MY180133A - Pressure-sensitive adhesive tape for semiconductor substrate fabrication - Google Patents

Pressure-sensitive adhesive tape for semiconductor substrate fabrication

Info

Publication number
MY180133A
MY180133A MYPI2018001762A MYPI2018001762A MY180133A MY 180133 A MY180133 A MY 180133A MY PI2018001762 A MYPI2018001762 A MY PI2018001762A MY PI2018001762 A MYPI2018001762 A MY PI2018001762A MY 180133 A MY180133 A MY 180133A
Authority
MY
Malaysia
Prior art keywords
pressure
sensitive adhesive
semiconductor substrate
adhesive tape
substrate fabrication
Prior art date
Application number
MYPI2018001762A
Inventor
Yoshinori Nagao
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY180133A publication Critical patent/MY180133A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication of the present invention includes a base material (4) and a pressure-sensitive adhesive layer (2) laminated on one surface of the base material (4), in which the base material (4) has a notched layer (41) positioned on the one surface side and an expansion layer (42) laminated on the other surface of the notched layer (41) , and the expansion layer (42) has a tack strength equal to or higher than (1) kPa and equal to or lower than (200) kPa at 80?C. In a case where the above constitution is adopted, it is possible to provide a pressure-sensitive adhesive tape (100) for semiconductor substrate fabrication that makes it possible to reliably prevent the occurrence of warpage in a dicing step and to inhibit or prevent the expansion layer (42) from being fused with a dicing table. (Figure 3)
MYPI2018001762A 2016-05-12 2017-05-02 Pressure-sensitive adhesive tape for semiconductor substrate fabrication MY180133A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016096045 2016-05-12
JP2016127070 2016-06-27

Publications (1)

Publication Number Publication Date
MY180133A true MY180133A (en) 2020-11-23

Family

ID=60267119

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018001762A MY180133A (en) 2016-05-12 2017-05-02 Pressure-sensitive adhesive tape for semiconductor substrate fabrication

Country Status (6)

Country Link
JP (1) JP6278164B1 (en)
CN (1) CN109328219B (en)
MY (1) MY180133A (en)
PH (1) PH12018502253A1 (en)
TW (1) TWI697947B (en)
WO (1) WO2017195711A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5906199B2 (en) 2010-03-08 2016-04-20 コルテック，インコーポレーテッド Molding method of multilayer polymer product for controlling breakthrough of core layer
US10759101B2 (en) 2014-01-24 2020-09-01 Milacron Llc Co-injection molded multi-layer article with injection-formed aperture between gate area and peripheral edge
JP7154686B2 (en) * 2018-06-06 2022-10-18 株式会社ディスコ Wafer processing method
JPWO2020158770A1 (en) * 2019-01-31 2021-12-02 リンテック株式会社 Expanding method and manufacturing method of semiconductor devices
CN110699000A (en) * 2019-10-11 2020-01-17 上海固柯胶带科技有限公司 Film material for grinding and packaging semiconductor
JP7488074B2 (en) * 2020-03-17 2024-05-21 日本カーバイド工業株式会社 Adhesive composition and protective tape
JP2022079444A (en) * 2020-11-16 2022-05-26 三菱ケミカル株式会社 Laminate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027474A (en) * 2005-07-19 2007-02-01 Denki Kagaku Kogyo Kk Base material film for wafer full-cut dicing tape, and wafer full-cut dicing tape using the film
JP2007031535A (en) * 2005-07-26 2007-02-08 Denki Kagaku Kogyo Kk Pressure-sensitive adhesive sheet and manufacturing process of electronic component
JP6146616B2 (en) * 2013-10-31 2017-06-14 住友ベークライト株式会社 Dicing substrate film, dicing film, and semiconductor chip manufacturing method
JP5603453B1 (en) * 2013-04-26 2014-10-08 古河電気工業株式会社 Adhesive tape for semiconductor wafer protection
JP5828990B2 (en) * 2013-09-30 2015-12-09 リンテック株式会社 Composite sheet for resin film formation
JP5607847B1 (en) * 2013-11-29 2014-10-15 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP2016018810A (en) * 2014-07-04 2016-02-01 積水化学工業株式会社 Dicing-die-bonding tape
JP2016018811A (en) * 2014-07-04 2016-02-01 積水化学工業株式会社 Dicing-die-bonding tape
JP6227494B2 (en) * 2014-07-14 2017-11-08 ダイヤプラスフィルム株式会社 Base film used for adhesive film for semiconductor manufacturing process
JP6293012B2 (en) * 2014-07-28 2018-03-14 グンゼ株式会社 Dicing substrate film and dicing film using the same
TWI706023B (en) * 2014-08-22 2020-10-01 日商琳得科股份有限公司 Sheet for forming protective film and method of manufacturing tip having protective film

Also Published As

Publication number Publication date
PH12018502253B1 (en) 2019-08-19
WO2017195711A1 (en) 2017-11-16
CN109328219B (en) 2020-04-28
PH12018502253A1 (en) 2019-08-19
CN109328219A (en) 2019-02-12
JPWO2017195711A1 (en) 2018-05-31
JP6278164B1 (en) 2018-02-14
TWI697947B (en) 2020-07-01
TW201742132A (en) 2017-12-01

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