JPH0468553A - Wafer expansion equipment - Google Patents

Abstract

PURPOSE:To change the expansion amount of a wafer sheet properly by making adjustments to the specified downward movement limit position of a presser ring with an expansion amount adjustment device. CONSTITUTION:A flat ring 3 which holds a wafer sheet 2 is put on the projected part 11A of an expand ring 11. Then, a presser ring 12 is so positioned that a desired step 15 (15A-15E) may correspond to a stopper claw 13 and is adhered to the upper surface of the flat ring 3. With the stopper claw 13 being pushed open, manual expansion force is applied to the presser ring 12 to lower it down. When the stopper claw 13 comes to the downward movement limit position where it fits in the preliminarily determined step 15 (15A-15E), the movement of the stopper claw 13 is stopped and the expansion of the wafer sheet 2 is finished. The specified downward movement limit position of the presser ring 12 is adjusted by the step 15 (15A-15E) for expansion amount adjustment.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a wafer expanding apparatus suitable for use in an electronic component manufacturing process.

(Prior Art) In the manufacturing process of electronic components, a wafer expander is used to separate semiconductor pellets or wafers arranged two-dimensionally into individual pellets. Conventional wafer expanding equipment holds the outer periphery of a wafer made of pellets or a well sheet adhered to a flat link, sets this flat link around the protruding link part of the expand link, and presses it down. The wafer sheet to be held is expanded on the protruding link portion.

However, the amount of expansion of the wafer sheet is determined by the amount of depression of the flat link around the protruding ring portion.

The amount of expansion of the wafer sheet must be selected appropriately depending on the wafer size, pellet size, material of the wafer sheet, etc.

(Problem to be solved by the invention) However, in the conventional wafer expander, a single value is fixed depending on the pressing amount of the flat link or the height of the protruding ring part, and the same expand link The amount of expansion of a wafer sheet that can be expanded using is only a single value.

Therefore, if the amount of expansion of the wafer sheet is to be varied depending on the wafer size, pellet size, material of the wafer sheet, etc., it is necessary to prepare expand links with different heights of the protruding ring portions.

SUMMARY OF THE INVENTION An object of the present invention is to use a single wafer expander to appropriately change the amount of expansion of a wafer sheet.

[Structure of the Invention] (Means for Solving the Problems) The present invention holds the outer circumferential portion of a wafer consisting of a group of pellets or a wafer sheet adhered to a flat ring, and connects the flat link to a protruding link portion of an expandable link. In a wafer expander that expands a wafer sheet held by a flat link onto the protruding link part by setting the wafer sheet around the protruding link part, the wafer sheet is attached to the flat ring set around the protruding link part of the expand link. , a press ring that moves downward by applying an expand force that presses down the flat link around the projecting ring portion, and a stopper means that defines the lower limit position of the press ring, and the press ring and the stopper At least one of the means is provided with an expansion amount adjusting means for adjusting the lower limit defined position of the press ring by the stopper means.

(Function) According to the present invention, when the stopper means defines the lower limit position of the press ring attached to the flat link, the lower limit position of the press ring is adjusted by the expansion amount adjusting means. Ru. As a result, the pressing amount of the flat ring, which determines the amount of expansion of the wafer sheet, is adjusted along with the adjustment of the lower limit of movement of the press ring, which is adjustable as described above.As a result, the amount of expansion of the wafer sheet is adjusted. You can change the expansion amount as appropriate.

(Example) Fig. 1 is a perspective view showing a first embodiment of the present invention, Fig. 2 is a vertical sectional view of Fig. 1, and Fig. 3 is a plan view showing a press ring.
FIG. 4 is a side view showing a press ring and a stopper claw, and FIG. 5 is a sectional view of a main part showing a second embodiment of the present invention.

In FIG. 1, 1 is a wafer consisting of a group of semiconductor pellets, 2 is a wafer sheet to which the wafer 1 is adhered, and 3 is a flat ring that holds the outer periphery of the wafer sheet 2.

In the wafer expander 10 shown in FIGS. 1 and 2, the flat ring 3 is set around the protruding ring portion 11A of the expand ring 11 and pushed down, and the wafer sheet 2 held by the flat ring 3 is moved around the protruding ring portion 11A of the expand ring 11. It is expanded in section 11A.

Here, the wafer expander WL1o includes a press ring 12 that is separate from the expand link 11, and stopper claws 13 that are pin-coupled to the base portion 11B of the expand ring 11 at four positions around the protruding ring portion 11A. have.

The press ring 12 is attached to the upper surface of the flat ring 3 that is set around the projecting ring portion 11A of the expand ring 11, and the press ring 12 is attached to the top surface of the flat ring 3 that is set around the projecting ring portion 11A of the expand ring 11.
A manual expanding force is applied to push it down around 1A, causing it to move downward.

The stopper claw 13 engages with the upper surface of the press ring 12 to restrict the lower limit position of the press ring 12. That is, when the press ring 12 moves downward, the lower surface of the flat ring 3 on which the press ring 12 is attached comes into contact with the elastic support (rubber body) 14 embedded in the base portion 11B of the expand ring 11. At this time, the press ring 12 engages with the stopper claw 13 while receiving an upward repulsive force from the expanded wafer sheet 2, and its lower limit of movement is defined.

As shown in FIG. 4, the stopper claw 13 is supported in an upright floating manner by a spring (not shown), and the lower edge of the press ring 12 is pushed onto the inclined surface 13A of the stopper claw 13. Accordingly, the upper surface of the press ring 12 or the stopper claw 1 is opened by swinging outward.
As soon as it passes the tip 13B of 3, it returns inward and closes,
It engages with the upper surface of the press ring 12.

However, the press ring 12 is provided with expansion amount adjustment steps 15 (15A to 15E) each consisting of five stages in each of the 4M circumferential areas on the upper surface (see Fig. 3).
.

Since the press ring 12 has different heights h between each of the expansion amount adjustment steps 15A to 15E and the lower surface of the press ring 12, by selecting the step 15 that engages with the stopper claw 13, , stopper claw 13
The amount by which the wafer sheet 2 is expanded can be adjusted by adjusting the lower limit of movement of the press ring 12 and by adjusting the amount of depression applied to the flat link 3.

For example, when the step 15A having the maximum height h is selected as the step 15 that engages with the stopper claw 13, the press ring 1 around the protruding link portion 11A is selected.
The downward stroke of the lower surface of 2 (=the upper surface of flat link 3) becomes maximum, and as a result, the amount of depression of flat link 3 becomes maximum, and as a result, the amount of expansion of wafer sheet 2 becomes maximum. On the other hand, when the step 15E with the minimum height h is selected as the step 15 for the stopper claw 13, the downward movement stroke of the lower surface of the press ring 12 (=the upper surface of the flat ring 3) around the protruding ring portion 11A As a result, the pressing amount of the flat link 3 becomes the minimum, and as a result, the amount of expansion of the wafer sheet 2 becomes the minimum.

Hereinafter, the procedure for using the expandable device ff1o for sea urchins will be explained.

(1) Flat ring 3 holding wafer sheet 2
The projecting ring portion 1 of the expand ring 11, IA
Put it on top.

(2) Press the press ring 12 into the desired step 15 (15
A to 15E) are aligned so that they correspond to the stopper claws 13, and are attached to the upper surface of the flat ring 3.

(3) While applying manual expanding force to the press ring 12 and pushing open the stopper claw 13, press the press ring 1.
Move 2 down. The press ring 12 is stopped at the lower limit of movement position where the stopper claw 13 engages with a predetermined step 15 (1, 5A-15E), and the expansion of the wafer sheet 2 is completed.

Next, the operation of the above embodiment will be explained.

According to the above embodiment, when the lower limit position of the press ring 12 attached to the flat ring 3 is defined by the stopper claw 13, the lower limit position 1 of the press ring 12 is set in step 15 for adjusting the amount of expansion. (15A~15
Adjustments can be made in E). As a result, the amount of depression of the flat link 3, which determines the amount of expansion of the wafer sheet 2, is adjusted along with the adjustment of the lower limit of movement of the press ring 12, which is adjustable as described above.
As a result, the amount of expansion of the wafer sheet 2 can be changed as appropriate.

The wafer expander 20 shown in FIG. 5 is similar to the wafer expander 10 described above, in which the flat link 3 is set around the protruding ring portion 21A of the expander link 21 and pushed down, and the wafer sheet held by the flat link 3 is 2 is expanded by the protruding link portion 2LA.

Here, the wafer expander 20 includes a press song 22 separate from the expand ring 21, and stoppers 23 protruding from the base portion 21B of the expand ring 21 at multiple positions around the protruding ring portion 21A. have.

The press ring 22 is attached to the upper surface of the flat link 3 set around the projecting ring portion 21A of the expand ring 21, and the press ring 22 is attached to the top surface of the flat link 3 set around the projecting ring portion 21A of the expand ring 21.
The cylinder device 24 applies an expanding force to push it down around 1A, and it moves downward.

The stopper 23 abuts against the lower surface of the press ring 22 and defines the lower limit position of the press ring 22 by the cylinder device 24 .

However, the press ring 22 is provided with expansion amount adjustment steps 25 (25A to 25E) similar to those provided on the upper surface of the press ring 12 of the wafer expander 10, in each of a plurality of circumferential regions on the lower surface.

Since each step 25A to 25E of the press ring 22 has a different step with respect to the lower surface of the press ring 22, by selecting the step 25 that abuts the stopper 23, the step 25 of the press ring 22 by the stopper 23 can be The amount of expansion of the wafer sheet 2 can be adjusted by adjusting the lower limit of movement position and by adjusting the amount of depression applied to the flat link 3.

In the wafer expander 20, the press ring 22 is connected to the protruding ring portion 21 of the expand link 21.
The press ring 22 is provided with a rotation means that rotates around A, and by the operation of this rotation means, the step 25 of the press ring 22 (25A to 25
E) The press ring 22 may be automatically positioned so as to correspond to the stopper 23.

Further, in the above two embodiments, the number of steps and the number of installation areas of the expansion amount adjustment steps 15 and 25 may be arbitrary.

The wafer expander 30 shown in FIGS. 6 and 7 is a modification of the wafer expander 20 described above, and the base 2
The stopper 32 rotatably provided on the support bracket 31 on 1B has a substantially cross shape, and each end of the substantially cross shape is engaged with the abutting surface 33 of the press ring 22.
4 (34A to 34D). Stopper 3
2 is each expansion amount adjusting section 34 (34A to 34D
) have different lengths h1 to h4, by selecting and setting the expansion amount adjusting portion 34 that engages the abutting surface 33, the lower limit of movement of the press ring 22 is adjusted by the stopper 32. Furthermore, by adjusting the amount of depression applied to the flat link 3, the amount of expansion of the wafer sheet 2 can be adjusted.

[Effects of the Invention] As described above, according to the present invention, the amount of expansion of a wafer sheet can be changed as appropriate using a single wafer expander.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of FIG. 1, and FIG. 3 is a plan view showing a press ring.
FIG. 4 is a side view showing a press ring and a stopper claw, FIG. 5 is a sectional view of a main part showing a second embodiment of the present invention, and FIG. 6 is a sectional view of a main part showing a modification of the second embodiment. , FIG. 7 is a schematic diagram showing the stopper of FIG. 6. 1... Wafer, 2... Wafer sheet, 10.20... Wafer extract device, 11.21
River expand link, 11A, 21A... protruding link portion, 12.22... press ring, 13... strike member claw, 23... stopper, 15 (15A to 15E), 25 (25A to 25E) ...Expansion amount adjustment step. Agent Patent Attorney Osamu Shiokawa 3...Flatling, Figure 1ゝ11 Figure 2 Figure 3 Figure 4 Figure 1F Figure 5 1B

Claims (1)

[Claims] (1) Hold the outer periphery of a wafer sheet to which a wafer consisting of a group of pellets is attached in a flat ring, set this flat ring around the protruding ring part of the expand ring and press down, and the wafer sheet held by the flat ring In a wafer expanding device that expands a wafer on the protruding ring part, an expanding force applied to a flat ring set around the protruding ring part of the expand ring and pushing down the flat ring around the protruding ring part. a press ring that is moved downward by being given a pressure, and a stopper means that defines a lower limit position of the press ring, and a lower limit position of the press ring defined by the stopper means at least one of the press ring and the stopper means. 1. A wafer expansion device characterized by being provided with an expansion amount adjustment means that can adjust the amount of expansion.