JPH06252263A - Adhesive tape spreading equipment - Google Patents

Abstract

PURPOSE:To prevent generation of puckers on an adhesive tape whick sticks a semiconductor wafer on a ring frame. CONSTITUTION:The title equipment is provided with the following; a stage 3 which sets a semiconductor wafer 1 and a ring frame 2, temporarily bonding stages which temporarily bond the front part and the rear part of an adhesive tape drawn out on the ring frame 2 separately, and a tension applying jig 6 which presses down the adhesive tape 4 between the stage 3 and the respective temporarily bonding stages 5 and applies tension to the tape 4. The temporarily bonding stands 5 are installed so as to be able to be inclined with ascent gradient toward the drawing-out direction of the adhesive tape 4. The tension applying jig 6 is installed so as to be able to reciprocate from above the adhesive tape 4 drawn out on the ring frame 2 to the outside of the tape 4. A retaining roller 7 which retains the rear of the adhesive tape 4 drawn out on the ring frame 2 is installed outside the stage 3 so as to be able to rotate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape applying device for attaching an adhesive tape for attaching a semiconductor wafer to a ring frame in a manufacturing process of integrated circuits and the like. is there.

[0002]

2. Description of the Related Art In a general semiconductor manufacturing process, when a semiconductor wafer on which an integrated circuit pattern is formed is cut by a dicer into individual integrated circuit chips,
In order to prevent the cut integrated circuit chips from scattering, the semiconductor wafer A to be dicer cut is fixed inside the ring frame B with an adhesive tape C in advance as shown in FIG.

As described above, as a device for attaching the semiconductor wafer A to the ring frame B with the adhesive tape C,
Conventionally, there is an adhesive tape tensioning device shown in FIG. This apparatus mounts a semiconductor wafer A and sets a ring frame B on the outer periphery of the stage D, a tape base E on which a roll-shaped adhesive tape C is set, and an adhesive tape C pulled out from the stage D. When a tape fixing base F for temporarily fixing a small gap above and a handle I attached to the cutter supporting arm K so as to rotate at a predetermined radius are rotated in the arrow direction shown in FIG. And a cutting device H to which a cutter G that moves along the peripheral edge of B is attached.

The work procedure of this adhesive tape tensioning device will be described below in order. ． The semiconductor wafer A is placed on the stage D, and the ring frame B is placed concentrically on the outer circumference of the stage. ． Hold the tip of the adhesive tape C set on the tape base E by hand and pull out the tape C above the semiconductor wafer A and the ring frame B. The tip of the adhesive tape C is adhered to the tape fixing base F, The adhesive tape C is stretched on the semiconductor wafer A and the ring frame B without bending. ． Use a rubber roller (not shown)
Then, the tape C is rolled in the pull-out direction, the back surface (adhesive surface) of the tape C is brought into pressure contact with the semiconductor wafer A and the ring frame B, and the tape C is adhered to them. ． The cutter support arm K of the cutting device H is rotated forward with the support shaft J as a fulcrum and set on the stage D as shown in FIG. 10B, and the blade edge of the cutter G is set on the upper surface of the peripheral edge of the ring frame B. It is pressed a few mm outside the inner peripheral edge. Next, the handle I is rotated in the direction of the arrow in FIG.
Cut into a circle. ． After the cutting is completed, the cutting device H is returned to the position shown in FIG. 10A, and the adhesive tape C on the outer side of the cut adhesive tape 4 is peeled off from the ring frame B and removed. As a result, the semiconductor wafer A is fixed to the inside of the ring frame B by the adhesive tape C as shown in FIG.

[0005]

By the way, in the pressure-sensitive adhesive tape tensioning device shown in FIG. 10, the pressure-sensitive adhesive tape C is attached to the semiconductor wafer A and the ring frame B in the steps 1 to 3 described above.
When the adhesive tape C is stretched so as not to bend, tension is applied only to the adhesive tape C in the drawing direction, so that the adhesive tape C may extend in that direction to cause vertical wrinkles. If the adhesive tape C is pressed and stuck to the semiconductor wafer A and the ring frame B while the vertical wrinkles are generated, the semiconductor wafer A and the ring frame B are not completely adhered at the wrinkled portion. If the semiconductor wafer A is cut with a dicer in this state, the adhesive is insufficiently adhered, and the wrinkled chips are separated from the adhesive tape C and scattered, or vertical wrinkles are suddenly extended during cutting and the semiconductor The wafer A may be displaced and the cutter may cut the integrated circuit portion. Since defective products are generated due to these causes, the product yield is deteriorated.

An object of the present invention is to prevent wrinkles from being generated in the adhesive tape when the adhesive tape is attached to the semiconductor wafer and the ring frame so that no scraps are generated during dicer cutting of the semiconductor wafer. To provide a tensioning device.

[0007]

According to a first aspect of the present invention, there is provided a pressure sensitive adhesive tape tensioning device as shown in FIG.
And a stage 3 for setting the ring frame 2 so that the ring frame 2 is located on the outer circumference of the semiconductor wafer 1, and a part 4a and a part 4b of the adhesive tape 4 drawn out on the ring frame 2 ahead of the ring frame 2 and behind 4b. A tension for applying a tension to the two temporary adhesive bases 5 for temporarily adhering the two and the adhesive tapes 4 temporarily adhered to the temporary adhesive bases 5 between the stage 3 and the respective temporary adhesive bases 5 to push them down. The application tool 6 is provided.

The adhesive tape tensioning device according to the second aspect of the present invention is characterized in that the temporary adhesive base 5 can be tilted so as to be inclined upward in the drawing-out direction of the adhesive tape 4, as shown in FIG. It is a thing.

In the adhesive tape tensioning device according to claim 3 of the present invention, as shown in FIGS. 2 and 3, the tension applying tool 6 pulls the ring tape 2 from above the adhesive tape 4 to the outside of the adhesive tape 4. It is characterized in that it can be reciprocally rotated up to.

According to a fourth aspect of the present invention, in the adhesive tape tensioning device, as shown in FIG. 6, a support roller 7 for supporting the back surface of the adhesive tape 4 drawn onto the ring frame 2 is provided outside the stage 3. It is characterized by being rotatably arranged.

[0011]

In the adhesive tape tensioning device according to the first aspect of the present invention, after the semiconductor wafer 1 and the ring frame 2 are set on the stage 3, the adhesive tape 4 is held by holding both ends in the width direction on the tip side. Pull out the tape 4 onto the stage 3 and further move the adhesive tape 4 ahead of the ring frame 2 4a.
And the rear part 4b are temporarily adhered to the temporary adhesion base 5, the tape 4
Is the semiconductor wafer 1 and the ring frame 2 on the stage 3.
Stretched over. Next, when the tension applying tool 6 is lowered onto the upper surface of the adhesive tape 4 temporarily adhered to the temporary adhesion table 5, the tape 4 is pushed down between the stage 3 and each temporary adhesion table 5 and the adhesive tape 4 is tensioned. Is given. As a result, even if the adhesive tape 4 stretched between the temporary adhesive bases 5 is vertically folded along the pulling direction, if the tension applying tool 6 applies tension in a direction different from the pulling direction, the adhesive tape 4 is lengthened vertically. Wrinkles are eliminated.

In the pressure-sensitive adhesive tape tensioning device according to the second aspect of the present invention, the temporary adhesion base 5 is inclined upward in the pull-out direction of the pressure-sensitive adhesive tape 4 with tension applied to the pressure-sensitive adhesive tape 4 by the tension applying tool 6. When the adhesive tape 4 is attached to the semiconductor wafer 1 and the ring frame 2 on the stage 3 from the pull-out side of the adhesive tape 4 with a rubber roller or the like in that state, the adhesive tape 4 and the semiconductor wafer 1 and the ring frame are attached at the time of attachment. Air between the adhesive tape 4 and the semiconductor wafer 1 and the ring frame 2 is not discharged between the adhesive tape 4 and the semiconductor wafer 1 and the ring frame 2.

In the adhesive tape tensioning device according to claim 3 of the present invention, the tension applying tool 6 pulls the ring frame 2 from above the adhesive tape 4 (FIG. 3 (a)) to the outside of the adhesive tape 4. 2 (a)}, the tension applying tool 6 can be used when the adhesive tape 4 is pulled out.
2 is moved to the position shown in FIG. 2A, the tension applying tool 6 does not interfere.

In the pressure-sensitive adhesive tape tensioning device according to a fourth aspect of the present invention, the support roller 7 for supporting the back surface of the pressure-sensitive adhesive tape 4 pulled out above the ring frame 2 is rotatably arranged outside the stage 3. Therefore, when the tension applying tool 6 is lowered while the adhesive tape 4 is temporarily adhered to the temporary adhesive base 5, the adhesive tape 4 is supported by the supporting roller 7 rotating as shown in FIG. The adhesive tape 4 on the semiconductor wafer 1 and the ring frame 2 is tensioned by being pulled in the direction.

[0015]

[Embodiment 1] FIG. 1 shows a first embodiment of the adhesive tape tensioning device of the present invention. Reference numeral 1 shown in FIG. 1 is a semiconductor wafer having a large number of integrated circuit patterns formed on the surface (downward in the drawing), 2 is a ring frame in which the semiconductor wafer 1 can be arranged on the inner peripheral side, 4 Is an adhesive tape wound in a roll shape for fixing the semiconductor wafer 1 to the inside of the ring frame 2, and the ring frame 2 and the adhesive tape 4 are conventionally used.

Reference numeral 3 shown in FIG. 1 is a stage on which the semiconductor wafer 1 and the ring frame 2 are mounted. Same stage 3
Is a circular wafer stage 10 on which the semiconductor wafer 1 is placed.
The ring frame stage 11 on which the ring frame 2 is placed is arranged with a small gap on the outer periphery of the ring frame stage 11. As shown in FIG. A threaded portion formed on the peripheral surface is screwed to connect the two, and the lower end of the wafer stage 10 is fixed on the base plate 12 of the present apparatus. By the way, when the ring frame stage 11 is rotated around the wafer stage 10, the ring frame stage 11 moves up and down, and the height can be adjusted.

On the base plate 12, in addition to the stage 3, as shown in FIG. 4, a second base plate 13 having an opening 14 formed in the central portion of the plate material for allowing the stage 3 to penetrate therethrough.
Is attached. In this second base plate 13, four cylindrical pedestals 15 are attached to the base plate 12, and connecting bolts 16 are provided on the upper parts of the pedestals 15 so as to be able to be vertically inserted and removed, and the spring 1 is provided around the connecting bolts 16.
7 are arranged, the connecting bolts 16 are inserted from the lower side of the holes formed in the second base plate 13, and the nuts 18 are screwed onto the upper ends of the connecting bolts 16 protruding above the plate 13 to form the above-mentioned nuts. It is swingable on the base plate 12 as shown in FIG.

Reference numeral 5 shown in FIG. 1 is a temporary bonding table. The temporary adhesion table 5 is a plate material formed to be wider than the tape 4 so that the adhesive tape 4 can be attached and fixed on the upper surface thereof. Two temporary adhesive bases 5 are arranged on both outsides of the stage 3 so as to sandwich the stage 3 along the pulling-out direction of the adhesive tape 4, and each of them is provided with a second base plate as shown in FIG. Insert one end of the support bar 20 having both ends formed with screws into the holes formed in the base plate 13
It is attached to the upper end of a support rod 20 which is vertically erected by nuts 21 and 22 screwed from both upper and lower sides of the.

The temporary bonding base 5 is temporarily bonded to the temporary bonding base 5 by loosening the nuts 21 and 22 at the bottom of the support rod 20 to adjust the tightening positions of both nuts 21 and 22 to adjust the height. The adhesive tape 4 is arranged slightly above the semiconductor wafer 1 and the ring frame 2 on the wafer stage 10 and the ring frame 2.

Reference numeral 7 shown in FIG. 1 denotes a support roller, and FIG.
As shown in (b), the pull-out direction of the adhesive tape 4 and
The stage 3 is moved along the direction of the arrow a forming an angle of 5 degrees.
Two support rollers 7 are arranged inside the temporary adhesion base 5 so as to face each other with the stage 3 interposed therebetween, and further, an arrow a forming an angle of 45 degrees with the pull-out direction of the adhesive tape 4 opposite to the above. Two support rollers 7 are arranged inside the stage 3 and the temporary bonding table 5 along the direction so as to face each other with the stage 3 interposed therebetween. Each support roller 7 is rotatably attached to the upper part of an attachment jig 25 which is vertically erected on the second base plate 13 so as to be substantially at the same height as the temporary bonding table 5. .

Reference numeral 6 shown in FIG. 1 is a tension applying tool,
This is the adhesive tape 4 pulled out on the ring frame 2.
One tape holding bar 8 is arranged inside each of the support rollers 7 and the temporary bonding base 5 so as to be reciprocally rotatable from above to the outside of the adhesive tape 4. As shown in FIGS. 5 (a) and 5 (b), the tape retainer bar 8 has an air cylinder 30 fixed upward on the edge of a second base plate 13 and has an L-shape at the tip of a piston rod 31 of the cylinder 30. The plate member 33 is horizontally fixed via the metal fittings 32, the support rods 34 of the tape pressing bar 8 are vertically set up and fixed to both ends of the plate member 33, and the air cylinder 35 is horizontally arranged at the center of the plate member 33. Then, a substantially T-shaped member 37 is fixed to the tip of the piston rod 36 of the same cylinder 35, and each support rod 3
4 to the upper end of the tape holding bar 8 at the middle
The tape presser bar 8 is rotatably attached to the end of the substantially T-shaped member 37 with a bolt 41, and the mounting hole 42 of the bolt 41 is attached to the end of the tape presser bar 8. It is formed to be long in the longitudinal direction and attached so as to be slidable in the hole 42.

The tape pressing bar 8 is provided on the air cylinder 3
By moving the piston rod 31 of No. 0 up and down, the tape pressing bar 8 moves up and down in the direction of the arrow in FIG. 5 (b), and by moving the piston rod 36 of the air cylinder 35 back and forth, the tape pressing bar 8 moves. 5 (a) indicated by an imaginary line {state shown in FIG. 2 (a)} to a state indicated by a solid line {state shown in FIG. 3 (a)}, the bolt 40
Rotate around as a fulcrum.

A guide bar 38 is provided so as to project downward at two positions on the plate member 33, and the lower end of the guide bar 38 is inserted into a guide hole 39 formed in the second base plate 13,
The plate member 33 is prevented from shaking when it is moved up and down by the air cylinder 30.

[0024]

[Description of Operation of Device of FIG. 1] Next, an example of use of the adhesive tape tensioning device of the present invention shown in FIG. 1 will be described. ． The semiconductor wafer 1 and the ring frame 2 are set on the wafer stage 10 and the ring frame stage 11, respectively. ． Holding the tip of the adhesive tape 4 wound in a roll shape and pulling it out to the ring frame 2 side as shown in FIG. 2, the tape 4 is temporarily bonded between the two temporary bonding bases 5. At this time, the adhesive tape 4 contacts the supporting roller 7. ． Actuating the air cylinder 35, the tape pressing bar 8
2 is moved from the position shown in FIG. 2A to the position shown in FIG. 3A, and the holding bar 8 is arranged above the adhesive tape 4.

[0025]. By operating the air cylinder 30,
As shown in (a), the tape pressing bar 8 is lowered between the support roller 7 and the temporary bonding base 5 to push the adhesive tape 4 downward. At this time, tension is applied to the adhesive tape 4 in the directions of the four arrows a shown in FIG. 6B, and even if vertical wrinkles are generated when the adhesive tape 4 is stretched between the temporary adhesive bases 5, wrinkles are generated. Will be resolved. ． The second base plate 13 is tilted as shown in FIG. 7, and in this state, the roller 29 is pressed against the adhesive tape 4 and moved on the ring frame 2 in the arrow direction in the figure. By doing so, the adhesive tape 4 can be adhered to the ring frame 2 and the semiconductor wafer 1 while letting air escape. ． After that, although not shown, the adhesive tape 4 is circularly cut along the upper surface of the ring frame 2 with a cutter as in the prior art, and the outer adhesive tape 4 is removed to complete the process.

[0026]

[Embodiment 2] FIG. 8 shows a second embodiment of the adhesive tape tensioning device of the present invention. 8 is a semiconductor wafer, 2 is a ring frame, and 4 is an adhesive tape, which are the same as those in the first embodiment.

A wafer stage 10 for setting the semiconductor wafer 1, a ring frame stage 11 for setting the ring frame 2, a base plate 12 for fixing the wafer stage 10, and a second base plate swingably mounted on the base plate 12. 13 has the same structure as that of the first embodiment.

In this embodiment, the temporary bonding table 5 similar to that of the first embodiment is used.
4 are arranged on the outer peripheral side of the ring frame stage 11 so as to face each other with the stage 11 sandwiched therebetween, along the direction of pulling out the adhesive tape 4 and the direction orthogonal thereto.

Further, a tension applying tool 6 is attached in a direction orthogonal to the pulling-out direction of the adhesive tape 4. In this tension applying tool 6, two support rollers 7 are arranged between the ring frame stage 11 and the temporary bonding table 5 so as to sandwich the stage 11 so as to face each other. One tape pressing bar 8 can be arranged between the temporary bonding table 5 and each of them.

Each of the support rollers 7 is mounted on the second base plate 13 so as to have substantially the same height as the temporary bonding table 5 as in the first embodiment.

As shown in FIG. 8 (b), the tape holding bar 8 is mounted on the second base plate 13 rotatably in the direction of the arrow in the drawing with the shaft a as a fulcrum, and the member b is shown in the drawing. When the member b is lowered by an actuator not provided, the tape pressing bar 8 can press the upper surface of the adhesive tape 4 stretched on the stage 11.

In this embodiment, the tension control unit 45 is attached to the tape base 44 on which the adhesive tape 4 is set. The tension control unit 45 is designed so that when the adhesive tape 4 is pulled out from the tape base 44, a predetermined tension is applied to the tape 4 along the pulling direction.

[0033]

[Explanation of Operation of Apparatus of FIG. 8] Next, an example of use of the adhesive tape tensioning apparatus of the present invention shown in FIG. 8 will be described. ． The semiconductor wafer 1 and the ring frame 2 are set on the wafer stage 10 and the ring frame stage 11, respectively. ． The adhesive tape 4 wound in a roll shape is pulled out to the ring frame 2 side, and the tape 4 is temporarily bonded to the four temporary bonding bases 5. At this time, the adhesive tape 4 also contacts the support roller 7. ． By operating an actuator (not shown), the tape pressing bar 8 is moved from the position shown by the phantom line in FIG. 8B to the position shown by the solid line, and the pressing bar 8 is moved to the adhesive tape 4.
It is placed on the upper side of.

.. Further, the tape holding bar 8 is lowered between the supporting roller 7 and the temporary bonding base 5 to push the adhesive tape 4 downward. At this time, tension is applied to the adhesive tape 4 in the tape withdrawing direction and in a direction orthogonal to the tape withdrawing direction, and even when vertical wrinkles are generated when the adhesive tape 4 is stretched between the temporary bonding bases 5, the wrinkles are eliminated. ． Thereafter, the second base plate 13 is formed as shown in FIG.
As shown in FIG. 3, the roller 29 is moved in the direction of the arrow in the drawing while pressing the roller 29 on the adhesive tape 4 in that state. By doing so, the adhesive tape 4 is adhered to the ring frame 2 and the semiconductor wafer 1 while escaping the air, and then the adhesive tape 4 is circularly formed along the upper surface of the ring frame 2 with a cutter (not shown) as in the conventional case. Is cut, and the adhesive tape 4 on the outside is removed to complete the process.

[0035]

According to the adhesive tape tensioning device of the present invention,
Since the semiconductor wafer 1 and the ring frame 2 can be attached to each other without generating wrinkles on the adhesive tape 4,
The position shift of the semiconductor wafer 1 can be eliminated, and as a result, the dicer cutting of the semiconductor wafer 1 can be performed accurately, and the generation of defective products due to the dicer cutting can be eliminated.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of an adhesive tape tensioning device of the present invention.

2 (a) and 2 (b) are diagrams showing a first operation of the tension applying tool in the adhesive tape tensioning device of FIG.
(A) is the top view, (b) is the side view.

3 (a) and 3 (b) are diagrams showing a second operation of the tension applying tool in the adhesive tape tensioning device of FIG. 1,
(A) is the top view, (b) is the side view.

FIG. 4 is a side view showing a partial cross section of the adhesive tape tensioning device of FIG.

5A is a plan view of a tape fixing bar in the adhesive tape tensioning device of FIG. 1, and FIG. 5B is a side view thereof.

6A is a side view showing a state in which tension is applied to the adhesive tape in the adhesive tape tensioning device of FIG. 1, FIG.
Is the plan view.

7 is a side view showing an example of attaching an adhesive tape to a semiconductor wafer and a ring frame by the adhesive tape applying device of FIG.

8A is a plan view showing a second embodiment of the adhesive tape tensioning device of the present invention, and FIG. 8B is a side view thereof.

FIG. 9 is a perspective view showing a state where a semiconductor wafer is fixed to a ring frame with an adhesive tape.

10 (a) and 10 (b) are side views showing an example of a conventional adhesive tape tensioning device, FIG. 10 (a) showing a temporary adhesion state of an adhesive tape, and FIG. It shows a state in which the adhesive tape is cut after the semiconductor wafer and the ring frame are adhered to the tape.

[Explanation of symbols]

 1 Semiconductor Wafer 2 Ring Frame 3 Stage 4 Adhesive Tape 5 Temporary Adhesive Table 6 Tensioning Tool 7 Support Roller

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Tsunefumi Imori 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd.

Claims (4)

[Claims] 1. A stage 3 for setting a semiconductor wafer 1 and a ring frame 2 so that the ring frame 2 is positioned on the outer circumference of the semiconductor wafer 1, and a ring frame 2 of an adhesive tape 4 drawn on the ring frame 2. Two temporary bonding bases 5 for temporarily bonding the front side 4a and the rear side 4b
And a tension applying tool 6 for applying a tension to the adhesive tape 4 by pressing down the adhesive tape 4 temporarily adhered to the temporary adhesive base 5 between the stage 3 and each temporary adhesive base 5. Adhesive tape tensioning device. 2. The pressure-sensitive adhesive tape tensioning device according to claim 1, wherein the temporary bonding table 5 is tiltable so as to be inclined upward in the pull-out direction of the pressure-sensitive adhesive tape 4. 3. The adhesive tape tensioner according to claim 1, wherein the tension applying tool 6 can be reciprocally rotated from above the adhesive tape 4 drawn onto the ring frame 2 to outside of the adhesive tape 4. apparatus. 4. The adhesive according to claim 1, wherein a support roller 7 for supporting the back surface of the adhesive tape 4 drawn onto the ring frame 2 is rotatably arranged outside the stage 3. Tape tensioning device.