TW200629473A - Processing method for substrate and film expansion device - Google Patents

Processing method for substrate and film expansion device

Info

Publication number
TW200629473A
TW200629473A TW094143978A TW94143978A TW200629473A TW 200629473 A TW200629473 A TW 200629473A TW 094143978 A TW094143978 A TW 094143978A TW 94143978 A TW94143978 A TW 94143978A TW 200629473 A TW200629473 A TW 200629473A
Authority
TW
Taiwan
Prior art keywords
film
expansion device
expansive
substrate
maintaining portion
Prior art date
Application number
TW094143978A
Other languages
Chinese (zh)
Inventor
Toshimitsu Wakuda
Kenshi Fukumitsu
Masayoshi Kusunoki
Tatsuya Suzuki
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TW200629473A publication Critical patent/TW200629473A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The present invention provides the processing method for substrate to decrease the damage of the cutting surface and film expansion device during the cutting initiation point formed in two directions of the processed object. The film expansion device 1 comprises: table 2 with the supporting surface 20a for supporting the wafer 50 adhering with the expansive film 40; a pair of a first maintaining portion 11 disposed respectively at the both sides of table 2 in the X-axis direction to maintain expansive film 40; a pair of a second maintaining portion 12 disposed respectively at the both sides of table 2 in the Y-axis direction to maintain expansive film 40; cylinder 22 which makes the expansive film 40 expand in X direction by means of increasing the distance between the supporting surface 20a of table 2 and the first maintaining portion 11; and cylinder 21 which makes the expansive film 40 expand in Y direction by means of increasing the distance between the supporting surface 20a of table 2 and the second maintaining portion 12.
TW094143978A 2004-12-14 2005-12-13 Processing method for substrate and film expansion device TW200629473A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004361786A JP2006173269A (en) 2004-12-14 2004-12-14 Method for machining substrate and device for extending film

Publications (1)

Publication Number Publication Date
TW200629473A true TW200629473A (en) 2006-08-16

Family

ID=36587771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143978A TW200629473A (en) 2004-12-14 2005-12-13 Processing method for substrate and film expansion device

Country Status (3)

Country Link
JP (1) JP2006173269A (en)
TW (1) TW200629473A (en)
WO (1) WO2006064714A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107275256A (en) * 2016-04-01 2017-10-20 株式会社迪思科 Expanding unit
TWI644774B (en) * 2014-08-20 2018-12-21 日商三星鑽石工業股份有限公司 a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134510A (en) * 2005-11-10 2007-05-31 Tokyo Seimitsu Co Ltd Wafer mounter
JP5029298B2 (en) * 2007-11-06 2012-09-19 株式会社デンソー Splitting method
JP5600997B2 (en) * 2010-03-30 2014-10-08 トヨタ自動車株式会社 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
JP5980600B2 (en) * 2012-07-12 2016-08-31 株式会社ディスコ Tape expansion unit
JP6009885B2 (en) * 2012-09-24 2016-10-19 株式会社ディスコ Tape expansion unit
JP6087707B2 (en) * 2013-04-15 2017-03-01 株式会社ディスコ Tape expansion unit
JP2016081973A (en) * 2014-10-10 2016-05-16 リンテック株式会社 Separation device and separation method
JP6420623B2 (en) * 2014-10-10 2018-11-07 リンテック株式会社 Separation device and separation method
JP6468789B2 (en) * 2014-10-20 2019-02-13 リンテック株式会社 Spacing device
JP6427005B2 (en) * 2014-12-26 2018-11-21 リンテック株式会社 Spacer
CN111524848A (en) * 2019-02-01 2020-08-11 相丰科技股份有限公司 Stretched film expanding method and film expander

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763844A (en) * 1980-10-03 1982-04-17 Mitsubishi Electric Corp Dividing method for semiconductor wafer
JPH0468553A (en) * 1990-07-10 1992-03-04 Toshiba Seiki Kk Wafer expansion equipment
JP4358502B2 (en) * 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP4432103B2 (en) * 2003-05-12 2010-03-17 株式会社東京精密 Method and apparatus for dividing plate-like member
JP4770126B2 (en) * 2003-06-06 2011-09-14 日立化成工業株式会社 Adhesive sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644774B (en) * 2014-08-20 2018-12-21 日商三星鑽石工業股份有限公司 a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate
CN107275256A (en) * 2016-04-01 2017-10-20 株式会社迪思科 Expanding unit
CN107275256B (en) * 2016-04-01 2022-02-22 株式会社迪思科 Expansion device

Also Published As

Publication number Publication date
JP2006173269A (en) 2006-06-29
WO2006064714A1 (en) 2006-06-22

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