PH12021550125A1 - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
PH12021550125A1
PH12021550125A1 PH12021550125A PH12021550125A PH12021550125A1 PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1 PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A PH12021550125 A PH 12021550125A PH 12021550125 A1 PH12021550125 A1 PH 12021550125A1
Authority
PH
Philippines
Prior art keywords
sensitive adhesive
pressure
tape
adhesive tape
glass processing
Prior art date
Application number
PH12021550125A
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12021550125A1 publication Critical patent/PH12021550125A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

Provided is a tape for glass processing capable of undergoing thermal contraction sufficiently in a short time, and capable of holding a kerf width. This tape for glass processing 10 comprises a pressure-sensitive adhesive tape 15 having a base material film 11 and a pressure-sensitive adhesive layer 12 formed on at least one surface side of the base material film 11 and is characterized in that: the pressure-sensitive adhesive tape 15 has a minus value for the sum of an integral value calculated as the total of the thermal deformation rates in the MD direction measured for every 1øC between 40øC and 80øC during a rise in temperature by a thermomechanical property testing machine and an integral value calculated as the total of thermal deformation rates in the TD direction measured for every 1øC between 40øC and 80øC during the temperature rise by the thermomechanical property testing machine; and the pressure-sensitive adhesive tape 15 is used for the processing of glass including an expanding step wherein the pressure-sensitive adhesive tape 15 is extended.
PH12021550125A 2019-05-29 2021-01-18 Tape for glass processing PH12021550125A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100125A JP7060547B2 (en) 2019-05-29 2019-05-29 Glass processing tape
PCT/JP2020/009033 WO2020240962A1 (en) 2019-05-29 2020-03-04 Tape for glass processing

Publications (1)

Publication Number Publication Date
PH12021550125A1 true PH12021550125A1 (en) 2021-10-04

Family

ID=73547635

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550125A PH12021550125A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7060547B2 (en)
KR (1) KR102505582B1 (en)
CN (1) CN112368108B (en)
PH (1) PH12021550125A1 (en)
SG (1) SG11202100512QA (en)
TW (1) TWI755743B (en)
WO (1) WO2020240962A1 (en)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235117B2 (en) * 1984-06-18 1990-08-08 Daiho Kensetsu SHIIRUDOKI
JPH10310749A (en) * 1997-05-13 1998-11-24 Mitsui Chem Inc Adhesive film for semiconductor wafer dicing, and dicing of semiconductor wafer
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Dividing method of semiconductor wafer
JP5151015B2 (en) * 2005-08-25 2013-02-27 東洋紡株式会社 Heat-shrinkable polyester film and label and method for producing the same
CN101668794A (en) * 2007-05-08 2010-03-10 三井化学株式会社 Crosslinked product of propylene polymer
JP5290853B2 (en) 2009-04-28 2013-09-18 三菱樹脂株式会社 Dicing adhesive sheet
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP5801584B2 (en) 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
JP5764519B2 (en) 2011-03-31 2015-08-19 古河電気工業株式会社 Dicing tape and semiconductor wafer processing method
JP5294358B2 (en) * 2012-01-06 2013-09-18 古河電気工業株式会社 Wafer processing tape and semiconductor device manufacturing method using the same
CN104871295B (en) 2012-12-26 2018-07-06 日立化成株式会社 Extended method, the manufacturing method of semiconductor device and semiconductor device
JP5379919B1 (en) * 2013-02-13 2013-12-25 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
MY192661A (en) * 2015-03-24 2022-08-30 Furukawa Electric Co Ltd Semiconductor processing tape
MY181315A (en) 2015-03-24 2020-12-21 Furukawa Electric Co Ltd Semiconductor processing tape
JP6632115B2 (en) * 2015-07-17 2020-01-15 藤森工業株式会社 Adhesive resin layer and adhesive resin film
JP2017147293A (en) * 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP2017174945A (en) 2016-03-23 2017-09-28 京セラ株式会社 Multilayer electronic component
JP2018166148A (en) 2017-03-28 2018-10-25 リンテック株式会社 Substrate film for dicing sheet and dicing sheet
JP6535117B1 (en) * 2018-03-28 2019-06-26 古河電気工業株式会社 Semiconductor processing tape

Also Published As

Publication number Publication date
CN112368108B (en) 2022-11-04
KR20210015888A (en) 2021-02-10
JP2020194903A (en) 2020-12-03
JP7060547B2 (en) 2022-04-26
TW202043401A (en) 2020-12-01
KR102505582B1 (en) 2023-03-06
CN112368108A (en) 2021-02-12
WO2020240962A1 (en) 2020-12-03
SG11202100512QA (en) 2021-03-30
TWI755743B (en) 2022-02-21

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