TW201737370A - Electronic device package tape - Google Patents

Abstract

Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention is characterized by comprising: a base tape 2 that has a pressure-sensitive adhesion face; a metal layer 3 that has a predetermined planar shape and is disposed on the pressure-sensitive adhesion face of the base tape 2; a bonding adhesive layer 4 that has a predetermined planar shape and is laminated to the metal layer 3 on the side of the metal layer 3 opposite the base tape 2 side; and a pressure-sensitive adhesive tape 5 that covers the bonding adhesive layer 4 and has a label part 5a, which has a predetermined planar shape and is disposed so as to come into contact with the base tape 2 in the periphery of the bonding adhesive layer 4. The electronic device package tape 1 is further characterized in that the adhesive power P1 between the base tape 2 and the metal layer 3 is 0.01-0.5N/25mm, the adhesive power P2 between the base tape 2 and the pressure-sensitive adhesive tape 5 is 0.01-0.5N/25mm, and P1/P2 is 0.1-10.

Description

Tape for electronic device packaging

The present invention relates to an adhesive tape for electronic device packaging, and more particularly to an electronic device packaging tape having a metal layer.

In recent years, electronic devices such as mobile phones and notebook PCs have been required to be thinner and smaller. Therefore, in order to reduce the thickness and size of an electronic device package such as a semiconductor package mounted on an electronic device, the number of electrodes of the electronic device or the circuit board is increased, and the pitch is further narrowed. In such an electronic device package, for example, a flip chip (FC) package is provided.

In the flip chip package, as described above, the number of electrodes is increased or the pitch is narrowed, so that an increase in heat generation is a problem. Therefore, as a heat dissipation structure of the flip chip package, it is proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 1).

Further, in the flip chip package, there is a possibility that the linear expansion ratio of the electronic device greatly differs from the linear expansion ratio of the circuit board. At this time, in the manufacturing process of the electronic device package, when the intermediate product is heated and cooled, the difference between the expansion amount and the shrinkage amount between the electronic device and the circuit substrate occurs. different. Because of this difference, warpage occurs in the electronic device package. As a structure for suppressing such warpage, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer (see, for example, Patent Document 2).

Further, in the flip chip package, it is also proposed to provide a metal layer on the back surface of the electronic device via the adhesive layer, and use the metal layer as a protective layer for laser marking (see, for example, Patent Document 3).

Further, in recent years, other semiconductor wafers of the same size are further laminated on a semiconductor wafer, and a three-dimensional assembly is performed. Here, in order to laminate other semiconductor wafers of the same size on the semiconductor wafer, the spacers must be laminated in advance between the two. This is due to the fact that other semiconductor wafers are also laminated on the electrode pad portion of the semiconductor wafer. As the spacer, a metal layer using an adhesive layer has been proposed (for example, see Patent Document 4). Patent Document 4 discloses that the spacer is provided by a step of bonding a spacer having a metal layer having at least one surface of the adhesive layer to the subsequent sheet, and bonding the adhesive layer to the dicing sheet with the adhesive layer as a bonding surface. a step of forming a wafer-shaped spacer having an adhesive layer by using a subsequent sheet; cutting the spacer by a needle, and peeling the spacer, by peeling off the adhesive layer together with the self-cut sheet The pick-up device used in the semiconductor wafer is a step of peeling off the cut sheet together with the adhesive layer; and the step of fixing the spacer to the adherend via the adhesive layer.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-235022

[Patent Document 2] Japanese Patent No. 5487847

[Patent Document 3] Japanese Patent No. 5419226

[Patent Document 4] Japanese Patent No. 4954569

As described above, the metal layer of the adhesive layer is used for various electronic device packages. As disclosed in Patent Document 4, it is convenient if it can be picked up by an existing device and fixed to the adherend.

Here, in the conventional pick-up device, the annular frame R of the annular holding member is bonded to the peripheral edge portion of the adhesive surface of the dicing tape D to which the wafer W or the wafer having the solid crystal layer is adhered. The annular frame R is fixed to the apparatus, whereby the wafer W is placed on the pickup device (see FIG. 5(C)). Therefore, the dicing tape D must be cut to correspond to the shape of the annular frame R when it is used.

Therefore, if the metal layer, the adhesive layer, and the adhesive tape are sequentially provided on the base tape, the adhesive tape is cut into a shape corresponding to the annular frame, and the metal layer and the adhesive layer correspond to the same. And the tape for electronic device packaging cut into a specific shape (that is, precut processing) (refer to FIGS. 1 and 2), and the substrate tape is peeled off during use to bond the ring frame to the adhesive. Tape, the convenience is very good. However, the tape for electronic device packaging thus constituted is not disclosed in the above patent document.

The tape for electronic device packaging constructed as described above must be The metal layer and the adhesive layer can be cut into a shape smaller than the adhesive tape so that the annular frame can be bonded to the peripheral portion of the adhesive tape. In order to achieve such a configuration, for example, an elongated metal foil and an adhesive film may be sequentially disposed on a long film-form substrate tape, and the metal foil and the adhesive film may be cut to form a metal layer of a specific shape and then After removing the unnecessary portion around the specific shape, the adhesive layer is bonded to the adhesive layer side, and the adhesive tape is cut into a ring-shaped position corresponding to the metal layer and the adhesive layer to correspond to the ring shape. The shape of the frame and the unwanted parts are removed.

At this time, the metal layer must be held on the substrate tape, so the surface of the substrate tape adjacent to the metal layer must have a certain degree of adhesion. However, as described above, the adhesive tape has a larger shape than the metal layer and the adhesive layer, and therefore there is a portion where the adhesive surface of the adhesive tape is bonded to the adhesive surface of the substrate tape. Therefore, in order to peel off the base tape at the time of use, there is a flaw that cannot be smoothly peeled off.

Therefore, the object of the present invention is to provide an electronic device packaging tape which can hold a metal layer on a substrate tape during pre-cut processing and which can peel the substrate tape well.

In order to solve the above problems, the tape for electronic device packaging of the present invention is characterized in that: a base tape having an adhesive surface; a metal layer provided on the adhesive surface of the base tape and having a specific planar shape; An adhesive layer provided on the side opposite to the substrate tape side and laminated with the metal layer, and having a specific planar shape; The adhesive tape of the base film and the adhesive layer, and the adhesive tape has a label portion that covers the adhesive layer and is provided in a specific planar shape so that the periphery of the adhesive layer contacts the base tape. The adhesive force P1 of the substrate tape and the metal layer is 0.01~0.5N/25mm, and the adhesion force P2 of the substrate tape and the adhesive tape is 0.01~0.5N/25mm, and the adhesion between the substrate tape and the metal layer is The ratio P1/P2 of P1 and the adhesion force P2 of the substrate tape and the adhesive tape is 0.1 to 10.

In the above tape for electronic device packaging, the metal layer preferably contains copper or aluminum.

In the above-described tape for electronic device packaging, the substrate tape preferably has a resin film and an adhesive layer for a base tape provided on one surface of the resin film.

Further, the adhesive tape for electronic device packaging, the adhesive layer for a base tape preferably contains an acrylate or a hydroxyl group-containing monomer represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms). An acrylic polymer composed of an isocyanate compound.

Further, in the above-described tape for electronic device packaging, the adhesive layer preferably contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. .

Further, in the tape for electronic device packaging, the adhesive layer preferably contains an acrylate, a hydroxyl group-containing monomer, and an intramolecular group, which are represented by CH ₂ =CHCOOR (wherein, R is an alkyl group having 4 to 18 carbon atoms). An acrylic polymer composed of an isocyanate compound having a radical-reactive carbon-carbon double bond.

According to the present invention, the metal layer can be held on the substrate tape during the pre-cut processing, and the substrate tape can be peeled off well in use.

1‧‧‧Electronic device packaging tape

2‧‧‧Substrate tape

3‧‧‧metal layer

4‧‧‧ adhesive layer

5‧‧‧Adhesive tape

5a‧‧‧Label

5b‧‧‧ peripherals

[ Fig. 1] (a) is a plan view schematically showing a structure of an adhesive tape for electronic device packaging according to an embodiment of the present invention, and (b) is a cross-sectional view.

Fig. 2 is a perspective view schematically showing the structure of an adhesive tape for electronic device according to an embodiment of the present invention.

FIG. 3 is an explanatory view showing a method of manufacturing an adhesive tape for electronic device according to an embodiment of the present invention, wherein (A) is a longitudinal cross-sectional view showing a bonding step of a metal layer, and (B) is an adhesive layer. The longitudinal direction cross-sectional view of the bonding step, (C) is a short-side cross-sectional view showing the pre-cutting step, and (D) is a perspective view showing the removal step of the unnecessary portion.

FIG. 4 is an explanatory view showing a method of manufacturing an adhesive tape for electronic device according to an embodiment of the present invention, wherein (A) is a cross-sectional view showing a bonding step of the adhesive tape, and (B) is a pre-cutting step. The cross-sectional view in the short side direction and (C) are cross-sectional views in the short side direction showing the removal step of the unnecessary portion.

Fig. 5 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.

Fig. 6 is a cross-sectional view schematically showing a method of using an adhesive tape for electronic device according to an embodiment of the present invention.

Fig. 7 is a cross-sectional view showing the structure of an electronic device package using the tape for electronic device packaging according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail.

Fig. 1 is a cross-sectional view showing an adhesive tape 1 for an electronic device according to an embodiment of the present invention. The electronic device encapsulating tape 1 is provided with a base tape 2 having an adhesive surface, and has a metal layer 3 having a specific planar shape on the adhesive surface of the base tape 2; on the side of the metal layer 3 and the substrate tape 2 The adhesive layer 4 having the opposite side and the metal layer 3 laminated and having a specific planar shape; and the specific setting provided with the adhesive layer 4 and the periphery of the adhesive layer 4 in contact with the substrate tape 2 The label portion 5a of the planar shape and the adhesive tape 5 surrounding the peripheral portion 5b on the outer side of the label portion 5a.

The label portion 5a has a shape corresponding to the annular frame R for dicing. The shape corresponding to the shape of the annular frame R for cutting is preferably substantially the same shape as the inner side of the annular frame R and is similar to the inner shape of the annular frame R. Further, it is not necessarily required to be circular, but it is preferably a shape close to a circle, and more preferably a circle. The peripheral portion 5b includes a form that completely surrounds the outer side of the label portion 5a and a form that is not completely surrounded as shown. Furthermore, the peripheral portion 5b may not be provided.

The layer of the agent 4 has a specific planar shape, which will be The annular frame R is bonded to the peripheral edge portion of the label portion 5a of the adhesive tape 5, and can be made smaller than the shape of the label portion 5a so as to be lifted up by the lifting member of the pickup device (see FIG. 6(C)). The subsequent layer 4 is preferably substantially the same shape as the label portion 5a and is similar to the size of the label portion 5a. The subsequent agent layer 4 does not necessarily have to be circular, but is preferably close to a circular shape, more preferably circular.

The metal layer 3 has the same shape as the adhesive layer 4, and the adhesive layer 4 is laminated on the metal layer 3. The lamination referred to herein is not necessarily required to be the same size as long as the main portion is laminated, but it is preferably substantially the same shape in terms of convenience in production.

In addition, the lamination referred to here includes a case where the adhesive layer 4 is directly provided on the metal layer 3, and a case where it is indirectly provided through an undercoat layer or the like which is excellent in adhesion therebetween.

The tape 1 for electronic device packaging of the present invention may be obtained by winding a long substrate tape 2 having a laminate in which a plurality of laminated layers 5a of a metal layer 3, an adhesive layer 4, and an adhesive tape 5 are formed. The form of the roll may be a form in which the laminate provided on the base tape 2 is cut one by one. Each component will be described below.

<Substrate tape 2>

The substrate tape 2 has an adhesive surface, and the adhesion force P1 of the substrate tape 2 and the metal layer 3 is 0.01 to 0.5 N/25 mm, and the adhesion force P2 of the substrate tape 2 and the adhesive tape 5 is 0.01 to 0.5 N/25 mm. Adhesion force P1 of the substrate tape 2 and the metal layer 3 and adhesion of the substrate tape 2 and the adhesive tape 5 The ratio P2 of P2 is 0.1 to 10, and there is no particular limitation. As the base tape 2, for example, a tape having a resin film and an adhesive layer for a base tape provided on one side of the resin film can be suitably used.

A known material can be used as the material of the resin film constituting the base tape 2, and examples thereof include polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE), and copolymer. (EVA, EEA, EBA), and a film in which some of these materials are substituted to further improve adhesion or mechanical strength. Further, a laminate of the film may be used for this purpose. From the viewpoints of heat resistance, smoothness, and ease of availability, it is preferably selected from polyethylene terephthalate, polypropylene, and high density polyethylene.

The thickness of the resin film constituting the base tape 2 is not particularly limited and may be appropriately set, and is preferably 10 to 150 μm.

The resin used for the adhesive layer for the base tape of the base tape 2 is as long as the adhesive force P1 of the base tape 2 and the metal layer 3 is 0.01 to 0.5 N/25 mm, and the adhesive tape 2 and the adhesive tape 5 are adhered. The force P2 is 0.01 to 0.5 N/25 mm, and the adhesive force P1 of the base tape 2 and the metal layer 3 and the ratio P1/P2 of the adhesive force P2 of the base tape 2 and the adhesive tape 5 are 0.1 to 10, and there is no particular limitation. A known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, an epoxy resin or the like which is used for the adhesive can be used, and acrylic acid which is preferably an acrylic polymer as a base polymer can be used. Adhesive.

Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl group). Esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, amyl esters, isoamyl esters, hexyl esters, heptyl esters, octyl esters, 2-ethylhexyl esters, Isooctyl ester, decyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, cetyl ester, eighteen a alkyl group such as an alkyl ester or an eicosyl ester having 1 to 30 carbon atoms, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate. One or two or more kinds of acrylic polymers such as a cyclopentyl ester or a cyclohexyl ester as a monomer component. Further, (meth) acrylate means acrylate and/or methacrylate, and (meth) of the present invention has the same meaning.

The acrylic polymer may also have a unit corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate or the cycloalkyl ester as needed for the purpose of reforming such as cohesive force and heat resistance. . Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl Acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) propylene sulfoxy naphthene a sulfonic acid group-containing monomer such as an acid; a phosphate group-containing monomer such as 2-hydroxyethyl acryloylphosphoric acid phosphate; acrylamide or acrylonitrile. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Examples of such a polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and neopentyl Diol (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate , (meth)acrylic acid epoxy ester, polyester (meth) acrylate, urethane (meth) acrylate, and the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.

The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer for a base tape is preferably a composition for suppressing the content of a low molecular weight substance. From this viewpoint, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, is mainly composed. Preferably, the adhesive can also be in an appropriate crosslinked form by internal crosslinking or external crosslinking.

Further, in order to control the crosslink density of the adhesive layer for a base tape, the peeling property with the adhesive tape 5 is improved, and for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, or a metal salt compound can be used. a method of crosslinking treatment by a suitable external crosslinking agent such as a metal nip compound, an amine resin compound, or a peroxide; or mixing a low molecular compound having two or more carbon-carbon double bonds and borrowing An appropriate method such as a method of performing crosslinking treatment by irradiation with an energy ray or the like. When an external crosslinking agent is used, the amount used is appropriately determined depending on the balance of the base polymer to be crosslinked and the use as an adhesive. In general, it is preferably blended in an amount of about 10 parts by weight or less, more preferably from 0.1 part by weight to 10 parts by weight, based on 100 parts by weight of the base polymer.

The acrylic polymer described above particularly contains an acrylate represented by CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and an isocyanate compound. The polymer P is preferred.

When the carbon number of the alkyl group of the alkyl acrylate is less than 4, the polarity is high and the peeling force is excessively large. In the manufacturing process of the tape 1 for electronic device packaging, the metal layer 3 and the adhesive layer 4 or the adhesive tape may be present. 5 After cutting into a specific shape, it becomes difficult to peel the unnecessary part of the periphery of the specific shape from the base tape 2 . On the other hand, when the carbon number of the alkyl group of the alkyl acrylate is more than 18, the glass transition temperature of the adhesive layer for a base tape becomes too high, and the subsequent characteristic at normal temperature is lowered, and as a result, the tape for electronic device packaging is used. During the manufacturing process, there may be metal layer 3 not fully When the base tape 2 or the annular frame is bonded, the metal layer 3 and the adhesive layer 4 are wrinkled.

The acrylic polymer P may contain units corresponding to other monomer components as needed.

In the acrylic polymer P, an isocyanate compound having no radically reactive carbon-carbon double bond is preferably used, but an isocyanate compound having a radically reactive carbon-carbon double bond can also be used. When an isocyanate compound having a radical-reactive carbon-carbon double bond is used, the acrylic polymer is a polymer having a monomer composition such as the above acrylate or a hydroxyl group-containing monomer, and the addition reaction contains a double bond. The composition of the isocyanate compound. Thereby, the active energy ray-curable adhesive layer (such as an ultraviolet curable adhesive layer) which is cured by irradiation with an active energy ray (such as ultraviolet rays) can be used. However, when the surface of the metal layer 3 has irregularities, the adhesive tape layer of the base tape due to the irradiation of the energy ray hardens and shrinks, and the adhesive layer of the base tape may bite into the unevenness of the surface of the metal layer 3 to make the base. The peeling force of the material tape 2 and the metal layer 3 rises. Further, when the energy ray is applied to the adhesive tape 5, the adhesive force of the adhesive tape 5 is lowered. Therefore, it is necessary to irradiate the adhesive tape 5 before the bonding, and the process becomes complicated. Therefore, in the acrylic polymer P, an isocyanate compound having no radically reactive carbon-carbon double bond is preferably used.

The thickness of the adhesive layer for the base tape constituting the base tape 2 is not particularly limited, and can be appropriately determined, and is generally about 3 to 200 μm. Further, the adhesive layer for the base tape may be composed of a single layer or a plurality of layers.

<Adhesive tape 5>

As the adhesive tape 5, as long as the adhesive force P2 of the base tape 2 and the adhesive tape 5 is 0.01 to 0.5 N/25 mm, the adhesive force P1 of the base tape 2 and the metal layer 3, and the adhesive force of the base tape 2 and the adhesive tape 5 The ratio P2 of P2 is 0.1 to 10, and there is no particular limitation, and a conventional adhesive tape 5 can be used. As the adhesive tape 5, for example, an adhesive layer may be suitably used for the base film.

The base film is not particularly limited as long as it is conventionally known. However, when a radiation curable material is used as an adhesive layer to be described later, it is preferred to use a radiation-transmitting property.

For example, examples of the material thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene-ethyl acrylate. a homopolymer or copolymer of an α-olefin of a copolymer, an ethylene-methyl acrylate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, or the like, a mixture thereof, a polyurethane, a styrene-ethylene- A thermoplastic elastomer such as a butene or pentene copolymer, a polyamine-polyol copolymer, or the like, and a mixture thereof. Further, the base film may be a mixture of two or more selected from the group, and the like may be a single layer or a stratified layer.

The thickness of the base film is not particularly limited and may be appropriately set, and is preferably 50 to 200 μm.

In order to improve the adhesion between the substrate film and the adhesive layer, the surface of the substrate film may also be subjected to chromic acid treatment, ozone exposure, flame storm. Chemical or physical surface treatments such as exposure to dew, high voltage electrocautery exposure, ionizing radiation treatment, etc.

Further, in the present embodiment, the adhesive layer is directly provided on the base film, but the anchor layer for improving the adhesion or the anchor layer for improving the machinability at the time of cutting may be interposed. The stress relaxation layer, the antistatic layer, and the like are indirectly provided.

The resin used for the adhesive layer of the adhesive tape 5 is not particularly limited, and a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a polyurethane resin, or an epoxy resin used for the adhesive can be used. Preferably, it is an acrylic adhesive which uses an acrylic polymer as a base polymer.

Examples of the acrylic polymer include alkyl (meth)acrylate (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester). , t-butyl ester, amyl ester, isoamyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, decyl ester, decyl ester, isodecyl Carbon number of alkyl groups such as ester, undecyl ester, dodecyl ester, tridecyl ester, myristyl ester, cetyl ester, octadecyl ester, eicosyl ester, etc. 1 to 30, particularly a linear or branched alkyl ester having 4 to 18 carbon atoms, and a cycloalkyl (meth)acrylate (for example, cyclopentyl ester or cyclohexyl ester) Or two or more types of acrylic polymers and the like as a monomer component. Further, (meth) acrylate means acrylate and/or methacrylate, and (meth) of the present invention has the same meaning.

Acrylic polymer, also capable of cohesiveness, heat resistance For the purpose of upgrading, etc., a unit corresponding to other monomer components copolymerizable with the above alkyl (meth) acrylate or cycloalkyl ester is contained as needed. Examples of such a monomer component include carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, isaconic acid, maleic acid, fumaric acid, and crotonic acid. Monomer; anhydride monomer such as maleic anhydride or isaconic anhydride; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (meth)acrylic acid ( a hydroxyl group-containing monomer such as 4-hydroxymethylcyclohexyl)methyl ester; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid, (methyl a sulfonic acid group-containing monomer such as acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene phthaloxy naphthalene sulfonic acid; 2-hydroxyethyl acrylonitrile phosphate; a monomer containing a phosphate group; acrylamide, acrylonitrile, or the like. These monomer components which can be copolymerized may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the entire monomer components.

Further, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like may be contained as a monomer component for copolymerization as needed. Examples of such a polyfunctional monomer include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and neopentyl Diol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol Alcohol hexa (meth) acrylate, (meth) acrylate epoxy ester, polyester (meth) acrylate, urethane (meth) acrylate, and the like. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less based on the total of the monomer components from the viewpoint of adhesion characteristics and the like.

The preparation of the acrylic polymer can be carried out, for example, by a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method, for a mixture of one or two or more kinds of component monomers. The adhesive layer is preferably a composition that suppresses the inclusion of a low molecular weight substance from the viewpoint of preventing wafer contamination, and the like, and is an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. The main component is preferred, and thus the adhesive can be appropriately crosslinked by an internal crosslinking method or an external crosslinking method.

Moreover, in order to control the crosslinking density of the adhesive layer and to improve the pick-up property, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelating compound, or an amine group can be used. a method of crosslinking a resin-based compound or a suitable external crosslinking agent such as a peroxide; or mixing a low-molecular compound having two or more carbon-carbon double bonds, and crosslinking treatment by energy ray irradiation or the like The appropriate way of the way. When an external crosslinking agent is used, the amount used is appropriately determined depending on the balance of the base polymer to be crosslinked and the use as an adhesive. In general, it is preferably blended in an amount of about 10 parts by weight or less, more preferably from 0.1 part by weight to 10 parts by weight, based on 100 parts by weight of the base polymer. Furthermore, from the viewpoint of preventing deterioration, etc. In addition, as the adhesive, additives such as various tackifiers and aging inhibitors may be used in addition to the above components.

As the adhesive constituting the adhesive layer, a radiation hardening type adhesive is suitable. In the above-mentioned adhesive, the radiation-curable adhesive may be an additive type radiation-curable adhesive in which a radiation curable monomer component or a radiation curable oligomer component is blended.

Examples of the radiation curable monomer component to be blended include, for example, urethane (meth) acrylate, trimethylolpropane tri(meth) acrylate, and tetramethylol methane tetra(methyl). Acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol Di(meth)acrylate and the like. These monomer components can be used alone or in combination of two or more.

Further, examples of the radiation curable oligomer component include various oligomers such as a urethane type, a polyether type, a polyester type, a polycarbonate type, and a polybutadiene type, and the molecular weight thereof is about 100 to 30,000. The scope is appropriate. The blending amount of the radiation hardening monomer component or the oligomer component can appropriately determine the amount by which the adhesive strength of the adhesive layer can be lowered depending on the type of the adhesive layer. In general, it is, for example, 5 parts by weight to 500 parts by weight, preferably 70 parts by weight to 150 parts by weight, per 100 parts by weight of the base polymer of the acrylic polymer or the like constituting the pressure-sensitive adhesive.

Further, the radiation-curable adhesive may be used as a base polymerization in a side chain or a main chain of a polymer or a carbon-carbon double bond at a terminal end of the main chain, in addition to the radiation-type adhesive of the above-mentioned addition type. An intrinsic type of radiation-curing adhesive for objects. The intrinsic type radiation curable adhesive does not need to contain a low molecular component oligomer component or the like, or has a small content. Therefore, the oligomer component does not move in the adhesive over time, and can form a stable phase. An adhesive layer of a layer structure is preferred.

The base polymer having a carbon-carbon double bond can be used without any particular limitation, and has a carbon-carbon double bond and has adhesiveness. Such a base polymer is preferably an acrylic polymer as a basic skeleton. The basic skeleton of the acrylic polymer may, for example, be an acrylic polymer exemplified above.

The introduction method of the carbon-carbon double bond to the acrylic polymer is not particularly limited, and various methods can be employed. However, it is easy to introduce a carbon-carbon double bond into the polymer side chain in molecular design. For example, a compound having a functional group and an acrylic polymer are copolymerized in advance, and a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is maintained, and radiation of a carbon-carbon double bond is maintained. A method of performing a condensation or addition reaction under hardening.

Examples of combinations of such functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridine group, a hydroxyl group and an isocyanate group. In view of the ease of reaction tracking, a combination of a hydroxyl group and an isocyanate group is particularly preferable among the combinations of such functional groups. Further, by a combination of such functional groups, as long as the combination of the acrylic polymer having the carbon-carbon double bond is formed, the functional group may be located on either side of the acrylic polymer and the compound. In a preferred combination, it is preferred that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryl oxime isocyanate, 2-methyl propylene methoxyethyl isocyanate, and m-isopropyl propylene. Base-α,α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, an ether compound such as the above-exemplified hydroxyl group-containing monomer or 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether or diethylene glycol monovinyl ether can be used. Co-aggregators.

The intrinsic type radiation-curable adhesive may be a base polymer (especially an acrylic polymer) having a carbon-carbon double bond, or may be blended with the radiation curable monomer component or oligomer component. The photopolymerizable compound is such that it does not deteriorate the properties. The blending amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably 0 to 10 parts by weight based on 100 parts by weight of the base polymer.

When hardened by ultraviolet rays or the like, it is preferred that the radiation-curable adhesive contains a photopolymerization initiator.

In the above acrylic polymer, particularly, an acrylate having a CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and a radical reaction in the molecule are contained. The acrylic polymer A composed of an isocyanate compound of a carbon-carbon double bond is preferred.

When the carbon number of the alkyl group of the alkyl acrylate is less than 4, the polarity may be high, the peeling force may become too large, and the pick-up property may fall. On the other hand, when the alkyl carbon number of the alkyl acrylate exceeds 18, the glass transition temperature of the adhesive layer becomes too high, and the subsequent characteristics at normal temperature are lowered, and as a result, an adhesive may be generated at the time of cutting or expanding. The peeling of the layer 4 and the metal layer 3.

The acrylic polymer A may contain units corresponding to other monomer components as needed.

In the acrylic polymer A, an isocyanate compound having a radically reactive carbon-carbon double bond can be used. In other words, the acrylic polymer preferably has a structure in which an isocyanate compound containing a double bond is subjected to an addition reaction with a polymer composed of a monomer composition such as the above acrylate or a hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radical-reactive carbon-carbon double bond in its molecular structure. Thereby, the active energy ray-curable adhesive layer (such as an ultraviolet curable adhesive layer) which is cured by irradiation with an active energy ray (such as ultraviolet rays) can be used, and the peeling force of the metal layer 3 and the adhesive layer can be reduced. .

Examples of the isocyanate compound containing a double bond include methacryl oxime isocyanate, propylene decyl isocyanate, 2-methacryloxyethyl isocyanate, 2-propenyl methoxyethyl isocyanate, and m-isopropenyl group. α,α-dimethylbenzyl isocyanate or the like. The isocyanate compound containing a double bond can be used individually or in combination of 2 or more types.

Further, in the active energy ray-curable adhesive, an external crosslinking agent may be appropriately used in order to adjust the adhesion before the active energy ray irradiation or the adhesion after the active energy ray irradiation. A specific method of the external crosslinking method is a method in which a reaction is carried out by adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound or a melamine crosslinking agent. When an external crosslinking agent is used, the amount of the crosslinking agent is appropriately determined depending on the balance of the base polymer to be crosslinked and the use of the adhesive. The amount of external crosslinking agent used, generally speaking, relative to the foregoing The basis weight of the base polymer is 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight). Further, an active energy ray-curable adhesive may be blended with an additive such as various conventionally known tackifiers, aging inhibitors, and foaming agents, in addition to the above-mentioned components, as needed.

The thickness of the adhesive layer is not particularly limited and can be appropriately determined, and is generally about 5 to 200 μm. Further, the adhesive layer may be composed of a single layer or a plurality of layers.

<metal layer 3>

The metal constituting the metal layer 3 is not particularly limited. For example, at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper is used for heat dissipation and warpage prevention of the electronic device package 8. It is preferable from the viewpoint. Among these, in terms of heat conductivity and heat dissipation, it is particularly preferable to contain copper. Further, from the viewpoint of preventing warpage of the electronic device package 8, it is particularly preferable to contain aluminum.

The thickness of the metal layer 3 can be appropriately determined in consideration of heat dissipation, warpage prevention of the electronic device package 8, and workability, and is usually in the range of 2 to 200 μm. When the metal layer 3 is 200 μm or less, the winding process is easy, and when it is 50 μm or less, it is preferable from the viewpoint of contributing to the reduction in thickness of the semiconductor package. On the other hand, from the viewpoint of heat dissipation, it is necessary to have a minimum of 2 μm or more.

For such a metal layer 3, a metal foil may be used, and the metal foil may be an electrolytic foil or a calendered foil.

<Binder layer 4>

Next, the agent layer 4 is a film which is previously thinned by an adhesive.

The subsequent agent layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, and polybutylene. Polyene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nene or 6,6-nylon, phenoxy resin, acrylic resin, PET (polyethylene terephthalate) A saturated polyester resin such as ester) or PBT (polybutylene terephthalate), a polyamidoximine resin, or a fluororesin. The thermoplastic resin may be used alone or in combination of two or more. Among these thermoplastic resins, phenoxy resin is easily ensured from the viewpoints of the viewpoint that the ionic impurities are small and the stress relaxation property is excellent, and the acrylic resin has both flexibility and strength and high toughness. The reliability of semiconductor components is particularly good.

The acrylic resin is not particularly limited, and may be a straight chain or a branch having a carbon number of 30 or less (preferably, a carbon number of 1 to 12, more preferably a carbon number of 6 to 10, particularly preferably a carbon number of 8 or 9). One or two or more kinds of polymers of an alkyl acrylate or methacrylic acid ester as a component. That is, in the present invention, the acrylic resin has a broad meaning including methacrylic resin. The aforementioned alkyl group may, for example, be methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, isobutyl, pentyl, isopentyl, hexyl, heptyl or 2-ethylhexyl. , octyl, isooctyl, decyl, isodecyl, sulfhydryl, isoindole Base, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, stearyl, octadecyl and the like.

Further, the other monomer for forming the acrylic resin (a monomer other than the alkyl ester of acrylic acid or methacrylic acid having an alkyl group having 30 or less carbon atoms) is not particularly limited, and examples thereof include acrylic acid and methacrylic acid. a carboxyl group-containing monomer such as carboxyethyl acrylate, carboxy amyl acrylate, isaconic acid, maleic acid, fumaric acid or crotonic acid; an anhydride monomer such as maleic anhydride or isocanic anhydride; (meth)acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, a hydroxyl group-containing monomer such as 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate or (4-hydroxymethylcyclohexyl)-methyl acrylate; styrenesulfonic acid, allylic Sulfonic acid, 2-(methyl) propylene decylamine-2-methylpropane sulfonic acid, (meth) acrylamide propylene sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene oxy group a sulfonic acid group-containing monomer such as naphthalenesulfonic acid; or a phosphate group-containing monomer such as 2-hydroxyethyl propylene decyl phosphate. Further, (meth)acrylic means acrylic acid and/or methacrylic acid, and (meth) of the present invention has the same meaning.

Further, examples of the thermosetting resin include an epoxy resin and a phenol resin, and examples thereof include an amine resin, an unsaturated polyester resin, a polyurethane resin, a polyoxyl resin, and a thermosetting polyimide resin. Wait. The thermosetting resin may be used alone or in combination of two or more. As the thermosetting resin, an epoxy resin having a small content such as ionic impurities which corrode the semiconductor element is particularly preferable. Also, as a hardener for epoxy resin, it is suitable for use. Phenolic resin.

The epoxy resin is not particularly limited, and for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a brominated bisphenol A type epoxy resin, or a hydrogenated bisphenol A type can be used. Epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, bismuth type epoxy resin, phenol novolak type epoxy resin, o-cresol novolac type epoxy resin, ginseng a difunctional epoxy resin or a polyfunctional epoxy resin such as a hydroxyphenylmethane type epoxy resin or a tetraphenol ethane type epoxy resin; or an intramethylene urea type epoxy resin or a diglycidyl isocyanurate type Epoxy resin such as epoxy resin or glycidylamine epoxy resin.

As the epoxy resin, in particular, a novolac type epoxy resin, a biphenyl type epoxy resin, a parahydroxyphenylmethane type epoxy resin, or a tetraphenol ethane type epoxy resin is preferable. Therefore, the epoxy resin is rich in reactivity with a phenol resin as a curing agent, and is excellent in heat resistance and the like.

Further, the phenol resin acts as a curing agent for the epoxy resin, and examples thereof include a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butyl phenol novolak resin, and a nonylphenol phenol aldehyde. A novolac type phenol resin such as a varnish resin; a polyoxystyrene such as a novolac type phenol resin or a polyoxypoxy styrene. The phenol resin may be used alone or in combination of two or more. Among these phenol resins, a phenol novolak resin and a phenol aralkyl resin are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

The blending ratio of the epoxy resin and the phenol resin, for example, the hydroxyl group in the phenol resin per equivalent of the epoxy group in the epoxy resin component It is suitable to blend in a form of from 0.5 equivalent to 2.0 equivalents. More preferably, it is 0.8 equivalents to 1.2 equivalents. In other words, when the blending ratio of the two is outside the above range, a sufficient hardening reaction is not performed, and the properties of the cured epoxy resin are likely to deteriorate.

Further, it is also possible to use a thermosetting epoxy resin and a phenol resin to promote the catalyst. The thermosetting-promoting catalyst is not particularly limited and can be used by appropriately selecting a known thermal hardening-promoting catalyst. The thermosetting-suppressing catalyst can be used singly or in combination of two or more. As the thermosetting-promoting catalyst, for example, an amine-based curing accelerator, a phosphorus-based curing accelerator, an imidazole-based curing accelerator, a boron-based curing accelerator, a phosphorus-boron-based curing accelerator, or the like can be used.

As the curing agent for the epoxy resin, as described above, a phenol resin is preferably used, but a known curing agent such as an imidazole, an amine or an acid anhydride may be used.

The adhesive layer 4 is important for adhesion (adhesion) to the adherend 9 such as an electronic device. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with a functional group at the end of the molecular chain of the polymer or the like may be added in advance as a crosslinking agent. Thereby, the subsequent characteristics at a high temperature can be improved, and the heat resistance can be improved.

The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, examples thereof include an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, and a peroxide crosslinking agent, and a urea crosslinking agent and a metal alkoxide system are also mentioned. Cross-linking agent, metal-clamping crosslinking agent, metal salt-based crosslinking agent, carbodiimide crosslinking agent, oxazoline crosslinking agent, aziridine crosslinking agent, amine crosslinking agent Wait. As a pay A crosslinking agent, an isocyanate crosslinking agent or an epoxy crosslinking agent is preferred. Further, the above-mentioned crosslinking agents may be used alone or in combination of two or more.

Further, in the present invention, the crosslinking treatment may be carried out by using an electron beam or an ultraviolet ray instead of using a crosslinking agent or a crosslinking agent.

In the subsequent agent layer 4, other additives may be appropriately blended as needed. Examples of the other additives include a filler (filler), a flame retardant, a decane coupling agent, and an ion scavenger, and examples thereof include an extender, an aging preventive, an antioxidant, and a surfactant.

As the filler, an inorganic filler or an organic filler may be used, and an inorganic filler is preferred. The adhesion of the filler such as an inorganic filler can improve the thermal conductivity, adjust the elastic modulus, and the like in the adhesive layer 4. Examples of the inorganic filler include ceramics such as cerium oxide, clay, gypsum, calcium carbonate, barium sulfate, aluminum oxide, cerium oxide, cerium carbide, cerium nitride, and aluminum nitride; aluminum, copper, silver, gold, and nickel. Various kinds of inorganic powders such as metals such as chromium, lead, tin, zinc, palladium, and solder, or alloys and other carbons. The filler may be used alone or in combination of two or more. As the filler, cerium oxide or aluminum oxide is particularly preferable, and cerium oxide is particularly preferred as molten cerium oxide. Further, the average particle diameter of the inorganic filler is preferably in the range of 0.001 μm to 80 μm. The average particle diameter of the inorganic filler can be measured, for example, by a laser diffraction type particle size distribution measuring apparatus.

The blending amount of the filler (especially the inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) based on the organic resin component, and particularly preferably 0 in the case of cerium oxide. weight The functional inorganic filler such as % to 70% by weight, heat conduction or electric conductivity is preferably 10% by weight to 98% by weight.

Further, examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. The flame retardant may be used alone or in combination of two or more. The decane coupling agent may, for example, be β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldi Ethoxy decane and the like. The decane coupling agent may be used alone or in combination of two or more. Examples of the ion scavenger include hydrotalcites, barium hydroxide, and the like. The ion scavenger may be used alone or in combination of two or more.

The adhesive layer 4 is particularly preferably composed of (A) epoxy resin, (B) hardener, (C) acrylic resin or phenoxy resin, and (D) surface-treated from the viewpoint of adhesion and reliability. Inorganic filler.

By using (A) an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-mentioned known epoxy resin can be used. (B) A hardener can be used as the above-mentioned known hardener.

(C) The acrylic resin has high flexibility as well as flexibility and strength. A preferred acrylic resin is a Tg (glass transition temperature) of -50 ° C to 50 ° C, and a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. The resulting (meth)acrylic copolymer containing a crosslinkable functional group. Further, when acrylonitrile or the like is contained to exhibit rubber properties, higher toughness can be obtained.

Further, regarding (C) phenoxy resin, the phenoxy resin has a molecular chain length similar to that of an epoxy resin, and is flexible as a composition having a high crosslinking density. The material acts to impart high toughness, so that although it is high in strength, a tough composition can be obtained. A preferred phenoxy resin is a bisphenol A type as a main skeleton, and other commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A/F mixed phenoxy resin or brominated phenoxy resin may be mentioned. As a better.

(D) The surface-treated inorganic filler may, for example, be an inorganic filler surface-treated with a coupling agent. As the inorganic filler, the above-mentioned known inorganic fillers such as cerium oxide or aluminum oxide can be used. The dispersibility of the inorganic filler is good by surface treatment with a coupling agent. Therefore, the adhesive layer 4 excellent in fluidity can be obtained, so that the adhesion to the metal layer 3 can be improved. Further, since the inorganic filler can be made highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

For example, the surface treatment of the inorganic filler by the decane coupling agent is carried out by dispersing the inorganic filler in the decane coupling agent solution by a known method, whereby the hydroxyl group present on the surface of the inorganic filler and the hexane of the decane coupling agent are used. The reaction of the thiol group obtained by hydrolysis of a hydrolyzable group such as an oxy group is carried out by forming a Si—O—Si bond on the surface of the inorganic filler.

The thickness of the layer 4 is not particularly limited, and is usually preferably 3 μm or more, and more preferably 5 μm or more from the viewpoint of workability. In order to contribute to thinning of the semiconductor package, it is preferably 100 μm or less. It is 50 μm or less. The subsequent agent layer 4 may be composed of a single layer or a plurality of layers.

Further, in the B layer (unhardened state or semi-hardened state), the adhesive layer 4 preferably has a peeling force (23° C., a peeling angle of 180 degrees, and a line speed of 300 mm/min) to the metal layer 3 of 0.3 N or more. . Peeling force is not up to At 0.3 N, when dicing (cutting), peeling occurs between the adhesive layer 4 and the metal layer 3.

The water absorption rate of the layer 4 is preferably 1.5 vol% or less. The method of measuring the water absorption rate is as follows. That is, a 50×50 mm adhesive layer 4 (film-like adhesive) was used as a sample, and the sample was dried in a vacuum dryer at 120° C. for 3 hours, and then allowed to cool in a desiccator, and the dry mass was measured as M1. The sample was immersed in distilled water at room temperature for 24 hours, and then taken out, and the surface of the sample was wiped with a filter paper and quickly weighed to obtain M2. The water absorption rate is calculated by the following formula (1).

Water absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (1) Here, d is the density of the film.

When the water absorption rate exceeds 1.5 vol%, there is a problem that a package crack occurs during solder reflow due to moisture absorption.

The saturated moisture absorption rate of the layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film-like adhesive) having a diameter of 100 mm was used as a sample, and the sample was dried in a vacuum dryer at 120 ° C for 3 hours, and after cooling in a desiccator, the dry mass was measured. As M1. The sample was taken up in a constant temperature and humidity chamber at 85 ° C and 85% RH for 168 hours, and then taken out, and quickly weighed as M2. The saturated moisture absorption rate is calculated by the following formula (2).

Saturated moisture absorption rate (vol%) = [(M2-M1) / (M1/d)] × 100 (2) Here, d is the density of the film.

When the saturated moisture absorption rate exceeds 1.0 vol%, the value of the vapor pressure is increased due to moisture absorption during reflow, and good reflow characteristics cannot be obtained.

The residual volatile component of the layer 4 is preferably 3.0% by weight or less. The method for measuring the residual volatile component is as follows. That is, the adhesive layer 4 (film-like adhesive) having a size of 50×50 mm is used as a sample, and the initial mass of the sample is measured. As M1, the sample is heated in a hot air circulation thermostat at 200° C. for 2 hours, and then weighed. And as M2. The residual volatile component is calculated by the following formula (3).

Residual volatile components (wt%) = [(M2-M1)/M1] × 100 (3)

When the residual volatile component exceeds 3.0% by weight, the solvent is volatilized by heating during the encapsulation, and pores are formed inside the adhesive layer 4 to cause cracking of the package.

The ratio of the linear expansion coefficient of the metal layer 3 to the linear expansion coefficient of the adhesive layer 4 (the linear expansion coefficient of the metal layer 3 / the linear expansion coefficient of the adhesive layer 4) is preferably 0.2 or more. When the ratio is less than 0.2, peeling tends to occur between the metal layer 3 and the adhesive layer 4, and package cracking occurs during packaging, and reliability is lowered.

In the tape 1 for electronic device packaging of the embodiment, the adhesion force P1 of the substrate tape 2 and the metal layer 3 is 0.01 to 0.5 N/25 mm, and the adhesion force P2 of the substrate tape 2 and the adhesive tape 5 is 0.01 to 0.5 N/25 mm. Substrate The ratio P1/P2 of the adhesive force P1 of the adhesive tape 2 to the metal layer 3 and the adhesive force P2 of the base tape 2 and the adhesive tape 5 is 0.1 to 10.

Adhesive force is based on JIS Z0237, and the substrate tape 2 cut into a width of 25 mm × 300 mm in length is attached to the adherend in an environment of 23 ° C and 50% RH, and a universal tensile tester is used to peel the angle. The measurement was performed at 180° and a peeling speed of 300 mm/min. When the adhesive force P1 is measured, the surface of the metal layer 3 of the laminate of the metal layer 3, the adhesive layer 4, and the adhesive tape 5 is the surface of the adhesive layer of the adhesive tape 5 when the adhesive force P2 is measured. .

When the adhesive force P1 of the base tape 2 and the metal layer 3 is 0.01 N/25 mm or more, the metal layer 3 is sufficiently held in the base tape 2 during the manufacturing process of the tape 1 for electronic device packaging, and can be favorably advanced. Cutting processing, etc. When the adhesive force P1 is 0.5 N/25 mm or less, after the metal layer 3 and the adhesive layer 4 are cut into a specific shape in the manufacturing process of the electronic device packaging tape 1, the unnecessary portion around the specific shape can be self-selected. The base tape 2 is easily peeled off and removed (refer to FIG. 3(D)). When the adhesive tape P1 is too high, when the tape 1 for electronic device packaging is used, when the base tape 2 is peeled off, an excessive force is applied in the peeling direction, and wrinkles are formed in the laminate of the metal layer 3 and the adhesive layer 4. Pleats. When the adhesive force P1 is 0.5 N/25 mm or less, when the tape 1 for electronic device packaging is used, the metal layer 3 can be favorably peeled off from the base tape 2 .

When the adhesive force P2 of the base tape 2 and the adhesive tape 5 is 0.01 N/25 mm or more, the adhesive tape 5 is sufficiently held in the base tape 2 during the manufacturing process of the tape 1 for electronic device packaging, and can be performed favorably. Pre-cut processing, etc. When the tape 1 for electronic device packaging is used, the base tape 2 is gradually peeled off from one end of the adhesive tape 5, and the tension applied to the tape 1 for electronic device packaging is controlled by the peeling of the base tape 2. While the adhesive tape 5 is attached to the annular frame R at any time, when the adhesive force P2 is too low, the adhesive tape 5 may be peeled off from the base tape 2 before the substrate tape 2 is peeled off, and air is allowed to enter. When the air enters between the adhesive tape 5 and the substrate tape 2, the tension applied to the electronic device packaging tape 1 by the peeling of the substrate tape 2 cannot be controlled, so that the adhesive tape 5 is attached to the ring frame at any time. At the time of R, the wrinkles may appear on the adhesive tape 5 or the adhesive layer 4 and the metal layer 3 laminated thereon. When the adhesive force P2 is 0.01 N/25 mm or more, before the base tape 2 is peeled off, the adhesive tape 5 is peeled off from the base tape 2 to allow air to enter, and the adhesive tape 5 can be favorably bonded to the annular frame. In addition, the reason why the adhesive tape 5 peels from the base tape 2 and the air enters before peeling the base tape 2 is mentioned, for example. The elongate electronic device encapsulating tape 1 is wound from a wound body in a roll shape, and the pre-cut adhesive tape 5, the adhesive layer 4, and the metal layer 3 are sequentially wound up, and disposed. The transfer auxiliary roller on the path in which the bonding table of the annular frame R is placed, the adhesive tape 5 is pulled over the base tape 2, and when the peeling force P2 is too low, the end of the adhesive tape 5 is made of the substrate. The tape 2 floats and peels off, allowing air to enter.

When the adhesive force P2 is 0.5 N/25 mm or less, in the manufacturing process of the electronic device packaging tape 1, after the adhesive tape 5 is cut into a specific shape, the unnecessary portion around the specific shape can be easily made from the base tape 2 The ground is peeled off and removed (refer to Fig. 3 (D)). Also, the adhesion P2 is too high When the tape 1 for electronic device packaging is used, when the base tape 2 is peeled off, an excessive force is applied in the peeling direction, and wrinkles are formed in the laminate of the metal layer 3 and the adhesive layer 4. When the adhesive force P2 is 0.5 N/25 mm or less, when the tape 1 for electronic device packaging is used, the adhesive tape 5 can be peeled off favorably from the base tape 2.

When the adhesive force P1 between the base tape 2 and the metal layer 3 and the adhesive force P2 between the base tape 2 and the adhesive tape 5 are too large, when the tape 1 for electronic device packaging is used, the substrate tape 2 is peeled off, and the metal layer is to be peeled off. 3. When the peripheral portion of the label portion 5a of the laminate of the adhesive layer 4 and the label portion 5a is bonded to the annular frame R, the force required to peel the base tape 2 from only the portion of the adhesive tape 5 is from the metal layer 3 The difference in the force required for the partial peeling of the large area becomes large, and in the portion where the peeling requires a large force, the laminate is stretched toward the side of the base tape 2, and the portion which can be peeled off with a small force is Since the force of stretching to the side of the base tape 2 is released, wrinkles are formed in the laminate, and the ring frame R cannot be adhered well. When the P1/P2 is 0.1 to 10, the ring frame R can be favorably bonded to the tape 1 for the electronic device packaging without wrinkles.

In order to make the adhesion forces P1, P2, and P1/P2 into the above ranges, the viscoelasticity or thickness of the base tape 2 or the adhesive tape 5 or the surface roughness of the metal layer 3 can be adjusted. When the surface roughness of the metal layer 3 is adjusted, the surface of the metal layer 3 adjacent to the substrate tape 2 may be subjected to a decane coupling agent treatment, a plasma treatment, an ozone water treatment, an ultraviolet ozone treatment, an ion beam treatment, or the like. Surface treatment. Further, when an electrolytic foil is used as the metal layer 3, the surface of the matte surface which is in contact with the electrolytic solution can be adjusted at the time of foil formation. degree.

Next, a method of manufacturing the tape 1 for electronic device packaging of the present embodiment will be described. First, an elongated metal layer 3 is prepared. As long as the metal layer 3 is a commercially available metal foil. Next, as shown in FIG. 3(A), the metal layer 3 is bonded to the adhesive surface of the elongated base tape 2 using a bonding roll r or the like.

Further, an adhesive film layer 4 having an elongated film shape is formed. The subsequent agent layer 4 can be formed by a conventional method of forming a film-like layer by formulating a resin composition. Specifically, for example, the resin composition is applied to a suitable separator (release paper or the like) and dried (heat curing is necessary, and the like, if necessary, dried by heat treatment) to form an adhesive. The method of layer 4 and the like. The resin composition may be a solution or a dispersion.

Next, as shown in FIG. 3(B), the adhesive layer 4 peeled off from the separator is bonded to the metal layer 3 bonded to the base tape 2 by using a bonding roll r or the like.

Further, after the metal layer 3 is bonded to the base tape 2, the adhesive layer 4 is bonded to the metal layer 3. However, after the metal layer 3 and the adhesive layer 4 are bonded, the metal layer 3 side may be bonded. The surface is attached to the substrate tape 2.

Next, as shown in FIG. 3(C), the adhesive layer 4 and the metal layer 3 are pre-cut into a specific shape (here, a circular shape) using a press cutter or the like, as shown in FIG. 3(D), The peripheral portion 6 is removed from the base tape 2 and removed. At this time, the adhesion force P1 between the base tape 2 and the metal layer 3 is 0.01 N/25 mm or more and 0.5 N/25 mm or less, so the metal layer 3 The adhesive tape 2 is sufficiently adhered and fixed, and the unnecessary portion 6 can be easily peeled off from the base tape 2, so that the pre-cut processing can be performed favorably. Further, the pre-cutting is not limited to the above, and the bonding layer 4 and the metal layer 3 may be preliminarily formed into a specific size corresponding to the size of the semiconductor wafer C or the like using a lattice-shaped cutting tooth having a circular outer shape. .

Further, the method of forming the metal layer 3 and the adhesive layer 4 having a specific shape on the base tape 2 is not limited to the above, and the elongated metal layer 3 can be bonded to the elongated base tape 2 and punched. After the unnecessary portion 6 is removed for a specific shape, the adhesive layer 4 formed into a specific shape is attached to the metal layer 3 of a specific shape, and the metal layer 3 and the adhesive layer 4 which are each formed into a specific shape in advance may be used. It is bonded to the base tape 2, but it is preferable to manufacture by the procedure shown in the above-mentioned FIG. 3 (A) - (D) from the simplicity of a manufacturing process.

Further, an adhesive tape 5 was separately prepared. The base film can be formed by a conventionally known film forming method. The film forming method may, for example, be a calendering film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, a dry lamination method, or the like. Next, an adhesive layer composition is applied onto the base film and dried (heat-crosslinking as needed) to form an adhesive layer. The coating method may be, for example, roll coating, screen coating, gravure coating or the like. Further, the adhesive layer composition may be directly applied to the base film to form an adhesive layer on the base film, or the adhesive layer composition may be applied to a release paper such as a release process. After the adhesive layer is formed, the adhesive layer is transferred to the substrate film. Thereby, the adhesive tape 5 in which the adhesive layer was formed on the base film was produced.

Thereafter, as shown in FIG. 4(A), on the side of the adhesive layer 5 of the adhesive tape 5 on the surface of the metal layer 3 of the specific shape provided on the base tape 2 and the adhesive layer 4 side of the adhesive layer 4. The adhesive tape 5 is laminated in a manner of surface contact. At this time, since the adhesive force P2 of the base tape 2 and the adhesive tape 5 is 0.01 N/25 mm or more, the adhesive tape 5 is sufficiently adhered and fixed to the base tape 2, and can be superposed|stacked favorable.

Next, as shown in FIG. 4(B), the adhesive tape 5 is pre-cut into a specific shape using a press cutter or the like, and as shown in FIG. 4(C), the peripheral unnecessary portion 7 is peeled off from the base tape 2 The tape 1 for electronic device packaging is removed. At this time, since the adhesive force P2 is 0.5 N/25 mm or less, the unnecessary portion 7 can be easily removed by peeling off the base tape 2 and removed.

<How to use>

A method of manufacturing the electronic device package 8 using the tape 1 for electronic device packaging of the present embodiment will be described with reference to FIGS. 5 to 7. Further, in the present embodiment, the electronic device package 8 will be described by taking a semiconductor wafer C which is flip-chip bonded to the adherend 9 as an example.

[Assembly Step of Semiconductor Wafer W]

First, another dicing tape D similar to the adhesive tape 5 of the tape 1 for electronic device packaging of the present invention is prepared, and the semiconductor wafer W is attached to the central portion of the dicing tape D as shown in FIG. 5(A). The adhesive tape is held and fixed (the assembly step of the semiconductor wafer W), and the annular frame R is bonded to the peripheral edge portion of the dicing tape D. At this time, the cutting tape D system Attached to the back side of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface, a non-electrode forming surface, etc.). The attachment method is not particularly limited, and is preferably a method of heating and crimping. The pressure bonding is usually performed by pressing by a pressing means such as a pressure roller.

[Cutting step of semiconductor wafer W]

Next, as shown in FIG. 5(B), the semiconductor wafer W is cut. Thereby, the semiconductor wafer W is cut into a specific size and diced (small-sized) to manufacture the semiconductor wafer C. The dicing is performed, for example, from the circuit surface side of the semiconductor wafer W in accordance with a general method. Moreover, in this step, for example, a cutting method called full cut that cuts into the dicing tape D can be used. The cutting device used in this step is not particularly limited, and a conventionally known one can be used. Further, when the expansion of the dicing tape D is performed, the expansion can be performed using a conventionally known expansion device.

[Pickup Step of Semiconductor Wafer C]

As shown in FIG. 5(C), the semiconductor wafer C is picked up, and the semiconductor wafer C is peeled off from the dicing tape D. The method of picking up is not particularly limited, and various methods known in the art can be employed. For example, the dicing tape D to which the semiconductor wafer C and the annular frame R are bonded is placed on the stage S of the pickup device with the substrate film side facing downward, and is fixed by the annular frame R. The jacking member T of the hollow cylindrical shape rises and expands the cutting tape D. In this state, the individual semiconductor wafers C are lifted up from the substrate film side of the dicing tape D by the needle N, and the semiconductor wafer to be lifted up C is a method of picking up by a pick-up device or the like.

[Crystalline connection step]

As shown in FIG. 5(D), the semiconductor wafer C picked up is fixed to the adherend 9 such as a substrate by a flip chip bonding method (flip-chip bonding method). Specifically, the semiconductor wafer C is fixed to the surface of the semiconductor wafer C (also referred to as a surface, a circuit pattern forming surface, an electrode forming surface, and the like) in opposition to the adherend 9 in accordance with a general method. Adhesive body 9. For example, first, the flux is attached to the bump 10 as a connection portion formed on the circuit surface side of the semiconductor wafer C. Then, the bumps 10 of the semiconductor wafer C are brought into contact with the bonding conductive material 11 (such as solder) bonded to the connection pads of the adherend 9, and the bumps 10 and the conductive material 11 are melted while being pressed. The semiconductor wafer C is electrically connected to the adherend 9 to fix the semiconductor wafer C to the adherend 9 (the flip chip bonding step). At this time, a gap is formed between the semiconductor wafer C and the adherend 9, and the distance between the gaps is generally about 30 μm to 300 μm. The flux remaining in the opposite surface or gap of the semiconductor wafer C and the adherend 9 is washed and removed.

As the adherend 9, various substrates such as a lead frame or a circuit board (such as a printed circuit board) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate or a plastic substrate. Examples of the plastic substrate include an epoxy resin substrate, a bismaleimide triazine substrate, and a polyimide substrate. Moreover, by using other semiconductor wafers as the adherends 9 and flip-chip bonding the semiconductor wafers C, the wafer stack structure can also be used. Chip on chip.

Next, as shown in FIG. 6(A), the base tape 2 of the tape 1 for electronic device packaging of the present embodiment is peeled off, and the adhesive layer of the metal layer 3 and the adhesive tape 5 is exposed, and the peripheral portion of the adhesive layer is exposed. Fixed to the annular frame R. At this time, the adhesion force P1 of the base tape 2 and the metal layer 3 is 0.5 N/25 mm or less, and the adhesion force P2 of the base tape 2 and the adhesive tape 5 is 0.01 N/25 mm or more and 0.5 N/25 mm or less, and the substrate. The ratio P1/P2 of the adhesive force P1 between the adhesive tape 2 and the metal layer 3 and the adhesive force P2 of the adhesive tape 2 and the adhesive tape 5 is 0.1 to 10, so that the base tape 2 can be peeled off well in the metal layer 3, and then When the wrinkles are not formed on the laminate of the agent layer 4 and the adhesive tape 5, the ring frame R is favorably bonded.

Next, as shown in FIG. 6(B), the metal layer 3 and the adhesive layer 4 are cut into pieces corresponding to the size of the semiconductor wafer C. The cutting can be performed by the same steps as the cutting step of the semiconductor wafer W described above. In the case where the pre-cut processing for pre-single the metal layer 3 and the adhesive layer 4 is performed, this step is not performed.

Next, as shown in FIG. 6(C), the singulated metal layer 3 and the adhesive layer 4 are picked up and peeled off by the adhesive tape 5. The pickup can be performed by the same steps as the pickup step of the above-described semiconductor wafer C.

Next, the side of the adhesive layer 4 of the picked-up metal layer 3 and the adhesive layer 4 is bonded to the back surface of the flip-chip bonded semiconductor wafer C as shown in FIG. Thereafter, a sealing material (a sealing resin or the like) is filled in the periphery of the semiconductor wafer C with the metal layer 3 and the gap between the semiconductor wafer C and the adherend 9 to be sealed. The sealing system is carried out in accordance with a general method. this At this time, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, the warpage caused by the difference in thermal expansion coefficient between the semiconductor wafer C and the adherend 9 in the flip chip bonding step is caused by the semiconductor wafer C and the metal layer 3 The difference in thermal expansion rate is offset. Further, since the metal layer 3 is provided on the back surface of the semiconductor wafer C, heat generated during use as an electronic device is radiated by the metal layer 3.

In the above description, the metal layer 3 is directly provided on the back surface of the semiconductor wafer C via the adhesive layer 4, and the metal layer 3 is also sealed together with the semiconductor wafer C. However, after the semiconductor wafer C is sealed, The metal layer 3 is provided on the upper surface of the sealing body via the adhesive layer 4. Since the electronic device package 8 is warped even when it is sealed, the warpage at the time of sealing can be offset by providing the metal layer 3 on the upper side surface of the sealing body.

In addition, the semiconductor wafer C which is flip-chip bonded to the adherend 9 is described as an example of the electronic device package 8. However, the present invention is not limited thereto. For example, other semiconductor wafers of the same size are laminated on the semiconductor wafer. In the electronic device package structure, in order to use the metal layer 3 of the tape 1 for electronic device packaging of the present invention as a spacer between the two wafers, the metal layer 3 may be provided on the semiconductor wafer on the lower side via the adhesive layer 4.

<Example>

Next, in order to clarify the effects of the present invention, the examples and comparative examples will be described in detail, but the present invention is not limited to the examples.

(1) Production of adhesive tape

As the base film, the following were produced.

(Substrate film a-1)

A zinc ion polymer a (density 0.96 g/cm ³ , zinc ion) of a ethylene-methacrylic acid-ethyl methacrylate (mass ratio 8:1:1) ternary copolymer synthesized by a radical polymerization method The resin beads having a content of 4% by mass, a chlorine content of less than 1% by mass, a Vicat softening point of 56 ° C, and a melting point of 86 ° C were melted at 140 ° C, and formed into an elongated film having a thickness of 100 μm using an extruder. A base film a-1 was produced.

(Substrate film a-2)

A resin bead of Novatec PP FW4B (polypropylene) (density: 0.90 g/cm ³ , Vicat softening point 96 ° C, melting point: 140 ° C) manufactured by Polychem Co., Ltd. of Japan was melted at 180 ° C, and formed into a thickness of 100 μm using an extruder. The film shape is long, whereby the base film a-2 is produced.

(adhesive layer composition b-1)

The acrylic copolymer (A1) having a functional group is prepared by 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, and the ratio of 2-ethylhexyl acrylate is 55 mol. A copolymer of % ear and a mass average molecular weight of 750,000. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value became 25, and the acrylic copolymer (a1) having a glass transition temperature of -50 ° C, a hydroxyl group value of 10 gKOH/g, and an acid value of 5 mgKOH/g was prepared. .

To 100 parts by mass of the acrylic copolymer (a1), 3 parts by mass of CORONATE L (manufactured by Tosoh Corporation, trade name) as a polyisocyanate was added, and Esacure KIP 150 as a photopolymerization initiator was added. A mixture of 3 parts by mass (manufactured by Lamberti Co., Ltd.) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition b-1.

(adhesive layer composition b-2)

The acrylic copolymer (A2) having a functional group is prepared by 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, and the ratio of 2-ethylhexyl acrylate is 70 mol. A copolymer of % ear and a mass average molecular weight of 750,000. Next, 2-isocyanatoethyl methacrylate was added so that the iodine value became 20, and the acrylic copolymer (a2) having a glass transition temperature of -50 ° C, a hydroxyl group of 15 gKOH/g, and an acid value of 5 mgKOH/g was prepared. .

To 100 parts by mass of the acrylic copolymer (a2), 3 parts by mass of CORONATE L (manufactured by Nitto Co., Ltd., trade name) as a polyisocyanate was added, and Esacure KIP 150 as a photopolymerization initiator was added. A mixture of 5 parts by mass (manufactured by Lamberti Co., Ltd.) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition b-2.

<Adhesive tape (1)>

The prepared adhesive layer composition b-1 is removed from the mold The release liner made of the polyethylene terephthalate film was coated so as to have a thickness of 10 μm after drying, and dried at 110 ° C for 3 minutes, and then bonded to the base film a-1. An adhesive tape (1) having an adhesive layer formed on the base film.

<Adhesive tape (2)>

The prepared adhesive layer composition b-2 was coated on a release liner made of a release-treated polyethylene terephthalate film so as to have a thickness of 10 μm after drying. After drying at 110 ° C for 3 minutes, it was bonded to the base film a-1 to prepare an adhesive tape (2) having an adhesive layer formed on the base film.

<Adhesive tape (3)>

The prepared adhesive layer composition b-2 was coated on a release liner made of a release-treated polyethylene terephthalate film so as to have a thickness of 10 μm after drying. After drying at 110 ° C for 3 minutes, it was bonded to the base film a-2 to prepare an adhesive tape (3) having an adhesive layer formed on the base film.

(2) Fabrication of the adhesive layer

(adhesive layer composition c-1)

50% by epoxy resin "1002" (Mitsubishi Chemical Co., Ltd., trade name, solid bisphenol A epoxy resin, epoxy equivalent 600) And epoxy resin "806" (manufactured by Mitsubishi Chemical Corporation, trade name, bisphenol F epoxy resin, epoxy equivalent 160, specific gravity 1.20) 100 parts by mass, and hardener "Dyhard (registered trademark) 100SF" ( 5 parts by mass of Evonik Degussa Co., Ltd., trade name, dicyandiamide), cerium oxide filler "SO-C2" (trade name of Admafine, average particle diameter: 0.5 μm), 150 parts by mass, and cerium oxide filler MEK was added to the composition of 5 parts by mass of "Aerosil R972" (manufactured by Nippon Aerosil Co., Ltd., trade name, average particle diameter of primary particle diameter: 0.016 μm), and the mixture was stirred and mixed to obtain a uniform composition.

100 parts by mass of a phenoxy resin "PKHH" (manufactured by INCHEM, trade name, mass average molecular weight: 52,000, glass transition temperature: 92 ° C), and "KBM-802" as a coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., "Curezol 2PHZ-PW" (trade name, 2-phenyl-4,5-two, manufactured by Shikoku Chemicals Co., Ltd.), which is a product of the product name, mercaptopropyltrimethoxydecane, 0.4 parts by mass, and a hardening accelerator. Hydroxymethylimidazole, decomposition temperature 230 ° C) 0.5 parts by mass, stirred and mixed until homogeneous. Further, it was filtered with a 100 mesh filter and vacuum defoamed to obtain a paint of the adhesive layer composition c-1.

<Binder layer (1)>

On the separator formed of the release-treated polyethylene terephthalate film, the adhesive layer composition c-1 was applied so as to have a thickness of 5 μm after drying, and dried at 110 ° C. In a minute, a film of the adhesive layer (1) was formed on the separator.

(3) Metal layer

As the metal layer, the following are prepared.

<metal layer (1)>

TQ-M4-VSP (trade name, manufactured by Mitsui Mining Co., Ltd., thickness 12μm, surface roughness Rz0.6μm)

<metal layer (2)>

F0-WS (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 12μm, surface roughness Rz1.3μm)

<metal layer (3)>

GTS-MP (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 35 μm, surface roughness Rz11.0 μm)

(4) Fabrication of substrate tape

As the resin film, the following were produced.

(Resin film d-1)

Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (Kuraray Co., Ltd., trade name "Septon KF-2104") and homopolypropylene (PP) (Ube Hiroshi Co., Ltd.) The resin beads obtained by mixing at a mixing ratio of 40:60 were melted at 200 ° C, and formed into an elongated film having a thickness of 90 μm by an extruder to prepare a resin film d- 1.

(Resin film d-2)

The resin beads of polyethylene terephthalate (PET) (trade name "Cosmoshine (registered trademark) A4100" manufactured by Toyobo Co., Ltd.) were melted at 260 ° C, and formed into an elongated film having a thickness of 50 μm using an extruder. In the form of a resin film d-2.

(Adhesive layer composition e-1 for base tape)

The acrylic copolymer (A3) having a functional group is prepared by 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, and the ratio of 2-ethylhexyl acrylate is 70 mol. An acrylic copolymer (a3) having an ear%, a mass average molecular weight of 500,000, a glass transition temperature of -50 ° C, a hydroxyl value of 30 gKOH/g, and an acid value of 5 mgKOH/g.

8 parts by mass of a polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was added to 100 parts by mass of the acrylic copolymer (a3), dissolved in ethyl acetate, and stirred to obtain a substrate. The adhesive layer composition e-1 for the adhesive tape.

(Adhesive layer composition e-2 for base tape)

The acrylic copolymer (A4) having a functional group is prepared from lauryl acrylate, 2-hydroxyethyl acrylate, and methacrylic acid, and the ratio of lauryl acrylate is 80 mol%, and the mass average molecular weight is 500,000. An acrylic copolymer (a4) having a glass transition temperature of 10 ° C, a hydroxyl group value of 40 gKOH/g, and an acid value of 5 mgKOH/g.

Addition to 100 parts by mass of the acrylic copolymer (a4) 10 parts by mass of a polyisocyanate-based compound (trade name "CORONATE L", manufactured by Tosoh Corporation) was dissolved in ethyl acetate and stirred to obtain an adhesive layer composition e-2 for a base tape.

<Substrate tape (1)>

The prepared substrate tape adhesive layer composition e-1 was applied to a release liner made of a release-treated polyethylene terephthalate film to a thickness of 10 μm after drying. After the coating was dried at 110 ° C for 3 minutes, the resin film d-1 was bonded to the resin film d-1 to form a base tape (1) on which a pressure-sensitive adhesive layer for a base tape was formed.

<Substrate tape (2)>

The prepared substrate tape adhesive layer composition e-2 was applied to a release liner made of a release-treated polyethylene terephthalate film to a thickness of 10 μm after drying. After the coating was dried at 110 ° C for 3 minutes, the resin film d-1 was bonded to the resin film to form a base tape (2) on which a pressure-sensitive adhesive layer for a base tape was formed.

<Substrate tape (3)>

The prepared substrate tape adhesive layer composition e-2 was applied to a release liner made of a release-treated polyethylene terephthalate film to a thickness of 10 μm after drying. After the coating was dried at 110 ° C for 3 minutes, the resin film d-2 was bonded to the resin film d-2 to form a base tape (3) on which a pressure-sensitive adhesive layer for a base tape was formed.

(5) Fabrication of tape for electronic device packaging

<Example 1>

The metal layer (1) obtained in the above manner and the adhesive layer (1) side of the adhesive layer (1) with a separator are attached at a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s. After that, the base tape (1) was bonded to the metal layer at a bonding angle of 120°, a pressure of 0.2 MPa, and a speed of 10 mm/s (bonding step). Next, the separator is peeled off from the adhesive layer, and the adhesive layer and the metal layer are pre-cut into a circular shape having a diameter of 320 mm from the surface of the adhesive layer to the substrate tape using a press cutter, and the periphery is Do not remove part of the tape from the substrate (1 pre-cut step).

Thereafter, the adhesive tape (1) is laminated on the surface of the adhesive layer side so as to be in contact with the metal layer provided on the substrate tape and the adhesive layer side of the adhesive layer (adhesive tape lamination step). Next, the adhesive tape (1) is pre-cut into a circular shape having a diameter of 370 mm so as to be concentric with the metal layer and the adhesive layer, and the unnecessary portion is removed from the substrate tape to be removed (2 pre-cut steps) The roll of 100 pieces of the metal layer, the adhesive layer, and the adhesive tape was wound, and the roll body of the tape for electronic device package of Example 1 shown in FIG.

<Examples 2 to 17 and Comparative Examples 1 to 10>

In addition to the combination of the adhesive tape, the adhesive layer composition, the metal layer, and the substrate tape, as shown in Tables 1 and 2, In the same manner, the roll bodies of the tapes for electronic device packaging of Examples 2 to 17 and Comparative Examples 1 to 10 were produced.

The following measurements and evaluations were performed on the tapes for electronic device packaging of Examples 1 to 17 and Comparative Examples 1 to 10. The results are shown in Tables 1 and 2.

The adhesion was measured in the following order according to JIS Z0237.

(Adhesive force of the substrate tape and the metal layer P1)

A test piece having a width of 25 mm and a length of 300 mm was taken from the base sheet of each of the examples and the comparative examples, and these were attached to the laminate of the metal layer, the adhesive layer, and the adhesive tape of each of the examples and the comparative examples. After the surface of the metal layer, 2 kg of the rubber roller was returned three times and pressure-bonded, and left for 1 hour as a sample. The measured value was measured using a tensile tester in accordance with JIS B 7721 in the range of 15 to 85% of its capacity. The measurement was carried out using a 180° tearing method, at which time the stretching speed was set to 300 mm/min. The measurement temperature was 23 ° C and the measured humidity was 50%. The average of the three points is shown in Tables 1 and 2.

(Adhesive force of substrate tape and adhesive tape P2)

A test piece having a width of 25 mm and a length of 300 mm was taken from the base sheet of each of the examples and the comparative examples, and the surface was attached to the surface of the adhesive layer of the adhesive tape of each of the examples and the comparative examples, and then a 2 kg rubber roller was used. Three times came back for crimping and left for 1 hour as a sample. The measured value is used in its capacity The adhesion test was performed in accordance with JIS B 7721 tensile tester in the range of 15 to 85%. The measurement was carried out by a 180° tearing method, and the stretching speed was set to 300 mm/min. The measurement temperature was 23 ° C and the measured humidity was 50%. The average of the three points is shown in Tables 1 and 2.

(precut processing)

In the production process of the tape for electronic device packaging of each of the examples and the comparative examples, the lamination state of the metal tape to the substrate tape was visually observed. The metal layer is not completely peeled off or partially peeled off from the substrate tape, and a laminate of a circular metal layer, an adhesive layer, and an adhesive tape can be formed at a specific position on the substrate tape as an excellent product. ◎ When the maximum width of partial peeling was less than 0.5 mm, it was evaluated as ○, and when it was 0.5 mm or more and less than 1 mm, it was evaluated as Δ, and when it was 1 mm or more, it was evaluated as ×. Further, after the metal layer and the adhesive layer are punched into a circular shape, when the peripheral portion is not peeled off from the base tape, and/or the adhesive tape is punched into a circular shape, the peripheral portion is not partially taped from the substrate. When peeling, it is not possible to peel off automatically by the pre-cutting device, and it is also evaluated as × as a defective product.

(loop frame fit)

For the electronic device encapsulating tape of the examples of the metal layer, the adhesive layer, and the adhesive tape, and the adhesive tape for electronic device packaging of the comparative example, the bonding apparatus (Disco 2700 by Disco Co., Ltd.) was used, and 50 laminated bodies were self-assembled. The substrate tape was peeled off, and the bonding to the annular frame was tried. 50 layers All the joints have no wrinkles and can be attached to the annular frame. As a good product, it is evaluated as ◎, although some wrinkles will be generated, but in the subsequent cutting process and die bonding process, it is caused by The defect rate of wrinkles is less than 5% of the total, and it is evaluated as ○. In the cutting process and the die bonding process, the defect rate due to wrinkles is 5% or more and less than 10% is acceptable. The evaluation was Δ. In the cutting process and the die bonding process, the defect rate due to wrinkles was 10% or more, and it was evaluated as ×.

As shown in Table 1, the adhesive tape for the electronic device package of Examples 1 to 17, the adhesion force P1 of the substrate tape and the metal layer is 0.01 to 0.3 N/25 mm, which is 0.01 to 0.5 N/25 mm as specified in the request. The adhesive force P2 of the adhesive tape and the adhesive tape is 0.01~0.5N/25mm as specified in the request, and the ratio P1/P2 of the adhesive force P1 of the substrate tape to the metal layer and the adhesive force P2 of the substrate tape and the adhesive tape is 0.1. ~8, which is 0.1 to 10 in the request, so the pre-cut workability and the loop frame fit are good results.

On the other hand, as shown in Table 2, in the tape for electronic device packaging of Comparative Example 1, the adhesion force P1 of the substrate tape and the metal layer was more than 0.5 N/25 mm, and the adhesive force P2 of the substrate tape and the adhesive tape was more than 0.5. N/25mm, after the metal layer and the adhesive layer are punched into a circular shape, and the adhesive tape is punched into a circular shape, it is difficult to peel off the peripheral portion from the base tape, resulting in poor pre-cut workability. . Further, when bonded to the annular frame, an excessive force was applied to the peeling direction of the base tape, and wrinkles were formed in the laminate of the metal layer and the adhesive layer, and the annular frame adhesion was also poor.

In the tapes for electronic device packaging of Comparative Examples 2 and 3, the adhesive force P2 of the substrate tape and the adhesive tape is more than 0.5 N/25 mm. Therefore, after the adhesive tape is punched into a circular shape, it is difficult to partially remove the peripheral tape from the substrate. Peeling is a result of poor pre-cut workability. And the annular frame fit is also a bad result.

In the tape for electronic device packaging of Comparative Example 4, the adhesion force P1 between the substrate tape and the metal layer is less than 0.01 N/25 mm, so the pre-cutting is performed. The peeling of the metal layer occurs during the working, and the ratio of the adhesion force P1 between the substrate tape and the metal layer and the adhesion force P2 between the substrate tape and the adhesive tape is less than 0.1 as a result of poor pre-cut workability, and thus the ring shape is Frame fit is also a bad result.

In the tapes for electronic device packaging of Comparative Examples 5 and 7, the adhesion force P1 between the substrate tape and the metal layer was more than 0.5 N/25 mm, which was a result of poor precut workability.

In the tape for electronic device packaging of Comparative Example 6, the adhesion force P1 between the substrate tape and the metal layer was less than 0.01 N/25 mm, which was a result of poor precut workability.

In the tape for electronic device packaging of Comparative Example 9, the adhesive force P2 of the substrate tape and the adhesive tape is less than 0.01 N/25 mm, so that air enters between the adhesive tape and the substrate tape, and when the annular frame is attached, The peeling of the material tape makes it impossible to control the tension applied to the tape for electronic device packaging, and wrinkles occur, resulting in poor adhesion of the annular frame.

In the tape for electronic device packaging of Comparative Example 8, the adhesion force P2 of the substrate tape and the adhesive tape is less than 0.01 N/25 mm, the adhesion force between the substrate tape and the metal layer P1, and the adhesion force between the substrate tape and the adhesive tape P2. Since the ratio P1/P2 is more than 10, it is a result of poor adhesion of the ring frame.

In the tape for electronic device packaging of Comparative Example 10, the adhesion force P1 between the substrate tape and the metal layer was less than 0.01 N/25 mm, which was a result of poor precut workability. Further, since the adhesive force P2 of the base tape and the adhesive tape was less than 0.01 N/25 mm, the adhesiveness of the annular frame was poor.

1‧‧‧Electronic device packaging tape

2‧‧‧Substrate tape

3‧‧‧metal layer

4‧‧‧ adhesive layer

5‧‧‧Adhesive tape

5a‧‧‧Label

5b‧‧‧ peripherals

Claims (6)

An adhesive tape for electronic device packaging, comprising: a base tape having an adhesive surface; a metal layer provided on the adhesive surface of the base tape; and having a specific planar shape, the metal layer and the substrate An adhesive layer having a specific planar shape and an adhesive tape having a base film and an adhesive layer, and the adhesive tape having the adhesive layer covering the adhesive layer a label portion having a specific planar shape provided in contact with the substrate tape around the adhesive layer, wherein an adhesive force P1 between the substrate tape and the metal layer is 0.01 to 0.5 N/25 mm, and the substrate tape and the aforementioned The adhesive force P2 of the adhesive tape is 0.01 to 0.5 N/25 mm, and the ratio P1/P2 of the adhesion force P1 between the substrate tape and the metal layer and the adhesion force P2 between the substrate tape and the adhesive tape is 0.1 to 10. The tape for electronic device packaging of claim 1, wherein the metal layer comprises copper or aluminum. The tape for electronic device packaging according to claim 1 or claim 2, wherein the substrate tape has a resin film and an adhesive layer for a base tape provided on one surface of the resin film. The tape for electronic device encapsulation of claim 3, wherein the adhesive layer for the base tape comprises an acrylate comprising a CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), and a hydroxyl group-containing An acrylic polymer composed of a monomer and an isocyanate compound. The tape for electronic device packaging according to any one of claims 1 to 4, wherein the adhesive layer comprises (A) an epoxy resin, (B) a hardener, (C) an acrylic resin or a phenoxy resin, and D) Surface treated inorganic filler. The tape for electronic device encapsulation according to any one of claims 1 to 5, wherein the adhesive layer contains an acrylate comprising CH ₂ =CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms) An acrylic polymer comprising a hydroxyl group-containing monomer and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.