SG11201906504SA - Tape for semiconductor processing - Google Patents
Tape for semiconductor processingInfo
- Publication number
- SG11201906504SA SG11201906504SA SG11201906504SA SG11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA SG 11201906504S A SG11201906504S A SG 11201906504SA
- Authority
- SG
- Singapore
- Prior art keywords
- tape
- semiconductor processing
- temporary adhesive
- values
- measured
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A tape for semiconductor processing that can be caused to shrink by heating sufficiently in a short time period and can retain a kerf width is provided. A tape for semiconductor processing 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one surface side of the substrate film 11, in which regarding the temporary adhesive tape 15, the sum of the integral value calculated from the sum total of the values of the thermal deformation rate in any of a first direction per 1°C between 40°C and 80°C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, and the integral value calculated from the sum total of the values of the thermal deformation rate in a second direction perpendicular to the first direction per 1°C between 40°C and 80°C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, is a negative value.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018061061A JP6535117B1 (en) | 2018-03-28 | 2018-03-28 | Semiconductor processing tape |
PCT/JP2018/026880 WO2019187184A1 (en) | 2018-03-28 | 2018-07-18 | Semiconductor processing tape |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201906504SA true SG11201906504SA (en) | 2019-11-28 |
Family
ID=67023796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201906504S SG11201906504SA (en) | 2018-03-28 | 2018-07-18 | Tape for semiconductor processing |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6535117B1 (en) |
KR (1) | KR102112789B1 (en) |
CN (1) | CN110546738B (en) |
BR (1) | BR112019019521B1 (en) |
MY (1) | MY187864A (en) |
SG (1) | SG11201906504SA (en) |
TW (1) | TWI685028B (en) |
WO (1) | WO2019187184A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7060548B2 (en) * | 2019-05-29 | 2022-04-26 | 古河電気工業株式会社 | Glass processing tape |
JP7060547B2 (en) * | 2019-05-29 | 2022-04-26 | 古河電気工業株式会社 | Glass processing tape |
KR102311521B1 (en) * | 2019-11-07 | 2021-10-13 | 양진석 | Apparatus of transferring a plurality of chips adn method of transferring a plurality of chips |
WO2023157195A1 (en) * | 2022-02-17 | 2023-08-24 | 株式会社レゾナック | Dicing die-bonding film, and method for manufacturing semiconductor device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2521459B2 (en) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | Method of manufacturing semiconductor chip |
JP4757442B2 (en) * | 1997-02-10 | 2011-08-24 | リンテック株式会社 | Chip body adhesive sheet |
JP4358502B2 (en) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
JP2003342393A (en) * | 2002-05-30 | 2003-12-03 | Mitsubishi Polyester Film Copp | Polyester soft film for dicing tape |
JP2004273895A (en) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
JP4754278B2 (en) | 2005-06-23 | 2011-08-24 | リンテック株式会社 | Chip body manufacturing method |
JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
JP2012174945A (en) * | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | Processing method of semiconductor wafer |
JP5801584B2 (en) * | 2011-03-29 | 2015-10-28 | リンテック株式会社 | Dicing tape and chip-shaped part manufacturing method |
US10008405B2 (en) * | 2012-12-26 | 2018-06-26 | Hitachi Chemical Company, Ltd | Expansion method, method for manufacturing semiconductor device, and semiconductor device |
JP6295135B2 (en) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
JP6230730B2 (en) * | 2015-03-24 | 2017-11-15 | 古河電気工業株式会社 | Semiconductor processing tape |
JP2017147293A (en) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape |
JP2017174945A (en) | 2016-03-23 | 2017-09-28 | 京セラ株式会社 | Multilayer electronic component |
-
2018
- 2018-03-28 JP JP2018061061A patent/JP6535117B1/en active Active
- 2018-07-18 MY MYPI2019003945A patent/MY187864A/en unknown
- 2018-07-18 CN CN201880005343.3A patent/CN110546738B/en active Active
- 2018-07-18 WO PCT/JP2018/026880 patent/WO2019187184A1/en active Application Filing
- 2018-07-18 KR KR1020197013958A patent/KR102112789B1/en active IP Right Grant
- 2018-07-18 BR BR112019019521-1A patent/BR112019019521B1/en active IP Right Grant
- 2018-07-18 SG SG11201906504S patent/SG11201906504SA/en unknown
- 2018-09-10 TW TW107131697A patent/TWI685028B/en active
Also Published As
Publication number | Publication date |
---|---|
MY187864A (en) | 2021-10-26 |
TW201942964A (en) | 2019-11-01 |
JP6535117B1 (en) | 2019-06-26 |
CN110546738B (en) | 2020-12-29 |
KR20190113746A (en) | 2019-10-08 |
KR102112789B1 (en) | 2020-05-19 |
CN110546738A (en) | 2019-12-06 |
JP2019175958A (en) | 2019-10-10 |
BR112019019521B1 (en) | 2021-03-16 |
BR112019019521A2 (en) | 2020-04-22 |
WO2019187184A1 (en) | 2019-10-03 |
TWI685028B (en) | 2020-02-11 |
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