CN1884412B - Adhesive sheet for use in cutting - Google Patents
Adhesive sheet for use in cutting Download PDFInfo
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- CN1884412B CN1884412B CN200610087139XA CN200610087139A CN1884412B CN 1884412 B CN1884412 B CN 1884412B CN 200610087139X A CN200610087139X A CN 200610087139XA CN 200610087139 A CN200610087139 A CN 200610087139A CN 1884412 B CN1884412 B CN 1884412B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides one kind of adhered sheet for preventing breaking of the cut body during cutting step, the usage of the adhered sheet in cutting and the obtained small cut pieces. The adhered sheet for cutting has basis material and adhesive layer in at least one side of the basis material. The adhered sheet for cutting features the basis material with tensile modulus of elasticity in 50-250 MPa, elongation at break greater than or equal to 200 % and cut-in tolerance greater than or equal to 2.5, with the cut-in tolerance of the basis material being expressed in the formula of cut-in tolerance=(breaking strength)/(tensile strength at 30 % of elongation at break).
Description
Technical field
The present invention relates to a kind of adhesive sheet for use in cutting, use this adhesion sheet the working method that is cut off body, and be cut off the body small pieces through what this working method obtained.
Background technology
In the past, be after the semiconductor crystal wafer of material is produced with large diameter state, to be cut off separations (dicing) one-tenth element small pieces, and to be transferred to fixedly operation with silicon, gallium, arsenic etc.At this moment, semiconductor crystal wafer to be to paste and to remain in the state of adhesive sheet for use in cutting (to call " adhesion sheet " in the following text), is applied in cutting action, matting, expansion process, picks up operation, fixing each such operation of operation.As above-mentioned adhesion sheet, acrylic acid series tackiness agent etc. is coated on the body material of being made up of plastics film, use usually to form the tackiness agent that the thick adhering agent layer in 1～200 μ m left and right sides forms.
In above-mentioned cutting action, behind the dise knife cut-out semiconductor crystal wafer that moves while rotating, form semi-conductor chip.In this operation, being called as the body material that is cut into the adhesion sheet that is keeping semiconductor crystal wafer cut-out mode inner, full cutting is just becoming main flow.
In above-mentioned expansion process, will guarantee that sufficient street and the semiconductor wafer that picks up that is easy to carry out subsequently are the adhere expansion of sheet of purpose.But in the full cutting-off method that cuts, in order to cut up to the inside of the sheet of adhering, also to expand the adhesion sheet significantly, the sheet of adhering sometimes ruptures from this switch-in part branch.Its result exists in and picks up in the operation, can't picking up semiconductor chip and make operability and the significantly reduced problem of yield rate.
For fear of the problems referred to above, in adhesion sheet in the past, use the body material film that constitutes by SE.But, when such adhesion sheet is taken care of with the state that is pasted on semiconductor crystal wafer for a long time, after additives such as the softening agent that comprises in the SE move to adhering agent layer, cause adhesive reduction.Its result, the chip when producing cutting sometimes fly out and peeling off when picking up bad.
For the adhesiveness that solves on the adhesion sheet changes in time, for example, disclose the body material film in the following japanese kokai publication hei 5-156214 communique and use the wafer adhesion of ethylene methacrylic acid methyl terpolymer film to use the adhesion sheet.In addition, in following japanese kokai publication hei 11-43656 communique, disclose the body material use and have the not wafer adhesion usefulness adhesion sheet of the film of OPP oriented polypropylene layer.But, these formerly the technology the operation property in the expansion process is not done any consideration.And, be disclosed in semiconductor crystal wafer is carried out in these each wafer adhesions of technology formerly with the adhesion sheet the man-hour that adds in use, the fracture of wafer adhesion with the adhesion sheet taken place in expansion process really.
In addition; Disclose at 2,000 one No. 124169 communiques of following TOHKEMY: comprise body material sheet and the cutting belt that is arranged at the adhering agent layer on the one of which side surface, this cutting belt has by the upper layer that contacts with adhering agent layer, is arranged at the middle layer under this upper layer and is arranged at the body material sheet that the lower layer under this middle layer constitutes.In addition; In this cutting belt; For the stretch-resistance (modulus in tension (young modulus) is long-pending with thickness) by the product representation of Young's modulus and bed thickness, the meaning of this TOHKEMY 2000-124169 communique is: the stretch-resistance (B) in the stretch-resistance of upper layer (A), middle layer and the stretch-resistance (C) of lower layer satisfy the relation of B＜A≤C.According to this TOHKEMY 2000-124169 communique, it records: in the expansion process in cutting, can not receive tackiness agent Young's modulus influence and evenly and fully enlarge the interval of line of cut, be difficult for producing the fracture at line of cut place simultaneously.But even the cutting belt of said structure, insufficient or breaking tenacity is compared with modulus in tension when enough big at the elongation at break of each layer that constitutes body material, in expansion process, also produces cutting belt sometimes and ruptures.That is, even the cutting belt of said structure, the fracture when also not preventing expansion process fully.
Summary of the invention
The present invention puts in view of the above problems and proposes; Its purpose is, the adhesive sheet for use in cutting that can prevent the fracture in the expansion process fully, the working method that is cut off body of using this adhesive sheet for use in cutting is provided and is cut off the body small pieces through what this method obtained.
The inventor is in order to solve above-mentioned problem in the past, to adhesive sheet for use in cutting, use the working method that is cut off body of this adhesive sheet for use in cutting and study through the body small pieces that are cut off that this method obtains.Its result has found to be controlled in the scope of regulation through the stretching physical property values with body material, thus the fracture can prevent in adhesive sheet for use in cutting in the past, to become the expansion process of problem fully the time, and accomplished the present invention.
That is, for solving above-mentioned problem, the adhesive sheet for use in cutting among the present invention is adhesive sheet for use in cutting structure, that when processing is cut off body, use that at least one mask of being employed in body material has adhering agent layer.It is characterized in that the modulus in tension of above-mentioned body material is 50～250MPa, elongation at break is more than or equal to 200%, and the degree of representing in the following formula of anti-the incision is more than or equal to 2.5.
(formula 1) degree of anti-incision the=(breaking tenacity of above-mentioned body material)/(tensile elongation of above-mentioned body material is 30% o'clock a tensile strength)
In said structure, the elongation at yield point of above-mentioned body material is preferably more than or equal to 30%.At this, the elongation at yield point of body material reads from yield-point, and this yield-point is through be the yield-point in the S-S curve that obtains of the tension test of standard under prescribed condition with JIS K 7162.
In addition, in said structure, above-mentioned body material preferably contains at least a kind that is selected among the crowd who is made up of polypropylene-based thermoplastic elastomer, WL 140 and ester based thermoplastic elastomerics.
In addition, in said structure, the thickness of above-mentioned adhering agent layer preferably 1 μ m～above-mentioned body material thickness 1/3.
In addition, in said structure, above-mentioned adhering agent layer preferably includes radiation-curing type tackiness agent.
In addition; In order to solve above-mentioned problem; The working method that is cut off body among the present invention is characterised in that to have following operation: adhesive sheet for use in cutting is pasted on the operation that is cut off body; Adhesive sheet for use in cutting wherein is adhesive sheet for use in cutting structure, that when processing is cut off body, use that at least one mask of being employed in body material has adhering agent layer; The modulus in tension of above-mentioned body material is 50～250MPa, and elongation at break is more than or equal to 200%, below the degree of anti-incision theed represent in the formula more than or equal to 2.5; Cut off above-mentionedly being cut off body and forming the operation that is cut off the body small pieces, in this operation, be cut off the side and carry out this cut-out to the body material of above-mentioned adhesive sheet for use in cutting from this; Make above-mentioned adhesive sheet for use in cutting expansion, expansion is adhesively fixed in the operation at the interval that respectively is cut off the body small pieces of this adhesive sheet for use in cutting; The operation that the body small pieces are peeled off from above-mentioned body material that is cut off that will have above-mentioned adhering agent layer,
(formula 2) degree of anti-incision the=(breaking tenacity of above-mentioned body material)/(tensile elongation of above-mentioned body material is 30% o'clock a tensile strength).
In aforesaid method, the elongation at yield point of above-mentioned body material is more preferably greater than equaling 30%.
In addition, in aforesaid method, above-mentioned body material preferably contains at least a kind that is selected among the crowd who is made up of polypropylene-based thermoplastic elastomer, WL 140 and ester based thermoplastic elastomerics.
In addition, in aforesaid method, preferably the thickness of above-mentioned adhering agent layer is 1/3 of 1 μ m～above-mentioned body material thickness.
In addition, in aforesaid method, above-mentioned adhering agent layer preferably includes radiation-curing type tackiness agent.
In addition, in aforesaid method, can use semiconductor element as being cut off body.
In addition, in order to solve aforementioned problems, the body small pieces that are cut off among the present invention are characterised in that this is cut off the body small pieces and is made through the above-mentioned working method that is cut off body.
According to the present invention; Be 50～250MPa, make elongation at break more than or equal to 200% and make the degree of anti-the incision for more than or equal to 2.5 through the tensile elasticity rate that makes body material; Thereby for example prevent when otch gets into adhesive sheet for use in cutting and expands this adhesive sheet for use in cutting fracture.Its result can pick up preferably and be cut off the body small pieces, and can seek the raising of operability and yield rate.
Description of drawings
Fig. 1 is the sectional view of the adhesive sheet for use in cutting overview in the expression embodiment of the present invention.
Fig. 2 is the graphic representation of relation of tensile elongation and the tensile strength of the body material film of expression in the above-mentioned adhesive sheet for use in cutting.
Fig. 3 (a) is the explanatory view of appearance of the expansion of the expression above-mentioned adhesive sheet for use in cutting that is pasted on semiconductor crystal wafer; To be expression semi-conductor chip and cut ring be adhesively fixed in the vertical view of the appearance of adhesive sheet for use in cutting Fig. 3 (b).
Fig. 4 (a) is the sectional view of expression cutting back semi-conductor chip and adhesive sheet for use in cutting; Fig. 4 (b) is the semi-conductor chip expanded of expression and the sectional view of adhesive sheet for use in cutting.
Fig. 5 is the graphic representation of the relation of tensile elongation and tensile strength in the body material film of the adhesive sheet for use in cutting of expression in the embodiment.
Embodiment
Below, the present invention will be described with reference to accompanying drawing.As shown in Figure 1, adhesive sheet for use in cutting 11 of the present invention is structures that adhering agent layer 2 is arranged at least one mask of body material film (body material) 1.The present inventor to the physicals of body material film, cutting the expansion condition when the cutting condition during as the semiconductor crystal wafer (semiconductor element) that is cut off body and expansion adhesive sheet for use in cutting study, and illustrated the mechanism of the fracture that causes adhesive sheet for use in cutting 11.At first, with tensile testing machine body material film 1 is carried out tension test, and tensile elongation and tensile strength are measured.Its result has obtained Strain-Strength curve as shown in Figure 2 (to call " S-S curve " in the following text).Fig. 2 is the graphic representation of expression tensile elongation and tensile strength relation.Body material 1 ruptures at the some place that is representing with breaking tenacity in the S-S curve of Fig. 2 and elongation at break when being expanded through applying tension load.The fracture of the adhesive sheet for use in cutting 11 after the cutting that takes place during expansion is also produced by the fracture of above-mentioned body material film 1.
The expansion of adhesive sheet for use in cutting 11 is undertaken by that kind shown in for example Fig. 3 (a) and Fig. 3 (b).Fig. 3 (a) is the explanatory view of appearance of the expansion of the expression adhesive sheet for use in cutting 11 that is pasted on semiconductor crystal wafer, and to be expression a plurality of semi-conductor chips (being cut off the body small pieces) and cut ring be adhesively fixed in the vertical view of the appearance of adhesive sheet for use in cutting 11 Fig. 3 (b).The a plurality of semi-conductor chips 12 that form through the cutting semiconductor wafer are adhesively fixed on adhesive sheet for use in cutting 11.In addition, the outside in the zone that forms each semi-conductor chip 12, its cut ring 13 is adhesively fixed in adhesive sheet for use in cutting 11 from the bonding zone that is fixed with a plurality of semi-conductor chips 12 through the zone of regulation.Expansion to behind the adhesive sheet for use in cutting 11 irradiation radioactive rays, used known in the past extension fixture to carry out as required.Extension fixture has cyclic outer shroud 14, and it can be pressed down to the below with adhesive sheet for use in cutting 11 through cut ring 13; In ring 15, its diameter is littler and support adhesive sheet for use in cutting 11 than the diameter of this outer shroud 14.
Expansion is undertaken by following mode.At first, outer shroud 14 separates the top that abundant distance ground is positioned at ring 15 with the degree that can insert adhesive sheet for use in cutting 11.Then, the adhesive sheet for use in cutting 11 that makes semi-conductor chip 12 and be adhesively fixed with cut ring 13 is inserted between outer shroud 14 and the interior ring 15.At this moment, the zone that is adhesively fixed with semi-conductor chip 12 is not set to the central part that is positioned at ring 15.Then, outer shroud 14 moves downwards along interior ring 15, depresses cut ring 13 simultaneously.Because cut ring 13 is depressed, the difference of altitude of adhesive sheet for use in cutting 11 through cut ring and interior ring is stretched and expands.The purpose of expansion is to prevent that semi-conductor chip 12 contacts with each other and is damaged when picking up.
The slit of each semi-conductor chip 12 that is formed by cutting (below, be called cutting slit) 16 is different and different according to the thickness of cutting tool (cutter), normally 15～60 μ m (with reference to Fig. 4 (a)).When being adhesively fixed with adhesive sheet for use in cutting 11 expansions of such semi-conductor chip 12, the width in cutting slit 16 is expanded to (with reference to Fig. 4 (b)) about 100～500 μ m.During expansion, being waited by the numerical value in the size of the size of cut ring internal diameter, semiconductor crystal wafer, semi-conductor chip 12 and cutting slit with respect to the amount of leaving behind of interior ring 15 of outer shroud 14 carry out suitable adjustment.For example, use extension fixture in the past, processing is as the semiconductor die bowlder of semiconductor crystal wafer, and the amount of leaving behind is more preferably and is set at about 5～10mm usually between 2～15mm.The amount of leaving behind can be carried out the setting of appropriateness according to die size or cutting slit numerical value, productivity etc.
When expanding, the zone of expansion is defined to the zone of not pasting semi-conductor chip 12 in the zone etc. of 12 of cutting slit 16, cut ring 13 and semi-conductor chips in adhesive sheet for use in cutting 11.The zone that is adhesively fixed with each semi-conductor chip 12 is not expanded.
When the cutting semiconductor wafer, cutting is for example proceeded to for the body material film 1 of adhesive sheet for use in cutting 11, cuts to about 1/4～1/2 the degree of depth of its thickness.In when expansion, at first, the part of cutting slit 16 at first begins to launch to expand into the V font, still, only is difficult in the part expansion in cutting slit 16, to make the gap of each semi-conductor chip 12 that sufficient interval arranged.At this, before above-mentioned interval is fully expanded, can also continue to expand adhesive sheet for use in cutting 11.Therefore, when not having the elongation at break that only can adapt to the abundant expansion that the expansion of cutting slit 16 causes, adhesive sheet for use in cutting 11 is in the part fracture in this cutting slit 16.
In addition; Even make the elongation at break increase of body material film 1 and make it fully adapt to above-mentioned expansion; When expanding; To the situation that the multiple semiconductor crystal wafer of the different numerical value of chip size, cutting slit numerical value etc. is handled, according to circumstances,, cutting slit 16 also can expand after becoming the width of regulation sometimes.Even when carrying out this expansion, in the time of only will adapting to the part of cutting slit 16, also need the elongation at break of several times～tens of times.Thereby, if the body material film that is made up of common plastics film then is difficult to adapt with it.
Therefore; The present inventor is conceived to the illustrative S-S curve of Fig. 1; Before cutting slit 16 reaches fracture; Such strength balance is expanded in the zone at the peripheral part place of the semiconductor crystal wafer through taking to make adhesive sheet for use in cutting 11, has found to prevent fully the method for adhesive sheet for use in cutting 11 fractures.That is, in the present invention, at first, the elongation at break that makes body material film 1 is more than or equal to 200%, more preferably greater than equaling 400%.And the degree of anti-incision that makes body material film 1 is more than or equal to 2.5, more preferably greater than equaling 3.Thus, such strength balance is expanded in the zone on cutting the semiconductor crystal wafer peripheral part that can realize adhesive sheet for use in cutting 11 before slit 16 reaches fracture.The molecular orientation that produces when for example making film through control possibly make the value of fracture depth in above-mentioned scope, increase or reduce.In addition, elongation at break preferably gets in the above-mentioned numerical range in MD direction and TD direction respectively.
The degree of anti-incision of body material 1 is to represent can try to achieve through following formula with respect to anti-expansionary index notch depth, body material film 1.For example, the degree of anti-the incision is meant that the cutting of the degree of anti-cutting-in degree reciprocal is remaining.Suppose that the degree of anti-the incision is 3,, still can stand expansion fully even expression cuts to body material film 1 its thickness of 1/3 of residue, promptly body material film 1 cut 2/3 of its thickness so.
(formula 3) degree of anti-incision the=(breaking tenacity of body material film 1)/(tensile elongation of body material film 1 is 30% o'clock a tensile elongation)
In the present invention, making the degree of anti-incision of body material film 1 is according to following reason more than or equal to 2.5.Promptly; If the tensile strength when body material film 1 reaches fracture just can prevent the fracture of body material film 1 greater than in order to expand the regional needed tensile strength of the semiconductor crystal wafer peripheral part in adhesive sheet for use in cutting 11 with 30% tensile elongation.In this, even for also being the same for example at the part place in cutting slit 16 of the degree of depth that cutting proceeds to 1/4～1/2 left and right thickness of body material film 1.Tensile strength when 3/4～1/2 value of the breaking tenacity under the state that in other words, is not cut is necessary to surpass and has expanded with 30% of tensile elongation.Therefore, also consider the error of depth of cut etc., as long as 2.5 times of the tensile strength of breaking tenacity when having expanded, preferably more than or equal to 3 times with 30% tensile elongation.That is, in the present invention, the degree of anti-incision that makes body material film 1 is more than or equal to 2.5, preferably more than or equal to 3.And the degree of anti-the incision preferably respectively in MD direction and TD direction, is in the above-mentioned numerical range.
In addition, in the present invention, the modulus in tension that makes body material film 1 is 50～250MPa, preferably 80～150MPa.Through modulus in tension is in the scope between 50～250MPa, thus can be with picking up well.And; Preferably use modulus in tension to be in the above-mentioned numerical range, and the elongation at yield point of body material film 1 more than or equal to 30% and tensile elongation for more than or equal to 0 and less than 30% during expansion in do not have the body material film of yield-point.Thus, when expansion,, the semiconductor crystal wafer peripheral part is slowly expanded along with the expansion in cutting slit 16.And, for example constitute the molecular structure (hard split mold, soft split mold compare etc.) of the resin of body material film 1, thereby can make the value of modulus in tension in said scope, increase or reduce through adjustment.In addition, modulus in tension preferably gets in the above-mentioned numerical range on MD direction and TD direction respectively.The elongation at yield point of body material film 1 is from being that yield-point the S-S curve that obtains of the tension test of standard reads with JIS K 7162 under prescribed condition.Identical with for example modulus in tension, constitute the molecular structure of the resin of body material film 1 through adjustment, thereby can make the value of elongation at yield point in said scope, increase or reduce.In addition, elongation at yield point needs only on any direction of MD direction or TD direction more than or equal to 30%.
As above-mentioned body material film 1, preferably contain at least a kind the polymkeric substance that is selected among the crowd who forms by polypropylene-based thermoplastic elastomer, vinyl resin and polyester based thermoplastic elastomerics.As the amount of above-mentioned polymkeric substance, only containing a kind time-like, the ratio that accounts for whole substrate material film 1 is preferably more than or equal to 30wt%.In addition, the ratio that the total of these amounts accounts for whole substrate material film 1 when using multiple above-mentioned polymkeric substance is preferably more than or equal to 30wt%.
As polypropylene-based thermoplastic elastomer, can give an example out for example propylene-S EBS multipolymer, propylene-SEPS multipolymer, propylene-EPR multipolymer etc.As the aforesaid propylene acid resin, multipolymer of can give an example out for example methacrylic resin, various propenoate etc.As above-mentioned polyester based thermoplastic elastomerics, the TPEE (thermoplastic polyester elastomer) that constitutes by PBT (polybutylene terephthalate)-PE (polyethers)-PBT of for example can giving an example out etc.
Body material film 1 can be any one stepped construction in the single or multiple lift.When being multilayered structure, preferably form by odd-level.And, when odd-level, be the center with its central stratum, the layer of being made up of identical physicals value, constituent material etc. better is the symplex structure that is symmetrically stacked on both sides.In addition, when adhering agent layer 2 was the radiation-curing type, preferably use made the tackiness agent that the part of X ray, ultraviolet ray, electron rays isoradial sees through at least.
Can allocate various additives such as weighting agent, inhibitor, photostabilizer, antistatic agent, lubricant, dispersion agent, neutralizing agent, tinting material such as mineral wet goods tenderizer, lime carbonate, silicon-dioxide, talcum powder, mica, clay as required in the body material film 1.In addition, also can apply antistatic agent or tinting material etc. as required.
The thickness of body material film 1 do not receive special restriction, can confirm rightly, and 10～30 μ m normally are preferably about 50～200 μ m.
In addition, body material film 1 can not use with stretching, can carry out single shaft or biaxial stretch-formed processing to it as required yet.Surface making the body material film 1 that forms like this can be implemented delustring processing, Corona discharge Treatment as required, is coated with habitual physics or chemical treatment such as base paint processing, crosslinking Treatment.
As the film-forming method of body material film 1, can adopt known method in the past.Can use rightly particularly for example roll machine-processed film, casting system film, expansion is extruded, the T drawing-die is extruded etc.In addition, when body material film 1 is made up of multilayer film,, can use habitual pellicular cascade methods such as for example common extrusion molding, dry type composite algorithm as the film-forming method of this body material film 1.
Adhering agent layer 2 can use known or habitual tackiness agent.What restriction this tackiness agent does not have, can after for example use rubber system, acrylic acid series, silicone-based, polyester system, gather various tackiness agents such as vinyl acetic monomer system.
As above-mentioned tackiness agent acrylic acid series tackiness agent preferably.Polymkeric substance or its that generally uses alkyl (methyl) propenoate as the acrylic acid polymer of the base polymer of acrylic acid series tackiness agent be the multipolymer of polymerizable monomer together.As the principal monomer of acrylic acid polymer, preferably the glass tansition temperatures of its homopolymer is smaller or equal to 20 ℃ alkyl (methyl) propenoate.
As the alkyl of alkyl (methyl) propenoate, can give an example for example methyl, ethyl, butyl, 2-ethylhexyl, octyl group, different nonyl etc.In addition; As above-mentioned copolymerization property monomer, (methyl) the acrylic acid hydroxy alkyl ester of can giving an example (for example hydroxyethyl ester, hydroxyl butyl ester, hydroxyl polyhexamethylene etc.), (methyl) glycidyl acrylate, (methyl) vinylformic acid, methylene-succinic acid, maleic anhydride, (methyl) acrylic acid amides, (methyl) vinylformic acid N-methylol amide, aminoalkyl group alkyl (methyl) propenoate (for example dimethyl amino ethyl methacrylate, tertiary butyl amino-ethyl methacrylic ester etc.), vinyl acetic monomer, vinylbenzene, vinyl cyanide, acryloyl morpholine etc.
In addition, as tackiness agent, also can use radiation-curing type tackiness agent or the thermal expansion type tackiness agent that is cured by ultraviolet ray, electron rays etc.Thus, with semi-conductor chip 12 when adhesive sheet for use in cutting 11 is peeled off, through to adhering agent layer 2 irradiation ultraviolet radiations or carry out the regulation heating, the bonding force of adhering agent layer 2 is descended.Its result can carry out peeling off of semi-conductor chip easily.Can also be cutting with chips welding can dual-purpose tackiness agent.In the present invention, use the radiation-curing type, preferably use ultraviolet hardening.And when using radiation-curing type tackiness agent as tackiness agent, for can be to the tackiness agent irradiation ultraviolet radiation before or after cutting action, above-mentioned body material film 1 preferably has sufficient radioactive rays perviousness.
Radiation-curing type tackiness agent contains for example above-mentioned base polymer (acrylic acid polymer) and the radiation-curing component forms.The radiation-curing component can not receive especially restrictedly to use in molecule, have carbon-to-carbon double bond, can be through radical polymerization solidified monomer, oligopolymer or polymkeric substance.As the radiation-curing component; Can give an example for example trimethylolpropane tris (methyl) propenoate, tetramethylolmethane three (methyl) propenoate, Tetraglycol 99 two (methyl) propenoate, 1, the carboxylate of (methyl) vinylformic acid such as 6-pinakon two (methyl) propenoate, NSC 6366 two (methyl) propenoate, Dipentaerythritol six (methyl) propenoate and polyvalent alcohol: ester origoester acrylate; Isocyanuric acid ester or tricarbimide ester cpds or urethane acrylates etc. such as 2-propenyl-two-3-crotonyl cyanurate, two (2-acryloxy ethyl) chlorinated isocyanurates, three (2-methacryloxyethyl) chlorinated isocyanurates of 2-hydroxyethyl.
In addition, radiation-curing type tackiness agent also can use the radiation-curing type polymkeric substance that on the polymkeric substance side chain, has carbon-to-carbon double bond as base polymer (acrylic acid polymer), need not add above-mentioned radiation-curing component in this case.
With ultraviolet curing radiation-curing type tackiness agent the time, need light to overlap initiator.Overlap initiator, the for example st-yrax alkyl ethers such as st-yrax methyl ether, st-yrax propyl ether, benzoin isobutyl butyl ether of can giving an example: aromatic series ketones such as benzil base, st-yrax, benzophenone, Alpha-hydroxy cyclohexyl benzophenone as light; Aromatic series ketal classes such as benzyl dimethyl ketal; The Vilaterm benzophenone; Thioxanthene ketones such as clopenthixal ketone, dodecyl thioxanthone, dimethyl-thioxanthone, diethyl thioxanthone.
In above-mentioned tackiness agent, can also contain habitual additive such as linking agent, tackifier, weighting agent, inhibitor, tinting material as required.As linking agent can give an example for example polyisocyanate compounds, melamine resin, urea resin, aziridine cpd, epoxy resin, acid anhydride, polyamine carbonyl bearing polymer etc.
The thickness of above-mentioned adhering agent layer 2 can be considered that kind and the depth of cut in when cutting of tackiness agent wait suitably and set.Particularly, preferably the thickness of adhering agent layer 2 is more than or equal to 1 μ m, and smaller or equal to 1/3 of above-mentioned body material thickness.Thickness through making adhering agent layer 2 is more than or equal to 1 μ m, thereby can keep the bonding force as adhesive sheet for use in cutting 11.And the thickness through making adhering agent layer 2 is smaller or equal to 1/3 of the thickness of body material film 1, thereby modulus in tension and the breaking tenacity etc. that can suppress adhering agent layer 2 excessively reduce, and gives full play to the characteristic with body material film 1.
Adhesive sheet for use in cutting 11 of the present invention is for labeling processing or make adhering agent layer 2 level and smooth, also can dividing plate 3 be laminated on the adhering agent layer 2.As the constituent material of dividing plate 3 synthetic resin films such as paper, Vilaterm, Vestolen PP 7052, polyethyleneterephthalate of can giving an example.In order to improve, can implement lift-off processing such as silicon processing, the processing of long-chain vinylformic acid, fluorine processing on the surface of dividing plate 3 as required from the separability of adhering agent layer 2.In addition, corresponding to improving purpose such as rigidity, also can carry out single shaft or biaxial stretch-formed processing or carry out range upon range of with another plastics film etc.The thickness of dividing plate 3 does not receive special qualification, but better is 10～200 μ m for example, is more preferably 25～100 μ m.
Among Fig. 1, have adhering agent layer 2 in the one side of body material film 1, adhering agent layer 2 also can be formed at the two sides of body material film 1.And adhesive sheet for use in cutting 11 also can twine sheet and form web-like.
Adhesive sheet for use in cutting 11 of the present invention for example can and make its drying (making its heat cross-linking as required) and forms adhering agent layer 2 at the surface-coated tackiness agent of body material film, through as required the surface that dividing plate fits to this adhering agent layer 2 being made.In addition, can be employed in to have formed on another dividing plate after the adhering agent layer 2 they are fitted to method on the body material film 1 etc.
And the operation that adhesive sheet for use in cutting 11 is pasted semiconductor crystal wafer will fit on the adhesive sheet for use in cutting 11 through the semiconductor crystal wafer that double-faced pressure-sensitive adhesive sheet be fixed in supporting wafer (supporting plate), and is fixed in cut ring 13.This operation is overlapping so that adhering agent layer 2 sides become binding face with semiconductor crystal wafer and adhesive sheet for use in cutting 11, and pushes through extruder members such as extrusion rolls.In addition, also can be in the container that can pressurize (for example pressure kettle etc.), overlapping semiconductor crystal wafer in ground and adhesive sheet for use in cutting 11 as above-mentioned, thus and paste through making to pressurize in the container.At this moment, also can be on one side through the extruder member extruding, Yi Bian paste.In addition, also can in vacuum vessel, likewise paste with above-mentioned.Sticking temperature during stickup is not limited by what, but preferably between 20～80 ℃.
The operation of cutting off (cutting) semiconductor crystal wafer and forming semi-conductor chip 12 can be carried out from time road surface side of semiconductor crystal wafer by ordinary method.In addition, cutting can be used cutter cutting, laser cutting, plasma cutting or roll and known method such as split.And, in this operation, can not receive the special known method in the past of using as cutting unit with limiting.
At each semi-conductor chip 12 that will have adhering agent layer 2 from the operation that body material film 1 is peeled off; For example carry out through each semi-conductor chip 12 up being pushed up from adhesive sheet for use in cutting 11 sides, and pick up the method etc. of the semi-conductor chip 12 that is come up by the top by pickup device with pin.
In the superincumbent explanation,, be illustrated as example with the situation of using semiconductor crystal wafer as being cut off body.But the present invention is not limited to this, for example semiconductor package part, glass, pottery etc. is cut off body also can be suitable for.
Below, specify preferred embodiment of the present invention for example.But the record of short of special qualifications such as material in the present embodiment or combined amount is not the meaning that scope of the present invention is only limited to this, but is that example simply is described.
(physical property evaluation of body material film)
Estimated the body material film made from aforesaid method through following method.The result is represented in table 1.
(1) modulus in tension
TP is that benchmark carries out with JIS K 7162.As condition determination; To be made as initial length 120mm as the body material film of sample; The oblong-shaped of width 10mm; With and chuck between apart from 50mm, draw speed 300mm/min carry out tension test in MD direction or TD direction, and measured the variable quantity (mm) of the elongation of the sample on all directions.Its result draws tangent line in the initial part that erects of the S-S curve (with reference to Fig. 1) that obtains, and cuts apart the tensile strength that its tangent line was equivalent to for 100% when elongation with the sectional area of body material film and be used as modulus in tension.With expression in result's table 1 below.
(2) elongation at yield point, elongation at break, the degree of anti-the incision
To carry out tension test identically, obtain the S-S curve with the method shown in above-mentioned (1).And, tried to achieve tensile elongation respectively at 30% o'clock MD direction or tensile strength on the TD direction, breaking tenacity, and elongation at break.The degree of anti-the incision is tried to achieve by following formula.In a single day and the S-S curve is as shown in Figure 5, when manifesting the yield-point that does not cause the decline of tensile strength with expansion increase tensile strength and rise once more, the tensile elongation at its yield-point place is tried to achieve the degree of anti-the incision as elongation at yield point.
(formula 4) degree of anti-incision the=(breaking tenacity of body material film)/(tensile elongation of body material film is 30% o'clock a tensile strength)
Embodiment 1
(manufacturing of body material film)
" trade(brand)name: ゼ ラ ス " that Mitsubishi Chemical (company) is made supplies to the T membrane forming mill (design temperature is 230 ℃) of プ ラ コ one manufactured and makes film, produced the body material film of thick 100 μ m, wide 35cm." trade(brand)name: ぜ ラ ス " that Mitsubishi Chemical (company) makes is the third rare based thermoplastic elastomerics that contains third rare component and ethylene propylene rubber component.
(physical property evaluation of body material film)
Estimated each physicals of elastic tensile modulus, elongation at yield point, elongation at break, the degree of anti-the incision for the body material film that obtains.
(manufacturing of adhesive sheet for use in cutting)
Make 90 parts by weight of acrylic acid butyl esters and the copolymerization in toluene solution of 10 parts by weight of acrylic acid by ordinary method, the third rare system that has obtained weight average molecular weight 500,000 carries out copolymerization.In the solution that contains this third rare based copolymer, add dipentaerythritol acrylate (manufacturing of trade(brand)name " カ ヤ ラ Star De DPHA " Japanese chemical drug (company)) 80 weight parts, light and overlap initiator (trade(brand)name " イ Le ガ キ ユ ア 184 ", チ バ ス ペ シ ヤ Le テ イ one ケ ミ カ Le ズ manufactured) 5 weight parts, polyisocyanate compounds (trade(brand)name " コ ロ ネ one ト L ", Japanese Port リ ウ レ タ Application (company) are made) 5 weight parts, modulated third rare be ultraviolet hardening tackiness agent solution.
To be coated on the corona treatment face of the body material film that obtains with aforesaid method with the tackiness agent solution that aforesaid method modulation forms, and 80 ℃ of heat cross-linkings 10 minutes, thereby the thick ultraviolet hardening adhering agent layer of 10 μ m formed.Then, dividing plate is fitted in this tackiness agent aspect and produces the ultraviolet hardening adhesive sheet for use in cutting.
Embodiment 2
(manufacturing of body material film)
" trade(brand)name: パ ラ ペ Star ト SA-F " (methacrylate resin) calendaring molding that (company) Network ラ レ is made and membranization (170 ℃ of design temperatures) produce the body material film of thick 100 μ m, wide 35cm.
(physical property evaluation of body material film)
Likewise the physicals of the body material film that obtains is estimated with embodiment 1.The result is illustrated in the following table 1.
(manufacturing of adhesive sheet for use in cutting)
To be coated on the corona treatment face of the body material film that obtains with aforesaid method with the tackiness agent solution that embodiment 1 modulates, and 80 ℃ of heat cross-linkings 10 minutes, thereby the thick ultraviolet hardening adhering agent layer of 10 μ m formed.Then, dividing plate is fitted in this tackiness agent aspect and produces the ultraviolet hardening adhesive sheet for use in cutting.
Embodiment 3
(manufacturing of body material film)
Supreme Being people is changed into the T membrane forming mill (design temperature is 230 ℃) that " trade(brand)name: ヌ one ベ ラ Application " (polyester elastomer resin) that (company) make supply to プ ラ コ one manufactured and make film, produce the body material film of thick 100 μ m, wide 35cm.
(physical property evaluation of body material film)
Likewise the physicals of the body material film that obtains is estimated with embodiment 1.The result is illustrated in the following table 1.
(manufacturing of adhesive sheet for use in cutting)
To be coated on the corona treatment face of the body material film that obtains with aforesaid method with the tackiness agent solution that embodiment 1 modulates, and 80 ℃ of crosslinking curings 10 minutes, thereby the thick ultraviolet hardening adhering agent layer of 10 μ m formed.Then, dividing plate is fitted in this tackiness agent aspect and produces the ultraviolet hardening adhesive sheet for use in cutting.
Comparative example 1
In this comparative example; As the body material film; Use new LDPE (film grade) (trade(brand)name: ス ミ カ セ Application, MFR=1.5, Sumitomo Mitsui Port リ オ レ Off イ Application (company) are made); Make film (thick 100 μ m), this film single face implemented likewise to produce the ultraviolet hardening adhesive sheet for use in cutting with embodiment 1 the body material film of corona treatment through T drawing-die extruding process except that using.
Comparative example 2
In this comparative example; As the body material film; Use ethylene-methacrylic acid copolymer (trade(brand)name: ニ ユ Network レ Le, MFR=2.0, Mitsui デ ユ Port Application Port リ ケ ミ カ Application (company) are made); Make film (thick 100 μ m), this film single face implemented likewise to produce the ultraviolet hardening adhesive sheet for use in cutting with embodiment 1 the body material film of corona treatment through T drawing-die extruding process except that using.
(evaluation)
Estimated each adhesive sheet for use in cutting that obtains with embodiment and comparative example through following method.These results are illustrated in the following table 1.
(1) distensibility evaluation
8 inches wafers that 350 μ m are thick are fixed on the adhesive sheet for use in cutting, cut under the condition below.
Divide scribing machine: DISCO manufactured, DFD-651 (trade(brand)name)
Cutter: DISCO manufactured, NBC-ZH2050 27HEDD (trade(brand)name)
The cutter rotating speed: 45,000rpm
Cutting speed in feet per minute: 100mm/sec
Depth of cut: with respect to the body material film is 40 μ m
Cut lengths: 8mm * 8mm
Workpiece after will cutting with mould junctor (device name: " CPS-100 ", " manufacturing of NEC マ シ Na リ one (company) "); Through making the quantitative change of leaving behind with respect to the outer shroud of interior ring turn to 5mm, 10mm, 15mm and expand respectively, confirm that each adhesive sheet for use in cutting has non-cracking.
(table 1)
(2) result
As learning from table 1, get the situation of cicada adhesive sheet for use in cutting in an embodiment, it is good not produce fracture and distensibility.On the other hand, confirmed: the situation of the adhesive sheet for use in cutting in comparative example though the amount of leaving behind does not produce fracture when being 5mm, produces fracture when the amount of leaving behind of 10mm or 15mm.
Claims (12)
1. adhesive sheet for use in cutting, its at least one mask that is employed in body material has the structure of adhering agent layer, when processing is cut off body, uses, it is characterized in that,
Above-mentioned body material is 1 layer, and its modulus in tension is 50～250MPa, and elongation at break is more than or equal to 200%, by the degree of anti-incision of following formulate more than or equal to 2.5,
(formula 1) degree of anti-incision the=(breaking tenacity of above-mentioned body material)/(tensile elongation of above-mentioned body material is 30% o'clock a tensile strength).
2. adhesive sheet for use in cutting according to claim 1 is characterized in that,
The elongation at yield point of above-mentioned body material is more than or equal to 30%.
3. adhesive sheet for use in cutting according to claim 1 is characterized in that,
Above-mentioned body material contains at least a kind that is selected among the crowd who is made up of polypropylene-based thermoplastic elastomer, vinyl resin and polyester based thermoplastic elastomerics.
4. adhesive sheet for use in cutting according to claim 1 is characterized in that,
The thickness of above-mentioned adhering agent layer is 1/3 of 1 μ m～above-mentioned body material thickness.
5. adhesive sheet for use in cutting according to claim 1 is characterized in that,
Above-mentioned adhering agent layer contains radiation-curing type tackiness agent.
6. a working method that is cut off body is characterized in that, comprises following operation,
Adhesive sheet for use in cutting is pasted on the operation that is cut off body; This adhesive sheet for use in cutting is adhesive sheet for use in cutting structure, that when processing is cut off body, use that at least one mask of being employed in body material has adhering agent layer; Above-mentioned body material is 1 layer; Its modulus in tension is 50～250MPa, and elongation at break is more than or equal to 200%, by the degree of representing in the following formula of anti-the incision more than or equal to 2.5;
Cut off above-mentionedly being cut off body and forming the operation that is cut off the body small pieces, it is cut off the side from this and carries out this cut-out to the body material of above-mentioned adhesive sheet for use in cutting;
Make above-mentioned adhesive sheet for use in cutting expansion, expansion is adhesively fixed in the operation at the interval that respectively is cut off the body small pieces of this adhesive sheet for use in cutting;
The operation that the body small pieces are peeled off from above-mentioned body material that is cut off that will have above-mentioned adhering agent layer,
(formula 2) degree of anti-incision the=(breaking tenacity of above-mentioned body material)/(tensile elongation of above-mentioned body material is 30% o'clock a tensile strength).
7. the working method that is cut off body according to claim 6 is characterized in that,
The elongation at yield point of above-mentioned body material is more than or equal to 30%.
8. the working method that is cut off body according to claim 6 is characterized in that,
Above-mentioned body material contains at least a kind that is selected among the crowd who is made up of polypropylene-based thermoplastic elastomer, vinyl resin and polyester based thermoplastic elastomerics.
9. the working method that is cut off body according to claim 6 is characterized in that,
The thickness of above-mentioned adhering agent layer is 1/3 of 1 μ m～above-mentioned body material thickness.
10. the working method that is cut off body according to claim 6 is characterized in that,
Above-mentioned adhering agent layer contains radiation-curing type tackiness agent.
11. the working method that is cut off body according to claim 6 is characterized in that,
The above-mentioned body that is cut off is a semiconductor element.
12. one kind is cut off the body small pieces, it is characterized in that,
Form through the described working method manufacturing that is cut off body of claim 6.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005181744A JP4549239B2 (en) | 2005-06-22 | 2005-06-22 | Dicing adhesive sheet |
| JP2005-181744 | 2005-06-22 | ||
| JP2005181744 | 2005-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1884412A CN1884412A (en) | 2006-12-27 |
| CN1884412B true CN1884412B (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610087139XA Active CN1884412B (en) | 2005-06-22 | 2006-06-13 | Adhesive sheet for use in cutting |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4549239B2 (en) |
| KR (1) | KR101169479B1 (en) |
| CN (1) | CN1884412B (en) |
| TW (1) | TWI382074B (en) |
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| JP4979063B2 (en) * | 2006-06-15 | 2012-07-18 | 日東電工株式会社 | Manufacturing method of semiconductor device |
| JP5122893B2 (en) * | 2007-09-14 | 2013-01-16 | 株式会社ディスコ | Device manufacturing method |
| KR101191121B1 (en) | 2007-12-03 | 2012-10-15 | 주식회사 엘지화학 | Dicing die bonding film and dicing method |
| KR100922226B1 (en) * | 2007-12-10 | 2009-10-20 | 주식회사 엘지화학 | Adhesive film, dicing die bonding film and semiconductor device using the same |
| JP2009277778A (en) * | 2008-05-13 | 2009-11-26 | Disco Abrasive Syst Ltd | Method of dividing wafer |
| JP2010251727A (en) * | 2009-03-24 | 2010-11-04 | Furukawa Electric Co Ltd:The | Tape for semiconductor wafer processing |
| JP5253322B2 (en) * | 2009-08-05 | 2013-07-31 | 三菱樹脂株式会社 | Film for semiconductor manufacturing process adhesive tape |
| JP5149888B2 (en) * | 2009-12-04 | 2013-02-20 | リンテック株式会社 | Stealth dicing adhesive sheet and method for manufacturing semiconductor device |
| JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
| KR101883648B1 (en) * | 2011-05-17 | 2018-07-31 | 린텍 코포레이션 | Film and adhesive sheet |
| JP6084818B2 (en) * | 2012-11-14 | 2017-02-22 | 矢崎総業株式会社 | Foam and foam manufacturing method |
| JP6084819B2 (en) * | 2012-11-14 | 2017-02-22 | 矢崎総業株式会社 | Foam and foam manufacturing method |
| CN104756237A (en) * | 2012-12-28 | 2015-07-01 | 琳得科株式会社 | Dicing-sheet substrate film and dicing sheet |
| JP6211771B2 (en) * | 2013-02-08 | 2017-10-11 | 日東電工株式会社 | Adhesive tape |
| JP6167024B2 (en) * | 2013-11-22 | 2017-07-19 | リンテック株式会社 | Dicing sheet base film and dicing sheet |
| JP6295132B2 (en) * | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
| JP6295135B2 (en) * | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
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| KR102034972B1 (en) | 2015-06-29 | 2019-10-21 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Film for manufacturing semiconductor parts |
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| JP6980680B2 (en) * | 2016-11-02 | 2021-12-15 | リンテック株式会社 | Adhesive sheet for stealth dicing |
| CN110235236B (en) | 2017-01-30 | 2023-06-30 | 三井化学东赛璐株式会社 | Film for producing component, tool for producing component, and method for producing component |
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| TWI382074B (en) | 2013-01-11 |
| CN1884412A (en) | 2006-12-27 |
| TW200700527A (en) | 2007-01-01 |
| KR20060134790A (en) | 2006-12-28 |
| JP4549239B2 (en) | 2010-09-22 |
| JP2007005436A (en) | 2007-01-11 |
| KR101169479B1 (en) | 2012-07-27 |
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