with the back surface protective film forming film and both were bonded to each other, and the first release sheet and the back surface protective film forming film (Lintec Corporation: LC2846, thickness: 40 μm). A sheet for forming a back surface protective film made of a second release sheet was obtained.

(Protective layer)
A sheet (manufactured by Lintec Corporation: SP-PET5011, thickness 50 μm) having a silicone-based release agent layer formed on one side of a polyethylene terephthalate (PET) film, which is the first release sheet described above, is used as the protective layer 1. board.

A film for forming the protective layer 2 was produced by the following method.
It contains an acrylic polymer (100 parts by mass, solid content) and a trifunctional xylylene diisocyanate-based cross-linking agent (Mitsui Takeda Chemical Co., Ltd .: Takenate D110N) (10.7 parts by mass, solid content), and methyl ethyl ketone as a solvent. A pressure-sensitive adhesive composition having a solid content concentration of 30% by mass was prepared. The acrylic polymer is obtained by copolymerizing -2-ethylhexyl acrylate (36 parts by mass), butyl acrylate (59 parts by mass), and -2-hydroxyethyl acrylate (5 parts by mass). The weight average molecular weight is 600,000.
The pressure-sensitive adhesive composition is applied to the peel-treated surface of a release film (Lintec Corporation: SP-PET38131, thickness 38 μm) in which one side of a polyethylene terephthalate (PET) film is peel-treated by silicone treatment, and at 120 ° C. By heating and drying for 2 minutes, a pressure-sensitive adhesive layer having a thickness of 5 μm was formed.
Next, a polypropylene film (Young's modulus 400 MPa, thickness 80 μm) is attached to the exposed surface of the pressure-sensitive adhesive layer as a base material, so that a protective layer having the pressure-sensitive adhesive layer on one surface of the base material is provided. 2 A film for forming was obtained.

As the protective layer 3 forming film, the polypropylene film used in the production of the protective layer 2 forming film was used (without the adhesive layer).

[Example 1]
The second release sheet on the back surface protective film forming film side is peeled off, the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300 μm), and the back surface is protected with the first release sheet left as the protective layer 1. A wafer with a film-forming complex A was obtained.
With respect to the wafer with the back surface protective film forming composite A, the deformation of the back surface protective film forming film in the conveying step was evaluated by the above-mentioned method. Table 1 shows the adsorption pressure and the results in the above evaluation.

[Example 2]
The second release sheet on the back surface protective film forming film side is peeled off, the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300 μm), and the first release sheet is further peeled off to expose the back surface protective film forming film. The release film of the protective layer 2 forming film was peeled off and an exposed pressure-sensitive adhesive layer was attached thereto to obtain a wafer with a composite B for forming a back surface protective film.
With respect to the wafer with the back surface protective film forming composite B, the deformation of the back surface protective film forming film in the conveying step was evaluated by the above-mentioned method. Table 1 shows the adsorption pressure and the results in the above evaluation.

[Example 3]
The second release sheet on the back surface protective film forming film side is peeled off, the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300 μm), and the first release sheet is further peeled off to expose the back surface protective film forming film. A film for forming the protective layer 3 was attached to the wafer to obtain a wafer with the composite C for forming the back surface protective film.
With respect to the wafer with the back surface protective film forming composite C, the deformation of the back surface protective film forming film in the conveying step was evaluated by the above-mentioned method. Table 1 shows the adsorption pressure and the results in the above evaluation.

[Comparative Example 1]
The second release sheet on the back surface protective film forming film side is peeled off, the exposed surface is attached to an 8-inch semiconductor wafer (thickness 300 μm), and the first release sheet is further peeled off to form a wafer with a back surface protective film forming film. Got
With respect to the wafer with the film for forming the back surface protective film, the deformation of the film for forming the back surface protective film in the transport step was evaluated by the above method. Table 1 shows the adsorption pressure and the results in the above evaluation.

No adsorption traces were confirmed in Examples 1 to 3 having the protective layer of the present invention. On the other hand, in Comparative Example 1 having no protective layer of the present invention, adsorption traces were confirmed.

The back surface protective film forming composite of the present invention can be used for manufacturing a semiconductor device with a back surface protective film.

1 ... Complex for forming a back surface protective film, 2 ... Composite for forming a back surface protective film, 3 ... Composite for forming a back surface protective film, 7 ... Semiconductor chip with a back surface protective film, 8 ... -Semiconductor wafer, 8a ... Circuit surface of semiconductor wafer, 8b ... Back surface of semiconductor wafer, 9 ... Semiconductor chip, 10 ... Support sheet, 101 ... Base material, 102 ... Adhesive Layers, 12 ... Protective layer, 13 ... Backside protective film forming film, 13'... Backside protective film, 14 ... Work, 14a ... Work circuit surface, 14b ... Work 14 Back surface, 151 ... release film, 152 ... release film, 17 ... circuit surface protection tape, 18 ... fixing jig, 21 ... semiconductor device, 22 ... back surface protection film Semiconductor device with forming film, 22'... Semiconductor device with backside protective film, 23 ... First laminate, 24 ... Second laminate, 25 ... Third laminate, 26 ... Fourth laminated body

Claims

A back surface protective film forming composite in which a protective layer and a back surface protective film forming film are laminated.
First, the back surface protective film forming film is attached to the back surface of the semiconductor substrate to obtain a second laminate in which the semiconductor substrate, the back surface protective film forming film, and the protective layer are laminated in this order. Laminating process and
A curing step of curing the back surface protective film forming film of the second laminate to obtain a back surface protective film,
A first laminated body in which the semiconductor substrate, the back surface protective film, and the protective layer are laminated in this order, which includes a transport step of transporting the second laminated body from the first laminating step to the curing step. A complex for forming a back surface protective film, which is used in the manufacturing method of.
A back surface protective film forming composite in which a protective layer and a back surface protective film forming film are laminated.
First, the back surface protective film forming film is attached to the back surface of the semiconductor substrate to obtain a second laminate in which the semiconductor substrate, the back surface protective film forming film, and the protective layer are laminated in this order. Laminating process and
A support sheet is attached to the protective layer of the second laminate, and the semiconductor substrate, the back surface protective film forming film, the protective layer, and the support sheet are laminated in this order. The second laminating process to get the body,
A back surface protective film forming composite used in a method for producing a third laminated body, which comprises a transporting step of transporting the second laminated body from the first laminating step to the second laminating step.
A method for manufacturing a first laminated body in which a semiconductor substrate, a back surface protective film, and a protective layer are laminated in this order.
The back surface protective film forming film of the back surface protective film forming composite according to claim 1 is attached to the back surface of the semiconductor substrate, and the semiconductor substrate, the back surface protective film forming film, and the protective layer are attached. In the first laminating step of obtaining a second laminated film in which and are laminated in this order,
A curing step of curing the back surface protective film forming film of the second laminate to obtain a back surface protective film,
A method for producing a first laminated body, which comprises a transporting step of transporting the second laminated body from the first laminating step to the curing step.
It is a method for manufacturing a third laminated body in which a semiconductor substrate, a film for forming a back surface protective film, a protective layer, and a support sheet are laminated in this order.
The back surface protective film forming film of the back surface protective film forming composite according to claim 2 is attached to the back surface of the semiconductor substrate, and the semiconductor substrate, the back surface protective film forming film, and the protective layer are attached. In the first laminating step of obtaining a second laminated film in which and are laminated in this order,
A support sheet is attached to the protective layer of the second laminate, and the semiconductor substrate, the back surface protective film forming film, the protective layer, and the support sheet are laminated in this order. The second laminating process to get the body,
A method for producing a third laminated body, which comprises a transporting step of transporting the second laminated body from the first laminating step to the second laminating step.
A support sheet is attached to the protective layer of the first laminate manufactured by the manufacturing method according to claim 3, and the semiconductor substrate, the back surface protective film, the protective layer, and the support sheet are attached to the protective layer. The second laminating step of obtaining the fourth laminated body which was laminated in order, and
A step of dying the semiconductor substrate and the back surface protective film of the fourth laminated body to obtain a semiconductor device with a back surface protective film.
A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor device with a back surface protective film from the support sheet.
The film for forming the back surface protective film of the third laminate produced by the production method according to claim 4 is cured to form a back surface protective film, and the semiconductor substrate, the back surface protective film, the protective layer, and the like. A curing step of obtaining a fourth laminated body in which the support sheets are laminated in this order, and
A step of dicing the semiconductor substrate and the back surface protective film of the fourth laminated body to obtain a semiconductor device with a back surface protective film.
A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor device with a back surface protective film from the support sheet.
A step of dicing the semiconductor substrate and the back surface protective film forming film of the third laminate manufactured by the production method according to claim 4 to obtain a semiconductor device with a back surface protective film forming film.
A curing step of curing the back surface protective film forming film to obtain a back surface protective film,
A method for manufacturing a semiconductor device with a back surface protective film, which comprises a step of picking up the semiconductor with a back surface protective film or a semiconductor device with a back surface protective film from the support sheet.