PH12015500100A1 - Mold release film - Google Patents

Mold release film

Info

Publication number
PH12015500100A1
PH12015500100A1 PH12015500100A PH12015500100A PH12015500100A1 PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1 PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A PH12015500100 A PH 12015500100A PH 12015500100 A1 PH12015500100 A1 PH 12015500100A1
Authority
PH
Philippines
Prior art keywords
mold release
release film
test piece
measurement
base layer
Prior art date
Application number
PH12015500100A
Inventor
Taniguchi Hirohito
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of PH12015500100A1 publication Critical patent/PH12015500100A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/005—Presence of styrenic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/006—Presence of styrenic polymer in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a mold release film having both mold release properties and embedding performance. The mold release film (1) according to the present invention comprises: a base layer (2) which comprises a polyolefin resin and a polystyrene resin having a syndiotactic structure; and a first mold release layer (3) which is arranged on the upper surface of the base layer (2) and is composed of a resin material containing a polystyrene resin having a syndiotactic structure as the main component. The mold release film (1) has a tensile storage elastic modulus (E') of 1.0 x 106 to 5.0 x 108 Pa at 120oC and 1.0 x 107 to 1.0 x 109 Pa at 170oC as measured by a test method in accordance with JIS K 7244 under such conditions that the length of a test piece is 40 mm, the width of the test piece is 4 mm, the length of the test piece between clamps is 20 mm, the measurement starting temperature is 25oC, the measurement termination temperature is 250oC, the temperature rising rate is 5oC/min, and the measurement frequency is 1 Hz.
PH12015500100A 2012-07-17 2015-01-14 Mold release film PH12015500100A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012158584A JP5895755B2 (en) 2012-07-17 2012-07-17 Release film
PCT/JP2013/068396 WO2014013884A1 (en) 2012-07-17 2013-07-04 Mold release film

Publications (1)

Publication Number Publication Date
PH12015500100A1 true PH12015500100A1 (en) 2015-03-02

Family

ID=49948714

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500100A PH12015500100A1 (en) 2012-07-17 2015-01-14 Mold release film

Country Status (6)

Country Link
JP (1) JP5895755B2 (en)
KR (1) KR20150035596A (en)
CN (1) CN104507680B (en)
PH (1) PH12015500100A1 (en)
TW (1) TWI554375B (en)
WO (1) WO2014013884A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398221B2 (en) * 2014-02-26 2018-10-03 住友ベークライト株式会社 Release film for producing resin-encapsulated semiconductor device, method for producing release film for producing resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device
JP6303727B2 (en) * 2014-03-31 2018-04-04 住友ベークライト株式会社 Release film
JP6467800B2 (en) * 2014-07-30 2019-02-13 住友ベークライト株式会社 Release film
JP6648400B2 (en) * 2014-11-10 2020-02-14 凸版印刷株式会社 Terminal resin film, tab and power storage device using the same
CN110461594B (en) * 2017-03-22 2021-02-12 住友电木株式会社 Release film and method for manufacturing flexible printed circuit board
EP3904090A4 (en) * 2018-12-28 2022-09-14 Kuraray Co., Ltd. Base film for decorative film and decorative film including same
JP7281381B2 (en) * 2019-10-04 2023-05-25 出光興産株式会社 Resin laminate for low dielectric materials
CN114080866B (en) * 2020-10-21 2022-09-16 住友电木株式会社 Release film and method for producing molded article
CN113924825B (en) * 2020-10-21 2022-10-25 住友电木株式会社 Release film and method for producing molded article
JP6870775B1 (en) * 2020-10-21 2021-05-12 住友ベークライト株式会社 Manufacturing method of release film and molded product

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001161747A (en) * 1999-12-08 2001-06-19 Kao Corp Absorptive article
JP2004082502A (en) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd Release film
JP5585079B2 (en) * 2007-07-31 2014-09-10 住友ベークライト株式会社 Release film
JP5272589B2 (en) * 2008-09-01 2013-08-28 住友ベークライト株式会社 Release film
JP5353217B2 (en) * 2008-12-11 2013-11-27 住友ベークライト株式会社 Release film, adhesion method using the same, and circuit board manufacturing method
TWI451959B (en) * 2009-10-19 2014-09-11 Kureha Corp Solvent release film and laminates made of polyphenylene sulfide resin
JP2011088287A (en) * 2009-10-20 2011-05-06 Pilot Ink Co Ltd Multi-lead writing utensil
JP2011088387A (en) * 2009-10-23 2011-05-06 Idemitsu Kosan Co Ltd Laminate for manufacturing flexible printed board
WO2011099252A1 (en) * 2010-02-09 2011-08-18 住友ベークライト株式会社 Laminated film
JP5488809B2 (en) * 2010-02-09 2014-05-14 住友ベークライト株式会社 Laminated film
JP5557152B2 (en) * 2010-02-09 2014-07-23 住友ベークライト株式会社 Laminated film
CN102763211B (en) * 2010-06-02 2014-11-05 三井化学东赛璐株式会社 Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet

Also Published As

Publication number Publication date
WO2014013884A1 (en) 2014-01-23
KR20150035596A (en) 2015-04-06
JP5895755B2 (en) 2016-03-30
TW201406518A (en) 2014-02-16
CN104507680A (en) 2015-04-08
CN104507680B (en) 2016-10-19
TWI554375B (en) 2016-10-21
JP2014019017A (en) 2014-02-03

Similar Documents

Publication Publication Date Title
PH12015500100A1 (en) Mold release film
PH12017500284B1 (en) Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
MY182272A (en) Mold release film and process for producing sealed body
PH12019500713A1 (en) First protective film forming sheet
IN2014DN08940A (en)
WO2014172237A3 (en) Methods of forming laminated glass structures
MY181765A (en) Heat-resistant adhesive sheet for semiconductor testing
MY170899A (en) Release film for green sheet manufacturing, release film manufacturing method for green sheet manufacturing, green sheet manufacturing method, and green sheet
MY154860A (en) Adhesive sheet for wafer bonding and method of processing a wafer by using the same
AR084330A1 (en) ETHYLENE-BASED POLYMERS AND PROCESSES TO FORM THEM
TW201334939A (en) Release film and method of manufacturing semiconductor device using same
MY171136A (en) Release film for ceramic green sheet producion process
MX2015009923A (en) In-line tie articles and methods of manufacture and use.
BR112015020014A2 (en) contact closure structures
TN2015000494A1 (en) Stone, flood dam and method for fabricating the latter
PH12017502382A1 (en) Release film for ceramic green sheet production process
PH12016500381A1 (en) Adhesive film and method for manufacturing seminconductor device
MY178423A (en) Pressure sensitive adhesive sheet and method of manufacturing processed device-related member
MX2015017108A (en) Foam gasket and bonding tape based on polyurethane dispersions.
MY192661A (en) Semiconductor processing tape
GB201015117D0 (en) Authentication of articles
WO2013002614A3 (en) Polyamic acid, polyamic acid solution, polyimide protective layer, and polyimide film
MX2011008463A (en) Flexible insulation system for high temperatures.
MX2015006622A (en) Moulded catching elements and method for manufacturing same.
AR092029A1 (en) INSULATIONS CONTAINING NON-MIGRATORY ANTISTATIC AGENT