JPWO2022202502A1 - - Google Patents
Info
- Publication number
- JPWO2022202502A1 JPWO2022202502A1 JP2022538735A JP2022538735A JPWO2022202502A1 JP WO2022202502 A1 JPWO2022202502 A1 JP WO2022202502A1 JP 2022538735 A JP2022538735 A JP 2022538735A JP 2022538735 A JP2022538735 A JP 2022538735A JP WO2022202502 A1 JPWO2022202502 A1 JP WO2022202502A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021047594 | 2021-03-22 | ||
| JP2021047594 | 2021-03-22 | ||
| PCT/JP2022/011685 WO2022202502A1 (en) | 2021-03-22 | 2022-03-15 | Adhesive sheet for jig fixation, composite sheet for protective film formation, and method for producing chip provided with protective film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP7114013B1 JP7114013B1 (en) | 2022-08-05 |
| JPWO2022202502A1 true JPWO2022202502A1 (en) | 2022-09-29 |
Family
ID=82740489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022538735A Active JP7114013B1 (en) | 2021-03-22 | 2022-03-15 | Adhesive sheet for fixing jig, composite sheet for forming protective film, and method for manufacturing chip with protective film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7114013B1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004193237A (en) * | 2002-12-10 | 2004-07-08 | Disco Abrasive Syst Ltd | Wafer retaining member equipped with pressure sensitive adhesive sheet and peeling method of pressure sensitive adhesive sheet |
| JP4642436B2 (en) * | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
| JP6129705B2 (en) * | 2013-09-27 | 2017-05-17 | リンテック株式会社 | Adhesive sheet for semiconductor processing and method for manufacturing semiconductor device |
| CN105899631A (en) * | 2014-01-08 | 2016-08-24 | 琳得科株式会社 | Composite sheet for protective-film formation |
| JP6391329B2 (en) * | 2014-07-03 | 2018-09-19 | リンテック株式会社 | Composite sheet for protective film formation |
| JP2017071730A (en) * | 2015-10-09 | 2017-04-13 | 日本合成化学工業株式会社 | Adhesive sheet |
| JP2019079961A (en) * | 2017-10-25 | 2019-05-23 | リンテック株式会社 | Semiconductor processing sheet |
-
2022
- 2022-03-15 JP JP2022538735A patent/JP7114013B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7114013B1 (en) | 2022-08-05 |
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