SG11201811266XA - Pressure-sensitive adhesive, pressure-sensitive adhesive film, pressure-sensitive adhesive tapes, and film substrates - Google Patents

Pressure-sensitive adhesive, pressure-sensitive adhesive film, pressure-sensitive adhesive tapes, and film substrates

Info

Publication number
SG11201811266XA
SG11201811266XA SG11201811266XA SG11201811266XA SG11201811266XA SG 11201811266X A SG11201811266X A SG 11201811266XA SG 11201811266X A SG11201811266X A SG 11201811266XA SG 11201811266X A SG11201811266X A SG 11201811266XA SG 11201811266X A SG11201811266X A SG 11201811266XA
Authority
SG
Singapore
Prior art keywords
pressure
sensitive adhesive
film
tapes
substrates
Prior art date
Application number
SG11201811266XA
Inventor
Koji Shitara
Souya Jo
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG11201811266XA publication Critical patent/SG11201811266XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

Provided is a pressure-sensitive adhesive that has a sufficient adhesive strength and is reduced in high-temperature strain. Also provided is a pressure-sensitive adhesive tape including such pressure-sensitive adhesive. Also provided is a film substrate including such pressure-sensitive adhesive. Also provided is a pressure-sensitive adhesive film that has a sufficient adhesive strength and is reduced in high-temperature strain. Also provided is a pressure-sensitive adhesive tape including such pressure-sensitive adhesive film. Also provided is a film substrate including such pressure-sensitive adhesive film. The pressure-sensitive adhesive of the present invention has an adhesive strength to a surface of a polyimide film of 1 N or more, and a storage modulus of elasticity G ʹ at 160°C of 1×10 5 Pa or more. The pressure-sensitive adhesive film of the present invention has an adhesive strength to a surface of a polyimide film of 1 N or more, a storage modulus of elasticity G ʹ at 160°C of 1×10 4 Pa or more, and a thickness of 20 μm or less .
SG11201811266XA 2016-07-19 2017-07-13 Pressure-sensitive adhesive, pressure-sensitive adhesive film, pressure-sensitive adhesive tapes, and film substrates SG11201811266XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016141197 2016-07-19
JP2016141196 2016-07-19
PCT/JP2017/025564 WO2018016416A1 (en) 2016-07-19 2017-07-13 Pressure-sensitive adhesive, pressure-sensitive adhesive film, pressure-sensitive adhesive tapes, and film substrates

Publications (1)

Publication Number Publication Date
SG11201811266XA true SG11201811266XA (en) 2019-01-30

Family

ID=60993016

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811266XA SG11201811266XA (en) 2016-07-19 2017-07-13 Pressure-sensitive adhesive, pressure-sensitive adhesive film, pressure-sensitive adhesive tapes, and film substrates

Country Status (6)

Country Link
JP (1) JP6375467B2 (en)
KR (1) KR102047204B1 (en)
CN (1) CN109476977B (en)
SG (1) SG11201811266XA (en)
TW (1) TWI649397B (en)
WO (1) WO2018016416A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019201696A1 (en) * 2018-04-20 2019-10-24 Basf Se Adhesive composition having a gel content based on cross-linking via keto groups or aldehyde groups
KR102099071B1 (en) * 2019-05-09 2020-05-18 길화소재 주식회사 Adhesive film for protecting semiconductor wafer and preparation method thereof
JP2022051105A (en) * 2020-09-18 2022-03-31 スリーエム イノベイティブ プロパティズ カンパニー Liquid adhesive, laminate, and method of producing semiconductor chip
JP2024007852A (en) 2022-07-06 2024-01-19 日東電工株式会社 Optical member having surface protective film, optical laminate, and manufacturing method of optical device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4766776B2 (en) * 2001-05-22 2011-09-07 日東電工株式会社 Adhesive sheet for fixing flexible printed wiring board and method for mounting electronic component on flexible printed wiring board
JP4515357B2 (en) * 2005-01-27 2010-07-28 リンテック株式会社 Adhesive for polarizing plate, polarizing plate with adhesive and method for producing the same
JP5328103B2 (en) * 2007-01-16 2013-10-30 ソマール株式会社 Cooling peelable pressure-sensitive adhesive composition and cooling peelable pressure sensitive adhesive sheet using the same
JP5522935B2 (en) * 2008-12-26 2014-06-18 ソマール株式会社 Adhesive composition and adhesive sheet
JP5600039B2 (en) 2010-07-05 2014-10-01 帝人デュポンフィルム株式会社 Flexible printed circuit board reinforcing film, flexible printed circuit reinforcing plate comprising the same, and flexible printed circuit board laminate comprising the same
JP2014047254A (en) * 2012-08-30 2014-03-17 Nitto Denko Corp Double-sided adhesive sheet, laminate and removal method of plate
JP6363930B2 (en) * 2014-10-10 2018-07-25 日東電工株式会社 Optical film with adhesive, method for producing the same, and method for producing an image display device
TWI692519B (en) * 2015-06-11 2020-05-01 日商三井化學東賽璐股份有限公司 Electronic parts protection film, electronic parts protection member, electronic parts manufacturing method and packaging manufacturing method

Also Published As

Publication number Publication date
CN109476977A (en) 2019-03-15
WO2018016416A1 (en) 2018-01-25
JP6375467B2 (en) 2018-08-15
KR20190003791A (en) 2019-01-09
JPWO2018016416A1 (en) 2018-07-19
CN109476977B (en) 2021-04-06
TWI649397B (en) 2019-02-01
TW201811956A (en) 2018-04-01
KR102047204B1 (en) 2019-11-20

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