TWI340446B - Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip - Google Patents

Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip

Info

Publication number
TWI340446B
TWI340446B TW094147750A TW94147750A TWI340446B TW I340446 B TWI340446 B TW I340446B TW 094147750 A TW094147750 A TW 094147750A TW 94147750 A TW94147750 A TW 94147750A TW I340446 B TWI340446 B TW I340446B
Authority
TW
Taiwan
Prior art keywords
substrate strip
semiconductor packaging
during semiconductor
preventing warpage
strip during
Prior art date
Application number
TW094147750A
Other languages
Chinese (zh)
Other versions
TW200725858A (en
Inventor
Chia Hsu Lin
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094147750A priority Critical patent/TWI340446B/en
Publication of TW200725858A publication Critical patent/TW200725858A/en
Application granted granted Critical
Publication of TWI340446B publication Critical patent/TWI340446B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
TW094147750A 2005-12-30 2005-12-30 Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip TWI340446B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094147750A TWI340446B (en) 2005-12-30 2005-12-30 Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094147750A TWI340446B (en) 2005-12-30 2005-12-30 Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip

Publications (2)

Publication Number Publication Date
TW200725858A TW200725858A (en) 2007-07-01
TWI340446B true TWI340446B (en) 2011-04-11

Family

ID=55855740

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147750A TWI340446B (en) 2005-12-30 2005-12-30 Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip

Country Status (1)

Country Link
TW (1) TWI340446B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685082B (en) * 2017-03-08 2020-02-11 聯發科技股份有限公司 Semiconductor package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016140793A1 (en) * 2015-03-03 2016-09-09 Intel Corporation Electronic package that includes multi-layer stiffener
JP6422462B2 (en) * 2016-03-31 2018-11-14 古河電気工業株式会社 Electronic device packaging tape
CN108231700B (en) * 2016-12-21 2020-03-03 苏州迈瑞微电子有限公司 Chip packaging structure and method
US10541211B2 (en) 2017-04-13 2020-01-21 International Business Machines Corporation Control warpage in a semiconductor chip package
JP7266036B2 (en) * 2018-07-26 2023-04-27 日本碍子株式会社 Temporary fixing substrate, temporary fixing method, and method for manufacturing electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685082B (en) * 2017-03-08 2020-02-11 聯發科技股份有限公司 Semiconductor package

Also Published As

Publication number Publication date
TW200725858A (en) 2007-07-01

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