MY192914A - Curable resin film and sheet for forming a first protective film - Google Patents
Curable resin film and sheet for forming a first protective filmInfo
- Publication number
- MY192914A MY192914A MYPI2019004447A MYPI2019004447A MY192914A MY 192914 A MY192914 A MY 192914A MY PI2019004447 A MYPI2019004447 A MY PI2019004447A MY PI2019004447 A MYPI2019004447 A MY PI2019004447A MY 192914 A MY192914 A MY 192914A
- Authority
- MY
- Malaysia
- Prior art keywords
- curable resin
- forming
- resin film
- sheet
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Abstract
A curable resin film (12) is a film for forming a first protective film (12?) on a surface having a bump (91) of a semiconductor wafer (90) by being attached to the surface, and being cured, in which a visible light transmittance of the curable resin film before curing is 45% or less, and an infrared transmittance of the curable resin film before curing is 33% or more. A sheet for forming a first protective film includes a first supporting sheet (101, 102, 103), and the curable resin film on one surface of the first supporting sheet (101a, 102a, 103a). (Figure 2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017022165 | 2017-02-09 | ||
PCT/JP2018/002484 WO2018147097A1 (en) | 2017-02-09 | 2018-01-26 | Curable resin film and sheet for forming first protective film |
Publications (1)
Publication Number | Publication Date |
---|---|
MY192914A true MY192914A (en) | 2022-09-15 |
Family
ID=63108082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019004447A MY192914A (en) | 2017-02-09 | 2018-01-26 | Curable resin film and sheet for forming a first protective film |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6388752B1 (en) |
KR (1) | KR102430167B1 (en) |
CN (1) | CN110249414B (en) |
MY (1) | MY192914A (en) |
PH (1) | PH12019501814A1 (en) |
SG (1) | SG11201907214VA (en) |
TW (1) | TWI663642B (en) |
WO (1) | WO2018147097A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112868095A (en) * | 2019-02-26 | 2021-05-28 | 琳得科株式会社 | Thermosetting resin film and first protective film-forming sheet |
JPWO2020175421A1 (en) * | 2019-02-26 | 2021-12-23 | リンテック株式会社 | Thermosetting resin film and first protective film forming sheet |
JP6803498B1 (en) * | 2019-03-29 | 2020-12-23 | 三井化学東セロ株式会社 | Manufacturing method of electronic device |
JP7326101B2 (en) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326103B2 (en) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7256851B2 (en) * | 2019-12-27 | 2023-04-12 | リンテック株式会社 | Manufacturing method of kit and semiconductor chip |
WO2023136053A1 (en) * | 2022-01-12 | 2023-07-20 | リンテック株式会社 | Sheet for forming first protective membrane, method for manufacturing semiconductor device, and use of sheet |
JP7260017B1 (en) | 2022-01-31 | 2023-04-18 | 大日本印刷株式会社 | Adhesive tape for semiconductor processing |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5249290B2 (en) | 1973-04-09 | 1977-12-16 | ||
JP3788652B2 (en) * | 1997-01-13 | 2006-06-21 | 三菱化学株式会社 | Near-infrared absorbing resin molded product |
JP4044543B2 (en) * | 2000-05-12 | 2008-02-06 | 富士通株式会社 | Manufacturing method of semiconductor chip |
JP2002226805A (en) * | 2001-02-06 | 2002-08-14 | Dainippon Ink & Chem Inc | Double-sided pressure-sensitive adhesive sheet |
JP2002252245A (en) * | 2001-02-22 | 2002-09-06 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
JP2007035880A (en) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | Manufacturing method of wafer with bump, wafer with bump and semiconductor device |
JP2009260229A (en) * | 2008-03-21 | 2009-11-05 | Hitachi Chem Co Ltd | Method of dicing semiconductor wafer, and method of connecting semiconductor chip with substrate |
JP2011231137A (en) * | 2010-04-23 | 2011-11-17 | Hitachi Chem Co Ltd | Epoxy resin composition for seal-filling semiconductor and semiconductor device |
JP2011253940A (en) * | 2010-06-02 | 2011-12-15 | Sony Chemical & Information Device Corp | Wafer dicing method, connecting method, and connecting structure |
JP5830250B2 (en) * | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5996901B2 (en) * | 2011-09-02 | 2016-09-21 | 株式会社日本触媒 | Light selective transmission filter, resin sheet, and solid-state image sensor |
JP6405556B2 (en) * | 2013-07-31 | 2018-10-17 | リンテック株式会社 | Protective film forming film, protective film forming sheet and inspection method |
CN111785673A (en) * | 2014-01-22 | 2020-10-16 | 琳得科株式会社 | Protective film forming film, protective film forming sheet, protective film forming composite sheet, and method for producing processed product |
WO2015111632A1 (en) * | 2014-01-22 | 2015-07-30 | リンテック株式会社 | Protective-membrane-forming film, sheet for forming protective membrane, compound sheet for forming protective membrane, and inspection method |
CN113980535A (en) * | 2014-10-29 | 2022-01-28 | 琳得科株式会社 | Protective film forming film, composite sheet for protective film formation, and method for manufacturing semiconductor chip with protective film |
JP6558034B2 (en) * | 2015-04-03 | 2019-08-14 | 大日本印刷株式会社 | Flexible multilayer circuit board for LED element and LED dot matrix display device using the same |
JP6415383B2 (en) * | 2015-04-30 | 2018-10-31 | 日東電工株式会社 | Back surface protective film, integrated film, film, method for manufacturing semiconductor device and method for manufacturing protective chip for protecting back surface of semiconductor element |
JP6517588B2 (en) * | 2015-05-27 | 2019-05-22 | デクセリアルズ株式会社 | Thermosetting adhesive sheet and method of manufacturing semiconductor device |
JP6506116B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET, AND METHOD OF MANUFACTURING WORK OR WORK |
JP6506117B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
JP6506118B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
-
2018
- 2018-01-26 JP JP2018525618A patent/JP6388752B1/en active Active
- 2018-01-26 SG SG11201907214VA patent/SG11201907214VA/en unknown
- 2018-01-26 CN CN201880010303.8A patent/CN110249414B/en active Active
- 2018-01-26 MY MYPI2019004447A patent/MY192914A/en unknown
- 2018-01-26 WO PCT/JP2018/002484 patent/WO2018147097A1/en active Application Filing
- 2018-01-26 TW TW107102923A patent/TWI663642B/en active
- 2018-01-26 KR KR1020197025912A patent/KR102430167B1/en active IP Right Grant
-
2019
- 2019-08-06 PH PH12019501814A patent/PH12019501814A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6388752B1 (en) | 2018-09-12 |
JPWO2018147097A1 (en) | 2019-02-14 |
TW201834044A (en) | 2018-09-16 |
KR102430167B1 (en) | 2022-08-05 |
CN110249414B (en) | 2023-04-04 |
WO2018147097A1 (en) | 2018-08-16 |
PH12019501814A1 (en) | 2020-09-14 |
CN110249414A (en) | 2019-09-17 |
KR20190116352A (en) | 2019-10-14 |
SG11201907214VA (en) | 2019-09-27 |
TWI663642B (en) | 2019-06-21 |
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