JP7114013B1 - Adhesive sheet for fixing jig, composite sheet for forming protective film, and method for manufacturing chip with protective film - Google Patents

Abstract

A jig-fixing pressure-sensitive adhesive sheet (1) used in a protective film-forming composite sheet comprising a protective film-forming film, comprising a first pressure-sensitive adhesive layer (161), a core film (162), and a second pressure-sensitive adhesive A layer (163) is laminated in this order in the thickness direction, and the jig fixing adhesive sheet (1) is obtained from a tensile test of a test piece after heating at 130 ° C. for 2 hours. The ratio (Ah/Bh) of the breaking strength (Ah) to the 180° peeling adhesive strength (Bh) to SUS304 in the test piece after heating at 130°C for 2 hours is 1.25 or more.

Description

TECHNICAL FIELD The present invention relates to a jig-fixing pressure-sensitive adhesive sheet, a protective film-forming composite sheet provided with a jig-fixing pressure-sensitive adhesive layer formed using the jig-fixing pressure-sensitive adhesive sheet, and a method for manufacturing a chip with a protective film.
This application claims priority based on Japanese Patent Application No. 2021-047594 filed in Japan on March 22, 2021, the content of which is incorporated herein.

2. Description of the Related Art In recent years, semiconductor devices have been manufactured by applying a mounting method called a so-called face down method. In the face-down method, a semiconductor chip having electrodes such as bumps on a circuit surface is used, and the electrodes are joined to a substrate. Therefore, the back surface of the semiconductor chip on the side opposite to the circuit surface may be exposed.

A resin film containing an organic material is formed on the exposed back surface of the semiconductor chip after the dicing process or packaging to prevent cracks from occurring in the semiconductor chip. may be taken into a semiconductor device as A composite sheet for forming a protective film, which is a combination of a film for forming a protective film and a dicing tape, is used for manufacturing and processing a semiconductor chip with a protective film (for example, Patent Document 1).

For example, the protective film-forming composite sheet 101 shown in FIG. It has a jig adhesive layer 16 for fixing to a fixing jig. A release film 15 may be laminated on the protective film forming film 13 and on the adhesive layer 16 for jig. The jig adhesive layer 16 has a multi-layer structure in which a first adhesive layer 161, a core film 162, and a second adhesive layer 163 are laminated in this order in the thickness direction. may have. The core material film 162 is often made of polyvinyl chloride (eg, Patent Document 1).

JP 2016-15456 A

When manufacturing a chip with a protective film using a protective film-forming composite sheet having a protective film-forming film, for example, first, as shown in FIGS. By attaching the jig adhesive layer 16 in the forming composite sheet 101 and attaching the protective film forming film 13 in the protective film forming composite sheet 101 to the back surface 9b of the workpiece 9 such as a semiconductor wafer, A first laminated composite sheet 501 is produced by laminating the protective film-forming film 13 and the workpiece 9 in this order on the support sheet 10 in the thickness direction thereof.

For example, when the protective film forming film 13 is thermosetting, the first laminated composite sheet 501 can be is heated (Fig. 5C). Thus, by thermally curing the protective film forming film 13 to form the protective film 13', the support sheet 10, the protective film 13' and the workpiece 9 are formed in this order as shown in FIG. 5D. A second laminated composite sheet 502 configured by being laminated in a direction is produced.

Then, the second laminated composite sheet 502 is cooled, and then the workpiece 9 in the second laminated composite sheet 502 is divided on the support sheet 10 to cut the protective film 13', as shown in FIG. 5E. As described above, the third laminated composite sheet 503 in which the plurality of protective film-attached chips 901 are fixed on the support sheet 10 is produced.

Then, as shown in FIG. 5F, chip 901 with protective film in third laminated composite sheet 503 is picked up by separating from support sheet 10 . After picking up the chips 901 with the protective film from all the intended chips 901 with the protective film, the chips 901 with the protective film are separated from the third laminated composite sheet 503, and the fourth laminated composite sheet 504 remains. remains attached to the fixture 18 by the fixture adhesive layer 16, as shown in FIG. 5G. By peeling the fourth laminated composite sheet 504 from the fixture 18 as shown in FIG. 5H, the fixture 18 is returned to FIG. 5A and reused.

When a protective film-forming composite sheet having a conventional thermosetting protective film-forming film is used and the protective film-forming film is thermally cured, adhesion between the jig adhesive layer 16 and the fixing jig 18 is reduced. When the force increases and the fourth laminated composite sheet 504 is peeled off from the fixing jig 18, a strong tension is applied, so as shown in FIG. There is a risk that the adhesive layer 16 and the adhesive layer 16 for jigs peeled off on the side of the fourth laminated composite sheet 504 will be separated, and the adhesive layer 16 for jigs will break.

Even if the protective film-forming film is not thermosetting, the first laminated composite sheet 501 may be stored for a long period of time or subjected to heat treatment when manufacturing the protective film chip. The adhesive force between the jig adhesive layer 16 and the fixing jig 18 increases, and when the fourth laminated composite sheet 504 is peeled off from the fixing jig 18, a strong tension is applied. There was a risk that the pressure-sensitive adhesive layer 16 for the printer would break. When the jig-use adhesive layer 16 is broken, as shown in FIG. It is separated from the adhesive layer 16 for tools. In order to reuse the fixing jig 18, it is necessary to peel off the jig adhesive layer 16 remaining on the side of the fixing jig 18, which is an extra load.

The present invention relates to a jig-fixing pressure-sensitive adhesive sheet having a core film, wherein the jig-fixing pressure-sensitive adhesive sheet is used to form a protective film-forming composite sheet having a jig pressure-sensitive adhesive layer, and a protective film-attached composite sheet is formed. A jig-fixing adhesive sheet that can be easily peeled off from a fixing jig without breakage of the jig-use adhesive layer when used for manufacturing a chip, and a jig formed using the jig-fixing adhesive sheet An object of the present invention is to provide a composite sheet for forming a protective film provided with a pressure-sensitive adhesive layer, and a method for producing a chip with a protective film.

The present invention provides the following adhesive sheet for jig fixing, protective film-forming composite sheet, and method for producing a chip with a protective film.

[1] A jig-fixing pressure-sensitive adhesive sheet for use in a protective film-forming composite sheet comprising a protective film-forming film,
A first pressure-sensitive adhesive layer, a core film, and a second pressure-sensitive adhesive layer are laminated in this order in their thickness direction,
The jig fixing pressure-sensitive adhesive sheet has a breaking strength (Ah) obtained from a tensile test on a test piece after heating at 130 ° C. for 2 hours, and a 180 ° peeling adhesive strength ( A pressure-sensitive adhesive sheet for fixing a jig, having a ratio (Ah/Bh) to Bh) of 1.25 or more.
[2] The jig-fixing pressure-sensitive adhesive sheet according to claim 1, wherein the 180° peeling adhesive strength (Bh) is 2.0 to 12 N/10 mm.
[3] The jig-fixing pressure-sensitive adhesive sheet according to [1] or [2], wherein the breaking strength (Ah) is 6 N/10 mm or more.
[4] The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are formed from a jig pressure-sensitive adhesive composition containing an acrylic resin, and the acrylic resin has a weight average molecular weight of 700,000 or more. The pressure-sensitive adhesive sheet for fixing jigs according to any one of [3].
[5] The jig fixing pressure-sensitive adhesive sheet according to [1] to [4], wherein the acrylic resin does not have a structural unit derived from (meth)acrylic acid.

[6] The jig-fixing pressure-sensitive adhesive sheet according to any one of [1] to [5], wherein the constituent material of the core film includes linear low-density polyethylene, unstretched polypropylene, or polyvinyl chloride.
[7] Any one of [1] to [6], wherein the jig-fixing pressure-sensitive adhesive sheet has a breaking elongation (Xh) of 100% or more obtained from a tensile test in a test piece after heating at 130°C for 2 hours. 1. The adhesive sheet for fixing the jig according to item 1.
[8] The jig fixing pressure-sensitive adhesive sheet has a breaking elongation (Xh) obtained from a tensile test on a test piece after heating at 130 ° C. for 2 hours, and a breaking elongation (Xh) obtained from a tensile test on a test piece before heating ( The pressure-sensitive adhesive sheet for fixing a jig according to any one of [1] to [7], wherein the ratio (Xh/X0) to X0) is 0.10 to 1.50.

[9] A support sheet, a protective film-forming film provided on one surface of the support sheet, and a protective film-forming film on the one surface of the support sheet or on the opposite side of the protective film-forming film to the support sheet A composite sheet for forming a protective film, comprising a jig adhesive layer provided near the peripheral edge on one surface,
A composite sheet for forming a protective film, wherein the jig adhesive layer is formed using the jig fixing adhesive sheet according to any one of [1] to [8].
[10] The protective film-forming composite sheet of [9], wherein the protective film-forming film is thermosetting.

[11] A method for manufacturing a chip with a protective film comprising a chip and a protective film provided on the back surface of the chip, comprising:
The adhesive layer for the jig in the protective film-forming composite sheet is attached to a fixing jig, and the protective film in the protective film-forming composite sheet according to [9] or [10] is applied to the back surface of the work. a step of producing a first laminated composite sheet in which the protective film-forming film and the workpiece are laminated in this order in the thickness direction on the support sheet by attaching the forming film;
By dividing the work on the support sheet and cutting the protective film-forming film or the protective film obtained by curing the protective film-forming film, a plurality of chips with a protective film-forming film or chips with a protective film are formed. preparing a third laminated composite sheet in which chips are fixed on the support sheet;
and picking up the chip with the protective film forming film or the chip with the protective film in the third laminated composite sheet by separating from the support sheet.

[12] A method for manufacturing a chip with a protective film comprising a chip and a protective film provided on the back surface of the chip, comprising:
The adhesive layer for the jig in the protective film forming composite sheet is attached to the fixing jig, and the protective film forming film in the protective film forming composite sheet described in [10] is attached to the back surface of the work. a step of producing a first laminated composite sheet in which the protective film-forming film and the workpiece are laminated in this order on the support sheet in the thickness direction;
By heating the first laminated composite sheet with the peripheral edge portion of the first laminated composite sheet attached to the fixing jig to cure the protective film-forming film and form the protective film, a step of producing a second laminated composite sheet in which the protective film and the workpiece are laminated in this order on a support sheet in their thickness direction;
A third laminated composite in which a plurality of chips with a protective film are fixed on the support sheet by dividing the work in the second laminated composite sheet and cutting the protective film on the support sheet. a step of making a sheet;
and picking up the chips with the protective film in the third laminated composite sheet by separating them from the support sheet.

According to the present invention, a jig-fixing pressure-sensitive adhesive sheet having a core film is used to form a protective film-forming composite sheet provided with a jig-use pressure-sensitive adhesive layer to protect A jig-fixing pressure-sensitive adhesive sheet that can be easily peeled from a fixing jig without breakage of the jig pressure-sensitive adhesive layer when used for manufacturing a film-coated chip, and the jig-fixing pressure-sensitive adhesive sheet is formed using the jig-fixing pressure-sensitive adhesive sheet. Provided are a composite sheet for forming a protective film provided with an adhesive layer for a jig, and a method for manufacturing a chip with a protective film.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically an example of the adhesive sheet for jig fixing which concerns on embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically an example of the composite sheet for protective film formation which concerns on embodiment of this invention. FIG. 4 is a cross-sectional view schematically showing another example of the protective film-forming composite sheet according to the embodiment of the present invention. FIG. 4 is a cross-sectional view schematically showing still another example of the protective film-forming composite sheet according to the embodiment of the present invention. FIG. 4 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a protective film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a protective film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a protective film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of an example of a method for manufacturing a chip with a protective film according to an embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the embodiment of the present invention; FIG. 4 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the embodiment of the present invention; FIG. 5 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the second embodiment of the present invention; FIG. 5 is a cross-sectional view for schematically explaining a part of the method for manufacturing a chip with a protective film according to the second embodiment of the present invention; FIG. 3 is a cross-sectional view for schematically explaining a part of an example of a conventional method for manufacturing a chip with a protective film.

<<Adhesive sheet for jig fixing>>
A jig-fixing pressure-sensitive adhesive sheet according to an embodiment of the present invention is a jig-fixing pressure-sensitive adhesive sheet used in a protective film-forming composite sheet comprising a protective film-forming film, comprising a first pressure-sensitive adhesive layer and a core film and a second pressure-sensitive adhesive layer are laminated in this order in the thickness direction.

An example of the jig-fixing pressure-sensitive adhesive sheet of the present embodiment will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view schematically showing an example of the jig-fixing pressure-sensitive adhesive sheet of the present embodiment. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there are cases where the main parts are enlarged for convenience, and the dimensional ratios of each component are the same as the actual ones. not necessarily.

The jig fixing pressure-sensitive adhesive sheet 1 shown in FIG. These layers are laminated in this order in the thickness direction.

The jig-fixing pressure-sensitive adhesive sheet shown in FIG. 1 is, as will be described later, formed by hollowing out, for example, a ring shape to obtain a jig-fixing pressure-sensitive adhesive sheet consisting of a first pressure-sensitive adhesive layer 161, a core material film 162 and a second pressure-sensitive adhesive layer 163. A protective film-forming composite sheet 101, a protective film-forming composite sheet 102, and a protective film-forming composite sheet 104 having a protective film-forming film capable of forming an agent layer 16 and having a protective film-forming film as shown in FIGS. can be used for

The first adhesive layer, the core film, and the second adhesive layer are laminated in this order in the thickness direction of the jig fixing adhesive sheet. Breaking strength (Ah) [N / 10 mm] obtained from a tensile test in the test piece, 130 ° C., 180 ° peeling adhesive strength (Bh) [N / 10 mm] of the test piece after heating for 2 hours to SUS304 Ratio (Ah /Bh) is 1.25 or more.

The jig-fixing pressure-sensitive adhesive sheet of the present embodiment has a ratio (Ah/Bh) of 1.25 or more. When a composite sheet is formed and used to manufacture a chip with a protective film, it can be easily peeled off from a fixing jig without breakage of the jig adhesive layer.

The jig fixing pressure-sensitive adhesive sheet preferably has a ratio (Ah/Bh) of 1.40 or more, more preferably 1.55 or more, further preferably 1.65 or more, further preferably 1.75. It is particularly preferable that it is above.

Although the upper limit of the ratio (Ah/Bh) is not limited, it is preferably 6.5 or less, more preferably 5.5 or less, from the viewpoint of improving the handleability of the adhesive sheet for fixing jigs. , 4.5 or less.

It is preferable that the jig-fixing pressure-sensitive adhesive sheet has a 180° peeling adhesion (Bh) to SUS304 after heating at 130° C. for 2 hours, of 2.0 to 12 N/10 mm. The 180° peel adhesive strength (Bh) is preferably 2.0 N/10 mm or more, more preferably 2.4 N/10 mm or more, and even more preferably 2.8 N/10 mm or more. By setting the value to the above lower limit or more, when forming a protective film-forming composite sheet having a jig-use adhesive layer using the jig-fixing pressure-sensitive adhesive sheet and using it for manufacturing a chip with a protective film, during the heating process, Alternatively, after the heating process, it is possible to reduce the possibility that the fixing jig is lifted.

The jig fixing pressure-sensitive adhesive sheet preferably has a 180° peeling adhesive strength (Bh) of 12 N/10 mm or less, more preferably 10 N/10 mm or less, and 9.2 N/10 mm or less. Especially preferred. When the adhesive sheet for fixing a jig is used to form a composite sheet for forming a protective film having an adhesive layer for a jig, and the composite sheet is used for manufacturing a chip with a protective film, Adhesive residue is less likely to occur on the side of , and can be easily peeled off from the fixing jig.

The jig-fixing pressure-sensitive adhesive sheet preferably has a breaking strength (Ah) of 6 N/10 mm or more, more preferably 8 N/10 mm or more, and 10 N/ It is more preferably 10 mm or more. By setting the value to at least the above lower limit, when a composite sheet for forming a protective film having an adhesive layer for a jig is formed using the pressure-sensitive adhesive sheet for fixing a jig and used for manufacturing a chip with a protective film, The adhesive layer can be easily peeled off from the fixing jig without breaking.

The breaking strength (Ah) is preferably 100 N/10 mm or less, more preferably 60 N/10 mm or less, and even more preferably 40 N/10 mm or less. By making it below the said upper limit, the adhesive sheet for fixing a jig can be made easy to handle.

The jig-fixing pressure-sensitive adhesive sheet preferably has a breaking elongation (Xh) of 100% or more, more preferably 200% or more, obtained from a tensile test in a test piece after heating at 130°C for 2 hours. It is more preferably 300% or more, and particularly preferably 400% or more. By setting the value to at least the above lower limit, when a composite sheet for forming a protective film having an adhesive layer for a jig is formed using the pressure-sensitive adhesive sheet for fixing a jig and used for manufacturing a chip with a protective film, The adhesive layer can be easily peeled off from the fixing jig without breaking.

The jig fixing pressure-sensitive adhesive sheet preferably has a breaking elongation (X0) of 100% or more, more preferably 200% or more, and more preferably 300% or more, as determined from a tensile test in a test piece before heating. It is even more preferable to have By setting the value to not less than the above lower limit, when a composite sheet for forming a protective film having an adhesive layer for a jig is formed using the pressure-sensitive adhesive sheet for fixing a jig and used for manufacturing a chip with a protective film, the protective film is formed. If there is a problem in attaching the composite sheet to the workpiece, the adhesive layer for the jig is fixed without breaking even during the process of peeling off the workpiece and making it usable again (rework). It can be easily peeled off from the jig.

The jig fixing pressure-sensitive adhesive sheet has a breaking elongation (Xh) obtained from a tensile test on the test piece after heating at 130 ° C. for 2 hours, relative to a breaking elongation (X0) obtained from the tensile test on the test piece before heating. The ratio (Xh/X0) is preferably 0.10 to 1.50, more preferably 0.30 to 1.30. When the adhesive sheet for fixing the jig is used to form the composite sheet for forming the protective film having the adhesive layer for the jig, and the composite sheet for forming the protective film is used for manufacturing the chip with the protective film, the heating process and the heating are carried out by setting the numerical value within the above range. Easy to use in both processes. For example, when trying to peel off the adhesive sheet for fixing the jig from the fixing jig using the same device, even during the rework process (that is, before heating), the chip with the protective film can be removed without changing the conditions. (that is, after heating), it can be easily peeled off under the same conditions.

(Method for measuring breaking strength (Ah) after heating and breaking elongation (Xh) after heating)
The jig-fixing pressure-sensitive adhesive sheet is cut into strips having a width of 10 mm and a length of 80 mm, heated at 130° C. for 2 hours, and allowed to cool. The jig-fixing pressure-sensitive adhesive sheet consists of the first release film 151, the first pressure-sensitive adhesive layer 161, the core film 162, the second pressure-sensitive adhesive layer 163, and the second release film 152, in this order. When laminated in the thickness direction, the second release film 152 is peeled off from the second adhesive layer 163 , and the first release film 151 is peeled off from the first adhesive layer 161 . Regarding the test piece of the jig-fixing pressure-sensitive adhesive sheet in which the first pressure-sensitive adhesive layer 161, the core film 162, and the second pressure-sensitive adhesive layer 163 are laminated in this order in the thickness direction, A tensile test is performed under the conditions of 23° C., a distance between chucks of 50 mm, and a tensile speed of 200 mm/min to determine breaking strength (Ah) [N/10 mm] and breaking elongation (Xh) [%].

(Method for measuring 180° peeling adhesive strength (Bh) after heating)
The jig-fixing pressure-sensitive adhesive sheet is cut into strips having a width of 10 mm and a length of 250 mm. 1 Adhesive layer 161 is adhered to the #1200HL polished surface of a #1200HL (hairline) polished SUS304 plate by reciprocating once with a 2 kg roller. It is heated at 130° C. for 2 hours, allowed to cool, and the 180° peeling adhesive strength (Bh) is measured at a speed of 300 mm/min in accordance with JIS Z0237 under an environment of 23° C. and 50% RH.

The 180° peeling adhesive force of the jig fixing adhesive sheet exposes the first adhesive layer 161 of the jig fixing adhesive sheet, and the 180° peeling adhesive force of the first adhesive layer 161 side of the jig fixing adhesive sheet is applied. The peeling adhesive strength may be measured, or the second adhesive layer 163 may be exposed and the 180° peeling adhesive strength of the second adhesive layer 163 side of the jig fixing adhesive sheet may be measured. Either the 180° peeling adhesive force on the first adhesive layer 161 side or the 180° peeling adhesive force on the second adhesive layer 163 side of the jig fixing adhesive sheet may be within the above range. Both the 180° peeling adhesive strength on the first adhesive layer 161 side and the 180° peeling adhesive strength on the second adhesive layer 163 side of the jig fixing adhesive sheet are preferably within the above ranges.

(Calculation method of ratio (Ah/Bh))
The ratio (Ah/Bh) of the breaking strength (Ah) obtained from the tensile test of the test piece after heating at 130 ° C. for 2 hours to the 180 ° peeling adhesive strength (Bh) of the test piece after heating at 130 ° C. for 2 hours. can be calculated by dividing the breaking strength (Ah) by the 180° pull-off adhesion (Bh).

(Method for measuring elongation at break (X0) before heating)
A jig-fixing pressure-sensitive adhesive sheet is cut into strips having a width of 10 mm and a length of 80 mm. The jig-fixing pressure-sensitive adhesive sheet consists of the first release film 151, the first pressure-sensitive adhesive layer 161, the core film 162, the second pressure-sensitive adhesive layer 163, and the second release film 152, in this order. When laminated in the thickness direction, the second release film 152 is peeled off from the second adhesive layer 163 , and the first release film 151 is peeled off from the first adhesive layer 161 . Regarding the test piece of the jig-fixing pressure-sensitive adhesive sheet in which the first pressure-sensitive adhesive layer 161, the core film 162, and the second pressure-sensitive adhesive layer 163 are laminated in this order in the thickness direction, A tensile test is performed under the conditions of 23° C., a distance between chucks of 50 mm, and a tensile speed of 200 mm/min, and the elongation at break (X0) [%] before heating is determined.

(Calculation method of ratio (Xh/X0))
The ratio (Xh/X0) of the breaking elongation (Xh) obtained from the tensile test on the test piece after heating at 130 ° C. for 2 hours to the breaking elongation (X0) obtained from the tensile test on the test piece before heating is It can be calculated by dividing the elongation at break (Xh) by the elongation at break (X0).

Next, each layer constituting the jig-fixing pressure-sensitive adhesive sheet will be described in more detail.

<Core film>
Various resins are mentioned as a constituent material of the core material film.
Examples of the resin include polyethylenes such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); Polyolefin: polyolefin thermoplastic elastomer such as ethylene-propylene rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-norbornene copolymer Ethylene-based copolymers such as coalescence (copolymers obtained using ethylene as a monomer); polystyrene; polycycloolefin; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6- Naphthalene dicarboxylate, polyesters such as wholly aromatic polyesters in which all structural units have aromatic cyclic groups; copolymers of two or more of the above polyesters; poly(meth)acrylic acid esters; polyurethanes; polyurethane acrylates; polyimides polyacetal; modified polyphenylene oxide; polyphenylene sulfide; polysulfone; polyetherketone;

Among the materials constituting the core film, the breaking elongation (X0), breaking strength (Ah), and breaking elongation (Xh) of the adhesive sheet for fixing jigs are adjusted to the above numerical ranges. Polyolefin or polyvinyl chloride is preferably included because it is easier to use. More preferably, it contains linear low-density polyethylene, unstretched polypropylene, or polyvinyl chloride.

The number of resins constituting the core film may be one, or two or more, and if two or more, the combination and ratio thereof can be arbitrarily selected.

The core material film may consist of one layer (single layer), or may consist of two or more layers. The combination of these multiple layers is not particularly limited.

The thickness of the core film may be 5 to 140 μm, preferably 16 to 100 μm, more preferably 20 to 80 μm, even more preferably 40 to 60 μm. When the thickness of the core film is within such a range, the flexibility of the jig-fixing pressure-sensitive adhesive sheet is improved, and the protective film-forming composite sheet using the jig-fixing pressure-sensitive adhesive sheet is prevented from wrinkling. can be prevented.

However, the thickness of the core material film cannot be excessively increased in order to adjust the breaking strength (Ah). In particular, when the thickness of the core film is equal to or less than the above upper limit, the pressure of the lamination roll of the mounter concentrates only on the ring frame portion due to the height of the core film, resulting in poor adhesion with the mounter. can be prevented, tunneling can be prevented when the protective film-forming composite sheet is stored in a roll form, and a decrease in cuttability during punching can be prevented.

Here, the “thickness of the core film” means the thickness of the entire core film. means the thickness of
The core film may contain various known additives such as fillers, colorants, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc., in addition to the main constituent materials such as the resins. .

The core material film is preferably transparent, and may be colored depending on the purpose, or may be vapor-deposited with other layers.

In order to adjust the adhesiveness between the core film and the first pressure-sensitive adhesive layer provided on both sides thereof, the core film is subjected to roughening treatment such as sandblasting and solvent treatment; corona discharge treatment and electron beam irradiation treatment. , plasma treatment, ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, oxidation treatment such as hot air treatment; lipophilic treatment; hydrophilic treatment, etc. may be applied to the surface. Further, the surface of the core material film may be treated with a primer.

The core film may have adhesiveness on at least one side by containing a specific range of components (for example, resin).

○Manufacturing method of core film The core film can be manufactured by a known method. For example, a core film containing a resin can be produced by molding a resin composition containing the core film.

<First adhesive layer and second adhesive layer>
The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer satisfy the condition of the peeling adhesive force, and may be non-energy ray-curable, may be energy ray-curable, or may be non-energy ray-curable. preferably of the same sex.
As used herein, the term "non-energy ray-curable" means the property of not being cured by energy ray irradiation. On the contrary, the property of curing by irradiation with energy rays is called "energy ray curability".
As used herein, the term "energy ray" means an electromagnetic wave or charged particle beam that has energy quanta. Examples of energy rays include ultraviolet rays, radiation, electron beams, and the like. Ultraviolet rays can be applied by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet light source. The electron beam can be generated by an electron beam accelerator or the like.

The thicknesses of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are preferably 2 to 15 μm, more preferably 3 to 12 μm, respectively, so that the 180° peeling adhesive force can be adjusted appropriately. 4 to 10 μm is particularly preferred.

The total thickness of the first pressure-sensitive adhesive layer, the core film and the second pressure-sensitive adhesive layer is preferably 10 to 170 μm, more preferably 20 to 100 μm, even more preferably 30 to 70 μm. , 35 to 60 μm. When it is at least the lower limit value, the 180° peeling adhesive force can be appropriately adjusted, and when it is at most the upper limit value, the flexibility of the adhesive sheet for fixing jigs is improved, and the adhesive for fixing jigs is improved. It is possible to prevent the formation of wrinkles in the protective film-forming composite sheet using the sheet.

The first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer can be formed using a pressure-sensitive adhesive composition for a jig containing a pressure-sensitive adhesive. For example, the first pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition for a jig to the surface on which the first pressure-sensitive adhesive layer is to be formed, and drying it as necessary. The second pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition for a jig onto the surface on which the second pressure-sensitive adhesive layer is to be formed, and drying it if necessary. More specific methods for forming the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer will be described later in detail together with methods for forming other layers. The content ratio of the components that do not vaporize at room temperature in the adhesive composition for jigs is usually the same as the content ratio of the components in the adhesive layer.

Application of the adhesive composition for jigs may be performed by a known method, for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater. , a screen coater, a Meyer bar coater, a kiss coater and the like.

Drying conditions for the adhesive composition for jigs are not particularly limited. Drying at 130° C. for 10 seconds to 5 minutes is preferred.

As the adhesive composition for a jig for forming the first adhesive layer and the second adhesive layer, a non-energy ray-curable adhesive composition or an energy ray-curable adhesive composition described later It is preferably a non-energy ray-curable pressure-sensitive adhesive composition.

Here, examples of the non-energy ray-curable pressure-sensitive adhesive composition include acrylic resins (resins containing structural units derived from (meth)acrylic acid esters), urethane resins (resins having urethane bonds), rubber-based Adhesive resin such as resin (resin having a rubber structure), silicone resin (resin having siloxane bond), epoxy resin (resin having epoxy group), polyvinyl ether, or polycarbonate (hereinafter referred to as "adhesive resin (i )”).

(Adhesive resin (i))
Among the tacky resins (i), it has high adhesion to the fixing jig 18 such as a ring frame, and effectively prevents the composite sheet for forming a protective film from being peeled off from the fixing jig 18 in a dicing process or the like. Acrylic resins that can be suppressed are preferred.
Examples of the acrylic resin in the adhesive resin (i) include acrylic polymers having at least structural units derived from (meth)acrylic acid alkyl esters.
The structural units of the acrylic resin may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

Examples of the (meth)acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is linear or branched. is preferred.
(Meth)acrylic acid alkyl esters, more specifically, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylic acid n-butyl, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, (meth) ) undecyl acrylate, dodecyl (meth) acrylate (lauryl (meth) acrylate), tridecyl (meth) acrylate, tetradecyl (meth) acrylate (myristyl (meth) acrylate), pentadecyl (meth) acrylate, ( Hexadecyl methacrylate (palmityl (meth)acrylate), heptadecyl (meth)acrylate, octadecyl (meth)acrylate (stearyl (meth)acrylate), nonadecyl (meth)acrylate, icosyl (meth)acrylate, etc. is mentioned.

In terms of improving the adhesive strength of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, the acrylic polymer has a structural unit derived from a (meth)acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group. is preferred. The number of carbon atoms in the alkyl group is preferably 4 to 12, more preferably 4 to 8, from the viewpoint of further improving the adhesive strength of the adhesive layer. In addition, the (meth)acrylic acid alkyl ester in which the alkyl group has 4 or more carbon atoms is preferably an acrylic acid alkyl ester.

It is preferable that the acrylic polymer further has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth)acrylic acid alkyl ester.
As the functional group-containing monomer, for example, the functional group becomes a starting point for crosslinking by reacting with a crosslinking agent described later, or the functional group is a functional group such as an isocyanate group or a glycidyl group in an unsaturated group-containing compound. By reacting with, it is possible to introduce unsaturated groups into the side chains of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include hydroxyl group, carboxyl group, amino group, epoxy group and the like.
That is, examples of functional group-containing monomers include hydroxyl group-containing monomers, carboxy group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (meth) Hydroxyalkyl (meth)acrylates such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; Saturated alcohol (unsaturated alcohol having no (meth)acryloyl skeleton) and the like can be mentioned. 4-Hydroxybutyl (meth)acrylate or 2-hydroxyethyl (meth)acrylate is preferable, 4-hydroxybutyl acrylate or 2-hydroxyethyl acrylate is more preferable, and acrylic acid 4-Hydroxybutyl is particularly preferred.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids (monocarboxylic acids having an ethylenically unsaturated bond) such as (meth)acrylic acid and crotonic acid; fumaric acid, itaconic acid, maleic acid, citracone; ethylenically unsaturated dicarboxylic acids (dicarboxylic acids having an ethylenically unsaturated bond) such as acids; anhydrides of the ethylenically unsaturated dicarboxylic acids; (meth)acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate; be done.

The functional group-containing monomer is preferably a hydroxyl group-containing monomer or a carboxy group-containing monomer, more preferably a hydroxyl group-containing monomer.

The acrylic resin in the adhesive resin (i) is preferably an acrylic polymer having a structural unit derived from a (meth)acrylic acid alkyl ester and a structural unit derived from a hydroxyl group-containing monomer, and has a structure derived from a (meth)acrylic acid alkyl ester. It may be an acrylic polymer having a unit, a structural unit derived from a hydroxyl group-containing monomer, and a structural unit derived from a carboxy group-containing monomer. The acrylic resin preferably does not have a structural unit derived from (meth)acrylic acid.

The functional group-containing monomers constituting the acrylic polymer may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the content of structural units derived from functional group-containing monomers is preferably 0.5 to 12% by mass, more preferably 0.8 to 10% by mass, relative to the total amount of structural units. is more preferable, and 1.0 to 5.0% by mass is particularly preferable.

The acrylic polymer may further have structural units derived from other monomers in addition to structural units derived from (meth)acrylic acid alkyl esters and structural units derived from functional group-containing monomers.
The other monomer is not particularly limited as long as it is copolymerizable with (meth)acrylic acid alkyl ester or the like.
Examples of the other monomers include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile and acrylamide.

The other monomers constituting the acrylic polymer may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The weight average molecular weight (Mw) of the acrylic resin in the adhesive resin (i) is preferably 700,000 or more, more preferably 800,000 or more. When it is at least the lower limit value, it becomes easier to adjust the 180° separation adhesive strength (Bh) of the jig fixing adhesive sheet to the numerical range.

The weight average molecular weight of the acrylic resin in the adhesive resin (i) is preferably 10 million or less, more preferably 5 million or less, and even more preferably 2 million or less. When it is equal to or less than the upper limit, it becomes easier to adjust the breaking strength (Ah) and the 180° separation adhesive strength (Bh) of the adhesive sheet for fixing jigs to the numerical ranges.

In this specification, the weight average molecular weight means a polystyrene conversion value measured by a gel permeation chromatography (GPC) method, unless otherwise specified.

The glass transition temperature (Tg) of the acrylic resin in the adhesive resin (i) is preferably -70 to 30°C, more preferably -65 to -5°C, and -60 to -20°C. is more preferred, and -55 to -40°C is particularly preferred. Since the Tg of the acrylic resin is within the above range, when it is used for manufacturing a chip with a protective film, it is difficult for the acrylic resin to rise from the fixing jig after heating, and adhesive remains on the fixing jig side. It is possible to more easily obtain a jig-fixing pressure-sensitive adhesive sheet with less stress.

The glass transition temperature (Tg) of the acrylic resin can be obtained by calculation using the following Fox formula.
1/Tg = (W1/Tg1) + (W2/Tg2) + ... + (Wm/Tgm) (wherein Tg is the glass transition temperature of the acrylic resin, and Tg1, Tg2, ... Tgm are the raw materials of the acrylic resin. is the glass transition temperature of the homopolymer of each monomer, and W1, W2, ... Wm is the mass fraction of each monomer, where W1 + W2 + ... + Wm = 1.)
For the glass transition temperature of the homopolymer of each monomer in the Fox formula, values described in Polymer Data Handbook, Adhesive Handbook, Polymer Handbook, etc. can be used. For example, methyl acrylate homopolymer has a Tg of 10°C, 2-hydroxyethyl acrylate homopolymer has a Tg of -15°C, n-butyl acrylate homopolymer has a Tg of -54°C, ethyl acrylate homopolymer has a Tg of -24°C, The 4-hydroxybutyl acrylate homopolymer has a Tg of -32°C, the N,N-dimethylacrylamide homopolymer has a Tg of 119°C, the acryloylmorpholine homopolymer has a Tg of 145°C, and the glycidyl methacrylate homopolymer has a Tg of 41°C.

Adhesive resin (i) other than the acrylic polymer preferably has structural units derived from functional group-containing monomers, similarly to the acrylic polymer.

The adhesive resin (i) contained in the adhesive composition for jigs may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the adhesive composition for jigs, the ratio of the content of the adhesive resin (i) to the total content of components other than the solvent (that is, the content of the adhesive resin (i) in the adhesive layer) is 60 to It is preferably 99% by mass, more preferably 70 to 98% by mass, and particularly preferably 80 to 96% by mass. When the ratio of the content of the adhesive resin (i) is in such a range, it is more preferable to adjust the 180° peeling adhesive force (Bh) of the jig fixing adhesive sheet to the above numerical range. become easier.

(Crosslinking agent (ii))
The adhesive composition for jigs preferably contains a cross-linking agent (ii).
The cross-linking agent (ii), for example, reacts with the functional groups to cross-link the adhesive resins (i).
Examples of the cross-linking agent (ii) include tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, isocyanate-based cross-linking agents (cross-linking agents having an isocyanate group) such as adducts of these diisocyanates; epoxy-based cross-linking agents such as ethylene glycol glycidyl ether; Cross-linking agent (cross-linking agent having glycidyl group); aziridine-based cross-linking agent (cross-linking agent having aziridinyl group) such as hexa[1-(2-methyl)-aziridinyl]triphosphatriazine; metal chelate-based cross-linking such as aluminum chelate agents (cross-linking agents having a metal chelate structure); isocyanurate-based cross-linking agents (cross-linking agents having an isocyanuric acid skeleton);
It is easier to adjust the 180° separation adhesive strength (Bh) of the jig fixing adhesive sheet to the numerical range by improving the cohesive force of the adhesive, and it is easy to obtain. From this point of view, the cross-linking agent (ii) is preferably an isocyanate-based cross-linking agent.

The cross-linking agent (ii) contained in the pressure-sensitive adhesive composition for jigs may be of one type or two or more types.

When the pressure-sensitive adhesive composition for jigs contains the cross-linking agent (ii), the content of the cross-linking agent (ii) in the pressure-sensitive adhesive composition for jigs is equal to the content of the adhesive resin (i) of 100 parts by mass. On the other hand, it is preferably 0.02 to 4.0 parts by mass, more preferably 0.03 to 2.0 parts by mass, further preferably 0.04 to 1.0 parts by mass, Particularly preferred is 0.04 to 0.3 parts by mass. When the content of the cross-linking agent (ii) is at least the lower limit, the effect of using the cross-linking agent (ii) can be obtained more remarkably. Further, when the content of the cross-linking agent (ii) is within the above range, it becomes easier to adjust the 180° separation adhesive strength (Bh) of the adhesive sheet for fixing a jig to within the above numerical range. .

(Other additives)
The adhesive composition for jigs may contain other additives that do not fall under any of the above components within the range that does not impair the effects of the present invention.
Examples of other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers. , a reaction retardant, a cross-linking accelerator (catalyst), and other known additives.
The reaction retarder is, for example, an action of a catalyst mixed in the adhesive composition for jigs to prevent an unintended cross-linking reaction from proceeding in the adhesive composition for jigs during storage. It suppresses. Examples of the reaction retarder include those that form a chelate complex by chelating the catalyst, more specifically those having two or more carbonyl groups (-C(=O)-) in one molecule. mentioned.

The other additives contained in the pressure-sensitive adhesive composition for jigs may be of one type or two or more types, and when there are two or more types, their combination and ratio can be arbitrarily selected.

In the adhesive composition for jigs, the content of other additives is not particularly limited, and may be appropriately selected according to the type.

(solvent)
The jig adhesive composition may contain a solvent. Since the pressure-sensitive adhesive composition for jigs contains a solvent, the applicability to the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol.

As the solvent, for example, the solvent used in the production of the adhesive resin (i) may be used as it is in the adhesive composition for a jig without removing it from the adhesive resin (i), or the adhesive resin ( A solvent that is the same as or different from that used during the production of i) may be separately added during the production of the adhesive composition for jigs.

The solvent contained in the pressure-sensitive adhesive composition for jigs may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

The content of the solvent in the adhesive composition for jigs is not particularly limited, and may be adjusted as appropriate.

[Method for producing adhesive composition for jig]
The adhesive composition for jigs is obtained by blending the constituent components.
There are no particular restrictions on the order of addition of each component when blending, and two or more components may be added at the same time.
When a solvent is used, it may be used by mixing the solvent with any of the ingredients other than the solvent and diluting this ingredient in advance, or diluting any of the ingredients other than the solvent in advance. Alternatively, the solvent may be used by mixing with these ingredients.

The method of mixing each component at the time of blending is not particularly limited, and may be selected from known methods such as a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves. It can be selected as appropriate.
The temperature and time at which each component is added and mixed are not particularly limited as long as each compounded component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30°C.

<First Release Film and Second Release Film>
The jig-fixing pressure-sensitive adhesive sheet can be supplied in a form in which the first release film and the second release film are laminated on the outer surfaces of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.

The first release film and the second release film are not particularly limited, and commercially available release films can be used. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film. , vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene (Meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc. are used, and polyethylene terephthalate film is preferred. Crosslinked films of these are also used. Furthermore, a laminated film of these may be used.

The surface tension of the surface of the first release film in contact with the first pressure-sensitive adhesive layer and the surface of the second release film in contact with the second pressure-sensitive adhesive layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably It is 35 mN/m or less. The lower limit is usually about 25 mN/m. Such a release film having a relatively low surface tension can be obtained by appropriately selecting the material, or can be obtained by applying a release agent to the surface of the release film and performing a release treatment. . The surface tension of the surface of the first release film in contact with the first pressure-sensitive adhesive layer and the surface of the second release film in contact with the second pressure-sensitive adhesive layer may be the same. It is preferable to make the surfaces in contact with the layers different so that they are the heavy release surfaces.

Alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, and rubber-based release agents are used as the release agent used for the release treatment, and particularly alkyd-, silicone-, and fluorine-based release agents is preferable because it has heat resistance.

In order to release the surface of the film or the like that serves as the substrate of the first release film and the second release film using the above-mentioned release agent, the release agent may be used as it is without a solvent, diluted with a solvent, or emulsified, and then applied to a gravure coater. , Meyer bar coater, air knife coater, roll coater, etc., and the release film coated with the release agent is subjected to room temperature or heating, or cured by electron beam to form a release agent layer. .

The surface roughness (Ra) of the surface of the first release film in contact with the first pressure-sensitive adhesive layer and the surface of the second release film in contact with the second pressure-sensitive adhesive layer is preferably 10 to 100 nm, preferably 15 to 60 nm, and 20 ~50 nm is preferred.
The surface roughness (Ra) of the surface of the first release film in contact with the first pressure-sensitive adhesive layer and the surface of the second release film in contact with the second pressure-sensitive adhesive layer may be the same or different.

<Method for manufacturing adhesive sheet for jig fixing>
The jig-fixing pressure-sensitive adhesive sheet can be manufactured by sequentially laminating the above-described layers so as to have corresponding positional relationships. The method for forming each layer is as described above.

For example, the adhesive composition for a jig for the first adhesive layer is applied to the release-treated surface of the first release film to form the first adhesive layer on the release-treated surface of the first release film. The exposed surface of the first pressure-sensitive adhesive layer is attached to one first surface of the core material film. The adhesive composition for a jig for the second adhesive layer is applied to the release-treated surface of the second release film to form the second adhesive layer on the release-treated surface of the second release film. By laminating the exposed surface of the second pressure-sensitive adhesive layer to the other second surface of the core film, the first pressure-sensitive adhesive layer, the core film, and the second pressure-sensitive adhesive layer are formed in this order. It is possible to manufacture a jig-fixing pressure-sensitive adhesive sheet that is laminated in the thickness direction.

<<Composite sheet for forming protective film>>
A protective film-forming composite sheet according to an embodiment of the present invention comprises a support sheet, a protective film-forming film provided on one surface of the support sheet, and a protective film on the one surface of the support sheet or the protective film. and an adhesive layer for a jig provided in the vicinity of the peripheral edge on the first surface of the forming film opposite to the support sheet, the adhesive layer for the jig. is formed using the jig fixing pressure-sensitive adhesive sheet according to the embodiment of the present invention.
An example of the protective film-forming composite sheet of the present embodiment will be described below with reference to the drawings.

FIG. 2 is a cross-sectional view schematically showing an example of the protective film-forming composite sheet of the present embodiment.
In the drawings after FIG. 2, the same constituent elements as those shown in already explained figures are given the same reference numerals as in the already explained figures, and detailed explanations thereof will be omitted.

The composite sheet 101 for forming a protective film shown here includes a support sheet 10 and a protective film provided on one surface (in this specification, sometimes referred to as "first surface") 10a of the support sheet 10. and a forming film 13 .
The support sheet 10 includes a substrate 11 and an adhesive layer 12 provided on one surface (first surface) 11 a of the substrate 11 . In the protective film-forming composite sheet 101 , the pressure-sensitive adhesive layer 12 is arranged between the substrate 11 and the protective film-forming film 13 .
That is, the support sheet 10 composed of the substrate 11 and the adhesive layer 12, the protective film-forming film 13 provided on the surface of the adhesive layer 12 of the support sheet 10, and the support sheet 10 of the protective film-forming film 13 are and a jig adhesive layer 16 provided in the vicinity of the peripheral portion on the first surface on the opposite side.
The first surface 10a of the support sheet 10 is the same as the surface 12a of the pressure-sensitive adhesive layer 12 on the side opposite to the substrate 11 side (in this specification, this may be referred to as the "first surface").

The protective film-forming composite sheet 101 further includes a jig adhesive layer 16 and a release film 15 on the protective film-forming film 13 .
In the protective film-forming composite sheet 101, the protective film-forming film 13 is laminated on the entire surface or substantially the entire surface of the first surface 12a of the adhesive layer 12, and the adhesive layer 12 side of the protective film-forming film 13 is opposite to the adhesive layer 12 side. A jig adhesive layer 16 is laminated on a part of the surface (in this specification, sometimes referred to as "first surface") 13a, that is, a region in the vicinity of the peripheral edge. Further, of the first surface 13a of the protective film forming film 13, the region where the jig adhesive layer 16 is not laminated and the surface of the jig adhesive layer 16 opposite to the protective film forming film 13 side are formed. A release film 15 is laminated on 16a (which may be referred to as a "first surface" in this specification). A support sheet 10 is provided on a surface 13b of the protective film-forming film 13 opposite to the first surface 13a (in this specification, this may be referred to as a "second surface").

Not only in the case of the protective film-forming composite sheet 101, but in the protective film-forming composite sheet of the present embodiment, the release film has an arbitrary configuration, and the protective film-forming composite sheet of the present embodiment includes a release film. It may or may not be provided.

In the protective film-forming composite sheet 101, the back surface of the work is attached to the first surface 13a of the protective film-forming film 13 with the release film 15 removed, and the first surface of the jig adhesive layer 16 is attached. 16a is used by being attached to a fixing jig 18 such as a ring frame.

FIG. 3 is a cross-sectional view schematically showing another example of the protective film-forming composite sheet of the present embodiment.
In the protective film-forming composite sheet 102 shown here, the shape and size of the protective film-forming film are different, and the adhesive layer for jig is not on the first surface of the protective film-forming film, but on the first surface of the adhesive layer. It is the same as the protective film-forming composite sheet 101 shown in FIG. 2 except that it is laminated.

More specifically, in the protective film-forming composite sheet 102, the protective film-forming film 23 extends in a partial region of the first surface 12a of the adhesive layer 12, that is, in the width direction of the adhesive layer 12 ( left-to-right direction). Further, a jig adhesive is applied to a region of the first surface 12a of the adhesive layer 12 where the protective film forming film 23 is not laminated so as to surround the protective film forming film 23 from the outside in the width direction without contact. An agent layer 16 is laminated. Then, a surface 23 a of the protective film forming film 23 opposite to the adhesive layer 12 side (in this specification, may be referred to as a “first surface”), and a first adhesive layer 16 of the jig adhesive layer 16 . A release film 15 is laminated on the surface 16a. A support sheet 10 is provided on a surface 23b of the protective film-forming film 23 opposite to the first surface 23a (in this specification, this may be referred to as a "second surface").

FIG. 4 is a cross-sectional view schematically showing still another example of the protective film-forming composite sheet of the present embodiment.
The protective film-forming composite sheet 104 shown here is the same as the protective film-forming composite sheet 101 shown in FIG.

The support sheet 20 consists of the base material 11 only.
That is, the protective film-forming composite sheet 104 is configured by laminating the substrate 11 and the protective film-forming film 13 in the thickness direction thereof. A support sheet 20 consisting only of a base material 11, a protective film forming film 13 provided on one surface of the support sheet 20, and a jig provided near the periphery on the one surface of the support sheet 10. A surface (first surface) 20 a of the support sheet 20 on the protective film forming film 13 side is the same as the first surface 11 a of the substrate 11 .

The composite sheet for forming a protective film according to the present embodiment is not limited to those shown in FIGS. 2 to 4, and part of the structure shown in FIGS. Alternatively, it may be deleted, or another configuration may be added to what has been described so far.

Next, each layer constituting the protective film-forming composite sheet will be described in more detail.

(circle) support sheet The support sheet may consist of one layer (single layer), and may consist of two or more layers. When the support sheet is composed of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.

The support sheet is preferably transparent and may be colored depending on the purpose.
When the protective film-forming film is energy ray-curable, the support sheet is preferably one that allows energy rays to pass through.

Examples of the support sheet include those comprising a substrate and a pressure-sensitive adhesive layer provided on one surface of the substrate; those comprising only a substrate; and the like. When the support sheet has a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is arranged between the substrate and the protective film-forming film in the protective film-forming composite sheet.

When a support sheet comprising a substrate and an adhesive layer is used, the adhesion and peelability between the support sheet and the protective film-forming film can be easily adjusted in the protective film-forming composite sheet.
When a support sheet consisting of only a substrate is used, a composite sheet for forming a protective film can be produced at low cost.

○ Substrate The substrate is sheet-like or film-like, and examples of its constituent materials include various resins.
Examples of the resin include polyethylenes such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); Polyolefin; ethylene-based copolymers such as ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, ethylene-norbornene copolymer (ethylene Polystyrene; Polycycloolefin; Polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalenedicarboxylate, all structural units are aromatic Polyesters such as wholly aromatic polyesters having cyclic groups; Copolymers of two or more of the above polyesters; Poly(meth)acrylic acid esters; Polyurethanes; Polyurethane acrylates; Polyimides; oxide; polyphenylene sulfide; polysulfone; polyether ketone and the like.

The constituent material of the base material preferably contains a polyolefin resin. Among these, polyolefins other than polyethylene are preferable, and polypropylene is more preferable.

Examples of the resin include polymer alloys such as mixtures of the polyester and other resins. The polymer alloy of the polyester and the resin other than polyester is preferably one in which the amount of the resin other than the polyester is relatively small.
Further, as the resin, for example, a crosslinked resin in which one or more of the resins exemplified above are crosslinked; Also included are resins.

The number of resins constituting the base material may be one, or two or more, and if two or more, the combination and ratio thereof can be arbitrarily selected.

The substrate may consist of one layer (single layer) or may consist of a plurality of layers of two or more layers. The combination of these multiple layers is not particularly limited.

The thickness of the substrate is preferably 50-300 μm, more preferably 60-100 μm. When the thickness of the base material is within such a range, the flexibility of the support sheet and protective film-forming composite sheet and the suitability for attachment to a workpiece such as a semiconductor wafer are further improved.
Here, the "thickness of the base material" means the thickness of the entire base material. means.

The substrate may contain various known additives such as fillers, colorants, antioxidants, organic lubricants, catalysts, softeners (plasticizers), etc., in addition to the main constituent materials such as the resins.

The substrate is preferably transparent, and may be colored depending on the purpose, or may be deposited with other layers.

In order to adjust the adhesiveness with the pressure-sensitive adhesive layer or protective film forming film provided thereon, the substrate is subjected to roughening treatment such as sandblasting, solvent treatment, corona discharge treatment, electron beam irradiation treatment, plasma treatment, Ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, oxidation treatment such as hot air treatment; lipophilic treatment; hydrophilic treatment, etc. may be applied to the surface. Further, the substrate may have a primer-treated surface.

The substrate may have tackiness on at least one surface by containing a specific range of components (for example, resin).

O Adhesive Layer The adhesive layer is sheet-like or film-like and contains an adhesive.
Examples of the adhesive include adhesive resins such as acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, and ester resins.

As used herein, the term “tacky resin” includes both a resin having stickiness and a resin having adhesiveness. For example, the tacky resin includes not only the resin itself that has tackiness, but also a resin that exhibits tackiness when used in combination with other components such as additives, and a resin that exhibits adhesiveness due to the presence of a trigger such as heat or water. Also included are resins and the like that show

The pressure-sensitive adhesive layer may consist of one layer (single layer) or may consist of two or more layers. The combination of these multiple layers is not particularly limited.

Although the thickness of the adhesive layer is not particularly limited, it is preferably 1 to 100 μm, more preferably 1 to 60 μm, and particularly preferably 1 to 30 μm.
Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer. means the thickness of

The pressure-sensitive adhesive layer is preferably transparent and may be colored depending on the purpose.
When the protective film-forming film has energy ray-curing properties, the pressure-sensitive adhesive layer preferably transmits energy rays.

The pressure-sensitive adhesive layer may be either energy ray-curable or non-energy ray-curable. The energy ray-curable pressure-sensitive adhesive layer can adjust physical properties before and after curing. For example, by curing the energy ray-curable adhesive layer before picking up a chip with a protective film, which will be described later, the chip with a protective film can be picked up more easily.

The adhesive layer can be formed using an adhesive composition containing an adhesive. For example, the pressure-sensitive adhesive layer can be formed on the target site by applying the pressure-sensitive adhesive composition to the surface on which the pressure-sensitive adhesive layer is to be formed, and drying it if necessary. The content ratio of the components that do not vaporize at room temperature in the pressure-sensitive adhesive composition is usually the same as the content ratio of the components in the pressure-sensitive adhesive layer.

The application and drying of the adhesive composition can be performed, for example, by the same methods as the above-described application and drying of the adhesive composition for jigs.

When the pressure-sensitive adhesive layer is energy ray-curable, the energy ray-curable pressure-sensitive adhesive composition includes, for example, a non-energy ray-curable adhesive acrylic resin (I-1a) having a hydroxyl group ( hereinafter sometimes abbreviated as “adhesive resin (I-1a)”) and an energy ray-curable compound (I-1); Energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of resin (I-1a) (hereinafter sometimes abbreviated as "adhesive resin (I-2a)") and a pressure-sensitive adhesive composition (I-3) containing the pressure-sensitive adhesive resin (I-2a) and an energy ray-curable compound.

When the pressure-sensitive adhesive layer is non-energy ray-curable, the non-energy ray-curable pressure-sensitive adhesive composition includes, for example, a pressure-sensitive adhesive composition containing the non-energy ray-curable adhesive resin (I-1a). (I-4) and the like.

[Non-energy ray-curable adhesive resin (I-1a)]
The adhesive resin (I-1a) is an acrylic resin having a hydroxyl group.
Examples of the acrylic resin include acrylic polymers having structural units derived from hydroxyl group-containing monomers and structural units derived from (meth)acrylic acid alkyl esters.
Examples of the (meth)acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is linear or branched. is preferred.

The acrylic polymer may further have a structural unit derived from a functional group-containing monomer other than the hydroxyl group-containing monomer, in addition to the structural unit derived from the hydroxyl group-containing monomer and the structural unit derived from the (meth)acrylic acid alkyl ester. .
As functional group-containing monomers including hydroxyl group-containing monomers, for example, the functional group becomes a starting point for crosslinking by reacting with a crosslinking agent described later, or the isocyanate group in the unsaturated group-containing compound described later. , and reacting with functional groups such as glycidyl groups to introduce unsaturated groups into the side chains of the acrylic polymer.

Examples of the functional group-containing monomer include hydroxyl group-containing monomers as well as carboxy group-containing monomers, amino group-containing monomers, and epoxy group-containing monomers.

The acrylic polymer may further have structural units derived from other monomers in addition to structural units derived from (meth)acrylic acid alkyl esters and structural units derived from functional group-containing monomers.
The other monomer is not particularly limited as long as it is copolymerizable with (meth)acrylic acid alkyl ester or the like.
Examples of the other monomers include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile and acrylamide.

The pressure-sensitive adhesive composition (I-1), the pressure-sensitive adhesive composition (I-2), the pressure-sensitive adhesive composition (I-3) and the pressure-sensitive adhesive composition (I-4) (hereinafter, including these pressure-sensitive adhesive compositions and abbreviated as "adhesive compositions (I-1) to (I-4)"), the acrylic resin such as the acrylic polymer may have only one structural unit, or , may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the ratio of the amount of structural units derived from the functional group-containing monomer to the total amount of the structural units is preferably 1 to 35% by mass.

The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) or the pressure-sensitive adhesive composition (I-4) may be only one type, or may be two or more types. , two or more thereof, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (I-1) or the pressure-sensitive adhesive composition (I-4), the content ratio of the pressure-sensitive adhesive resin (I-1a) to the total weight of the pressure-sensitive adhesive layer is preferably 5 to 99% by mass, and may be, for example, 25 to 98% by mass, 45 to 97% by mass, or 65 to 96% by mass.

[Energy ray-curable adhesive resin (I-2a)]
The adhesive resin (I-2a) is obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound is capable of bonding with the adhesive resin (I-1a) by reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group. It is a compound having a group.
Examples of the energy ray polymerizable unsaturated group include (meth)acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like, and (meth)acryloyl group is preferred.
Groups capable of bonding with functional groups in the adhesive resin (I-1a) include, for example, an isocyanate group and a glycidyl group capable of bonding with a hydroxyl group or an amino group, and a hydroxyl group and an amino group capable of bonding with a carboxy group or an epoxy group. etc.

Examples of the unsaturated group-containing compound include (meth)acryloyloxyethyl isocyanate, (meth)acryloylisocyanate, glycidyl (meth)acrylate, and the like.

The pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) or (I-3) may be only one type, may be two or more types, or may be two or more types. , the combination and ratio thereof can be arbitrarily selected.

In the adhesive layer formed from the adhesive composition (I-2) or (I-3), the content ratio of the adhesive resin (I-2a) with respect to the total weight of the adhesive layer is 5 to It is preferably 99% by mass.

[Energy ray-curable compound]
The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) or (I-3) is a monomer or oligomer having an energy ray-polymerizable unsaturated group and curable by energy ray irradiation. is mentioned.

Among energy ray-curable compounds, monomers include, for example, trimethylolpropane tri(meth)acrylate, pentaerythritol (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4 -polyvalent (meth)acrylates such as butylene glycol di(meth)acrylate, 1,6-hexanediol (meth)acrylate; urethane (meth)acrylates; polyester (meth)acrylates; polyether (meth)acrylates; meth)acrylate and the like.
Among energy ray-curable compounds, examples of oligomers include oligomers that are polymers of the above-exemplified monomers.

The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) or (I-3) may be only one kind, may be two or more kinds, or may be two or more kinds. In that case, their combination and ratio can be arbitrarily selected.

In the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (I-1) or (I-3), the content ratio of the energy ray-curable compound with respect to the total weight of the pressure-sensitive adhesive layer is 1 to 50 mass. %.

[Crosslinking agent]
The adhesive compositions (I-1) to (I-4) may further contain an isocyanate cross-linking agent.

The cross-linking agent reacts with the hydroxyl groups to cross-link the adhesive resins (I-1a) or the adhesive resins (I-2a).

In the adhesive compositions (I-1) to (I-4), the content of the cross-linking agent is based on 100 parts by mass of the adhesive resin (I-1a) or adhesive resin (I-2a). It is preferably 0.01 to 50 parts by mass, and may be, for example, 1 to 40 parts by mass, 5 to 35 parts by mass, or 10 to 30 parts by mass.

[Photoinitiator]
Adhesive compositions (I-1), (I-2) and (I-3) (hereinafter, these adhesive compositions are collectively referred to as "adhesive compositions (I-1) to (I-3) ”) may further contain a photopolymerization initiator. The adhesive compositions (I-1) to (I-3) containing a photopolymerization initiator undergo sufficient curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, and 2,4-diethyl. Thioxanthone, α-hydroxycyclohexylphenyl ketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1- Examples include [4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and β-chloroanthraquinone.

The photopolymerization initiators contained in the pressure-sensitive adhesive compositions (I-1) to (I-3) may be only one type, or may be two or more types. Any combination and ratio thereof can be selected.

In the adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the energy ray-curable compound.
In the adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the adhesive resin (I-2a). .
In the adhesive composition (I-3), the content of the photopolymerization initiator is 0.01 to 0.01 with respect to 100 parts by mass of the total content of the adhesive resin (I-2a) and the energy ray-curable compound. It is preferably 20 parts by mass.

[Other additives]
The pressure-sensitive adhesive compositions (I-1) to (I-4) may contain other additives that do not fall under any of the above components within the range that does not impair the effects of the present invention.
Examples of other additives include antistatic agents, antioxidants, softeners (plasticizers), fillers, rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers. , a reaction retardant, a cross-linking accelerator (catalyst), and other known additives.
In addition, the reaction retarder is, for example, the action of a catalyst mixed in the adhesive compositions (I-1) to (I-4) during storage, the pressure-sensitive adhesive compositions (I-1) to ( In I-4), it is a component that suppresses the progress of an unintended cross-linking reaction. Examples of the reaction retarder include those that form a chelate complex by chelating the catalyst, more specifically those having two or more carbonyl groups (-C(=O)-) in one molecule. mentioned.

The other additives contained in the pressure-sensitive adhesive compositions (I-1) to (I-4) may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

The content of other additives in the pressure-sensitive adhesive compositions (I-1) to (I-4) is not particularly limited, and may be appropriately selected according to the type.

[solvent]
The adhesive compositions (I-1) to (I-4) may contain a solvent. Since the pressure-sensitive adhesive compositions (I-1) to (I-4) contain a solvent, the coating suitability to the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters (carboxylic acid esters) such as ethyl acetate; ethers such as tetrahydrofuran and dioxane; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol.

The solvents contained in the pressure-sensitive adhesive compositions (I-1) to (I-4) may be one kind, or may be two or more kinds, and when there are two or more kinds, combinations thereof and ratio can be selected arbitrarily.

The solvent content of the pressure-sensitive adhesive compositions (I-1) to (I-4) is not particularly limited, and may be adjusted as appropriate.

○ Manufacturing method of adhesive composition The adhesive composition such as the adhesive compositions (I-1) to (I-4) includes the adhesive and, if necessary, components other than the adhesive. It is obtained by blending each component for constituting the agent composition.
There are no particular restrictions on the order of addition of each component when blending, and two or more components may be added at the same time.
The method of mixing each component at the time of blending is not particularly limited, and may be selected from known methods such as a method of mixing by rotating a stirrer or a stirring blade; a method of mixing using a mixer; a method of mixing by applying ultrasonic waves. It can be selected as appropriate.
The temperature and time at which each component is added and mixed are not particularly limited as long as each compounded component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30°C.

◇Manufacturing Method of Supporting Sheet When a pressure-sensitive adhesive layer is provided on a substrate, for example, the pressure-sensitive adhesive composition may be applied onto the substrate and dried as necessary. Alternatively, for example, a pressure-sensitive adhesive layer is formed on the release film by coating the pressure-sensitive adhesive composition on the release film and drying if necessary, and the exposed surface of the pressure-sensitive adhesive layer is applied to the substrate. You may laminate|stack an adhesive layer on a base material by laminating with one surface of. In this case, the release film may be removed either during the manufacturing process or during the use process of the protective film-forming composite sheet.

O Protective Film-Forming Film The protective film-forming film is used by attaching it to the back surface of a workpiece such as a semiconductor wafer in the method of manufacturing a chip with a protective film. A protective film-forming film is used to protect the back surface of a work or chips obtained by dividing the work.

By using the protective film-forming composite sheet, it is possible to manufacture a chip with a protective film, which includes a chip and a protective film provided on the back surface of the chip, by a method for manufacturing a chip with a protective film, which will be described later.

Furthermore, by using the chip with the protective film, a substrate device can be manufactured.
As used herein, the term "substrate device" means a chip with a protective film that is flip-chip connected to connection pads on a circuit board at protruding electrodes on the circuit surface of the chip. For example, if a semiconductor wafer is used as the workpiece, the substrate device may be a semiconductor device on which a semiconductor chip with a protective film is mounted.

The protective film-forming film may be curable or non-curable. The protective film-forming film is preferably curable.
When the protective film-forming film is curable, the protective film-forming film may be a thermosetting protective film-forming film or an energy ray-curable protective film-forming film. More preferably, the protective film-forming film is a thermosetting protective film-forming film.
In this specification, the protective film-forming film at room temperature is heated to a temperature exceeding room temperature and then cooled to room temperature to form a protective film-forming film after heating and cooling, and the resin after heating and cooling. When the hardness of the film-forming film and the hardness of the resin film-forming film before heating are compared at the same temperature, if the resin film-forming film after heating and cooling is harder, the protective film-forming film is It is thermosetting.

When the protective film-forming film is curable, the protective film-forming film becomes a protective film by curing the protective film-forming film attached to a work such as a semiconductor wafer or a chip obtained by dividing the work.
When the protective film-forming film is non-curable, the protective film-forming film adheres to the protective film by picking up chips obtained by dividing a workpiece such as a semiconductor wafer together with the protective film-forming film attached to the chip. regarded as what has happened.

The thermosetting protective film-forming film can be formed using the thermosetting protective film-forming composition (III-1) described below.

<Protective film forming composition (III-1)>
Examples of the thermosetting protective film-forming composition include a thermosetting protective film-forming composition (III-1) containing a polymer component (A) and a thermosetting component (B) (in the present specification, may be abbreviated as “protective film forming composition (III-1)”) and the like.

[Polymer component (A)]
The polymer component (A) is a polymer compound for imparting film-forming properties, flexibility, etc. to the thermosetting protective film-forming film.
The protective film-forming composition (III-1) and the polymer component (A) contained in the thermosetting protective film-forming film may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

Examples of the polymer component (A) include acrylic resins, urethane resins, phenoxy resins, silicone resins, saturated polyester resins, etc. Acrylic resins are preferred.

The acrylic resin is a resin containing structural units derived from a (meth)acrylic acid ester, which is a monomer. As used herein, "derived from" means that the monomer has undergone a structural change necessary for it to polymerize.
In this specification, "(meth)acrylic acid" is a concept that includes both "acrylic acid" and "methacrylic acid". The same is true for (meth)acrylic acid and similar terms.

Examples of the acrylic resin in the polymer component (A) include known acrylic polymers.
The weight average molecular weight (Mw) of the acrylic resin is preferably from 10,000 to 2,000,000, more preferably from 100,000 to 1,500,000. When the weight average molecular weight of the acrylic resin is at least the above lower limit, the shape stability (stability over time during storage) of the thermosetting protective film-forming film is improved. Further, when the weight average molecular weight of the acrylic resin is equal to or less than the upper limit, the thermosetting protective film-forming film easily follows the uneven surface of the adherend, and the adherend and the thermosetting protective film-forming film The generation of voids and the like is further suppressed between

The glass transition temperature (Tg) of the acrylic resin is preferably -60 to 70°C, more preferably -30 to 50°C. When the Tg of the acrylic resin is equal to or higher than the lower limit, the adhesion between the protective film and the support sheet is suppressed, and the releasability of the support sheet is improved. Further, when the Tg of the acrylic resin is equal to or less than the above upper limit, the adhesive strength of the thermosetting protective film-forming film and the protective film to the adherend is improved.

Examples of acrylic resins include polymers of one or more (meth)acrylic acid esters; (meth)acrylic acid esters, (meth)acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene and N-methylol. Examples thereof include copolymers of two or more monomers selected from acrylamide and the like.

Examples of the (meth)acrylic acid esters constituting the acrylic resin include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate, n-butyl acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, (meth)acrylic acid heptyl, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, Undecyl (meth)acrylate, dodecyl (meth)acrylate (lauryl (meth)acrylate), tridecyl (meth)acrylate, tetradecyl (meth)acrylate (myristyl (meth)acrylate), pentadecyl (meth)acrylate , hexadecyl (meth) acrylate (palmityl (meth) acrylate), heptadecyl (meth) acrylate, octadecyl (meth) acrylate (stearyl (meth) acrylate), etc. A (meth)acrylic acid alkyl ester having a chain structure with a number of 1 to 18;
Cycloalkyl (meth)acrylates such as isobornyl (meth)acrylate and dicyclopentanyl (meth)acrylate;
(meth)acrylic acid aralkyl ester such as benzyl (meth)acrylate;
(meth)acrylic acid cycloalkenyl esters such as (meth)acrylic acid dicyclopentenyl ester;
(meth)acrylic acid cycloalkenyloxyalkyl ester such as (meth)acrylic acid dicyclopentenyloxyethyl ester;
(meth)acrylic acid imide;
glycidyl group-containing (meth)acrylic acid esters such as glycidyl (meth)acrylate;
Hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, (meth) ) hydroxyl group-containing (meth)acrylic acid esters such as 3-hydroxybutyl acrylate and 4-hydroxybutyl (meth)acrylate;
Examples thereof include substituted amino group-containing (meth)acrylic acid esters such as N-methylaminoethyl (meth)acrylate. Here, "substituted amino group" means a group in which one or two hydrogen atoms of an amino group are substituted with groups other than hydrogen atoms.

Monomers constituting the acrylic resin may be of one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

Acrylic resins may have functional groups capable of bonding with other compounds, such as vinyl groups, (meth)acryloyl groups, amino groups, hydroxyl groups, carboxy groups, and isocyanate groups. The functional group of the acrylic resin may be bonded to another compound via a cross-linking agent (F), which will be described later, or may be directly bonded to another compound without the cross-linking agent (F). By bonding the acrylic resin to other compounds via the functional group, the reliability of the package obtained using the protective film-forming composite sheet tends to be improved.

In the protective film-forming composition (III-1), the ratio of the content of the polymer component (A) to the total content of all components other than the solvent (that is, in the thermosetting protective film-forming film, the thermosetting The ratio of the content of the polymer component (A) to the total mass of the protective film-forming film) is preferably 1% by mass or more and less than 85% by mass, regardless of the type of the polymer component (A), and is 2% by mass. % or more and less than 65 mass%, more preferably 3 mass% or more and less than 50 mass%, more preferably 4 mass% or more and less than 40 mass%, and 5 mass% or more and less than 35 mass%. It is particularly preferable that the content is 10% by mass or more and less than 30% by mass.

The polymer component (A) may also correspond to the thermosetting component (B). In the present specification, when the protective film-forming composition (III-1) contains components corresponding to both the polymer component (A) and the thermosetting component (B), the protective film-forming composition Composition (III-1) for use is considered to contain a polymer component (A) and a thermosetting component (B).

[Thermosetting component (B)]
The thermosetting component (B) is a component that has thermosetting properties and cures the thermosetting protective film-forming film to form a hard protective film.
The thermosetting component (B) contained in the protective film-forming composition (III-1) and the thermosetting protective film-forming film may be only one type, or may be two or more types, and in the case of two or more types. , their combination and ratio can be arbitrarily selected.

Examples of the thermosetting component (B) include epoxy thermosetting resins (thermosetting resins having an epoxy group), thermosetting polyimide resins (thermosetting resins having an imide bond), and thermosetting unsaturated Examples thereof include polyester resins (thermosetting resins having an ester bond and an unsaturated bond between carbon atoms), and epoxy-based thermosetting resins are preferred. In this specification, the thermosetting polyimide resin is a generic term for a polyimide precursor and a thermosetting polyimide that form a polyimide resin by thermosetting.

(epoxy thermosetting resin)
The epoxy thermosetting resin consists of an epoxy resin (B1) and a thermosetting agent (B2).
The protective film-forming composition (III-1) and the epoxy-based thermosetting resin contained in the thermosetting protective film-forming film may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

・Epoxy resin (B1)
The epoxy resin (B1) may have an epoxy group in the molecule, and includes known resins such as polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and hydrogenated products thereof, Bifunctional or higher having two or more epoxy groups in the molecule, such as ortho-cresol novolak epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin, etc. and epoxy compounds.

As the epoxy resin (B1), an epoxy resin having an unsaturated hydrocarbon group may be used.

The epoxy resin (B1) may be used alone or in combination of two or more. When two or more are used in combination, the combination and ratio thereof can be arbitrarily selected.

・Heat curing agent (B2)
The thermosetting agent (B2) functions as a curing agent for the epoxy resin (B1).
Examples of the thermosetting agent (B2) include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an anhydrided group of an acid group. is preferably a group, more preferably a phenolic hydroxyl group or an amino group.

Among the thermosetting agents (B2), phenolic curing agents having phenolic hydroxyl groups include, for example, polyfunctional phenolic resins, biphenols, novolac-type phenolic resins, dicyclopentadiene-based phenolic resins, and aralkylphenolic resins.
Among the thermosetting agents (B2), amine-based curing agents having an amino group include, for example, dicyandiamide (hereinafter sometimes abbreviated as "DICY") and the like.

The thermosetting agent (B2) may have an unsaturated hydrocarbon group.

The thermosetting agent (B2) is solid at room temperature and exhibits no curing activity with respect to the epoxy resin (B1). It is preferably a curing agent (hereinafter sometimes abbreviated as "heat-activated latent epoxy resin curing agent").
The heat-activatable latent epoxy resin curing agent is stably dispersed in the epoxy resin (B1) in the thermosetting protective film-forming film at room temperature, but becomes compatible with the epoxy resin (B1) by heating, Reacts with epoxy resin (B1). By using the heat-activatable latent epoxy resin curing agent, the storage stability of the protective film-forming composite sheet is remarkably improved. For example, the movement of the curing agent from the thermosetting protective film-forming film to the adjacent support sheet or jig adhesive layer is suppressed, and the decrease in thermosetting of the thermosetting protective film-forming film is effectively suppressed. be done. In addition, since the thermosetting property of the thermosetting protective film-forming film by heating becomes higher, the pick-up property of a chip with a protective film, which will be described later, is further improved.

Examples of the heat-activatable latent epoxy resin curing agent include onium salts, dibasic acid hydrazides, dicyandiamides, and amine adducts of curing agents.

Among the thermosetting agent (B2), the molecular weight of non-resin components such as biphenol and dicyandiamide is not particularly limited, but is preferably 60 to 500, for example.

The thermosetting agent (B2) may be used alone or in combination of two or more. When two or more are used in combination, the combination and ratio thereof can be arbitrarily selected.

In the protective film-forming composition (III-1) and the thermosetting protective film-forming film, the content of the thermosetting agent (B2) is 0.1 per 100 parts by mass of the epoxy resin (B1). It is preferably from 1 to 500 parts by mass, more preferably from 1 to 200 parts by mass, even more preferably from 1 to 50 parts by mass, and particularly preferably from 1 to 10 parts by mass. When the content of the thermosetting agent (B2) is at least the lower limit, curing of the thermosetting protective film-forming film proceeds more easily. Further, the content of the thermosetting agent (B2) is equal to or less than the upper limit, so that the moisture absorption rate of the thermosetting protective film-forming film is reduced, and the package obtained using the protective film-forming composite sheet reliability is improved.

In the protective film-forming composition (III-1), the ratio of the content of the thermosetting component (B) to the total content of all components other than the solvent (that is, the thermosetting in the thermosetting protective film-forming film The ratio of the content of the thermosetting component (B) to the total mass of the protective film-forming film) is preferably 1% by mass or more and less than 75% by mass, regardless of the type of the thermosetting component (B). , preferably 2% by mass or more and less than 60% by mass, more preferably 3% by mass or more and less than 50% by mass, even more preferably 4% by mass or more and less than 40% by mass, 5% by mass or more and 35% by mass It is particularly preferably less than 6% by mass, and particularly preferably 6% by mass or more and less than 30% by mass.

The thermosetting protective film-forming film of the embodiment contains a polymer component (A) and a thermosetting component (B), the polymer component (A) is an acrylic resin, and the thermosetting component (B ) is an epoxy thermosetting resin comprising an epoxy resin (B1) and a thermosetting agent (B2).

[Curing accelerator (C)]
The protective film-forming composition (III-1) and the thermosetting protective film-forming film may contain a curing accelerator (C). The curing accelerator (C) is a component for adjusting the curing speed of the protective film-forming composition (III-1).
Preferred curing accelerators (C) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole. , 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole (one or more hydrogen atoms other than hydrogen atoms) imidazole substituted with a group); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (phosphines in which one or more hydrogen atoms are substituted with an organic group); tetraphenylphosphonium tetraphenylborate, triphenylphosphine Tetraphenylboron salts such as tetraphenylborate and the like are included.

The curing accelerator (C) contained in the protective film-forming composition (III-1) and the thermosetting protective film-forming film may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.

When the curing accelerator (C) is used, the content of the curing accelerator (C) in the protective film-forming composition (III-1) and the thermosetting protective film-forming film is equal to that of the thermosetting component (B). It is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, based on 100 parts by mass of the content. When the content of the curing accelerator (C) is at least the lower limit, the effect of using the curing accelerator (C) can be obtained more remarkably. Further, when the content of the curing accelerator (C) is equal to or less than the above upper limit, for example, the highly polar curing accelerator (C) can be used in the thermosetting protective film-forming film under high temperature and high humidity conditions. The effect of suppressing migration to the adhesive interface side with the adherend and segregation is increased, and the reliability of the package obtained using the protective film-forming composite sheet is further improved.

[Filler (D)]
The protective film-forming composition (III-1) and the thermosetting protective film-forming film may contain a filler (D). Since the thermosetting protective film-forming film contains the filler (D), the thermal expansion coefficient of the protective film obtained by curing the thermosetting protective film-forming film can be easily adjusted. is optimized for the object on which the protective film is to be formed, the reliability of the package obtained using the protective film-forming composite sheet is further improved. In addition, by including the filler (D) in the thermosetting protective film-forming film, the moisture absorption rate of the protective film can be reduced and the heat dissipation can be improved.

The filler (D) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
Preferable inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, iron oxide, silicon carbide, boron nitride; beads obtained by spheroidizing these inorganic fillers; and surface modification of these inorganic fillers. products; single crystal fibers of these inorganic fillers; glass fibers and the like.
Among these, the inorganic filler is preferably silica or alumina.

The protective film-forming composition (III-1) and the filler (D) contained in the thermosetting protective film-forming film may be of one type or two or more types. can be selected arbitrarily.

When the filler (D) is used, the ratio of the content of the filler (D) to the total content of all components other than the solvent in the protective film-forming composition (III-1) (i.e., thermosetting protective The ratio of the content of the filler (D) to the total mass of the thermosetting protective film-forming film in the film-forming film) is preferably greater than 5% by mass and less than 85% by mass, and more than 20% by mass. is preferably greater than 85% by mass, more preferably greater than 30% by mass and less than 80% by mass, more preferably greater than 45% by mass and less than 80% by mass, and more than 46% by mass. is particularly preferably less than 75% by mass. When the content of the filler (D) is within such a range, the adjustment of the coefficient of thermal expansion described above becomes easier.

[Coupling agent (E)]
The protective film-forming composition (III-1) and the thermosetting protective film-forming film may contain a coupling agent (E). By using a coupling agent (E) having a functional group capable of reacting with an inorganic compound or an organic compound, it is possible to improve the adhesiveness and adhesion of the thermosetting protective film-forming film to the adherend. . Moreover, by using the coupling agent (E), the protective film obtained by curing the thermosetting protective film-forming film has improved water resistance without impairing heat resistance.

The coupling agent (E) is preferably a compound having a functional group capable of reacting with the functional group of the polymer component (A), thermosetting component (B), etc., and is preferably a silane coupling agent. more preferred.
Preferred silane coupling agents include, for example, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2- (3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2-amino ethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyl dimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane and the like.

The coupling agent (E) contained in the protective film-forming composition (III-1) and the thermosetting protective film-forming film may be one type or two or more types. Any combination and ratio thereof can be selected.

When the coupling agent (E) is used, the content of the coupling agent (E) in the protective film-forming composition (III-1) and the thermosetting protective film-forming film is determined by the polymer component (A) and heat It is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and 0.1 to 5 parts by mass with respect to 100 parts by mass of the total content of the curable component (B). Part is particularly preferred. When the content of the coupling agent (E) is at least the lower limit, the dispersibility of the filler (D) in the resin is improved, and the adhesiveness of the thermosetting protective film-forming film to the adherend is improved. The effects of using the coupling agent (E), such as an improvement in the Further, when the content of the coupling agent (E) is equal to or less than the upper limit, outgassing is further suppressed.

[Crosslinking agent (F)]
As the polymer component (A), those having functional groups such as vinyl groups, (meth)acryloyl groups, amino groups, hydroxyl groups, carboxy groups, isocyanate groups, etc. that are capable of bonding with other compounds, such as the acrylic resins described above, are used. In this case, the protective film-forming composition (III-1) and the thermosetting protective film-forming film may contain a cross-linking agent (F) for binding the functional group to another compound for cross-linking. . By cross-linking using the cross-linking agent (F), the storage elastic modulus E' of the thermosetting protective film-forming film can be easily adjusted to a suitable range.

Examples of the cross-linking agent (F) include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate cross-linking agent (a cross-linking agent having a metal chelate structure), an aziridine cross-linking agent (a cross-linking agent having an aziridinyl group), and the like. is mentioned.

Examples of the organic polyvalent isocyanate compound include tolylene diisocyanate (TDI), hexamethylene diisocyanate (HDI), xylylene diisocyanate (XDI), and isocyanate cross-linking agents such as adducts of these diisocyanates (that is, isocyanate groups cross-linking agents having two or more).

When an organic polyvalent isocyanate compound is used as the cross-linking agent (F), it is preferable to use a hydroxyl group-containing polymer as the polymer component (A). When the cross-linking agent (F) has an isocyanate group and the polymer component (A) has a hydroxyl group, the reaction between the cross-linking agent (F) and the polymer component (A) causes cross-linking to the thermosetting protective film-forming film. The structure can be easily introduced.

The cross-linking agent (F) contained in the protective film-forming composition (III-1) and the thermosetting protective film-forming film may be one type or two or more types. can be selected arbitrarily.

When the cross-linking agent (F) is used, the content of the cross-linking agent (F) in the protective film-forming composition (III-1) is 0.5 parts per 100 parts by mass of the polymer component (A). It is preferably from 01 to 20 parts by mass, more preferably from 0.1 to 10 parts by mass, and particularly preferably from 0.5 to 5 parts by mass. When the content of the cross-linking agent (F) is at least the lower limit, the effect of using the cross-linking agent (F) can be obtained more remarkably. Further, when the content of the cross-linking agent (F) is equal to or less than the upper limit, the adhesion of the thermosetting protective film-forming film to the support sheet and the adhesion of the thermosetting protective film-forming film to the work or chip Excessive decrease in adhesive strength is suppressed.

[Energy ray-curable compound (G)]
The protective film-forming composition (III-1) may contain an energy ray-curable compound (G). Since the thermosetting protective film-forming film contains the energy ray-curable compound (G), its properties can be changed by irradiation with energy rays.

Examples of the energy ray-curable compound (G) in the protective film-forming composition (III-1) include the same energy ray-curable compounds as in the adhesive composition (I-1).

The energy ray-curable compound (G) contained in the protective film-forming composition (III-1) may be of only one type, or may be of two or more types. Can be selected arbitrarily.

When the energy ray-curable compound (G) is used, in the protective film-forming composition (III-1), the energy ray-curable compound (G) with respect to the total mass of the protective film-forming composition (III-1) The content ratio is preferably 1 to 50% by mass, more preferably 2 to 40% by mass, and particularly preferably 3 to 30% by mass.

[Photoinitiator (H)]
When the protective film-forming composition (III-1) contains the energy ray-curable compound (G), a photopolymerization initiator (H ) may be contained.

Examples of the photopolymerization initiator (H) in the protective film-forming composition (III-1) include the same photopolymerization initiators as in the adhesive composition (I-1).

The photopolymerization initiator (H) contained in the protective film-forming composition (III-1) may be of only one type, or may be of two or more types. can be selected to

In the protective film-forming composition (III-1), the content of the photopolymerization initiator (H) is 0.1 to 20 parts by mass with respect to 100 parts by mass of the energy ray-curable compound (G). is preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass.

[Colorant (I)]
The protective film-forming composition (III-1) and the thermosetting protective film-forming film may contain a coloring agent (I).
Examples of the coloring agent (I) include known ones such as inorganic pigments, organic pigments, and organic dyes.

Examples of the organic pigments and organic dyes include aminium dyes, cyanine dyes, merocyanine dyes, croconium dyes, squalium dyes, azulenium dyes, polymethine dyes, naphthoquinone dyes, pyrylium dyes, and phthalocyanines. dyes, naphthalocyanine dyes, naphtholactam dyes, azo dyes, condensed azo dyes, indigo dyes, perinone dyes, perylene dyes, dioxazine dyes, quinacridone dyes, isoindolinone dyes, quinophthalone dyes , pyrrole dyes, thioindigo dyes, metal complex dyes (metal complex dyes), dithiol metal complex dyes, indolephenol dyes, triallylmethane dyes, anthraquinone dyes, dioxazine dyes, naphthol dyes, azomethine dyes dyes, benzimidazolone-based dyes, pyranthrone-based dyes, threne-based colors, and the like.

Examples of the inorganic pigments include carbon black, cobalt-based pigments, iron-based pigments, chromium-based pigments, titanium-based pigments, vanadium-based pigments, zirconium-based pigments, molybdenum-based pigments, ruthenium-based pigments, platinum-based pigments, ITO ( indium tin oxide) dyes, ATO (antimony tin oxide) dyes, and the like.

The colorant (I) contained in the protective film-forming composition (III-1) and the thermosetting protective film-forming film may be one kind or two or more kinds. can be selected arbitrarily.

When the colorant (I) is used, the content of the colorant (I) in the thermosetting protective film-forming film may be appropriately adjusted depending on the purpose. For example, the protective film may be printed by laser irradiation. Visibility can be adjusted. Also, by adjusting the content of the coloring agent (I) in the thermosetting protective film-forming film, it is possible to improve the design of the protective film and to make grinding marks on the back surface of the wafer less visible. Considering this point, in the protective film-forming composition (III-1), the ratio of the content of the colorant (I) to the total content of all components other than the solvent (i.e., the thermosetting protective film-forming The ratio of the content of the coloring agent (I) to the total mass of the thermosetting protective film-forming film in the film) is preferably 0.1 to 10% by mass, and 0.1 to 7.5% by mass. 0.1 to 5% by mass is particularly preferable. When the content of the colorant (I) is at least the lower limit, the effect of using the colorant (I) can be obtained more remarkably. Further, when the content of the colorant (I) is equal to or less than the upper limit, an excessive decrease in the light transmittance of the thermosetting protective film-forming film is suppressed.

[General purpose additive (J)]
The protective film-forming composition (III-1) and thermosetting protective film-forming film may contain a general-purpose additive (J) within a range that does not impair the effects of the present invention.
The general-purpose additive (J) may be a known one, can be arbitrarily selected according to the purpose, and is not particularly limited. Preferred examples include plasticizers, antistatic agents, antioxidants, gettering agents, and the like. is mentioned.

The protective film-forming composition (III-1) and the general-purpose additive (I) contained in the thermosetting protective film-forming film may be one type or two or more types, and when there are two or more types, Any combination and ratio thereof can be selected.
The contents of the protective film-forming composition (III-1) and the general-purpose additive (I) of the thermosetting protective film-forming film are not particularly limited, and may be appropriately selected according to the purpose.

[solvent]
The protective film-forming composition (III-1) preferably further contains a solvent. The protective film-forming composition (III-1) containing a solvent is easy to handle.
Although the solvent is not particularly limited, preferred examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol), and 1-butanol. esters such as ethyl acetate and butyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone;
The protective film-forming composition (III-1) may contain only one kind of solvent, or two or more kinds of solvents.

The solvent contained in the protective film-forming composition (III-1) is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the protective film-forming composition (III-1) can be more uniformly mixed.

○Method for Producing a Thermosetting Protective Film-Forming Composition A protective film-forming composition such as the protective film-forming composition (III-1) is obtained by blending each component for constituting the composition.

The composition for forming a thermosetting protective film can be produced by the same method as the above-described method for producing the pressure-sensitive adhesive composition, except that, for example, the types of ingredients are different.

○Adhesive Layer for Jigs The adhesive layer 16 for jigs is used to fix the protective film-forming composite sheet 101 to a fixing jig 18 such as a ring frame.
The jig adhesive layer 16 is formed using the above-described jig fixing adhesive sheet according to the embodiment of the present invention, and includes a first adhesive layer 161, a core material film 162, and a second adhesive. Layers 163 are laminated in this order in the thickness direction.

The jig adhesive layer 16 is preferably ring-shaped.

○Method for Manufacturing Adhesive Layer for Jig It can be produced as follows using the adhesive sheet for fixture fixation.

The second release film 152, which is a light-surface release film, is peeled off and removed from the jig-fixing pressure-sensitive adhesive sheet shown in FIG. Next, a circular punching blade is applied from the side of the second adhesive layer 163 to cut the inner peripheral edges of the first adhesive layer 161, the core film 162, and the second adhesive layer 163, and the inner circular portion is cut. Remove. Next, from the side of the second adhesive layer 163, a circular punching blade is applied concentrically to cut the outer peripheral edges of the first adhesive layer 161, the core film 162, and the second adhesive layer 163. remove part.
As a result, the jig adhesive layer 16 is formed by laminating the ring-shaped first adhesive layer 161, the core film 162, and the second adhesive layer 163 in this order on the first release film 151. can be made.

The protective film-forming composite sheet comprising the jig adhesive of the present embodiment can be suitably used in the method for manufacturing a chip with a protective film, which will be described later.

◇Method for producing a composite sheet for forming a protective film In the composite sheet for forming a protective film, the above layers are laminated so as to have a corresponding positional relationship, and if necessary, the shape of some or all of the layers is adjusted. can be manufactured. The method for forming each layer is as described above.

It is possible to directly form a protective film-forming film by further applying a protective film-forming composition onto the pressure-sensitive adhesive layer laminated on the substrate. In this way, a new layer (hereinafter abbreviated as "second layer") is formed on any layer (hereinafter abbreviated as "first layer") laminated on the base material, When forming a continuous two-layer laminated structure (in other words, a laminated structure of a first layer and a second layer), a composition for forming the second layer is applied onto the first layer. Then, if necessary, a method of drying can be applied.
However, the second layer is formed in advance on a release film using a composition for forming it, and the side opposite to the side of the formed second layer that is in contact with the release film It is preferable to form a continuous two-layer laminated structure by bonding the exposed surface of the first layer to the exposed surface of the first layer. At this time, the composition is preferably applied to the release-treated surface of the release film. The release film may be removed as necessary after the laminated structure is formed.

For example, the protective film-forming composite sheet 101 shown in FIG. 2 can be produced by the following procedure.
A support sheet 10 having an adhesive layer 12 laminated on a base material 11 and a protective film forming film 13 on a release film are prepared, and the adhesive layer 12 of the support sheet 10 and the protective film forming film 13 are bonded together. By laminating, a third laminate comprising a support sheet 10 composed of a substrate 11 and an adhesive layer 12, a protective film-forming film 13, and a release film is produced.
The release film is removed from the third laminate.
A ring-shaped first adhesive layer 161, a core film 162, and a second adhesive layer 163 are laminated in this order on the first release film 151 according to the above-described method for manufacturing the adhesive layer for a jig. The adhesive layer 16 for a jig is produced, and the protective film forming film 13 of the third laminate from which the release film has been removed is bonded to the adhesive layer 16 for a jig.

The protective film-forming composite sheet 101 shown in FIG. 2 can also be produced by the following procedure.
A third laminate comprising a support sheet 10 composed of a substrate 11 and an adhesive layer 12, a protective film-forming film 13, and a release film is produced.
The second release film 152 is peeled off and removed from the jig-fixing pressure-sensitive adhesive sheet 1 shown in FIG. Next, a circular punching blade is applied from the second adhesive layer 163 side, and the inner peripheral edges of the first adhesive layer 161, the core material film 162, and the second adhesive layer 163 are separated, leaving the first release film 151. is cut, the inner circular portion is removed, and the first adhesive layer 161, the core film 162 and the second adhesive layer 163 from which the inner circular portion has been removed are placed on the first release film 151. A fourth laminated body is produced which is laminated in order.
The release film is peeled off from the third laminate, and the exposed protective film forming film 13 and the second adhesive layer 163 exposed by removing the inner circular portion of the fourth laminate are pasted together. do. After that, from the side of the base material 11, a circular punching blade is applied to the outer side concentrically with the inner circle, leaving the first release film 151, and the support sheet 10 composed of the base material 11 and the adhesive layer 12 is protected. The film-forming film 13, the second adhesive layer 163, the core film 162, and the outer peripheral edges of the first adhesive layer 161 are cut to remove the outer portions.

Here, the case where the protective film-forming film and the ring-shaped adhesive layer for a jig are laminated in this order on the adhesive layer was exemplified. In the case of laminating adhesive layers for jigs that are not (for example, in the shape of a rectangular frame), the target lamination structure can be arbitrarily selected.

Thus, all the layers other than the base material constituting the composite sheet for forming a protective film can be formed in advance on the release film and laminated on the surface of the desired layer by laminating. Accordingly, the protective film-forming composite sheet may be produced by appropriately selecting a layer that employs such a process.

The protective film-forming composite sheet may be in the form of a sheet, and is preferably in the form of a roll.

<<Method for manufacturing chip with protective film>>
The protective film-forming composite sheet according to the embodiment of the present invention described above can be used in a method for manufacturing a chip with a protective film, which includes a chip and a protective film provided on the back surface of the chip.

In the method for manufacturing a chip with a protective film according to the present embodiment, the adhesive layer for a jig in the composite sheet for forming a protective film is attached to a fixing jig, and the adhesive layer for the jig is attached to the back surface of the work. By attaching the protective film-forming film in the protective film-forming composite sheet according to the embodiment, the protective film-forming film and the workpiece are laminated in this order on the support sheet in the thickness direction thereof. and heating the first laminated composite sheet with the peripheral edge portion of the first laminated composite sheet attached to the fixing jig to form the protective film forming film. is cured to form the protective film, thereby producing a second laminated composite sheet in which the protective film and the workpiece are laminated in this order in the thickness direction on the support sheet. Then, by dividing the work on the support sheet and cutting the protective film-forming film or the protective film obtained by curing the protective film-forming film, a plurality of chips with protective film-forming films or protection a step of producing a third laminated composite sheet in which a film-coated chip is fixed on the support sheet; and picking up by pulling apart.

As used herein, the term "workpiece" refers to a wafer or semiconductor device panel.
The "wafer" includes element semiconductors such as silicon, germanium, and selenium, and compound semiconductors such as GaAs, GaP, InP, CdTe, ZnSe, and SiC; semiconductor wafers composed of insulators such as sapphire and glass; and insulating wafers.
A "semiconductor device panel" refers to an assembly in which a plurality of semiconductor devices each having at least one electronic component sealed with a sealing resin layer are arranged side by side in a plane.
A circuit is formed on one surface of these workpieces, and in this specification, the surface of the workpiece on which the circuit is formed is referred to as a "circuit surface". The surface opposite to the circuit surface of the workpiece is called the "back surface".
The workpiece is divided into chips by means of dicing or the like. In this specification, as in the case of the workpiece, the surface of the chip on which the circuit is formed is called the "circuit surface", and the surface opposite to the circuit surface of the chip is called the "back surface".
It is preferable that projecting electrodes such as bumps and pillars are provided on both the circuit surface of the workpiece and the circuit surface of the chip. The projecting electrodes are preferably made of solder.

<Method for manufacturing chip with protective film according to first embodiment>
5A to 5H are cross-sectional views for schematically explaining the method for manufacturing a chip with a protective film according to the first embodiment. Here, a method for manufacturing a chip with a protective film will be described, taking as an example the case where the protective film-forming composite sheet 101 shown in FIG. 2 is used when the protective film-forming film 13 is thermosetting.

A method for manufacturing a chip with a protective film according to the first embodiment is a method for manufacturing a chip with a protective film 901 including a chip 90 and a protective film 130' provided on the back surface 90b of the chip 90,
The jig adhesive layer 16 in the protective film forming composite sheet 101 is attached to the fixing jig 18, and the protective film forming film 13 in the protective film forming composite sheet 101 is attached to the back surface 9b of the work 9. By doing so, a step of producing a first laminated composite sheet 501 in which the protective film forming film 13 and the workpiece 9 are laminated in this order on the support sheet 10 in the thickness direction thereof;
By heating the first laminated composite sheet 501 with the peripheral edge portion of the first laminated composite sheet 501 attached to the fixing jig 18 to cure the protective film forming film 13 and form the protective film 13 ′, a step of producing a second laminated composite sheet 502 in which the protective film 13′ and the workpiece 9 are laminated in this order on the support sheet 10 in the thickness direction thereof;
By dividing the workpiece 9 in the second laminated composite sheet 502 on the support sheet 10 and cutting the protective film 13 ′, a plurality of chips 901 with a protective film are fixed on the support sheet 10 to form a third composite sheet. a step of making a laminated composite sheet 503;
and picking up the protective film-attached chip 901 in the third laminated composite sheet 503 by separating it from the support sheet 10 .

In the step of producing the first laminated composite sheet in the method for manufacturing a chip with a protective film according to the present embodiment, as shown in FIGS. 5A and 5B, a protective film forming composite sheet 101 is attached to a fixing jig 18. A protective film is formed on the support sheet 10 by adhering the adhesive layer 16 for jig inside and adhering the protective film forming film 13 in the protective film forming composite sheet 101 to the back surface 9b of the work 9. A first laminated composite sheet 501 is produced by laminating the film 13 and the workpiece 9 in this order in the thickness direction thereof. 5B, the first surface 13a of the protective film forming film 13 in the protective film forming composite sheet 101 is attached to the back surface 9b of the work 9. As shown in FIG. The peripheral portion of the first laminated composite sheet 501 is attached to the fixing jig 18 with the jig adhesive layer 16 . If the workpiece 9 is provided with a backgrinding tape on its circuit surface, the backgrinding tape is removed from the circuit surface of the workpiece 9 .

The attachment of the protective film-forming film 13 in the protective film-forming composite sheet 101 to the workpiece 9 can be performed by a known method. For example, the protective film forming film 13 may be attached to the workpiece 9 while being heated.

Next, in the step of producing the second laminated composite sheet, the first laminated composite sheet 501 is heated while the peripheral portion of the first laminated composite sheet 501 is attached to the fixing jig 18 (FIG. 5C). As a result, by curing the protective film forming film 13 to form the protective film 13′, the support sheet 10, the protective film 13′ and the workpiece 9 are arranged in this order in the thickness direction as shown in FIG. 5D. A second laminated composite sheet 502 is produced.

Reference numeral 13a' indicates the surface of the protective film 13' which was the first surface 13a of the protective film-forming film 13 (in this specification, may be referred to as "first surface"). Reference numeral 13b' indicates the surface of the protective film 13' that was the second surface 13b of the protective film-forming film 13 (in this specification, it may be referred to as the "second surface").

The protective film-forming film 13 shown in FIG. 5B may be laser-marked by laser irradiation through the support sheet 10 (transmitting the support sheet 10), or the protective film 13' shown in FIG. Then, the laser marking may be performed by irradiating the laser through the support sheet 10 (transmitting the support sheet 10).

Next, in the step of producing the third laminated composite sheet, the second laminated composite sheet 502 is cooled, and then, as shown in FIG. 9 is divided and the protective film 13' is cut. The workpiece 9 is divided into individual pieces to form a plurality of chips 90 .

The division of the workpiece 9 and the cutting of the protective film 13' may be performed by known methods. For example, by dicing such as blade dicing, laser dicing by laser irradiation, or water dicing by spraying water containing an abrasive, the division of the work 9 and the cutting of the protective film 13' can be performed continuously.
The protective film 13' is cut along the outer circumference of the chip 90 regardless of the cutting method.

By dividing the workpiece 9 and cutting the protective film 13′ in this manner, the chip 90 and the protective film after cutting provided on the rear surface 90b of the chip 90 (in this specification, simply “protective film”) are formed. ) 130 ′ are obtained. Reference numeral 130b' denotes a surface of the protective film 130' after cutting, which was the second surface 13b' of the protective film 13' (in this specification, may be referred to as a "second surface"). there is

In the step of producing the third laminated composite sheet, the third laminated composite sheet 503 in which the plurality of protective film-attached chips 901 are fixed on the support sheet 10 is produced as described above.

Next, in the picking up step, as shown in FIG. 5F, the chip 901 with the protective film in the third laminated composite sheet 503 is picked up by separating from the supporting sheet 10 .

In the picking up step, peeling occurs between the second surface 130b' of the protective film 130' in the chip 901 with the protective film and the first surface 12a of the adhesive layer 12 in the support sheet 10.

Here, a case is shown in which the chip 901 with the protective film is separated in the arrow P direction by using the separating means 7 such as a vacuum collet. Note that the cross-sectional representation of the detachment means 7 is omitted here.
The protective film-attached chip 901 can be picked up by a known method.

In the picking up process, such picking up of the protective film-attached chips 901 is performed for all the target chips 901 with the protective film.

In the method for manufacturing a chip with a protective film according to the present embodiment, the target chip with a protective film 901 is obtained by performing the steps up to the picking up step.

After the picking up step, the fourth laminated composite sheet 504 remaining after the protective film-attached chip 901 is separated from the third laminated composite sheet 503 is fixed by the jig adhesive layer 16 as shown in FIG. 5G. It is attached to the jig 18 for use. By peeling the fourth laminated composite sheet 504 from the fixture 18 as shown in FIG. 5H, the fixture 18 can be returned to FIG. 5A and reused.

In the method for manufacturing a chip with a protective film according to the first embodiment, the first laminated composite sheet 501 is heated to cure the protective film forming film 13 to form the protective film 13', thereby forming the second laminated composite sheet. 502 was produced, and then the workpiece 9 in the second laminated composite sheet 502 was divided and the protective film 13' was cut to produce a plurality of chips 901 with protective films. The method for producing a chip with a protective film according to the present embodiment when the protective film-forming film 13 is thermosetting is not limited to this, and without heating the first laminated composite sheet 501, as shown in FIG. 6A , On the support sheet 10, by dividing the work 9 in the first laminated composite sheet 501 and cutting the protective film forming film 13, a third laminated composite sheet 503 is produced, and as shown in FIG. After picking up the obtained chip 902 with the protective film formed film, the protective film formed film may be thermally cured to form the chip 901 with the protective film.

In the method for manufacturing a chip with a protective film according to the present embodiment, since the jig-use adhesive layer 16 is formed using the jig-fixing adhesive sheet according to the above-described embodiment, the fourth laminated composite sheet 504 is used. When peeled from the fixing jig 18 , the jig adhesive layer 16 can be easily peeled from the fixing jig 18 without breaking.

<Method for manufacturing chip with protective film according to second embodiment>
5A to 5B, 6A to 6B, and 5G to 5H, the second implementation when the protective film forming film 13 of the protective film forming composite sheet 101 shown in FIG. 2 is non-curing. A method for manufacturing a chip with a protective film according to the embodiment will be described.

A method for manufacturing a chip with a protective film according to the second embodiment is a method for manufacturing a chip with a protective film 901 including a chip 90 and a protective film 130' provided on the back surface 90b of the chip 90,
The jig adhesive layer 16 in the protective film forming composite sheet 101 is attached to the fixing jig 18, and the protective film forming film 13 in the protective film forming composite sheet 101 is attached to the back surface 9b of the work 9. By doing so, a step of producing a first laminated composite sheet 501 in which the protective film forming film 13 and the workpiece 9 are laminated in this order on the support sheet 10 in the thickness direction thereof;
By dividing the workpiece 9 on the support sheet 10 and cutting the protective film forming film 13, a third laminated composite sheet 503 having a plurality of protective film forming film-attached chips 902 fixed on the support sheet 10 is obtained. a step of making;
and picking up the chip 902 with the protective film forming film in the third laminated composite sheet 503 by separating it from the support sheet 10 .

In the step of producing the first laminated composite sheet in the method for manufacturing a chip with a protective film according to this embodiment, as in the method for manufacturing a chip with a protective film according to the first embodiment, FIGS. As described above, the jig adhesive layer 16 in the protective film forming composite sheet 101 is attached to the fixing jig 18, and the protective film forming film in the protective film forming composite sheet 101 is attached to the back surface 9b of the work 9. 13, a first laminated composite sheet 501 is produced in which the protective film forming film 13 and the workpiece 9 are laminated in this order on the support sheet 10 in their thickness direction.

Laser marking may be performed by irradiating the protective film-forming film 13 shown in FIG. 5B with a laser through the support sheet 10 (permeating the support sheet 10).

Next, in the step of producing the third laminated composite sheet, as shown in FIG. 6A, the workpiece 9 in the first laminated composite sheet 501 is divided on the support sheet 10, and the protective film forming film 13 is cut. do. The workpiece 9 is divided into individual pieces to form a plurality of chips 90 .

Division of the workpiece 9 and cutting of the protective film forming film 13 may be performed by a known method. For example, by dicing such as blade dicing, laser dicing by laser irradiation, or water dicing by spraying water containing an abrasive, division of the work 9 and cutting of the protective film forming film 13 can be performed continuously. .
The protective film forming film 13 is cut along the outer periphery of the chip 90 regardless of the cutting method.

In this way, by dividing the workpiece 9 and cutting the protective film forming film 13, a plurality of pieces each having the chip 90 and the protective film forming film 130 after cutting provided on the back surface 90b of the chip 90 are obtained. A chip 902 with a protective film forming film is obtained. Reference numeral 130b denotes a surface of the protective film-forming film 130 after cutting, which was the second surface 13b of the protective film-forming film 13 (in this specification, may be referred to as a "second surface"). there is

In the step of producing the third laminated composite sheet, the third laminated composite sheet 503 in which the plurality of chips 902 with protective film forming films are fixed on the support sheet 10 is produced as described above.

Next, in the picking up step, as shown in FIG. 6B, the chip 902 with the protective film forming film in the third laminated composite sheet 503 is picked up by separating from the support sheet 10 . When the protective film forming film is non-curable, the protective film forming film 130 becomes the protective film 130 ′ by picking up the chip 902 with the protective film forming film.

In the picking up step, peeling occurs between the second surface 130b′ of the protective film forming film 130 in the chip 902 with the protective film forming film and the first surface 12a of the adhesive layer 12 in the support sheet 10. occur.

Here, a case is shown in which the protective film-attached chip 902 is separated in the arrow P direction using the separating means 7 such as a vacuum collet. Note that the cross-sectional representation of the detachment means 7 is omitted here.

In the step of picking up, such chips 902 with a protective film forming film are picked up for all target chips 902 with a protective film forming film.

In the method for manufacturing a chip with a protective film according to the present embodiment, the target chip with a protective film 901 is obtained by performing the steps up to the picking up step.

After the picking up step, the chip 902 with the protective film forming film is separated from the third laminated composite sheet 503, and the fourth laminated composite sheet 504 remains, as shown in FIG. is attached to the fixing jig 18 by By peeling the fourth laminated composite sheet 504 from the fixture 18 as shown in FIG. 5H, the fixture 18 can be returned to FIG. 5A and reused.

In the method for manufacturing a chip with a protective film according to the present embodiment, since the jig-use adhesive layer 16 is formed using the jig-fixing adhesive sheet according to the above-described embodiment, the fourth laminated composite sheet 504 is used. When peeled from the fixing jig 18 , the jig adhesive layer 16 can be easily peeled from the fixing jig 18 without breaking.

The method for manufacturing a chip with a protective film according to this embodiment has been described so far with respect to the method for manufacturing a chip with a protective film according to this embodiment in the case of using the protective film-forming composite sheet 101 shown in FIG. However, in the method for manufacturing a chip with a protective film according to the present embodiment, a composite sheet other than the protective film-forming composite sheet 101, such as the protective film-forming composite sheet 102 or the protective film-forming composite sheet 104 shown in FIGS. The protective film-forming composite sheet of the present embodiment may be used.

◇ Substrate device manufacturing method (use of chip with protective film)
After obtaining the chip with the protective film by the above-described manufacturing method, the substrate is manufactured in the same manner as the conventional manufacturing method of the substrate device, except that the chip with the protective film is used in place of the conventional chip with the protective film. You can manufacture equipment.

For example, a chip with a protective film obtained using the protective film-forming film is picked up from a support sheet, and the protruding electrode on the chip with a protective film is brought into contact with a connection pad on a circuit board to obtain the protruding shape. A manufacturing method including a flip-chip connection step for electrically connecting electrodes and connection pads on the circuit board is mentioned.

The present invention will be described in more detail below with reference to specific examples. However, the present invention is by no means limited to the examples shown below. In addition, all the contents of components other than methyl ethyl ketone shown below are the contents of the target product without a solvent.

(Jig adhesive composition 1)
The adhesive resin (i) is obtained by copolymerizing butyl acrylate (BA, 88 parts by mass), ethyl acrylate (EA, 10 parts by mass), and 4-hydroxybutyl acrylate (4HBA, 2 parts by mass). Acrylic polymer (weight average molecular weight 1300000, glass transition temperature Tg: -51 ° C.) (15 parts by mass), and as a cross-linking agent (ii), xylylene diisocyanate (XDI)-based cross-linking agent (manufactured by Soken Chemical Co., Ltd., product name "TD-75") (0.01 parts by mass), and a resin containing carbon black as a pigment ("Multilac (registered trademark) A-903 black", manufactured by Toyocolor Co., Ltd., 2.82 parts by mass (of which the pigment 0.704 parts by mass))) and methyl ethyl ketone as a solvent were stirred to prepare a jig adhesive composition 1 having a solid content concentration of 20% by mass.

(Jig adhesive composition 2)
As the adhesive resin (i), acrylic obtained by copolymerizing butyl acrylate (BA, 89 parts by mass), 4-hydroxybutyl acrylate (4HBA, 1 part by mass) and acryloylmorpholine (ACMO, 10 parts by mass) A polymer (weight average molecular weight 800000, glass transition temperature Tg: −43° C.) (34.3 parts by mass) and a tolylene diisocyanate-based cross-linking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) as a cross-linking agent (ii) ”, 0.05 parts by mass), and a resin containing carbon black as a pigment (“Multilac (registered trademark) A-903 Black”, manufactured by Toyocolor Co., Ltd., 2.82 parts by mass (of which 0.704 parts by mass of pigment) ) and methyl ethyl ketone as a solvent were stirred to prepare a jig adhesive composition 2 having a solid content concentration of 20% by mass.

(Jig adhesive composition 3)
As the adhesive resin (i), an acrylic polymer (weight average molecular weight 900000, glass transition Temperature Tg: -53 ° C.) (33.4 parts by mass), and as a cross-linking agent (ii), a xylylene diisocyanate (XDI)-based cross-linking agent (manufactured by Soken Chemical Co., Ltd., trade name “TD-75”) (0 .13 parts by mass), and a resin containing carbon black as a pigment (“Multilac (registered trademark) A-903 Black”, manufactured by Toyocolor Co., Ltd., 2.82 parts by mass (including 0.704 parts by mass of the pigment)), Methyl ethyl ketone as a solvent was stirred to prepare a jig adhesive composition 3 having a solid concentration of 20% by mass.

(Jig adhesive composition 4)
An acrylic polymer obtained by copolymerizing butyl acrylate (BA, 89 parts by mass), 4-hydroxybutyl acrylate (4HBA, 1 part by mass), and dimethylacrylamide (10 parts by mass) as the adhesive resin (i). (weight average molecular weight 900000, glass transition temperature Tg: -44 ° C.) (37.4 parts by mass), and as a cross-linking agent (ii), a xylylene diisocyanate (XDI)-based cross-linking agent (manufactured by Soken Chemical Co., Ltd., trade name) "TD-75") (0.13 parts by mass), and a resin containing carbon black as a pigment ("Multilac (registered trademark) A-903 Black", manufactured by Toyocolor Co., Ltd., 2.82 parts by mass (of which 0 pigment .704 parts by mass)) and methyl ethyl ketone as a solvent were stirred to prepare a jig adhesive composition 4 having a solid content concentration of 20% by mass.

(Jig adhesive composition 5)
As the adhesive resin (i), butyl acrylate (BA, 69.5 parts by mass), methyl acrylate (MA, 30 parts by mass) and 2-hydroxyethyl acrylate (2HEA, 0.5 parts by mass) were used. Polymerized acrylic polymer (weight average molecular weight 500,000, glass transition temperature Tg: -38 ° C.) (100 parts by mass) and a tolylene diisocyanate-based cross-linking agent (Tosoh Corporation "Coronate L , 5 parts by mass) and methyl ethyl ketone as a solvent were stirred to prepare a jig adhesive composition 5 having a solid content concentration of 20% by mass.

[Example 1]
In Example 1, the jig-fixing pressure-sensitive adhesive sheet 1 shown in FIG. 1 and the protective film-forming composite sheet 101 provided with the protective film-forming film shown in FIG. 2 were produced in the following manner.

(1) Production of adhesive sheet for fixing jigs As the first release film, a release film (SP- PET381031) was coated with the pressure-sensitive adhesive composition 1 for a jig obtained above, and dried by heating at 115°C for 3 minutes to obtain a thickness of 5 µm on the release-treated surface of the first release film. to form a first pressure-sensitive adhesive layer. As a core film, one first surface of an unstretched polypropylene film (manufactured by Sun Tox Co., Ltd., trade name “TP02”, thickness 40 μm, hereinafter referred to as “core film A”) subjected to corona treatment on both sides. The exposed surface of the first pressure-sensitive adhesive layer was pasted on. After that, as the second release film, a release film (manufactured by Lintec Corporation, product name “SP-PET381130”) formed by forming a silicone-based release agent layer on one side of a polyethylene terephthalate (PET) film with a thickness of 38 μm was released. The jig adhesive composition 1 similarly obtained above was applied to the treated surface and dried by heating at 115° C. for 3 minutes to form a second adhesive having a thickness of 5 μm on the release treated surface of the second release film. A layer was formed. By laminating the exposed surface of the second pressure-sensitive adhesive layer to the other second surface of the core film A, the first pressure-sensitive adhesive layer, the core film, and the second pressure-sensitive adhesive layer are laminated in this order. A jig-fixing pressure-sensitive adhesive sheet of Example 1 was prepared by laminating in the thickness direction of . The jig-fixing pressure-sensitive adhesive sheet of Example 1 is formed by laminating a first release film, a first pressure-sensitive adhesive layer, a core film A, a second pressure-sensitive adhesive layer and a second release film in this order.

(2) Preparation of first laminate containing protective film-forming film The following components (a) to (g) are mixed and diluted with methyl ethyl ketone so that the solid content concentration is 50% by mass to form a protective film. A composition was prepared for

(a) Polymer component: (meth)acrylic acid ester copolymer (20 parts by mass of n-butyl acrylate, 50 parts by mass of methyl acrylate, 15 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate are copolymerized Copolymer obtained by weight average molecular weight: 800,000, glass transition temperature: -5.6 ° C.) 120 parts by mass (solid content conversion, same below)
(b-1) Thermosetting component: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER828”, epoxy equivalent 184 to 194 g / eq) 75 parts by mass (b-2) Thermosetting component: bisphenol A-type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER1055", epoxy equivalent 800 to 900 g / eq) 25 parts by mass (c) Thermally active latent epoxy resin curing agent: Dicyandiamide (manufactured by ADEKA Co., Ltd.: Adeka Hardner EH3636AS, active hydrogen content 21 g / eq) 3 parts by mass (d) Curing accelerator: 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., product name "Curesol 2PHZ") 3 parts by mass (e ) Filler: silica filler (manufactured by Admatechs Co., Ltd., product name “SC2050MA” average particle size: 0.5 μm) 290 parts by mass (f) Colorant: carbon black (manufactured by Mitsubishi Chemical Corporation, product name “#MA650”, Average particle size: 28 nm) 1.2 parts by mass (g) Silane coupling agent: (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-403") 2 parts by mass

As the third release film, a release film (product name “SP-PET381031” manufactured by Lintec Corporation) was prepared. As the fourth release film, a release film (product name “SP-PET381130” manufactured by Lintec Corporation) was prepared.

First, on the release surface of the third release film, the protective film-forming composition described above is applied with a knife coater so that the finally obtained protective film-forming film has a thickness of 25 μm, and dried. to form a protective film-forming film. After that, the release surface of the fourth release film is superimposed on the protective film-forming film, and the two are bonded together to form a first release film comprising the third release film, the protective film-forming film (thickness: 25 μm), and the fourth release film. A laminate was obtained.

(3) Preparation of a second laminate containing a support sheet The following components (h) and (i) were mixed and diluted with methyl ethyl ketone so that the solid content concentration was 25% by mass to prepare a pressure-sensitive adhesive composition. prepared.

(h) Adhesive main agent: (meth)acrylic acid ester copolymer (a copolymer obtained by copolymerizing 60 parts by weight of 2-ethylhexyl acrylate, 30 parts by weight of methyl methacrylate and 10 parts by weight of 2-hydroxyethyl acrylate , weight average molecular weight: 600,000) 100 parts by mass (i) Crosslinking agent: xylene diisocyanate adduct of trimethylolpropane (manufactured by Mitsui Takeda Chemicals, product name “Takenate D110N”) 20 parts by mass

As the fifth release film, a release film (product name “SP-PET381031” manufactured by Lintec Corporation) was prepared by forming a silicone-based release agent layer on one side of a PET film having a thickness of 38 μm.

On the release surface of the fifth release film, the pressure-sensitive adhesive composition described above is applied so that the thickness of the pressure-sensitive adhesive layer finally obtained is 5 μm, and dried at 100 ° C. for 1 minute to form the pressure-sensitive adhesive layer. formed. After that, a polypropylene film (thickness: 80 μm) was laminated as a base material to the pressure-sensitive adhesive layer to obtain a second laminate consisting of a support sheet consisting of the base material and the pressure-sensitive adhesive layer, and a fifth release film.

(4) Production of Third Laminate The fourth release film was peeled off from the first laminate obtained in (2) above to expose the protective film-forming film. On the other hand, the fifth release film was peeled off from the second laminate obtained in (3) above to expose the pressure-sensitive adhesive layer. The first laminate and the second laminate are laminated at 0.5 m/min so that the exposed protective film-forming film is in contact with the exposed adhesive layer, and a support consisting of the base material and the adhesive layer is formed. A third laminate was obtained by laminating the sheet, the protective film-forming film, and the third release film.

(5) Production of Composite Sheet for Protective Film Formation The second release film 152 was peeled off from the jig fixing pressure-sensitive adhesive sheet 1 of Example 1 and removed. Next, a circular punching blade is applied from the second adhesive layer 163 side, and the inner peripheral edges of the first adhesive layer 161, the core material film 162, and the second adhesive layer 163 are separated, leaving the first release film 151. is cut, the inner circular portion is removed, and the first adhesive layer 161, the core film 162 and the second adhesive layer 163 from which the inner circular portion has been removed are placed on the first release film 151. A fourth laminate was produced by laminating in order. At this time, the diameter of the inner periphery of the first adhesive layer 161, the core film 162 and the second adhesive layer 163 was 185 mm.

The third release film is peeled off from the third laminate, and the exposed protective film forming film 13 and the second adhesive layer 163 exposed by removing the inner circular portion of the fourth laminate are separated from each other by 0. It was laminated at 5 m/min. After that, from the base material 11 side, a circular punching blade is applied to the outside in a concentric shape with the inner circle, leaving the first release film 151 in the jig fixing adhesive sheet 1, leaving the base material 11 and the adhesive layer. 12, the protective film forming film 13, the second adhesive layer 163, the core film 162, and the outer peripheral edge of the first adhesive layer 161 are punched, and the outer portion is removed. A protective film-forming composite sheet 101 of Example 1 was produced. At this time, the diameter of the outer peripheral edge of the protective film-forming composite sheet 101 of Example 1 having the jig adhesive layer 16 was set to 210 mm.

The protective film-forming composite sheet 101 of Example 1 includes an adhesive sheet (that is, a support sheet 10) in which an adhesive layer 12 (thickness: 5 μm) is laminated on a substrate 11, and an adhesive layer of the adhesive sheet. A protective film forming film 13 laminated on the 12 side, an annular jig adhesive layer 16 laminated on the peripheral edge portion of the protective film forming film 13 opposite to the adhesive sheet, and a jig adhesive layer 16. and a first release film 151 laminated on the side opposite to the protective film forming film 13 in . The protective film-forming composite sheet 101 of Example 1 corresponds to the structure shown in FIG.

[Example 2]
In the adhesive sheet for jig fixing of Example 1, the core film was a linear low-density polyethylene film (manufactured by Aicello Co., Ltd., trade name “N-606”, thickness 40 μm, hereinafter referred to as A jig-fixing pressure-sensitive adhesive sheet of Example 2 was prepared in the same manner as the jig-fixing pressure-sensitive adhesive sheet of Example 1, except that the film was changed to "core material film B".

[Example 3]
In the adhesive sheet for fixing jigs of Example 1, the core material film was a non-stretched polypropylene film (manufactured by Nihon Matai Co., Ltd., trade name "MK12", thickness 40 μm, hereinafter referred to as "core material A jig-fixing pressure-sensitive adhesive sheet of Example 3 was prepared in the same manner as the jig-fixing pressure-sensitive adhesive sheet of Example 1, except that the adhesive sheet was changed to "Film C".

[Example 4]
In the jig-fixing pressure-sensitive adhesive sheet of Example 1, the core film was a non-stretched polypropylene film (thickness 50 μm, Young's modulus 460 MPa at 23 ° C. and F-5 value (at 5% tension) Stress) 20 MPa film, hereinafter referred to as "core film D"). made.

[Example 5]
In the jig-fixing pressure-sensitive adhesive sheet of Example 1, the core film was a polyvinyl chloride film (manufactured by Okamoto Co., Ltd., product name “OSGP42B-D23”, thickness 50 μm, hereinafter referred to as “core film E”. ), a jig-fixing pressure-sensitive adhesive sheet of Example 5 was prepared in the same manner as the jig-fixing pressure-sensitive adhesive sheet of Example 1, except for changing to ).

[Example 6]
In the jig fixing pressure-sensitive adhesive sheet of Example 5, the jig fixing pressure-sensitive adhesive sheet was prepared in the same manner as the jig fixing pressure-sensitive adhesive sheet of Example 5, except that the jig pressure-sensitive adhesive composition 1 was changed to the jig pressure-sensitive adhesive composition 2. Thus, a jig-fixing pressure-sensitive adhesive sheet of Example 6 was produced.

[Example 7]
In the jig fixing pressure-sensitive adhesive sheet of Example 5, the jig fixing pressure-sensitive adhesive sheet was prepared in the same manner as the jig fixing pressure-sensitive adhesive sheet of Example 5, except that the jig pressure-sensitive adhesive composition 1 was changed to the jig pressure-sensitive adhesive composition 3. Thus, a jig-fixing pressure-sensitive adhesive sheet of Example 7 was produced.

In the protective film forming composite sheet of Example 1, except that the jig fixing adhesive sheet of Example 1 was changed to the jig fixing adhesive sheet of Examples 2 to 7, the protective film forming of Example 1 was performed. Protective film-forming composite sheets of Examples 2 to 7 were produced in the same manner as the composite sheets for the protective film.

[Comparative Example 1]
In the jig fixing pressure-sensitive adhesive sheet of Example 4, the jig fixing pressure-sensitive adhesive sheet of Example 2 was prepared in the same manner as the jig fixing pressure-sensitive adhesive sheet of Example 2, except that the jig pressure-sensitive adhesive composition 1 was changed to the jig pressure-sensitive adhesive composition 4. Thus, a jig-fixing pressure-sensitive adhesive sheet of Comparative Example 1 was produced.

[Comparative Example 2]
The jig of Comparative Example 2 was prepared in the same manner as the jig fixing adhesive sheet of Comparative Example 1, except that the core film was changed to the core film B in the jig fixing adhesive sheet of Comparative Example 1. A fixing pressure-sensitive adhesive sheet was produced.

[Comparative Example 3]
The jig of Comparative Example 3 was prepared in the same manner as the jig fixing adhesive sheet of Comparative Example 1, except that the core film was changed to the core film E in the jig fixing adhesive sheet of Comparative Example 1. A fixing pressure-sensitive adhesive sheet was produced.

[Comparative Example 4]
In the jig-fixing pressure-sensitive adhesive sheet of Comparative Example 1, the jig-use adhesive composition 4 was changed to the jig-use adhesive composition 5, and the plasticizer species of the core film was different from that of the core film E. The jig-fixing pressure-sensitive adhesive sheet of Comparative Example 1 was changed to a polyvinyl chloride film (manufactured by Okamoto Co., Ltd., product name "OSGP42B", thickness 50 µm, hereinafter referred to as "core film I"). A jig-fixing pressure-sensitive adhesive sheet of Comparative Example 4 was prepared in the same manner.

In the protective film forming composite sheet of Example 1, except that the jig fixing adhesive sheet of Example 1 was changed to the jig fixing adhesive sheet of Comparative Examples 1 to 4, the protective film forming of Example 1 was performed. Protective film-forming composite sheets of Comparative Examples 1 to 4 were prepared in the same manner as the composite sheets for the protective film.

<Tensile test before heating>
The jig-fixing pressure-sensitive adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4 were cut into strips having a width of 10 mm and a length of 80 mm. The second release film 152 was peeled off from the second adhesive layer 163 , and the first release film 151 was peeled off from the first adhesive layer 161 . A test before heating of the adhesive sheet for jig fixing, which is configured by laminating the first adhesive layer 161, the core material film 162, and the second adhesive layer 163 in this order in the thickness direction. A tensile test was performed on the piece using a universal tensile tester ("Autograph" manufactured by Shimadzu Corporation) under the conditions of 23 ° C. and 50% RH, a distance between chucks of 50 mm, and a tensile speed of 200 mm / min. , the elongation at break (X0) [%] before heating was determined. Table 1 shows the results.

<Tensile test after heating>
The jig-fixing pressure-sensitive adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4 were cut into strips having a width of 10 mm and a length of 80 mm, heated at 130° C. for 2 hours, and allowed to cool. The second release film 152 was peeled off from the second adhesive layer 163 , and the first release film 151 was peeled off from the first adhesive layer 161 . A test after heating of an adhesive sheet for fixing a jig, which is configured by laminating a first adhesive layer 161, a core film 162, and a second adhesive layer 163 in this order in the thickness direction. A tensile test was performed on the piece using a universal tensile tester ("Autograph" manufactured by Shimadzu Corporation) under the conditions of 23 ° C. and 50% RH, a distance between chucks of 50 mm, and a tensile speed of 200 mm / min. , breaking strength after heating (Ah) [N/10 mm], and breaking elongation after heating (Xh) [%] were determined. Table 1 shows the results.

<Measurement of 180° peeling adhesive strength (Bh) after heating>
The jig fixing adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4 were cut into strips with a width of 10 mm and a length of 250 mm, and the first adhesive layer 161 on the side to be attached to the fixing jig was cut. exposed. Examples 1 to 7 and Comparative Examples 1 to 4 were applied to the #1200HL polished surface of a SUS304 plate (“SUS304 #1200HL (hairline), thickness 1000 μm, size 70 mm × 150 mm” manufactured by Paltec Co., Ltd.). The exposed first pressure-sensitive adhesive layer of the test piece before heating was laminated by reciprocating a 2 kg roller once, and heated at 130° C. for 2 hours. After cooling to room temperature (23 ° C.), using a universal tensile tester ("Autograph" manufactured by Shimadzu Corporation), the test piece before heating was tested in an environment of 23 ° C. and 50% RH. 1 Peel off the test piece before heating from SUS304 at a peeling speed of 300 mm / min so that the surfaces of the adhesive layer and SUS304 that were in contact with each other form an angle of 180 °, and at this time, the test piece before heating The peel force between the first pressure-sensitive adhesive layer and SUS304 was measured. Of the measured values when the test piece was peeled off over a length of 50 mm before heating, the values when the first 5 mm length was removed and the last when the 5 mm length was removed were excluded. The average of the measured values was defined as the 180° peeling adhesive strength (Bh) (N/10 mm) for SUS after heating. Table 1 shows the results.

(Calculation of ratio (Ah/Bh))
For the jig fixing adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4, the ratio (Ah/Bh) was obtained by dividing the breaking strength (Ah) by the 180° separation adhesive strength (Bh). calculated and sought. Table 1 shows the results.

(Calculation of ratio (Xh/X0))
For the jig fixing adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4, the ratio (Xh/X0) was calculated by dividing the breaking elongation (Xh) by the breaking elongation (X0). and asked. Table 1 shows the results.

(Evaluation of Peelability of Adhesive Sheet for Jig Fixing)
From each of the protective film-forming composite sheets of Examples 1 to 7 and Comparative Examples 1 to 4, the first release film was peeled off, and the central portion of the exposed protective film-forming film was transferred to a silicon wafer (diameter 6 inches, thickness 350 μm). , #2000), and the exposed first adhesive layer of the jig fixing adhesive sheet is placed on a dicing ring frame, passed through a laminator at 70 ° C. and 0.3 m / min, and crimped. Let sit for a minute.
The first adhesive layer of the jig fixing adhesive sheet attached to the dicing ring frame is heated at 130° C. for 2 hours to cure the thermosetting protective film-forming film, and then cooled to room temperature (23° C.). It was allowed to cool until Next, the silicon wafer and the protective film of the portion adhered to the silicon wafer are removed by peeling off from the support sheet, and the composite sheets for forming the protective film of Examples 1 to 7 and Comparative Examples 1 to 4 are separated from the ring frame and each other. Peeling was performed at peeling speeds of 11 mm/s and 23 mm/s so that the contacting surfaces formed an angle of 180°.
After peeling, the state of the jig-fixing pressure-sensitive adhesive sheet was observed. The peelability of the jig-fixing pressure-sensitive adhesive sheet was evaluated according to the following criteria. Table 1 shows the results.
A: There was no breakage of the adhesive layer for a jig at the time of peeling.
B: There was no breakage of the adhesive layer for a jig during peeling, but cracks occurred.
C: The adhesive layer for jig was broken at the time of peeling.

The jig-fixing pressure-sensitive adhesive sheets of Examples 1 to 7 and the protective film-forming composite sheets of Examples 1 to 7 formed using these sheets are used for manufacturing a chip with a protective film. It can be easily peeled off from the fixing jig without breaking the agent layer.
In the adhesive sheets for jig fixing of Examples 1 to 7, the breaking strength (Ah), 180° peeling adhesive strength (Bh), and ratio (Ah/Bh) of the test pieces after heating at 130°C for 2 hours were Since it is within the predetermined numerical range, the protective film-forming film is not cured not only after the heating process when the protective film-forming film is thermosetting, but also when the protective film-forming film is energy ray-curable. When used for manufacturing a chip with a protective film, the adhesive layer for a jig can be easily peeled off from a fixing jig without breakage even when the adhesive layer is not broken. Furthermore, if there is a problem in attaching the composite sheet for forming the protective film to the workpiece, the adhesive layer for the jig is removed during the process of peeling off the workpiece so that the workpiece can be used again (rework). It can be easily peeled off from the fixing jig without breaking.

INDUSTRIAL APPLICABILITY The present invention can be used to manufacture various substrate devices including semiconductor devices.

1... Adhesive sheet for jig fixation,
DESCRIPTION OF SYMBOLS 10, 20... Support sheet 10a... One surface (1st surface) of support sheet 11... Base material 12... Adhesive layer 13, 23... Protective film formation film 13'... Protective film 13a'... One surface (first surface) of the protective film, 13b'... The other surface (second surface) of the protective film, 130'... Protective film after cutting,
Reference Signs List 101, 102, 104 Protective film-forming composite sheet 15 Release film 151 First release film 152 Second release film 16 Adhesive layer for jig 161 First adhesive layer 163 ... second adhesive layer, 162 ... core material film, 18 ... fixing jig,
501... First laminated composite sheet, 502... Second laminated composite sheet, 503... Third laminated composite sheet, 504... Fourth laminated composite sheet,
9 Work 9b Back surface of workpiece 90 Chip 90b Back surface of chip 901 Chip with protective film 902 Chip with protective film forming film

Claims (12)

A jig-fixing pressure-sensitive adhesive sheet for use in a protective film-forming composite sheet comprising a protective film-forming film,
A first pressure-sensitive adhesive layer, a core film, and a second pressure-sensitive adhesive layer are laminated in this order in their thickness direction,
The jig fixing pressure-sensitive adhesive sheet has a breaking strength (Ah) obtained from a tensile test on a test piece after heating at 130 ° C. for 2 hours, and a 180 ° peeling adhesive strength ( A pressure-sensitive adhesive sheet for fixing a jig, having a ratio (Ah/Bh) to Bh) of 1.25 or more. 2. The jig fixing adhesive sheet according to claim 1, wherein the 180° peeling adhesive strength (Bh) is 2.0 to 12 N/10 mm. The jig fixing pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the breaking strength (Ah) is 6 N/10 mm or more. The method of claims 1 to 3, wherein the first adhesive layer and the second adhesive layer are formed from a jig adhesive composition containing an acrylic resin, and the acrylic resin has a weight average molecular weight of 700,000 or more. The adhesive sheet for fixing a jig according to any one of items. The jig fixing pressure-sensitive adhesive sheet according to claim 4, wherein the acrylic resin does not have a structural unit derived from (meth)acrylic acid. The jig-fixing pressure-sensitive adhesive sheet according to any one of claims 1 to 5, wherein the constituent material of the core film includes linear low-density polyethylene, unstretched polypropylene, or polyvinyl chloride. The jig-fixing pressure-sensitive adhesive sheet according to any one of claims 1 to 6, wherein a test piece after heating at 130°C for 2 hours has a breaking elongation (Xh) of 100% or more obtained from a tensile test. Adhesive sheet for jig fixing. The jig fixing pressure-sensitive adhesive sheet has a breaking elongation (Xh) obtained from a tensile test on the test piece after heating at 130 ° C. for 2 hours, relative to a breaking elongation (X0) obtained from the tensile test on the test piece before heating. The jig fixing pressure-sensitive adhesive sheet according to any one of claims 1 to 7, wherein the ratio (Xh/X0) is 0.10 to 1.50. A support sheet, a protective film-forming film provided on one surface of the support sheet, and the one surface of the support sheet or the first surface of the protective film-formed film opposite to the support sheet A protective film-forming composite sheet comprising a jig adhesive layer provided near the peripheral edge of
A composite sheet for forming a protective film, wherein the jig adhesive layer is formed using the jig fixing adhesive sheet according to any one of claims 1 to 8. The protective film-forming composite sheet according to claim 9, wherein the protective film-forming film is thermosetting. A method for manufacturing a chip with a protective film comprising a chip and a protective film provided on the back surface of the chip,
The protective film-forming film in the protective film-forming composite sheet according to claim 9 or 10 is applied to the back surface of the workpiece while the adhesive layer for the jig in the protective film-forming composite sheet is attached to a fixing jig. A step of producing a first laminated composite sheet in which the protective film-forming film and the work are laminated in this order in the thickness direction on the support sheet by attaching the
By dividing the work on the support sheet and cutting the protective film-forming film or the protective film obtained by curing the protective film-forming film, a plurality of chips with a protective film-forming film or chips with a protective film are formed. preparing a third laminated composite sheet in which chips are fixed on the support sheet;
and picking up the chip with the protective film forming film or the chip with the protective film in the third laminated composite sheet by separating from the support sheet. A method for manufacturing a chip with a protective film comprising a chip and a protective film provided on the back surface of the chip,
The adhesive layer for a jig in the protective film forming composite sheet is attached to a fixing jig, and the protective film forming film in the protective film forming composite sheet according to claim 10 is attached to the back surface of the work. a step of producing a first laminated composite sheet in which the protective film-forming film and the workpiece are laminated in this order on the support sheet in the thickness direction;
By heating the first laminated composite sheet with the peripheral edge portion of the first laminated composite sheet attached to the fixing jig to cure the protective film-forming film and form the protective film, a step of producing a second laminated composite sheet in which the protective film and the workpiece are laminated in this order on a support sheet in their thickness direction;
A third laminated composite in which a plurality of chips with a protective film are fixed on the support sheet by dividing the work in the second laminated composite sheet and cutting the protective film on the support sheet. a step of making a sheet;
and picking up the chips with the protective film in the third laminated composite sheet by separating them from the support sheet.

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