SG11201807410SA - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
SG11201807410SA
SG11201807410SA SG11201807410SA SG11201807410SA SG11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA
Authority
SG
Singapore
Prior art keywords
tape
electronic device
device packaging
packaging
electronic
Prior art date
Application number
SG11201807410SA
Inventor
Toru Sano
Hiromitsu Maruyama
Jirou Sugiyama
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11201807410SA publication Critical patent/SG11201807410SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
SG11201807410SA 2016-03-31 2016-11-22 Tape for electronic device packaging SG11201807410SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072256A JP6422462B2 (en) 2016-03-31 2016-03-31 Electronic device packaging tape
PCT/JP2016/084563 WO2017168825A1 (en) 2016-03-31 2016-11-22 Electronic device package tape

Publications (1)

Publication Number Publication Date
SG11201807410SA true SG11201807410SA (en) 2018-09-27

Family

ID=59962840

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807410SA SG11201807410SA (en) 2016-03-31 2016-11-22 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6422462B2 (en)
KR (1) KR102165006B1 (en)
CN (1) CN108779375B (en)
MY (1) MY190282A (en)
SG (1) SG11201807410SA (en)
TW (1) TWI632625B (en)
WO (1) WO2017168825A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019146605A1 (en) * 2018-01-24 2019-08-01 リンテック株式会社 Elongated laminated sheet and rolled body thereof
SG11202006914YA (en) * 2018-01-24 2020-08-28 Lintec Corp Rolled body of elongated laminated sheet
CN108485542B (en) * 2018-03-23 2023-12-15 山东天汇防水股份有限公司 Perforated polyethylene self-adhesive waterproof coiled material and preparation and use methods thereof
JP7071785B2 (en) * 2018-07-06 2022-05-19 株式会社ディスコ Wafer processing method
JP7071784B2 (en) * 2018-07-06 2022-05-19 株式会社ディスコ Wafer processing method
JP2020024967A (en) * 2018-08-06 2020-02-13 株式会社ディスコ Wafer processing method
JP2020024968A (en) * 2018-08-06 2020-02-13 株式会社ディスコ Wafer processing method
JP7191458B2 (en) * 2018-08-06 2022-12-19 株式会社ディスコ Wafer processing method
JP2020043111A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP7175560B2 (en) * 2018-09-06 2022-11-21 株式会社ディスコ Wafer processing method
JP2020043149A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043146A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043110A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043150A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043148A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP2020043147A (en) * 2018-09-06 2020-03-19 株式会社ディスコ Wafer processing method
JP7246825B2 (en) * 2018-12-06 2023-03-28 株式会社ディスコ Wafer processing method
CN109720623A (en) * 2018-12-30 2019-05-07 上海仪电智能电子有限公司 A kind of tire implanted RFID electronic label press equipment and its compression method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319970A (en) 1976-08-10 1978-02-23 Mitsubishi Heavy Ind Ltd Treating method of exhaust gas
JP2001035817A (en) * 1999-07-22 2001-02-09 Toshiba Corp Method of dividing wafer and manufacture of semiconductor device
TWI340446B (en) * 2005-12-30 2011-04-11 Advanced Semiconductor Eng Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip
JP4954569B2 (en) * 2006-02-16 2012-06-20 日東電工株式会社 Manufacturing method of semiconductor device
JP2007235022A (en) * 2006-03-03 2007-09-13 Mitsui Chemicals Inc Adhesive film
JP5157208B2 (en) * 2006-03-20 2013-03-06 日立化成株式会社 Die bond dicing sheet
CN102176481B (en) * 2006-04-26 2013-06-05 日立化成株式会社 Adhesive tape and solar cell module using the same
JP5486831B2 (en) * 2009-03-19 2014-05-07 積水化学工業株式会社 Dicing tape and semiconductor chip manufacturing method
KR101073698B1 (en) * 2009-09-07 2011-10-14 도레이첨단소재 주식회사 Lamination method of adhesive tape and lead frame
JP5487847B2 (en) 2009-09-25 2014-05-14 日本電気株式会社 Electronic device package, manufacturing method thereof, and electronic apparatus
CN102337089B (en) * 2010-07-07 2014-01-29 古河电气工业株式会社 Wafer processing adhesive tape and method for processing semiconductor therewith
JP5066231B2 (en) * 2010-07-28 2012-11-07 日東電工株式会社 Flip chip type semiconductor back film, strip-shaped semiconductor back film manufacturing method, and flip chip type semiconductor device
JP5419226B2 (en) * 2010-07-29 2014-02-19 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP2012236899A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Method of producing adhesive sheet
KR101616680B1 (en) * 2013-03-28 2016-04-28 후루카와 덴키 고교 가부시키가이샤 Adhesive tape and wafer-processing tape
JP6374199B2 (en) * 2014-03-31 2018-08-15 日東電工株式会社 Die bond film, dicing die bond film and laminated film

Also Published As

Publication number Publication date
JP6422462B2 (en) 2018-11-14
TWI632625B (en) 2018-08-11
TW201737370A (en) 2017-10-16
JP2017179262A (en) 2017-10-05
CN108779375B (en) 2020-11-10
CN108779375A (en) 2018-11-09
KR20180127361A (en) 2018-11-28
WO2017168825A1 (en) 2017-10-05
KR102165006B1 (en) 2020-10-13
MY190282A (en) 2022-04-12

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