PH12019500713A1 - First protective film forming sheet - Google Patents

First protective film forming sheet

Info

Publication number
PH12019500713A1
PH12019500713A1 PH12019500713A PH12019500713A PH12019500713A1 PH 12019500713 A1 PH12019500713 A1 PH 12019500713A1 PH 12019500713 A PH12019500713 A PH 12019500713A PH 12019500713 A PH12019500713 A PH 12019500713A PH 12019500713 A1 PH12019500713 A1 PH 12019500713A1
Authority
PH
Philippines
Prior art keywords
buffer layer
curable resin
resin film
strain
test piece
Prior art date
Application number
PH12019500713A
Inventor
Masanori Yamagishi
Issei ADACHI
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12019500713A1 publication Critical patent/PH12019500713A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

This first protection film forming sheet is provided with a first base material, a buffer layer formed on the first base material, and a curable resin film formed on the buffer layer. When test pieces for each of the buffer layer and the curable resin film are fabricated having a diameter of 8 mm and a thickness of 1 mm, and a strain distribution measurement is performed to measure the shearing modulus G' of the test pieces by producing a strain in the test pieces under conditions of 90øC and 1 Hz, a shearing modulus Gb300' of the test piece for the buffer layer when the test piece for the buffer layer has a strain of 300 pcnt , and a shearing modulus Gc300' of the test piece for the curable resin film when the test piece for the curable resin film has a strain of 300 pcnt satisfy the relationship Gb300' = Gc300'.
PH12019500713A 2016-10-05 2019-04-02 First protective film forming sheet PH12019500713A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016197523 2016-10-05
PCT/JP2017/032468 WO2018066302A1 (en) 2016-10-05 2017-09-08 First protection film forming sheet

Publications (1)

Publication Number Publication Date
PH12019500713A1 true PH12019500713A1 (en) 2019-11-11

Family

ID=61830909

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019500713A PH12019500713A1 (en) 2016-10-05 2019-04-02 First protective film forming sheet

Country Status (7)

Country Link
JP (1) JP6344811B1 (en)
KR (1) KR102412725B1 (en)
CN (1) CN109791887B (en)
PH (1) PH12019500713A1 (en)
SG (1) SG11201902955QA (en)
TW (1) TWI649195B (en)
WO (1) WO2018066302A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108821231B (en) * 2018-06-26 2019-08-09 清华大学 A kind of surface based on mechanics principle has the high resiliency matrix and method of micro-structure
JP2020063362A (en) * 2018-10-17 2020-04-23 住友ベークライト株式会社 Adhesive composition for wet friction material
JP6859376B2 (en) * 2019-01-22 2021-04-14 グンゼ株式会社 Cover film
JP6697603B1 (en) * 2019-03-27 2020-05-20 グンゼ株式会社 Cover film
TW202136448A (en) * 2020-02-27 2021-10-01 日商琳得科股份有限公司 Protective coating formation sheet, method for producing chip equipped with protective coating, and layered product
WO2023136053A1 (en) * 2022-01-12 2023-07-20 リンテック株式会社 Sheet for forming first protective membrane, method for manufacturing semiconductor device, and use of sheet

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5830250B2 (en) * 2011-02-15 2015-12-09 日東電工株式会社 Manufacturing method of semiconductor device
JP5666335B2 (en) 2011-02-15 2015-02-12 日東電工株式会社 Protective layer forming film
JP2013004872A (en) * 2011-06-20 2013-01-07 Hitachi Chem Co Ltd Method of manufacturing semiconductor device, film glue, and adhesive sheet
JP5944155B2 (en) * 2011-12-12 2016-07-05 日東電工株式会社 LAMINATED SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING LAMINATED SHEET
JP6059499B2 (en) * 2012-10-05 2017-01-11 リンテック株式会社 Surface protection sheet
KR20140069508A (en) * 2012-11-29 2014-06-10 제일모직주식회사 Adhesive film for protecting surface of semiconductor wafer
TWI600740B (en) * 2012-11-30 2017-10-01 Lintec Corp Sheet having a curable resin film-forming layer, and method of manufacturing the semiconductor device using the same
JP5950869B2 (en) * 2013-06-20 2016-07-13 古河電気工業株式会社 Adhesive tape for semiconductor wafer surface protection
CN105452408B (en) * 2013-09-30 2019-03-19 琳得科株式会社 Composite sheet is used in resin film formation
JP2015084352A (en) 2013-10-25 2015-04-30 東レ株式会社 Multilayered sheet for gluing circuit member, and method for manufacturing semiconductor device
CN105765699A (en) * 2013-11-22 2016-07-13 琳得科株式会社 Dicing-sheet base film and base-film manufacturing method
JP6419728B2 (en) * 2014-01-21 2018-11-07 リンテック株式会社 Wafer protection adhesive sheet
JP6322013B2 (en) * 2014-03-20 2018-05-09 リンテック株式会社 Adhesive sheet
JP6347657B2 (en) 2014-04-22 2018-06-27 デクセリアルズ株式会社 Protective tape and method of manufacturing semiconductor device using the same

Also Published As

Publication number Publication date
SG11201902955QA (en) 2019-05-30
KR20190056385A (en) 2019-05-24
CN109791887B (en) 2023-04-28
TW201821270A (en) 2018-06-16
WO2018066302A1 (en) 2018-04-12
KR102412725B1 (en) 2022-06-23
CN109791887A (en) 2019-05-21
JPWO2018066302A1 (en) 2018-10-04
JP6344811B1 (en) 2018-06-20
TWI649195B (en) 2019-02-01

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