PH12021550126A1 - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
PH12021550126A1
PH12021550126A1 PH12021550126A PH12021550126A PH12021550126A1 PH 12021550126 A1 PH12021550126 A1 PH 12021550126A1 PH 12021550126 A PH12021550126 A PH 12021550126A PH 12021550126 A PH12021550126 A PH 12021550126A PH 12021550126 A1 PH12021550126 A1 PH 12021550126A1
Authority
PH
Philippines
Prior art keywords
tape
sensitive adhesive
pressure
glass processing
adhesive tape
Prior art date
Application number
PH12021550126A
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12021550126A1 publication Critical patent/PH12021550126A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

The present invention provides a tape for glass processing, the tape making it possible to suitably conduct heat shrinkage in a short period of time and to maintain the kerf width. This tape 10 for glass processing is characterized by: having a pressure-sensitive adhesive tape 15 that has a base-material film 11 and a pressure-sensitive adhesive layer 12 formed on at least one surface of the base-material film 11; the pressure-sensitive adhesive tape 15 being such that the sum of the total of differential values for the thermal deformation rate per degree Celsius in a range of 40-80 øC measured during heating by a thermomechanical characteristic tester in an MD direction, and the total of differential values for the thermal deformation rate per degree Celsius in a range of 40-80øC measured during heating by a thermomechanical characteristic tester in a TD direction, is a negative value; and being used in processing of glass that includes an expansion step in which the pressure-sensitive adhesive tape 15 is expanded.
PH12021550126A 2019-05-29 2021-01-18 Tape for glass processing PH12021550126A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100126A JP7060548B2 (en) 2019-05-29 2019-05-29 Glass processing tape
PCT/JP2020/009034 WO2020240963A1 (en) 2019-05-29 2020-03-04 Tape for glass processing

Publications (1)

Publication Number Publication Date
PH12021550126A1 true PH12021550126A1 (en) 2021-10-04

Family

ID=73546033

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550126A PH12021550126A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7060548B2 (en)
KR (1) KR102505646B1 (en)
CN (1) CN112368107B (en)
PH (1) PH12021550126A1 (en)
SG (1) SG11202100513WA (en)
TW (1) TWI743809B (en)
WO (1) WO2020240963A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023281996A1 (en) * 2021-07-08 2023-01-12 マクセル株式会社 Adhesive tape

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235118B2 (en) * 1982-12-27 1990-08-08 Tokyo Gasu Kk SUIHEICHOKYORISAKUSHINKOHONIOKERUKUTSUSAKUHETSUDO
JPH10310749A (en) * 1997-05-13 1998-11-24 Mitsui Chem Inc Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
JP5151015B2 (en) * 2005-08-25 2013-02-27 東洋紡株式会社 Heat-shrinkable polyester film and label and method for producing the same
KR20100007966A (en) * 2007-05-08 2010-01-22 미쓰이 가가쿠 가부시키가이샤 Crosslinked product of propylene polymer
JP5290853B2 (en) 2009-04-28 2013-09-18 三菱樹脂株式会社 Dicing adhesive sheet
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP2012174945A (en) 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The Processing method of semiconductor wafer
JP5801584B2 (en) 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
JP5764519B2 (en) 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
WO2014157471A1 (en) * 2013-03-28 2014-10-02 古河電気工業株式会社 Adhesive tape and wafer-processing tape
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
JP6230730B2 (en) 2015-03-24 2017-11-15 古河電気工業株式会社 Semiconductor processing tape
JP6632115B2 (en) * 2015-07-17 2020-01-15 藤森工業株式会社 Adhesive resin layer and adhesive resin film
JP2017147293A (en) 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP2018166148A (en) 2017-03-28 2018-10-25 リンテック株式会社 Substrate film for dicing sheet and dicing sheet
JP2018178002A (en) * 2017-04-17 2018-11-15 日東電工株式会社 Dicing/die-bonding film
JP6535117B1 (en) 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape

Also Published As

Publication number Publication date
KR102505646B1 (en) 2023-03-06
CN112368107A (en) 2021-02-12
JP2020194904A (en) 2020-12-03
SG11202100513WA (en) 2021-02-25
JP7060548B2 (en) 2022-04-26
TW202043402A (en) 2020-12-01
TWI743809B (en) 2021-10-21
CN112368107B (en) 2022-10-25
KR20210015889A (en) 2021-02-10
WO2020240963A1 (en) 2020-12-03

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