JP2010098088A - Lengthy body of tape for processing wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lengthy body of a tape for processing a wafer capable of preventing an exfoliation of an adhesive tape from the film with a parting treatment applied when using the tape for processing the wafer to prevent a riding up of the adhesive film. <P>SOLUTION: The lengthy body of the tape for processing the wafer includes: a lengthy film 11; an adhesive agent layer 12 provided on a first surface of the film 11 and having the predetermined planar shape; a label 13a covering the adhesive agent layer 12, provided so as to contact the film 11 at the periphery of the adhesive agent layer 12, and having the predetermined planar shape; an adhesive tape 14b comprising an adhesive film 13 having a periphery part 13b provided so as to surround the outer circumference of the label 13a and adhered on the adhesive film 13 of the periphery part 13b; and an adhesive tape 14a adhered to a first surface of the lengthy film 11 and the opposite side second surface. Part of an adhesive surface between the adhesive tapes 14a, 14b is adhered to form an adhesive part 15. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a long body of a wafer processing tape, and more particularly to a long body of a wafer processing tape having two functions of a dicing tape and a die bonding film.

  Recently, a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and separated into individual chips (dicing) and a semiconductor chip that has been cut are bonded to a lead frame, a package substrate, or the like, or stacked. As a package, a dicing die bonding tape having two functions of a die bonding film (also referred to as a die attach film) for laminating and adhering semiconductor chips has been developed.

  As such a dicing die bonding tape, there is a tape that has been precut in consideration of workability such as attachment to a wafer and attachment to a ring frame during dicing (for example, Patent Document 1). reference).

  An example of a pre-cut dicing die bonding tape is shown in FIG. FIG. 4 is a schematic view of the dicing die bonding tape 50. As shown in FIG. 4, the dicing die bonding tape 50 includes a film 51, an adhesive layer 52, and an adhesive film 53. The adhesive layer 52 is processed into a circle corresponding to the shape of the wafer, and has a circular label shape. The adhesive film 53 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 53 includes a circular label portion 53a and a peripheral portion 53b surrounding the outside. Have. The adhesive layer 52 and the circular label portion 53a of the pressure-sensitive adhesive film 53 are laminated with their centers aligned, and the circular label portion 53a of the pressure-sensitive adhesive film 53 covers the adhesive layer 52 and has a film 51 around it. Touching.

When dicing the wafer, the film 51 is peeled off from the label composed of the adhesive layer 52 and the adhesive film 53 in a laminated state, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 52 as shown in FIG. The dicing ring frame R is adhesively fixed to the outer periphery of the circular label portion 53a of the adhesive film 53. In this state, the semiconductor wafer W is diced, and then the adhesive film 53 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive film 53 has a reduced adhesive force due to the curing process, the adhesive film 53 is easily peeled off from the adhesive layer 52, and the semiconductor chip is picked up with the adhesive layer 52 attached to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.
JP 2007-2173 A

  Incidentally, the dicing die bonding tape 50 as described above is a long product as shown in FIG. Therefore, when the dicing die bonding tape 50 is manufactured, if a plurality of defective labels exist continuously, for example, the dicing die bonding tape 50 is cut after removing the label, and the adhesive tape is used again. Bonding is performed to prepare a dicing die bonding tape 50 having a specified length and a specified number of labels.

FIG. 6 is a view showing a portion where the label is peeled off and two dicing die bonding tapes 50 are joined. FIG. 6A and FIG. 6B are a plan view and a XX line end view of the dicing die bonding tape 50. As shown in FIG. 6, the joint portion 60 in which the dicing die bonding tape 50 is joined to each other in the middle of the long body is formed as follows.
(1) Peel off the label (the label made up of the adhesive layer 52 and the adhesive film 53 in a laminated state) to be spliced.
(2) The film 50 is cut.
(3) After the cut portions of the film 50 are brought together and face-to-face aligned, the adhesive tape 61 (61a) is applied to the film 50.
(4) Adhesive tape 61 (61b) is also affixed on the adhesive film 53b on the opposite side to which adhesive tape 61a has been affixed.
(5) The adhesive tape 61 protruding from the film width direction side is cut out.

  When the dicing die bonding tape 50 is used, the label is peeled off. For this reason, the surface of the film 51 is subjected to a mold release process. Moreover, the adhesive tape affixed to the peripheral part 53b side of an adhesive film so that the joint part 60 formed as mentioned above may be covered is very short, as shown in FIG. Therefore, when the dicing / die bonding tape 50 is used, the adhesive tape 61b of the joint portion 60 is peeled off from the film 51 that has been subjected to the release treatment, and the adhesive film 53b is rolled up.

  Accordingly, an object of the present invention is to prevent the adhesive tape having a short joint from being peeled off from the film which has been subjected to the mold release treatment when using the dicing die bonding tape, and as a result, the adhesive film is rolled up. An object of the present invention is to provide a long wafer processing tape that prevents this.

  In order to achieve the above object, in the long body of the wafer processing tape according to the present invention, the first adhesive tape affixed on the peripheral adhesive film and the first of the long film The second adhesive tape is attached to the second surface opposite to the surface, and a part of the adhesive surfaces of the first and second adhesive tapes are bonded together to form an adhesive portion.

  Specifically, the long body of the wafer processing tape according to the present invention includes a long film, an adhesive layer having a predetermined planar shape provided on the first surface of the film, and the adhesive. A label portion having a predetermined planar shape so as to cover the adhesive layer and contact the film around the adhesive layer, and a peripheral portion provided so as to surround the outer periphery of the label portion. It is a long body of a wafer processing tape comprising an adhesive film having a first adhesive tape affixed on the peripheral adhesive film, and a side opposite to the first surface of the long film. It has the 2nd adhesive tape stuck on the 2nd surface, and the 1st and the 2nd above-mentioned adhesive tapes paste a part of adhesive surfaces together, and form an adhesion part, It is characterized by the above-mentioned. It is a long body of a tape for wafer processing.

  When the wafer processing tape is used as the dicing die bonding tape by the adhering portion formed by adhering a part of the adhesive surfaces of the first and second adhesive tapes, the first adhesive tape and the second adhesive tape are used. Since the adhesive tape is not peeled off, the adhesive tape is prevented from peeling off from the film, and as a result, the adhesive film can be prevented from rolling up.

  As a long body of a wafer processing tape according to the present invention, the first and second adhesive tapes are a plurality of wafer processing tapes cut obliquely with respect to the longitudinal direction of the wafer processing tape. Are preferably joined.

  Since the first and second adhesive tapes join a plurality of wafer processing tapes cut obliquely with respect to the longitudinal direction of the wafer processing tape, it is easy and accurate by matching the cut surfaces. The two wafer processing tapes can be aligned.

  As a long body of the wafer processing tape according to the present invention, it is preferable that the first pressure-sensitive adhesive tape is attached to a long film in a region other than the label portion and a peripheral portion of the pressure-sensitive adhesive film.

  Since the first adhesive tape is affixed to the long film in the area other than the label part and the peripheral part of the adhesive film, the first adhesive tape is not affixed on the label part of the adhesive film, When using a wafer processing tape as a dicing die bonding tape, the label part can be easily peeled off together with the adhesive layer.

  As the long body of the wafer processing tape according to the present invention, it is preferable that the sticking portion is formed so as to protrude in the width direction of the long film.

  Since the sticking part is formed so as to protrude in the width direction of the long film, a part of the adhesive surfaces of the first and second adhesive tapes can be easily pasted without processing the film. Together, a sticking part can be formed.

  As a long body of the tape for wafer processing which concerns on this invention, it has a 1st notch part in the area | region of the elongate film in which the said 1st adhesive tape was affixed, and the said sticking part is a said 1st. Preferably, it is formed in the notch.

  Since it has a 1st notch part in the area | region of the elongate film in which the 1st adhesive tape was affixed, a 1st adhesive tape and a 2nd adhesive tape are via a 1st notch part. Adhesion becomes possible, and the sticking part can be formed in the first cutout part. From the film, the first and second adhesive tapes are not peeled off when the wafer processing tape is used as the dicing die bonding tape by the sticking part formed in the first cutout part. It is possible to prevent the adhesive tape from peeling off, and as a result, it is possible to prevent the adhesive film from rolling up. Furthermore, the sticking part can be formed without protruding in the width direction of the long film.

  As a long body of a wafer processing tape according to the present invention, a second cutout portion is provided in an area of a peripheral portion of the adhesive film to which the first adhesive tape is affixed. It is also preferable that a third cutout portion is provided at a position corresponding to the second cutout portion, and the sticking portion is formed in the second cutout portion and the third cutout portion.

  The first and second adhesive tapes are not peeled off when the wafer processing tape is used as the dicing die bonding tape by the sticking portions formed in the second and third cutout portions. The adhesive tape can be prevented from peeling off from the film, and as a result, the adhesive film can be prevented from rolling up. Furthermore, the sticking part can be formed without protruding in the width direction of the long film. In addition, since the position of a 2nd notch part should just be provided in the peripheral part to which an adhesive tape is affixed, the freedom degree of manufacture can be improved.

  As a long body of the wafer processing tape according to the present invention, it is preferable that at least one of the first and second adhesive tapes is a colored member.

  Since at least one of the first and second adhesive tapes is a colored member, it can be easily confirmed visually or by a color difference meter that there is a joint portion joined to the long body of the wafer processing tape. . Moreover, when only the 1st adhesive tape stuck on the adhesive film of the peripheral part is a coloring member, it can prevent forgetting to stick the 1st adhesive tape in the case of joining of the tape for wafer processing.

  As the long body of the wafer processing tape according to the present invention, it is desirable that the first adhesive tape stuck on the peripheral portion does not protrude from the long film.

  When the wafer processing tape is used, since the label portion is peeled off together with the adhesive layer, the film 51 is subjected to a mold release process. Therefore, when the first adhesive tape affixed on the peripheral part protrudes from the long film, the protruding part is easily peeled off, and the adhesive tape is peeled off starting from the peeled part. When 1 adhesive tape does not protrude into a long film, it can prevent that an adhesive tape peels.

  According to the long wafer processing tape of the present invention, the bonding part formed by bonding a part of the adhesive surfaces of the first and second adhesive tapes together is used as a dicing die bonding tape for wafer processing. When the tape is used, the first adhesive tape and the second adhesive tape are not peeled off, so that the adhesive tape is prevented from peeling off from the film, and as a result, the adhesive film is prevented from rolling up. be able to.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1A is a wafer processing tape (dicing die bonding tape) according to an embodiment of the present invention, which is for wafer processing cut along an AA line in an oblique direction with respect to the longitudinal direction. FIG. 1B is a plan view of a wafer processing tape bonded with an adhesive tape, FIG. 1B is an end view taken along the line AA of FIG. 1A, and FIG. It is the L section enlarged view.

  As shown in FIGS. 1A and 1B, a wafer processing tape 10 includes a long film 11, a circular adhesive layer 12 provided on the film 11, an adhesive film 13, and the like. Have The pressure-sensitive adhesive film 13 covers the adhesive layer 12 and adheres to the circular label portion 13 a provided so as to contact the film 11 around the adhesive layer 12 and both end portions in the width direction of the film 11. The peripheral part 13b provided continuously along the longitudinal direction of the film 11 so that the outer periphery of the laminated body of the agent layer 12 and the label part 13a may be enclosed.

  As shown in FIG. 1 (a), the wafer processing tape 10 is peeled off from the film 11 from the laminate 11 composed of the adhesive layer 12 and the label portion 13a, and then, in the longitudinal direction of the wafer processing tape 10. On the other hand, it is cut along the line AA in an oblique direction. The cut wafer processing tape 10 is bonded using the adhesive tapes 14a and 14b. The adhesive tape 14a is attached to the film 11 so as to cover the entire cutting line along the cutting direction of the wafer processing tape 10 from the opposite surface of the film 11 on which the adhesive layer 12 is provided. The adhesive tape 14b is affixed so that the cutting line on the peripheral part 13b of the adhesive film 13 may be covered.

  Therefore, even when the adhesive tape 14b is affixed to the film 11 in the region other than the label portion 13a and the peripheral 13b portion of the adhesive film, the adhesive tape 14b is not affixed on the label portion 13a of the adhesive film. When the wafer processing tape 10 is used as a dicing die bonding tape, the label portion 13b can be easily peeled off together with the adhesive layer 12.

  Furthermore, as shown in FIG. 1A and FIG. 1B, the adhesive tape 14a and the adhesive tape 14b are bonded together by protruding a part of each adhesive surface from the lateral direction of the film 11. Yes.

  When the wafer processing tape 10 is used by the sticking part 15 formed by bonding the adhesive tapes 14a and 14b, the adhesive tapes 14a and 14b are not peeled off. Can be prevented, and as a result, the adhesive film can be prevented from rolling up.

  Moreover, since the sticking part 15 is formed so as to protrude in the width direction of the film 11, a part of the adhesive surfaces of the first and second adhesive tapes can be easily obtained without processing the film 11. Can be pasted together to form a sticking part.

  Moreover, as shown in FIGS. 1 (a) to 1 (c), the adhesive tape 14b affixed on the peripheral portion 13b of the adhesive film is a laminate label composed of the adhesive layer 12 and the label portion 13a. It sticks so that it may not protrude on the surface of the film 11 which appears after peeling from the film 11.

  When the wafer processing tape 10 is used, since the label portion 13a is peeled off together with the adhesive layer 12, the film 11 is subjected to a mold release process. Therefore, when the adhesive tape 14b stuck on the peripheral portion 13b protrudes from the film 11, the protruding portion is easily peeled off, and the adhesive tape 14b is peeled off from the peeled portion, whereas the adhesive tape 14b Can prevent the adhesive tape 14b from being peeled off.

  Further, when at least one of the adhesive tapes 14a and 14b has been colored, it can be easily confirmed visually or by a color difference meter that there is a joint joined to the wafer processing tape 10 using the adhesive tape 14. can do. Moreover, when the coloring process is performed only to the adhesive tape 14b stuck on the adhesive film 13 of the peripheral part 13b, it is possible to prevent the adhesive tape 14b from being forgotten to be stuck when the wafer processing tape 10 is joined. it can.

  The wafer processing tapes cut in the longitudinal direction and the oblique direction of the wafer processing tape 10 are joined using the adhesive tapes 14a and 14b. Therefore, the two wafer processing tapes can be aligned easily and accurately by matching the cut surfaces.

  Hereafter, each component of the tape 10 for wafer processing of this embodiment is demonstrated in detail.

(the film)
As the film 11 used for the wafer processing tape 10 of the present invention, a known film such as a polyethylene terephthalate (PET) type, a polyethylene type, or a film subjected to a release treatment can be used. The thickness of the film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer 12 of the present invention is formed on the first surface 11a of the film 11 and has a circular label shape corresponding to the shape of the wafer.

  The adhesive layer 12 is attached to the back surface of the chip when the chip is picked up after the semiconductor wafer or the like is bonded and diced, and is used as an adhesive for fixing the chip to the substrate or the lead frame. Is. As the adhesive layer 12, an adhesive including at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
As described above, the adhesive film 13 of the present invention has the circular label portion 13a corresponding to the shape of the ring frame for dicing, and the peripheral portion 13b surrounding the outside. Such an adhesive film can be formed by removing the peripheral region of the circular label portion 13a from the film-like adhesive by precut processing.

  The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the wafer does not peel when dicing the wafer, and can be easily peeled from the adhesive layer when picking up the chip after dicing. Any material that exhibits low adhesive strength may be used. For example, what provided the adhesive adhesive layer in the base film can be used conveniently.

  The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.
The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

  The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do.

  It is preferable to prepare a pressure-sensitive adhesive by appropriately mixing an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like with the resin of the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

  A radiation-polymerizable compound can be blended in the pressure-sensitive adhesive layer to facilitate peeling from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.

Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction.
The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

(Adhesive tape)
As the adhesive tape 14, for example, an adhesive tape obtained by applying an adhesive to a resin film substrate can be suitably used. As the base resin for the adhesive tape, polyethylene terephthalate (PET) and polyester are preferable from the viewpoint of heat resistance, smoothness, and availability. The composition and physical properties of the adhesive of the adhesive tape are not particularly limited, and those that do not peel from the film 11 in the winding process and storage process of the wafer processing tape 10 are preferable.

<Modification 1>
A modification of the embodiment of the present invention will be described with reference to FIG. FIG. 2 (a) shows a wafer processing tape (dicing / die bonding tape), and the wafer processing tape cut obliquely with respect to the longitudinal direction along the line BB is used with an adhesive tape. 2B is a plan view of the bonded wafer processing tape, FIG. 2B is an end view taken along the line BB in FIG. 2A, and FIG. 2C is an enlarged view of a portion M in FIG.

  As shown in FIG. 2 (a), the wafer processing tape 20 is formed in the longitudinal direction of the wafer processing tape 20 after peeling the label of the laminated body composed of the adhesive layer 22 and the label portion 23a from the film 21. On the other hand, it is cut along the line BB in an oblique direction. And the cut | disconnected tape 20 for wafer processing is joined using the adhesive tapes 24a and 24b. The adhesive tape 24a is attached to the film 21 so as to cover the entire cutting line along the cutting direction of the wafer processing tape 20 from the opposite surface of the film 21 on which the adhesive layer 22 is provided. The adhesive tape 24b is affixed so that the cutting line on the peripheral part 23b of the adhesive film 23 may be covered.

  Furthermore, as shown in FIG. 2A to FIG. 2C, the adhesive tape 24 b attached to the peripheral portion 23 b protrudes to the film 21. In a region that protrudes from the film 21, a notch 26 that penetrates the film 21 is provided. Therefore, the adhesive tape 24 a and the adhesive tape 24 b form a pasting portion 25 through a notch portion 26 provided in the film 21 at a part of each adhesive surface.

  Therefore, since it has the notch part 26 in the area | region of the film 21 to which the adhesive tape 24b was stuck, it becomes possible for the adhesive tape 24a and the adhesive tape 24b to adhere | attach via the notch part 26, and a notch part. The sticking part 25 can be formed in 26. When the wafer processing tape is used as the dicing die bonding tape by the sticking part 25 formed in the notch part 26, the adhesive tapes 24a and 24b are not peeled off. Can be prevented, and as a result, the adhesive film 24b can be prevented from rolling up. Furthermore, the sticking part 25 can be formed without protruding from the width direction of the long film 21.

<Modification 2>
Another modification of the embodiment of the present invention will be described with reference to FIG. FIG. 3A is a wafer processing tape (dicing / die bonding tape), and the wafer processing tape cut obliquely with respect to the longitudinal direction along the line C-C is used with an adhesive tape. 3B is a plan view of the bonded wafer processing tape, FIG. 3B is an end view taken along the line CC of FIG. 3A, and FIG. 3C is an enlarged view of a portion N of FIG.

  As shown in FIG. 3 (a), the wafer processing tape 30 is formed in the longitudinal direction of the wafer processing tape 30 after peeling the label of the laminate composed of the adhesive layer 32 and the label portion 33a from the film 31. On the other hand, it is cut along the line CC in an oblique direction. The cut wafer processing tape 30 is bonded using the adhesive tapes 34a and 34b. The adhesive tape 34 a is attached to the film 31 so as to cover the entire cutting line along the cutting direction of the wafer processing tape 30 from the opposite surface of the film 31 on which the adhesive layer 32 is provided. The adhesive tape 34b is affixed so that the cutting line on the peripheral part 33b of the adhesive film 33 may be covered.

  Further, as shown in FIGS. 3A to 3C, the adhesive tape 34 b attached to the peripheral portion 33 b does not protrude from the width direction of the film 31. For this reason, the notch part 36b which penetrates the adhesive film 33 in the area | region of the peripheral part 33b of the adhesive film in which the adhesive tape 34b was stuck is added to the position corresponding to this notch part 36b of the film 31 in addition. A cutout portion 36 a penetrating 31 is provided. Therefore, the adhesive tape 34a and the adhesive tape 34b are attached to a part of each adhesive surface via a notch 36a provided in the film 31 and a notch 36b provided in the peripheral part 33b of the adhesive film 33. A portion 35 is formed.

  Therefore, it has the notch part 36b provided in the area | region of the peripheral part 33b of an adhesive film, and the notch part 36a provided in the area | region of the film 31 provided in the position corresponding to this notch part 36b. Therefore, the adhesive tape 34a and the adhesive tape 34b can be adhered via the two notches 36a and 36b, and the sticking portion 35 is formed in the corresponding two notches 36a and 36b. Can do. When the wafer processing tape is used as the dicing die bonding tape, the adhesive tapes 34a and 34b are prevented from being peeled off by the sticking portion 35 formed in the two cutout portions 36a and 36b. It is possible to prevent the adhesive film 34b from rolling up. Furthermore, the sticking part 35 can be formed without protruding from the width direction of the long film 31. In addition, since the position of a notch part should just be provided in the peripheral part to which an adhesive tape is affixed, the freedom degree of manufacture can be improved.

  As described above, according to the long wafer processing tape according to the present embodiment, the adhesive tape attached on the peripheral adhesive film in order to join the cut wafer processing tape using the adhesive tape. And a part of adhesive surfaces with the adhesive tape affixed on the elongate film in which the adhesive film is not affixed are bonded together, and an adhesion part is formed. As a result, when wafer processing tape is used as a dicing die bonding tape, it prevents the adhesive tape from peeling off from the film that has been subjected to the mold release treatment, and as a result, the adhesive film rips from the long film. It can be prevented from going up.

(A) is a top view of the tape for wafer processing which concerns on embodiment of this invention, (b) is an AA line end elevation, (c) is the L section enlarged view. (A) is a top view of the wafer processing tape which is a modification, (b) is a BB line end view, (c) is an M section enlarged view. (A) is a top view of the tape for wafer processing which is another modification, (b) is a CC line end view, (c) is the N section enlarged view. It is a schematic diagram of the conventional wafer processing tape. It is sectional drawing which shows the state by which the tape for wafer processing and the ring frame for dicing were bonded together. (A) is a top view of the conventional tape for wafer processing, (b) is an XX line end view.

Explanation of symbols

10, 20, 30, 50: Wafer processing tapes 11, 21, 31: Films 12, 52: Adhesive layers 13, 23, 33: Adhesive films 13a, 53b: Circular label portions 13b, 23b, 33b, 53b: Periphery Part 14, 14a, 14b, 24, 24a, 24b, 34, 34a, 34b: Adhesive tape 15, 25, 35: Adhering part 26, 36a, 36b: Notch

Claims (8)

A long film,
An adhesive layer having a predetermined planar shape provided on the first surface of the film;
A label portion having a predetermined planar shape that covers the adhesive layer and is in contact with the film around the adhesive layer, and a peripheral portion that surrounds the outer periphery of the label portion It is a long body of a wafer processing tape consisting of an adhesive film having
A first adhesive tape affixed on the peripheral adhesive film;
A second adhesive tape affixed to the second surface opposite to the first surface of the long film;
The first and second pressure-sensitive adhesive tapes are formed by attaching a part of the pressure-sensitive adhesive surfaces to form a sticking portion.   The said 1st and said 2nd adhesive tape joins several tapes for wafer processing cut | disconnected in the diagonal direction with respect to the longitudinal direction of the said wafer processing tape. Long body of wafer processing tape. The first adhesive tape is
The long body of the tape for wafer processing according to claim 1 or 2, wherein the tape is attached to a long film in a region other than the label portion and a peripheral portion of the adhesive film.   The said sticking part protrudes in the width direction of the said elongate film, and is formed in the elongate body of the tape for wafer processing of any one of Claims 1-3 characterized by the above-mentioned. In the area of the long film on which the first adhesive tape is affixed, a first notch is provided,
The said sticking part is formed in the said 1st notch part, The long body of the tape for wafer processing of any one of Claims 1-4 characterized by the above-mentioned. In the area of the peripheral part of the pressure-sensitive adhesive film to which the first pressure-sensitive adhesive tape is affixed, there is a second notch,
A third cutout portion at a position corresponding to the second cutout portion of the long film;
The said sticking part is formed in the said 2nd and 3rd notch part, The elongate body of the tape for wafer processing of any one of Claims 1-5 characterized by the above-mentioned.   The long body of a tape for wafer processing according to any one of claims 1 to 6, wherein at least one of the first and second adhesive tapes is a colored member.   The long body of the tape for wafer processing according to any one of claims 1 to 7, wherein the first adhesive tape stuck on the peripheral portion does not protrude from the long film. .

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