WO2020218516A1 - Method of manufacturing three-layer laminate - Google Patents

Abstract

The present invention relates to a method of manufacturing a three-layer laminate including a work (14), one surface of which being a circuit surface (14a) and the other surface being a back side (14b), the method including: a first laminating step for attaching a back side protective-coating formation film (13) on the back side (14b) of the work (14); and a second laminating step for attaching a support sheet (10) on the back side protective-coating formation film (13), these steps being performed in this order, wherein during the processing from the first laminating step to the second laminating step, a two-layer laminate including the work (14) and the back side protective-coating formation film (13) laminated thereon is transferred one by one and the first and second laminating steps are performed by a device for attaching a back side protective-coating formation film and a device for attaching a support sheet coupled with each other or performed in the same device.

Description

Method for manufacturing the third laminate

The present invention relates to a method for producing a third laminated body. More specifically, the present invention relates to a method for manufacturing a third laminated body in which a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet are laminated in this order.
The present application claims priority based on Japanese Patent Application No. 2019-086303 filed in Japan on April 26, 2019, the contents of which are incorporated herein by reference.

In recent years, semiconductor devices to which a mounting method called a face down method has been applied have been manufactured. In the face-down method, a semiconductor chip having an electrode such as a bump on the circuit surface is used, and the electrode is bonded to the substrate. Therefore, the back surface of the semiconductor chip opposite to the circuit surface may be exposed.

A resin film containing an organic material is formed on the back surface of the exposed semiconductor chip as a back surface protective film, and may be incorporated into a semiconductor device as a semiconductor chip with a back surface protective film. The back surface protective film is used to prevent cracks from occurring in the semiconductor chip after the dicing step or packaging (for example, Patent Documents 1 and 2).

Such a semiconductor chip with a back surface protective film is manufactured, for example, through the process shown in FIG. That is, the back surface protective film forming film 13 is laminated on the back surface 8b of the semiconductor wafer 8 having the circuit surface (FIG. 9A), and the back surface protective film forming film 13 is heat-cured or energy ray-cured to protect the back surface. The film is 13'(FIG. 9 (B)), the back surface protective film 13'is laser-marked (FIG. 9 (C)), and the support sheet 10 is laminated on the back surface protective film 13'(FIG. 9 (D)). The wafer 8 and the back surface protective film 13'are die to obtain the semiconductor chip 7 with the back surface protective film (FIGS. 9 (E) and 9 (F)), and the semiconductor chip 7 with the back surface protective film is picked up from the support sheet 10. (Fig. 9 (G)) A method is known. The order of the curing step and the laser marking step is arbitrary, and the back surface protective film forming film 13 is laminated on the back surface 8b of the semiconductor wafer 8 having a circuit surface (FIG. 9A), and the back surface protective film forming film 13 is laminated. After laser marking, the back surface protective film forming film 13 may be thermoset or energy ray cured to form a back surface protective film 13', and then the steps of FIGS. 9 (D) to 9 (G) may be performed. In FIG. 9A, the first laminating step of laminating the back surface protective film forming film 13 on the back surface 8b of the semiconductor wafer 8 and in FIG. 9D, the support sheet 10 is laminated on the back surface protective film 13'. Conventionally, the second laminating step is performed by separate devices.

Further, a protective film forming composite sheet in which the back surface protective film forming film 13 and the support sheet 10 are integrated is used for manufacturing a semiconductor chip with a back surface protective film (for example, Patent Document 2).

A method for manufacturing a semiconductor chip with a back surface protective film using a composite sheet for forming a protective film goes through, for example, the process shown in FIG. That is, the back surface protective film forming film 13 of the protective film forming composite sheet 1 in which the back surface protective film forming film 13 and the support sheet 10 are laminated is attached to the back surface 8b of the semiconductor wafer 8 having the circuit surface (FIG. 10 (A')), the circuit surface protection tape 17 is peeled off (FIG. 10 (B')), and the back surface protective film forming film 13 is heat-cured or energy ray-cured to obtain the back surface protective film 13'(FIG. 10). (C')), laser marking the back surface protective film 13'from the side of the support sheet 10 (FIG. 10 (D')), dying the semiconductor wafer 8 and the back surface protective film 13', and semiconductor with the back surface protective film. A method is known in which the chip 7 is used (FIGS. 10 (E') and 10 (F')), and the semiconductor chip 7 with the back surface protective film is picked up from the support sheet 10 (FIG. 10 (G')). In this case as well, the order of the curing step and the laser marking step is arbitrary.

Japanese Patent No. 4271597 Japanese Patent No. 5363662

As described above, in FIG. 9 (A), the first laminating step of laminating the back surface protective film forming film 13 on the back surface 8b of the semiconductor wafer 8 and in FIG. 9 (D), the back surface protective film 13'is supported. Conventionally, the second laminating step of laminating the sheets 10 is performed by separate devices. The laminate obtained in the first laminating step is housed in one cassette and transported by hand to an apparatus performing the second step, and the transport by this person is a back surface protective film. Reduces the production efficiency of semiconductor chips.
Further, the laminated body obtained in the first laminating step may be contaminated or damaged while being housed in the cassette and transported.

Further, in the conventional method for manufacturing a semiconductor chip with a protective film shown in FIG. 10, since the protective film forming composite sheet 1 in which the back surface protective film forming film 13 and the support sheet 10 are integrated is used, the back surface is used. The step of attaching the back surface protective film forming film 13 to the work to be protected (that is, the semiconductor wafer 8) of the protective film forming film 13 and the step of attaching the support sheet 10 can be made into one step. However, when the protective film forming composite sheet 1 is used, the characteristics of the back surface protective film forming film 13 and the characteristics of the support sheet 10 must be combined in combination, and a method for manufacturing a semiconductor chip with a protective film that meets the purpose. Therefore, many kinds of composite sheets 1 for forming a protective film must be prepared.

Further, usually, in the protective film forming composite sheet 1, the back surface protective film forming film 13 punched to a predetermined size is laminated on the support sheet 10, and the laminated body is punched to the size of a dicing jig to remove unnecessary portions. It can be manufactured by removing it. Unlike the case where the back surface protective film forming film 13 and the support sheet 10 are sequentially laminated on the hard semiconductor wafer 8 as in the method of FIG. 9, in the production of the protective film forming composite sheet 1, each has a soft back surface. Since the protective film forming film 13 and the support sheet 10 are bonded together, there is a problem that the difficulty level is high and the yield is deteriorated, so that the manufacturing cost is high.

The present invention has been made in view of the above circumstances, and the third laminated body in which a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet are laminated in this order is efficiently and low. An object of the present invention is to provide a method for producing a third laminate that can be produced at low cost.

The present invention provides the following method for producing a third laminate.

[1] A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
One side of the work is the circuit surface and the other side is the back surface.
The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
From the first laminating step to the second laminating step, the second laminated body in which the back surface protective film forming film is laminated on the work is conveyed one by one.
The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
[2] A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
One side of the work is the circuit surface and the other side is the back surface.
The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
The transport distance of the work from the sticking start point of the first laminating step to the sticking completion point of the second laminating step is 7000 mm or less.
The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
[3] A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
One side of the work is the circuit surface and the other side is the back surface.
The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
The transport time of the work from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is 400 s or less.
The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
[4] The third laminated body according to [3], wherein the transport time of the work from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is 150 s or less. Manufacturing method.

According to the present invention, a third laminated body in which a work such as a semiconductor wafer, a film for forming a back surface protective film, and a support sheet are laminated in this order can be efficiently manufactured at low cost. Manufacturing method is provided.

It is the schematic sectional drawing which shows an example of embodiment of the manufacturing method of the 3rd laminated body schematically. It is the schematic sectional drawing which shows an example of the back surface protective film forming film. It is the schematic sectional drawing which shows another example of the embodiment of the manufacturing method of the 3rd laminated body schematically. It is the schematic sectional drawing which shows an example of embodiment of the manufacturing method of 4th laminated body schematically. It is the schematic sectional drawing which shows another example of the embodiment of the manufacturing method of the 4th laminated body schematically. It is schematic cross-sectional view which shows an example of embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows another example of the embodiment of the manufacturing method of the semiconductor device with a back surface protective film schematically. It is schematic cross-sectional view which shows another example of the embodiment of the manufacturing method of the semiconductor device with the back surface protective film schematically. It is schematic cross-sectional view which shows typically an example of the manufacturing method of the conventional semiconductor chip with a back surface protective film. It is schematic cross-sectional view which shows another example of the conventional manufacturing method of the semiconductor chip with the back surface protective film schematically. It is a schematic sectional drawing which shows an example of the support sheet 10 which provided the pressure-sensitive adhesive layer 12 on the base material 11.

Hereinafter, a method for producing a third laminate, which is an embodiment to which the present invention is applied, will be described in detail. In the drawings used in the following description, in order to make the features easier to understand, the featured parts may be enlarged for convenience, and the dimensional ratios of each component may not be the same as the actual ones. Absent.

<< Manufacturing method of the third laminate >>
FIG. 1 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a third laminated body. The method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 19 in which the work 14, the back surface protective film forming film 13, and the support sheet 10 are laminated in this order. One surface of 14, one surface is a circuit surface 14a, the other surface is a back surface 14b (FIG. 1 (a)), and the back surface protective film forming film 13 is attached to the back surface 14b side of the work 14. The laminating step (FIG. 1 (b)) and the second laminating step (FIG. 1 (d)) of attaching the support sheet 10 to the back surface protective film forming film 13 are included in this order (FIG. 1 (a)). ~ FIG. 1 (e)).

In the present embodiment, the device for attaching the back surface protective film forming film and the support sheet are attached between the first laminating step and the second laminating step (FIGS. 1B to 1d). It is performed by connecting the devices to be used, or in the same device.
Therefore, in the present embodiment, the second laminated body in which the back surface protective film forming film 13 is laminated on the work 14 is housed in the cassette between the first laminating step and the second laminating step. Instead, they can be transported one by one to the second laminating step shown in FIG. 1 (d). By performing in the same device, the device space can be further reduced. By connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet, it is possible to deal with it by modifying the conventional device without designing from scratch, and the initial cost can be reduced. Since the second laminated body is not housed in the cassette and transported to the outside of the apparatus, the production efficiency can be improved and the contamination and damage of the second laminated body can be suppressed.
The step of connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet is the step of connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet, and the first step. From the first laminating step to the step of performing the second laminating step from one laminating step, or by a device in which a device for attaching a back surface protective film forming film and a device for attaching a support sheet are connected. It means that the second laminating step is carried out.

The back surface protective film forming film 13 used in the first laminating step may be processed into the shape of the work in advance, or may be processed in the same apparatus immediately before the first laminating step is performed. If the size of the work is constant on the production line used, the former that can be machined in advance is more efficient, and if the size of the work is likely to change, the latter For example, there is no waste of the film for forming the back surface protective film, and there is a cost merit.

Further, in another embodiment, the transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step can be designed to be 7000 mm or less. The device space can be reduced. The transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step can be 6500 mm or less, 6000 mm or less, or 4500 mm or less. It can be set to 3000 mm or less.
Further, the transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step can be 200 to 7000 mm or less, and 200 to 6000 mm. It can also be 200 to 4500 mm, and can be 200 to 3000 mm.
In the present specification, the transport distance of the work 14 from the sticking start point of the first laminating process to the sticking completion point of the second laminating step is the transport distance from the sticking point of the first laminating process to the second laminating step. It means the distance actually moved by the work 14 to the pasting completion point of.

Further, in still another embodiment, the transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be set to 400 s or less. It can be set to 150 s or less, and the process time can be shortened. The transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be 130 s or less, 110 s or less, 90 s or less. It can be set to 70s or less.
The transport time of the work 14 from the start of pasting of the first laminating step to the completion of pasting of the second laminating step can be 15 to 400 s or 15 to 150 s. It can be 15 to 130 s, 15 to 110 s, 15 to 90 s, or 15 to 70 s.

The transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is the time required for the first laminating step and the place where the first laminating step was performed. It is roughly divided into three, the transportation time from the to the place where the second laminating process is performed, and the time required for the second laminating process.

The time required for the first laminating step can be 40 s or less, 15 s or less, and the process time can be shortened. The time required for the first laminating step can be 10 s or less, or 8 s or less.
Further, the time required for the first laminating step can be 3 to 40 s, 3 to 15 s, 3 to 10 s, or 3 to 8 s.

The transport time from the place where the first laminating step is performed to the place where the second laminating step is performed can be 200 s or less, can be 75 s or less, and the process time can be shortened. The transport time from the place where the first laminating step is performed to the place where the second laminating step is performed can be 60 s or less, or 37 s or less.
Further, the transport time from the place where the first laminating step is performed to the place where the second laminating step is performed can be 3 to 200 s, 3 to 75 s, or 3 to 60 s. It can also be 3 to 37 s.

The time required for the second laminating step can be 160 s or less, 60 s or less, and the process time can be shortened. The time required for the second laminating step can be 40 s or less, or 25 s or less.
Further, the time required for the second laminating step can be set to 3 to 160 s, 3 to 60 s, 3 to 40 s, or 3 to 25 s.

The transport distance of the work from the sticking start point of the first laminating step of the present embodiment shown in FIG. 1 (b) to the sticking completion point of the second laminating step shown in FIG. 1 (d) is 7000 mm. It can be less than or equal to 6500 mm, less than or equal to 6000 mm, less than or equal to 4500 mm, and less than or equal to 3000 mm. The transport time of the work from the start of sticking of the first laminating step of the present embodiment shown in FIG. 1 (b) to the completion of sticking of the second laminating step shown in FIG. 1 (d) is 400 s. It can be less than or equal to 150 s, less than 130 s, less than 110 s, less than 90 s, less than 70 s.

The method for producing the third laminated body of the present embodiment can be carried out by connecting an apparatus for attaching a film for forming a back surface protective film and an apparatus for attaching a support sheet, or can be carried out in the same apparatus.
The same device can be implemented by, for example, a device including a back surface protective film forming film sticking table, a support sheet sticking table, and a transport arm.
Specifically, the work 14 put into the above device is conveyed to the back surface protective film forming film affixing table by the transfer arm, and is installed with the back surface 14b facing upward. On the back surface protective film forming film attachment table, the back surface protective film forming film 13 processed in advance to the size of the work 14 outside the device or immediately before the work 14 is attached to the back surface 14b side of the work 14. It becomes a two-layered body. The second laminated body is conveyed to the support sheet affixing table by a conveying arm, and is installed with the back surface protective film forming film side facing upward. In the support sheet attachment table, the support tape 10 is attached to the back surface protective film forming film 13 of the second laminate to form the third laminate.

The speed at which the protective film forming film 13 is attached to the back side of the work 14 in the first laminating step and the speed at which the support sheet 10 is attached to the protective film forming film 13 in the second laminating step are 100 mm / sec or less. It can also be 80 mm / sec or less, 60 mm / sec or less, or 40 mm / sec or less. When the sticking speed in the first laminating step and the sticking speed in the second laminating step are equal to or less than the upper limit value, the adhesion between the work 14 and the protective film forming film 13 and the protective film forming are formed. The adhesion between the film 13 and the support sheet 10 can be improved.
The sticking speed in the first laminating step and the sticking speed in the second laminating step may be 2 mm / sec or more, 5 mm / sec or more, or 10 mm / sec or more. You can also do it. When the sticking speed in the first laminating step and the sticking speed in the second laminating step are equal to or higher than the lower limit, the production efficiency of the third laminated body 19 is improved and the first laminating step is performed. The transport time of the work 14 from the start of sticking to the completion of sticking in the second laminating step can be 400 s or less.
The sticking speed in the first laminating step and the sticking speed in the second laminating step can be 2 to 100 mm / sec, 2 to 80 mm / sec, or 5 to 60 mm / sec. It can be set to seconds, or 10 to 40 mm / sec.

The device preferably includes 1 to 5 film sticking tables for forming a back surface protective film, and more preferably 1 to 3 tables. When the number of the back surface protective film forming film sticking tables in the apparatus is not less than the lower limit value of the above range, the production efficiency is increased, and when it is not more than the upper limit value, the space of the apparatus can be reduced.

The device preferably includes 1 to 5 support sheet attachment tables, and more preferably 1 to 3 tables. When the number of support sheet attachment tables in the apparatus is not less than the lower limit value of the above range, the production efficiency is increased, and when it is not more than the upper limit value, the space of the apparatus can be reduced.

It is preferable that the device is provided with a transfer arm according to each transfer path. When the ratio of the number of transport arms to the total number of tables is 1 or more, the production efficiency can be improved. Further, when two or more tables are provided, if the ratio of the number of transfer arms to the total number of tables is more than 0 and less than 1 (for example, the total number of transfer arms is 1 for two tables), the space of the device is reduced. Is possible.

Specific examples of connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet include a device having a mechanism for attaching the back surface protective film forming film and a mechanism for attaching the support sheet. Examples thereof include a method in which the devices are made continuous and the second laminated body in which the back surface protective film forming film 13 is attached to the work 14 is conveyed one by one by using a conveying arm between the mechanisms.

In this embodiment, a semiconductor wafer is used as the work 14 shown in FIG. 1 (a). One surface of the semiconductor wafer is the circuit surface 14a, on which bumps are formed. Further, in order to prevent the circuit surface 14a and bumps of the semiconductor wafer from being crushed during grinding of the back surface of the semiconductor wafer and dimples and cracks on the back surface of the wafer, the circuit surface 14a and bumps of the semiconductor wafer are protected from the circuit surface. It may be protected by a tape 17. The circuit surface protection tape 17 is a back surface grinding tape, and the back surface of the semiconductor wafer, which is the work 14, (that is, the back surface 14b of the work) may be a ground surface.

The work 14 is not limited as long as it has a circuit surface 14a on one side and the other surface can be said to be the back surface. As the work 14, a semiconductor wafer having a circuit surface on one side or individual electronic components are sealed with a sealing resin, and one side has a terminal forming surface (in other words, a circuit surface) of a semiconductor device with terminals. An example includes a semiconductor device panel composed of a semiconductor device assembly with terminals.

As the circuit surface protection tape 17, for example, the surface protection sheet disclosed in JP-A-2016-192488 and JP-A-2009-141265 can be used. The circuit surface protection tape 17 includes an adhesive layer having an appropriate removability. The pressure-sensitive adhesive layer may be formed of a general-purpose weak pressure-sensitive pressure-sensitive adhesive such as a rubber-based, acrylic resin, silicone resin, urethane resin, or vinyl ether resin. Further, the pressure-sensitive adhesive layer may be an energy ray-curable pressure-sensitive adhesive that is cured by irradiation with energy rays and becomes removable. The circuit surface protection tape 17 has a double-sided tape shape, and the outer side of the circuit surface protection tape 17 may be fixed to a hard support, or the work 14 may be fixed to a hard support. ..

As used herein, the term "energy beam" means an electromagnetic wave or a charged particle beam having an energy quantum. Examples of energy rays include ultraviolet rays, radiation, electron beams and the like. Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
Further, in the present specification, "energy ray curable" means a property of being cured by irradiating with energy rays, and "non-energy ray curable" is a property of not being cured by irradiating with energy rays. Means.

In the first laminating step of the present embodiment shown in FIG. 1 (b), the back surface protective film forming film 13 can be used as the first laminated body 5 shown in FIG. The first laminated body 5 shown in FIG. 2 includes a first release film 151 on one surface of the back surface protective film forming film 13, and a second release film 152 on the other surface. After the first release film 151 is peeled off, in the first laminating step, the exposed surface 13a from which the release film of the back surface protective film forming film 13 has been peeled off is attached to the back surface 14b of the work 14 facing each other (FIG. 1 (b)). The back surface protective film forming film 13 at this time may be one that has been processed in advance according to the shape of the work 14, or may be processed and used in the apparatus immediately before. Next, it is preferable that the second release film 152 is peeled off to form a second laminated body (FIG. 1 (c)).

The back surface protective film forming film shown in FIG. 2 is prepared by, for example, applying a protective film forming composition containing a solvent on the peeling surface of a second release film 152 having a thickness of 10 to 100 μm with a knife coater. It is dried in an oven at 120 ° C. for 2 minutes to form a back surface protective film forming film. Next, the release surface of the first release film 151 having a thickness of 10 to 100 μm is overlapped with the back surface protective film forming film and the two are bonded to each other, and the first release film 151 and the back surface protective film forming film (back surface protection in FIG. 2) are laminated. A first laminated body 5 composed of a film forming film 13) (thickness: 3 to 50 μm) and a second release film 152 can be obtained. Such a first laminated body 5 is suitable for storage as a roll, for example.

In the second laminating step shown in FIG. 1D, the support sheet 10 is laminated on the back surface protective film forming film 13 laminated on the back surface 14b of the work 14. The support sheet 10 is, for example, a circular polyethylene terephthalate film having a thickness of 80 μm and a diameter of 270 mm, and may be provided with a jig adhesive layer 16 on the outer peripheral portion. In the present embodiment, the work 14 may be fixed to the fixing jig 18 together with the back surface protective film forming film 13. Then, the support sheet 10 may be laminated on the back surface protective film forming film 13 and fixed to the fixing jig 18 via the jig adhesive layer 16 (FIG. 1 (e)).

(Protective film forming composition)
The composition of the protective film forming composition for forming the back surface protective film forming film preferably contains a binder polymer component and a curable component.

(Binder polymer component)
A binder polymer component is used to impart sufficient adhesiveness and film-forming property (sheet forming property) to the back surface protective film forming film. As the binder polymer component, conventionally known acrylic resins, polyester resins, urethane resins, acrylic urethane resins, silicone resins, rubber-based polymers and the like can be used.

The weight average molecular weight (Mw) of the binder polymer component is preferably 10,000 to 2 million, more preferably 100,000 to 1.2 million. If the weight average molecular weight of the binder polymer component is too low, the adhesive force between the back surface protective film forming film and the support sheet becomes high, and transfer failure of the back surface protective film forming film may occur. If it is too high, the back surface protective film is formed. The adhesiveness of the film for use may deteriorate and transfer to a chip or the like may not be possible, or the back surface protective film may peel off from the chip or the like after transfer.
That is, when Mw is at least the lower limit of the above range, the adhesive force between the back surface protective film forming film and the support sheet does not become too high, and transfer failure of the back surface protective film forming film can be suppressed. When Mw is not more than the upper limit of the above range, the deterioration of the adhesiveness of the back surface protective film forming film is suppressed and the film cannot be transferred to the chip or the like, or the back surface protective film is peeled off from the chip or the like after the transfer. Occurrence is suppressed.
In the present embodiment, the weight average molecular weight (Mw) is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.

Acrylic resin is preferably used as the binder polymer component. The glass transition temperature (Tg) of the acrylic resin is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and particularly preferably −40 to 30 ° C. If the glass transition temperature of the acrylic resin is too low, the peeling force between the back surface protective film forming film and the support sheet becomes large, and transfer failure of the back surface protective film forming film may occur. If it is too high, the back surface protective film forming film may occur. The adhesiveness of the film may be reduced and transfer to a chip or the like may not be possible, or the back surface protective film may be peeled off from the chip or the like after transfer.
That is, when Tg is not more than the lower limit of the above range, the peeling force between the back surface protective film forming film and the support sheet does not become too large, and transfer failure of the back surface protective film forming film can be suppressed. When Tg is equal to or less than the upper limit of the above range. The deterioration of the adhesiveness of the back surface protective film forming film is suppressed, and the occurrence of a problem that the back surface protective film cannot be transferred to the chip or the like or the back surface protective film is peeled off from the chip or the like after the transfer is suppressed.
In the present specification, the "glass transition temperature" is represented by the temperature of the inflection point of the obtained DSC curve obtained by measuring the DSC curve of the sample using a differential scanning calorimeter.

Examples of the monomer constituting the acrylic resin include a (meth) acrylic acid ester monomer or a derivative thereof. For example, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl. Examples include (meth) acrylate. Further, a (meth) acrylate having a cyclic skeleton, specifically, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, Examples thereof include dicyclopentenyloxyethyl (meth) acrylate and imide (meth) acrylate. Further, examples of the monomer having a functional group include hydroxymethyl (meth) acrylate having a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and the like; and glycidyl (meth) having an epoxy group. Examples include acrylate. As the acrylic resin, an acrylic resin containing a monomer having a hydroxyl group is preferable because it has good compatibility with a curable component described later. Further, the acrylic resin may be copolymerized with acrylic acid, methacrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and the like.

In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid. For example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is referred to as "(meth) acryloyl group". Is a concept that includes both "acryloyl group" and "methacryloyl group".

Further, as a binder polymer component, a thermoplastic resin may be blended in order to maintain the flexibility of the protective film after curing. As such a thermoplastic resin, one having a weight average molecular weight of 1,000 to 100,000 is preferable, and one having a weight average molecular weight of 3,000 to 80,000 is more preferable. The glass transition temperature of the thermoplastic resin is preferably −30 to 120 ° C., more preferably −20 to 120 ° C. Examples of the thermoplastic resin include polyester resin, urethane resin, phenoxy resin, polybutene, polybutadiene, polystyrene and the like. These thermoplastic resins can be used alone or in admixture of two or more. By containing the above-mentioned thermoplastic resin, the back surface protective film forming film follows the transfer surface of the back surface protective film forming film, and the generation of voids and the like can be suppressed.

(Curable component)
As the curable component, a thermosetting component and / or an energy ray curable component is used.

As the thermosetting component, a thermosetting resin and a thermosetting agent are used. As the thermosetting resin, for example, an epoxy resin is preferable.

As the epoxy resin, a conventionally known epoxy resin can be used. Specific examples of the epoxy resin include polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, and bisphenol. Examples thereof include epoxy compounds having bifunctionality or higher in the molecule, such as A-type epoxy resin, bisphenol F-type epoxy resin, and phenylene skeleton-type epoxy resin. These can be used alone or in combination of two or more.

The film for forming the back surface protective film contains 100 parts by mass of the binder polymer component, preferably 1 to 1000 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass. Is done. If the content of the thermosetting resin is less than 1 part by mass, sufficient adhesiveness may not be obtained, and if it exceeds 1000 parts by mass, the peeling force between the back surface protective film forming film and the pressure-sensitive adhesive sheet or the base film becomes strong. It becomes high, and transfer failure of the back surface protective film forming film may occur.
That is, when the content of the thermosetting resin is at least the lower limit of the above range, sufficient adhesiveness can be obtained. When the content of the thermosetting resin is not more than the upper limit of the above range, the peeling force between the back surface protective film forming film and the pressure-sensitive adhesive sheet or the base film does not become too high, and transfer failure of the back surface protective film forming film occurs. It is suppressed.

The thermosetting agent functions as a curing agent for thermosetting resins, especially epoxy resins. Preferred thermosetting agents include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.

Specific examples of the phenolic curing agent include polyfunctional phenolic resin, biphenol, novolak type phenolic resin, dicyclopentadiene type phenolic resin, zylock type phenolic resin, and aralkylphenolic resin. Specific examples of the amine-based curing agent include DICY (dicyandiamide). These can be used alone or in combination of two or more.

The content of the thermosetting agent is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the thermosetting resin. If the content of the thermosetting agent is small, the adhesiveness may not be obtained due to insufficient curing, and if it is excessive, the hygroscopicity of the film for forming the back surface protective film may increase and the reliability of the semiconductor device may be lowered.
That is, when the content of the thermosetting agent is not more than the lower limit value in the above range, insufficient curing is unlikely to occur and adhesiveness is easily obtained. When the content of the thermosetting agent is not more than the upper limit of the above range, the hygroscopicity of the back surface protective film forming film does not increase, and it is difficult to lower the reliability of the semiconductor device.

As the energy ray-curable component, a low molecular weight compound (energy ray-polymerizable compound) containing an energy ray-polymerizable group and polymerizing and curing when irradiated with energy rays such as ultraviolet rays and electron beams can be used. Specifically, as such an energy ray-curable component, trimethylolpropantriacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol. Examples thereof include acrylate-based compounds such as diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate-based oligomer, epoxy-modified acrylate, polyether acrylate and itaconic acid oligomer. Such a compound has at least one polymerizable double bond in the molecule, and usually has a weight average molecular weight of about 100 to 30,000, preferably about 300 to 10,000. The blending amount of the energy ray-polymerizable compound is preferably 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass with respect to 100 parts by mass of the binder polymer component.

Further, as the energy ray-curable component, an energy ray-curable polymer in which an energy ray-curable group is bonded to the main chain or side chain of the binder polymer component may be used. Such an energy ray-curable polymer has both a function as a binder polymer component and a function as a curable component.

The main skeleton of the energy ray-curable polymer is not particularly limited, and may be an acrylic resin that is widely used as a binder polymer component, or a polyester resin, a polyether resin, or the like, but synthetic and physical properties. It is particularly preferable to use an acrylic resin as the main skeleton because it is easy to control.

The energy ray-polymerizable group bonded to the main chain or side chain of the energy ray-curable polymer is, for example, a group containing an energy ray-polymerizable carbon-carbon double bond, specifically, a (meth) acryloyl group or the like. Can be exemplified. The energy ray-polymerizable group may be bonded to the energy ray-curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.

The weight average molecular weight (Mw) of the energy ray-curable polymer to which the energy ray-polymerizable group is bonded is preferably 10,000 to 2 million, more preferably 100,000 to 1.5 million. The glass transition temperature (Tg) of the energy ray-curable polymer is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and particularly preferably −40 to 30 ° C.

The energy ray-curable polymer is, for example, an acrylic resin containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group, and a substituent and an energy ray-polymerizable carbon that react with the functional group. It is obtained by reacting with a polymerizable group-containing compound having 1 to 5 carbon double bonds per molecule. Examples of the substituent that reacts with the functional group include an isocyanate group, a glycidyl group, a carboxyl group and the like.

Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate; (meth) acrylic acid and the like. Can be mentioned.

The acrylic resin is a (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group or a derivative thereof, and another (meth) acrylic acid ester monomer copolymerizable therewith. Alternatively, it is preferably a copolymer composed of a derivative thereof.

Examples of the (meth) acrylic monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof include 2-hydroxyethyl (meth) acrylate having a hydroxyl group and 2-hydroxy. Propyl (meth) acrylate; acrylic acid having a carboxyl group, methacrylic acid, itaconic acid; glycidyl methacrylate having an epoxy group, glycidyl acrylate and the like can be mentioned.

As another (meth) acrylic acid ester monomer or a derivative thereof that can be copolymerized with the above monomer, for example, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically a methyl (meth) acrylate. , Ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and the like; (meth) acrylate having a cyclic skeleton, specifically cyclohexyl (meth) acrylate, Examples thereof include benzyl (meth) acrylate, isobornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, and imide acrylate. Further, vinyl acetate, acrylonitrile, styrene and the like may be copolymerized with the acrylic resin.

Even when an energy ray-curable polymer is used, the above-mentioned energy ray-polymerizable compound may be used in combination, or a binder polymer component may be used in combination. Regarding the relationship between the blending amounts of these three in the film for forming the back surface protective film in the present invention, the energy ray-polymerizable compound is preferably used with respect to 100 parts by mass of the total mass of the energy ray-curable polymer and the binder polymer component. It is contained in an amount of 1 to 1500 parts by mass, more preferably 10 to 500 parts by mass, and particularly preferably 20 to 200 parts by mass.

By imparting energy ray curability to the back surface protective film forming film, the back surface protective film forming film can be cured easily and in a short time, and the production efficiency of the chip with the protective film is improved. Conventionally, a protective film for a chip is generally formed of a thermosetting resin such as an epoxy resin, but since the curing temperature of the thermosetting resin exceeds 200 ° C. and the curing time is about 2 hours. It was an obstacle to improving production efficiency. However, since the energy ray-curable back surface protective film forming film is cured in a short time by energy ray irradiation, the protective film can be easily formed and can contribute to the improvement of production efficiency.

The back surface protective film forming film can contain the following components in addition to the above binder polymer component and curable component.

(Colorant)
The back surface protective film forming film preferably contains a colorant. By blending a colorant in the back surface protective film forming film, it is possible to shield infrared rays and the like generated from surrounding devices when the semiconductor device is incorporated into a device, and prevent the semiconductor device from malfunctioning due to them. .. Further, the visibility of characters when a product number or the like is printed on the protective film obtained by curing the back surface protective film forming film is improved. That is, in a semiconductor device or semiconductor chip on which a protective film is formed, a product number or the like is usually printed on the surface of the protective film by a laser marking method (a method in which the surface of the protective film is scraped off by laser light), but the protective film is By containing the colorant, a sufficient contrast difference between the portion scraped by the laser beam of the protective film and the portion not scraped can be obtained, and the visibility is improved. As the colorant, organic or inorganic pigments and dyes are used. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. As the black pigment, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon and the like are used, but the black pigment is not limited thereto. From the viewpoint of increasing the reliability of the semiconductor device, carbon black is particularly preferable. As the colorant, one type may be used alone, or two or more types may be used in combination. The high curability of the back surface protective film forming film in the present invention is particularly preferably exhibited when the transparency of ultraviolet rays is reduced by using a colorant that reduces the transparency of both visible light and / or infrared rays and ultraviolet rays. Will be done. As a colorant that reduces the transparency of both visible light and / or infrared rays and ultraviolet rays, in addition to the above-mentioned black pigment, absorbability or reflectivity in both wavelength regions of visible light and / or infrared rays and ultraviolet rays is provided. It is not particularly limited as long as it has.

The blending amount of the colorant is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 0.5 to 25 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film. It is 1 to 15 parts by mass.

(Curing accelerator)
The curing accelerator is used to adjust the curing rate of the back surface protective film forming film. The curing accelerator is preferably used when the epoxy resin and the thermosetting agent are used in combination, especially in the curable component.

Preferred curing accelerators are tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; Examples thereof include tetraphenylborone salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These can be used alone or in combination of two or more.

The curing accelerator is contained in an amount of preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the curable component. By containing the curing accelerator in an amount in the above range, it has excellent adhesive properties even when exposed to high temperature and high humidity, and achieves high reliability even when exposed to severe reflow conditions. can do. If the content of the curing accelerator is low, sufficient adhesive properties cannot be obtained due to insufficient curing, and if it is excessive, the curing accelerator having high polarity has an adhesive interface in the back surface protective film forming film under high temperature and high humidity. By moving to the side and segregating, the reliability of the semiconductor device is reduced.

(Coupling agent)
The coupling agent may be used to improve the adhesiveness, adhesion and / or cohesiveness of the protective film to the chip of the back surface protective film forming film. Further, by using the coupling agent, the water resistance of the protective film obtained by curing the back surface protective film forming film can be improved without impairing the heat resistance of the protective film.

As the coupling agent, a compound having a group that reacts with a functional group of a binder polymer component, a curable component, or the like is preferably used. As the coupling agent, a silane coupling agent is desirable. Examples of such a coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ- (methacryloxypropyl). ) Trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N- Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxy Examples thereof include silane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These can be used alone or in combination of two or more.

The coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass with respect to 100 parts by mass of the total of the binder polymer component and the curable component. Is included in the ratio of. If the content of the coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgas.
That is, when the content of the coupling agent is at least the lower limit value in the above range, the effect of the coupling agent is obtained, and when it is at least the upper limit value, outgassing is suppressed.

(Inorganic filler)
By blending the inorganic filler into the film for forming the back surface protective film, it is possible to adjust the coefficient of thermal expansion of the protective film after curing, and the coefficient of thermal expansion of the protective film after curing is optimized for the semiconductor chip. By doing so, the reliability of the semiconductor device can be improved. It is also possible to reduce the hygroscopicity of the protective film after curing.

Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride and the like, spherical beads, single crystal fibers and glass fibers. Among these, silica filler and alumina filler are preferable. The inorganic filler can be used alone or in combination of two or more. The content of the inorganic filler can be usually adjusted in the range of 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the back surface protective film forming film.

(Photopolymerization initiator)
When the back surface protective film forming film contains an energy ray-curable component as the above-mentioned curable component, the energy ray-curable component is cured by irradiating with energy rays such as ultraviolet rays when using the film. At this time, by incorporating the photopolymerization initiator in the composition, the polymerization curing time and the amount of light irradiation can be reduced.

Specific examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2, 4-Diethylthioxanthone, α-hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1 -[4- (1-Methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, β-chloranthraquinone and the like can be mentioned. The photopolymerization initiator may be used alone or in combination of two or more.

The blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray-curable component. If it is less than 0.1 part by mass, satisfactory transferability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated, and the back surface protective film forming film is formed. Curability may be insufficient.
That is, when the blending ratio of the photopolymerization initiator is at least the lower limit of the above range, photopolymerization proceeds sufficiently and satisfactory transferability is obtained, and when it is at least the upper limit, residues that do not contribute to photopolymerization The formation is suppressed, and the curability of the back surface protective film forming film becomes sufficient.

(Crosslinking agent)
A cross-linking agent can also be added to adjust the initial adhesive force and cohesive force of the back surface protective film forming film. Examples of the cross-linking agent include an organic polyvalent isocyanate compound and an organic polyvalent imine compound.

Examples of the organic polyvalent isocyanate compound include aromatic polyvalent isocyanate compounds, aliphatic polyhydric isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimerics of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting with a polyol compound.

Examples of the organic polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, and the like. Diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, trimethylpropane adduct tolylene diisocyanate and Examples include lysine isocyanate.

Examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylpropan-tri-β-aziridinyl propionate, and tetramethylolmethane-tri. Examples thereof include -β-aziridinyl propionate and N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) triethylene melamine.

The cross-linking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the total amount of the binder polymer component and the energy ray-curable polymer. Used in proportions of parts.

(General-purpose additive)
In addition to the above, various additives may be added to the back surface protective film forming film, if necessary. Examples of various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents and the like.

(solvent)
The protective film-forming composition preferably further contains a solvent. The protective film-forming composition containing a solvent has good handleability.
The solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
The solvent contained in the protective film forming composition may be only one type, may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

The solvent contained in the protective film-forming composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the protective film-forming composition can be mixed more uniformly.

The back surface protective film forming film obtained by applying and drying the protective film forming composition composed of the above-mentioned components has adhesiveness and curability, and in an uncured state, the work (semiconductor wafer or It adheres easily by pressing against a chip, etc.). When pressing, the back surface protective film forming film may be heated. After curing, a protective film having high impact resistance can be finally provided, the adhesive strength is excellent, and a sufficient protective function can be maintained even under severe high temperature and high humidity conditions. The back surface protective film forming film may have a single-layer structure, or may have a multi-layer structure as long as it contains one or more layers containing the above components.
The ratio of the contents of the components that do not vaporize at room temperature in the back surface protective film forming film is the same as the ratio of the contents of the components in the protective film forming composition. In addition, in this specification, "normal temperature" means a temperature which is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 25 ° C.

The coating of the protective film forming composition may be carried out by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen. Examples thereof include a method using various coaters such as a coater, a Meyer bar coater, and a knife coater.

The drying conditions of the protective film-forming composition are not particularly limited, but when the protective film-forming composition contains a solvent described later, it is preferable to heat-dry the protective film-forming composition. The solvent-containing protective film-forming composition is preferably dried at 70 to 130 ° C. for 10 seconds to 5 minutes, for example.

The thickness of the back surface protective film forming film is not particularly limited, but is preferably 3 to 300 μm, more preferably 5 to 250 μm, and particularly preferably 7 to 200 μm.
As used herein, the term "thickness" refers to the average of five randomly selected thicknesses measured with a contact thickness meter on a cut surface randomly cut in the thickness direction of an object. It is a value represented by.

<Support sheet>
Examples of the support sheet 10 used in one aspect of the present invention include a sheet composed of only the base material 11 and a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer 12 on the base material 11.
The support sheet included in the third laminate of one aspect of the present invention is a release sheet for preventing dust or the like from adhering to the surface of the back surface protective film forming film, or the surface of the back surface protective film forming film in a dicing step or the like. It acts as a dicing sheet for protection.

The thickness of the support sheet is appropriately selected depending on the intended use, but is preferably 10 to 500 μm, more preferably 20 to 20 to 500 μm from the viewpoint of imparting sufficient flexibility and improving the adhesiveness to the silicon wafer. It is 350 μm, more preferably 30 to 200 μm.
The thickness of the support sheet includes not only the thickness of the base material constituting the support sheet but also the thickness of those layers and the film when the adhesive layer is provided.

(Base material)
A resin film is preferable as the base material 11 constituting the support sheet 10.
Examples of the resin film include polyethylene films such as low-density polyethylene (LDPE) films and linear low-density polyethylene (LLDPE) films, ethylene / propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene. Film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene / vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic Examples thereof include acid copolymer films, ethylene / (meth) acrylic acid ester copolymer films, polystyrene films, polycarbonate films, polyimide films, and fluororesin films.
The base material used in one aspect of the present invention may be a single-layer film composed of one type of resin film, or may be a laminated film in which two or more types of resin films are laminated.
Further, in one aspect of the present invention, a sheet obtained by subjecting the surface of a base material such as the above-mentioned resin film to a surface treatment may be used as a support sheet.

These resin films may be crosslinked films.
Further, colored resin films or printed ones can also be used.
Further, the resin film may be a sheet obtained by extruding a thermoplastic resin or may be a stretched resin film, or a curable resin thinned and cured by a predetermined means to form a sheet. May be used.

Among these resin films, a base material containing a polypropylene film is preferable from the viewpoint that it has excellent heat resistance, has expandability because it has appropriate flexibility, and easily maintains pickup suitability.
The base material containing the polypropylene film may have a single-layer structure composed of only the polypropylene film or a multi-layer structure composed of the polypropylene film and another resin film.
When the film for forming the back surface protective film is thermosetting, the resin film constituting the base material has heat resistance, thereby suppressing damage due to heat of the base material and suppressing the occurrence of defects in the manufacturing process of the semiconductor device. it can.

When a sheet composed of only a base material is used as the support sheet, the surface tension of the surface of the base material in contact with the surface of the back surface protective film forming film is preferable from the viewpoint of adjusting the peeling force within a certain range. Is 20 to 50 mN / m, more preferably 23 to 45 mN / m, still more preferably 25 to 40 mN / m.

The thickness of the base material constituting the support sheet is preferably 10 to 500 μm, more preferably 15 to 300 μm, and further preferably 20 to 200 μm.

(Adhesive sheet)
Examples of the pressure-sensitive adhesive sheet used as the support sheet 10 in one aspect of the present invention include those having a pressure-sensitive adhesive layer 12 formed from a pressure-sensitive adhesive on a base material 11 such as the resin film described above.
FIG. 11 is a schematic cross-sectional view showing an example of a support sheet 10 in which the pressure-sensitive adhesive layer 12 is provided on the base material 11.
When the support sheet 10 includes the pressure-sensitive adhesive layer 12, in the second laminating step, the pressure-sensitive adhesive layer 12 of the support sheet 10 is laminated on the back surface protective film forming film 13.

Examples of the pressure-sensitive adhesive which is a material for forming the pressure-sensitive adhesive layer include a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive resin, and the pressure-sensitive adhesive composition further contains a general-purpose additive such as the above-mentioned cross-linking agent and pressure-sensitive adhesive. You may.
When paying attention to the structure of the resin, examples of the adhesive resin include acrylic resin, urethane resin, phenoxy resin, silicone resin, saturated polyester resin, vinyl ether resin and the like, and acrylic resin is preferable. Further, when focusing on the function of the resin, examples thereof include an energy ray-curable pressure-sensitive adhesive, a heat-foaming type pressure-sensitive adhesive, and an energy ray-foaming type pressure-sensitive adhesive.
In one aspect of the present invention, an energy ray-curable adhesive formed from an adhesive composition containing an energy ray-curable resin from the viewpoint of adjusting the peeling force within a certain range and improving the pick-up property. A pressure-sensitive adhesive sheet having an agent layer or a pressure-sensitive adhesive sheet having a slightly adhesive pressure-sensitive adhesive layer is preferable.
The energy ray-curable resin may be a resin having a polymerizable group such as a (meth) acryloyl group or a vinyl group, but an adhesive resin having a polymerizable group is preferable.

In the first laminating step, the back surface protective film forming film is not attached to the entire surface of a work such as a semiconductor wafer, the back surface protective film forming film floats, and the back surface protective film forming film wrinkles occur. The support sheet can also serve as a peeling sheet for the back surface protective film forming film when a poor attachment of the back surface protective film forming film occurs. Even if the back surface protective film forming film is poorly attached in the first laminating step, the third laminated body is produced as it is through the second laminating step. After that, the work such as the semiconductor wafer can be reworked by removing the film for forming the back surface protective film from the work such as the semiconductor wafer together with the support sheet. At this time, in consideration of the production tact, it is necessary to quickly peel off the support sheet from the fixing jig (that is, the ring frame), and the adhesive layer for the jig is preferably energy ray curable. Further, by using a support sheet provided with an energy ray-curable adhesive layer on the base material, the support sheet is directly supported on a fixing jig such as a ring frame without using an adhesive layer for a jig. The sheet can be fixed, and by irradiating with energy rays such as ultraviolet rays, the reworkability can be made excellent.

Further, from the viewpoint of adjusting the peeling force within a certain range, an adhesive containing an acrylic resin is preferable.
As the acrylic resin, an acrylic polymer having a structural unit (x1) derived from an alkyl (meth) acrylate is preferable, and the acrylic resin has a structural unit (x1) and a structural unit (x2) derived from a functional group-containing monomer. Acrylic copolymers are more preferred.

The alkyl group of the alkyl (meth) acrylate has preferably 1 to 18 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 8 carbon atoms.
Examples of the alkyl (meth) acrylate include the same alkyl (meth) acrylates described in the above-mentioned binder polymer component section.
The alkyl (meth) acrylate may be used alone or in combination of two or more.
The content of the structural unit (x1) is usually 50 to 100% by mass, preferably 50 to 99.9% by mass, and more preferably 60 to 99% with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 70 to 95% by mass.

Examples of the functional group-containing monomer include a hydroxy group-containing monomer, a carboxy group-containing monomer, an epoxy group-containing monomer, and the like, and specific examples of each monomer are the same as those exemplified in the binder polymer component portion. can give.
In addition, these may be used alone or in combination of 2 or more types.
The content of the structural unit (x2) is usually 0 to 40% by mass, preferably 0.1 to 40% by mass, and more preferably 1 to 30 with respect to the total structural unit (100% by mass) of the acrylic polymer. It is by mass, more preferably 5 to 20% by mass.

Further, the acrylic resin used in one aspect of the present invention is obtained by reacting an acrylic copolymer having the above-mentioned structural units (x1) and (x2) with a compound having an energy ray-polymerizable group. , Energy ray-curable acrylic resin may be used.
The compound having an energy ray-polymerizable group may be a compound having a polymerizable group such as a (meth) acryloyl group or a vinyl group.

When a pressure-sensitive adhesive containing an acrylic resin is used, it is preferable to contain a cross-linking agent together with the acrylic resin from the viewpoint of adjusting the peeling force within a certain range.
Examples of the cross-linking agent include isocyanate-based cross-linking agents, imine-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, carbodiimide-based cross-linking agents, and the like, from the viewpoint of adjusting the peeling force within a certain range. Isocyanate-based cross-linking agents are preferred.
The content of the cross-linking agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, and further, based on the total mass (100 parts by mass) of the acrylic resin contained in the pressure-sensitive adhesive. It is preferably 0.5 to 10 parts by mass, and even more preferably 1 to 8 parts by mass.

The support sheet 10 may be composed of one layer (single layer) or may be composed of two or more layers. When the support sheet is composed of a plurality of layers, the constituent materials and the thicknesses of the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.

In the present specification, not only in the case of the support sheet, "a plurality of layers may be the same or different from each other" means "all layers may be the same or all layers are different". It means that only a part of the layers may be the same, and further, "a plurality of layers are different from each other" means that "at least one of the constituent materials and the thickness of each layer is different from each other". Means.

The support sheet may be transparent, opaque, or colored depending on the purpose.
For example, when the back surface protective film forming film has energy ray curability, the support sheet preferably allows energy rays to pass through.
For example, in order to optically inspect the back surface protective film forming film via the support sheet, the support sheet is preferably transparent.

In the present embodiment, the circuit surface 14a of the work 14 is protected by the circuit surface protection tape 17, and after the second laminating step, the circuit surface protection tape 17 is peeled off from the circuit surface 14a of the work 14. The peeling step to be performed can be included. In the present embodiment, the circuit surface protection tape 17 has an energy ray-curable pressure-sensitive adhesive layer on the side attached to the circuit surface 14a, which is cured by irradiation with energy rays and becomes removable. In the peeling step, the pressure-sensitive adhesive layer of the circuit surface protection tape 17 is irradiated with energy rays to cure the pressure-sensitive adhesive layer so that it can be peeled off again, thereby protecting the circuit surface from the circuit surface 14a of the work 14. The tape 17 can be easily peeled off.

The method for producing the third laminated body of the present embodiment may include a step of irradiating the back surface protective film forming film 13 with a laser from the side of the support sheet 10 to perform laser marking. In the method for producing the third laminated body of the present embodiment, the support sheet 10 is laminated on the back surface protective film forming film 13, so that when a laser is irradiated from the support sheet 10 side through the support sheet, the back surface protective film is formed. Laser marking can be performed on the surface of the film 13 in contact with the support sheet 10.

FIG. 3 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing the third laminated body. In the drawings after FIG. 3, the same components as those shown in the already explained figures are designated by the same reference numerals as in the case of the already explained figures, and detailed description thereof will be omitted.

In the present embodiment, the work 14 is a semiconductor device panel composed of an aggregate in which at least one electronic component 62 is sealed with a sealing resin layer 64 and arranged in a plane. The method for manufacturing the third laminated body of the present embodiment is a method for manufacturing the third laminated body 19 in which the semiconductor device panel which is the work 14, the back surface protective film forming film 13, and the support sheet 10 are laminated in this order. One surface of the work 14 is the circuit surface 14a, the other surface is the back surface 14b (FIG. 3 (a')), and the back surface protective film forming film 13 is on the back surface 14b side of the work 14. The first laminating step (FIG. 3 (b')) of attaching the support sheet 10 and the second laminating step (FIG. 3 (c')) of attaching the support sheet 10 to the back surface protective film forming film 13. Included in order (FIGS. 3 (a') (d')).
In the present embodiment, an apparatus and a support sheet for attaching a back surface protective film forming film between the first laminating step and the second laminating step (FIGS. 3 (a') to 3 (d')). It is performed by connecting the devices to which the above is applied, or in the same device.
Therefore, in the present embodiment, the second laminated body in which the back surface protective film forming film 13 is laminated on the work 14 is housed in the cassette between the first laminating step and the second laminating step. Instead, they can be transported one by one to the second laminating step shown in FIG. 3 (d'). By performing in the same device, the device space can be further reduced. By connecting the device for attaching the back surface protective film forming film and the device for attaching the support sheet, it is possible to deal with it by modifying the conventional device without designing from scratch, and the initial cost can be reduced. Since the second laminated body is not housed in the cassette and transported to the outside of the apparatus, the production efficiency can be improved and the contamination and damage of the second laminated body can be suppressed.

The back surface protective film forming film 13 used in the first laminating step may be processed into the shape of the work in advance, or may be processed in the same apparatus immediately before the first laminating step is performed. If the size of the work is constant on the production line used, the former that can be machined in advance is more efficient, and if the size of the work is likely to change, the latter For example, there is no waste of the film for forming the back surface protective film, and there is a cost merit.

Further, in another embodiment, the transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step can be designed to be 7000 mm or less. The device space can be reduced. The transport distance of the work 14 from the sticking start point of the first laminating step to the sticking completion point of the second laminating step can be 6500 mm or less, 6000 mm or less, or 4500 mm or less. It can be set to 3000 mm or less.

Further, in still another embodiment, the transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be set to 400 s or less. It can be set to 150 s or less, and the process time can be shortened. The transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step can be 130 s or less, 110 s or less, 90 s or less. It can be set to 70s or less.

The transport time of the work 14 from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is the time required for the first laminating step, and the place where the first laminating step is performed. The preferable range of each of the three times, that is, the transport time from the first to the place where the second laminating step is performed and the time required for the second laminating step, is the same as that described in the manufacturing method of FIG. ..

The method for producing the third laminated body of the present embodiment can be carried out by connecting an apparatus for attaching a film for forming a back surface protective film and an apparatus for attaching a support sheet, or can be carried out in the same apparatus.
As the same device, it is preferable to use the device described in the manufacturing method of FIG.

In the present embodiment, the semiconductor device panel may be formed by arranging individual semiconductor devices in a substantially circular region in a plane, and the individual semiconductor devices may be formed in a substantially rectangular region in a plane. It may be formed side by side.

Also in the present embodiment shown in FIG. 3, the support sheet 10 is laminated on the back surface protective film forming film 13 as in the embodiment shown in FIG. 1, so that the laser is emitted from the side of the support sheet 10 through the support sheet. When irradiated, the surface of the back surface protective film forming film 13 in contact with the support sheet 10 can be laser-marked.

<< Manufacturing method of the fourth laminated body >>
In the method for producing the fourth laminated body of the present embodiment, the back surface protective film forming film 13 of the third laminated body 19 produced by the method for producing the third laminated body is cured to obtain the back surface protective film 13'. This is a method for manufacturing a fourth laminated body 19'in which the work 14, the back surface protective film 13', and the support sheet 10 are laminated in this order, which includes a curing step.

FIG. 4 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a fourth laminated body. The method for manufacturing the fourth laminated body of the present embodiment includes a peeling step (FIG. 4 (e)) of peeling the circuit surface protection tape 17 from the circuit surface 14a of the work 14 after the second laminating step. A step of irradiating the back surface protective film forming film 13 with a laser from the side of the support sheet 10 to perform laser marking (FIG. 4 (f)), and curing the back surface protective film 13 to form the back surface protective film 13'. The curing step (FIG. 4 (g)) is included. In this embodiment, a thermosetting film for forming a back surface protective film is used, and in the curing step of this embodiment, the film is thermoset at 130 ° C. for 2 hours.

When the thermosetting film for forming a back surface protective film is heat-treated and heat-cured to form a back surface protective film, the curing conditions are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. It is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.

For example, the heating temperature during thermosetting is preferably 100 to 200 ° C, more preferably 110 to 180 ° C, and particularly preferably 120 to 170 ° C. The heating time at the time of thermosetting is preferably 0.5 to 5 hours, more preferably 0.5 to 3 hours, and particularly preferably 1 to 2 hours. In the case of thermosetting in the curing step, the order of the peeling steps is preferably before the curing step in consideration of the heat resistance of the circuit surface protection tape 17.

FIG. 5 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing the fourth laminated body. The method for manufacturing the fourth laminated body of the present embodiment includes a peeling step (FIG. 5 (e)) of peeling the circuit surface protection tape 17 from the circuit surface 14a of the work 14 after the second laminating step. A curing step (FIG. 5 (f')) in which the back surface protective film 13 is cured to form the back surface protective film 13', and the back surface protective film 13'is irradiated with a laser from the support sheet 10 side for laser marking. (FIG. 5 (g')) and the like.

<< Manufacturing method of semiconductor device with back surface protective film >>
FIG. 6 is a schematic cross-sectional view schematically showing an example of an embodiment of a method for manufacturing a semiconductor device with a back surface protective film. In the method for manufacturing a semiconductor device with a back surface protective film according to the present embodiment, the work 14 and the back surface protective film 13'of the fourth laminated body 19'manufactured by the method for manufacturing the fourth laminated body are diced to protect the back surface. The step of forming the semiconductor device 21 with a film (FIGS. 6 (h) and 6 (i)) and the step of picking up the semiconductor device 21 with a back surface protective film from the support sheet 10 (FIG. 6 (j)) are included.

FIG. 7 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing a semiconductor device with a back surface protective film. In the method for manufacturing the semiconductor device with the back surface protective film of the present embodiment, the back surface protective film forming film 13 and the work 14 of the third laminate 19 manufactured by the method for manufacturing the third laminate are diced to form the back surface. A step of forming the semiconductor device 21'with a protective film forming film (FIGS. 7 (h') and 7 (i')) and a step of picking up the back surface protective film forming film-attached semiconductor device 21'from the support sheet 10. (FIG. 7 (j')) and a curing step (FIG. 7 (k')) in which the back surface protective film forming film 13 is cured to obtain the back surface protective film 13'.

FIG. 8 is a schematic cross-sectional view schematically showing another example of the embodiment of the method for manufacturing a semiconductor device with a back surface protective film. In the method for manufacturing the semiconductor device with the back surface protective film of the present embodiment, the back surface protective film forming film 13 and the work 14 of the third laminate 19 manufactured by the method for manufacturing the third laminate are diced to form the back surface. A step of forming a semiconductor device 21'with a protective film forming film (FIGS. 8 (h) and 8 (i)) and a curing step of curing the back surface protective film 13 to form a back surface protective film 13'(FIG. 8). 8 (j')) and the step of picking up the semiconductor device 21 with the back surface protective film from the support sheet 10.

In the method for manufacturing a semiconductor device with a back surface protective film of the present embodiment, the back surface protective film forming film 13 is thermosetting, and in the step of forming the back surface protective film of the present embodiment, for example, the back surface protective film forming film 13 Is thermoset at 130 ° C. for 2 hours.

As described above, the curing conditions for forming the back surface protective film by thermosetting the thermosetting film for forming the back surface protective film are as long as the degree of curing is such that the back surface protective film sufficiently exerts its function. The method is not particularly limited, and may be appropriately selected depending on the type of the thermosetting film for forming the back surface protective film.

In the method for manufacturing a semiconductor device with a back surface protective film of the present embodiment, the back surface protective film forming film 13 is energy ray curable, and the step of forming the back surface protective film is to apply energy rays to the back surface protective film forming film 13. It may be a step of irradiating and curing the energy ray.

The curing conditions when the energy ray-curable back surface protective film forming film is energy-cured to form the protective film are not particularly limited as long as the degree of curing is such that the protective film sufficiently exerts its function. , The energy ray-curable back surface protective film may be appropriately selected according to the type of the film.
For example, the illuminance of the energy ray at the time of energy ray curing of the energy ray curable back surface protective film forming film is preferably 4 to 280 mW / cm ² . The amount of light of the energy rays at the time of curing is preferably 3 to 1000 mJ / cm ² .

As the energy ray-curable back surface protective film forming film, for example, those disclosed in International Publication No. 2017/188200 and International Publication No. 2017/188218 can also be used.

The method for manufacturing the third laminate of the present invention can be used for manufacturing a semiconductor device with a back surface protective film.

1 ... Composite sheet for forming a protective film, 5 ... First laminate, 6 ... Second laminate, 7 ... Semiconductor chip with backside protective film, 8 ... Semiconductor wafer, 8b ...・ Back surface of semiconductor wafer, 9 ... Semiconductor chip, 10 ... Support sheet, 11 ... Base material, 12 ... Adhesive layer, 13 ... Back surface protective film forming film, 13'... Backside protective film, 13a ... Exposed surface from which the release film 151 of the back surface protective film forming film has been peeled off, 13b ... Exposed surface from which the release film 152 of the backside protective film forming film has been peeled off, 14 ... Work , 14a ... Circuit surface of the work, 14b ... Back surface of the work, 151 ... 1st release film, 152 ... 2nd release film, 16 ... Adhesive layer for jig, 17 ... -Circuit surface protection tape, 18 ... fixing jig, 19 ... third laminate, 19'... fourth laminate, 20 ... semiconductor device, 21 ... with backside protective film Semiconductor device, 21'... Semiconductor device with a film for forming a back surface protective film, 62 ... Electronic parts, 63 ... Circuit board, 63a ... Terminal forming surface, 64 ... Sealing resin layer

Claims (4)

1. A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
   One side of the work is the circuit surface and the other side is the back surface.
   The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
   The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
   From the first laminating step to the second laminating step, the second laminated body in which the back surface protective film forming film is laminated on the work is conveyed one by one.
   The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
2. A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
   One side of the work is the circuit surface and the other side is the back surface.
   The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
   The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
   The transport distance of the work from the sticking start point of the first laminating step to the sticking completion point of the second laminating step is 7000 mm or less.
   The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
3. A method for manufacturing a third laminated body in which a work, a film for forming a back surface protective film, and a support sheet are laminated in this order.
   One side of the work is the circuit surface and the other side is the back surface.
   The first laminating step of attaching the back surface protective film forming film to the back surface side of the work, and
   The second laminating step of attaching the support sheet to the back surface protective film forming film is included in this order.
   The transport time of the work from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is 400 s or less.
   The process from the first laminating step to the second laminating step is performed by connecting a device for attaching the back surface protective film forming film and an device for attaching the support sheet, or in the same device. (3) Method for manufacturing a laminated body.
4. The method for producing a third laminated body according to claim 3, wherein the transport time of the work from the start of sticking of the first laminating step to the completion of sticking of the second laminating step is 150 s or less. ..

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