JP5583725B2 - Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method - Google Patents

Description

  The present invention relates to a laser dicing sheet that is a dicing sheet used when a laser beam is used in a dicing process for dicing a plate-like member such as a semiconductor wafer, and a laser dicing sheet that is a laminate of the laser dicing sheet and a release sheet. -It is related with the manufacturing method of the chip body obtained by separating a plate-shaped member into pieces using a peeling sheet laminated body and its laser dicing sheet.

  After a circuit is formed on the surface of the semiconductor wafer, a grinding process is performed on the back side of the wafer, and a back grinding process for adjusting the thickness of the wafer and a dicing process for dividing the wafer into a predetermined chip size are performed.

  Along with the recent downsizing of electronic equipment casings and an increase in demand for semiconductor devices using multi-layered chips, semiconductor chips that are constituent members thereof are being made thinner. For this reason, it has been required to reduce the thickness of a conventional wafer having a thickness of about 350 μm to 50 to 100 μm or less.

  As the wafer that is a brittle member becomes thinner, the risk of breakage increases during processing and transportation. When such an ultra-thin wafer is cut by a dicing blade that rotates at high speed, chipping or the like occurs particularly on the back side of the semiconductor wafer, and the die strength of the chip is significantly reduced.

  For this reason, a so-called stealth dicing method is proposed in which a dicing line is formed while a modified portion is selectively formed by irradiating the inside of a semiconductor wafer with a laser beam, and the semiconductor wafer is cut starting from the modified portion. (Patent Document 1). According to the stealth dicing method, after forming the modified portion by irradiating the inside of the semiconductor wafer with a laser beam, the ultrathin semiconductor wafer is attached to an adhesive sheet (dicing sheet) composed of a base material and an adhesive layer, By expanding the dicing sheet, the semiconductor wafer can be divided (diced) along the dicing line, and semiconductor chips can be produced with high yield.

  A laser may be used as a processing means in the dicing process as described above, and a laser may be used as a tool for accurately aligning a plate-like member such as a semiconductor wafer during the dicing process. In these cases, a dicing sheet (also referred to as “laser dicing sheet” in the present specification) used when laser light is used in the dicing process allows the laser to pass through the laser dicing sheet. Therefore, it must have excellent transparency to laser light.

  In order to meet such a demand, for example, Patent Document 2 discloses a base resin film and a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is formed on the base resin film, and parallel rays in a wavelength region of 400 to 1100 nm. A wafer sticking pressure-sensitive adhesive sheet having a transmittance of 80% or more is disclosed, and in a preferred embodiment of the sheet, the arithmetic average roughness Ra of the surface opposite to the surface on which the pressure-sensitive adhesive layer of the base resin film is formed is 0.1 to 0.3 μm.

Japanese Patent No. 3762409 JP 2012-15236 A

  As disclosed in Patent Document 2, making the surface opposite to the surface on which the adhesive layer of the base resin film is formed as a smooth surface has advantages such as improving dicing workability for the laser dicing sheet. . However, when the surface opposite to the side facing the pressure-sensitive adhesive layer of the base material of the laser dicing sheet (also referred to as “back surface of the base material” in this specification) is a smooth surface, the following problems may occur. It was revealed.

  That is, generally, the pressure-sensitive adhesive layer of the laser dicing sheet is on the surface opposite to the side facing the base material (the surface on which the plate-like member is pasted during use) until it is used in the dicing process. The release surface of the release sheet is affixed so that the adhesive layer is not contaminated or deteriorated. The laser dicing sheet-release sheet laminate (also referred to as “DR laminate” in this specification), which is a laminate of the laser dicing sheet and the release sheet thus obtained, is stored in various forms. For example, in some cases, a plurality of laser dicing sheets may be stored in the form of an elongated body that is laminated on the release surface of a long release sheet in a direction parallel to the longitudinal direction of the release sheet. In some cases, the long body is wound in the longitudinal direction and stored in the form of a wound body. In some cases, for example, a single laser dicing sheet may be stored in the form of a stack obtained by stacking a number of layers of a DR laminate formed by attaching a single release sheet.

  When the DR laminate is stored in the form of a wound body or a stack, the back surface of the substrate of the laser dicing sheet of the DR laminate, and the release sheet peeling surface of another DR laminate closest to the DR laminate, Is in contact with the opposite surface (also referred to as “releasable sheet back surface” in this specification). Depending on the storage state (specifically, when the winding force of the winding body is strong or when the stack body is pressed in the stacking direction, etc.) In some cases, the adhesion between the back surface of the release sheet of another DR laminate that is in contact with the back surface may be increased.

  As a specific example, a problem when the adhesion is increased will be described by taking a wound body in which a DR laminated body having a long shape is wound so that the laser dicing sheet is on the inner side. When the DR laminate is unwound from the winding body, the release sheet in the outermost layer is pulled, and the laser dicing sheet that is attached to the release surface located on the inner peripheral side (core side) of the release sheet is also the outermost periphery. The unwinding operation is normally performed by being unwound from the winding body together with the release sheet. However, when the adhesion between the back surface of the base material and the back surface of the release sheet of the DR laminate located on the inner circumference side in the winding body is high, the laser dicing sheet that should be fed out originally is that of the laser dicing sheet. Peeling occurs at the interface between the pressure-sensitive adhesive side surface and the release surface of the outermost release sheet. As a result, the laser dicing sheet is not fed out together with the outermost release sheet, but remains on the back surface of the release sheet of the DR laminate located on the inner circumference side.

  When such a situation occurs, since the laser dicing sheet is peeled off from the DR laminated body that has been fed out, it is not possible to carry out the pasting operation between the laser dicing sheet and the plate-like member. Furthermore, the laser dicing sheet attached to the back surface of the release sheet of the DR laminate may significantly reduce the workability of the subsequent release sheet winding operation. Specifically, it is exemplified that the sheet is wound around a pinch roller for winding the release sheet. In such a case, the feeding operation of the DR laminated body in the form of a wound body must be stopped. Hereinafter, such a problem is also referred to as “DR laminate supply failure”.

  The same DR laminate supply failure may occur in a DR laminate in the form of a stack. In the case of a DR laminate having a laser dicing sheet attached to the lower layer side of the release sheet, the DR laminate is obtained by holding the release sheet in the same manner as the DR laminate in the form of the winding body. When turning off, only the release sheet is turned off, and the laser dicing sheet may remain in the stack. In the case of a stack of DR laminates in which a laser dicing sheet is attached to the upper layer side of the release sheet, when the DR laminate is turned over by grasping the release sheet, the laser dicing of the lower DR laminate is performed. There may be a problem that the sheet is also flipped together.

  The present invention relates to a laser dicing sheet capable of reducing the possibility of a DR laminate supply failure occurring in a DR laminate in the form of such a wound body or stack, and lamination of the laser dicing sheet and a release sheet. It is an object to provide a chip body manufacturing method for manufacturing a chip body by dividing a plate-like member into pieces using a laser dicing sheet-peeling sheet stack body (DR stack body), and the laser dicing sheet. To do.

  In order to achieve the above-mentioned object, the present inventors have studied that the substrate back surface of the laser dicing sheet provided in the DR laminate is composed of a plurality of parts, and one of the parts (this specification) In the document, a part of the surface is referred to as a “region”) as a first region suitable as a laser incident surface, and another one of the plurality of portions is a back surface of the release sheet (a DR laminate including itself as a component) It may be the back surface of the release sheet, or it may be the back surface of the release sheet of the DR laminate that is different from the DR laminate that constitutes the component itself). Thus, it was found that the above-mentioned DR laminated body supply failure is less likely to occur.

  The present invention completed on the basis of such knowledge is, firstly, a laser dicing sheet comprising a base material and an adhesive layer laminated on one surface of the base material, and the adhesive of the base material The back surface, which is the surface opposite to the side facing the agent layer, includes a first region having a surface roughness of less than 0.1 μm in arithmetic mean roughness Ra and a second region having a surface roughness of 0.3 μm or more. The first region includes a laser incident region to which a laser is irradiated during use, and the second region is provided on an outer peripheral side of the laser dicing sheet in a plan view than the laser incident region. A laser dicing sheet is provided (Invention 1).

  The first surface of the substrate of the laser dicing sheet is low in arithmetic average roughness and hardly deteriorates in scattering and phase uniformity when the laser is transmitted. A second region having low properties, and by disposing the second region on the outer peripheral side of the laser incident region, the laser dicing sheet is in a stage before peeling the laser dicing sheet from the DR laminate. The problem of peeling off from the release surface of the release sheet is less likely to occur.

  In the said invention (invention 1), it is preferable that the surface roughness of the said 2nd area | region is 0.5 micrometer or more by arithmetic mean roughness Ra (invention 2). With such surface roughness, the adhesion between the laser dicing sheet and the back surface of the release sheet can be more stably reduced.

  In the above inventions (Inventions 1 and 2), the second region is annular in a plan view, and the laser incident region is more than the inner periphery in the planar view of the second region. It is preferable to be located on the center side in the in-plane direction of the region (Invention 3). By arranging the second region on the back surface of the base material as described above, the problem that the laser dicing sheet peels off from the release surface of the release sheet is more stable when the DR laminate is fed out or turned over. It is difficult to occur.

  In the said invention (invention 1 to 3), it is preferable that the back surface of the said base material consists of said 1st area | region and said 2nd area | region (invention 4). When the back surface of the base material has such a configuration, the entire region other than the second region on the back surface of the base material can be used as the laser incident region, so that processing of the plate-like member (specifically, stealth dicing) Even if light such as laser is used for purposes other than the purpose (for example, alignment of plate-like members, alignment of ring frame), it is easy to secure a region where the light is incident. Become.

  In the above inventions (Inventions 1 to 4), the base material preferably has a Young's modulus at 23 ° C. of 30 MPa to 600 MPa (Invention 5). When the base material has such characteristics, the base material is easily stretched uniformly in the expanding process, and therefore, the base material is not easily broken during the expanding process or the base material and the ring frame are peeled off. . In particular, when the stealth dicing method is adopted, it is difficult to cause a problem that the plate-like member on the laser dicing sheet is not appropriately cleaved or the alignment direction of the chip body formed by cleaving the plate-like member is not uniform. .

  In the said invention (invention 1-5), it is preferable that the said 2nd area | region is formed when the roughening process was performed with respect to the back surface of the said base material (invention 6). When the second region is formed by such a method, the laser dicing sheet according to the above-described invention can be easily produced by preparing a base material whose entire back surface is the first region.

  In the above inventions (Inventions 1 to 6), the first region preferably has a linear transmittance of 80% or more at the wavelength of 1064 nm and a phase difference of 10 nm or less at the wavelength of 1064 nm (Invention 7). When the first region has superior characteristics, the laser dicing sheet according to the above invention can be suitably used as a dicing sheet for stealth dicing.

  In the present invention, secondly, the laser dicing sheet according to any of the above inventions (Inventions 1 to 7) and the laser dicing sheet were laminated so that the release surface faces the surface on the pressure-sensitive adhesive layer side of the laser dicing sheet. A release sheet is provided, and the release surface of the release sheet is provided with a laser dicing sheet-release sheet laminate having a region where the laser dicing sheet is not laminated (Invention 8).

  In such a laser dicing sheet-release sheet laminate, the above-mentioned DR laminate supply failure is unlikely to occur.

  3rdly, this invention peels the said peeling sheet from the laser dicing sheet-release sheet laminated body which concerns on the said invention (invention 8), exposes the surface at the side of the said adhesive layer of the said laser dicing sheet, A plate-like member is affixed to a region overlapping with the first region in a plan view on the surface of the exposed adhesive layer side of the laser dicing sheet, the first region is a laser incident surface, and the base material and The laser dicing sheet is applied to the plate member after passing through the pressure-sensitive adhesive layer and extended to the in-plane direction. Thus, a chip body manufacturing method is provided in which the plate-like member is singulated to obtain a chip body (Invention 9).

  According to such a manufacturing method, since the modified portion is appropriately formed inside the plate-like member by the laser beam that has passed through the laser dicing sheet and entered, the modified portion is expanded by the expanding process of extending the laser dicing sheet. It is more stable that the plate member is broken at the portion. Therefore, according to the manufacturing method of the present invention, the chip body can be manufactured with a high yield.

  The laser dicing sheet according to the present invention uses at least a part of the first region on the back surface of the base material as a laser incident region, so that the laser light irradiated to the laser dicing sheet during use is scattered by the base material or of the phase. Uniformity is unlikely to decrease, and an appropriate laser beam can be irradiated to the plate-like member. Moreover, according to the DR laminated body according to the present invention including such a laser dicing sheet, the DR laminated body before use is laminated (specifically, in the form of a winding body or a stack body) The surface in contact with the back surface of the release sheet of the DR laminate, that is, the back surface of the base material includes not only the first region but also the second region. It consists of a relatively rough surface. Further, the second region is usually provided on the outer peripheral side of the laser dicing sheet in a plan view than the laser incident region to which the laser is irradiated, which occupies most of the laser dicing sheet. For this reason, when it is going to peel off a certain DR laminated body from the peeling sheet arrange | positioned so that the peeling sheet back surface may contact | connect the base material back surface, the adhesiveness of the peeling surface of a peeling sheet and the surface of an adhesive layer In the plan view, peeling occurs at the interface having the lowest adhesion between the adhesiveness between the pressure-sensitive adhesive layer and the substrate, and the adhesion between the second region of the substrate back surface and the back surface of the release sheet. Adhesion between the second region composed of a rough surface provided at a position close to the outer periphery of the dicing sheet and the back surface of the release sheet is the lowest, and peeling at this interface is likely to occur. . Therefore, even if the DR laminated body according to the present invention is in the form of a wound body or a stacked body, the DR laminated body supply failure hardly occurs.

It is a schematic sectional drawing of the laser dicing sheet-release sheet laminated body (DR laminated body) which concerns on one Embodiment of this invention. It is a top view which shows notionally the base material back of the laser dicing sheet of the laser dicing sheet-release sheet layered product (DR layered product) concerning one embodiment of the present invention. The laser dicing sheet-release sheet laminate (DR laminate) according to an embodiment of the present invention is in the form of a wound body, and a perspective view conceptually showing a state in which the DR laminate is drawn out from the wound body. FIG. A laser dicing sheet-peeling sheet laminate (DR laminate) is drawn out from a wound body according to an embodiment of the present invention, and one of the laser dicing sheets attached to a long release sheet is taken out. It is a fragmentary sectional view which shows the state just before conceptually. It is sectional drawing which shows notionally the state in which the laser dicing sheet-release sheet laminated body (DR laminated body) which concerns on one Embodiment of this invention has comprised the form of the stack body. It is sectional drawing which shows notionally the state by which the plate-shaped member and the ring frame were affixed on the adhesive layer of the laser dicing sheet which concerns on this embodiment.

  Hereinafter, embodiments of the present invention will be described.

1. Laser dicing sheet-release sheet laminate As shown in FIG. 1, a laser dicing sheet-release sheet laminate (DR laminate) 100 according to an embodiment of the present invention includes one of a substrate 1 and a substrate 1. The laser dicing sheet 10 provided with the pressure-sensitive adhesive layer 3 laminated on the surface and the release sheet 11 are provided. The release sheet 11 faces the surface on the pressure-sensitive adhesive layer 3 side of the laser dicing sheet 10 so that the release surface faces the surface. Are stacked.

(1) Base material 1
The base material 1 included in the laser dicing sheet 10 according to the present embodiment has a function of appropriately transmitting laser light (hereinafter also referred to as “laser transmission function”) and a function of reducing adhesion to the back surface of the release sheet. (Hereinafter also referred to as “adhesion reduction function”).

  As shown in FIG. 2, the base material 1 according to the present embodiment has the above two functions, so that the base material back surface 1 </ b> A (which faces the pressure-sensitive adhesive layer 3 in the base material 1) composed of a single layered body. The first region 1a and the second region 1b are provided on the surface opposite to the side, that is, the substrate-side surface as a laser dicing sheet.

i) 1st area | region In this specification, the "1st area | region" 1a means the part whose surface roughness in base material back surface 1A is less than 0.1 micrometer in arithmetic mean roughness Ra. Here, the arithmetic average roughness Ra is a characteristic based on JIS B0601: 2001, measured by a contact-type surface roughness meter, and the same applies hereinafter. The first region 1a includes a laser incident region 1c where a laser is incident upon use. In FIG. 2, the entire surface of the first region 1a is a laser incident region 1c. As described above, since the first region 1a is a smooth surface having a low arithmetic average roughness Ra, the laser incident on the laser incident region 1c set in the plane of the first region 1a is reflected or scattered. The possibility of doing so has been reduced. As the arithmetic average roughness Ra decreases, the laser transmittance increases. Therefore, the arithmetic average roughness Ra in the first region 1a is preferably as small as possible, and the lower limit thereof is not particularly limited. This arithmetic average roughness Ra usually has a lower limit of about 0.01 μm due to the manufacturing restrictions of the members constituting the substrate 1. The arithmetic mean roughness Ra of the first region 1a can be adjusted by a known method. For example, when manufacturing the film which gives the base material 1 by extrusion molding, it can carry out by transferring the surface shape of a cooling roll. Moreover, in manufacture of the film which gives the 1st sheet | seat 1 in case the 1st sheet | seat 1 is a stretched film, it can carry out by changing the quantity and size of the filler added to the material of a film. Moreover, when casting a liquid substance and making it harden | cure, it can carry out by adjusting the roughness of the process film used for casting.

ii) Second Region In the present specification, the “second region” 1b refers to a portion where the surface roughness of the substrate back surface 1A is 0.3 μm or more in terms of arithmetic average roughness Ra. The second region 1b is provided on the outer peripheral side of the laser dicing sheet 1 in plan view (the direction of the line of sight is parallel to the normal of the main surface) than the laser incident region 1c. As an example of such an arrangement relationship, FIG. 2 shows an outer peripheral side of a laser incident region 1c having a circular shape in plan view (in FIG. 2, the first region 1a and the laser incident region 1c coincide). A base material back surface 1A is shown in which a second region 1b having an annular shape in a plan view is arranged (in a direction away from the center of the laser incident region 1c in the in-plane direction of the base material back surface 1A). Here, in the substrate back surface 1A shown in FIG. 2, the outer peripheral end of the laser incident region 1c (that is, the first region 1a) and the inner peripheral end of the second region 1b are continuous. Note that the concept of the term “annular” includes not only a complete annular shape in a plan view as shown in FIG. 2 but also a partial discontinuity (for example, a C shape) or a large number of regions. The case where the whole is circular (for example, a radial ring shape) is also included.

  Hereinafter, as a specific example, the case where the second region 1b is completely annular in a plan view as shown in FIG. 2 and the entire inner periphery thereof is the first region 1a is defined by the second region 1b. The resulting adhesion reducing function of the substrate 1 will be described. Further, as shown in FIG. 3, the DR laminate 100 is formed by laminating a plurality of laser dicing sheets 10 side by side in a direction parallel to the longitudinal direction of the sheet 11 on the release surface of the long release sheet 11. A specific example is a case where the long body is formed in the form of a long body, which is wound in the long direction around the core C and stored in the form of a winding body 100A.

  FIG. 4 conceptually shows a state immediately before the DR laminate 100 is unwound from the winding body 100A and one of the laser dicing sheets 10 attached to the long release sheet 11 is made peelable. It is a fragmentary sectional view shown. Note that the wound body 100A shown in FIG. 4 has a DR laminate 100 in the form of a long body, and laser dicing is performed on the side closer to the rotation center of the winding core C of the wound body 100A (inner circumferential side). Winding is performed such that the sheet 10 is disposed and the release sheet 11 is disposed on the side (outer peripheral side) that is distal to the rotation center of the core C of the winding body 100A.

  In the DR laminated body 100 according to the present embodiment, when the DR laminated body 100 is fed from the winding body 100A, the pressure-sensitive adhesive layer 3 is formed on the outermost release sheet 11a and the release surface of the outermost release sheet 11a. Laser dicing sheet 10 to which the side surface is affixed, and outermost release sheet 11a disposed so that the surface opposite to the release surface (release sheet back surface) is in contact with the substrate back surface 1A of laser dicing sheet 10 In the stacked body composed of the release sheet 11b on the inner circumferential side, the separation occurs at the interface between the laser dicing sheet 10 and the release sheet 11b, and the laser dicing sheet 10 can be appropriately peeled off. Can do.

  In the laser dicing sheet 10 according to the present embodiment, as described above, the back surface 1A of the substrate has the second region 1b composed of a relatively rough surface (arithmetic average roughness Ra of 0.3 μm or more) in plan view. Since the first region 1a consisting of a relatively smooth surface (arithmetic surface height Ra is less than 0.1 μm) is disposed on the inner peripheral side thereof, the substrate back surface 1A and the release sheet When peeling with 11b is performed, the peeling is always performed from the interface between the second region 1b having a relatively rough surface and the back surface of the release sheet 11b, and the first region 1a having a relatively smooth surface. And the back surface of the release sheet 11b do not become the starting point of release.

  On the other hand, for example, when the substrate back surface 1A is composed of only the relatively smooth first region 1a, the adhesiveness between the smooth first region 1a and the back surface of the release sheet 11b is the pressure-sensitive adhesive layer 3. It peels at the interface between the pressure-sensitive adhesive layer 3 and the release surface of the release sheet 11 and is peeled off at the interface between the base material back surface 1A and the back surface of the release sheet 11b. Will remain in close contact with each other, leading to poor supply of the DR laminate. When this DR laminate supply failure occurs, the long DR laminate 100 is present in a state where the laser dicing sheet 10 exposes the pressure-sensitive adhesive layer 3 on the surface on the release sheet 11 side, There is an increased risk of serious problems such as adhesion of the pressure-sensitive adhesive layer 3 to parts in equipment for feeding such as a roller (for example, a pinch roller) that passes when the release sheet 11 is wound.

  From the viewpoint of more stably suppressing the occurrence of such DR laminate supply failure, the surface roughness of the second region is preferably 0.5 μm or more in terms of arithmetic average roughness Ra, and is 0.7 μm or more. More preferably. The upper limit of the arithmetic average roughness Ra of the second region is about 3 μm.

iii) Material, physical properties, etc. of base material The base material 1 according to this specific example has a function of transmitting laser light in the laser incident region 1c in the dicing process, and does not break in the expanding process performed after the dicing process. The constituent material is not particularly limited. Usually, it is composed of a film mainly composed of a resin-based material. Specific examples of the film include: a polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene film such as a high density polyethylene (HDPE) film, a stretched or unstretched polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, A polyurethane film, an ethylene vinyl acetate copolymer film, and a film made of a water additive or a modified product thereof are used. In addition, these crosslinked films and copolymer films are also used, and among them, a polyvinyl chloride film is preferable in consideration of expandability. Said base material may comprise the layered body individually by 1 type, and also may comprise the layered body as a laminated film which combined 2 or more types of these.

  Various additives such as pigments, flame retardants, plasticizers, antistatic agents, lubricants, fillers and the like may be contained in the film mainly composed of the above resin-based material. The content of such additives is not particularly limited, but should be limited to a range in which the substrate 1 exhibits a desired function and does not lose smoothness and flexibility. As described above, one surface of the base material 1 contains a material (pigment, filler, etc.) that reduces the linear transmittance of the incident laser light because a part of the surface becomes a laser incident surface when in use. Preferably not.

  The constituent material of the base material 1 according to this specific example is made of a material capable of setting the linear transmittance at a wavelength of 1064 nm of a light source used for stealth dicing to 80% or more. And it is preferable from a viewpoint of improving processing accuracy.

  In the case where the pressure-sensitive adhesive layer 3 includes a material that is polymerized by irradiation with energy rays and ultraviolet rays are used as the energy rays to be polymerized, the constituent material of the substrate 1 is permeable to ultraviolet rays. It is preferable to have. In addition, when using an electron beam as said energy beam, it is preferable that the constituent material of the base material 1 has the transparency with respect to an electron beam.

  Moreover, in order to improve adhesiveness with the adhesive which comprises the adhesive layer 3, in the surface by which the adhesive layer 3 in the base material 1 is laminated | stacked, a corona treatment is performed or a primer layer is provided. May be.

  The Young's modulus at 23 ° C. of the substrate 1 is 30 MPa or more and 600 MPa or less, preferably 50 MPa or more and 500 MPa or less, and more preferably 100 MPa or more and 400 MPa or less. Since the base material 1 having a Young's modulus at 23 ° C. of 30 MPa or more and 600 MPa or less is easily stretched uniformly during the expanding process, it is excellent in suitability of the process, and particularly when the stealth dicing method is employed. The problem that the plate-like member on the sheet 10 is not appropriately cleaved or the alignment direction of the chip bodies formed by cleaving the plate-like member is less likely to occur. When the Young's modulus of the substrate 1 is in the above range, the substrate back surface of the DR laminate is in contact with the back surface when a rough region is not provided on the substrate back surface 1A of the substrate 1. There exists a tendency for adhesiveness with the peeling sheet back surface of another DR laminated body to improve. This is considered to be because it becomes easy to follow the unevenness on the surface of another material with which the substrate 1 is in contact. However, even if the base material 1 has such a Young's modulus, in the laser dicing sheet 10 according to the present embodiment, the second back surface 1A of the base material is a relatively rough surface as described above. Since the region 1b is provided, it is possible to prevent the supply failure of the DR laminate.

  The elongation at break of the substrate 1 is preferably 50% or more, more preferably 70% or more as a value measured by stretching at 200 mm / min at 23 ° C. and a relative humidity of 50%. It is preferably 100% or more. Here, the breaking elongation is an elongation ratio of the length of the test piece at the time of breaking the test piece to the original length in a tensile test based on JIS K7161: 1994 (ISO 527-1: 1993). Since the base material 1 having a breaking elongation of 50% or more is not easily broken during the expanding process, the plate-like member on the laser dicing sheet 10 is not appropriately cut or the plate-like member is divided. It is difficult for the chip body to drop off.

  The thickness of the base material 1 is not limited as long as the laser dicing sheet 10 can function appropriately in the dicing process and the expanding process described above. If it is excessively thin, there is a concern that it may be easily broken during the manufacturing process or use. On the other hand, it is preferable that the base material 1 has a phase difference at a wavelength of 1064 nm of a light source used for stealth dicing of 100 nm or less from the viewpoint of improving processing quality and processing accuracy of the dicing process. However, even if the material of the base material 1 is adjusted, there is a concern that it is difficult to set the above phase difference to 100 nm or less. Therefore, the thickness of the substrate 1 is preferably 20 μm or more and 150 μm or less, more preferably 40 μm or more and 100 μm or less, and particularly preferably 50 μm or more and 90 μm or less.

  In the configuration shown in FIG. 2, the substrate back surface 1 </ b> A of the substrate 1 is normally aligned with the first region 1 a and the laser irradiation region 1 c in a plan view as described above. In order to irradiate the laser until reaching the end of the plate-like member, the area of the pressure-sensitive adhesive layer 3 to which the plate-like member to be diced is stuck (also referred to as “member sticking area” in this specification) is a flat surface. It is included in the laser irradiation region 1c, that is, the first region 1a when viewed.

iv) Manufacturing method of the base material 1 As described above, when the material of the base material 1 is set in consideration of the laser transmission function, first, the first region on the back surface 1A of the base material 1 is as described above. A constituent material of the base material 1 that satisfies the condition, that is, a constituent material of the base material 1 having a surface with a surface roughness such that the arithmetic average roughness Ra of at least one surface is less than 0.1 μm is prepared. . Then, what is necessary is just to form the part which should become the 2nd area | region which bears an adhesiveness reduction function by giving arbitrary roughening processes to the predetermined place of said one surface of the base material 1's. The details of the roughening treatment are not limited, and any known means such as sandblasting, plasma ashing, etching (wet / dry), or rolling may be used. In consideration of production cost, trade-off with other manufacturing processes, design freedom, etc., sandblasting is preferable.

  The planar view shape of the base material 1 (the shape seen from the direction parallel to the normal to the main surface) is a plate-like member such as a semiconductor wafer that is a workpiece, on the surface of the laser dicing sheet 10 on the pressure-sensitive adhesive layer 3 side. When affixed to the area including the center, the area to be affixed to the ring frame used for transportation, etc. is sufficiently secured around it, and the affixed to these semiconductor wafers and the ring frame A plurality of chip bodies obtained by separating the jig and the semiconductor wafer into individual pieces, and securing a suitable area between them and attaching a jig as a fulcrum when the ring frame is pulled down in the expanding process. There is no particular limitation as long as the gap is set to some extent (several millimeters to several centimeters) in plan view even after stretching. Usually, the planar view shape of the base material 1 is a shape close to a circle corresponding to the shape formed by the inner periphery of the ring frame.

v) Modifications etc. As described above, the back surface 1A of the substrate 1 only needs to include the first region 1a including the laser incident region 1c and the second region 1b, and includes regions other than these regions. It may or may not be included. That is, the substrate back surface 1A may be configured by the first region a and the second region 1b, and still another region (generically referred to as “third region” in this specification). You may have. The feature of the third region derived from the feature of the first region 1a and the feature of the second region 1b is that the surface roughness is not less than 0.1 μm and less than 0.3 μm in arithmetic mean roughness Ra. Become. As described above, when the second region is formed by the sandblasting process, even if a technique such as masking is used, the result corresponds to the third region between the first region and the second region. A region having a surface roughness may be formed.

  As described above, the arrangement relationship between the first region and the second region on the back surface 1A of the substrate is the outer periphery of the laser dicing sheet 1 in a plan view than the laser incident region 1c set in the first region 1a. There is no particular limitation except that the second region 1b is provided on the side. As shown in FIG. 2, the second region may be completely annular in plan view, and the first region may be arranged on the inner peripheral side in plan view. Good. For example, in the case where the DR laminate 100 is stored in the form of a wound body 100A, only the position corresponding to the end of the laser dicing sheet 10 on the back side of the long-side feed in the substrate rear surface 1A of the laser dicing sheet 10 is drawn out. A second region may be formed. In the case of the winding body 100A, whether or not the laser dicing sheet 10 is appropriately peeled during feeding is determined by the surface on the pressure-sensitive adhesive layer 3 side at the end in the longitudinal direction of the laser dicing sheet 10. And the peelability of the outermost release sheet 11a (hereinafter referred to as “outer adhesion”) and the adhesion between the back surface 1A of the substrate and the back surface of the release sheet 11b on the inner circumference side (hereinafter “ It is highly dependent on the magnitude relationship with the “inner adhesion”), so that the outer adhesion is relatively lowered only by roughening the end in the longitudinal direction of the substrate back surface 1A. can do.

  When the direction at which the release sheet 11 is pulled out in order to take out the laser dicing sheet 10 from the DR laminate is not necessarily constant, the entire back surface 1A is a smooth surface (that is, the surface corresponding to the first region 1a). On the other hand, forming a plurality of small circular second regions 1b so that a line connecting their centers draws a circle is mentioned as an example. When the second region 1b is formed by the sand blasting process, the nozzle is arranged at a predetermined distance from the back surface A of the base material 1, and the sand blasting process is performed for a predetermined time, so that the nozzle position is set on the back surface A. The substrate back surface 1A having the above-described configuration can be configured by an operation of moving in the in-plane direction and performing sandblasting for a predetermined time.

(2) Pressure-sensitive adhesive layer The pressure-sensitive adhesive layer 3 is laminated on the surface opposite to the substrate back surface 1A, 2A for the base materials 1 and 2 according to any of the above specific examples. It can be formed by various known adhesives. Such an adhesive is not limited at all, but, for example, an adhesive such as rubber-based, acrylic-based, silicone-based, or polyvinyl ether is used. Moreover, an energy ray polymerization type, a heat foaming type, or a water swelling type pressure sensitive adhesive can also be used. As the energy ray (ultraviolet ray, electron beam, etc.) polymerizable adhesive, it is particularly preferable to use an ultraviolet polymerizable adhesive.

Hereinafter, the energy ray polymerization type pressure-sensitive adhesive will be specifically described with an acrylic pressure-sensitive adhesive as an example.
The acrylic pressure-sensitive adhesive contains an acrylic polymer (A) in order to give sufficient pressure-sensitive adhesiveness and cohesiveness to the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition, and the energy ray polymerizable compound (B). Containing. The energy ray polymerizable compound (B) also contains an energy ray polymerizable group and polymerizes when irradiated with energy rays such as ultraviolet rays and electron beams, and has a function of reducing the adhesive strength of the pressure sensitive adhesive composition. Moreover, as what combines the property of said component (A) and (B), it replaces with these, and energy-beam polymerization type polymer (henceforth, component (A AB) may be used. Such an energy beam polymerization type pressure-sensitive adhesive polymer (AB) has a property that has both the function of imparting adhesiveness and film-forming property and energy beam polymerizability.

  A conventionally well-known acrylic polymer can be used as an acrylic polymer (A). The weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 100,000 to 2,000,000, and more preferably 300,000 to 1,500,000. Moreover, it is preferable that molecular weight distribution (Mw / Mn, Mn is a number average molecular weight) is 1.0-10, and it is more preferable that it is 1.0-3.0. The glass transition temperature (Tg) of the acrylic polymer (A) is preferably in the range of −70 to 30 ° C., more preferably in the range of −60 to 20 ° C.

  Specific examples of the (meth) acrylic acid ester serving as a monomer for forming the acrylic polymer (A) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and butyl (meth) acrylate. Alkyl (meth) acrylates having an alkyl group of 1 to 18 carbon atoms such as 2-ethylhexyl (meth) acrylate; cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl acrylate, dicyclopentanyl acrylate (Meth) acrylates having a cyclic skeleton such as dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, etc. (Meth) acrylate having an acid group; glycidyl methacrylate, (meth) acrylate having an epoxy group such as glycidyl acrylate. In addition, examples of the monomer for forming the acrylic polymer (A) include acrylic acid, methacrylic acid, itaconic acid, and acrylonitrile. The acrylic polymer (A) may be copolymerized with vinyl acetate, styrene, vinyl acetate or the like.

  The energy beam polymerizable compound (B) is a compound that polymerizes when irradiated with energy rays such as ultraviolet rays and electron beams. Examples of the energy beam polymerizable compound include low molecular weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy beam polymerizable group, and specifically include trimethylolpropane triacrylate and tetramethylolmethane. Tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dicyclopentadiene dimethoxydiacrylate, isobornyl Cyclic aliphatic skeleton-containing acrylate such as acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, Carboxy-modified acrylates, polyether acrylates, acrylate compounds such as itaconic acid oligomer is used. Such a compound has at least one polymerizable double bond in the molecule, and usually has a molecular weight of about 100 to 30,000, preferably about 300 to 10,000.

  Generally, the component (B) is used in a proportion of 10 to 400 parts by weight, preferably about 30 to 350 parts by weight, relative to 100 parts by weight of the component (A).

  The energy beam polymerization type pressure-sensitive adhesive polymer (AB) having the properties of the components (A) and (B) is formed by bonding an energy beam polymerizable group to a main chain or a side chain.

  The main skeleton of the energy beam polymerization type polymer (AB) is not particularly limited, and can be the same as the above-mentioned acrylic polymer (A).

  The energy beam polymerizable group bonded to the main chain or side chain of the energy beam polymerization type polymer (AB) is, for example, a group containing an energy beam polymerizable carbon-carbon double bond, specifically, (meth). An acryloyl group etc. can be illustrated. The energy beam polymerizable group may be bonded to the energy beam polymerization type pressure-sensitive adhesive polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.

  The weight average molecular weight (Mw) of the energy beam polymerization type polymer (AB) is preferably 100,000 to 2,000,000, and more preferably 300,000 to 1,500,000. Moreover, it is preferable that molecular weight distribution (Mw / Mn, Mn is a number average molecular weight) is 1.0-10, and it is more preferable that it is 1.0-3.0. The glass transition temperature (Tg) of the energy beam polymerization type polymer (AB) is preferably in the range of −70 to 30 ° C., more preferably in the range of −60 to 20 ° C.

  The energy ray polymerization type polymer (AB) includes, for example, an acrylic polymer containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group, a substituent that reacts with the functional group, and It is obtained by reacting a polymerizable group-containing compound having 1 to 5 energy beam polymerizable carbon-carbon double bonds per molecule. Such an acrylic polymer includes a (meth) acrylic acid ester monomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof, and a monomer constituting the component (A) described above. And obtained by copolymerization. The polymerizable group-containing compound includes (meth) acryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate; Acrylic acid etc. are mentioned. In the energy ray polymerization type polymer (AB) obtained by such a production method, the weight average molecular weight (Mw), molecular weight distribution (Mw / Mn, glass transition temperature (Tg)) of the above-mentioned energy ray polymerization type polymer (AB). Denotes an acrylic polymer before being reacted with the polymerizable group-containing compound.

  It is preferable to use a photopolymerization initiator in combination with the energy beam polymerizable compound (B) or the energy beam polymerization type polymer (AB). Examples of photopolymerization initiators include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones. 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone Examples include 2,4,6-trimethylbenzoyldiphenylphosphine oxide. By using the photopolymerization initiator in combination, when ultraviolet rays are used as energy rays, the irradiation time and the irradiation amount can be reduced by blending the photopolymerization initiator. Although the compounding quantity of this photoinitiator is not specifically limited, With respect to a total of 100 parts by mass (solid content, the same shall apply hereinafter) of the energy beam polymerizable compound (B) and the energy beam polymerizable adhesive polymer (AB), It is preferable to set it as 0.5 to 10 mass parts.

  Furthermore, in order to improve various physical properties, the pressure-sensitive adhesive composition may contain other components (such as a crosslinking agent) as necessary. Examples of the crosslinking agent include organic polyvalent isocyanate compounds, organic polyvalent epoxy compounds, and organic polyvalent imine compounds. Although the compounding quantity of this crosslinking agent is not specifically limited, It shall be 0.2 mass part or more and 10 mass parts or less with respect to a total of 100 mass parts of an acryl-type polymer (A) and an energy beam polymerization type polymer (AB). It is preferable.

  The acrylic pressure-sensitive adhesive containing the acrylic polymer (A) and the energy beam polymerizable compound (B) as described above or the acrylic pressure-sensitive adhesive containing the energy beam polymerization-type pressure-sensitive polymer (AB) is irradiated with energy rays. To polymerize. Examples of energy rays include ionizing radiation, that is, X-rays, ultraviolet rays, electron beams, and the like. Among these, ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.

When ultraviolet rays are used as the ionizing radiation, near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling. What is necessary is just to select suitably according to the kind of energy-beam polymeric compound (B) and the thickness of the adhesive layer 3, and it is about 50-500 mJ / cm < ² > normally, and the amount of ultraviolet rays is 100-450 mJ / cm < ² >. 200 to 400 mJ / cm ² is more preferable. Moreover, ultraviolet illuminance is about 50-500 mW / cm < ² > normally, 100-450 mW / cm < ² > is preferable and 200-400 mW / cm < ² > is more preferable. There is no restriction | limiting in particular as an ultraviolet-ray source, For example, a high pressure mercury lamp, a metal halide lamp, UV-LED etc. are used.

  When an electron beam is used as the ionizing radiation, the acceleration voltage may be appropriately selected according to the type of the energy beam polymerizable compound (B) and the thickness of the pressure-sensitive adhesive layer 3, and usually an acceleration voltage of 10 to 1000 kV. It is preferable that it is a grade. Moreover, what is necessary is just to set an irradiation dose to the range which an energy-beam polymeric compound (B) superposes | polymerizes appropriately, and is normally selected in the range of 10-1000 krad. The electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.

  The thickness of the pressure-sensitive adhesive layer 3 is preferably in the range of 1 μm to 15 μm, more preferably 2 μm to 10 μm, and particularly preferably 3 μm to 8 μm. When the pressure-sensitive adhesive layer 3 is excessively thick, even if the material and thickness of the base material 1 are controlled, the laminate of the base material 1 and the pressure-sensitive adhesive layer 3 is transmitted during use and reaches the plate-like member. It may be difficult to set the laser light intensity and phase uniformity within a desired range. In addition, when the laser dicing sheet-release sheet laminate according to the present invention is used for the stealth dicing method, if the pressure-sensitive adhesive layer 3 is thick, the deformation of the base material at the time of expansion does not easily propagate to the semiconductor wafer. There is a concern that this may cause a problem in the division. If the pressure-sensitive adhesive layer 3 is excessively thin, the pressure-sensitive adhesive layer 3 may not be able to properly fix the plate-like member during use.

(3) Release Sheet The DR laminate 100 according to the present embodiment is a surface opposite to the side facing the base material 1 of the pressure-sensitive adhesive layer 3 of the laser dicing sheet 10 (surface on which a plate-like member is pasted during use). In addition, a release sheet 11 is laminated to protect the pressure-sensitive adhesive layer until the time of use.

  As long as the above object can be achieved, the material constituting the release sheet 11 is arbitrary, and examples include a support film made of a plastic film and a release agent applied thereto. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene. Among these, a polyester film having low stretchability and excellent dimensional stability and smoothness is preferable. As the release agent, silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable. The plastic film that forms the support film for the release sheet 11 may function alone as a release sheet. When the support film is a polyester film, it usually does not have releasability with respect to the pressure-sensitive adhesive as it is, so that it is preferable to apply a release agent to form a release surface. That is, the peeling surface may be comprised from the surface of this support film. Alternatively, instead of the support film made of the plastic film of the release sheet 11 described above, a paper base such as glassine paper, coated paper, or high-quality paper or a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper base is used. Also good. Although there is no restriction | limiting in particular about the thickness of the peeling sheet 11, Usually, it is about 20 micrometers or more and 250 micrometers or less.

  The shape of the release sheet 11 is not particularly limited, but the pressure-sensitive adhesive layer 3 of the laser dicing sheet 10 is usually provided on the release surface of the release sheet 11 so that the laser dicing sheet 10 can be easily peeled from the release sheet 11. An area where the side surface is not attached is provided.

  An example of a specific shape of the release sheet 11 is a long shape. A specific example of the form of the DR laminate 100 in this case is a form in which a plurality of laser dicing sheets 10 are attached to the release surface of the release sheet 11 while being separated from each other in the longitudinal direction of the release sheet 11. At this time, the DR laminate 100 may be stored as a long body. However, as shown in FIG. 3, one end of the DR laminate 100 in the longitudinal direction is fixed to the core material C and wound. And may be stored in the form of a wound body 100A. FIG. 3 is a perspective view conceptually showing a state in which the DR laminated body 100 in the form of such a wound body 100A is drawn out.

  Another example of the specific shape of the release sheet 11 is a non-long shape. A specific example of the form of the DR laminate 100 in this case is a form in which one laser dicing sheet 10 is attached to the release sheet 11. At this time, the DR laminate 100 may be stored in the form of a stack 100B in which a plurality of DR laminates 100 are laminated in the thickness direction of the DR laminate 100. FIG. 5 is a cross-sectional view conceptually showing the DR laminate 100 in the form of such a stack 100B.

2. Laser Dicing Sheet A laser dicing sheet 10 according to an embodiment of the present invention is obtained by peeling the release sheet 11 from the DR laminate 100 according to the present embodiment.
The substrate 1 of the laser dicing sheet 10 according to the present embodiment includes a first region 1a including the laser irradiation region 1c on the substrate back surface 1A, and a first region 1a on the outer peripheral side of the laser dicing sheet 10 in plan view of the laser irradiation region 1c. 2 region 1b. The first region 1a serves a laser transmission function, and the second region 1b serves a function of reducing adhesion. Therefore, the laser dicing sheet 10 according to the present embodiment can be suitably used as a dicing sheet in a dicing process using laser light, and in the DR laminated body 100 including the laser dicing sheet 10 and the release sheet 11, DR. Laminate supply failure is unlikely to occur.

3. Manufacturing method of DR laminated body The manufacturing method of DR laminated body 100 which concerns on this embodiment is not specifically limited. What is necessary is just to manufacture combining a well-known coating method, the sticking method, the cutting method (a half cut is included), the peeling method, a roughening process, etc. suitably. Below, an example of the manufacturing method of DR laminated body which has a structure as shown in FIG. 1 is shown.

  The pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 is applied on the release surface of the release sheet 11, and the obtained coating film is dried to obtain the pressure-sensitive adhesive layer 3. The coating method is arbitrary, and examples include a die coater, a curtain coater, a spray coater, a slit coater, and a knife coater. The drying method is also arbitrary. For example, it may be performed by heating at about 80 to 120 ° C. for several minutes, or may be air drying that is left in the atmosphere. On the other hand, for at least one surface, a resin-based film is prepared which gives a base material 1 having a surface roughness with an arithmetic average roughness Ra of less than 0.1 μm. The surface on the opposite side to the surface in which the surface roughness of the resin film is adjusted as described above is opposite to the side facing the release sheet 11 of the pressure-sensitive adhesive layer 3 obtained using the pressure-sensitive adhesive composition. It sticks on the surface of the side, and obtains the original fabric of DR laminated body 100 by which the release film 11, the adhesive layer 3, and the resin film which gives the base material 1 were laminated | stacked in this order.

  Sand blasting is performed on the area corresponding to the shape of the second area 1b on the surface of the DR laminate 100 on the base material 1 side, that is, the surface whose surface roughness is adjusted, using a sand blasting device. . As shown in FIG. 2, when the shape of the second region 1b is an annular shape, the sandblasting process may be performed on the annular region correspondingly (as described later, the annular region). Since the unnecessary part located outside is removed, sandblasting may be performed at the same time.) Further, in order to prevent the inner portion of the annular region from being sandblasted, masking may be performed by attaching an adhesive film to the portion in a detachable manner. Then, the half cut which cut | disconnects the base material 1 and the adhesive layer 3 from the base material 1 side with respect to the 1st laminated body after a blast process so that the external shape of the base material 1 may be formed with a cutting line. Process. Finally, by removing unnecessary portions located outside the cutting line, the laser dicing sheet 10 composed of the base material 1 and the pressure-sensitive adhesive layer 3 having the same outer diameter is laminated on the release surface of the release sheet 11. A DR laminate 100 is obtained. In addition, since it is preferable that the 2nd area | region 1b is located in the outer peripheral side edge part vicinity of the back surface 1A of the base material 1, the outer diameter of the roughened area | region formed by sandblasting is 2nd of annular | circular shaped. The outer peripheral side end of the back surface 1A of the substrate 1 formed by performing a half-cut process that is performed subsequent to the sandblasting process is made slightly larger than the outer diameter of the region 1b to ensure a rough surface. It is preferable to do.

4). Hereinafter, an example of a method for manufacturing a chip body using the laser dicing sheet 10 obtained by peeling the release sheet 11 from the DR laminate 100 according to the present embodiment will be described.

  First, a plate-like member is affixed to a predetermined region on the surface opposite to the side facing the first sheet 1 in the pressure-sensitive adhesive layer 3 of the laser dicing sheet 10. As described above, this predetermined region is a portion overlapping the laser irradiation region 1c in plan view. Examples of the plate-like member include a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, and a member made of a metal material such as a precision component. Further, when the plate-shaped member is a semiconductor wafer or the like and the circuit is already formed, the surface on which the circuit is formed may be attached so as to face the adhesive layer 3, or the circuit is formed. It may be affixed so that the back surface which is not facing the adhesive layer 3. In addition, what is necessary is just to stick a ring frame to the adhesive layer 3 of the laser dicing sheet 10 according to sticking of this plate-shaped member, when using a ring frame. FIG. 6 is a cross-sectional view conceptually showing the state in which the plate-like member 71 and the ring frame 72 are attached to the pressure-sensitive adhesive layer 3 of the laser dicing sheet 10 in this way.

  Next, laser light is irradiated so that the laser beam dicing sheet 10 passes through the base material 1 and the pressure-sensitive adhesive layer 3 from the laser irradiation region 1 c on the back surface 1 </ b> A of the laser dicing sheet 10 and reaches the plate-like member 71. At this time, it is preferable to irradiate the laser beam so as to be condensed inside the plate-like member 71 because the damage to the base material 1 and the pressure-sensitive adhesive layer 3 is small. The laser light source is a device that generates light having a uniform wavelength and phase, and the types of laser light include Nd-YAG laser, Nd-YVO laser, Nd-YLF laser, and titanium sapphire laser that generate pulsed laser light. The thing which causes multiphoton absorption can be mentioned. The wavelength of the laser light is preferably 800 to 1100 nm, and more preferably 1064 nm.

  Due to the laser light applied to the inside of the plate-like member 61, a modified portion is formed inside the plate-like member 71 along the planned cutting line to form a dicing line. The number of times the laser beam scans one scheduled cutting line may be one time or multiple times. Preferably, the irradiation position of the laser beam and the position of the planned cutting line between the circuits are monitored, and the laser beam is irradiated while aligning the laser beam. You may irradiate a laser beam separately for the alignment at this time.

  When the laser irradiation is thus completed, the laser dicing sheet 10 to which the plate member after laser irradiation is attached is extended outward in the main surface direction of the sheet using an expanding device or the like. A tensile force is applied to the plate member in accordance with the extension of the laser dicing sheet 10, and the modified portion in the plate member is brittlely broken by this tensile force. As a result, the plate-like member 71 is cut along the dicing line into individual pieces, and a chip body is obtained as each of the divided pieces.

  The method for extending the laser dicing sheet 10 may be appropriately set according to the type of the plate-like member 61 to be singulated, the structure / composition of the modified portion formed in the plate-like member 61, etc. In many cases, the film is stretched by about 5 to 50 mm at a speed of 5 to 600 mm / min. The chip body on the obtained laser dicing sheet 10 may be individually taken out by performing a pickup process, or a cleaning process for removing crushed powder or the like may be performed before that.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

[Example 1]
(1) Preparation of coating composition for forming pressure-sensitive adhesive layer Acrylic copolymer (2-ethylhexyl acrylate / vinyl acetate / acrylic acid / methyl methacrylate / 2-hydroxyethyl methacrylate = 23.5 / 70 / Polypropylene glycol (Mw = 700) as an energy ray polymerizable compound with respect to 100 parts by weight of 1/5 / 0.5 (mass ratio), Mw = 600,000, Mw / Mn = 6.0, Tg = 3 ° C. , 80 parts by weight of a bifunctional urethane acrylate oligomer (Mw = 4000) composed of a copolymer of isophorone diisocyanate and 2-hydroxypropyl acrylate, 3 parts by weight of a photopolymerization initiator (“Irgacure 184” manufactured by BASF) and an isocyanate-based crosslinking agent (Nippon Polyurethane “Coronate L”) 2 parts by weight (all solid And a coating composition for forming an adhesive layer.

(2) Preparation of Resin Film for Giving Substrate A long polyvinyl chloride film having a thickness of 80 μm having the following characteristics was prepared as a resin film for giving a base material.
Arithmetic average roughness Ra of surface: 0.03 μm
Linear transmittance at a wavelength of 1064 nm: 92%
Phase difference at a wavelength of 1064 nm: 32 nm
Young's modulus: 280 MPa

(3) Preparation of the raw material of the DR laminate The polyethylene terephthalate film was used as a support film, and the above-mentioned preparation was performed on the release surface of a long release sheet ("SP-PET3811" manufactured by Lintec Corporation) having a thickness of 38 µm. The coating composition for forming the pressure-sensitive adhesive layer was applied so that the thickness after drying was 5 μm. The obtained coating film was dried at 100 ° C. for 1 minute to obtain a laminate of a release sheet and an adhesive layer. One side of the resin-based film that gives the base material (the side opposite to the side having the arithmetic average roughness Ra described above) is pasted to the surface on the pressure-sensitive adhesive layer side of this laminate, and the DR laminate Got the original fabric.

(4) Production of second region A releasable adhesive film is applied to a circular region having a diameter of 210 mm on the surface of the resin film side that gives the base material in the raw material of the DR laminate. Then, after performing masking, sandblasting was performed using a sandblasting apparatus (PNEUMA BLASTER SFK-2 manufactured by Fuji Seisakusho). Next, the re-peelable adhesive film is peeled and removed, and a roughened region having an arithmetic average roughness Ra of 0.7 μm (an annular shape having an outer diameter of 280 mm and an inner diameter of 210 mm, the center of which is the original (Corresponding to the center in the opposite width direction) was obtained as the second region. The surface roughness in the second region was equal to that before the sandblast treatment, and the arithmetic surface height Ra was 0.03 μm. This sand blasting process was repeated every 300 mm in the lengthwise direction of the original fabric to form convenient 100 annular roughened regions.

(5) Production of DR laminate A half cut in which a resin film and a pressure-sensitive adhesive layer that give a substrate are cut from the surface on the substrate side is performed on the raw material of the DR laminate after the sandblast treatment. 100 cutting lines (closed curves) forming a circle having a diameter of 270 mm in plan view were produced. The centers of the circles formed by these cutting lines were made to coincide with the centers of the annular second regions previously formed by sandblasting. Then, the resin-based film and the pressure-sensitive adhesive layer outside the cutting line forming a circle having a diameter of 270 mm were removed.

In this way, a DR laminate was obtained in which 100 pieces of laser dicing sheets having the following shape and arrangement were arranged side by side in the longitudinal direction on the release surface of the long release sheet.
Planar shape of the laser dicing sheet: a circle with a diameter of 270 mm Planar shape of the first region: a circle with a diameter of 210 mm Planar shape of the second region: an annulus with an outer diameter of 270 mm and an inner diameter of 210 mm containing the first region Longitudinal distance between two laser dicing sheets arranged in the nearest position: 30 mm
This DR laminate was wound in the longitudinal direction to form a wound body.

[Examples 2 to 4 and Comparative Example 2]
Except having changed the internal diameter of the sandblasting range in Example 1 into the internal diameter shown in Table 1, the same operation as Example 1 was performed and the winding body of DR laminated body was obtained.

[Comparative Example 1]
In Example 1, except that the sandblasting treatment was not performed, the same operation as in Example 1 was performed, and a laser dicing sheet having a substrate back surface composed of the first region was laminated on the release surface of the 100 release sheet. A DR laminate wound body was obtained.

[Comparative Example 3]
In Example 1, the same operation as in the example was performed except that the entire surface of the base material was subjected to sandblasting, and the laser dicing sheet having the second region on the back surface of the base material was placed on the release surface of the 100-sheet release sheet. A laminated body of a DR laminate was obtained.

[Test Example 1] Measurement of Young's Modulus JIS K7161: 1994 using a universal tensile tester (Tensilon RTA-T-2M manufactured by Orientec Co., Ltd.) for the resin-based film that gives the base material used in the examples and comparative examples. The Young's modulus was measured under the conditions of a tensile speed of 200 mm / min in an environment of 23 ° C. and a relative humidity of 50%. The result is as described above.

[Test Example 2] Measurement of linear transmittance For the resin-based film that gives the base material used in the examples and comparative examples, an ultraviolet / visible / near-infrared spectrophotometer ("UV-3101PC" manufactured by Shimadzu Corporation) was used. The linear transmittance in the wavelength range of 200 to 1200 nm was measured, and a value of 1064 nm was read. The result is as described above.

[Test Example 3] Retardation measurement Retardation film inspection apparatus ("RETS-100" manufactured by Otsuka Electronics Co., Ltd. (detector "MCPD-7700")) for the resin-based film that gives the base material used in the examples and comparative examples. ) Was used to measure the phase difference in the range of 800 to 1100 nm, and the value of the phase difference at a wavelength of 1064 nm was read. The result is as described above.

[Test Example 4] Measurement of Arithmetic Average Roughness Ra The surface used as the back of the base material in the case of using the laser dicing sheet in the resin-based film giving the base material used in the Examples and Comparative Examples, and Examples 1 to 4 For the second region of the back surface of the base material formed by the sandblasting process performed in Comparative Examples 2 to 3, a contact type surface roughness meter (“SURFTEST SV-3000” manufactured by Mitsutoyo) was used for JIS B0601-2001. Based on this, 10 points of arithmetic average roughness Ra were measured in the plane, and the average value was calculated. The measurement conditions were as follows.
(When Ra ≦ 1.0)
Cut-off value λc: 0.25 mm, evaluation length Ln: 1.25 mm
(When Ra> 1.0)
Cut-off value λc: 0.8 mm, evaluation length Ln: 4 mm

[Test Example 5] Evaluation of DR laminated body supply property The DR laminated body wound body according to each of Examples and Comparative Examples was set in a wafer bonding apparatus ("RAD-2500m / 12" manufactured by Lintec Corporation). Using the apparatus, the laser dicing sheet was peeled from the release sheet in the DR laminate, and each of the peeled laser dicing sheets was attached to a silicon wafer having a diameter of 200 mm and a thickness of 100 μm, and a ring frame for an 8-inch wafer.
As a result, if the number of laser dicing sheets that were properly peeled off from the release sheet and were not bonded to the silicon wafer was 4 or less, it was determined as “good”, and the laser dicing that resulted in inappropriate bonding The case where there were 5 or more sheets was defined as “bad”. The evaluation results are shown in Table 2.

[Test Example 6] Evaluation of Expandability and Dicing Property The release sheet was peeled from the DR laminates in the examples and comparative examples, and the obtained laser dicing sheet was subjected to the same method as in Test Example 5 and the same silicon wafer as in Test Example 5 And affixed to the ring frame. The silicon wafers affixed to the laser dicing sheets according to Examples 1 to 4 and Comparative Examples 1 to 3 were entirely located in the first region on the back surface of the substrate in plan view.

  Using a laser irradiation device (“DFL7360” manufactured by DISCO, wavelength: 1064 nm), a laser that focuses light inside the wafer through the laser dicing sheet from the side facing the adhesive layer of the silicon wafer is 2 mm × Irradiation was performed while scanning along a planned cutting line set to form a 2 mm chip body. The laser irradiation area at this time was included in the first area on the back surface of the substrate in any laser dicing sheet. After irradiating all the planned cutting lines with laser, using an expander (“DDS2010” manufactured by DISCO), the laser dicing sheet is pulled down at a speed of 300 mm / min, and the silicon wafer on the adhesive layer side surface of the laser dicing sheet The region to which is attached was extended 15 mm in the main surface inward and outward directions.

  As a result, when the laser dicing sheet is stretched without problems, it is determined that the expandability is “good”, and the chip body is formed by dividing the wafer along all the planned cutting lines of the silicon wafer. Determined that the dicing property was “good”. On the other hand, when the laser dicing sheet fell off from the ring frame or the laser dicing sheet was torn, it was determined that the expandability was “impossible”. When the silicon wafer was not sufficiently divided, the dicing property was determined to be “impossible”. The evaluation results are shown in Table 2.

  As is clear from Table 1, the DR laminated body of the example satisfying the conditions of the present invention was excellent in precut property, and it was difficult to cause a defective supply of the DR laminated body. Moreover, it was excellent in dicing properties and expanding properties. Note that “partially impossible” in the dicing property of Comparative Example 2 means that the outer diameter of the first region was smaller than the outer diameter (200 mm) of the semiconductor wafer, so that laser irradiation was performed near the outermost peripheral edge of the semiconductor wafer. This is insufficient, and this part means that the semiconductor wafer was cut along a line different from the dicing scheduled line.

  The laser dicing sheet-release sheet laminate according to the present invention is suitable as a laminate of a laser dicing sheet and a release sheet used in a dicing process including an operation of irradiating a laser so as to transmit the dicing sheet, such as stealth dicing. Used for.

DESCRIPTION OF SYMBOLS 100 ... DR laminated body 10 ... Laser dicing sheet 1 ... Base material 1A ... Back surface of the base material 1a ... 1st area | region
DESCRIPTION OF SYMBOLS 1c ... Laser irradiation area | region 1b ... 2nd area | region 3 ... Adhesive layer 2 ... Base material 2A ... Back surface of the base material 21 ... 1st base material 22 ... 2nd base material 221 ... Adhesive layer 11 ... Release sheet DESCRIPTION OF SYMBOLS 100A ... Winding body 11a ... Outermost release sheet 11b ... Release sheet of inner peripheral side more than outermost release sheet C ... Core material 100B ... Stack body 71 ... Plate-like member 72 ... Ring frame

Claims (9)

A laser dicing sheet comprising a base material and an adhesive layer laminated on one surface of the base material,
The back surface, which is the surface opposite to the side facing the pressure-sensitive adhesive layer of the base material, is a first region whose surface roughness is less than 0.1 μm in arithmetic mean roughness Ra and 0.3 μm or more. Having a second region,
The first region includes a laser incident region where a laser is irradiated in use,
The laser dicing sheet, wherein the second region is provided on the outer peripheral side of the laser dicing sheet in a plan view than the laser incident region.   2. The laser dicing sheet according to claim 1, wherein the surface roughness of the second region is 0.5 μm or more in terms of arithmetic average roughness Ra.   The second region is annular in plan view, and the laser incident region is positioned closer to the center in the in-plane direction of the second region than the inner periphery in plan view of the annular second region. The laser dicing sheet according to claim 1 or 2.   The laser dicing sheet according to any one of claims 1 to 3, wherein a back surface of the base material includes the first region and the second region.   The laser dicing sheet according to any one of claims 1 to 4, wherein the base material has a Young's modulus at 23 ° C of 30 MPa to 600 MPa.   The laser dicing sheet according to any one of claims 1 to 5, wherein the second region is formed by subjecting a back surface of the base material to a roughening treatment.   7. The laser dicing sheet according to claim 1, wherein the first region has a linear transmittance of 80% or more at the wavelength of 1064 nm and a phase difference of 10 nm or less at a wavelength of 1064 nm.   The laser dicing sheet according to any one of claims 1 to 7, and a release sheet laminated so that the release surface of the laser dicing sheet faces the pressure-sensitive adhesive layer side of the laser dicing sheet, A laser dicing sheet-release sheet laminate having a region where the laser dicing sheet is not laminated on the release surface of the release sheet. The release sheet is peeled from the laser dicing sheet-release sheet laminate described in claim 8 to expose the surface of the laser dicing sheet on the pressure-sensitive adhesive layer side,
Affixing a plate-like member to a region overlapping with the first region in a plan view on the surface of the exposed adhesive layer side of the laser dicing sheet,
Using the first region as a laser incident surface, irradiating a laser so as to pass through the base material and the adhesive layer and reach the plate member,
The plate member is separated into individual pieces by extending the laser dicing sheet to which the plate member after the laser irradiation is attached in the main surface direction, thereby obtaining a chip body. A method for manufacturing a chip body.

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