JP5603101B2 - Sheet cutting device and cutting method - Google Patents

Description

The present invention relates to a sheet over preparative cutting apparatus and cutting method, in particular, the adhesive layer is provided on one surface of the substrate sheet, cutting the adhesive sheet stuck on an adherend via the adhesive layer The present invention relates to a sheet cutting apparatus and a cutting method.

For example, Patent Document 1 discloses an apparatus that uses a semiconductor wafer (hereinafter, simply referred to as a “wafer”) as an adherend and attaches an adhesive sheet to the wafer.
The apparatus disclosed in this document is configured to affix a protective tape (adhesive sheet) to a wafer and then cut the adhesive sheet into a predetermined shape with a cutter blade in accordance with the shape of the wafer.

JP 2002-57208 A

However, in the sheet sticking device disclosed in Patent Document 1, the adhesive sheet is cut by rotating the cutter blade in one direction along the outer periphery of the wafer.
In such a configuration, when the cutter blade 100 is damaged or the cutting ability thereof is reduced, or when the adhesive force of the adhesive sheet S is weak, as shown in FIG. The outer peripheral portion of the adhesive sheet S affixed to the substrate is lifted, and the adhesive sheet S protrudes from the outer periphery of the wafer W after cutting, so that the adhesive sheet S cannot be cut into a predetermined shape.
Further, as shown in FIG. 9, after the cutter blade 100 is pierced into the adhesive sheet S, the cutting resistance when the cutter blade 100 is about to start moving is very large, so the adhesive sheet S is partially lifted. This causes a phenomenon in which an uncut portion SR of the adhesive sheet S is generated, and the adhesive sheet S cannot be cut into a predetermined shape as described above.
Furthermore, as shown in FIG. 4 (A), in the case of the adhesive sheet S having a cut C that can be divided into a plurality of divided sheets S1, S2, the cut C portion is the edge of the cutter blade. When the blade passes, that is, when the blade edge moves from one divided sheet to the other, the other adhesive sheet is partially wound or lifted to cut the cutter blade 100 at the incision C portion. An uncut portion SR of the adhesive sheet S is generated on the downstream side in the direction. In addition, as shown in FIG. 10, at the moment when the edge of the cutter blade 100 is caught by the notch C portion, the uncut portion SR is generated on the upstream side in the cutting direction of the cutter blade 100 in the notch C portion. There is also.

[Object of the invention]
The object of the present invention is to cut the adhesive sheet affixed to the adherend in accordance with the size of the adherend without causing an uncut portion of the adhesive sheet on the outside of the adherend. it is to provide a Cie over preparative cutting apparatus and cutting method can to cut the sheet into a predetermined shape.

In order to achieve the above object, the present invention is a sheet cutting apparatus in which an adhesive layer is provided on one surface of a base sheet, and the adhesive sheet attached to an adherend is cut through the adhesive layer. And
A cutting means including a cutter blade that pierces the adhesive sheet affixed to the adherend and cuts the adhesive sheet according to the size of the adherend; and a control means for controlling the cutting means in a predetermined manner. , Having a piercing depth control means for piercing the cutter blade into the adhesive sheet, adjusting the piercing depth of the cutter blade with the piercing depth control means, and using the first part of the cutter blade, after cutting the adhesive sheet by moving the cutter blade in one direction along the outer edge, a second site using Utotomoni of the cutter blade by changing the puncture depth, cutting perpendicular to the plane of the adhesive sheet In the top view of the direction, the centerline of the cutter blade is relative to the surface of the adhesive sheet in the front view of the toe angle where the centerline of the cutter blade is inclined with respect to the cutting direction and in the cutting direction parallel to the surface of the adhesive sheet. The A camber angle obliquely, in the adhesive sheet surface in parallel cutting direction side view of the cutter blade further again at least to change of the caster angle which the center line of the cutter blade is inclined in the cutting direction by moving in the one direction or more, uncut partial cutting according to the first part to cut the cut leaving part of the case of occurrence, that has adopted the configuration that.

Furthermore, the present invention is a sheet cutting method in which an adhesive layer is provided on one surface of a base sheet, and the adhesive sheet attached to the adherend is cut through the adhesive layer, the cutter blade comprising: A first cutting step of piercing the adhesive sheet and cutting the adhesive sheet in one direction along the outer edge of the adherend using the first portion of the cutter blade; and after the first cutting step, the second site using Utotomoni of the cutter blade by changing the depth piercing, in the cutting direction viewed perpendicular to the plane of the adhesive sheet, a toe angle which the center line of the cutter blade is inclined with respect to the cutting direction In the front view in the cutting direction parallel to the surface of the adhesive sheet, the camber angle in which the center line of the cutter blade is inclined with respect to the surface of the adhesive sheet, and in the side view in the cutting direction parallel to the surface of the adhesive sheet, Mosquito By centerline terpolymers blade moves further the cutter blade in the one direction or again the cutter blade by changing at least one of the caster angle which is inclined to the cutting direction, cut with the cutting of the first portion The method of performing the 2nd cutting process of cut | disconnecting the said uncut part when the remaining part generate | occur | produces is taken.

According to the present invention, the cutter blade rotates once in one direction along the outer edge of the adherend to perform the first cutting, and then further rotates one or more times in the same direction to cut the adhesive sheet. Since it is a structure, even if an uncut portion occurs when it is cut for the first time, the uncut portion can be cut by the second and subsequent cuts, and the adhesive sheet can be cut into a predetermined shape.
In addition, for example, when the adhesive sheet is provided so as to be divided into a plurality of parts by cutting, cutting the adhesive sheet in one direction may cause uncut parts before and after the cutting, but even in this case, After performing the first cutting in one direction, the remaining portion can be reliably cut by further cutting once more in the one direction. In addition, let the cutting direction downstream side of the cutter blade in the incision C part be after cutting, and let the cutting direction upstream side of the cutter blade in the incision C part be before cutting.
Further, the control means is provided with a piercing depth control means, the piercing depth of the cutter blade to the adhesive sheet is changed via the piercing depth control means, and the first part and the second part of the cutter blade are used properly. In the configuration, by continuing to use only the same part of the cutter blade, it is possible to prevent the cutting ability of the cutter blade from being lowered and to prevent the uncut portion from being generated.
In the configuration provided with the camber angle control means, the cutter blade is moved in one direction at the first camber angle to cut the adhesive sheet, and then the cutter blade is moved again in one direction at the second camber angle. by cutting the adhesive sheet by moving the, Ru can be reliably cut off the uncut portion of the adhesive sheet.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The schematic perspective view which shows the state by which the adhesive sheet was affixed on the wafer. (A), (B) is a schematic perspective view of a cutting member. (A), (B) is operation | movement explanatory drawing which cut | disconnects an adhesive sheet. (A), (B) is operation | movement explanatory drawing which cut | disconnects an adhesive sheet. Operation | movement explanatory drawing which changes and changes a piercing depth. Operation | movement explanatory drawing which a cutter blade cuts maintaining a camber angle. Explanatory drawing which shows the malfunction of a prior art example. Explanatory drawing which shows the malfunction of a prior art example. Explanatory drawing which shows the malfunction of a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIG. 1 and FIG. 2, the sheet sticking apparatus 10 is configured to press the adhesive sheet S against the wafer W, the feeding means 12 for the adhesive sheet S, the table 13 that supports the wafer W as the adherend. A pressing means 14 for sticking, a cutting means 15 for constituting a sheet cutting device for cutting the adhesive sheet S into a predetermined shape in accordance with the size of the wafer W after the adhesive sheet S is attached to the wafer W, and the wafer W by cutting. Is provided with a winding means 18 for winding up an unnecessary sheet SD generated on the outside of the sheet, and a control means 19 for controlling these means. Here, as shown in FIG. 2, the adhesive sheet S in the present embodiment is provided with an adhesive layer A on one surface of a band-shaped base sheet BS, and is a central portion in the width direction, and its extension. A sheet that can be divided into a first divided sheet S <b> 1 and a second divided sheet S <b> 2 by a cut C along the outgoing direction is employed.

  The feeding means 12 collects the support roller 20 that supports the adhesive sheet S wound in a roll together with the release sheet RL, the release member 22 that folds the release sheet RL and peels the adhesive sheet S, and collects the release sheet RL. The adhering sheet S through the guide roller 28 when the adhering sheet S is pasted to the collecting roller 23, the plurality of guide rollers 25 to 32 and the dancer roller 79 disposed between the supporting roller 20 and the collecting roller 23. Cylinders 38A and 38B for holding the adhesive sheet S between the load cell 34 for detecting the tension of the belt and the guide rollers 27 and 30 via the brake shoes 39A and 39B and suppressing the feeding of the adhesive sheet S, the peeling member 22 and the guide roller 27 To 30 and the frame F1 supporting the load cell 34 are detected by the load cell 34. It is constituted by a sticking angle maintaining means 36 is lowered by the tension. The feeding means 12 and the sticking angle maintaining means 36 have substantially the same configuration as that disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and a detailed description thereof will be given here. Omitted.

  The table 13 includes an outer table 40 having a substantially square shape in plan view, an inner table 41 having a substantially circular shape in plan view, and a single-axis robot 43 that moves the inner table 41 up and down. Thereby, the inner table 41 can adjust the height position of the upper surface according to the thickness of the adhesive sheet S and the thickness of the wafer W.

  The pressing means 14 is constituted by a pressing roller 45 which can be moved up and down in FIG. 1 by a cylinder 47 provided on the upper surface of the frame 46, and the frame 46 is supported on a slider (not shown) of the linear motor 49. It is provided so as to be movable in the middle left and right direction.

The cutting means 15 includes a robot body 50 constituted by a so-called 6-axis robot and a cutter blade 51 as a cutting member supported on the free end side of the robot 50. The cutter blade 51 is detachably mounted via a tool holding chuck 52 located on the free end side of the robot body 50. Note that the cutting means 15 has substantially the same structure as that disclosed in Japanese Patent Application No. 2006-15783 filed by the present applicant, and thus detailed description thereof will be omitted. By controlling numerically, the cutter blade 51 can be driven in a multidimensional direction. Thereby, the cutter blade 51 can be moved in one direction (direction (a) in FIG. 4) along the outer periphery of the wafer W by predetermined control of a plurality of arms constituting the robot body 50.
As shown in FIGS. 3A and 3B, the cutter blade 51 in the present embodiment includes a shaft portion 53 that is a gripped portion of the tool holding chuck 52, and the cutter blade 51 has a blade edge. A type in which 51A is formed on one side or a type in which blade edges 51A are formed on both sides can be employed.

  The winding means 18 includes a roller 71 supported by a frame F2, a driving roller 60 driven by a motor M1, and a winding roller 63 that rotates by following an unnecessary sheet SD between the driving roller 60 and a frame F2. Is supported on the slider 65 of the linear motor 49 so as to be movable in the left-right direction in FIG.

  The control means 19 is configured to include a storage unit capable of storing a program for predetermined control of the respective means. The program includes a program constituting the piercing depth control means, and the cutter blade 51 cuts the adhesive sheet S. And a program for controlling the posture of the cutter blade 51, such as the angle and orientation of the cutter blade 51 when it is performed. In addition, the control means 19 can illustrate a computer, a sequencer, etc.

  The piercing depth control means controls and adjusts the piercing depth D from the upper surface of the adhesive sheet S to the lowest position of the cutter blade 51, as shown in FIG. Thereby, arbitrary two places in the edge 51A of the cutter blade 51 are defined as a first part 51a and a second part 51b, and the cutter blade 51 cuts the adhesive sheet S by moving in one direction a along the outer periphery of the wafer W. The first part 51a is used when performing, and when the cutter blade 51 cuts the adhesive sheet S by moving again in one direction a, the second part 51b is used for cutting. According to such a configuration, for example, if the first part 51a of the cutter blade 51 is damaged and the cutting ability is lowered, the cutting is performed even if the same first part 51a is used to move again in one direction a. The remaining portion SR (see FIGS. 4 and 5) may not be cut, but the remaining portion SR can be cut by moving the second portion 51b of the cutter blade 51 in the one direction a once again. it can. The first part 51a and the second part 51b can be changed along the blade edge 51A. For example, when the preset number of times of cutting is exceeded, the first part 51a and the second part 51b are changed along the blade edge 51A. The 1st and 2nd site | parts 51a and 51b can be changed little by little.

  In this embodiment, the program for controlling the posture of the cutter blade 51 can control the camber angle CN at which the center line of the cutter blade 51 is inclined when the cutter blade 51 is viewed from the front in the cutting direction, as shown in FIG. In addition to the camber angle changing program as a proper camber angle control means, as shown in FIG. 4, the toe-in that can control the toe-in angle TI at which the center line of the cutter blade 51 inclines with respect to the cutting direction when viewed from above in the cutting direction. As shown in FIG. 6, the program for changing the toe angle as the angle control means is a caster angle control means capable of controlling the caster angle CS at which the center line of the cutter blade 51 is inclined in the cutting direction in a side view of the cutting direction. Includes a caster angle change program.

  Next, a method for applying the adhesive sheet S in the present embodiment will be described.

  In the initial setting, as shown in FIG. 1, the adhesive sheet S is peeled off from the supporting roller 20 by the peeling member 22 at the raised position and fixed to the winding roller 63, while the peeling sheet RL is And fixed to the collection roller 23.

  When the power is turned on, the winding means 18 operates to wind up the adhesive sheet S until the hole formed in the adhesive sheet S in the previous sheet pasting operation exceeds the roller 71. After that, the brake shoes 39A and 39B come into contact with the guide rollers 27 and 30, respectively, to suppress the feeding of the adhesive sheet S and enter a standby state.

  Next, when the wafer W is set on the table 13 via a transfer means (not shown), the pressing roller 45 moves to the left side in FIG. 1 and the load cell 34 detects a change in the tension of the adhesive sheet S, and the frame F1. 2, the adhesive sheet S is attached to the upper surface of the outer table 40 and the upper surface of the wafer W, as shown in FIG.

When the application of the adhesive sheet S is completed, the cutting means 15 is operated, and the adhesive sheet S is cut along the outer peripheral edge of the wafer W by the cutter blade 51. As shown in FIG. 2, the cutting is performed by piercing the cutter blade 51 at a predetermined position on the outer edge of the wafer W, and then maintaining the blade edge 51 </ b> A forward in the cutting direction, and the cutter blade 51 on the outer edge of the wafer W. The adhesive sheet S is cut along the outer edge of the wafer W by being moved once in one direction a along the first direction (first cutting step).
During this first cutting step, the control means 19 reads the program from the storage unit and controls the cutting means 15 so that the piercing depth D, the toe-in angle TI, the camber angle CN, and the caster angle CS of the cutter blade 51 become predetermined angles. To be controlled. In the case of the present embodiment, the piercing depth control means adjusts the piercing depth D of the cutter blade 51 to D1, and the first portion 51a of the cutter blade 51 cuts the adhesive sheet S as shown in FIG. As shown in FIG. 7, the camber angle of the cutter blade 51 is controlled to CN1 by the camber angle control means, and the adhesive sheet S is cut.
Here, in the first cutting step, the camber angle CN1 is preferably closer to an angle orthogonal to the surface of the adhesive sheet S or an angle orthogonal. As indicated by the two-dot chain line in FIG. 7, as the camber angle CN becomes smaller, the area where the cutter blade 51 and the adhesive sheet S come into contact with each other increases, so that the cutting resistance by the cutter blade 51 increases. This is because the outer peripheral portion of the adhesive sheet S attached to the wafer W is easily lifted, and the uncut portion SR is easily generated.

Following the first cutting step, the cutting means 15 keeps the blade edge 51A facing forward in the cutting direction, and further moves the cutter blade 51 along the outer edge of the wafer W once more in one direction a for cutting. Completion (second cutting step).
In the second cutting step, as in the first cutting step, the control means 19 reads the program from the storage unit and controls the cutting means 15, and the piercing depth D, the toe-in angle TI, and the camber angle CN of the cutter blade 51 are controlled. The caster angle CS is controlled to be a predetermined angle. In the case of the present embodiment, the piercing depth control means adjusts the piercing depth D of the cutter blade 51 to D2, and the second portion 51b of the cutter blade 51 cuts the adhesive sheet S as shown in FIG. As shown in FIG. 7, the camber angle of the cutter blade 51 is controlled to CN2 by the camber angle control means, and the adhesive sheet S is cut.
Here, in the second cutting step, the camber angle CN2 is set to be smaller than the camber angle CN1 in the first cutting step. Thus, by setting the camber angle CN2 small, for example, when the wafer W is ground to a thickness indicated by a two-dot chain line in FIG. The adhesive sheet S (the uncut portion SR) does not protrude from the outer edge, and the adhesive sheet S that protrudes during grinding can be prevented from entering the grinding member of the grinding apparatus and damaging the wafer W. . The uncut portion SR in this case is a portion that is cut in the second cutting step after the first cutting step.
In the second cutting step, by setting the camber angle CN to be small, the area where the cutter blade 51 and the adhesive sheet S come into contact increases, but as shown in FIGS. 4B and 5B. In addition, since the portion outside the wafer W (the uncut portion SR) cut in the second cutting step is displaced so as to escape to the outside of the wafer W, the camber angle CN is reduced in the first cutting step for cutting. Compared to the case, the cutting resistance is small, and the peripheral portion SR of the adhesive sheet S attached to the wafer W is not lifted up so that the uncut portion SR cannot be cut. The camber angle and the piercing depth do not necessarily need to be changed, and the camber angle and the piercing depth may be cut without being changed depending on the thickness and rigidity of the adhesive sheet S or the outer edge end face shape of the adherend. .
In the first and second cutting steps, the toe angle TI and the caster angle CS may be set to different angles via the toe angle control means and the caster angle control means, or set to the same angle. May be. In the case of this embodiment, the toe-in angle TI is set to the same angle in both the first and second cutting steps, but the caster angle CS is set to CS1 in the first cutting step, and in the second cutting step. It is set to CS2. The cutting resistance of the adhesive sheet S can also be reduced by making the caster angle CS2 larger than the caster angle CS1 or setting the piercing depth D2 shallower than the piercing depth D1.

Here, when the cut C is provided in the adhesive sheet S, if the cutting edge 51A of the cutter blade 51 decreases the cutting ability with time, the cutter blade 51 hits the cut C during the cutting of the adhesive sheet S. In other words, the cutting resistance increases sharply at the moment of transfer from the first divided sheet S1 to the second divided sheet S2, or at the moment of transfer from the second divided sheet S2 to the first divided sheet S1, so that the wafer W is bonded. A force that lifts up the sheet S acts, and the adhesive sheet S is cut in a state where the portion of the adhesive sheet S outside the outer edge of the wafer W is pulled by this force, and as shown in FIG. In addition, uncut portions SR are generated before and after the cut C in the cutting direction of the adhesive sheet S.
According to the present embodiment, even if such an uncut portion SR is generated, the cutter blade 51 is moved in the direction a once again as shown in FIG. By cutting twice in the direction, the uncut portion SR can be cut.

  After the cutting of the adhesive sheet S is completed in this way, the wafer W is removed from the table 13 via a transfer device (not shown), and the frame F2 moves to the left side in FIG. The unnecessary sheet SD is wound up by the winding roller 63. Next, the brake shoes 38, 39 are separated from the guide rollers 27, 30 and the frame F1 is raised. At the same time, the pressing roller 45 is raised, the pressing means 14 and the frame F2 are returned to the positions shown in FIG. The sheet S is fed out and thereafter the same operation as described above is performed.

  Therefore, according to such an embodiment, even if the cutter blade 51 moves in one direction a and the uncut portion SR is generated, the uncut portion SR can be cut by the second movement, and the adhesive sheet This eliminates the inconvenience that the adhesive sheet S partially protrudes from the outer edge of the wafer W after the S is pasted, and the adhesive sheet can be cut into a predetermined shape.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the said embodiment, although the adhesive sheet S which has the notch C shall be affixed on the wafer W, as FIG. 5 shows, the object which affixes or cut | disconnects the adhesive sheet S which does not have the notch C It is also possible to do. In this case, as shown in FIG. 5 (A), after the cutter blade 51 is pierced into the adhesive sheet S, the cutting resistance when the cutter blade 51 starts to move is very large. A phenomenon in which the adhesive sheet S is lifted partially occurs, the adhesive sheet S cannot be cut at a predetermined cutting position, and an uncut portion SR of the adhesive sheet S is generated. However, even if such an uncut portion SR is generated, the cutter blade 51 is moved once more in one direction a along the outer edge of the wafer W as shown in FIG. That is, the uncut portion SR can be cut by cutting twice or more.

Further, the first and second cuts in the one direction a have been shown to be substantially two rotations along the outer edge of the wafer W, but the second cut is two or more rotations. I will not prevent it.
In the embodiment, the control unit 19 moves the cutter blade 51 in one direction along the outer edge of the wafer W through the cutting unit 15 to cut the adhesive sheet S, and then pierces the depth D and the toe-in angle. The adhesive sheet S may be cut by changing at least one of the TI, the camber angle CN, and the caster angle CS, and further moving the cutter blade 51 in one direction a once more. At this time, in the third and subsequent cuts, the adhesive sheet S may be cut by changing at least one of the piercing depth D, the toe-in angle TI, the camber angle CN, and the caster angle CS.

  Further, the adherend is not limited to the wafer W, and other adherends such as a glass plate, a steel plate, a pottery, a wooden plate, or a resin plate can be targeted. The semiconductor wafer is a silicon semiconductor wafer, It may be a compound semiconductor wafer.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Feeding means 14 Pressing means 15 Cutting means (sheet cutting apparatus)
19 Control means 51 Cutter blade (cutting member)
51A Blade edge A Adhesive layer BS Base material sheet C Cutting S Adhesive sheet S1 1st division sheet (division sheet)
S2 Second divided sheet (divided sheet)
SR Uncut part a Unidirectional W Semiconductor wafer (Substrate)

Claims (2)

An adhesive layer is provided on one surface of the base sheet, and is a sheet cutting device for cutting an adhesive sheet attached to an adherend through the adhesive layer,
Cutting means including a cutter blade for piercing the adhesive sheet affixed to the adherend and cutting according to the size of the adherend;
Control means for predetermined control of the cutting means,
The control means includes a piercing depth control means for piercing the cutter blade into an adhesive sheet, and the piercing depth control means adjusts the piercing depth of the cutter blade and uses the first part of the cutter blade. after cutting the adhesive sheet by moving the cutter blade in one direction along the outer edge of the adherend, using the second portion of the cutter blade by changing the puncture depth Utotomoni surface of the adhesive sheet The center line of the cutter blade is the adhesive sheet when viewed from the top in the cutting direction orthogonal to the toe angle at which the center line of the cutter blade is inclined with respect to the cutting direction and the cutting direction parallel to the surface of the adhesive sheet. At least one of a camber angle that is inclined with respect to the surface and a caster angle in which the center line of the cutter blade is inclined in the cutting direction in a side view in the cutting direction parallel to the surface of the adhesive sheet. Further is allowed to be to move in the one direction further than again the cutter blade, the sheet cutting apparatus, wherein a uncut portion at the cutting of the first portion cleaves the cutting leaving part of the case of occurrence. An adhesive layer is provided on one surface of the base sheet, and is a sheet cutting method for cutting an adhesive sheet attached to an adherend through the adhesive layer,
A first cutting step of cutting the adhesive sheet in one direction along the outer edge of the adherend using a first portion of the cutter blade by piercing the cutter blade into the adhesive sheet;
After the first cutting step, a second site using Utotomoni of the cutter blade by changing the depth piercing of the cutter blade, in the cutting direction viewed perpendicular to the plane of the adhesive sheet, the center of the cutter blade A toe-in angle at which the line is inclined with respect to the cutting direction; a camber angle at which a center line of the cutter blade is inclined with respect to the surface of the adhesive sheet in a front view in the cutting direction parallel to the surface of the adhesive sheet; In a side view in a cutting direction parallel to the surface of the cutter, at least one of the center angles of the cutter blades and a caster angle inclined in the cutting direction is changed to move the cutter blades in the one direction again and again. And a second cutting step of cutting the uncut portion when the uncut portion is generated by the cutting by the first portion by moving the sheet. Law.

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