CN111113706A - Stick sticking device for silicon wafer production - Google Patents

Stick sticking device for silicon wafer production Download PDF

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Publication number
CN111113706A
CN111113706A CN201911381300.8A CN201911381300A CN111113706A CN 111113706 A CN111113706 A CN 111113706A CN 201911381300 A CN201911381300 A CN 201911381300A CN 111113706 A CN111113706 A CN 111113706A
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CN
China
Prior art keywords
wall
box body
plate
rod
electric telescopic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201911381300.8A
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Chinese (zh)
Inventor
杨兆安
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201911381300.8A priority Critical patent/CN111113706A/en
Publication of CN111113706A publication Critical patent/CN111113706A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • B05D3/0281After-treatment with induction heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/901Devices for picking-up and depositing articles or materials provided with drive systems with rectilinear movements only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00De-stacking of articles
    • B65G59/02De-stacking from the top of the stack
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00De-stacking of articles
    • B65G59/02De-stacking from the top of the stack
    • B65G59/026De-stacking from the top of the stack with a stepwise upward movement of the stack

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The invention discloses a sticking rod device for silicon wafer production, which comprises a box body, wherein an extension plate is arranged at the top of the outer wall of the left side of the box body, two electric slide rails are respectively arranged at the bottom of the extension plate and the inner wall of the top of the box body, the two electric slide rails are internally and slidably connected with the same movable seat, two mounting seats are arranged at the bottom of the movable seat, a third electric telescopic rod is respectively arranged on the inner wall of one side of each of the two mounting seats, a clamping plate is respectively arranged at one end of each of the two third electric telescopic rods, a feeding hole is formed in the top of the outer wall of the left side of the box body, a storage bin is arranged on the inner wall of the bottom. When the silicon rod placing device is used, the electric slide rail drives the silicon rod to move to the top of the placing seat, the glass or resin plate is placed on the placing seat, the second electric telescopic rod pushes the movable plate to upwards jack, so that the glass or resin plate is bonded with the bottom of the silicon rod, the silicon rod placing device is convenient and rapid to use, rapid feeding can be achieved, and the processing efficiency is improved.

Description

Stick sticking device for silicon wafer production
Technical Field
The invention relates to the technical field of silicon wafer production, in particular to a rod sticking device for silicon wafer production.
Background
The main production flow of photovoltaic section trade includes that the spindle is examined, the viscose, is sliced, comes unstuck, is washd, is selected separately six processes, and wherein the second process viscose can mainly be divided into two processes: firstly, bond glass or resin plate to stainless steel's work piece board, secondly bond silicon rod to glass or resin plate on, the silicon rod that glues the stick and accomplish just can pack into the slicer and begin the cutting after certain intensity through the solidification of a period of time, has the problem of inefficiency when current silicon chip production is used with gluing the stick device.
Through retrieval, chinese patent publication No. CN207954349U discloses an automatic rod sticking system for silicon rods, which comprises a single crystal feeding system, a truss manipulator system, an automatic rod sticking machine system, a pre-curing warehouse automatic line system, a splitting manipulator system and a three-dimensional warehouse system, wherein the single crystal feeding system is arranged at one side of the automatic rod sticking machine system, the truss manipulator system is fixedly arranged between the single crystal feeding system and the automatic rod sticking machine system through a support frame, and the automatic rod sticking machine system is arranged at the front of the pre-curing warehouse automatic line system. The automatic stick sticking system for the silicon stick in the patent has the following defects: the problem of not convenient and fast enough use exists.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a rod sticking device for silicon wafer production.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a silicon chip production is with gluing excellent device, the power distribution box comprises a box body, the top of box left side outer wall is equipped with the extension board, and the bottom of extension board and the top inner wall of box all are equipped with two electric slide rail, and the inside sliding connection of two electric slide rail has same sliding seat, the bottom of sliding seat is equipped with two mount pads, and one side inner wall of two mount pads all is equipped with third electric telescopic handle, and two third electric telescopic handle's one end all is equipped with the grip block, the material loading mouth has been seted up at the top of box left side outer wall, and the bottom inner wall of box is equipped with the storage silo, and the top of storage silo right side outer wall is equipped with places the seat, and the bottom inner wall of box is equipped with second electric telescopic handle.
As a still further scheme of the invention: the inner wall of the bottom of the box body is provided with a storage bin, the inner wall of the bottom of the storage bin is provided with a lifting mechanism, and the top of the lifting mechanism is provided with a lifting plate.
As a still further scheme of the invention: the left side inner wall of box is equipped with first electric telescopic handle, and first electric telescopic handle's one end is equipped with the push pedal.
As a still further scheme of the invention: the perforation has all been seted up at the top of storage silo both sides outer wall, and the bottom inner wall of fenestrate bottom inner wall flushes with the bottom inner wall of placing the seat.
As a still further scheme of the invention: the top outer wall of fly leaf is seted up evenly distributed's through-hole, and the bottom of fly leaf is equipped with the fan.
As a still further scheme of the invention: the feed opening has been seted up to the right side outer wall of box, and the bottom inner wall of feed opening is equipped with down the flitch.
As a still further scheme of the invention: the right side of box both sides inner wall is equipped with out the tuber plate, and the top of going out the tuber plate is equipped with heating resistor silk, and evenly distributed's air outlet has been seted up to the top outer wall that goes out the tuber plate, and the bottom inner wall of box is equipped with the air pump.
The invention has the beneficial effects that:
1. the silicon rod with the glue coated at the bottom is clamped through the third electric telescopic rod and the clamping plate by arranging the electric sliding rail, the third electric telescopic rod and the clamping plate, the electric sliding rail drives the silicon rod to move to the top of the placing seat, the glass or the resin plate is placed on the placing seat, and the second electric telescopic rod pushes the movable plate to upwards jack, so that the glass or the resin plate is bonded with the bottom of the silicon rod, and the operation is convenient and rapid;
2. the glass or resin plate is placed in the storage bin by arranging the storage bin, the lifting mechanism and the push plate, the lifting mechanism pushes the lifting plate to move upwards so that the top glass or resin plate is flush with the opening position of the through hole, the first electric telescopic rod pushes the push plate to push the top glass or resin plate into the placing seat, rapid feeding is achieved, and machining efficiency is improved;
3. through setting up heating resistor silk, air pump and play aerofoil, the silicon rod after the heating resistor silk circular telegram is glued the stick is in time dried, and the air is blown out to going out the aerofoil to the air pump simultaneously, and the air current is from the air outlet blowout, bloies the silicon rod after gluing the stick, improves drying efficiency.
Drawings
FIG. 1 is a schematic structural view of a bar bonding apparatus for silicon wafer production according to example 1;
FIG. 2 is a sectional view showing a side structure of a mount of a bar bonding apparatus for silicon wafer production according to embodiment 1;
FIG. 3 is a schematic view of a mounting base structure of a rod sticking device for silicon wafer production according to embodiment 1;
FIG. 4 is a sectional view showing the entire side structure of a bar bonding apparatus for silicon wafer production as set forth in example 2.
In the figure: the device comprises a box body 1, a push plate 2, a first electric telescopic rod 3, a mounting seat 4, a movable seat 5, an extension plate 6, a feeding port 7, a clamping plate 8, a perforation 9, a placing seat 10, a heating resistance wire 11, a blanking plate 12, a blowing plate 13, an air pump 14, a movable plate 15, a fan 16, a second electric telescopic rod 17, a lifting mechanism 18, a storage bin 19, a lifting plate 20 and a third electric telescopic rod 21.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-3, a sticking rod device for silicon wafer production comprises a box body 1, wherein the top of the outer wall of the left side of the box body 1 is connected with an extension plate 6 through a fastening bolt, the bottom of the extension plate 6 and the inner wall of the top of the box body 1 are both connected with two electric slide rails through fastening bolts, the inner parts of the two electric slide rails are connected with the same movable seat 5 in a sliding manner, the bottom of the movable seat 5 is connected with two installation seats 4 through fastening bolts, one side inner walls of the two installation seats 4 are both connected with third electric telescopic rods 21 through fastening bolts, one ends of the two third electric telescopic rods 21 are both connected with a clamping plate 8 through fastening bolts, the top of the outer wall of the left side of the box body 1 is provided with a feeding port 7, the inner wall of the bottom of the box body 1 is connected with a storage bin 19 through fastening bolts, the top of the outer wall of the right side of the, one end of the second electric telescopic rod 17 is connected with a movable plate 15 through a fastening bolt, the silicon rod with the bottom coated with glue is clamped through the third electric telescopic rod 21 and the clamping plate 8, the electric slide rail drives the silicon rod to move to the top of the placing seat 10, the glass or the resin plate is placed on the placing seat 10, and the second electric telescopic rod 17 pushes the movable plate 15 to move upwards, so that the glass or the resin plate is bonded with the bottom of the silicon rod, and the operation is convenient and fast.
Wherein, the inner wall of the bottom of the box body 1 is connected with a storage bin 19 through a fastening bolt, the inner wall of the bottom of the storage bin 19 is connected with a lifting mechanism 18 through a fastening bolt, and the top of the lifting mechanism 18 is connected with a lifting plate 20 through a fastening bolt.
Wherein, the inner wall of the left side of the box body 1 is connected with a first electric telescopic rod 3 through a fastening bolt, and one end of the first electric telescopic rod 3 is connected with a push plate 2 through a fastening bolt.
Wherein, perforation 9 has all been seted up at the top of 19 both sides outer walls of storage silo, and the bottom inner wall of perforation 9 flushes with the bottom inner wall of placing seat 10, puts glass or resin plate in storage silo 19, and elevating system 18 promotes lifter plate 20 and upwards moves and makes the glass or resin plate at top and perforation 9's open position flush, and 3 promotion push pedal 2 of first electric telescopic handle realize quick material loading with the glass or the resin plate at top promote to placing seat 10 in, improve machining efficiency.
Wherein, evenly distributed's through-hole has been seted up to the top outer wall of fly leaf 15, and the bottom of fly leaf 15 is connected with fan 16 through fastening bolt, and when second electric telescopic handle 17 promoted fly leaf 15 and upwards moved, fan 16 took out the negative pressure to fly leaf 15 inside, effectively avoided the glass or the resin board of fly leaf 15 top outer wall to slide.
Wherein, the feed opening has been seted up to the right side outer wall of box 1, and the bottom inner wall of feed opening has flitch 12 down through fastening bolt connection, glues the stick and accomplishes the back, and electronic slide rail drives the silicon rod and removes to the top of lower flitch 12, and third electric telescopic handle 21 drives grip block 8 and removes the silicon rod that makes after gluing the stick and accomplish and drop to realizing the unloading on lower flitch 12.
The working principle is as follows: the silicon rod with the glue coated at the bottom is clamped through the third electric telescopic rod 21 and the clamping plate 8, the electric slide rail drives the silicon rod to move to the top of the placing seat 10, the glass or resin plate is placed on the placing seat 10, the second electric telescopic rod 17 pushes the movable plate 15 to push upwards, so that the glass or resin plate is bonded with the bottom of the silicon rod, the glass or resin plate is placed in the storage bin 19 conveniently and quickly, the lifting mechanism 18 pushes the lifting plate 20 to move upwards so that the glass or resin plate at the top is flush with the opening position of the perforation 9, the first electric telescopic rod 3 pushes the push plate 2 to push the glass or resin plate at the top into the placing seat 10 to realize quick feeding, the processing efficiency is improved, when the second electric telescopic rod 17 pushes the movable plate 15 to move upwards, the fan 16 performs negative pressure pumping on the inside of the movable plate 15, and the glass or resin plate on the outer wall at the top of the movable, after the sticking rod is completed, the electric slide rail drives the silicon rod to move to the top of the lower feeding plate 12, and the third electric telescopic rod 21 drives the clamping plate 8 to move so that the silicon rod after the sticking rod is completed drops to the lower feeding plate 12 to achieve feeding.
Example 2
Referring to fig. 4, a sticky bar device for silicon wafer production, this embodiment compares in embodiment 1, and the right side of box 1 both sides inner wall is connected with out aerofoil 13 through fastening bolt, and the top of going out aerofoil 13 is connected with heating resistor silk 11 through fastening bolt, and evenly distributed's air outlet has been seted up to the top outer wall of play aerofoil 13, and the bottom inner wall of box 1 is connected with air pump 14 through fastening bolt.
The working principle is as follows: the silicon rod after gluing the stick is in time dried in the circular telegram of heating resistor silk 11, and air pump 14 is gone into to blowing out 13 interior air-blasts simultaneously, and the air current is followed the air outlet blowout, bloies to the silicon rod after gluing the stick, improves drying efficiency.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (7)

1. The sticky bar device for silicon wafer production comprises a box body (1) and is characterized in that an extension plate (6) is arranged at the top of the outer wall of the left side of the box body (1), two electric slide rails are arranged on the bottom of the extension plate (6) and the inner wall of the top of the box body (1), the two electric slide rails are connected with the same movable seat (5) in a sliding manner, two mounting seats (4) are arranged at the bottom of the movable seat (5), a third electric telescopic rod (21) is arranged on the inner wall of one side of each of the two mounting seats (4), a clamping plate (8) is arranged at one end of each of the two third electric telescopic rods (21), a feeding hole (7) is formed in the top of the outer wall of the left side of the box body (1), a storage bin (19) is arranged on the inner wall of the bottom of the box body (1), a placing seat (10) is arranged on the top of the outer wall of the right, one end of the second electric telescopic rod (17) is provided with a movable plate (15).
2. The rod sticking device for silicon wafer production according to claim 1, wherein a storage bin (19) is arranged on the inner wall of the bottom of the box body (1), a lifting mechanism (18) is arranged on the inner wall of the bottom of the storage bin (19), and a lifting plate (20) is arranged on the top of the lifting mechanism (18).
3. The sticking rod device for silicon wafer production according to any one of claims 1 to 2, wherein the inner wall of the left side of the box body (1) is provided with a first electric telescopic rod (3), and one end of the first electric telescopic rod (3) is provided with a push plate (2).
4. The rod sticking device for silicon wafer production according to claim 3, wherein the top of the outer wall of the storage bin (19) is provided with a through hole (9), and the bottom inner wall of the through hole (9) is flush with the bottom inner wall of the placing seat (10).
5. The rod sticking device for silicon wafer production according to claim 4, wherein the outer wall of the top of the movable plate (15) is provided with uniformly distributed through holes, and the bottom of the movable plate (15) is provided with a fan (16).
6. The rod sticking device for producing the silicon wafers as claimed in claim 5, wherein a feed opening is formed in the outer wall of the right side of the box body (1), and a feed plate (12) is arranged on the inner wall of the bottom of the feed opening.
7. The rod sticking device for silicon wafer production according to claim 6, wherein the right side of the inner walls of the two sides of the box body (1) is provided with an air outlet plate (13), the top of the air outlet plate (13) is provided with a heating resistance wire (11), the outer wall of the top of the air outlet plate (13) is provided with uniformly distributed air outlets, and the inner wall of the bottom of the box body (1) is provided with an air pump (14).
CN201911381300.8A 2019-12-27 2019-12-27 Stick sticking device for silicon wafer production Withdrawn CN111113706A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911381300.8A CN111113706A (en) 2019-12-27 2019-12-27 Stick sticking device for silicon wafer production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911381300.8A CN111113706A (en) 2019-12-27 2019-12-27 Stick sticking device for silicon wafer production

Publications (1)

Publication Number Publication Date
CN111113706A true CN111113706A (en) 2020-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911381300.8A Withdrawn CN111113706A (en) 2019-12-27 2019-12-27 Stick sticking device for silicon wafer production

Country Status (1)

Country Link
CN (1) CN111113706A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252263A (en) * 1993-02-22 1994-09-09 Furukawa Electric Co Ltd:The Adhesive tape spreading equipment
CN103267050A (en) * 2013-04-28 2013-08-28 苏州工业园区高登威科技有限公司 Automatic monocrystal silicon bonding machine
CN106391369A (en) * 2016-09-08 2017-02-15 合肥智慧殿投资管理有限公司 Pipelined automatic surface treatment equipment of liquid crystal display glass board
CN205951057U (en) * 2016-08-30 2017-02-15 台州市双辉机械设备有限公司 Directional sizing machine of crystal bar
CN206069708U (en) * 2016-08-31 2017-04-05 张凤国 A kind of high performance pipeline type double-layer glass cup crystal base bond processing equipment
CN206282831U (en) * 2016-12-30 2017-06-27 常州亿晶光电科技有限公司 Sheet glass feeding device in lamination of solar battery components technique
CN206349340U (en) * 2016-12-30 2017-07-21 沈阳昊霖智能装备有限公司 A kind of silicon rod is bonded automatic production line
CN110480763A (en) * 2019-07-31 2019-11-22 李辉 A kind of plywood production processing bonding press equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252263A (en) * 1993-02-22 1994-09-09 Furukawa Electric Co Ltd:The Adhesive tape spreading equipment
CN103267050A (en) * 2013-04-28 2013-08-28 苏州工业园区高登威科技有限公司 Automatic monocrystal silicon bonding machine
CN205951057U (en) * 2016-08-30 2017-02-15 台州市双辉机械设备有限公司 Directional sizing machine of crystal bar
CN206069708U (en) * 2016-08-31 2017-04-05 张凤国 A kind of high performance pipeline type double-layer glass cup crystal base bond processing equipment
CN106391369A (en) * 2016-09-08 2017-02-15 合肥智慧殿投资管理有限公司 Pipelined automatic surface treatment equipment of liquid crystal display glass board
CN206282831U (en) * 2016-12-30 2017-06-27 常州亿晶光电科技有限公司 Sheet glass feeding device in lamination of solar battery components technique
CN206349340U (en) * 2016-12-30 2017-07-21 沈阳昊霖智能装备有限公司 A kind of silicon rod is bonded automatic production line
CN110480763A (en) * 2019-07-31 2019-11-22 李辉 A kind of plywood production processing bonding press equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
赵坚勇: "《有机发光二极管(OLED)显示技术》", 31 July 2012 *

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Application publication date: 20200508