MY190282A - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
MY190282A
MY190282A MYPI2018702991A MYPI2018702991A MY190282A MY 190282 A MY190282 A MY 190282A MY PI2018702991 A MYPI2018702991 A MY PI2018702991A MY PI2018702991 A MYPI2018702991 A MY PI2018702991A MY 190282 A MY190282 A MY 190282A
Authority
MY
Malaysia
Prior art keywords
tape
pressure
base tape
sensitive adhesive
electronic device
Prior art date
Application number
MYPI2018702991A
Inventor
Masami Aoyama
Toru Sano
Jirou Sugiyama
Hiromitsu Maruyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY190282A publication Critical patent/MY190282A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

Provided is a tape for electronic device packaging, which can hold a metal layer on a base tape during precut processing, and enables satisfactory detachment of the base tape at the time of use. Disclosed is a tape for electronic device packaging 1 of the invention, which includes a base tape 2 having a pressure-sensitive adhesive surface; a metal layer 3 having a predetermined planar shape, which is provided on the pressure-sensitive adhesive surface of the base tape 2; an adhesive layer 4 having a predetermined planar shape, which is provided by lamination on a surface of the metal layer 3, the surface being on the opposite side of the base tape 2 side; and a pressure-sensitive adhesive tape 5 having a label portion 5a having a predetermined planar shape, which is provided so as to cover the adhesive layer 4 and to be brought into contact with the base tape 2 at the periphery of the adhesive layer 4, in which the pressure-sensitive adhesive force P1 between the base tape 2 and the metal layer 3 is 0.01 to 0.5 N/25 mm, the pressure-sensitive adhesive force P2 between the base tape 2 and the pressure-sensitive adhesive tape 5 is 0.01 to 0.5 N/25 mm, and the ratio P1/P2 is 0.1 to 10. (Fig. 1)
MYPI2018702991A 2016-03-31 2016-11-22 Tape for electronic device packaging MY190282A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072256A JP6422462B2 (en) 2016-03-31 2016-03-31 Electronic device packaging tape
PCT/JP2016/084563 WO2017168825A1 (en) 2016-03-31 2016-11-22 Electronic device package tape

Publications (1)

Publication Number Publication Date
MY190282A true MY190282A (en) 2022-04-12

Family

ID=59962840

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018702991A MY190282A (en) 2016-03-31 2016-11-22 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6422462B2 (en)
KR (1) KR102165006B1 (en)
CN (1) CN108779375B (en)
MY (1) MY190282A (en)
SG (1) SG11201807410SA (en)
TW (1) TWI632625B (en)
WO (1) WO2017168825A1 (en)

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JP7153034B2 (en) * 2018-01-24 2022-10-13 リンテック株式会社 Long laminated sheet and its wound body
WO2019146604A1 (en) * 2018-01-24 2019-08-01 リンテック株式会社 Rolled body of elongated laminated sheet
CN108485542B (en) * 2018-03-23 2023-12-15 山东天汇防水股份有限公司 Perforated polyethylene self-adhesive waterproof coiled material and preparation and use methods thereof
JP7071784B2 (en) * 2018-07-06 2022-05-19 株式会社ディスコ Wafer processing method
JP7071785B2 (en) * 2018-07-06 2022-05-19 株式会社ディスコ Wafer processing method
JP2020024967A (en) * 2018-08-06 2020-02-13 株式会社ディスコ Wafer processing method
JP2020024968A (en) * 2018-08-06 2020-02-13 株式会社ディスコ Wafer processing method
JP7191458B2 (en) * 2018-08-06 2022-12-19 株式会社ディスコ Wafer processing method
JP2020043150A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043148A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043110A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043147A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043146A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043111A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP7175560B2 (en) * 2018-09-06 2022-11-21 株式会社ディスコ Wafer processing method
JP2020043149A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP7246825B2 (en) * 2018-12-06 2023-03-28 株式会社ディスコ Wafer processing method
CN109720623A (en) * 2018-12-30 2019-05-07 上海仪电智能电子有限公司 A kind of tire implanted RFID electronic label press equipment and its compression method

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JPS5319970A (en) 1976-08-10 1978-02-23 Mitsubishi Heavy Ind Ltd Treating method of exhaust gas
JP2001035817A (en) * 1999-07-22 2001-02-09 Toshiba Corp Method of dividing wafer and manufacture of semiconductor device
TWI340446B (en) * 2005-12-30 2011-04-11 Advanced Semiconductor Eng Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip
JP4954569B2 (en) * 2006-02-16 2012-06-20 日東電工株式会社 Manufacturing method of semiconductor device
JP2007235022A (en) * 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP5157208B2 (en) * 2006-03-20 2013-03-06 日立化成株式会社 Die bond dicing sheet
JPWO2007125903A1 (en) * 2006-04-26 2009-09-10 日立化成工業株式会社 Adhesive tape and solar cell module using the same
JP5486831B2 (en) * 2009-03-19 2014-05-07 積水化学工業株式会社 Dicing tape and semiconductor chip manufacturing method
KR101073698B1 (en) * 2009-09-07 2011-10-14 도레이첨단소재 주식회사 Lamination method of adhesive tape and lead frame
JP5487847B2 (en) 2009-09-25 2014-05-14 日本電気株式会社 Electronic device package, manufacturing method thereof, and electronic apparatus
KR101311647B1 (en) * 2010-07-07 2013-09-25 후루카와 덴키 고교 가부시키가이샤 Wafer processing tape and method of processing semiconductor therewith
JP5066231B2 (en) * 2010-07-28 2012-11-07 日東電工株式会社 Flip chip type semiconductor back film, strip-shaped semiconductor back film manufacturing method, and flip chip type semiconductor device
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP2012236899A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Method of producing adhesive sheet
KR101616680B1 (en) * 2013-03-28 2016-04-28 후루카와 덴키 고교 가부시키가이샤 Adhesive tape and wafer-processing tape
JP6374199B2 (en) * 2014-03-31 2018-08-15 日東電工株式会社 Die bond film, dicing die bond film and laminated film

Also Published As

Publication number Publication date
KR102165006B1 (en) 2020-10-13
CN108779375B (en) 2020-11-10
WO2017168825A1 (en) 2017-10-05
CN108779375A (en) 2018-11-09
TW201737370A (en) 2017-10-16
KR20180127361A (en) 2018-11-28
JP6422462B2 (en) 2018-11-14
JP2017179262A (en) 2017-10-05
TWI632625B (en) 2018-08-11
SG11201807410SA (en) 2018-09-27

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