PH12021550125A1 - Tape for glass processing - Google Patents
Tape for glass processingInfo
- Publication number
- PH12021550125A1 PH12021550125A1 PH12021550125A PH12021550125A PH12021550125A1 PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1 PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1
- Authority
- PH
- Philippines
- Prior art keywords
- sensitive adhesive
- pressure
- tape
- adhesive tape
- glass processing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Provided is a tape for glass processing capable of undergoing thermal contraction sufficiently in a short time, and capable of holding a kerf width. This tape for glass processing 10 comprises a pressure-sensitive adhesive tape 15 having a base material film 11 and a pressure-sensitive adhesive layer 12 formed on at least one surface side of the base material film 11 and is characterized in that: the pressure-sensitive adhesive tape 15 has a minus value for the sum of an integral value calculated as the total of the thermal deformation rates in the MD direction measured for every 1øC between 40øC and 80øC during a rise in temperature by a thermomechanical property testing machine and an integral value calculated as the total of thermal deformation rates in the TD direction measured for every 1øC between 40øC and 80øC during the temperature rise by the thermomechanical property testing machine; and the pressure-sensitive adhesive tape 15 is used for the processing of glass including an expanding step wherein the pressure-sensitive adhesive tape 15 is extended.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100125A JP7060547B2 (en) | 2019-05-29 | 2019-05-29 | Glass processing tape |
PCT/JP2020/009033 WO2020240962A1 (en) | 2019-05-29 | 2020-03-04 | Tape for glass processing |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12021550125A1 true PH12021550125A1 (en) | 2021-10-04 |
Family
ID=73547635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12021550125A PH12021550125A1 (en) | 2019-05-29 | 2021-01-18 | Tape for glass processing |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7060547B2 (en) |
KR (1) | KR102505582B1 (en) |
CN (1) | CN112368108B (en) |
PH (1) | PH12021550125A1 (en) |
SG (1) | SG11202100512QA (en) |
TW (1) | TWI755743B (en) |
WO (1) | WO2020240962A1 (en) |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0235117B2 (en) * | 1984-06-18 | 1990-08-08 | Daiho Kensetsu | SHIIRUDOKI |
JPH10310749A (en) * | 1997-05-13 | 1998-11-24 | Mitsui Chem Inc | Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer |
JP4358502B2 (en) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
JP2004273895A (en) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
JP5151015B2 (en) * | 2005-08-25 | 2013-02-27 | 東洋紡株式会社 | Heat-shrinkable polyester film and label and method for producing the same |
CN101668794A (en) * | 2007-05-08 | 2010-03-10 | 三井化学株式会社 | Crosslinked product of propylene polymer |
JP5290853B2 (en) | 2009-04-28 | 2013-09-18 | 三菱樹脂株式会社 | Dicing adhesive sheet |
JP5554118B2 (en) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
JP5801584B2 (en) | 2011-03-29 | 2015-10-28 | リンテック株式会社 | Dicing tape and chip-shaped part manufacturing method |
JP5764519B2 (en) | 2011-03-31 | 2015-08-19 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer processing method |
JP5294358B2 (en) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | Wafer processing tape and semiconductor device manufacturing method using the same |
CN104871295B (en) | 2012-12-26 | 2018-07-06 | 日立化成株式会社 | Extended method, the manufacturing method of semiconductor device and semiconductor device |
JP5379919B1 (en) * | 2013-02-13 | 2013-12-25 | 古河電気工業株式会社 | Adhesive tape for semiconductor processing |
JP6295135B2 (en) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
MY192661A (en) * | 2015-03-24 | 2022-08-30 | Furukawa Electric Co Ltd | Semiconductor processing tape |
MY181315A (en) | 2015-03-24 | 2020-12-21 | Furukawa Electric Co Ltd | Semiconductor processing tape |
JP6632115B2 (en) * | 2015-07-17 | 2020-01-15 | 藤森工業株式会社 | Adhesive resin layer and adhesive resin film |
JP2017147293A (en) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape |
JP2017174945A (en) | 2016-03-23 | 2017-09-28 | 京セラ株式会社 | Multilayer electronic component |
JP2018166148A (en) | 2017-03-28 | 2018-10-25 | リンテック株式会社 | Substrate film for dicing sheet and dicing sheet |
JP6535117B1 (en) * | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
-
2019
- 2019-05-29 JP JP2019100125A patent/JP7060547B2/en active Active
-
2020
- 2020-03-04 CN CN202080003846.4A patent/CN112368108B/en active Active
- 2020-03-04 SG SG11202100512QA patent/SG11202100512QA/en unknown
- 2020-03-04 WO PCT/JP2020/009033 patent/WO2020240962A1/en active Application Filing
- 2020-03-04 KR KR1020207037097A patent/KR102505582B1/en active IP Right Grant
- 2020-05-28 TW TW109117769A patent/TWI755743B/en active
-
2021
- 2021-01-18 PH PH12021550125A patent/PH12021550125A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN112368108B (en) | 2022-11-04 |
KR20210015888A (en) | 2021-02-10 |
JP2020194903A (en) | 2020-12-03 |
JP7060547B2 (en) | 2022-04-26 |
TW202043401A (en) | 2020-12-01 |
KR102505582B1 (en) | 2023-03-06 |
CN112368108A (en) | 2021-02-12 |
WO2020240962A1 (en) | 2020-12-03 |
SG11202100512QA (en) | 2021-03-30 |
TWI755743B (en) | 2022-02-21 |
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