PH12019501814A1 - Curable resin film and sheet for forming a first protective film - Google Patents
Curable resin film and sheet for forming a first protective filmInfo
- Publication number
- PH12019501814A1 PH12019501814A1 PH12019501814A PH12019501814A PH12019501814A1 PH 12019501814 A1 PH12019501814 A1 PH 12019501814A1 PH 12019501814 A PH12019501814 A PH 12019501814A PH 12019501814 A PH12019501814 A PH 12019501814A PH 12019501814 A1 PH12019501814 A1 PH 12019501814A1
- Authority
- PH
- Philippines
- Prior art keywords
- curable resin
- resin film
- forming
- sheet
- film
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 title abstract 5
- 230000001681 protective effect Effects 0.000 title abstract 3
- 101100243022 Mus musculus Pcnt gene Proteins 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
This curable resin film is a film which is for forming a first protective film on a surface of a semiconductor wafer by being adhered to the surface having bumps and by being cured, wherein the visible light transmittance of the curable resin film before curing is 45 pcnt or less, and the infrared ray transmission of the curable resin film before curing is 33 pcnt or more. This sheet for forming the first protective film is provided with a first supporting sheet, and said curable resin film on one surface of the first supporting sheet.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017022165 | 2017-02-09 | ||
PCT/JP2018/002484 WO2018147097A1 (en) | 2017-02-09 | 2018-01-26 | Curable resin film and sheet for forming first protective film |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12019501814A1 true PH12019501814A1 (en) | 2020-09-14 |
Family
ID=63108082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12019501814A PH12019501814A1 (en) | 2017-02-09 | 2019-08-06 | Curable resin film and sheet for forming a first protective film |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6388752B1 (en) |
KR (1) | KR102430167B1 (en) |
CN (1) | CN110249414B (en) |
MY (1) | MY192914A (en) |
PH (1) | PH12019501814A1 (en) |
SG (1) | SG11201907214VA (en) |
TW (1) | TWI663642B (en) |
WO (1) | WO2018147097A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI834820B (en) * | 2019-02-26 | 2024-03-11 | 日商琳得科股份有限公司 | Thermosetting resin film and first protective film forming sheet |
TWI833912B (en) * | 2019-02-26 | 2024-03-01 | 日商琳得科股份有限公司 | Thermosetting resin film and first protective film forming sheet |
JP6803498B1 (en) * | 2019-03-29 | 2020-12-23 | 三井化学東セロ株式会社 | Manufacturing method of electronic device |
JP7326103B2 (en) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326101B2 (en) * | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7176072B2 (en) * | 2019-12-27 | 2022-11-21 | リンテック株式会社 | Manufacturing method of kit and semiconductor chip |
JP7323734B1 (en) * | 2022-01-12 | 2023-08-08 | リンテック株式会社 | Sheet for forming first protective film, method for manufacturing semiconductor device, and use of sheet |
JP7260017B1 (en) * | 2022-01-31 | 2023-04-18 | 大日本印刷株式会社 | Adhesive tape for semiconductor processing |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5249290B2 (en) | 1973-04-09 | 1977-12-16 | ||
JP3788652B2 (en) * | 1997-01-13 | 2006-06-21 | 三菱化学株式会社 | Near-infrared absorbing resin molded product |
JP4044543B2 (en) * | 2000-05-12 | 2008-02-06 | 富士通株式会社 | Manufacturing method of semiconductor chip |
JP2002226805A (en) * | 2001-02-06 | 2002-08-14 | Dainippon Ink & Chem Inc | Double-sided pressure-sensitive adhesive sheet |
JP2002252245A (en) * | 2001-02-22 | 2002-09-06 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
JP2007035880A (en) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Works Ltd | Manufacturing method of wafer with bump, wafer with bump and semiconductor device |
JP2009260229A (en) * | 2008-03-21 | 2009-11-05 | Hitachi Chem Co Ltd | Method of dicing semiconductor wafer, and method of connecting semiconductor chip with substrate |
JP2011231137A (en) * | 2010-04-23 | 2011-11-17 | Hitachi Chem Co Ltd | Epoxy resin composition for seal-filling semiconductor and semiconductor device |
JP2011253940A (en) * | 2010-06-02 | 2011-12-15 | Sony Chemical & Information Device Corp | Wafer dicing method, connecting method, and connecting structure |
JP5830250B2 (en) * | 2011-02-15 | 2015-12-09 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5996901B2 (en) * | 2011-09-02 | 2016-09-21 | 株式会社日本触媒 | Light selective transmission filter, resin sheet, and solid-state image sensor |
JP6405556B2 (en) * | 2013-07-31 | 2018-10-17 | リンテック株式会社 | Protective film forming film, protective film forming sheet and inspection method |
SG11201605781WA (en) * | 2014-01-22 | 2016-09-29 | Lintec Corp | Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and inspection method |
US9953856B2 (en) * | 2014-01-22 | 2018-04-24 | Lintec Corporation | Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and method of producing manufactured product |
CN107112219A (en) * | 2014-10-29 | 2017-08-29 | 琳得科株式会社 | Diaphragm formation film and diaphragm formation composite sheet |
JP6558034B2 (en) * | 2015-04-03 | 2019-08-14 | 大日本印刷株式会社 | Flexible multilayer circuit board for LED element and LED dot matrix display device using the same |
JP6415383B2 (en) * | 2015-04-30 | 2018-10-31 | 日東電工株式会社 | Back surface protective film, integrated film, film, method for manufacturing semiconductor device and method for manufacturing protective chip for protecting back surface of semiconductor element |
JP6517588B2 (en) * | 2015-05-27 | 2019-05-22 | デクセリアルズ株式会社 | Thermosetting adhesive sheet and method of manufacturing semiconductor device |
JP6506117B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
JP6506116B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET, AND METHOD OF MANUFACTURING WORK OR WORK |
JP6506118B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
-
2018
- 2018-01-26 WO PCT/JP2018/002484 patent/WO2018147097A1/en active Application Filing
- 2018-01-26 TW TW107102923A patent/TWI663642B/en active
- 2018-01-26 CN CN201880010303.8A patent/CN110249414B/en active Active
- 2018-01-26 MY MYPI2019004447A patent/MY192914A/en unknown
- 2018-01-26 KR KR1020197025912A patent/KR102430167B1/en active IP Right Grant
- 2018-01-26 SG SG11201907214VA patent/SG11201907214VA/en unknown
- 2018-01-26 JP JP2018525618A patent/JP6388752B1/en active Active
-
2019
- 2019-08-06 PH PH12019501814A patent/PH12019501814A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN110249414B (en) | 2023-04-04 |
MY192914A (en) | 2022-09-15 |
CN110249414A (en) | 2019-09-17 |
SG11201907214VA (en) | 2019-09-27 |
KR102430167B1 (en) | 2022-08-05 |
KR20190116352A (en) | 2019-10-14 |
WO2018147097A1 (en) | 2018-08-16 |
JP6388752B1 (en) | 2018-09-12 |
TWI663642B (en) | 2019-06-21 |
TW201834044A (en) | 2018-09-16 |
JPWO2018147097A1 (en) | 2019-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12019501814A1 (en) | Curable resin film and sheet for forming a first protective film | |
PH12018500670A1 (en) | Sheet for semiconductor processing | |
CL2016002280A1 (en) | Uv-reactive hot melt adhesive for rolling clear films | |
BR102016010064A2 (en) | spring assembly and process of producing a spring assembly | |
EP4235637A3 (en) | An optical device that produces flicker-like optical effects | |
MY196765A (en) | Method for manufacturing light emitting device including light emitting element and color conversion material layer | |
PH12017500376B1 (en) | Adhesive film | |
MX2016009646A (en) | Intermediate film for laminated glass, laminated glass and method for fitting laminated glass. | |
MY185983A (en) | Curable resin film and first protective film forming sheet | |
GB2563764A (en) | Micro-optic device with double sided optical effect | |
AU2017253939B2 (en) | Device and method for increasing the adhesion of a component layer to a carrier object | |
PH12018500836A1 (en) | Curable resin film and first protective film forming sheet | |
MX2017007116A (en) | Display device, interlayer film for laminated glass, and laminated glass. | |
SG11201910104UA (en) | Temporary protective film for semiconductor sealing molding | |
WO2018165408A3 (en) | Blue led light cure on demand compositions | |
PH12018500851B1 (en) | First protective film forming sheet | |
MX2018015553A (en) | Light guides with coating to be used in water. | |
PH12019501058A1 (en) | Adhesive sheet for semiconductor processing | |
MX2017017122A (en) | Pressure-sensitive adhesive film and the use thereof for protecting surfaces. | |
EP3875493A4 (en) | Curable resin composition, film, laminate and display device | |
MX2019000869A (en) | Optical device having optical and mechanical properties. | |
TW201614016A (en) | Light-shielding paint, light-shielding paint set, light-shielding film, optical element, and method for producing optical element | |
EP3749706A4 (en) | Curable silicone composition, cured product thereof, and optical semiconductor device | |
TW201614617A (en) | Display apparatus and method for manufacturing therefor | |
EP2980645A3 (en) | Designing of photomask blank and photomask blank |