JP6146616B2 - Dicing substrate film, dicing film, and semiconductor chip manufacturing method - Google Patents

Description

  The present disclosure relates to a substrate film for dicing, a dicing film, and a method for manufacturing a semiconductor chip.

  As a method for manufacturing a semiconductor chip, there is known a method in which a semiconductor member such as a semiconductor wafer is manufactured in a large area in advance and then diced (cut and separated) into chips to pick up chips separated by dicing. . In the dicing process, a dicing film is used to fix the semiconductor wafer.

  The dicing film is generally composed of a dicing substrate film cut by a dicing blade and an adhesive layer for fixing the semiconductor wafer. The semiconductor wafer fixed to the dicing film is diced into chips, and then the dicing film is expanded (expanded) to separate the chips, and the semiconductor chips are picked up.

  By the way, since the cutting waste (base material waste) derived from the dicing film generated in the dicing process contaminates the semiconductor wafer and reduces the yield of the semiconductor chips, it is necessary to reduce the generation of the cutting waste as much as possible. Further, in order to improve the picking accuracy of the semiconductor chip and further improve the productivity, the dicing film can be uniformly and smoothly expanded without being torn or cut (hereinafter referred to as expandability). Is also required. In addition, the dicing film is usually manufactured, stored, transported and wound in a roll shape. However, when blocking between the films occurs, the quality deteriorates, and thus blocking resistance is also required.

  Various dicing films have been proposed for such demands. For example, in Patent Document 1, a surface formed from a resin component containing a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer hydrogenated product: 60 to 90% by weight and a polystyrene resin: 10 to 40% by weight A dicing film having a substrate film for dicing having a layer has been proposed.

JP2013-55112A

  However, the conventional dicing film has an insufficient effect of suppressing the generation of cutting waste, and there is still room for improvement.

  In addition, the expanded dicing film is accommodated in the ring cassette. In consideration of the film storability, the dicing film can be restored to a size that can be easily accommodated in the ring cassette (hereinafter referred to as restoration property). )) Is desired. However, the conventional dicing film does not provide sufficient restoration.

  Therefore, in one or a plurality of embodiments, the present disclosure provides a dicing base film and a dicing film that are excellent in expandability and restoration property and have a high effect of suppressing generation of cutting waste during dicing.

  In one or a plurality of embodiments, the present disclosure is a substrate film for dicing that includes a base material layer and a surface layer disposed on one main surface of the base material layer, and the surface layer is made of polystyrene. A base for dicing, comprising: a vinyl resin, a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof, and the content of the polystyrene resin in the surface layer exceeds 50% by weight Related to film.

  In one or a plurality of embodiments, the present disclosure relates to a dicing film in which an adhesive layer is provided on a main surface on the surface layer side of the substrate film for dicing of the present disclosure.

  In one or a plurality of embodiments, the present disclosure includes an attaching step of attaching the dicing film of the present disclosure and a semiconductor member, a dicing step of dicing the semiconductor member into pieces, and expanding the dicing film, The present invention relates to a method for manufacturing a semiconductor chip, which includes an expanding step of expanding between the separated semiconductor members adjacent to each other and a pickup step of picking up the separated semiconductor members.

  According to the present disclosure, in one or a plurality of embodiments, it is possible to provide a dicing substrate film and a dicing film that are excellent in expandability and recoverability and have a high effect of suppressing generation of cutting waste during dicing.

FIG. 1 is a schematic cross-sectional view illustrating an example of a dicing substrate according to the present disclosure.

  The present disclosure is based on the knowledge that in the dicing process, a part of the dicing film is cut together with the semiconductor member, so that a part of the dicing film is melted by frictional heat and leads to generation of cutting chips. Further, the present disclosure provides a surface layer containing a polystyrene-based resin and a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof on a base material layer, and a dicing blade is provided only on the surface layer. Based on the knowledge that cutting waste can be significantly reduced by cutting.

  That is, in one aspect, the present disclosure is a substrate film for dicing including a base material layer and a surface layer disposed on one main surface of the base material layer, wherein the surface layer is a polystyrene resin. And a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof, and the content of the polystyrene resin in the surface layer is more than 50% by weight. .

  According to the dicing substrate film of the present disclosure, in one or a plurality of embodiments, it is possible to provide a dicing substrate film that is excellent in expandability and recoverability and has a high effect of suppressing generation of cutting waste during dicing.

  Hereinafter, the dicing substrate film of the present disclosure will be described in detail.

  FIG. 1 is a schematic cross-sectional view illustrating an example of the configuration of a dicing substrate film of the present disclosure. As shown in FIG. 1, the substrate film for dicing 10 of the present disclosure includes a base material layer 11 and a surface layer 12 disposed on one main surface of the base material layer 11. A dicing film 20 is obtained by further providing a pressure-sensitive adhesive layer 13 on the surface layer 12 of the substrate film 10 for dicing.

  Hereinafter, each layer constituting the dicing substrate film of the present disclosure will be described in detail.

<Surface layer>
In one or a plurality of embodiments, the surface layer constituting the dicing substrate film of the present disclosure is a cut layer cut by a dicing blade. The surface layer contains a polystyrene resin and a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof.

[Polystyrene resin]
Although it does not specifically limit as polystyrene-type resin, In one or some embodiment, general purpose polystyrene resin, impact-resistant polystyrene resin, or a mixture thereof etc. are mentioned. The “universal polystyrene” in the present disclosure is usually a styrene homopolymer. “Impact-resistant polystyrene” generally refers to general-purpose polystyrene added with a rubber component such as butadiene. In one or a plurality of embodiments, fine rubber-like particles are blended or grafted into a polystyrene matrix. It has a polymerized structure.

  The content of the polystyrene-based resin in the surface layer is, in one or more embodiments, more than 50% by weight, preferably 60% by weight or more, from the viewpoint of improving blocking resistance and suppressing generation of cutting waste. It is. Moreover, from a viewpoint which can improve the expandability and restoring property of a film, Preferably it is 85 weight% or less, More preferably, it is 80 weight% or less.

[Vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer]
In the present disclosure, the vinyl aromatic hydrocarbon refers to an aromatic hydrocarbon having at least one vinyl group. In one or more embodiments, the vinyl aromatic hydrocarbon includes styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylethylene, N, N-dimethyl-p-aminoethylstyrene, N, N-diethyl-p-aminoethylstyrene and the like can be mentioned. These can be used individually by 1 type or in mixture of 2 or more types. Among these, styrene is preferable.

  A conjugated diene hydrocarbon refers to a diolefin having a pair of conjugated double bonds. In one or more embodiments, the conjugated diene hydrocarbon includes 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3- Examples include pentadiene, 2-methyl-1,3-pentadiene, and 1,3-hexadiene. These can be used individually by 1 type or in mixture of 2 or more types. Among these, 1,3-butadiene is preferable.

  The vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer is a hydrogenated product from the viewpoint of suppressing the oxidative deterioration caused by the presence of double bonds in the conjugated diene hydrocarbon and increasing the strength of the film. It is preferable.

  In the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer, a double bond derived from a conjugated diene hydrocarbon is saturated by hydrogenation (for example, hydrogenation with a nickel catalyst or the like) by a known method. Is preferred. Thereby, in addition to the above-mentioned effects, a more stable resin excellent in heat resistance, chemical resistance, durability and the like can be obtained.

  In one or a plurality of embodiments, the hydrogenation rate of the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer hydrogenated product is 85% or more of the double bond derived from the conjugated diene hydrocarbon in the copolymer. , 90% or more, or 95% or more. The hydrogenation rate can be measured using a nuclear magnetic resonance apparatus (NMR).

  The content of the vinyl aromatic hydrocarbon unit in the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer can improve compatibility with the polystyrene resin, and can improve the expandability of the film. In embodiment, 10 to 50 weight% is preferable and 15 to 45 weight% is more preferable. Moreover, the content of the conjugated diene hydrocarbon unit is 50 to 90% by weight in the content before hydrogenation in one or a plurality of embodiments, from the viewpoint that the expandability of the film and the blocking resistance can be improved. Or it is 55 to 85 weight%.

  In one or more embodiments, the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or the hydrogenated product thereof has a weight average molecular weight (Mw) of 10,000 to 600,000, or 50,000 to 300,000. The weight average molecular weight can be measured using commercially available standard gel permeation chromatography (GPC).

  The content of the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or the hydrogenated product thereof in the resin component forming the surface layer is, in one or more embodiments, a viewpoint capable of improving the expandability and restorability of the film. Therefore, it is preferably 15% by weight or more, more preferably 20% by weight or more. Moreover, from a viewpoint which can improve blocking resistance and can suppress generation | occurrence | production of cutting waste, Preferably it is 50 weight% or less, More preferably, it is less than 50 weight%, More preferably, it is 40 weight% or less.

  The vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer may be in the form of a random copolymer of a styrene monomer and a diene monomer. Or the form of the block copolymer of a styrene-type monomer and a diene-type monomer may be sufficient. Or the form containing both a random copolymer and a block copolymer may be sufficient. The styrene monomer unit content can be measured using an ultraviolet spectrophotometer or a nuclear magnetic resonance apparatus (NMR), and the diene monomer unit content can be measured using a nuclear magnetic resonance apparatus (NMR). It can be measured.

  In one or a plurality of embodiments, the random copolymer and the hydrogenated product thereof can be produced by the method described in JP-A-2004-59741.

  As a block copolymer, in one or a plurality of embodiments, one having a block segment derived from a vinyl aromatic hydrocarbon at one end or both ends of the copolymer, and further having a block segment derived from a conjugated diene hydrocarbon, Or what blended these etc. are mentioned. Specific examples include a styrene-ethylene-butadiene-styrene copolymer (hereinafter also referred to as SEBS). The content of the styrene structural unit in SEBS (hereinafter referred to as St content) is preferably 10% by weight or more from the viewpoint of improving compatibility with the polystyrene resin and improving the film formability of the film. The content is preferably 15% by weight or more, and preferably 50% by weight or less, more preferably 45% by weight or less, from the viewpoint of improving the expandability of the film.

  In one or a plurality of embodiments, the surface layer may contain an antistatic agent, a filler or the like as long as the gist of the invention is not impaired.

  The thickness of the surface layer is preferably thicker than the depth of cut into the surface layer by the dicing blade (hereinafter also referred to as the depth of cut) from the viewpoint of reducing cutting waste. The thickness of the surface layer is 5 to 60 μm or 20 to 40 μm in one or more embodiments. Moreover, the thickness of a surface layer is 5 to 60% with respect to the thickness of the base film for dicing in one or some embodiment, or 20 to 40%.

<Base material layer>
As a base material layer constituting the substrate film for dicing of the present disclosure, an expanded layer that can be conventionally used or developed in the future can be used in one or a plurality of embodiments, and is preferably composed of a resin material. . In one or a plurality of embodiments, the resin material includes polyolefin resins such as polyvinyl chloride, polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene; ethylene-vinyl acetate copolymer, ionomer, ethylene (meth) acrylic Olefin copolymers such as acid copolymers and ethylene / (meth) acrylic acid ester copolymers; polyalkylene terephthalate resins such as polyethylene terephthalate and polybutylene terephthalate; styrene thermoplastic elastomers, olefin thermoplastic elastomers, Examples thereof include thermoplastic resins such as polyvinyl isoprene and polycarbonate, and mixtures of these thermoplastic resins. Among these, a mixture of polypropylene and an elastomer or a mixture of polyethylene and an elastomer is preferable. By using such a resin material, excellent expandability can be obtained.

  In one or a plurality of embodiments, the base material layer may contain an antistatic agent, a filler, and the like as long as the physical properties of the film are not impaired.

  In one or a plurality of embodiments, the thickness of the base material layer is 40 to 95 μm or 60 to 80 μm from the viewpoint of securing a strength that does not break the film when the film is stretched in the expanding step. Moreover, the thickness of a base material layer is 40 to 95% or 60 to 80% with respect to the thickness of the base film for dicing in one or some embodiment.

  The dicing substrate film of the present disclosure may further include an intermediate layer between the base material layer and the surface layer in one or a plurality of embodiments from the viewpoint of improving the production yield.

<Intermediate layer>
The intermediate layer is a layer that is not cut by the dicing blade in one or more embodiments.

  In one or a plurality of embodiments, the resin component forming the intermediate layer is a vinyl aromatic hydrocarbon from the viewpoint of improving the adhesion between the base material layer and the surface layer without reducing the expandability of the film. It is preferable to contain a conjugated diene hydrocarbon copolymer or a hydrogenated product thereof. In addition, as a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or its hydrogenated substance, the same thing as the above-mentioned surface layer can be used, The detailed description is abbreviate | omitted here.

  Moreover, as a resin component forming the intermediate layer, in one or a plurality of embodiments, in addition to the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof, a polystyrene-based resin or a base material layer is used. You may further contain other resin components, such as the resin component to comprise. In addition, since the same thing as the above-mentioned surface layer can be used as a polystyrene-type resin, since it is as having mentioned above about the resin component which comprises a base material layer, the detailed description is abbreviate | omitted here.

  When the intermediate layer contains a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof and other resin components, the base material layer and the surface are suppressed while suppressing a decrease in the expandability of the film. From the viewpoint of improving the adhesion with the layer, the content of the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or the hydrogenated product thereof is 50% by weight or more, or 60% by weight or more, and 100% by weight. Or 90% by weight or less.

  The thickness of the intermediate layer is 5 to 60 μm or 20 to 40 μm in one or more embodiments.

  The overall thickness of the dicing substrate film of the present disclosure is 50 to 200 μm or 80 to 150 μm in one or more embodiments. By setting the total thickness of the dicing substrate film to 50 μm or more, the wafer can be protected from impact when dicing. In addition, when the base film for dicing has an intermediate layer, in one or a plurality of embodiments, the thickness of the base layer is reduced without changing the thickness of the surface layer, so that the thickness of the whole film is Set the value within the range.

  Examples of the manufacturing method of the substrate film for dicing according to the present disclosure include known methods such as an extrusion method using a T die or a circular die and a calender method. From the viewpoint of the thickness accuracy of the substrate film, a T die was used. Extrusion is preferred.

  Hereinafter, an extrusion method using a T die will be described.

  First, the resin component which comprises a surface layer and a base material layer is each dry blended or melt-kneaded, and resin for each layer formation is obtained. And each layer forming resin is supplied to a screw type extruder, extruded from a multilayer T die adjusted to 180 to 240 ° C., and cooled while passing through a cooling roll adjusted to 10 to 50 ° C. Wind up. Alternatively, after each layer forming resin is once obtained as pellets, it may be extruded as described above. The thickness of each layer formed can be adjusted by adjusting the screw speed of the extruder.

  In the process of winding the film by cooling while passing through the cooling roll, the film is wound substantially unstretched from the viewpoint of securing a strength sufficient to prevent the film from being broken at the time of expansion and improving the restoration property after expansion. It is preferable. Substantially non-stretching means that no positive stretching is performed, and includes non-stretching or slight stretching that does not affect the warpage of the wafer during dicing. Usually, the film may be pulled to such an extent that no sagging occurs when the film is wound.

  In one or a plurality of embodiments, the dicing film 20 according to the present disclosure can be configured as the dicing film 20 according to the present disclosure by providing the pressure-sensitive adhesive layer 13 on the surface layer 12 as illustrated in FIG. 1.

<Adhesive layer>
The pressure-sensitive adhesive layer is not particularly limited as long as the semiconductor member can be attached and the semiconductor member separated into pieces after dicing can be suitably peeled off, but the acrylic pressure-sensitive adhesive and the ultraviolet curable urethane acrylate resin A resin composition containing an isocyanate-based crosslinking agent or the like is preferable. As a result, the semiconductor member can be sufficiently held before dicing, and the holding force (adhesive force) of the adhesive is reduced by irradiating with ultraviolet rays before picking up the separated semiconductor member. Can be picked up.

  In one or a plurality of embodiments, the thickness of the pressure-sensitive adhesive layer is preferably 2 μm or more, more preferably 3 μm or more from the viewpoint of improving the adhesion with the semiconductor member. Moreover, from a viewpoint which can improve the workability at the time of dicing, Preferably it is 30 micrometers or less, More preferably, it is 15 micrometers or less.

  In one or a plurality of embodiments, the manufacturing method of the dicing film of the present disclosure includes applying a coating liquid in which the resin composition forming the pressure-sensitive adhesive layer is appropriately dissolved or dispersed in a solvent on the surface layer of the substrate film for dicing. Examples thereof include a method of forming a pressure-sensitive adhesive layer by applying and drying by a known coating method such as roll coating or gravure coating.

  In one or a plurality of embodiments, the dicing film of the present disclosure may further include a protective layer on the pressure-sensitive adhesive layer.

<Protective layer>
The protective layer is not particularly limited as long as it can protect the pressure-sensitive adhesive layer until the dicing film is used and can be suitably removed when the dicing film is used. As a protective layer, from the viewpoint of improving workability when using a dicing film, in one or a plurality of embodiments, a film made of a polyester resin, a polyethylene resin, a polypropylene resin, a polystyrene resin, or the like is used. preferable.

  In one or more embodiments, the surface of the protective layer that contacts the pressure-sensitive adhesive layer may be subjected to a release treatment. In this case, the protective layer can be more suitably removed when the dicing film is used. Examples of the release treatment method include a method of applying a release resin such as silicon resin or alkyd resin in one or a plurality of embodiments.

  In one or a plurality of embodiments, the manufacturing method of the semiconductor chip of the present disclosure includes a pasting step of pasting the dicing film of the present disclosure and the semiconductor member, a dicing step of dicing the semiconductor member into individual pieces, There is a method including an expanding step of expanding a dicing film and expanding between the separated semiconductor members adjacent to each other, and a pickup step of picking up the separated semiconductor member.

  In the attaching step, in one or a plurality of embodiments, the adhesive layer of the dicing film and the semiconductor member are attached using a commercially available mounter or the like. When the dicing film has a protective layer, the dicing film and the semiconductor member can be attached while removing the protective layer.

  In the dicing step, in one or a plurality of embodiments, a commercially available dicer or the like is used to dice the semiconductor member into individual pieces.

  In the expanding step, in one or a plurality of embodiments, a space between adjacent separated semiconductor members is expanded using a commercially available expander device or the like. As a result, the subsequent pickup process can be suitably executed.

  In the pick-up process, in one or a plurality of embodiments, a semiconductor chip is obtained by picking up an individual semiconductor member using a commercially available chip bonder or the like.

  In one or a plurality of embodiments, the manufacturing method of a semiconductor chip of the present disclosure includes an inspection step of visually inspecting an individualized semiconductor member through a dicing film using a commercially available objective microscope or the like after the expanding step. May be included. Thereby, since it can be detected whether there is a defective part in the separated semiconductor member, productivity can be improved.

  In one or a plurality of embodiments, the semiconductor chip manufacturing method of the present disclosure may include an ultraviolet irradiation step before the pickup step when the pressure-sensitive adhesive layer includes an ultraviolet curable urethane acrylate resin or the like. Thereby, it can irradiate with an ultraviolet-ray before a pick-up process, can reduce the holding power of an adhesive layer, and can pick up suitably.

The present disclosure further relates to one or more of the following embodiments.
[1] A substrate film for dicing comprising a base material layer and a surface layer disposed on one main surface of the base material layer, wherein the surface layer comprises a polystyrene resin and a vinyl aromatic hydrocarbon A substrate film for dicing comprising a conjugated diene hydrocarbon copolymer or a hydrogenated product thereof, wherein the content of the polystyrene resin in the surface layer exceeds 50% by weight.
[2] The substrate film for dicing according to [1], wherein the polystyrene-based resin is at least one selected from the group consisting of general-purpose polystyrene and impact-resistant polystyrene.
[3] The substrate film for dicing according to [1] or [2], wherein the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer is a styrene-ethylene-butadiene-styrene copolymer.
[4] The vinyl aromatic hydrocarbon content in the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer is 10% by weight or more and 50% by weight or less, and any one of [1] to [3] A substrate film for dicing as described in 1.
[5] The content of the polystyrene-based resin in the surface layer is more than 50% by weight and 85% by weight or less, and the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or hydrogen thereof in the surface layer. The substrate film for dicing according to any one of [1] to [4], wherein the content of the additive is 15% by weight or more and 50% by weight or less, or 15% by weight or more and less than 50% by weight.
[6] The substrate film for dicing according to any one of [1] to [5], wherein the surface layer is a cut layer cut by a dicing blade.
[7] The substrate film for dicing according to any one of [1] to [6], further including an intermediate layer between the base material layer and the surface layer.
[8] A dicing film in which an adhesive layer is provided on the main surface on the surface layer side of the substrate film for dicing according to any one of [1] to [7].
[9] The step of attaching the dicing film and the semiconductor member according to [8], the dicing step of dicing the semiconductor member into individual pieces, and expanding the dicing film into adjacent pieces. A method for manufacturing a semiconductor chip, comprising: an expanding step for expanding between the semiconductor members; and a pickup step for picking up the separated semiconductor member.

  The present disclosure will be described in more detail by way of examples, but this is merely an example, and the present disclosure is not limited thereto.

<Raw material>
The raw materials used for the production of the substrate films for dicing in Examples and Comparative Examples are as follows.
Styrene-butadiene copolymer (HIPS): “H9152” (trade name, manufactured by PS Japan Ltd.)
-Hydrogenated product of styrene-ethylene-butadiene-styrene block copolymer (SEBS, St content: 18% by weight): "Tuftec H1062" (trade name, manufactured by Asahi Kasei Chemicals Corporation)
・ Polypropylene (PP): “FS2011DG-2” (trade name, manufactured by Sumitomo Chemical Co., Ltd.)
Polystyrene (PS): “HF77” (trade name, manufactured by PS Japan Ltd.)

Example 1
HIPS: 55% by weight and SEBS: 45% by weight were dry blended with a tumbler to obtain a surface layer forming resin. Further, PP: 60% by weight and SEBS: 40% by weight were dry blended to obtain a base layer forming resin. Then, each obtained layer forming resin is supplied to each extruder adjusted to 200 ° C., and extruded from a two-layer die at 200 ° C. so as to be in the order of surface layer / base material layer. It cooled and solidified with the set cooling roll, wound up in the substantially unstretched state, and obtained the base film for dicing of a 2 layer structure. In Example 1, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Example 2)
For the resin component forming the surface layer, a dicing substrate film having a two-layer structure was prepared in the same manner as in Example 1 except that the HIPS content was changed to 60% by weight and the SEBS content was changed to 40% by weight. Produced. In Example 2, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Example 3)
With respect to the resin component forming the surface layer, a dicing substrate film having a two-layer structure was prepared in the same manner as in Example 1 except that the HIPS content was 70% by weight and the SEBS content was changed to 30% by weight. Produced. In Example 3, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the total thickness of the substrate film for dicing was 100 μm.

Example 4
For the resin component forming the surface layer, a dicing substrate film having a two-layer structure was prepared in the same manner as in Example 1 except that the HIPS content was changed to 80% by weight and the SEBS content was changed to 20% by weight. Produced. In Example 4, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the total thickness of the substrate film for dicing was 100 μm.

(Example 5)
For the resin component forming the surface layer, a dicing substrate film having a two-layer structure was prepared in the same manner as in Example 1 except that the HIPS content was 85% by weight and the SEBS content was changed to 15% by weight. Produced. In Example 5, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Example 6)
A substrate film for dicing having a two-layer structure was produced in the same manner as in Example 2 except that the same amount (60% by weight) of PS was used instead of HIPS which is a resin component forming the surface layer. In Example 6, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Example 7)
A substrate film for dicing having a two-layer structure was produced in the same manner as in Example 4 except that the same amount (80% by weight) of PS was used instead of HIPS which is a resin component forming the surface layer. In Example 7, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the total thickness of the substrate film for dicing was 100 μm.

(Comparative Example 1)
For the resin component forming the surface layer, a dicing substrate film having a two-layer structure was prepared in the same manner as in Example 1 except that the HIPS content was 40% by weight and the SEBS content was changed to 60% by weight. Produced. In Comparative Example 1, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Comparative Example 2)
A dicing substrate film having a two-layer structure was produced in the same manner as in Example 1 except that the resin component forming the surface layer was changed to only HIPS (content: 100% by weight). In Comparative Example 2, the thickness of the surface layer was 40 μm, the thickness of the base material layer was 60 μm, and the thickness of the entire substrate film for dicing was 100 μm.

(Comparative Example 3)
HIPS: 80 wt% and SEBS: 20 wt% were dry blended with a tumbler to obtain a resin composition. The obtained resin composition was supplied to an extruder adjusted to 200 ° C., extruded from a single-layer die adjusted to 200 ° C., cooled and solidified with a 30 ° C. cooling roll, and substantially unstretched. The film was wound in a state to obtain a substrate film for dicing having a single layer structure.

  A pressure-sensitive adhesive layer was provided on the surface layer of each of the substrate films for dicing of Examples 1 to 7 and Comparative Examples 1 to 3 produced as described above to obtain dicing films. Specifically, first, 2-ethylhexyl acrylate: 30% by weight, vinyl acetate: 70% by weight, and 2-hydroxyethyl methacrylate: 1% by weight are mixed in a toluene solvent to obtain a base resin having a weight average molecular weight of 150,000. Got. Then, 100 parts by weight of this base resin and a polyhydric alcohol adduct of tolylene diisocyanate as a crosslinking agent (trade name “Coronate L”, manufactured by Nippon Polyurethane Co., Ltd.): 10 parts by weight are dissolved in ethyl acetate, and then dried. After barcode coating was performed on the surface layer of the substrate film for dicing so that the subsequent thickness became 10 μm, it was dried at 80 ° C. for 5 minutes to obtain a dicing film.

  The obtained dicing film was evaluated for cutting waste properties, expandability, and restorability as follows, and the results are shown in Table 1. Moreover, in Table 1, the thickness of the adhesive layer which comprises the dicing film of Examples 1-7 and Comparative Examples 1-3, content of the resin component which forms a surface layer, the thickness of a surface layer, and a base material layer are shown. The content of the resin component to be formed, the thickness of the base material layer, and the thickness of the entire substrate film for dicing are also shown.

(Cutting properties)
The cutting waste characteristics were evaluated as follows. First, a silicon wafer (thickness: 0.2 mm) is attached to the dicing film, dicing is performed under the following conditions, the cut line is observed, and the number of cutting scraps having a length of 100 μm or more coming out of the cut line is determined. Counting was performed to evaluate cutting waste characteristics, and the evaluation results are shown in Table 1. Here, when the number of cutting wastes was 0 to 5, it was evaluated that the cutting waste characteristics were excellent, and in Table 1, “A” was written. When the number of cutting wastes was 6 to 10, it was evaluated that cutting waste characteristics were good, and in Table 1, “B” was indicated. When the number of cutting wastes was 11 or more, it was evaluated that the cutting waste characteristics were not good, and in Table 1, “C” was indicated.

[Dicing condition]
Dicing machine: “DAD-3350” (trade name, manufactured by DISCO)
Dicing blade: “ZH205O 27HEDD” (trade name, manufactured by DISCO)
Blade rotation speed: 45000rpm
Cutting speed: 50mm / sec
Cutting: 40 μm from the surface of the dicing film (the cutting depth for the surface layer is 30 μm)
Cut size: 10mm x 10mm
Blade cooler: 2L / min

(Expanding and restoring properties)
The expandability and restorability were evaluated as follows. First, in the same manner as the evaluation of the cutting waste characteristics, a silicon wafer is attached to a dicing film, dicing is performed, and the dicing film in a state where a wafer separated by dicing is attached is a wafer expander apparatus (product). Name “HS1010” (manufactured by Hugle Co., Ltd.) and expanded with a withdrawal amount of 6 mm.

  Regarding the expandability, whether or not the dicing film broke after 10 minutes from the start of the expansion was evaluated, and the evaluation results are shown in Table 1. Here, when the film did not break, it was evaluated that the expandability was good, and “A” was shown in Table 1. When the film broke, it was evaluated that the expandability was not good, and in Table 1, “B” was indicated.

  Regarding the recoverability, the expansion was stopped after 10 minutes from the start of the expansion, and the amount of sagging of the film after being allowed to stand for 10 minutes was measured and evaluated based on the measured values. The evaluation results are shown in Table 1. Here, when the amount of sag of the film was 5 mm or less, it was evaluated that the film had excellent resilience. When the amount of sagging of the film was more than 5 mm and less than 9 mm, the restorability was evaluated as good, and “B” was shown in Table 1. When the amount of sag of the film was 9 mm or more, it was evaluated that the restorability was not good, and “C” was shown in Table 1.

  As shown in Table 1, the dicing films of Examples 1 to 7 have a higher effect of suppressing the generation of cutting waste than the dicing films of Comparative Examples 1 to 3, and are excellent in expandability and restorability. I understood that. In addition, Example 1 in which the HIPS content in the surface layer exceeds 50% by weight was able to significantly reduce the generation of cutting scraps compared to Comparative Example 1 in which the HIPS content in the surface layer was 50% by weight or less. Therefore, it was found that it is important that the content of HIPS exceeds 50% by weight for the suppression of the generation of cutting waste. Moreover, since the comparative example 2 which does not contain SEBS was not good in the restoring property, in order to obtain sufficient restoring property, it turned out that SEBS is important. Since Comparative Example 3 having a single-layer structure was broken when expanded, it was found that it is important to make the substrate film for dicing into a two-layer structure in order to obtain sufficient expandability. .

  Since the dicing film of the present disclosure is excellent in expandability and restoration property and has a high effect of suppressing the generation of cutting waste during dicing, it is suitably used as a semiconductor member fixing film in a dicing process when manufacturing a semiconductor device. It is done.

DESCRIPTION OF SYMBOLS 10 Base film for dicing 11 Base material layer 12 Surface layer 13 Adhesive layer 20 Dicing film

Claims (8)

A substrate film for dicing comprising a substrate layer and a surface layer disposed on one principal surface of the substrate layer,
The surface layer contains a polystyrene resin and a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof,
The content of the polystyrene-based resin in the surface layer, exceed 50% by weight,
The polystyrene resin is at least one selected from the group consisting of general-purpose polystyrene that is a styrene homopolymer and impact-resistant polystyrene that is a styrene-butadiene copolymer,
A substrate film for dicing, wherein the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer is a styrene-ethylene-butadiene-styrene copolymer . The substrate film for dicing according to claim 1, wherein the impact-resistant polystyrene has a structure in which a rubber component is blended or graft-polymerized with general-purpose polystyrene . The substrate film for dicing according to claim 1 or 2, wherein a content of the vinyl aromatic hydrocarbon in the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer is 10 wt% or more and 50 wt% or less. The content of the polystyrene resin in the surface layer is more than 50% by weight and 85% by weight or less,
The content of the vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer or a hydrogenated product thereof in the surface layer is 15 wt% or more and 50 wt% or less, according to any one of claims 1 to 3 . Base film for dicing. The dicing substrate film according to any one of claims 1 to 4 , wherein the surface layer is a cut layer cut by a dicing blade. The base film for dicing according to any one of claims 1 to 5 , further comprising an intermediate layer between the base material layer and the surface layer. On the main surface of the surface layer side of the dicing substrate film according to any one of claims 1 to 6, the adhesive layer is provided, the dicing film. A pasting step for pasting the dicing film according to claim 7 and the semiconductor member;
A dicing step of dicing the semiconductor member into individual pieces;
Expanding the dicing film and expanding between the adjacent singulated semiconductor members; and
And a pick-up step for picking up the separated semiconductor member.

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