JPH04105813A - Processing method for external shape of printed board - Google Patents
Processing method for external shape of printed boardInfo
- Publication number
- JPH04105813A JPH04105813A JP22485890A JP22485890A JPH04105813A JP H04105813 A JPH04105813 A JP H04105813A JP 22485890 A JP22485890 A JP 22485890A JP 22485890 A JP22485890 A JP 22485890A JP H04105813 A JPH04105813 A JP H04105813A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- printed circuit
- circuit board
- cutter
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims description 9
- 238000003754 machining Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 8
- 230000002950 deficient Effects 0.000 abstract 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
Abstract
Description
［産業上の利用分野］
本発明は、プリント基板と回転する工具を相対送りする
ことにより、プリント基板の外形を加工するプリント基
板外形加工方法に係り、特に、工具の寿命を延ばすこと
ができ、加工不良の発生を防止することのできるプリン
ト基板外形加工方法に関する。[Industrial Field of Application] The present invention relates to a printed circuit board contour processing method for processing the contour of a printed circuit board by relatively feeding a printed circuit board and a rotating tool. The present invention relates to a method for processing the outer shape of a printed circuit board that can prevent the occurrence of processing defects.
一般に、プリント基板の外形を加工するプリント基板外
形加工装置は、テーブル上に＼載置されたプリント基板
に、回転する工具を一定量切り込ませた後、テーブルと
工具をＸ−Ｙ方向に相対移動させるように構成されてい
る。
いま、スピンドルを下降してプリント基板に工具のカッ
タ一部を切り込んだときの状態を見ると、第５図に示す
如き状態となっている。
すなわち、図中、１００は、工具。長さＬは、工具１０
０のカッタ一部の長さ（カッター長）。
φＤは、工具１００のカッタ一部の径である。
３ｔは厚さｔのプリント基板１１０の３枚分の厚さ。１
２０は、プリント基板１１０の下に敷く下板で、例えば
フェノール樹脂積層板等で形成されている。１３０は、
プリント基板１１０を載置するテーブル。ａは、工具１
００を下板１２０に切り込む長さである。
この工具１００のカッタ一部の長さし、工具１ｏＯのカ
ッタ一部の径φＤ、プリント基板１１０の１枚分の厚さ
ｔ、下板１２０に切り込む長さａをそれぞれ、
φＤ＝２．４ｍｍ、
Ｌ＝１１．５薗
ｔ＝１．６ｎｎ
ａ＝０．５＋ｎｍ
とし、プリント基板１１０を３枚重ねて加工する場合、
工具１００のカッタ一部の切込深さは、３ｔ＋ｂ＝５．
３ｍｍ
となる。Generally, a printed circuit board contour processing device that processes the external shape of a printed circuit board uses a rotating tool to cut a certain amount into a printed circuit board placed on a table, and then moves the table and tool relative to each other in the X-Y direction. configured to be moved. Now, when the spindle is lowered and a portion of the cutter of the tool cuts into the printed circuit board, the state is as shown in FIG. 5. That is, in the figure, 100 is a tool. Length L is tool 10
0 cutter part length (cutter length). φD is the diameter of a portion of the cutter of the tool 100. 3t is the thickness of three printed circuit boards 110 having a thickness of t. 1
A lower plate 20 is placed under the printed circuit board 110 and is made of, for example, a phenol resin laminate. 130 is
A table on which a printed circuit board 110 is placed. a is tool 1
00 is the length to be cut into the lower plate 120. The length of the cutter part of this tool 100, the diameter φD of the cutter part of the tool 1oO, the thickness t of one printed circuit board 110, and the length a of cutting into the lower plate 120 are respectively φD=2.4 mm. , L=11.5, t=1.6nn, a=0.5+nm, and when three printed circuit boards 110 are stacked and processed,
The cutting depth of the cutter part of the tool 100 is 3t+b=5.
It will be 3mm.
【発明が解決しようとする課題】
このようなプリント基板の外形加工方法にあっては、プ
リント基板に対する工具の切り込み深さが一定（固定）
しており、切削加工には、常に工具の同一カッタ一部の
みが用いられることになる。
このため、工具１００を回転させてプリント基板１１０
の外形加工を行っていくと、加工距離が増すにつれて、
プリント基板１１０を切削する工具１００が摩耗する。
そして、プリント基板１００が、ガラスエポキシ基板で
あると、ガラス繊維を切削するため、特に、プリント基
板１００を切削する部分の摩耗が大きくなり、第６図に
示す如く工具１００の径の大きさが非切削部分すの部分
の径Ｒ１と切削部分Ｃの部分の径Ｒ２とで差が生じてく
る。
したがって、第６図に示す如き非切削部分すの部分の径
Ｒ□と切削部分Ｃの部分の径Ｒ２とで工具１００の径の
大きさに差が生じている状態で、外形加工するプリント
基板１１０の枚数や、工具１００の高さの設定（工具１
００をＺ方向に下降させる距離）を変更すると、工具１
００に生じている径の段差によって複数枚重ねたプリン
ト基板１１０毎に外形寸法に差が生じたり、１枚のプリ
ント基板で表面外形寸法と裏面外形寸法に差が生じてし
まい、プリント基板の外形加工精度が低下する。
また、工具１００を回転させてプリント基板１１０の外
形加工をし、工具１００のカッターの一部分（プリント
基板１１０に当接している部分）のみが摩耗する所謂片
減りした状態で、更にこの摩耗したカッタ一部で外形加
工を繰り返すと、この外形加工に使用したカッタ一部が
摩滅してしまい、他にカッタ一部で摩耗していない（未
使用）部分があるにも拘らず、工具を交換しなければな
らず、工具寿命が短くなる。
本発明は、プリント基板の外形加工時に工具のカッタ一
部を効率的に使用することにより、工具の寿命を延ばす
ことができ、加工不良の発生を防止することのできるプ
リント基板外形加工方法を提供することを目的としてい
る。[Problems to be Solved by the Invention] In this method of processing the external shape of a printed circuit board, the depth of cut of the tool into the printed circuit board is constant (fixed).
Therefore, only part of the same cutter of the tool is always used for cutting. For this reason, the tool 100 is rotated to remove the printed circuit board 110.
As the machining distance increases,
The tool 100 that cuts the printed circuit board 110 wears out. If the printed circuit board 100 is a glass epoxy board, the glass fibers are cut, so the wear of the part where the printed circuit board 100 is cut becomes large, and the diameter of the tool 100 increases as shown in FIG. A difference arises between the diameter R1 of the non-cutting portion C and the diameter R2 of the cutting portion C. Therefore, when the diameter of the tool 100 is different between the diameter R□ of the non-cutting part and the diameter R2 of the cutting part C, as shown in FIG. Setting the number of pieces of 110 and the height of tool 100 (tool 1
00 in the Z direction), tool 1
Due to the difference in diameter that occurs in the diameter of the printed circuit board 110, there may be a difference in external dimensions between multiple printed circuit boards 110, or a difference may occur between the front and back external dimensions of a single printed circuit board. Machining accuracy decreases. Further, when the tool 100 is rotated to process the outer shape of the printed circuit board 110, only a part of the cutter of the tool 100 (the part that is in contact with the printed circuit board 110) is worn out, so-called uneven wear, and this worn cutter is further removed. If you repeat the external machining on a part, the cutter used for this external machining will wear out, and even though there are other parts of the cutter that are not worn (unused), you will not be able to replace the tool. tool life will be shortened. The present invention provides a printed circuit board contour processing method that can extend the life of the tool and prevent the occurrence of processing defects by efficiently using a part of the cutter of the tool during contour processing of the printed circuit board. It is intended to.
上記目的を達成するために、本発明のプリント基板外形
加工方法においては、プリント基板と回転する工具の相
対移動によってプリント基板の外形を加工する間に、前
記工具をその軸方向に往復移動させるようにしたもので
ある。
また、上記目的を達成するために、本発明のプリント基
板外形加工方法においては、プリント基板と回転する工
具の相対移動によってプリント基板の外形を加工する間
に、所定時間毎に所定距離ステップ状に前記工具をその
軸方向に往復移動させるようにしたものである。
さらに、上記目的を達成するために、本発明のプリント
基板外形加工方法においては、プリント基板と回転する
工具の相対移動によってプリント基板の外形を加工する
毎に、加工時の前記工具の軸方向の位置を該工具のカッ
ター長の範囲で所定距離変化させて、プリント基板の外
形加工を行うようにしたものである。In order to achieve the above object, in the printed circuit board outline processing method of the present invention, while processing the outline of the printed circuit board by relative movement between the printed circuit board and the rotating tool, the tool is reciprocated in its axial direction. This is what I did. In addition, in order to achieve the above object, in the printed circuit board outline processing method of the present invention, while processing the outline of the printed circuit board by relative movement of the printed circuit board and the rotating tool, stepwise processing is performed for a predetermined distance at predetermined time intervals. The tool is configured to reciprocate in its axial direction. Furthermore, in order to achieve the above object, in the printed circuit board outline processing method of the present invention, each time the outline of the printed circuit board is processed by relative movement between the printed board and the rotating tool, the axial direction of the tool during processing is The outer shape of the printed circuit board is processed by changing the position by a predetermined distance within the range of the cutter length of the tool.
【作用］
プリント基板と回転する工具の相対移動によってプリン
ト基板の外形を加工する間に、前記工具をその軸方向に
往復移動させ、外形加工開始から終了までの１つの外形
加工工程において工具のカッタ一部の上部から下部まで
全体を使用するため、プリント基板の外形加工時に工具
のカッタ一部を効率的に使用して工具のカッタ一部の片
減りを防止し、工具の寿命を延ばすことができ、工具の
カッタ一部の片減りによる加工不良の発生を防止するこ
とができる。
また、プリント基板と回転する工具の相対移動によって
プリント基板の外形を加工する間に、所定時間毎に所定
距離ステップ状に前記工具をその軸方向に往復移動、す
なわち、外形加工開始から終了までの１つの外形加工工
程において工具のカッタ一部を加工距離毎にステップ状
に上部（下部）から下部（上部）までの全体を往復動し
て使用するため、プリント基板の外形加工時に工具のカ
ッタ一部を効率的に使用して工具のカッタ一部の片減り
を防止し、工具の寿命を延ばすことができ、工具のカッ
タ一部の片減りによる加工不良の発生を防止することが
できる。、
さらに、プリント基板と回転する工具の相対移動によっ
てプリント基板の外形を加工する毎に、加工時の前記工
具の軸方向の位置を該工具のカッター長の範囲で所定距
離変化させ１、すなわち、外形加工開始から終了までの
１つの外形加工工程毎に、工具の使用カッタ一部を変え
て使用するため、プリント基板の外形加工時に工具のカ
ッター部を効率的に使用して工具のカッタ一部の片減り
を防止し、工具の寿命を延ばすことができ、工具のカッ
タ一部の片減りによる加工不良の発生を防止することが
できる。
【実施例】
以下、本発明の実施例について説明する。
第１図には、本発明に係るプリント基板外形加工方法の
適用されるプリント基板外形加工装置の一実施例が示さ
れている。
図において、１は、プリント基板外形加工装置で、回転
する工具とプリント基板との間で相対送りすることによ
り該プリント基板の外形を加工するものである。
・
２は、工具で、スピンドル３に脱着自在に把持されてい
る。そして、スピンドル３は、スピンドルモータ４によ
って回転駆動される。
５は、スピンドル送りモータで、スピンドル３をＺ方向
に移動することにより工具２をＺ方向に移動するための
ものである。
６は、スピンドル送りモータ５をＹ方向に移動させる送
り螺子である。この送り螺子６は、スピンドル送りモー
タ７によって回転するように構成されている。
８は、第２図に示す如き奇跡１１に沿って外形加工の行
われるプリント基板１０を載置するテーブルで、テーブ
ル送りモータ９によってＸ方向に移動可能に構成されて
いる。
１２は、モータドライバーで，スピンドルモータ４と、
スピンドル送りモータ５と、スピンドル送りモータ７を
駆動するものである。このモータドライバー１２には、
ＮＣ制御装置１３が接続されており、このＮＣ制御装置
１３は、キーまたはテープで入力される符号化（コード
化）したＮＣテーブル上の外形加工情報・工具駆動情報
に基づいてスピンドルモータ４と、スピンドル送りモー
タ５と、スピンドル送りモータ７の駆動量を制御する制
御指令に変換してモータドライバー１２に与えるもので
ある。
第３図に、本願第１の発明に係るプリント基板外形加工
方法を示す工具のＺ方向の移動状態が示されている。
本願第１の発明は、回転する工具２によってプリント基
板１０の軌跡１１に沿って外形加工を行うに、外形加工
開始から終了までの１つの外形加工工程（第２図図示加
工開始Ａ点から加工終了Ａ点に至るまで）において、工
具２の高さを所定速度で最適な距離で第３図図示Ａ点か
らＢ点に至る下方向に連続的に変化させ、さらにＢ点か
ら０点に至る上方向に連続的に変化させるものである。
すなわち、１つの外形加工工程で、加工開始点Ａから加
工終了点Ａに至るまでに工具２の高さは、距離Ｓの範囲
を往復移動する。この工具２の高さ移動距離Ｓは、
Ｓ＞３ ｔ[Function] While processing the outer shape of the printed circuit board by relative movement between the printed circuit board and the rotating tool, the tool is reciprocated in its axial direction, and the cutter of the tool is Since the entire part is used from the top to the bottom, part of the cutter of the tool can be used efficiently when machining the external shape of a printed circuit board, preventing the part of the cutter from wearing out unevenly, and extending the life of the tool. This makes it possible to prevent machining defects due to uneven wear of a part of the cutter of the tool. In addition, while the outer shape of the printed circuit board is processed by the relative movement of the printed circuit board and the rotating tool, the tool is reciprocated in its axial direction in steps of a predetermined distance at predetermined time intervals, that is, from the start to the end of the outer shape processing. In one contour machining process, part of the cutter of the tool is reciprocated from the top (bottom) to the bottom (top) in steps for each machining distance. It is possible to prevent uneven wear of a part of the cutter of the tool by efficiently using the parts, thereby extending the life of the tool, and preventing the occurrence of machining defects due to uneven wear of a part of the cutter of the tool. Further, each time the outer shape of the printed circuit board is processed by relative movement between the printed circuit board and the rotating tool, the axial position of the tool during processing is changed by a predetermined distance within the range of the cutter length of the tool 1, that is, Since the cutter part of the tool is changed for each external machining process from the start to the end of the external machining process, the cutter part of the tool can be used efficiently when machining the external shape of a printed circuit board. It is possible to prevent uneven wear of the tool, extend the life of the tool, and prevent machining defects due to uneven wear of a part of the cutter of the tool. [Examples] Examples of the present invention will be described below. FIG. 1 shows an embodiment of a printed circuit board contour processing apparatus to which a printed circuit board contour processing method according to the present invention is applied. In the figure, reference numeral 1 denotes a printed circuit board contour processing device which processes the contour of the printed circuit board by relative feeding between a rotating tool and the printed circuit board.
- 2 is a tool that is detachably held by the spindle 3; The spindle 3 is rotationally driven by a spindle motor 4. 5 is a spindle feed motor for moving the tool 2 in the Z direction by moving the spindle 3 in the Z direction. 6 is a feed screw that moves the spindle feed motor 5 in the Y direction. This feed screw 6 is configured to be rotated by a spindle feed motor 7. Reference numeral 8 denotes a table on which a printed circuit board 10 to be subjected to external processing is placed along a line 11 as shown in FIG. 2, and is configured to be movable in the X direction by a table feed motor 9. 12 is a motor driver, which includes a spindle motor 4;
It drives the spindle feed motor 5 and the spindle feed motor 7. This motor driver 12 includes
An NC control device 13 is connected, and this NC control device 13 controls the spindle motor 4 and the tool drive information on the encoded (encoded) NC table, which is input using a key or tape. The control command is converted into a control command for controlling the drive amount of the spindle feed motor 5 and the spindle feed motor 7, and is given to the motor driver 12. FIG. 3 shows a state in which the tool is moved in the Z direction, showing the printed circuit board external shape processing method according to the first invention of the present application. The first invention of the present application is characterized in that when the outer shape is machined along the locus 11 of the printed circuit board 10 with the rotating tool 2, one outer shape machining process from the start of the outer shape machining to the end (machining from the machining start point A shown in FIG. 2) is performed. (up to the end point A), the height of the tool 2 is continuously changed downward at a predetermined speed and an optimal distance from point A to point B shown in Figure 3, and then from point B to point 0. It changes continuously in the upward direction. That is, in one contour machining process, the height of the tool 2 reciprocates within a range of distance S from the machining start point A to the machining end point A. The height movement distance S of this tool 2 is S>3 t
Claims (3)
プリント基板の外形を加工する間に、前記工具をその軸
方向に往復移動させることを特徴とするプリント基板外
形加工方法。(1) A method for machining the outer shape of a printed circuit board, characterized in that while the outer shape of the printed circuit board is processed by relative movement between the printed circuit board and a rotating tool, the tool is reciprocated in the axial direction thereof.
プリント基板の外形を加工する間に、所定時間毎に所定
距離ステップ状に前記工具をその軸方向に往復移動させ
ることを特徴とするプリント基板外形加工方法。(2) Printed circuit board contouring characterized in that while the contour of the printed circuit board is processed by relative movement between the printed circuit board and a rotating tool, the tool is reciprocated in the axial direction of the printed circuit board in a stepwise manner by a predetermined distance at predetermined intervals. Processing method.
プリント基板の外形を加工する毎に、加工時の前記工具
の軸方向の位置を該工具のカッター長の範囲で所定距離
変化させて、プリント基板の外形加工を行うことを特徴
とするプリント基板外形加工方法。(3) Every time the outer shape of the printed circuit board is processed by relative movement of the printed circuit board and the rotating tool, the axial position of the tool during processing is changed by a predetermined distance within the range of the cutter length of the tool. A method for processing the outer shape of a printed circuit board, the method comprising processing the outer shape of a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22485890A JPH04105813A (en) | 1990-08-27 | 1990-08-27 | Processing method for external shape of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22485890A JPH04105813A (en) | 1990-08-27 | 1990-08-27 | Processing method for external shape of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04105813A true JPH04105813A (en) | 1992-04-07 |
Family
ID=16820275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22485890A Pending JPH04105813A (en) | 1990-08-27 | 1990-08-27 | Processing method for external shape of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04105813A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08309612A (en) * | 1995-05-12 | 1996-11-26 | Kennametal Inc | Milling cutter and measure of milling |
| JP2009107038A (en) * | 2007-10-26 | 2009-05-21 | Konica Minolta Opto Inc | Working method |
| JP2010073846A (en) * | 2008-09-18 | 2010-04-02 | Fujitsu Ltd | Substrate processor and substrate processing method |
| JP2010228092A (en) * | 2009-02-09 | 2010-10-14 | Deckel Maho Pfronten Gmbh | Method and device for generating control data for controlling tool in machine tool including at least five shafts |
| JP2011161551A (en) * | 2010-02-08 | 2011-08-25 | Hitachi Via Mechanics Ltd | Device and method for machining workpiece, and program |
| JP2011171561A (en) * | 2010-02-19 | 2011-09-01 | Lintec Corp | Apparatus and method of pasting sheet, as well as apparatus and method of cutting the sheet |
| JP2011171562A (en) * | 2010-02-19 | 2011-09-01 | Lintec Corp | Apparatus and method of pasting sheet, as well as apparatus and method of cutting the sheet |
| JP2012096339A (en) * | 2010-11-05 | 2012-05-24 | Hitachi Via Mechanics Ltd | Method and device of machining workpiece, and program |
| JP2015066639A (en) * | 2013-09-30 | 2015-04-13 | 国立大学法人 名古屋工業大学 | Method for manufacturing fiber-reinforced resin laminate component by cutting |
| EP3356070A4 (en) * | 2015-09-29 | 2019-07-17 | ABB Schweiz AG | Method and system for machining |
-
1990
- 1990-08-27 JP JP22485890A patent/JPH04105813A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08309612A (en) * | 1995-05-12 | 1996-11-26 | Kennametal Inc | Milling cutter and measure of milling |
| JP2009107038A (en) * | 2007-10-26 | 2009-05-21 | Konica Minolta Opto Inc | Working method |
| JP2010073846A (en) * | 2008-09-18 | 2010-04-02 | Fujitsu Ltd | Substrate processor and substrate processing method |
| JP2010228092A (en) * | 2009-02-09 | 2010-10-14 | Deckel Maho Pfronten Gmbh | Method and device for generating control data for controlling tool in machine tool including at least five shafts |
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