SG10201708895QA - Sheet, tape, and method for manufacturing semiconductor device - Google Patents

Sheet, tape, and method for manufacturing semiconductor device

Info

Publication number
SG10201708895QA
SG10201708895QA SG10201708895QA SG10201708895QA SG10201708895QA SG 10201708895Q A SG10201708895Q A SG 10201708895QA SG 10201708895Q A SG10201708895Q A SG 10201708895QA SG 10201708895Q A SG10201708895Q A SG 10201708895QA SG 10201708895Q A SG10201708895Q A SG 10201708895QA
Authority
SG
Singapore
Prior art keywords
sheet
present disclosure
accordance
tape
semiconductor device
Prior art date
Application number
SG10201708895QA
Inventor
Kimura Ryuichi
Shiga Goji
Takamoto Naohide
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201708895QA publication Critical patent/SG10201708895QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

SHEET, TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [PROBLEM] The present disclosure provides a sheet permitting application of marks having excellent endurance regardless of whether curing is carried out. [SOLUTION MEANS] A sheet in accordance with the present disclosure comprises a dicing film comprising a base layer and an adhesive layer disposed on the base layer. A sheet in accordance with the present disclosure further comprises a semiconductor backside protective film disposed on the adhesive layer. At a sheet in accordance with the present disclosure, the amount of exothermic heat generated at exothermic peak(s) between ° C and 300° C in the DSC curve produced by DSC measurement of the semiconductor backside protective film is not greater than 40 J/g. [SELECTED DRAWING] FIG. 1 28
SG10201708895QA 2016-11-14 2017-10-30 Sheet, tape, and method for manufacturing semiconductor device SG10201708895QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016221438A JP6812212B2 (en) 2016-11-14 2016-11-14 Manufacturing methods for sheets, tapes and semiconductor devices

Publications (1)

Publication Number Publication Date
SG10201708895QA true SG10201708895QA (en) 2018-06-28

Family

ID=62172118

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201708895QA SG10201708895QA (en) 2016-11-14 2017-10-30 Sheet, tape, and method for manufacturing semiconductor device

Country Status (5)

Country Link
JP (1) JP6812212B2 (en)
KR (1) KR102430188B1 (en)
CN (1) CN108091604B (en)
SG (1) SG10201708895QA (en)
TW (1) TWI750246B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102208065B1 (en) * 2019-01-04 2021-01-27 주식회사 프로텍 System for Laser Bonding of Flip Chip
JP7478524B2 (en) * 2019-09-05 2024-05-07 リンテック株式会社 Film for forming protective film, composite sheet for forming protective film, and method for manufacturing workpiece with protective film
JP2023147738A (en) 2022-03-30 2023-10-13 リンテック株式会社 Film for forming protective coat, composite sheet for forming protective coat, method for manufacturing semiconductor device, and use of film for forming protective coat

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885325B2 (en) 2009-05-29 2016-03-15 日東電工株式会社 Dicing tape integrated semiconductor backside film
JP5456642B2 (en) 2009-12-24 2014-04-02 日東電工株式会社 Flip chip type film for semiconductor backside
JP5501938B2 (en) * 2009-12-24 2014-05-28 日東電工株式会社 Flip chip type film for semiconductor backside
JP5367656B2 (en) * 2010-07-29 2013-12-11 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
JP5662810B2 (en) * 2011-01-14 2015-02-04 リンテック株式会社 Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device
JP5820170B2 (en) * 2011-07-13 2015-11-24 日東電工株式会社 Adhesive film for semiconductor device, flip chip type semiconductor back film, and dicing tape integrated semiconductor back film
JP5930625B2 (en) * 2011-08-03 2016-06-08 日東電工株式会社 Die bond film, dicing die bond film, and semiconductor device
TWI583760B (en) * 2012-08-02 2017-05-21 Lintec Corp A film-like adhesive, a bonding sheet for semiconductor bonding, and a method of manufacturing the semiconductor device
CN104685609B (en) * 2012-10-05 2018-06-08 琳得科株式会社 Manufacturing method with the cambial slice of protective film and chip
JP5931700B2 (en) * 2012-11-13 2016-06-08 信越化学工業株式会社 Protective film for semiconductor wafer and method for manufacturing semiconductor chip
JP6431343B2 (en) * 2014-11-21 2018-11-28 日東電工株式会社 Adhesive sheet, adhesive sheet with dicing sheet, laminated sheet, and method for manufacturing semiconductor device
JP6415383B2 (en) * 2015-04-30 2018-10-31 日東電工株式会社 Back surface protective film, integrated film, film, method for manufacturing semiconductor device and method for manufacturing protective chip for protecting back surface of semiconductor element

Also Published As

Publication number Publication date
KR102430188B1 (en) 2022-08-08
TW201833270A (en) 2018-09-16
KR20180054462A (en) 2018-05-24
TWI750246B (en) 2021-12-21
JP6812212B2 (en) 2021-01-13
JP2018081953A (en) 2018-05-24
CN108091604B (en) 2023-05-12
CN108091604A (en) 2018-05-29

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