TW201405694A - Adhesive tape, adhesive tape joining method and adhesive tape joining apparatus - Google Patents

Abstract

A raw material tape adhering an elongated adhesive tape to an elongated carrier tape is reeled out from a raw material roll; an adhesive tape T is half-cut on the carrier tape into an adhesive tape sheet with a circular cutting member having a circular arc shape at both sides in a width direction of the raw material tape and having a linear shape at the front and the rear of a longitudinal direction of the raw material tape; and by folding and moving the carrier tape with an edge member, the adhesive tape sheet is peeled from the carrier tape while the adhesive tape sheet is joined to a ringframe which is synchronized with a peeling speed and moved relatively.

Description

Adhesive tape, adhesive tape attachment method and adhesive tape attachment device

The present invention relates to an adhesive tape attached to an annular frame for holding a semiconductor wafer, and an adhesive tape attaching method and an adhesive tape attaching device for attaching the adhesive tape to the annular frame.

In order to make the semiconductor wafer thinned by the back surface polishing process (hereinafter referred to as "wafer" as appropriate), it is easy to handle, and in order to perform the dicing process, it is to be looped via the adhesive tape (cut tape) for support. The center of the frame then holds the wafer.

The attaching process of the dicing tape is, for example, as exemplified below. A tape-like adhesive film provided on the tape-like substrate is added from the roll. The adhesive film is pre-cut into a circular shape on the substrate to form a dicing tape. The base tape on which the dicing tape is formed is guided to an attachment means composed of the edge members, and the base tape is folded back to peel off the dicing tape. The dicing tape to be peeled off is simultaneously attached to the annular frame and the wafer disposed at the center of the annular frame (refer to Japanese Laid-Open Patent Publication No. 2005-116928).

As shown in Fig. 4(c), the dicing tape is formed by arranging circular dicing tapes at predetermined intervals on the substrate.

In addition, as far as the dicing tape is concerned, as shown in Fig. 4(a), On the substrate, the strip-shaped material is cut into a substantially circular shape to have a straight portion at four places in the front, rear, left, and right in the longitudinal direction, and a plurality of dicing tapes are connected in line with each other in front and rear straight portions (refer to Japan Special Open 2011). -192850 bulletin).

The dicing tape shown in Fig. 4(c) is formed by cutting at a predetermined interval and halfway, and if it is only one interval of the front and rear dicing tapes, it is a short distance. Therefore, it is considered that there is no obstruction when the cut tape is discarded. However, when viewed in the unit of the raw material roll, the number of cut pieces that are cut into a circular shape is large, and the amount of waste is cumulatively increased. Therefore, in the treatment of attaching the adhesive tape to the annular frame and the wafer, the frequency of exchange of the raw material coil wound with the dicing tape is increased, and the work efficiency is lowered.

Further, the dicing tape shown in Fig. 4(a) causes the straight portions of the adhesive tape sheet to be in line contact with each other, so that no discarded portions are generated in the longitudinal direction. However, when the adhesive tape is peeled off from the substrate, although it has been half cut, the adhesive tape of the peeling object and the adhesive layer of the subsequent adhesive tape are stuck to each other frequently.

If the attachment process is continued in this state, wrinkles are generated on the end side before the subsequent application of the tape. Therefore, there arises a problem that the dicing tape cannot be closely adhered to the annular frame or the like.

The present invention has been made in view of such circumstances, and an object thereof is to provide an adhesive tape which can be effectively cut from a belt-shaped adhesive tape to be attached to an annular frame and which can be attached to the annular frame with high precision. Adhesive tape, adhesive tape attachment method and adhesive tape attachment device.

In order to achieve such a purpose, the present invention adopts the following configuration.

That is, an adhesive tape is attached to the annular frame and the semiconductor wafer, and the adhesive tape includes a configuration in which a linear end having opposite sides and a circular end connected to the linear ends are connected. The plurality of sheets are adhered to the strips so that the linear end edges of each other are arranged close to each other on the long carrier tape.

According to the adhesive tape, since the plurality of adhesive tape sheets having the linear end edges in the longitudinal direction of the carrier tape are formed such that the linear end faces approach each other, the amount of use of each adhesive tape can be reduced.

Further, since the distance between the cut portions between the front and rear adhesive tape sheets arranged on the carrier tape is shortened, the discarded portion of the adhesive tape after the half cut can be reduced. Therefore, the number of the adhesive tape sheets disposed on the carrier tape can be increased, and the exchange frequency of the adhesive tape roll can be reduced.

Further, the adhesive tape sheet may have a pair of linear end edges which are parallel along the side edges of the carrier tape. That is, the adhesive tape may have a shape having four linear end edges on the front, rear, left, and right sides. By the adhesive tape, when a plurality of adhesive tape rolls are formed by cutting a wide width of the raw material roll into a predetermined width, the adhesive tape can be shortened by forming an arc-shaped end edge in the width direction. More rolls of predetermined width are produced from the stock roll. In addition, the amount of waste of the raw material roll can also be reduced.

Further, in order to achieve such a purpose, the present invention adopts the following configuration.

That is, an adhesive tape attaching method is to attach an adhesive tape In the annular frame, the foregoing method comprises the following process: a discharging process, which is a raw material tape which is attached to a long carrier tape from a raw material roll and has a long adhesive tape; the cutting process is performed by an annular cutting member The adhesive tape is cut into an adhesive tape piece on the upper half of the carrier tape, and the cutting member has a circular arc shape on both sides in the width direction of the raw material tape, and has a linear shape in front and rear of the longitudinal direction; and a attaching process When the carrier tape is folded back and moved by the edge member, the adhesive tape sheet is peeled off from the carrier tape, and the adhesive tape sheet is attached to the annular frame that moves in synchronization with the peeling speed.

According to this method, the adhesive tape piece having the linear end side in the front-rear direction can be formed by half cutting from the raw material tape, and the adhesive tape piece can be peeled off from the carrier tape and attached to the annular frame. Therefore, it is possible to reduce the amount of the adhesive tape used in the longitudinal direction and the discarded portion between the adhesive tape sheets after the adhesive tape is cut. In other words, since the amount of cut-out of the adhesive tape of each of the raw material rolls is increased, the frequency of exchange of the raw material rolls can be reduced.

In addition, the adhesive tape piece of the peeling object and the subsequent adhesive tape piece are not in line contact with each other as in the past. Therefore, when the adhesive tape of the object to be processed is peeled off, since the adhesive tape of the front end side of the adhesive tape and the rear end of the adhesive tape of the peeling object are not adhered via the adhesive layer, the front end of the subsequent adhesive tape is not produced. Wrinkles, etc. Therefore, the adhesive tape sheet can be brought into close contact with the annular frame.

Further, the cutting member is, for example, a cutting roller having an annular cutting blade that connects an arc shape and a linear shape.

By this method, the cutting speed of the cutting roller and the adhesive tape is made Simultaneously, the film is pressed and rotated on the adhesive tape, whereby the adhesive tape can be half cut. That is, it is not necessary to stop the conveyance of the raw material tape. Therefore, the half cut of the adhesive tape sheet and the adhesive tape sheet can be effectively attached to the annular frame.

Further, in order to achieve such a purpose, the present invention adopts the following configuration.

That is, an adhesive tape attaching device attaches an adhesive tape to an annular frame, and the device comprises the following structure: a tape supply portion which is attached to a long carrier tape from a raw material roll and has a long adhesive tape attached thereto. a raw material belt; a belt guiding mechanism that moves the raw material belt discharged from the belt supply portion along a predetermined belt conveying path to be guided to the edge member; and a pre-cutting mechanism that uses an annular cutting member The adhesive tape is cut into an adhesive tape piece on the upper half of the carrier tape, and the cutting member has a circular arc shape on both sides in the width direction of the adhesive tape provided in the belt conveying path, and has a linear shape in front and rear in the longitudinal direction; Relining the carrier tape to peel off the adhesive tape sheet; holding the platform to hold the annular frame; and attaching a mechanism for moving the aforementioned holding platform in synchronism with the attachment roller and the belt moving speed, one side Adhesive tape piece peeled off from the carrier tape by the aforementioned edge member is pressed by the attaching roller to be attached to the annular frame on the holding platform; and the carrier tape collecting portion is recovered and peeled off Said carrier tape adhesive strip.

With this configuration, the adhesive tape is cut from the long raw material tape halfway on the tape transport path while being synchronized with the tape moving speed. The adhesive tape sheet may be attached to the annular frame while being peeled off from the carrier tape. That is, the above method can be suitably implemented by this configuration.

Further, it is preferable that the cutting member is a cutting roller having an annular cutting blade that connects the circular arc shape and the linear shape.

According to this configuration, when the adhesive tape piece is half-cut from the long adhesive tape, the half-cut of the adhesive tape and the adhesive tape piece are continuously attached to the annular frame without stopping the conveyance of the raw material tape.

1‧‧‧With Supply Department

2‧‧‧With precutting mechanism

3‧‧‧Tension roller

4‧‧‧Adhesive tape recycling department

5‧‧‧With attachments

6‧‧‧ Carrying belt recycling department

7‧‧‧cutting roller

8‧‧‧Support roller

9‧‧‧ Cutting the blade

10‧‧‧Sheet

11‧‧‧ Straight line

12‧‧‧ arc part

13‧‧‧Feeding roller

14‧‧‧Recycling bobbin

15‧‧‧1st attachment unit

16‧‧‧2nd attachment unit

17‧‧‧ Attached platform

18‧‧‧Edge components

20‧‧‧ Attachment roller

21‧‧‧feed rolls

22‧‧‧Recycling bobbin

23‧‧‧Drive cylinder

24‧‧‧ Attachment roller

25‧‧‧ movable platform

26‧‧‧Framekeeping Department

27‧‧‧ Wafer Holder

30‧‧‧ Wafer Holder

31‧‧‧Framekeeping Department

32‧‧‧ chamber

33‧‧‧Upper casing

34‧‧‧ Lower case

35‧‧‧ pole

36‧‧‧Motor

37‧‧‧ Lifting drive mechanism

38‧‧‧ vertical wall

39‧‧‧rails

40‧‧‧ movable platform

41‧‧‧ movable frame

42‧‧‧ Arm

43‧‧‧ Support shaft

Ct‧‧‧ carrying belt

E1‧‧‧linear end

e1A‧‧‧Line shape end

E2‧‧‧ arc-shaped end

e2A‧‧‧Arc-shaped end

f‧‧‧Ring frame

Ta‧‧‧adhesive tape

Tb‧‧‧adhesive layer

Tc‧‧‧Substrate

MF‧‧‧ Wafer Mount

P‧‧‧Protective belt

T‧‧‧ adhesive tape

T’‧‧‧Useless adhesive tape

TR‧‧‧ Raw material rolls

W‧‧‧ wafer

It is to be understood that the present invention is to be considered as a

Figure 1 is a plan view of the adhesive tape.

Fig. 2 is an enlarged plan view showing a portion surrounded by a two-dot chain line in Fig. 1.

Figure 3 is a longitudinal sectional side view of the adhesive tape.

Figure 4 is a comparison of the adhesive tape of the present invention with a conventional adhesive tape.

Figure 5 is a front elevational view of the adhesive tape attachment device.

Figure 6 is a plan view of the adhesive tape attachment device.

Figure 7 is a perspective view of the cutting roller.

Figure 8 is a longitudinal section of the attached platform.

Figure 9 is a flow chart showing the attachment process of the adhesive tape.

Figure 10 is a perspective view of the attached portion.

Fig. 11 is a schematic side view showing the attaching operation of the adhesive tape of the first attaching unit.

Figure 12 is a view showing the attachment action of the adhesive tape of the first attachment unit. Slightly side view.

Fig. 13 is a schematic side view showing the attachment operation of the adhesive tape of the second attachment unit.

Fig. 14 is a schematic side view showing the attaching operation of the adhesive tape of the second attaching unit.

Figure 15 is a plan view of the back side of the wafer mount.

Fig. 16 is a front elevational view showing the adhesive tape attachment device of the modification.

Fig. 17 is a longitudinal sectional side view showing a second attachment unit of a modification.

Fig. 18 is a flow chart showing the attachment process of the adhesive tape in the modification.

Fig. 19 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

Fig. 20 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

Fig. 21 is a schematic side view showing an operation of attaching an adhesive tape to a wafer.

Figure 22 is a front elevational view of the modification device.

Figure 23 is a plan view of the adhesive tape of the modified device.

Fig. 24 is a plan view showing the back side of the wafer mount of the modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<adhesive tape>

In the present embodiment, a strip-shaped adhesive tape having an adhesive tape sheet which holds the semiconductor wafer on the annular frame will be described in detail.

Figure 1 shows the plane of the adhesive tape of the present invention, 2 shows a partial enlarged plane of the adhesive tape, and Fig. 3 shows a longitudinal sectional side view of the adhesive tape.

The adhesive tape T is attached to the long carrier tape ct with a long adhesive tape T at the same width as the carrier tape ct. The adhesive tape itself has been semi-cut into an adhesive tape ta on the carrier tape ct, and the adhesive tape piece ta has a pair of linear end edges e1 orthogonal to the longitudinal direction and facing forward and backward, and linear ends A pair of right and left arc-shaped end sides e2 connected to one end of the side e1. A plurality of adhesive tape sheets ta are formed in front and rear along the longitudinal direction of the adhesive tape T so that the linear end edges e1 are arranged close to each other and opposed to each other.

The distance between the linear end sides e1 of the front and rear adhesive strips ta is set to the following distance: when the adhesive tape piece ta in front of the transport direction is peeled off, the adhesive layer at the rear end of the adhesive tape piece ta and the rear adhesive tape piece ta The adhesive layer on the front end is no longer the distance. In other words, the distance is set such that the distance at which the unnecessary peeling stress acts on the front end of the rear adhesive tape piece ta and wrinkles are generated when attached to the annular frame. The generation of the wrinkles varies depending on the type of the adhesive tape T or environmental characteristics (such as temperature, humidity, tension, etc.). Therefore, the distance between the adhesive tape sheets ta is determined in advance by experiment or simulation. However, the distance between the adhesive tapes ta of the conventional example is cut into a perfect circle, as compared with the case where the linear end sides of the conventional example are brought into contact with each other (Fig. 4(a)), for example, as shown in Fig. 4 . When the front and rear adhesive tape sheets ta are arranged at a predetermined pitch (Fig. 4(c)), the distance L2 between the centers P1 and P2 of the adhesive tape piece ta of the present embodiment is set as an adhesive tape of a conventional example. The relationship between the distances L1 and L3 between the centers of the sheets ta is L1 < L2 < L3.

Further, as shown in Fig. 2, the adhesive tape T is laminated in the order of the carrier tape ct, the adhesive layer tb, and the substrate tc.

<Adhesive tape attachment device>

Fig. 5 shows the front side of the adhesive tape attaching device of the present invention, and Fig. 6 shows the side of the device.

This adhesive tape attaching device is composed of a tape supply unit 1, a tape cutting mechanism 2, a tension roller 3, an adhesive tape collecting portion 4, a tape attaching portion 5, and a carrier tape collecting portion 6. Hereinafter, each structure will be described in detail.

The tape supply unit 1 is provided with a bobbin for mounting a material roll TR around which the adhesive tape T is wound. The adhesive tape T discharged from the tape supply unit 1 is guided to a predetermined tape transport path via the tension roller 3, and is supplied to the tape attaching portion 5 via the tape pre-cut mechanism 2.

The belt pre-cutting mechanism 2 is provided with a cutting roller 7 and a backup roller 8 which are synchronously driven up and down. As shown in Fig. 7, the cutting roller 7 is constructed by attaching a sheet 10 on which the cutting blade 9 is formed to a driving roller. The cutting blade 9 is formed in an annular shape composed of a straight portion 11 and a circular arc portion 12 which are horizontally opposed; the circular arc portion 12 connects one ends of the two straight portions 11 to each other.

When the sheet 10 is attached to the driving roller, the two straight portions 11 of the cutting blade 9 are parallel and close to each other along the longitudinal direction of the driving roller.

The backup roller 8 is a metal drive roller. Further, at least one of the cutting roller 7 and the backup roller 8 is configured to be movable up and down by the driving cylinder. Therefore, the gap between the two rolls 7 and 8 can be changed and set depending on the thickness of the adhesive tape T.

The adhesive tape collecting portion 4 is configured such that the strip-shaped unnecessary adhesive tape T' cut into the adhesive tape ta shape on the carrier tape ct is peeled off from the carrier tape ct and taken up by the take-up reel 14 at the take-up bobbin 14. Therefore, the adhesive tape T in which the adhesive tape piece ta remains on the carrier tape ct is guided to the tape attaching portion 5.

As shown in FIGS. 5 and 6, the tape attaching portion 5 includes a first attaching unit 15 that attaches the adhesive tape piece ta to the annular frame f, and attaches the adhesive tape piece ta to the semiconductor wafer W. (hereinafter, simply referred to as "wafer"), the second attaching unit 16, the attaching platform 17, and the like.

The first attaching unit 15 includes the edge member 18, the attaching roller 20, and the like. The first attaching unit 15 is provided to reciprocate above the attaching platform 17 along the transport direction of the adhesive tape T.

The edge member 18 is folded back from the carrier tape ct of the adhesive tape T which is fed by the pre-cut mechanism 2 and is half-cut, and the adhesive tape ta is peeled off, and the carrier tape ct is guided to the carrier tape collecting portion 6.

The attaching roller 20 faces the end portion disposed before the edge member 18 from above. Further, the attaching roller 20 is configured to be lifted and lowered by the drive cylinder 23. Therefore, the adhesive tape piece ta which is peeled off from the carrier tape ct and pushed forward in the front end of the edge member 18 is pressed from above, and is attached to the upper surface of the annular frame f held by the attaching platform 17. Further, the tape attaching mechanism of the present invention is constituted by the attaching roller 20 and the driving cylinder 23. Furthermore, the first attaching unit 15 corresponds to the tape attaching mechanism of the present invention.

The second attaching unit 16 is provided with an attaching roller 24 that can be moved up and down by the driving cylinder. The second attaching unit 16 is provided so as to cross the moving direction of the adhesive tape T so as not to interfere with the advancement of the first attaching unit 15. Further, the attaching roller 24 is covered with an elastic body.

As shown in FIGS. 6 and 8, the attaching platform 17 is composed of a pull-out movable table 25, a frame holding portion 26, and a wafer holding portion 27.

The movable table 25 is configured to move horizontally forward and backward along the guide rails at the left and right ends.

The frame holding portion 26 is configured to fix and fix the annular frame f placed on the annular holding surface by suction holding or supporting pin.

The wafer holding portion 27 has a holding surface for adsorbing the wafer W, and is configured to be movable up and down by an actuator such as an air cylinder.

The carrier tape collecting portion 6 is configured such that the carrier tape ct folded back by the edge member 18 is driven to move by the feed roller 21 and is taken up by the recovery bobbin 22.

Further, the tension roller 3 and the guide roller not attached with a symbol constitute the belt movement guiding mechanism of the present invention.

The adhesive tape attaching device of the present invention is constructed as above. Referring to the flow chart shown in FIG. 9 and FIGS. 10 to 15 , the adhesive tape piece will be described after the adhesive tape piece ta is attached to the annular frame f by using the adhesive tape attaching device. The ta is attached to the wafer W for a round of motion.

The movable table 25 is pulled out from the apparatus body by the attaching platform 17, and the annular frame f and the wafer W are placed and held by the respective holding portions of the frame holding portion 26 and the wafer holding portion 27. The movable table 25 is returned to the apparatus body. At this time, the wafer holding portion 27 is set to be slightly lowered, and the surface height of the wafer W is lower than the surface height of the annular frame f (step S1). At this time, the wafer W is placed with its back side facing up. Further, a protective tape P is attached to the surface of the wafer W.

The apparatus main body is operated to discharge and supply the adhesive tape T from the tape supply unit 1 (step S2). In the process of passing between the cutting roller 7 with the pre-cutting mechanism 2 and the backup roller 8, the adhesive tape T is continuously and semi-cut into the adhesive tape ta on the carrier tape ct by the rotationally driven cutting roller 7. S3).

The half-cut adhesive tape T is sent to the adhesive tape collecting portion 4 via the tension roller 3 . The adhesive tape collecting portion 4 peels off the useless adhesive tape T' cut into the adhesive tape piece ta by the feed roller 13. Thereafter, the adhesive tape T' is gradually taken up and recovered in the bobbin 14 (step S4).

The adhesive tape T in which only the adhesive tape piece ta remains on the carrier tape ct is sent to the tape attaching portion 5.

The first attaching unit 15 pulls out the adhesive tape T introduced by the tension roller 3, and moves to the front tape attaching position. When the first attaching unit 15 reaches the tape attaching position, the carrier tape ct folded back by the edge member 18 is gradually taken up and recovered in the bobbin of the carrier tape collecting portion 6. At this time, the adhesive tape piece ta is peeled off from the carrier tape ct which is gradually folded back and gradually protrudes forward along the upper surface of the edge member 18.

As shown in Fig. 10, the front end of the adhesive tape piece ta passes over the front end of the edge member 18 to directly below the attaching roller 20 at the upper waiting position, as shown in Fig. 11, the lowering of the attaching roller 20 will be as shown in Fig. The front end portion of the double-sided adhesive tape ta projecting toward the front of the edge member 18 is pressed against the end surface of the annular frame f held by the attachment platform 17. Then, as shown in Fig. 12, the first attaching unit 15 is synchronized with the winding speed of the adhesive tape piece ta which is gradually moved forward from the side of the carrier tape ct, and the winding speed of the carrier tape ct is oriented. The waiting position at the rear moves. That is, the adhesive tape piece ta peeled off from the carrier tape ct is gradually attached by the attaching roller 20. On the surface of the annular frame f (step S5).

At this time, the belt supply amount is adjusted by the tension roller 3 so as not to supply an excessive amount of the adhesive tape T to the first attaching unit 15.

When the adhesive tape piece ta is attached to the annular frame f, the second attaching unit 16 is moved to the front attachment position. When the second attaching unit 16 reaches the predetermined position, as shown in Fig. 13, the attaching roller 24 is lowered and moved forward from one end of the annular frame f to the other end. At this time, as shown in Fig. 14, the attaching roller 24 is elastically deformed while gradually adhering the adhesive tape piece ta to the back surface of the wafer W which is adjacent to the adhesive tape piece ta (step S6).

When the attaching roller 24 reaches the end position, the second attaching unit 16 raises the attaching roller 24. Thereafter, the second attaching unit 16 moves backward and returns to the waiting position.

The movable table 25 is pulled out from the apparatus body, and as shown in Fig. 15, the wafer mounting frame MF formed by the adhesive tape piece ta is taken out and recovered (step S7). As described above, the one-wheel operation in which the adhesive tape piece ta is attached to the ring frame f and the wafer W is completed, and the same operation is repeated until the predetermined piece is reached (step S8).

According to the apparatus of the above-described embodiment, since the adhesive tape T portion which is opposed to the front and rear direction of the adhesive tape T is half-cut into a straight line, the distance in the longitudinal direction can be set to be shorter than the width direction. The spacers are continuously formed on the carrier tape ct. Therefore, more adhesive tapes ta can be obtained from the material roll TR than the adhesive tape pieces which are cut into a perfect circle. In other words, the frequency of exchange of the material roll TR can be reduced, and work efficiency can be improved. In addition, due to the adhesion between the front and rear adhesive strips ta The distance with T is short, so the amount of discarded adhesive tape T can also be reduced.

Further, since the adhesive tape sheets ta before and after the transport direction are half-cut at a predetermined pitch, the adhesive layers of the front and rear adhesive tape sheets ta do not follow each other. Therefore, when the adhesive tape piece ta is peeled off from the carrier tape ct, it is possible to prevent the adhesive tape ta at the rear from sticking and apply unnecessary peeling stress to cause wrinkles.

Furthermore, the present invention can also be implemented in the following form:

(1) The adhesive tape piece ta is attached to the back surface of the wafer W and is not limited to the above embodiment. For example, only the wafer W may be housed in the chamber, and the adhesive tape piece ta may be attached by decompression. On the back side of the wafer W.

As shown in FIGS. 16 and 17 , the attaching stage 17 includes a wafer holding unit 30 for holding a wafer and a frame holding unit 31 for holding an annular frame, and the wafer holding unit 30 and the frame holding unit 31 are provided. A lower casing 34 that is formed integrally with the upper casing 33 to form the chamber 32 is provided.

The wafer holding portion 30 is connected to the rod 35 of the lower casing 34 constituting the chamber 32 via a sealing member for sealing. The other end of the rod 35 is drivingly coupled to the motor 36. Therefore, the wafer holding unit 30 is configured to move up and down in the lower casing 34 by the forward/reverse driving of the motor 36.

Further, the upper portion of the cylinder of the lower casing 34 is slightly rounded, and is subjected to a mold release treatment such as fluorine processing.

The upper casing 33 is placed on the lift drive mechanism 37. The lift drive mechanism 37 includes a movable table 40 that can be raised and lowered along a guide rail 39 disposed on the back of the vertical wall 38 in the longitudinal direction; the movable frame 41 is supported by the movable table 40 in an adjustable height; and the arm 42 is attached From here, the movable frame 41 is forward Extend. An upper casing 33 is attached to the lower end of the support shaft 43 projecting downward from the front end of the arm 42.

The chamber 32 composed of the upper and lower pair of housings 33, 34 has a diameter smaller than the width of the adhesive strip ta. That is, the adhesive tape piece ta exposed from the outer periphery of the wafer W to the inner diameter of the annular frame f can be tightly sandwiched by the two casings 33, 34.

Next, a one-rotation operation of attaching the adhesive tape piece ta to the wafer W by the apparatus of this embodiment will be described in accordance with the flowchart shown in Fig. 18.

In addition, until the adhesive tape piece ta is attached to the annular frame f, the processes from step S11 to step S15 are omitted as in the above-described embodiment, and the adhesion from the different processing steps S16 to S18 will be adhered. The operation of attaching the tape ta to the wafer W will be described.

By the same operation as in the above embodiment, the adhesive tape piece ta is attached to the annular frame f by the first attaching unit 15, and as shown in Fig. 19, the upper casing 33 is lowered. With this decrease, the adhesive case ta which is exposed between the outer periphery of the wafer W and the inner diameter of the annular frame f is sandwiched by the upper case 33 and the lower case 34 to form the chamber 32 (step S16). At this time, the adhesive tape piece ta functions as a sealing material, and the upper casing 33 side and the lower casing 34 side are divided to form two spaces.

The wafer W located in the lower casing 34 and the adhesive tape piece ta have a predetermined gap and are close to the opposite direction.

In the flow path that connects the upper case 33 and the lower case 34 to the vacuum device via the electromagnetic valve, the switch of the electromagnetic valve is adjusted by a control unit (not shown) to decompress the inside of the two housings 33 and 34. That is, the opening degree of the solenoid valve is adjusted so that the inside of the two casings 33, 34 is gradually decompressed at the same speed.

When the pressure inside the two casings 33, 34 is reduced to a predetermined pressure, the solenoid valve is closed and the operation of the vacuum device is stopped.

The control unit gradually raises the inside of the upper casing 33 to a predetermined air pressure while adjusting the opening degree of the solenoid valve while leaking. At this time, the air pressure in the lower casing 34 becomes lower than the air pressure in the upper casing 33, and by the differential pressure, as shown in Fig. 20, the adhesive tape piece ta is gradually pulled from the center thereof into the lower casing 34. The patch is slowly attached to the outer periphery from the center of the wafer W disposed close to (step S17).

When the inside of the upper casing 33 reaches a predetermined air pressure, the control unit adjusts the opening degree of the electromagnetic valve so that the air pressure in the lower casing 34 becomes the same as the air pressure in the upper casing 33. In response to this air pressure adjustment, the wafer holding portion 30 is raised to bring the surface of the annular frame f to the same height as the upper surface of the wafer W. Then, as shown in Fig. 21, the control unit raises the upper casing 33, opens the atmosphere in the upper casing 33, opens the electromagnetic valve, and opens the atmosphere on the lower casing 34 side (step S18).

When the upper casing 33 is raised, the adhesive tape piece ta is attached to the back surface of the wafer W.

The upper casing 33 is returned to the upper waiting position to form the wafer mount MF. The attaching platform 17 is pulled out to carry out the wafer mount MF (step S19). As described above, the one-wheel operation in which the adhesive tape piece ta is attached to the ring frame f and the wafer W is completed, and the same operation is repeated until the predetermined number of sheets is reached (step S20).

(2) In the above embodiment, as shown in Fig. 22, both the first attaching unit 15 and the vacuum chamber type attaching unit which are provided with the attaching roller 24 may be provided and used arbitrarily.

(3) In the apparatus according to the above modification, the heater may be provided in the chamber, and the adhesive tape ta may be heated while being attached to the back surface of the wafer W.

(4) In the apparatus of the above modification, the chamber 32 may be configured as an annular frame f or may be housed together.

(5) In the apparatus of each of the above embodiments, the useless adhesive tape T' is peeled off in the middle of the tape attachment portion 5 after the half-cutting process, but the tape attaching portion 5 and the carrier tape may be used. Ct is taken together for recycling.

(6) The adhesive tape T of each of the above embodiments has a shape in which a pair of linear end portions e1 orthogonal to the longitudinal direction and facing forward and backward, but is not limited by this shape. For example, as shown in Figs. 23 and 24, a pair of linear end faces e1A parallel to the side end sides of the carrier tape are formed. An adhesive tape T having a shape in which one end of each of the linear end sides e1 and e1A of the front and rear sides of the belt ct is connected to the end surface e2A may be arranged on the carrier tape ct.

Further, in the apparatus of the above embodiment, when the adhesive tape T is half cut, the cutting blade 9 having the same shape as the adhesive tape T is formed on the sheet 10.

By the adhesive tape T, when a wide strip of raw material is cut along the length of the adhesive tape T to produce a roll of a plurality of adhesive tapes, in the case of manufacturing a plurality of rolls of the adhesive tape T, compared with An adhesive tape T having arc-shaped end edges in the width direction can be used to make more rolls. Further, the amount of waste in the width direction of the raw material roll can be adjusted to be small.

The present invention may be embodied in other specific forms without departing from the spirit and scope of the invention. Add the scope of the patent application, not the above description.

Ta‧‧‧adhesive tape

Claims (5)

An adhesive tape is attached to the annular frame and the semiconductor wafer, and the adhesive tape comprises the following structure: an arc-shaped end edge having opposite straight end edges and a linear end edge The plurality of sheets are adhered to each other such that the linear end edges of each other are close to each other and are arranged on the long carrier tape. An adhesive tape attaching method, which attaches an adhesive tape according to claim 1 of the patent application to an annular frame, the method comprising the following process: a releasing process, which is attached from a long carrier tape discharged from a raw material roll a raw material tape of a long adhesive tape; the cutting process is to cut the adhesive tape on the upper half of the carrier tape into an adhesive tape piece by an annular cutting member, the cutting member having two sides on the width direction of the raw material tape a circular arc shape having a linear shape in front and rear of the longitudinal direction; and an attaching process which, when the carrier tape is folded back and moved by the edge member, peels off the adhesive tape from the carrier tape while being synchronized with the peeling speed Adhesive strips are attached to the relatively moving annular frame. The adhesive tape attaching method according to claim 2, wherein the cutting member is a cutting roller having an annular cutting blade that connects an arc shape and a linear shape. An adhesive tape attaching device for attaching an adhesive tape according to claim 1 of the patent application to an annular frame, the device comprising the following structure: a tape supply portion which is attached to a long carrier tape from a raw material roll a raw material tape with a long adhesive tape; a belt guiding mechanism for moving a raw material strip discharged from the belt supply portion along a predetermined belt conveying path to be guided to an edge member; and a pre-cutting mechanism for using an annular cutting member to carry the adhesive tape on the belt The tape is cut into an adhesive tape piece, and the cutting member has a circular arc shape on both sides in the width direction of the adhesive tape provided in the belt conveying path, and has a linear shape in front and rear in the longitudinal direction; the edge member is folded back. The carrier tape is used to peel off the adhesive tape sheet; the holding platform holds the annular frame; and the tape attaching mechanism moves the aforementioned holding platform in synchronization with the moving speed of the attaching roller and the tape, and the edge is utilized The adhesive tape sheet from which the member is peeled off from the carrier tape is pressed by the attaching roller to be attached to the annular frame on the holding platform; and the carrier tape collecting portion recovers the carrier tape from which the adhesive tape sheet has been peeled off. The adhesive tape attaching device of claim 4, wherein the cutting member is a cutting roller having an annular cutting blade that connects an arc shape and a linear shape.