SG11202010427SA - Device and method for attaching protective tape on semiconductor wafer - Google Patents

Device and method for attaching protective tape on semiconductor wafer

Info

Publication number
SG11202010427SA
SG11202010427SA SG11202010427SA SG11202010427SA SG11202010427SA SG 11202010427S A SG11202010427S A SG 11202010427SA SG 11202010427S A SG11202010427S A SG 11202010427SA SG 11202010427S A SG11202010427S A SG 11202010427SA SG 11202010427S A SG11202010427S A SG 11202010427SA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
protective tape
attaching protective
attaching
tape
Prior art date
Application number
SG11202010427SA
Inventor
Karl Heinz Priewasser
Ken Ikehata
Yoshinori Kakinuma
Yosuke Ishimatsu
Original Assignee
Disco Hi Tec Europe Gmbh
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Hi Tec Europe Gmbh, Takatori Corp filed Critical Disco Hi Tec Europe Gmbh
Publication of SG11202010427SA publication Critical patent/SG11202010427SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
SG11202010427SA 2018-04-24 2018-04-24 Device and method for attaching protective tape on semiconductor wafer SG11202010427SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/016533 WO2019207632A1 (en) 2018-04-24 2018-04-24 Device and method for attaching protective tape on semiconductor wafer

Publications (1)

Publication Number Publication Date
SG11202010427SA true SG11202010427SA (en) 2020-11-27

Family

ID=68294423

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010427SA SG11202010427SA (en) 2018-04-24 2018-04-24 Device and method for attaching protective tape on semiconductor wafer

Country Status (8)

Country Link
US (1) US11935768B2 (en)
JP (1) JP7287630B2 (en)
KR (1) KR102555601B1 (en)
CN (1) CN112020768A (en)
DE (1) DE112018007513T5 (en)
SG (1) SG11202010427SA (en)
TW (1) TWI820117B (en)
WO (1) WO2019207632A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102400988B1 (en) * 2022-03-10 2022-05-23 (주)파웰 코퍼레이션 Autoclave Apparatus for electrostatic chuck bonding
CN116021403A (en) * 2022-10-13 2023-04-28 北京特思迪半导体设备有限公司 Flexible air bag structure for wafer batch polishing and accurate control method of down force

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3890765A (en) 1973-09-07 1975-06-24 Phillips Petroleum Co Carton forming machine
JPS5828532U (en) 1981-08-14 1983-02-24 株式会社日立製作所 Status and fault display method
JPH1012578A (en) * 1996-06-26 1998-01-16 Mitsubishi Electric Corp Method and apparatus for mounting wafer on support base
JP3627090B2 (en) * 1997-09-17 2005-03-09 株式会社名機製作所 Lamination molding method and lamination molding apparatus
JP3607143B2 (en) 1999-11-19 2005-01-05 株式会社タカトリ Method and apparatus for attaching protective tape to semiconductor wafer
US6520844B2 (en) * 2000-08-04 2003-02-18 Sharp Kabushiki Kaisha Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
KR20030033084A (en) * 2000-09-27 2003-04-26 스트라스바흐, 인코포레이티드 Tool for applying resilient tape to chuck used for grinding or polishing wafers
JP2002222779A (en) 2001-01-29 2002-08-09 Nec Yamagata Ltd Tape sticking device and method therefor
JP3957506B2 (en) * 2001-12-26 2007-08-15 Ｎｅｃエレクトロニクス株式会社 Substrate surface protection sheet affixing device and affixing method
JP3545758B2 (en) 2003-06-17 2004-07-21 リンテック株式会社 Method and apparatus for cutting semiconductor wafer protection film
JP4559122B2 (en) * 2004-05-25 2010-10-06 有限会社都波岐精工 Tape bonding apparatus and tape bonding method
KR100725289B1 (en) * 2005-03-17 2007-06-07 엘에스전선 주식회사 Apparatus and method for manufacturing adhesive tape used for semiconductor manufacturing
JP4612453B2 (en) 2005-03-30 2011-01-12 株式会社タカトリ Method and apparatus for applying tape to wafer
JP2007036153A (en) * 2005-07-29 2007-02-08 Disco Abrasive Syst Ltd Sticking method and apparatus of protective tape for wafer
JP4841355B2 (en) * 2006-08-08 2011-12-21 日東電工株式会社 Method for holding semiconductor wafer
JP5112682B2 (en) * 2006-12-18 2013-01-09 リンテック株式会社 Sheet sticking device and sticking method
JP4934620B2 (en) * 2008-03-25 2012-05-16 古河電気工業株式会社 Wafer processing tape
JP2009246004A (en) * 2008-03-28 2009-10-22 Tokyo Seimitsu Co Ltd Dicing tape sticking apparatus
JP4723614B2 (en) * 2008-06-06 2011-07-13 リンテック株式会社 Sheet sticking device and sticking method
JP5216472B2 (en) * 2008-08-12 2013-06-19 日東電工株式会社 Method and apparatus for attaching protective tape to semiconductor wafer
JP5317267B2 (en) 2008-11-14 2013-10-16 株式会社タカトリ Wafer mounting device
JP5273791B2 (en) * 2008-12-02 2013-08-28 株式会社タカトリ Equipment for applying adhesive tape to substrates
JP5417131B2 (en) 2009-11-20 2014-02-12 日東電工株式会社 Adhesive tape attaching apparatus and adhesive tape attaching method
JP5126260B2 (en) * 2010-03-16 2013-01-23 Ｎｅｃエンジニアリング株式会社 Tape sticking device and tape sticking method
JP2014204033A (en) * 2013-04-08 2014-10-27 日東電工株式会社 Semiconductor device manufacturing method
JP2015162634A (en) 2014-02-28 2015-09-07 株式会社タカトリ Device of pasting protective tape to wafer and method of manufacturing wafer
JP5828532B1 (en) 2014-12-02 2015-12-09 大宮工業株式会社 Pasting device
JP2017041469A (en) 2015-08-17 2017-02-23 日東電工株式会社 Protective tape sticking method
KR102499977B1 (en) 2016-07-13 2023-02-15 삼성전자주식회사 Adhesive tape sticking apparatus and method of manufacturing a semiconducotr package using the same

Also Published As

Publication number Publication date
DE112018007513T5 (en) 2021-03-11
US20210249285A1 (en) 2021-08-12
CN112020768A (en) 2020-12-01
US11935768B2 (en) 2024-03-19
WO2019207632A1 (en) 2019-10-31
TW201946208A (en) 2019-12-01
KR102555601B1 (en) 2023-07-18
KR20210003139A (en) 2021-01-11
TWI820117B (en) 2023-11-01
JPWO2019207632A1 (en) 2021-04-22
JP7287630B2 (en) 2023-06-06

Similar Documents

Publication Publication Date Title
EP3581890B8 (en) Method and device for positioning
EP3955315A4 (en) Semiconductor device and fabrication method therefor
SG11202012963WA (en) Adhesive tape for semiconductor processing and method for producing semiconductor device
SG11202012961SA (en) Semiconductor processing adhesive tape and method of manufacturing semiconductor device
IL275116A (en) Method for depositing an epitaxial layer on a front side of a semiconductor wafer and device for carrying out the method
SG10201905840VA (en) Semiconductor device and manufacturing method thereof
EP3859360A4 (en) Semiconductor device inspection method and semiconductor device inspection device
EP3734666C0 (en) Semiconductor device and fabrication method thereof
EP3832733A4 (en) Semiconductor device and method for manufacturing same
SG11202010428UA (en) Device and method for attaching protective tape to semiconductor wafer
EP3811408A4 (en) Semiconductor device and method of fabrication thereof
SG11202113168SA (en) Semiconductor device examination method and semiconductor device examination device
EP3886178A4 (en) Semiconductor device and method for manufacturing semiconductor device
SG11202010427SA (en) Device and method for attaching protective tape on semiconductor wafer
EP3745449A4 (en) Semiconductor device and method for manufacturing semiconductor device
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film
EP4084047A4 (en) Ic chip-mounting device and ic chip-mounting method
SG11202111780XA (en) Semiconductor device manufacturing device and manufacturing method
SG11202111977XA (en) Method for inspecting semiconductor and semiconductor inspecting device
EP3998476A4 (en) Semiconductor device inspection method and semiconductor device inspection device
EP3804478A4 (en) Semiconductor device package and method for use thereof
GB2585696B (en) Semiconductor device and method for producing same
TWI799544B (en) Adhesive tape and method for manufacturing semiconductor device
SG11201910866XA (en) Semiconductor device and manufacturing method
EP3742495A4 (en) Semiconductor device and method for manufacturing semiconductor device