KR102254069B1 - Resin molding method, film conveying device, and resin molding device - Google Patents

Abstract

A task is to provide a technology that can reduce the running cost of manufacturing molded products. As a solution, the mold surface 21a is covered with a roll-shaped release film F supplied from the film loader hand 40 provided on both sides of the molding mold 20, the mold is closed to perform resin molding, and then the mold is opened. Thus, when the mold process in which the process of releasing the molded product from the cavity C is performed a plurality of times and the release film F is judged to be unsuitable for use, the unused portion of the release film F is molded after the mold is opened. It has a film supply process of supplying to the mold, and in the mold process, the release film F is moved to a position close to the mold surface 21a, and in the film supply process, the release film F is moved from the mold surface 21a. The holding position of the release film F in the film loader hand 40 is controlled so that it may move to the position to be separated.

Description

Resin molding method, film conveying device, and resin molding device

The present invention relates to a resin molding method, a film conveying device, and a resin molding device.

Japanese Unexamined Patent Application Publication No. Hei 08-142105 (Patent Document 1) describes a technique for molding a resin by filling a resin in a cavity covered with a release film.

Japanese Unexamined Patent Application Publication No. Hei 08-142105

In the release film after resin molding, wrinkles due to stretches and irregularities are formed. For example, when resin molding is performed in the state of wrinkles on the release film, the wrinkles are transferred to the molded article, causing molding failure. For this reason, it is preferable that a wrinkle-free release film (unused portion) is supplied and resin-molded for each resin molding operation. However, since the amount of use of the release film affects the running cost of manufacturing the molded article, there is a problem that the cost becomes expensive when the amount of use increases.

An object of the present invention is to provide a technique capable of reducing the running cost of manufacturing a molded article. In addition, one and other objects and novel features of the present invention will be clarified from the description of the present specification and the accompanying drawings.

The resin molding method according to one solution of the present invention is to cover the mold surface with a roll-shaped release film supplied from a film conveying device provided on both sides of the mold, mold-close the mold to perform resin molding, and then open the mold to form the resin from the cavity. It has a mold process in which the process of releasing the molded product is performed a plurality of times, and a film supply process of supplying an unused portion of the release film to the mold after opening the mold when it is determined that the release film is unsuitable for use, In the molding process, the release film is moved to a position close to the mold surface, and in the film supply process, the release film is moved to a position separated from the mold surface. It is characterized in that the holding position of the release film is controlled. According to this, shift of the release film can be prevented, and the same portion of the release film can be used a plurality of times.

In the resin molding method according to the above solution, it is more preferable to move the release film by means of a guide roller that is enclosed by the release film and is capable of moving forward and backward in a direction orthogonal to the mold surface. In this way, the release film can be moved to a position close to the mold surface or to a position to be separated.

In the resin molding method according to the one solution, in the molding step, resin molding is performed in a state in which the release film is adsorbed to the mold surface, and the adsorption of the release film is released when the molded product is released. It is more preferable. It is possible to smooth the peeling of the release film, reduce the burden on the release film, and prevent breakage.

In the resin molding method related to the above-mentioned one solution, in the film conveying device, a take-up servo motor for rotating a take-up shaft and a take-up servo motor for rotating a take-up shaft are used. The delivery amount of the release film laid over and delivered through the major roll from the unwinding shaft is measured by an encoder provided on the major roll, and the torque of the unwinding shaft is controlled by the unwinding servomotor based on the delivery amount. It is more preferable to fix the take-up shaft and control the torque of the take-up shaft after the molded article in the molding step is released and before mold closing. According to this, it is possible to reliably prevent displacement due to movement of the release film.

In a resin molding method according to another solution of the present invention, in a resin molding method for molding a work by supplying a release film and a resin to a mold, the release film of a single leaf is cut out from a roll film and supplied to the mold, It characterized in that the process of mold-molding with the work and the resin supplied to the mold is repeated. By using a sheet-fed film (release film) a plurality of times, the amount of sheet-fed film used in mold molding is reduced, so that the production running cost of a molded article can be reduced.

In the resin molding method related to the other solution, after supplying a resin to the release film while holding the outer peripheral portion of the release film with a holding tool, supplying the release film and the resin together with the holding tool to a mold, It is characterized in that the release film held by the holding tool is used for molding a plurality of times. According to this, it is possible to use a plurality of times by preventing the occurrence of wrinkles in the sheet-fed film.

In the resin molding method according to the other solution, it is more preferable to apply tension to the release film again each time the release film is used a plurality of times. Accordingly, it is possible to prevent the occurrence of a problem due to the stretched sheet-fed film.

A film conveying device according to one solution of the present invention is a film conveying device including a conveying jig for conveying a single leaf release film held by an outer periphery by a retaining tool, wherein the conveying jig is disposed inside the retaining tool. And a movable holding unit for holding the holding unit and moving the holding unit in a direction opposite to the pressing direction of the pressing unit. According to this, it is possible to prevent the occurrence of wrinkles in the sheet-fed film.

In the film conveying apparatus related to the above-mentioned one solution, a stage in which the retaining tool is set, and a first movable part provided around the stage and configured to move the movable retaining part of the conveying jig are provided. . According to this, it is possible to prevent the occurrence of wrinkles in the sheet-fed film in the conveying state.

In a resin molding apparatus comprising a film conveying device, a film conveying device, and a mold according to the above-described solution, in a state that is provided around the mold, and the mold surface is covered with the release film together with the conveying jig. And a second movable part for moving the movable holding part of the conveying jig. According to this, it is possible to prevent the occurrence of wrinkles in the sheet-fed film in the state of being supplied to the inside of the mold.

Among the inventions disclosed in the present application, the effects obtained by representative ones will be briefly described as follows. The running cost of manufacturing molded products can be reduced.

1 is a schematic configuration diagram of an initial state of a resin molding apparatus (upper cavity/compression molding type) according to Embodiment 1 of the present invention.
Fig. 2 is a schematic configuration diagram of the resin molding apparatus shown in Fig. 1 in a state after molding.
3 is a schematic flow diagram of the operation of the resin molding apparatus shown in FIG. 1.
4 is a schematic flow diagram of a mold process shown in FIG. 3.
5 is an explanatory diagram of film adsorption in a resin molding step following FIG. 1.
6 is an explanatory diagram of mold molding following FIG. 5.
7 is an explanatory diagram of a mold opening following FIG. 6.
Fig. 8 is an explanatory view of the completion of film peeling following Fig. 7.
9 is a schematic explanatory view of a modified example (lower mold cavity/compression molding type) of the resin molding apparatus according to Embodiment 1 of the present invention.
Fig. 10 is a schematic explanatory view of another modified example (upper-shaped cavity transfer molding type) of the resin molding apparatus according to Embodiment 1 of the present invention.
11 is an explanatory diagram of film extraction in a resin molding process according to Embodiment 2 of the present invention.
12 is an explanatory diagram of film cutting following FIG. 11.
Fig. 13 is an explanatory view before film holding by a conveying jig following Fig. 12;
Fig. 14 is an explanatory view after film holding by a conveying jig following Fig. 13;
Fig. 15 is an explanatory diagram of film tension application following Fig. 14;
Fig. 16 is an explanatory diagram of resin supply following Fig. 15;
Fig. 17 is an explanatory view of carrying a film into a molding die following Fig. 16;
18 is an explanatory diagram of a film set following FIG. 17;
Fig. 19 is an explanatory view of a resin set following Fig. 18;
20 is an explanatory diagram of retraction of the conveying jig following FIG. 19.
Fig. 21 is an explanatory diagram of mold closure following Fig. 20;
Fig. 22 is an explanatory diagram of mold molding following Fig. 21;
Fig. 23 is an explanatory diagram of a mold opening following Fig. 22;
Fig. 24 is an explanatory view of the completion of film peeling following Fig. 23;
Fig. 25 is an explanatory view of carrying in a conveyance jig into a molding die following Fig. 24;
Fig. 26 is an explanatory diagram of film holding by a conveying jig following Fig. 25;
Fig. 27 is an explanatory diagram of film take-out by a conveying jig following Fig. 26;
Fig. 28 is an explanatory diagram of carrying in a conveyance jig into the stage following Fig. 27;
Fig. 29 is an explanatory diagram of a conveyance jig set following Fig. 28;
Fig. 30 is an explanatory diagram of reapplying film tension following Fig. 29;
Fig. 31 is an explanatory diagram of resin supply following Fig. 30;

In the following embodiments of the present invention, if necessary, the description is divided into a plurality of sections and the like, but in principle, they are not irrelevant to each other, and one is in a relationship such as some or all of the other modified examples and details. For this reason, in all figures, members having the same function are denoted by the same reference numerals, and repeated explanations thereof are omitted. In addition, the number of constituent elements (including the number, numerical value, amount, range, etc.) is not limited to that specific number, except for cases where it is specifically specified or is clearly limited to a specific number in principle, It may be less than or equal to a specific number. In addition, when referring to the shape of a constituent element or the like, it is assumed that the shape or the like substantially approximates or is similar to the shape, except for the case where it is specifically specified and the case where it is clearly not considered to be in principle.

(Embodiment 1)

A resin molding apparatus 10 according to Embodiment 1 of the present invention will be described with reference to the drawings. 1 and 2 are schematic configuration diagrams (partial cross-sectional views) of the resin molding apparatus 10 in an initial state and a state after molding, respectively. The resin molding apparatus 10 is a compression molding type using a horizontally long roll-shaped release film F (roll film), and resin (R) for a work W (for example, a substrate on which a part is mounted). Resin molding (mold molding) is performed using.

The resin molding apparatus 10 includes a molding mold 20 having an upper mold 21 and a lower mold 22 (one and the other mold) forming a pair. The molding die 20 can be opened and closed by a known press mechanism, and the upper die 21 and the lower die 22 are collapsible. Further, in the molding mold 20, the upper mold 21 has a cavity C (cavity concave portion), the cavity C is opened in the mold open state, and the cavity C is in the mold closed state. It is blocked. Further, the molding die 20 is heated by a known built-in heater, and resin molding is performed by applying heat to the resin R supplied or filled in the cavity C. In addition, in the molding die 20, the release film F is supplied to the mold surface 21a of the upper mold 21, and the work W is supplied to the mold surface 22a of the lower mold 22.

The upper mold 21 includes a cavity piece 23, a clamper 24, and a base 25, and these mold blocks are assembled. A through hole is formed in the clamper 24 in the thickness direction. With the cavity piece 23 inserted in this through hole, the cavity piece 23 is fixed to and supported by the base 25. Thereby, in the upper mold 21, the cavity C is constituted as a region surrounded by the lower surface of the cavity piece 23 and the inner circumferential surface of the clamper 24. Further, the molding die 20 includes an elastic member 26 (for example, a spring) provided between the clamper 24 and the base 25. Through this elastic member 26, the clamper 24 can be assembled to the base 25, and is configured to move forward and backward in the mold opening/closing direction.

Further, the molding die 20 includes a sealing member 27 (for example, an O-ring) provided between the inner circumferential surface of the clamper 24 and the outer circumferential surface of the cavity piece 23. Further, the molding mold 20 includes aeros 28 and 29 provided in the clamper 24 to connect the outside and the inside (including the cavity C) of the molding mold 20. A suction device (for example, a vacuum pump) not shown in the drawing is connected to the outer side of the mold of the aeros 28 and 29. Accordingly, when covering the mold surface 21a of the upper mold 21 with the release film F, the release film F is adsorbed through the aero 28 (inner circumferential side) and the aero 29 (outer circumferential side). can do.

Further, the molding die 20 includes a sealing member 30 (for example, an O-ring) provided on the die surface 22a of the lower die 22. Further, the molding mold 20 includes an aero 31 provided in the lower mold 22 so as to connect the outside and the inside of the molding mold 20. A suction device (for example, a vacuum pump) not shown in the drawing is connected to the outer side of the mold of the aero 31. Thereby, in the mold closed state, the sealing member 30 is crushed between the upper mold 21 and the lower mold 22, and the inside of the sealed mold is sucked in air from the aero 31 to make it a reduced pressure (vacuum) state. have.

Further, the molding die 20 includes an aero 32 provided in the lower die 22 so as to connect the outside of the molding die 20 and the die surface 22a. A suction device (for example, a vacuum pump) not shown in the drawing is connected to the outer side of the mold of the aero 32. Thereby, when the work W is set (supplied) on the mold surface 22a of the lower die 22, the work W can be adsorbed through the air furnace 32.

In addition, the resin molding device 10 is provided so as to be located on both sides of the molding die 20, and a film loader hand 40 (film conveying device) that conveys (supplies) the roll-shaped release film F to the inside of the die. ). The film loader hand 40 is controlled by the control unit 41 included in the resin molding apparatus 10. The control unit 41 includes a CPU, a memory such as ROM and RAM, and executes a control operation by the CPU based on a control program recorded in the memory, and a resin molding apparatus including a film loader hand 40 ( 10) Control the whole.

In this embodiment, the release film F is one which is easily peeled from the molding die 20 after resin molding, and is formed of a film material having heat resistance, flexibility, and extensibility. As the release film (F), for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, and the like are suitably used.

Moreover, the film loader hand 40 is provided with the unwinding part 50 and the winding part 60, and conveys the release film F from the unwinding part 50 to the winding-up part 60. At this time, the release film F is supplied to the molding die 20 disposed between the unwinding portion 50 and the winding portion 60. That is, as shown in Figs. 1 and 2, the unused release film (F) sent out from the unwinding unit 50 is supplied to the mold-opened molding mold 20, and has been used through the molding mold 20. The release film F is wound up by the winding part 60. In addition, in the winding part 60 shown in FIG. 1, the state in which the release film F is not wound up (state before use) is shown. In the winding part 60 shown in FIG. 2, the release film F wound up in a state with wrinkles, such as irregularities formed at the time of molding, is shown.

The unwinding part 50 is an unwinding shaft 51 from which the release film F is unwound, a major roll 52 for measuring the delivery amount (transfer amount) of the release film F, and a guide for guiding the release film F. It is provided with a roller (53). In addition, the winding unit 60 includes a winding shaft 61 on which the release film F is wound, a roll 62 for delivering the release film F, and a guide roller 63 for guiding the release film F. ). In the film loader hand 40, the unwinding shaft 51, the major roll 52, the guide roller 53, the guide roller 63, the roll 62 in the order of conveyance of the release film F from the upstream to the downstream. , The take-up shaft 61 is provided, and the release film F is placed between the take-up shaft 51 and the take-up shaft 61. In the initial state shown in FIG. 1, the unused release film F is attached to the take-up shaft 51, and the tip end of the release film F is attached to the take-up shaft 61.

In addition, the film loader hand 40 is provided on the unwinding shaft 51, and includes an unwinding servomotor 54 that rotates the unwinding shaft 51, and an encoder 55 provided in the major roll 52. . Data is transmitted and received between the unwinding servomotor 54 and the control unit 41. In addition, the encoder 55 is also used to measure the delivery amount (rotation speed) of the release film F delivered from the unwinding shaft 51 via the major roll 52. Data is transmitted from the encoder 55 to the control unit 41. Thereby, in the film loader hand 40, under the control of the control part 41, the conveyance state of the release film F can be controlled. In addition, the encoder 55 may use a servo motor similar to the unwind servo motor 54, and may use an encoder built into it.

Further, the film loader hand 40 is provided with a take-up servomotor 64 that is provided on the take-up shaft 61 and rotates the take-up shaft 61. Data is transmitted/received between the take-up servomotor 64 and the control unit 41. In addition, in the film loader hand 40, the torque of the take-up shaft 61 is controlled by the take-up servo motor 64. Moreover, although the control part 41 controls the conveyance state of the release film F, when tension is applied to the release film F, the take-up shaft 51 is held in a state where the take-up shaft 61 is stopped (fixed). Reverse rotation.

The delivery amount of the release film F can be obtained from the diameter of the major roll 52 and the rotation speed of the major roll 52. And in the film loader hand 40, the torque of the unwinding shaft 51 is controlled by the unwinding servomotor 54 (control part 41) based on the delivery amount measured by the encoder 55. For example, even if the unwinding shaft 51 is rotated by applying the same force (current value), since the torque applied to the release film F is different depending on the diameter of the release film F, the unwinding servomotor ( 54) (control unit 41).

The diameter of the release film F in the unwinding shaft 51 at a predetermined operation point is, for example, the outer diameter of the unused release film F, the total amount of the released release film F, and It can be calculated based on the thickness of the release film F. Specifically, it can be determined by subtracting the thickness of the release film F that has already been delivered from the outer diameter of the unused release film F in the initial state. Here, the thickness of the release film F that has already been delivered can be obtained from the total amount (distance) of the released release film F and the thickness of the release film F. In addition, it is not always necessary to directly calculate or the like for the calculation of each value exemplified in the present embodiment. For this reason, for example, it is sufficient to incorporate it as a calculation formula in a process in control, or to use the idea substantially in an individual control process.

In addition, as a method of calculating the diameter of the unwinding shaft 51 including the release film F, the unwinding shaft 51 including the release film F when a predetermined amount of the release film F is delivered It is also possible to calculate by the ratio of the rotation amount and the rotation amount of the major roll 52. In this case, the outer diameter of the unwinding shaft 51 including the release film F is calculated as a product of the reciprocal of the ratio of the rotation amount and the outer diameter (fixed value) of the major roll 52. The torque is controlled by referring to the size of the outer diameter of the unwinding shaft 51 (including the release film F) obtained by any method including the method exemplified in these.

In addition, the film loader hand 40 includes guide rollers 53 and 63 for guiding the release film F, and advancing and retreating mechanisms 56 and 66 in which the operation is controlled by the control unit 41 while they are attached. For example, a cylinder) is provided. The guide roller 53 is provided in the vicinity of the upper mold 21 on the upstream side (unwinding side) of the film conveyance, and the release film F is hung. The other side, the guide roller 63 is provided in the vicinity of the upper die 21 on the downstream side (winding-up side) of film conveyance, and the release film F hangs around. The guide rollers 53 and 63 are configured to be able to move forward and backward in a direction perpendicular to the mold surface 21a of the upper mold 21 (the vertical direction in the drawing) by the advancing and retreating mechanisms 56 and 66.

Thereby, the advancing and retreating mechanisms 56 and 66 can move the guide rollers 53 and 63 to a position separated from the mold surface 21a by lowering the guide rollers 53 and 63 in the film supply process. The other, the advancing and retreating mechanisms 56 and 66 can raise the guide rollers 53 and 63 in the molding process and move the release film F to a position close to the mold surface 21a. That is, the vertical position control of the release film F guided by the guide rollers 53 and 63 is performed by interlocking the advance and retreat mechanisms 56 and 66 to operate. In this way, the resin molding apparatus 10 controls the holding position of the release film F in the film loader hand 40.

Next, a resin molding method (operation method) using the resin molding apparatus 10 according to the present embodiment will be described with reference to the drawings. 3 is a schematic flow diagram of the resin molding apparatus 10, and FIG. 4 is a schematic flow diagram of a molding process. 5 to 8 are explanatory diagrams of a resin molding process.

In the resin molding apparatus 10, as a molding treatment, a mold process of mold-molding a part of the work W is performed (step S100). Prior to this, as shown in Fig. 1, the guide rollers 53 and 63 are lowered, and the release film F guided thereto is moved to a position separated from the mold surface 21a. Then, the unused portion of the release film F spread between the take-up shaft 51 and the take-up shaft 61 is mold-opened using the take-up servo motor 54 and the take-up servo motor 64. It is conveyed and supplied into the inside of the mold 20.

In the molding process, as shown in FIG. 1, in a state in which the molding die 20 is opened, the work W is set on the die surface 22a of the lower die 22 (step S110). The work W is adsorbed and held on the mold surface 22a by suction from the aero 32. If a resin (R) (e.g., liquid resin, granular resin, etc.) is set on the work (W) in advance, the resin (R) together with the work (W) is also set (supplied) inside the molding mold (20). )do.

Subsequently, as shown in FIG. 5, the release film F is adsorbed on the mold surface 21a of the upper mold 21 (step S120). Here, the guide rollers 53 and 63 are raised, and the release film F is moved to a position close to the mold surface 21a. At this time, the release film F is adsorbed and held along the mold surface 21a including the inner surface of the cavity C by suction from the air furnaces 28 and 29. That is, the mold surface 21a including the inner surface of the cavity C is covered with the release film F.

Subsequently, the molding die 20 is closed (step S130). Here, the upper mold 21 and the lower mold 22 are brought close together, and the seal member 30 on the mold surface 22a of the lower mold 22 abuts the mold surface 21a of the upper mold 21 (seal touch )do. Prior to this, by suctioning from the aero 31, the inside of the molding die 20 is sealed and pressure reduction is started. Further, by bringing the upper mold 21 and the lower mold 22 closer together, the work W is clamped from the upper mold 21 and the lower mold 22. Thereby, the opening of the cavity C is closed by the work W, and the parts of the work W and the resin R are accommodated in the cavity C.

Subsequently, as shown in Fig. 6, mold molding is performed (step S140). Here, the upper mold 21 and the lower mold 22 are brought closer together, the elastic member 26 is pushed and contracted, and the release film F is adsorbed to the mold surface 21a, and the resin in the cavity C ( After filling and compressing R), the resin (R) is cured by heating for a predetermined time. Thereby, the part of the work W is molded with the resin R (resin molded part).

Subsequently, as shown in FIG. 7, when the work W (molded product) is released, adsorption of the release film F is released (step S150), and mold opening is performed (step S160). Here, suction from the aeros 28 and 29 is stopped to release the adsorption of the release film F, and the upper mold 21 and the lower mold 22 are separated. By controlling such an adsorption state, it is possible to smooth the peeling of the release film F, reduce the burden on the release film F, and prevent breakage. Further, by keeping the guide rollers 53 and 63 raised, the release film F can be brought close to the mold surface 21a.

Subsequently, as shown in FIG. 8, by further moving the upper mold 21 and the lower mold 22 apart, peeling of the release film F from the work W is completed. During resin molding, by covering the mold surface 21a including the inner surface of the cavity C with a release film F, the contact of the resin R to the mold surface 21a is prevented to be released from the cavity C. Can promote. Further, since the guide rollers 53 and 63 are kept raised, the release film F peeled from the work W can be brought close to the mold surface 21a. After that, the suction from the aero 32 is stopped to release the adsorption of the work W, and the work W is carried out to the outside of the mold by a work conveying device (unloader) not shown in the drawing.

In this way, after the molding process (step S100) is finished, it is determined by the control unit 41 whether or not the release film F can be reused (step S200). The criterion for determining the reuse of the release film F can be arbitrarily set. For example, it can be determined whether or not the reuse of the release film F has reached a predetermined number of times. Specifically, if the release film F is only used in one molding step, it is judged that it can be reused, and a second molding step is performed. In addition, as a method of judging the reuse of the release film F, the surface condition of the release film F is imaged, image processing is performed, and then the shape of the irregularities (the amount or depth of wrinkles) is calculated, or a displacement meter (for example, For example, it may be measured with a laser displacement meter), and the suitability of reuse may be determined based on the value. In addition, when the increase of the release film F increases according to the number of times of use of the mold process, it may be determined whether or not the reuse is appropriate according to the increased amount of the release film F. In this case, it is also possible to determine the appropriateness of reuse according to the amount of tension added to correct the stretch of the release film F, the amount of winding, and the like.

In the case where the release film F can be reused, the above-described operation of covering the mold surface 21a with the release film F as it is, mold-closing the mold to perform resin molding, and then release the molded article by opening the mold is repeated. . In this case, the release film F after the release is in a state in which wrinkles generated by being adsorbed by irregularities such as the cavity C remain. Therefore, in this embodiment, during repeated use of the release film F, the guide rollers 53 and 63 are raised so that the release film F contacts the mold surface 21a. Thereby, since the mold surface 21a and the release film F are in contact, it can be made relatively difficult to shift them.

In this case, for example, when the mold surface 21a and the release film F are misaligned in a plurality of mold moldings, the release film F having irregularities corresponding to the shape of the cavity C is formed on the mold surface. In (21a), it is arrange|positioned at the position displaced from the cavity C, and there exists a possibility of causing a problem. Specifically, by clamping the uneven release film F, the clamping cannot be properly performed, and there is a fear that the resin R may leak. Further, it is also conceivable that the unevenness of the release film F is transferred in the molded portion molded from the resin R, resulting in a molding failure.

7 shows a state in which the release film F is in contact with the end of the mold surface 21a with the guide rollers 53 and 63 raised even when the mold is opened. For example, if the guide rollers 53 and 63 are lowered to separate the entire release film F from the mold surface 21a, a shift occurs when the release film F is reused in the next molding step. For this reason, while the release film F is used a plurality of times, by maintaining the state in which the guide rollers 53 and 63 are raised, it is possible to prevent the release film F from shifting.

In addition, during the use of the release film F a plurality of times, after the work W (molded product) is released and before the release film F is adsorbed, the take-up shaft 61 by the take-up servomotor 64 Is fixed (stopped). Moreover, the unwinding shaft 51 is controlled by a predetermined torque by the unwinding servomotor 54, and a predetermined tension is applied to the release film F. Here, in application of a predetermined tension, torque control can be accurately performed by performing torque control using the outer diameter of the unwinding shaft 51 including the release film F.

For example, when trying to control the torque using the outer diameter of the used release film F in the take-up shaft 61, the used release film F has wrinkles formed during molding. It is wound up with. For this reason, it is difficult to accurately calculate the external shape of the take-up shaft 61 on which the used release film F is wound, and it is difficult to appropriately transmit the force applied to the take-up shaft 61. . On the other hand, the size of the diameter of the unused release film F in the unwinding shaft 51 can be accurately grasped by the delivery amount and the thickness of the release film F, and the force applied to the unwinding shaft 51 is applied to the release film. (F) can be transferred appropriately. For this reason, torque control can be accurately performed, and a predetermined tension can be appropriately applied to the release film F. Therefore, for example, by excessive or excessive tension, the position is not shifted, and shift due to movement of the release film F can be reliably prevented. In addition, when the positional shift of the release film F is difficult to become a problem, when tension is applied to the release film F, the torque of the take-up shaft 61 may be controlled by the take-up servomotor 64. Further, torque may be controlled in both the take-up shaft 51 and the take-up shaft 61.

On the other hand, in the judgment in step S200, if the molding process is repeated and the release film F has been used a predetermined number of times, it is judged that it is unsuitable for reuse. In this case, after the mold is opened by the film supply process (steps S300, S400, S500), after the release film F of the unused portion is supplied, the mold process is restarted.

In order to supply the release film F of the unused part, first, the release film F is moved to the delivery position (step S300). Specifically, in the mold-open state, the guide rollers 53 and 63 are lowered by the advancing and retreating mechanisms 56 and 66, and the release film F guided thereto is separated from the mold surface 21a. Move to the delivery position.

Subsequently, the release film F is sent out (step S400), and the release film F is moved to the adsorption position (step S500). Specifically, the take-up shaft 61 is rotated by the take-up servo motor 64 to take up the release film F on the take-up shaft 61, and the take-up shaft 51 by the take-up servo motor 54 Is rotated to send out the release film (F). At this time, since the delivery amount is measured by the encoder 55, the release film F of the unused portion can be moved to the suction position facing the cavity C. After the release film F of the unused part is supplied, the molding process is restarted.

In this way, by using the release film F a plurality of times, the amount of use of the release film F in the molding process is reduced, so that the production running cost of the work W (molded product) can be reduced. In addition, while the release film F is being used a plurality of times, the release film F is held at a position in contact with the mold surface 21a without lowering the guide rollers 53 and 63. ) Can prevent misalignment. However, if the guide rollers 53 and 63 are not lowered and the mold-opening is attempted to release the molded article while adsorbing the release film F, a burden is placed on the release film F. Therefore, by releasing adsorption of the release film F at the time of releasing, it is possible to smooth the peeling of the release film F, reduce the burden, and prevent the release film F from being damaged. In addition, after the molded product is released and before the release film F is adsorbed, the take-up shaft 61 is fixed and the take-up shaft 51 is controlled with a predetermined torque to reliably prevent displacement of the release film F. can do.

In addition, the effect of using the release film F in the present invention a plurality of times increases as the thickness of the mold increases, the greater the effect. In this embodiment, a case where a so-called substrate is applied as the workpiece W has been described, but a large wafer with a contrast of 8 inches or 12 inches larger than that of a general substrate, or a wafer level package (WLP) using a circular workpiece such as a carrier. B. By applying LPM (Large Panel Molding) or the like using a large panel with a length of more than 300 mm per side as a work, the effect of reducing the amount of release film F is large, and the effect of reducing the manufacturing running cost is increased.

As described above, in the present embodiment, as shown in Fig. 1 and the like, the case of the resin molding apparatus 10 in which the cavity C is provided in the upper mold 21 has been described. Without being limited thereto, as shown in Fig. 9, a resin molding apparatus in the case of providing a cavity C in the lower mold 22 with the configuration inverted up and down, and supplying (adsorbing and holding) the release film F thereto ( 10A) can also be applied. Compared to the resin molding apparatus 10 described above, in the resin molding apparatus 10A shown in the figure, the workpiece W is adsorbed and held by the upper mold 21 in the mold-open state, and the cavity of the lower mold 22 ( Resin (R) is supplied into C) and resin-molded. In the resin molding apparatus 10A, since other molding treatment steps (Fig. 3, Fig. 4, etc.) are performed in the same manner, the resin molding apparatus 10 has an effect similar to that of the resin molding apparatus 10.

In addition, in the above-described embodiment, as shown in Fig. 1 and the like, the case of the compression molding type resin molding apparatus 10 has been described. The present invention is not limited thereto, and the present invention is also applied to a transfer molding type resin molding apparatus 10B having a port 70, a plunger 71, a curl 72, and a runner gate 73 as shown in FIG. can do. In the resin molding apparatus 10B, the resin R is supplied into the port 70 in the mold-open state, and the work W is adsorbed and held by the mold surface 22a (set portion) of the lower mold 22. . In addition, in the resin molding apparatus 10B, the release film F is formed so as to cover the mold surface 21a of the upper mold 21 including the cavity C, the curl 72 and the runner gate 73 in the mold-open state. ) Is supplied, adsorbed and held. Then, in the resin molding apparatus 10B, the resin R is pressed by the plunger 71 in the port 70 in the mold closed state, and the cavity C is formed through the curl 72 and the runner gate 73. It is supplied to the resin and molded. In the resin molding apparatus 10B, other molding treatment steps (Fig. 3, Fig. 4, etc.) are performed in the same manner, so that the same effect as that of the resin molding apparatus 10 is obtained.

(Embodiment 2)

A resin molding method (operation method) using the resin molding device 10C provided with the film conveying device 80 according to the second embodiment of the present invention will be described with reference to the drawings. 11 to 31 are explanatory diagrams of a resin molding process. In the first embodiment, a case where a roll film was directly used as the release film F was described, but in this embodiment, a roll film wrapped around a horizontally long film was cut into, for example, a circular shape, a rectangular shape, etc. A case where a sheet-fed film is used for resin molding a plurality of times will be described.

As shown in FIG. 11, the film conveyance device 80 includes a stage 81, a pair of rings 82 (holding tool), a roll-shaped release film F, and a take-out device (not shown). It is equipped with. Here, one ring 82 is set on the stage 81, and the release film F is pulled out by the take-out device so that it may pass above it. The pulled-out release film F is pressed by the other ring 82, and is sandwiched between one and the other ring 82 (Fig. 12). As this ring 82, for example, by overlapping on the outer periphery of the sheet-fed release film F prepared by cutting, it surrounds the outer periphery area of the sheet-fed release film F so that the release film F can be sandwiched and held. Is composed of a ring shape such as a circular ring shape or a rectangular ring shape.

Specifically, as shown in FIG. 13 which is a diagram viewed from the front direction orthogonal to the lateral direction from which the release film F shown in FIG. 12 was pulled out, the side parallel to the pulling direction of the release film F (release film F ), it is preferable that the upper and lower rings 82 are connected to each other so as to be fixable. In other words, it is preferable that the ring 82 is configured to be larger than the width of the release film F, so that the rings 82 can be connected to each other at a position where the release film F is not sandwiched. For this reason, the size of the ring 82 with respect to the release film F is smaller than that of the sheet-fed release film F in the drawing direction of the release film F, and in the direction orthogonal to this direction, the sheet-fed release It can be made larger than the film (F). According to this configuration, the ring 82 can be cut while holding the release film F therebetween.

Subsequently, as shown in FIG. 12, the release film F is cut from the outside of the ring 82 by the cutting tool 83 provided in the film conveying device 80. When cutting the release film F, the ring 82 can also be adsorbed on the stage 81 and held. The cut release film F becomes a sheet|leaf (sheet-fed film). The ring 82 holds the outer periphery of the release film F so that tension is applied to the release film F. In addition, the retaining tool for holding the outer peripheral portion of the release film F is not limited to the use of the ring 82. For example, it is also possible to use a plurality of clips that partially sandwich the outer periphery of the release film F and hold it. As an example, in the case of using the rectangular release film F, it is possible to provide each of four sides, one by one or a plurality of clip-shaped retaining devices, each of which is inserted from the top and bottom of each of the four sides.

Subsequently, as shown in FIG. 13, in order to hold the release film F through the ring 82, the transfer jig 84 provided in the film transfer device 80 is moved to the upper side of the stage 81. Let it. Subsequently, as shown in FIG. 14, the ring 82 (release film F) is held by the lowered conveyance jig 84 (FIG. 14). The conveyance jig 84 has a pressing portion 85 for pressing the release film F on the inner side of the ring 82 and is configured in a frame shape with a central portion penetrating therethrough. In addition, the conveyance jig 84 holds the ring 82 and moves the ring 82 in the opposite direction (upward direction) to the pressing direction of the pressing portion 85 (in the middle, downward direction). It has a part 86. For example, the movable holding part 86 is comprised so that the claw part 86a (chuck part) which clamps and holds the ring 82 is moved by a latch mechanism. This latch mechanism is a mechanism that can be held at an arbitrary height by being configured to be rotatable only in one direction within a range of a certain angle.

Subsequently, as shown in FIG. 15, tension is applied to the release film F held by the ring 82. For example, the movable holding part 86 is movable by the cylinder 90 (first movable part) provided in the film conveying device 80. This cylinder 90 is provided around the stage 81 so as to be able to move up and down. When the claw portion 86a holding the ring 82 is pushed up by the cylinder 90, the outer peripheral portion of the release film F held by the ring 82 is pushed upward. At this time, while the central portion of the release film F is pressed by the pressing portion 85 of the conveying jig 84, the outer peripheral portion of the release film F is pulled, so that tension is applied to the release film F. . In addition, according to the latch mechanism provided in the movable holding portion 86, even if the release film F is pressed by the pressing portion 85, the movement of the claw portion 86a is limited to only the upward direction (one direction), Tension can be given to the release film F.

Subsequently, as shown in FIG. 16, the resin R (for example, liquid resin, granular resin, etc.) is supplied on the release film F to which tension was applied. Since the central part of the conveyance jig 84 penetrates, the resin R can be supplied on the release film F from here. At this time, since tension is applied to the release film F, it is possible to prevent the release film F from being bent under the weight of the resin R and causing the resin R to be biased toward the center of the release film F.

Subsequently, as shown in FIG. 17, the release film F is carried into the inside of the molding die 20 provided with the resin molding apparatus 10C. Specifically, in the inside of the mold-opened molding mold 20 (the upper mold 21 and the lower mold 22 are separated), a ring with a tension applied to the release film F by the conveying jig 84 The release film (F) is carried in together with (82). In the molding mold 20 of the resin molding apparatus 10C, a cavity C is provided in the lower mold 22 as in FIG. 9. As described later, the mold surface 22a of the lower mold 22 including the inner surface of the cavity C is covered with the release film F. Further, the work W is adsorbed and held by the mold surface 21a of the upper mold 21 via the aero 32.

By the way, as shown in FIG. 18, the resin molding apparatus 10C is provided around the molding die 20, and the cylinder 91 (2nd) which moves the movable holding part 86 of the conveyance jig 84 Movable part). The cylinder 91 is provided around the lower mold 22 of the molding die 20 so as to be able to move up and down, and similarly to the cylinder 90, the claw portion 86a holding the ring 82 can be pushed up. With such a resin molding apparatus 10C, the release film F is set on the mold surface 22a (the upper surface of the clamper 24) of the lower mold 22. Specifically, the movable holding part 86 of the conveyance jig 84 is movable by the cylinder 91, and tension is added to the release film F. In this case, if an appropriate tension is not applied, the release film F is heated by the heater of the lower mold 22 to cause stretch and stretch, and the resin R will be biased. On the other hand, by appropriately adding tension to the release film F by the operation of the cylinder 91, it is possible to prevent such a problem from occurring. Subsequently, the release film F is pressed against the mold surface 22a by the pressing portion 85 of the transfer jig 84.

Subsequently, as shown in FIG. 19 (the upper mold 21 is not shown), the release film F is provided so as to cover the mold surface 22a including the inner surface of the cavity C through the air furnaces 28 and 29. Adsorbs. At this time, the release film F is adsorbed along the mold surface 22a, and the release film F is set along the inner surface of the cavity C in the mold surface 22a. Further, since the resin R is set on the release film F, the resin R is set in the cavity C as it is.

On the other hand, the lower mold 22 of the resin molding apparatus 10C is provided on the mold surface 22a (the upper surface of the clamper 24) of the lower mold 22, and is a pocket 92 for installing the ring 82 as a retaining tool. ) (Recess). As a structure for attaching the ring 82 as the holding tool, it is not necessary to necessarily provide on the lower mold 22, and a dedicated member may be provided on the outer periphery of the molding mold 20.

In addition, the lower mold 22 is provided with a mechanism for locking the ring 82. For example, a mechanism for locking the ring 82 is provided as an aero 93 provided in the clamper 24 so as to connect the outside and the inside of the molding die 20. A suction device (for example, a vacuum pump) not shown in the drawing is connected to the outer side of the mold of the aero 93. For this reason, when the release film F is adsorbed, the ring 82 holding the outer circumference of the release film F is accommodated in the pocket 92 and is sucked through the aero 93 so that it is adsorbed (held). . At this time, by releasing the holding of the movable holding portion 86 of the conveying jig 84, the ring 82 is released. In this way, by carrying the ring 82 holding the release film F into the mold 20 so as to remain in the mold 20, the release film F can be set at an accurate position. As will be described later, after resin molding, tension is reapplied at the stage 81 to set the release film F on the molding mold 20 again. However, since the positions can be combined in this way, shifting is prevented to prevent the release film F. ) Can be used multiple times for resin molding.

In addition, as a mechanism for holding the ring 82 as a holding tool to the molding die 20, not only the above-described adsorption mechanism but also other mechanisms may be employed. For example, it is also possible to use an engaging structure such as a swinging claw-shaped member, or other locking mechanisms having a keyway engaging structure.

Subsequently, as shown in FIG. 20, the conveyance jig 84 is retracted. At this time, since the ring 82 is released from the movable holding portion 86 of the conveying jig 84, the release film F is adsorbed to and held by the mold surface 22a of the lower mold 22.

Subsequently, as shown in FIG. 21, the upper mold 21 and the lower mold 22 are brought close together, and the molding mold 20 is mold-closed. On the other hand, the upper mold 21 of the resin molding apparatus 10C includes a retracting portion 94 (recessed portion) provided on the mold surface 21a. When the mold is closed, the ring 82 is accommodated by the retracting portion 94 in the upper mold 21.

Subsequently, as shown in FIG. 22, mold molding is performed. Here, the upper mold 21 and the lower mold 22 are brought closer together, the elastic member 26 is pushed and contracted, and the resin (R) in the cavity (C) is compressed, and then the resin (R) is cured by heating for a predetermined time. Let it. Thereby, the work W is molded with the resin R.

Subsequently, as shown in FIG. 23, the molding die 20 is mold-opened by moving the upper mold 21 and the lower mold 22 away from the cavity C to release the work W (molded product). At this time, while holding the adsorption of the ring 82, the adsorption of the release film F is released. In this case, even without providing the film loader hand 40 (specifically, the unwinding shaft 51 or the winding shaft 61) as shown in FIG. 1, the release film F can be smoothly removed from the molded article. I can. Specifically, since the lower mold 22 on the side opposite to the upper mold 21 on which the work W is held is held from the outer periphery of the release film F, the lower mold 22 is similar to the film loader hand 40. The release film F can be pulled out from the outer periphery of, and as shown in FIG. 7, the release film F can be removed from the molded article. As described above, it is possible to prevent the release film F from being released in a state in which it is attached to the molded article while having a simple configuration, and smooth peeling of the release film F can be achieved.

Subsequently, as shown in FIG. 24, by further moving the upper mold 21 and the lower mold 22 apart, peeling of the release film F from the work W is completed. By covering the mold surface 22a including the inner surface of the cavity C with the release film F, the contact of the resin R to the mold surface 22a can be prevented, thereby promoting release from the cavity C. have. However, the release film F peeled off from the work W is stretched and becomes a wrinkled state.

Subsequently, as shown in FIG. 25, the conveyance jig 84 is carried into the inside of the mold-opening mold 20. Subsequently, as shown in FIG. 26 (the upper mold 21 is not shown), the ring 82 (release film F) is held by the lowered conveyance jig 84. Subsequently, as shown in FIG. 27 (upper mold 21 is not shown), the release film F used together with the ring 82 is taken out from the mold-opening mold 20 by the conveying jig 84. do. In the present embodiment, by leaving the ring 82 holding the release film F in the mold 20 during resin molding, the ring 82 is held by the conveying jig 84 after resin molding. Can be taken out. For example, in the case of a configuration in which the ring 82 holding the release film F is not used, it is difficult to hold it again at the position originally held in the heated and deformed release film F. . However, since the release film F is held by the ring 82, the same position can be reliably held and conveyed regardless of the deformation of the release film F.

Subsequently, the conveyance jig 84 carried out from the molding die 20 is carried in the upper side of the stage 81 as shown in FIG. 28. Subsequently, as shown in FIG. 29, the conveyance jig 84 is lowered to the stage 81 side, and the release film F used together with the ring 82 is set on the stage 81.

Subsequently, as shown in Fig. 30, tension is again applied to the used release film F. Specifically, the release film F is pulled more strongly than the tension is applied to the release film F described with reference to FIG. 15. That is, the claw portion 86a holding the ring 82 is pushed up to a higher position by the cylinder 90, and the outer peripheral portion of the release film F held by the ring 82 is pushed up to a higher position. Thereby, the release film F is stretched more strongly with respect to the release film F that has been stretched by heating and pressing in the molding die 20 having irregularities, so that the same tension as in the state shown in Fig. 15 is released, for example. It can be given to (F).

Subsequently, as shown in FIG. 31, the resin R (for example, a liquid resin, a granular resin, etc.) is supplied on the release film F to which tension was applied again. At this time, even if the release film (F) has already been used for molding one or more times, since the tension is appropriately applied, sagging when the resin (R) is supplied is prevented, and the resin (R) is applied to the release film (F). You can prevent it from shifting to the center. After that, using the used release film F, the steps described with reference to Figs. 17 to 31 are sequentially repeated until a predetermined number of times is reached. In this process, in the process of the film set shown in Figs. 17 to 18, since the release film F held by the ring 82 (holding tool) is used, the deviation of the release film F is prevented. It can be prevented and molded multiple times into the same part of the release film F. According to this, it is possible to prevent the occurrence of molding problems as described above.

Subsequently, after repeating the above-described process sequentially until a predetermined number of times, the used release film (F) is discarded, and the process including the step of preparing the release film (F) shown after FIG. 11 is performed. By repeating, the release film F can be used for molding a plurality of times. As described above, the present embodiment using the single-leaf release film F can also be used for molding a plurality of times, and the running cost of manufacturing the work W (molded product) can be reduced.

As mentioned above, although this invention was demonstrated concretely based on embodiment, this invention is not limited to the said embodiment, It goes without saying that various changes are possible within the scope not departing from the gist of the invention.

In the above embodiment, a case where the release film is used a plurality of times has been described. It is not limited to this, and can also be applied to the case where a release film of an unused portion without wrinkles is supplied for each resin molding operation.

In addition, a resin molding apparatus capable of molding a plurality of times may be provided using a single-leaf release film F without using the same holding tool as the pair of rings 82. In this case, for example, a resin molding apparatus for supplying the release film F and the resin R to the molding mold 20 to mold the workpiece W is A film preparation unit for preparing a release film F, a film supply unit for supplying the prepared single leaf release film F to the molding mold 20, and a single leaf release film supplied together with the molding mold 20 Using (F), it can also be set as the structure provided with the press part which molds a plurality of times.

In this case, as an apparatus (film preparation unit) for preparing the single-leaf release film F, as shown in FIG. 12, the horizontally long release film F is taken out from the rolled film wrapped around it, and the cutting tool 83 It can be configured to cut by ). In addition, the sheet-fed release film F does not necessarily need to be cut and prepared in a case where it is not necessary to cut, such as a case where a plurality of sheet-leaf release films F of the shape are stacked and supplied.

In addition, as a film supply unit for supplying the sheet-fed release film F prepared in this way to the molding die 20, the outer periphery of the sheet-fed release film F is held by a conveying jig 84 as shown in FIG. 13. . As a configuration for holding the outer periphery of the release film F, the outer periphery of the release film F may be pinched from the outside, or may be configured to adsorb the upper surface of the release film F. The transfer jig 84 having such a structure can be held by an in-loader to have a structure capable of being transferred. In this case, the sheet-fed release film F prepared by the film preparation part is conveyed to the press part provided with the molding die 20 to the film supply part comprised with the conveyance jig 84 or an in-loader, and is supplied.

A resin R may be mounted on the sheet-fed release film F, and the sheet-fed release film F may be carried into the molding die 20 of the press unit. Moreover, you may carry in only the single-leaf release film F into the molding die 20 of a press part without mounting the resin R. In this case, it is necessary to carry the resin R into the molding die 20 every time a plurality of mold moldings are performed using the single sheet release film F.

On the other hand, in the press part, for example, by providing a molding mold 20 as shown in FIG. 17 and opening and closing a pair of platens on which the upper mold 21 and the lower mold 22 are provided, mold molding is Done. In this case, depending on which one of the methods of carrying in the resin (R) as described above is applied, a single sheet-fed release film (F) is set in either the upper mold 21 and the lower mold 22 Afterwards, the resin R may be sequentially supplied, or the resin R may be mounted on the single leaf release film F from the outside of the press unit, and carried in every mold molding. Thereafter, the resin R and the work W are supplied and mold-closing is performed by closing the mold 20.

According to this configuration, it is possible to perform mold molding a plurality of times using the single-leaf release film F without using the same holding tool as the pair of rings 82. Thereby, for example, in the above-described embodiment, the effect of using the holding tool cannot be obtained, but the management of the holding tool becomes unnecessary, and the configuration can be simplified. In addition, when the wrinkles of the release film F do not have a molding problem, efficient molding is possible with a simple configuration.

Claims (11)

A mold process in which the mold surface is covered with a roll-shaped release film supplied from the film conveying device provided on both sides of the mold, mold is closed to perform resin molding, and then mold is opened to release the molded product from the cavity a plurality of times;
When it is determined that the release film is unsuitable for use, it has a film supply process of supplying an unused portion of the release film to the mold after opening the mold,
In the molding process, in the film conveying device, the release film is moved to a position close to the mold surface, and in the film supplying process, the release film is moved to a position separated from the mold surface. Controlling the holding position of the release film,
The resin molding method, characterized in that the release film is hung around the release film, and the release film is moved by a guide roller capable of moving forward and backward in a direction orthogonal to the mold surface. The method of claim 1,
In the molding step, resin molding is performed while the release film is adsorbed on the mold surface, and adsorption of the release film is released when the molded product is released. The method according to claim 1 or 2,
In the film conveying apparatus, a take-up servo motor that rotates a take-up shaft and a take-up servo motor that rotates a take-up shaft are used, and the release film is placed between the take-up shaft and the take-up shaft,
The delivery amount of the release film delivered from the unwinding shaft through the major roll is measured by an encoder provided on the major roll, and the torque of the unwinding shaft is controlled by the unwinding servomotor based on the delivery amount,
A resin molding method characterized by controlling the torque of the take-up shaft by fixing the take-up shaft after releasing the molded article in the molding step and before closing the mold. delete delete delete delete delete delete delete delete

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