PH12016500961A1 - Semiconductor-processing pressure-sensitive adhesive tape - Google Patents
Semiconductor-processing pressure-sensitive adhesive tapeInfo
- Publication number
- PH12016500961A1 PH12016500961A1 PH12016500961A PH12016500961A PH12016500961A1 PH 12016500961 A1 PH12016500961 A1 PH 12016500961A1 PH 12016500961 A PH12016500961 A PH 12016500961A PH 12016500961 A PH12016500961 A PH 12016500961A PH 12016500961 A1 PH12016500961 A1 PH 12016500961A1
- Authority
- PH
- Philippines
- Prior art keywords
- semiconductor
- sensitive adhesive
- adhesive tape
- processing pressure
- pressure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
Provided is a semiconductor-processing pressure-sensitive adhesive tape provided with strong adhesion necessary when physical/mechanical peeling of a support member is to be performed, in which even if a washing fluid for washing away adhesive residue left over from when the support member was bonded to the semiconductor wafer comes into contact with a tackifier, the tackifier does not dissolve and contaminate the semiconductor element. The semiconductor-processing pressure-sensitive adhesive tape admits a laser necessary for stealth dicing such that the laser beam is radiated on the semiconductor wafer to form a modified layer, and the semiconductor wafer can be separated into semiconductor chips. This semiconductor-processing pressure-sensitive adhesive tape has a radiation-curable tackifier layer formed on at least one surface of a base material resin film, the contact angle of the pressure-sensitive adhesive layer to methyl isobutyl ketone prior to the pressure-sensitive adhesive layer being irradiated is 25.1o to 60o, and the parallel beam transmittance of light at a wavelength of 1064 nm incident from the base material resin film side is 88 pcnt or greater and less than 100 pcnt .
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013247169 | 2013-11-29 | ||
JP2014040320A JP5607847B1 (en) | 2013-11-29 | 2014-03-03 | Adhesive tape for semiconductor processing |
PCT/JP2014/081333 WO2015080188A1 (en) | 2013-11-29 | 2014-11-27 | Semiconductor-processing pressure-sensitive adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12016500961B1 PH12016500961B1 (en) | 2016-07-11 |
PH12016500961A1 true PH12016500961A1 (en) | 2016-07-11 |
Family
ID=51840534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12016500961A PH12016500961A1 (en) | 2013-11-29 | 2016-05-24 | Semiconductor-processing pressure-sensitive adhesive tape |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5607847B1 (en) |
KR (1) | KR101897376B1 (en) |
CN (1) | CN105765700B (en) |
MY (1) | MY172341A (en) |
PH (1) | PH12016500961A1 (en) |
TW (1) | TWI589668B (en) |
WO (1) | WO2015080188A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108701597B (en) * | 2016-03-04 | 2023-03-31 | 琳得科株式会社 | Composite sheet for forming protective film |
WO2017163971A1 (en) * | 2016-03-24 | 2017-09-28 | リンテック株式会社 | Supporting sheet and composite sheet for protective film formation |
JP6278164B1 (en) * | 2016-05-12 | 2018-02-14 | 住友ベークライト株式会社 | Adhesive tape for semiconductor substrate processing |
JP6781639B2 (en) * | 2017-01-31 | 2020-11-04 | 株式会社ディスコ | Wafer generation method |
JP6800062B2 (en) * | 2017-03-28 | 2020-12-16 | 古河電気工業株式会社 | Adhesive tape |
CN110582839B (en) * | 2017-12-27 | 2023-06-06 | 古河电气工业株式会社 | Radiation-curable adhesive tape for dicing |
JP2019189853A (en) * | 2018-04-23 | 2019-10-31 | 積水化学工業株式会社 | Adhesive tape, adhesive tape roll, and production method of adhesive tape |
JP7348838B2 (en) * | 2018-06-05 | 2023-09-21 | 積水化学工業株式会社 | Adhesive tape |
JP7324023B2 (en) * | 2019-03-22 | 2023-08-09 | 日東電工株式会社 | dicing tape |
JP7269095B2 (en) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | glass processing tape |
JPWO2021065515A1 (en) * | 2019-10-01 | 2021-04-08 | ||
CN111545922B (en) * | 2020-04-08 | 2022-07-12 | 山东天岳先进科技股份有限公司 | Processing method of silicon carbide crystal |
CN115287004A (en) * | 2022-04-19 | 2022-11-04 | 广东莱尔新材料科技股份有限公司 | Adhesive tape for processing semiconductor wafer and preparation method thereof |
CN115011274B (en) * | 2022-06-24 | 2023-07-18 | 浙江权威胶粘制品有限公司 | Modified acrylic ester high-temperature-resistant adhesive tape and preparation method thereof |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349799A (en) * | 1993-06-08 | 1994-12-22 | Hitachi Chem Co Ltd | Back-grinding method of silicon wafer |
JP4659300B2 (en) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
JP2006135272A (en) | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | Substrate support plate and peeling method of support plate |
WO2006129458A1 (en) * | 2005-05-30 | 2006-12-07 | Jsr Corporation | Wafer with fixing agent and method for producing wafer with fixing agent |
JP2007284577A (en) * | 2006-04-17 | 2007-11-01 | Nitto Denko Corp | Pressure-sensitive adhesive sheet and method for processing adherend by using the same |
JP5467720B2 (en) * | 2007-12-28 | 2014-04-09 | リンテック株式会社 | Adhesive composition, adhesive sheet and method for producing semiconductor device |
JP5111620B2 (en) | 2008-01-24 | 2013-01-09 | ブルーワー サイエンス アイ エヌ シー. | Method of mounting device wafer reversely on carrier substrate |
JP5184161B2 (en) | 2008-03-17 | 2013-04-17 | 古河電気工業株式会社 | Semiconductor processing tape |
DE102008044200B4 (en) | 2008-11-28 | 2012-08-23 | Thin Materials Ag | Bonding method |
JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
KR101198254B1 (en) * | 2010-05-31 | 2012-11-07 | 주식회사 케이씨씨 | Adhesive sheet for manufaturing semiconductor |
KR101311647B1 (en) * | 2010-07-07 | 2013-09-25 | 후루카와 덴키 고교 가부시키가이샤 | Wafer processing tape and method of processing semiconductor therewith |
JP4865926B1 (en) * | 2011-06-24 | 2012-02-01 | 古河電気工業株式会社 | Wafer processing tape |
JP5019657B1 (en) * | 2011-10-27 | 2012-09-05 | 古河電気工業株式会社 | Adhesive tape for semiconductor device processing |
JP5901422B2 (en) * | 2012-05-15 | 2016-04-13 | 古河電気工業株式会社 | Semiconductor wafer dicing method and semiconductor processing dicing tape used therefor |
JP5379919B1 (en) * | 2013-02-13 | 2013-12-25 | 古河電気工業株式会社 | Adhesive tape for semiconductor processing |
-
2014
- 2014-03-03 JP JP2014040320A patent/JP5607847B1/en active Active
- 2014-11-27 CN CN201480064677.XA patent/CN105765700B/en active Active
- 2014-11-27 MY MYPI2016000952A patent/MY172341A/en unknown
- 2014-11-27 WO PCT/JP2014/081333 patent/WO2015080188A1/en active Application Filing
- 2014-11-27 KR KR1020167014147A patent/KR101897376B1/en active IP Right Grant
- 2014-11-28 TW TW103141401A patent/TWI589668B/en active
-
2016
- 2016-05-24 PH PH12016500961A patent/PH12016500961A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5607847B1 (en) | 2014-10-15 |
KR101897376B1 (en) | 2018-09-10 |
KR20160079045A (en) | 2016-07-05 |
CN105765700A (en) | 2016-07-13 |
WO2015080188A1 (en) | 2015-06-04 |
JP2015128126A (en) | 2015-07-09 |
PH12016500961B1 (en) | 2016-07-11 |
TWI589668B (en) | 2017-07-01 |
MY172341A (en) | 2019-11-21 |
TW201529794A (en) | 2015-08-01 |
CN105765700B (en) | 2018-12-11 |
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