JP2019079961A - Semiconductor processing sheet - Google Patents

Abstract

To provide a semiconductor processing sheet, which can prevent occurrence of air entrapment between a resin film forming layer and a release film when stored at a low temperature.SOLUTION: A semiconductor processing sheet 101 includes: a resin film forming layer 12 provided on a support sheet 11 having a base material; and a jig fixing tape 14 provided on the resin film forming layer 12. A release film 15 is provided on the resin film forming layer 12 and the jig fixing tape 14, a thickness of the jig fixing tape 14 is not less than 25 μm and not more than 65 μm.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor processing sheet used as a dicing die bonding sheet or a composite sheet for forming a back surface protective film in a dicing step of a semiconductor wafer.

  In the dicing process of a semiconductor wafer, a dicing die bonding sheet in which a film adhesive for bonding a semiconductor element to a lead frame, an organic substrate or the like and a dicing tape are combined is used. Also, to protect the back surface of the semiconductor chip of the semiconductor device using a mounting method called a so-called face down method, a composite sheet for forming a protective film and a dicing tape are used in combination. It is done.

  As a sheet for semiconductor processing such as a dicing die bonding sheet and a composite sheet for forming a protective film, for example, the sheet 102 for semiconductor processing shown in FIG. 3 has a resin film forming layer 12 on a support sheet 11 having a base material. The resin film forming layer 12 is used by being attached to a semiconductor wafer (not shown). Further, the semiconductor processing sheet 102 is provided with a jig fixing tape 14 ′ for fixing to a jig such as a ring frame on a region near the peripheral portion of the resin film forming layer 12. The peeling film 15 is laminated on the jig fixing tape 14 '.

  These sheets for semiconductor processing are wound around a core rod to form a cylindrical roll, and then, in many cases, a roll protector is attached to both ends in the width direction of the roll, stored, and transported (for example, Patent Document 1) And Patent Document 2).

JP 2004-10216 A JP, 2013-95470, A

  These semiconductor processing sheets may be stored while being held by a roll protector. In such a case, when stored for a long time at a low temperature, there is a problem that the sheet for semiconductor processing may be wrinkled or the laminated members may be easily peeled off.

  Then, an object of this invention is to provide the sheet | seat for semiconductor processing which can prevent generation | occurrence | production of a wrinkles, and generation | occurrence | production of peeling of lamination | stacking members, even if it is low temperature storage for a long time in the state wound around a roll.

  In order to solve the above problems, the inventors of the present invention have conducted intensive studies, and the resin film forming layer 12 of the semiconductor processing sheet 102 is protected by the peeling film 15 through the jig fixing tape 14 ′. The generation of wrinkles and peeling of the sheet 102 for semiconductor processing causes a gap between the resin film forming layer 12 and the peeling film 15 in a place where a step is formed by the jig fixing tape 14 ′. During storage, it moves near the center of the resin film forming layer 12 between the resin film forming layer 12 and the peeling film 15, and appears as air bites 16, causing wrinkles and peeling of the semiconductor processing sheet 102. Found out that In addition, air biting is unintended partial peeling which arises between the resin film forming layer 12 and the peeling film 15 when it preserve | saves in a roll state.

  As a result, the inventors have found that it is possible to prevent the occurrence of wrinkles and peeling of the semiconductor processing sheet by reducing the thickness of the jig fixing tape. It has also been found that handling is difficult even if the jig fixing tape is made too thin, and wrinkles are easily generated when the semiconductor wafer is attached.

In the present invention, a resin film forming layer is provided on a support sheet having a base material, and a ring-shaped jig fixing tape is provided on the resin film forming layer, the resin film forming layer and the jig fixing tape The sheet | seat for semiconductor processing which provides a peeling film on it and whose thickness of the said tape for jig fixing is 25 micrometers or more and 65 micrometers or less is provided.
In the sheet for semiconductor processing of the present invention, the jig fixing tape preferably includes a core material and an adhesive layer on both the upper side surface and the lower side surface of the core material.

  According to the present invention, there is provided a sheet for semiconductor processing which can prevent the occurrence of wrinkles and the occurrence of peeling between laminated members even when stored at low temperature for a long time in a state of being wound around a roll.

It is sectional drawing which shows typically one Embodiment of the sheet | seat for semiconductor processing of this invention. It is sectional drawing which shows typically other embodiment of the sheet | seat for semiconductor processing of this invention. It is sectional drawing which shows typically the example of the conventional sheet | seat for semiconductor processing.

<< sheet for semiconductor processing >>

  The semiconductor processing sheet of the present invention will be described with reference to the drawings. Note that the drawings used in the following description may be enlarged for convenience, in order to make the features of the present invention intelligible. Not necessarily.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a sheet for semiconductor processing of the present invention.
The semiconductor processing sheet 101 shown here comprises a resin film forming layer 12 on a support sheet 11 having a base material, and a ring-shaped jig fixing tape 14 on a region near the periphery of the resin film forming layer 12. The peeling film 15 is provided on the resin film forming layer 12 and the jig fixing tape 14, and the thickness of the jig fixing tape 14 is 25 μm or more and 65 μm or less.

  When the thickness of the jig fixing tape is 25 μm or more and 65 μm or less, even if the sheet for semiconductor processing is wound around a roll and stored for a long time at a low temperature, generation of wrinkles or peeling of laminated members occurs Can be prevented. That is, since the thickness of the jig fixing tape is as thin as 65 μm or less, the contact area between the resin film-formed layer and the release film can be increased, and even when stored at low temperatures for a long time, air bite By preventing the occurrence, it is possible to prevent the occurrence of wrinkles and delamination. Further, by setting the thickness of the jig fixing tape to 25 μm or more, the handling becomes easy, and it becomes possible to prevent the generation of wrinkles when the semiconductor wafer is attached. The thickness of the jig fixing tape is more preferably 26 μm to 60 μm, and particularly preferably 26 μm to 55 μm.

  In the semiconductor processing sheet 101, the resin film forming layer 12 is laminated on one surface (hereinafter may be referred to as the "first surface") 11a of the support sheet 11, and the support sheet 11 of the resin film forming layer 12 is A ring-shaped jig-fixing tape 14 is laminated on a part of the surface 12a on the opposite side to the provided side (hereinafter, may be referred to as "first surface"), that is, a region near the peripheral portion. Of the first surface 12a of the resin film forming layer 12, the surface on which the jig fixing tape 14 is not stacked, and the opposite surface not in contact with the resin film forming layer 12 of the jig fixing tape 14 A release film 15 is laminated on (the first surface 14 a). Here, the first surface 14 a of the jig fixing tape 14 is the surface of the jig fixing tape 14 opposite to the side in contact with the resin film forming layer 12, and the jig fixing tape 14 is In some cases, the boundaries between the first surface 14a and the inner side surface 14c can not be clearly distinguished.

  In the case of the semiconductor processing sheet 101 of the present invention, the thickness of the jig fixing tape 14 is the same as that of the conventional semiconductor processing sheet 101 ', compared to the conventional semiconductor processing sheet 101'. Because the inner side surface 14c of the jig fixing tape 14 is in firm contact with the release film 15 or the non-contact portion is smaller, the long-term low-temperature storage in a rolled state is possible. Also in this case, delamination does not progress from the non-contact portion, and delamination can be suppressed.

  The jig fixing tape 14 may have, for example, a single-layer structure containing an adhesive composition, and as shown in FIG. It may have a multi-layered structure in which the layer 141 is stacked.

  The sheet for semiconductor processing 101 shown in FIG. 1 has the first surface 12a of the resin film forming layer 12 on which the circuit of the semiconductor wafer (not shown) is formed (the present specification) in a state where the peeling film 15 is removed. Is affixed to the opposite side (sometimes abbreviated as "back side" in the present specification) to the "circuit-forming side". The first surface 14 a is used by being attached to a jig such as a ring frame.

  The resin film forming layer 12 has, for example, a circular shape or the like when the semiconductor processing sheet 101 is viewed from above at the resin film forming layer 12 side and viewed in plan.

  The sheet for semiconductor processing of the present invention is not limited to the sheet for semiconductor processing 101 shown in FIG. 1, and within the scope of not impairing the effects of the present invention, the configuration shown in FIG. It may be done.

  As a sheet for semiconductor processing of the present invention, a dicing die bonding sheet is provided with a film-like adhesive on a support sheet having a base material, and is used by sticking a semiconductor wafer on the film-like adhesive. Further, as a sheet for processing a semiconductor according to the present invention, the composite sheet for protective film formation is provided with a film for protective film formation on a support sheet having a substrate, and the semiconductor wafer is used by sticking on the film for protective film formation. Be done. The sheet for semiconductor processing of the present invention may be a dicing die bonding sheet or a composite sheet for forming a protective film.

  As a sheet for semiconductor processing of the present invention, for example, a dicing die bonding sheet is provided with a film adhesive on a support sheet having a base material, and a ring-shaped jig on a region near the periphery of the film adhesive. A fixing tape is provided, a release film is provided on the film adhesive and the jig fixing tape, and the jig fixing tape has a thickness of 25 μm to 65 μm, and is in the form of a film. An adhesive corresponds to the resin film forming layer. The dicing die bonding sheet is attached to a semiconductor wafer by a film adhesive and temporarily fixed to a jig such as a ring frame by a jig fixing tape.

  As a sheet for semiconductor processing of the present invention, in the composite sheet for protective film formation, the film for protective film formation to which a semiconductor wafer is stuck corresponds to the resin film formation layer of the sheet for semiconductor processing of the present invention.

  Hereinafter, each layer which comprises this dicing die bonding sheet as a sheet | seat for semiconductor processing of this invention is demonstrated.

<Support sheet>
The said support sheet has a base material, may consist of a base material (it has only a base material), and may have a base material and other layers other than a base material. . As a support sheet which has the said other layer, what provided the adhesive layer on the base material is mentioned, for example.
The film adhesive described later is provided on the support sheet. Therefore, for example, in the case where the support sheet is provided with a pressure-sensitive adhesive layer on a base material, a film-like adhesive as a resin film forming layer is provided on the pressure-sensitive adhesive layer, and the support sheet is In the above case, the film-like adhesive as the resin film forming layer is provided in direct contact with the substrate.

The thickness of the support sheet can be appropriately selected according to the purpose, but is preferably 20 μm to 200 μm, more preferably 25 μm to 150 μm, and particularly preferably 30 μm to 100 μm.
Here, "the thickness of the support sheet" means the thickness of the entire support sheet, for example, the thickness of the support sheet consisting of a plurality of layers means the total thickness of all the layers constituting the support sheet means. In addition, as a measuring method of the thickness of a support sheet, thickness is measured using a contact-type thickness gage, for example in arbitrary five places, The method of calculating the average of a measured value etc. is mentioned.

[Base material]
It is preferable that the constituent material of the said base material is various resin, and, specifically, for example, polyethylene (it may abbreviate as low density polyethylene (it may abbreviate as LDPE), linear low density polyethylene (it may abbreviate as LLDPE) , High-density polyethylene (sometimes abbreviated as HDPE), polypropylene, polybutene, polybutadiene, polymethylpentene, styrene / ethylene butylene / styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate (PET Sometimes abbreviated as: polybutylene terephthalate, polyurethane, polyurethane acrylate, polyimide, ethylene vinyl acetate copolymer, ionomer resin, ethylene (meth) acrylic acid copolymer, ethylene (meth) acrylic acid ester copolymer , Police Emissions, polycarbonate, fluorocarbon resins, hydrogenated product of any of these resins, modified products, include cross-linked product or copolymer and the like. From the viewpoint of chip control and expandability, low density polyethylene (LDPE) films, ethylene-methacrylic acid (EMAA) copolymer films, and ethylene- (meth) acrylate (EMMA) copolymer films are preferred.

  In the present specification, “(meth) acrylic acid” is a concept including both “acrylic acid” and “methacrylic acid”. The same applies to terms similar to (meth) acrylic acid, for example, “(meth) acrylate” is a concept including both “acrylate” and “methacrylate”, “(meth) acryloyl group” Is a concept including both "acryloyl group" and "methacryloyl group".

  The resin constituting the substrate may be only one type, or two or more types, and in the case of two or more types, the combination and ratio thereof can be arbitrarily selected.

The substrate may be composed of one layer (that is, a single layer), or may be composed of a plurality of layers of two or more layers. When the substrate comprises a plurality of layers, the plurality of layers may be the same or different. That is, all layers may be identical, all layers may be different, or only some layers may be identical. And when several layers mutually differ, the combination of these several layers is not specifically limited unless the effect of this invention is impaired. Here, that the plurality of layers are different from each other means that at least one of the material and thickness of each layer is different from each other.
In the present specification, not only in the case of the base material, but “a plurality of layers may be the same as or different from each other” means that “all layers may be the same or all layers are different. Means that only some of the layers may be the same, and the phrase "plural layers are different from each other" means that "at least one of the constituent material and thickness of each layer is different from each other". Means

The thickness of the substrate can be appropriately selected according to the purpose, but is preferably 20 μm to 200 μm, more preferably 25 μm to 150 μm, and particularly preferably 30 μm to 100 μm.
Here, "the thickness of the substrate" means the thickness of the entire substrate, for example, the thickness of the substrate comprising a plurality of layers means the total thickness of all the layers constituting the substrate means. In addition, as a measuring method of the thickness of a base material, thickness is measured using a contact-type thickness meter in arbitrary five places, for example, The method of calculating the average of a measured value, etc. are mentioned.

The base material is roughened by sandblasting, solvent treatment, embossing, etc., corona discharge treatment, electron beam irradiation, etc., in order to improve the adhesion with other layers such as the pressure-sensitive adhesive layer provided thereon. The surface may be subjected to oxidation treatment such as treatment, plasma treatment, ozone / ultraviolet radiation treatment, flame treatment, chromic acid treatment, hot air treatment or the like.
Moreover, the surface of the substrate may be subjected to primer treatment.
In addition, the base material prevents adhesion of the base material to another sheet and adhesion of the base material to the suction table when the antistatic coating layer and the film-like adhesive composite sheet are stacked and stored. It may have a layer or the like.
Among them, the substrate is preferably a substrate whose surface has been subjected to electron beam irradiation treatment from the viewpoint of suppressing generation of fragments of the substrate due to friction of a blade during dicing of a semiconductor wafer. From the viewpoint of easy implementation, it is preferable that the electron beam irradiation treatment is not performed.

[Pressure-sensitive adhesive layer]
A well-known thing can be suitably used for the said adhesive layer.
The pressure-sensitive adhesive layer can be formed using a pressure-sensitive adhesive composition containing various components for constituting the pressure-sensitive adhesive layer. The ratio of the contents of the components which do not vaporize at normal temperature in the pressure-sensitive adhesive composition is usually the same as the ratio of the contents of the components of the pressure-sensitive adhesive layer. In addition, in this specification, the "normal temperature" means the temperature which does not cool or heat especially, ie, the normal temperature, for example, the temperature of 15-30 degreeC etc. are mentioned.

  When the pressure-sensitive adhesive layer contains an energy ray-curable component, the adhesion of the energy ray is reduced to make the semiconductor chip easier to pick up. The treatment for reducing the adhesiveness by irradiating the pressure-sensitive adhesive layer with energy rays may be performed after the film-like adhesive composite sheet is attached to the adherend, or may be performed in advance before being attached to the adherend. It may be

In the present invention, the term "energy beam" means an electromagnetic wave or charged particle beam having energy quantum, and examples thereof include ultraviolet rays, electron beams and the like.
The ultraviolet light can be irradiated, for example, by using a UV-LED, a high pressure mercury lamp, a fusion H lamp or a xenon lamp as an ultraviolet light source. The electron beam can irradiate what was generated by the electron beam accelerator or the like.
In the present invention, "energy ray curing property" means the property of curing by irradiation with energy rays, and "non energy ray curing property" means the property of not curing even by irradiation of energy rays. .

  Preferred examples of the pressure-sensitive adhesive composition include those containing an acrylic polymer and an energy ray-polymerizable compound (pressure-sensitive adhesive composition (i)), having a hydroxyl group, and having a polymerizable group in a side chain. What contains acrylic polymer (For example, what has a hydroxyl group and has a polymeric group in a side chain via a urethane bond), and an isocyanate type crosslinking agent (pressure-sensitive adhesive composition (ii)) Those which can be mentioned and which further contain a solvent are preferred.

  The pressure-sensitive adhesive composition further includes various additives such as a photopolymerization initiator, a coloring agent (pigment, dye), an antidegradant, an antistatic agent, a flame retardant, a silicone compound, a chain transfer agent and the like in addition to the components described above. May be contained.

  The pressure-sensitive adhesive composition may contain a reaction retarder for suppressing the progress of an unintended crosslinking reaction during storage. Examples of the reaction retarder include those that inhibit the action of a component serving as a catalyst that promotes the crosslinking reaction, and preferred examples include those that form a chelate complex by a chelate to the catalyst. More preferable examples of the reaction retarder include those having two or more carbonyl groups (-C (= O)-) in the molecule, and those having two carbonyl groups in the molecule, For example, dicarboxylic acids, keto acids, diketones and the like can be mentioned.

  When the support sheet has a pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer can be appropriately selected according to the purpose, but is preferably 1 to 100 μm, more preferably 1 to 60 μm, and 1 to 30 μm. Being particularly preferred. Here, "the thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers means the total of all layers constituting the pressure-sensitive adhesive layer. Means the thickness of. In addition, as a measuring method of the thickness of an adhesive layer, thickness is measured using a contact-type thickness meter in arbitrary five places, for example, The method of calculating the average of a measured value etc. is mentioned.

  The pressure-sensitive adhesive composition is obtained by blending the respective components for constituting the pressure-sensitive adhesive layer, such as an acrylic polymer, and, for example, the same as the adhesive composition described later except that the blending components are different. It is obtained by the method.

The pressure-sensitive adhesive layer can be formed by applying a pressure-sensitive adhesive composition on the surface of the substrate and drying it.
At this time, if necessary, the applied pressure-sensitive adhesive composition may be crosslinked by heating. The heating conditions may be, for example, 100 to 130 ° C. for 1 to 5 minutes, but not limited thereto. In addition, a pressure-sensitive adhesive layer formed by applying the pressure-sensitive adhesive composition on the release-treated surface of the release film and drying it is attached to the surface of the substrate, and the release film may be removed if necessary. An adhesive layer can be formed on the material.

  The application of the pressure-sensitive adhesive composition to the surface of the substrate or the release material may be performed by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife Methods using various coaters, such as a coater, a curtain coater, a die coater, a knife coater, a screen coater, a Mayer bar coater, a kiss coater, etc., are mentioned.

<Film adhesive>
The film adhesive as the resin film forming layer is not particularly limited as long as the effects of the present invention are not impaired, and known ones can be appropriately used.

  The film-like adhesive has a curing property, preferably a thermosetting property, and a pressure-sensitive adhesive property. The film-like adhesive having both the thermosetting property and the pressure sensitive adhesive property can be stuck by lightly pressing on various adherends in the uncured state. The film-like adhesive may be attached to various adherends by heating and softening. The film-like adhesive finally becomes a cured product having high impact resistance by curing, and the cured product can retain sufficient adhesive properties even under severe high temperature and high humidity conditions.

  The film adhesive may be composed of a single layer (monolayer) or may be composed of a plurality of layers of two or more layers. When the film-like adhesive comprises a plurality of layers, the plurality of layers may be identical to or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.

The thickness of the film adhesive is not particularly limited, but is preferably 1 to 50 μm, and more preferably 3 to 40 μm. When the thickness of the film adhesive is equal to or more than the lower limit value, higher adhesion to an adherend (semiconductor chip) can be obtained. On the other hand, when the thickness of the film adhesive is equal to or less than the upper limit, the film adhesive can be cut more easily in the dividing step described later, and generation of cutting chips during dicing using a dicing blade The amount can be further reduced.
Here, "the thickness of the film-like adhesive" means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive comprising a plurality of layers means all of the components of the film-like adhesive. Means the total thickness of the layers.

As a preferable film adhesive, what contains a polymer component (a) and an epoxy-type thermosetting resin (b) is mentioned, for example. As an epoxy-type thermosetting resin (b), what consists of an epoxy resin (b1) and a thermosetting agent (b2) is mentioned, for example.
In addition to the polymer component (a) and the epoxy-based thermosetting resin (b), other components which do not fall under these as a film-like adhesive may be used in order to improve various physical properties thereof. May be contained. Preferred examples of the other components include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a crosslinking agent (f), an energy ray curable resin (g), and a photopolymerization initiation Agents (h), general purpose additives (i) and the like. The general-purpose additive (i) may be a known one, can be optionally selected according to the purpose, and is not particularly limited. Preferred examples thereof include a plasticizer, an antistatic agent, an antioxidant, and a colorant (dye , Pigments), gettering agents and the like.

  The film-like adhesive can be formed using an adhesive composition containing its constituent material. For example, the film-like adhesive can be formed on a target site by applying the adhesive composition on the surface to be formed of the film-like adhesive and drying it as required. With respect to the composition and production method of the adhesive composition, and the production method of the film-like adhesive using the adhesive composition, reference is made to the examples described in JP-A-2016-135856 and WO 2016/140248 etc. can do.

<Fixing tape>
The jig fixing tape is provided on the resin film forming layer in order to temporarily fix the semiconductor processing sheet to a dicing jig such as a ring frame. Preferably, as shown in FIG. 1, it is provided on the area | region of the peripheral part vicinity of a resin film formation layer.

The jig fixing tape preferably has an adhesive strength to a silicon wafer (mirror surface) according to JIS Z 0237; 2009 of 0.1 N / 25 mm or more, more preferably 0.5 to 6 N / 25 mm, particularly preferably Is 1 to 5 N / 25 mm.
When the adhesive strength is 0.1 N / 25 mm or more, the adhesion between the jig fixing tape and the metal jig becomes sufficient, and the jig such as a ring frame is fixed during the manufacturing process of the semiconductor device. This process can be smoothly performed without peeling off the tool fixing tape at the interface.
Further, when the adhesive strength is 6 N / 25 mm or less, adhesive residue on the jig (adhesive constituting the jig fixing tape) when peeling the jig fixing tape from the jig such as a ring frame or the like It is possible to prevent the occurrence of the residue of the agent composition. If the residue is mixed in the semiconductor device, the reliability of the semiconductor device may be reduced, and the residue may contaminate a device such as a transfer arm used for transportation or the like between manufacturing steps of the semiconductor device.

  The jig fixing tape may have a single-layer structure containing the pressure-sensitive adhesive composition, and may have a multi-layer structure in which layers containing the pressure-sensitive adhesive composition are laminated on both sides of a sheet serving as a core material. It may be Examples of the pressure-sensitive adhesive composition include the same as the above-described pressure-sensitive adhesive composition, and examples of the sheet to be the core material include the same as the above-described base material.

  For example, a fixing tape is formed on a peeling film to be described later, and a blade is inserted into the fixing tape to form a circular cut, and the fixing tape on the inner portion is peeled off and removed. Thus, a ring-shaped jig fixing tape can be obtained.

<Peeling film>
The release film is not particularly limited, and a commercially available release film can be used. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film , Polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene (meth) acrylic acid copolymer film, ethylene (meth) acrylic acid ester Copolymer films, polystyrene films, polycarbonate films, polyimide films, fluorine resin films and the like are used. Moreover, these crosslinked films are also used. Furthermore, these laminated films may be sufficient.

  The surface tension of the surface of the release film in contact with the resin film-forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a release film having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release film and performing release treatment. .

  Alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, rubber-based release agents are used as the release agent used for the release treatment, and in particular, alkyd-based, silicone-based and fluorine-based release agents Is preferable because it has heat resistance.

  In order to release the surface of a film or the like to be a substrate of a release film using the above release agent, the release agent may be used as it is with no solvent, or diluted with solvent or emulsified to form a gravure coater, Mayer bar coater, air knife coater. The release film may be coated by a roll coater or the like, and the release film coated with the release agent may be provided at normal temperature or under heating, or may be cured by an electron beam to form a release agent layer.

  As surface roughness (Ra) of a peeling film, 10-100 nm is preferable, 15-60 nm is preferable, and 20-50 nm is preferable.

<< Method of manufacturing sheet for semiconductor processing >>
The sheet for semiconductor processing can be manufactured by sequentially laminating the above-mentioned layers so as to have a corresponding positional relationship. The method of forming each layer is as described above.

  For example, a resin film-forming layer is laminated on a substrate by coating the above-mentioned adhesive composition on a substrate and drying it as necessary, and a jig fixing tape formed on a peeling film And the resin film formation layer can be laminated to form a sheet for processing a semiconductor.

  On the other hand, for example, in the case of laminating a film-like adhesive as a resin film forming layer on the pressure-sensitive adhesive layer already laminated on the substrate, the above-mentioned adhesive composition is coated on the pressure-sensitive adhesive layer. The film-like adhesive is directly formed by drying if necessary, and the ring-shaped jig fixing tape and the film-like adhesive formed on the peeling film are laminated to form a dicing die bonding sheet. It is possible. As described above, in the case of forming a continuous two-layer laminated structure using any of the compositions, the composition is further coated on the layer formed of the composition to form a new layer. It is possible to form However, of these two layers, the layer to be laminated later is formed in advance using the composition on another release film, and the side of the formed layer in contact with the release film is It is preferable to form a continuous two-layered laminated structure by bonding the opposite exposed surface to the exposed surface of the remaining layer that has already been formed. At this time, the composition is preferably applied to the release-treated surface of the release film. The release film may be removed as necessary after the formation of the laminated structure.

  That is, the pressure-sensitive adhesive composition is coated on the substrate, and dried as necessary, thereby laminating the pressure-sensitive adhesive layer on the substrate, and separately coating the adhesive composition on the release film The film adhesive is formed on the release film by drying if necessary, and the exposed surface of the film adhesive is attached to the exposed surface of the pressure-sensitive adhesive layer already laminated on the substrate. At the same time, the film adhesive is laminated on the pressure-sensitive adhesive layer. Further, the peeling film is peeled to expose the film adhesive, and the jig fixing tape formed on the peeling film and the film adhesive are laminated to obtain a dicing die bonding sheet.

In addition, when laminating an adhesive layer on a base material, it replaces with the method of coating an adhesive composition on a base material as mentioned above, and applies an adhesive composition on a peeling film. If necessary, the pressure-sensitive adhesive layer may be formed on the release film by drying, and the exposed surface of the pressure-sensitive adhesive layer may be laminated by bonding to one surface of the substrate.
In any of the methods, the release film may be removed at any timing after formation of the intended laminated structure.

  As described above, any layer other than the base material constituting the dicing die bonding sheet can be laminated in advance by a method of forming in advance on the peeling film and bonding it to the surface of the target layer, and this may be done as needed. A layer adopting such a process may be appropriately selected to manufacture a dicing die bonding sheet.

  In addition, a sheet for semiconductor processing is subjected to precut processing so as to be fixed to a ring frame having a known shape, and a plurality of resin film-formed layers are arranged on a long sheet at predetermined intervals. It can also be manufactured as

  As the semiconductor processing sheet, the dicing die bonding sheet used in the dicing / die bonding process has been described as an example, but the present invention is not limited to this, and the same applies to the protective film forming composite sheet. With respect to the composition and production method of the protective film-forming film, and the production method of the composite sheet for protective film formation using the protective film-forming film, the examples described in JP-A-2016-015456 and JP-A-2016-141749 are described. It can be implemented for reference.

  Hereinafter, the present invention will be described in more detail by way of examples of dicing die bonding sheets. However, the present invention is not limited at all to the examples shown below.

The components used for producing the adhesive composition are shown below.
Polymer component (a) -1: methyl acrylate (hereinafter abbreviated as "MA") (95 parts by mass) and 2-hydroxyethyl acrylate (hereinafter abbreviated as "HEA") (5 parts by mass Acrylic resin (weight average molecular weight 800,000, glass transition temperature 9 ° C.) formed by copolymerizing
Epoxy resin (b1) -1: cresol novolac epoxy resin to which an acryloyl group is added (CNA 147 manufactured by Nippon Kayaku Co., Ltd.)
Thermosetting agent (b2) -1: Phenolic resin (HE100C-25 manufactured by Air Water Co., Ltd.)
· Filler (d) -1: silica filler (ADMATEX, YA050C-MJE)
Coupling agent (e) -1: Silane coupling agent (Shin-Etsu Chemical Co., Ltd. KBE-402)
Crosslinking agent (f) -1: Tolylene diisocyanate trimer adduct of trimethylolpropane (Toronso "Corronate L")

(Production of adhesive composition)
52.0 parts by weight of polymer component (a) -1, 18.2 parts by weight of epoxy resin (b1) -1, 3.0 parts by weight of thermosetting agent (b2) -1, 25.0 parts by weight Filler (d) -1, 0.43 parts by mass of coupling agent (e) -1, and 0.37 parts by mass of crosslinking agent (f) -1 are dissolved or dispersed in methyl ethyl ketone at 23 ° C. The adhesive composition 1 was obtained by stirring.

(Production of film adhesive)
The adhesive composition obtained above is coated on the release-treated surface of a release film of which one surface of a polyethylene terephthalate film (thickness 38 μm) is release-treated by silicone treatment, and heat-dried at 115 ° C. for 3 minutes Thus, a film-like adhesive having a thickness of 5 μm was formed.
Then, an 80 μm thick polyethylene film (LDPE base material: surface tension 33 mN / m) is attached to the exposed surface of the film adhesive, and the LDPE substrate, the film adhesive, and the release film are laminated in this order. I got a tape.

(Adhesive composition)
An acrylic polymer (weight average molecular weight 700000, copolymerized with 2-ethylhexyl acrylate (2EHA, 85 parts by mass) and 2-hydroxyethyl acrylate (HEA, 15 parts by mass) as an adhesive resin Glass transition temperature -63 ° C) (100 parts by mass), and tolylene diisocyanate trimer adduct of trimethylolpropane as a crosslinking agent ("Coronato L" manufactured by Tosoh Corp.) (28.28 parts by mass) as a solvent A pressure-sensitive adhesive composition containing toluene (204 parts by mass) was prepared.

Example 1
The pressure-sensitive adhesive composition obtained above is applied to a release-treated surface (surface roughness Ra: 20 nm) of a release film (SP-PS 381031 (C) manufactured by Lintec Corporation) and dried by heating at 115 ° C. for 3 minutes. Thus, a 5 μm thick pressure-sensitive adhesive layer was obtained. This pressure-sensitive adhesive layer was bonded to one side of a polypropylene film (40 μm in thickness) subjected to double-sided corona treatment as a core material, to obtain an intermediate 1. Thereafter, the same pressure-sensitive adhesive composition is applied to the same release film to form a pressure-sensitive adhesive layer having a thickness of 5 μm, and the surface is bonded to the surface of the core of Intermediate 1 where the pressure-sensitive adhesive layer is not laminated. By doing this, a fixing tape was produced.
Remove the peeling film on one side of the jig fixing tape, insert a circular blade with a diameter of 230 mm into the adhesive layer / core material / adhesive layer, and form a circular cut with an inner diameter of 230 mm in the fixing tape. The tape on the inner part was peeled off and removed.
Thereafter, the peeling film of the film-like adhesive tape was peeled off, and it was bonded to the ring-shaped jig-fixing tape cut into a circular shape at a pressure of 0.3 MPa and a speed of 1.5 m / min. After that, according to the outer peripheral shape of the jig, cutting was performed, unnecessary portions were removed, and a 50-sheet roll of the 8-inch wafer semiconductor processing sheet of Example 1 was produced.
Similarly, a circular cut having a diameter of 330 mm may be formed in the fixing tape, and the tape in the inner portion may be peeled off to produce a semiconductor processing sheet for a 12-inch wafer.

Example 2
As a core material, 50 sheets of a semiconductor processing sheet for an 8-inch wafer of Example 2 are wound in the same manner as in Example 1 except that a polyethylene terephthalate film (38 μm in thickness) subjected to double-sided corona treatment is used. A roll was made.

[Example 3]
As a core material, 50 sheets of semiconductor processing sheet for 8-inch wafer of Example 3 were wound in the same manner as in Example 1 except that a polyethylene terephthalate film (25 μm in thickness) subjected to double-sided corona treatment was used. A roll was made.

Example 4
As a core material, 50 sheets of a semiconductor processing sheet for an 8-inch wafer of Example 4 were wound in the same manner as in Example 1 except that a polyethylene terephthalate film (16 μm thick) subjected to double-sided corona treatment was used as the core material. A roll was made.

[Example 5]
A roll of 50 sheets of an 8-inch wafer semiconductor processing sheet of Example 5 was wound in the same manner as in Example 1 except that a polypropylene film (50 μm in thickness) subjected to double-sided corona treatment was used as a core material. Was produced.

[Example 6]
As a core material, 50 sheets of a semiconductor processing sheet for an 8-inch wafer of Example 6 are wound in the same manner as in Example 1 except that a polyethylene terephthalate film (60 μm in thickness) subjected to double-sided corona treatment is used. A roll was made.

Comparative Example 1
50 cored sheet of semiconductor processing sheet for 8-inch wafer of Comparative Example 1 in the same manner as in Example 1 except that a polyethylene terephthalate film (12 μm in thickness) subjected to double-sided corona treatment was used as the core material. A roll was made.

Comparative Example 2
50 cored sheet of semiconductor processing sheet for 8-inch wafer of Comparative Example 2 in the same manner as in Example 1 except that a polyethylene terephthalate film (6 μm in thickness) subjected to double-sided corona treatment was used as the core material. A roll was made.

Comparative Example 3
A roll of 50 sheets of an 8-inch wafer semiconductor processing sheet of Comparative Example 3 was prepared in the same manner as in Example 1 except that a polypropylene film (60 μm in thickness) subjected to double-sided corona treatment was used as a core material. Was produced.

Comparative Example 4
50 cored sheet of semiconductor processing sheet for 8-inch wafer of Comparative Example 4 in the same manner as in Example 1 except that a polyethylene terephthalate film (75 μm in thickness) subjected to double-sided corona treatment was used as the core material. A roll was made.

[Low temperature storage evaluation (-5 ° C)]
The roll protector was attached to a 50-sheet roll of each sample, and then sealed with an aluminum vapor deposition bag. The roll was stored at a temperature of -5 ° C for 4 days, then returned to normal temperature, taken out from the aluminum vapor deposition bag, and the sheet was pulled out from the surface side to generate air mixing or wrinkles between the film adhesive and the release film. The number of sheets was confirmed. Air bites with a maximum length of 5 mm or more and those with wrinkles were regarded as NG, and the number of NG / 50 sheets (total number of samples) was evaluated.

[Low temperature storage evaluation (5 ° C)]
After storing the rolls of each sample at a temperature of 5 ° C. for 4 days as in the case of -5 ° C., the temperature was returned to normal temperature, and the number of sheets in which air mixing and wrinkles occurred was confirmed. An air bit of 5 mm or more and one with wrinkles were regarded as NG, and the evaluation was made with the number of NG / 50 (total number of samples).

[Mount evaluation]
Using a tape mounter device (Lintec Co., Ltd., Adwill RAD-2700F) and sticking 10 sheets of each sample to a 350 μm thick 8-inch wafer and ring frame while peeling off the peeling film at a sticking speed of 20 mm / s did. The wafer bonding temperature was 40.degree. At that time, air biting between layers, and those with wrinkles at the time of sticking are considered as NG, and with NG number / total number of sheets, those without NG, ie, those with 0/10 〇 and even with one NG It evaluated as x.

[Expand evaluation]
Using a tape mounter device (Lintec Co., Ltd., Adwill RAD-2500m), at a sticking speed of 20 mm / s, two samples of each sheet for semiconductor processing for 8-inch wafer are peeled off from the peeling film, and the thickness is It was attached to a 350 μm 8-inch wafer. After dicing into pieces with a chip size of 10 mm × 10 mm using a dicing apparatus (DFC6361 manufactured by Disco Co., Ltd.), the speed is 1 mm / s, expand by an expander apparatus (ME-300B manufactured by Lintec Co., Ltd.) When expanded at an amount of 10 mm and a temperature of 23 ° C., those with cracks and peelings of the ring frame fixing tape were evaluated as x, and those without problems were evaluated as ○.

  In the sheet for semiconductor processing of Examples 1 to 6 in which the thickness of the jig fixing tape is 25 μm or more and 65 μm or less, air biting of 5 mm or more is not observed in low temperature storage evaluation at 5 ° C. There were also good mount evaluations and expand evaluations. In the sheet for semiconductor processing of Comparative Examples 1 and 2 in which the thickness of the jig fixing tape is less than 25 μm, although the low temperature storage evaluation was good, the mount evaluation or the expand evaluation was poor. In the sheet for semiconductor processing of Comparative Examples 3 and 4 in which the thickness of the jig fixing tape exceeds 65 μm, the low temperature storage evaluation was poor.

  The sheet for semiconductor processing of the present invention can be used as a dicing die bonding sheet for producing a semiconductor device, and a composite sheet for forming a protective film.

  101, 101 ', 102 ... sheet for semiconductor processing, 11 ... support sheet, 11a ... first surface of support sheet, 12 ... resin film forming layer, 12a ... resin film forming layer 1st surface 14, 14 '... tape for fixing the jig, 14a ... 1st surface of the tape for fixing the jig, 14c ... inner side of the tape for fixing the jig, 16 ... air Chew 141 ··· Layer containing adhesive composition, 142 ··· Sheet serving as core material

Claims (2)

A resin film forming layer is provided on a support sheet having a substrate, a jig fixing tape is provided on the resin film forming layer, and a peeling film is provided on the resin film forming layer and the jig fixing tape. Become
The sheet for semiconductor processing whose thickness of the tape for jig fixation is 25 micrometers or more and 65 micrometers or less.   The sheet for semiconductor processing according to claim 1, wherein the jig fixing tape comprises a core, and an adhesive layer on both the upper side and the lower side of the core.

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