JP2014151596A - Method and apparatus for sticking and molding film-like object of resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for sticking and molding a film-like object of a resin molding which molds a resin molding, and can stick each portion with a uniform pressure when a film-like object is stuck to the resin molding.SOLUTION: In a method for sticking and molding a film-like object of a resin molding P which molds the resin molding P, and sticks a film-like object F to at least one surface of the resin molding P, the resin molding P is molded in a cavity 26 of dies 22 and 23, then the film-like object F is oppositely arranged on the resin molding P left in the cavity 26 after opening, and the film-like object F is pressed and stuck to the resin molding P by using a difference in air pressure between an upper part c1 and a lower part c2 of the film-like object F.

Description

The present invention relates to a resin-molded article film-form sticking method, a resin-molded article film-form sticking method, and a film-like article sticking-molding apparatus that mold a resin-molded article and attach a film-like article to at least one surface thereof. Is.

Conventionally, as a method for molding a resin molded product and sticking a film-like material on at least one surface thereof, those described in Patent Literature 1 and Patent Literature 2 are known. In Patent Document 1, a sheet made of a fiber-reinforced thermoplastic resin composition and a resin film are heated with a heater and then set in a mold equipped with a vacuuming mechanism, and are deformed (molded) by vacuum suction, and the resin film is It is the method of making it stick. In the embodiment of the method for adhering the thermoplastic resin sheet and the release sheet shown in FIG. 6 of Patent Document 2, a pressurizing mechanism using hydraulic pressure in each of the preheating pressurizing unit, the molding heating pressurizing unit, and the cooling pressurizing unit. The thermoplastic resin sheet and the release sheet are pressed by using and the lamination molding is performed. In the embodiment of the method for adhering the thermoplastic resin sheet and the release sheet shown in FIG. 7 of Patent Document 2, the thermoplastic resin sheet and the release sheet are pressed between the heat and pressure rollers to perform lamination molding. ing.

JP 2010-58371 A (Claim 1, FIG. 1, FIG. 2) JP 2012-246442 A (0040 to 0043, FIG. 6, FIG. 7)

However, Patent Document 1 can cope with the case where the thickness of the resin molded product is not more than a certain value and can be easily deformed. However, if the resin molded product side is not easily deformed into an arbitrary shape, the resin film cannot be successfully applied. There was a problem. In addition, since the vacuum suction hole formed in the mold directly contacts the resin film or the resin molded product, the trace formed by the vacuum suction hole remains on the resin molded product or is sucked by the vacuum suction hole. There is a problem that a difference occurs in the suction force exerted between the portion and the portion far from the portion to be sucked.

Further, the embodiment of FIG. 6 of Patent Document 2 has a problem that the surface pressure during pressurization is not constant because the mold surface is pressed against the release sheet by hydraulic pressure. In other words, even if the pressing device pressurizes between flat molds, the board surface to which the molds are attached is often warped by the applied pressure, and the surface pressure at the central portion is often weakened. Also in the embodiment of FIG. 7 of Patent Document 2, since the pressurization between the rollers is continuously performed, the pressurization time must be shortened. As a result, it may be difficult to transfer heat sufficiently to the thermoplastic sheet and the release sheet for bonding. Further, in FIG. 7 of the patent document, there is a problem that pressing by a roller cannot cope with unevenness having a certain size or more on the surface of the molded product. Further, in the example of FIG. 6 and the example of FIG. 7, voids were easily generated between the thermoplastic resin sheet and the release sheet because no pressurization was performed under vacuum.

Further, in Patent Document 1 and Patent Document 2, since the molding of the resin plate and the resin sheet including the impregnation of the fiber material is performed in a different place, a molding apparatus for the resin sheet or the like and a bonding apparatus are separately required. Met.

Therefore, the present invention can achieve at least one of the following problems. As a first problem, when a resin molded product is molded and a film-like product is affixed to the resin molded product, each part is applied with equal pressure when the film-like product is affixed to the resin molded product. It aims at providing the film-form sticking molding method and film-like sticking molding apparatus of the resin molded product which can be affixed. In addition, as a second problem, the resin molded product and the film-like product are sufficiently vacuum-sucked, and when the film-like product is pasted and molded, the occurrence of voids can be prevented. It is an object of the present invention to provide a molding method and a film-like material sticking / molding device. Further, as a third problem, the molding of the resin molded product and the application of the film-like product to the resin molded product are performed by the same molding apparatus, so that the cost is increased by installing the apparatuses separately, the installation place is increased, the number of maintenance times is increased. It is an object of the present invention to provide a film-like material sticking / molding method and a film-like material sticking / molding device for a resin molded product capable of solving at least one of an increase and an increase in energy consumption.

The film-like product affixing method for a resin molded product according to claim 1 of the present invention is a method for affixing a film-like product for a resin-molded product in which a resin-molded product is molded and a film-like product is attached to at least one surface thereof. After molding the resin molded product in the cavity of the mold, place the film-like material opposite to the resin molded product left in the cavity after opening, and use the pressure difference between the upper and lower sides of the film-like product Then, the film-like product is pressed against a resin molded product and pasted.

The method for sticking and forming a film-like product of a resin molded product according to claim 2 of the present invention is the method of sticking a film-like product to the resin molded product according to claim 1, wherein at least part of the film-like product or resin molding is applied by heat. It is characterized by carrying out by melting at least a part of the product.

According to a third aspect of the present invention, there is provided a method for affixing a film-like product to a resin-molded product according to the first or second aspect, wherein the attachment of the film-like product to the resin-molded product is performed at least above the film-like product. It is characterized by supplying compressed air.

According to a fourth aspect of the present invention, there is provided a resin-molded product film-like product pasting apparatus for molding a resin-molded product and attaching a film-like product to at least one surface thereof. An injection molding machine or a press device for molding a resin molded product in the cavity of the mold, and a film-like product supply device for disposing the film-like product against the resin molded product left in the opened cavity, It is characterized in that it is provided with at least one of a pressurized air supply device and a vacuum suction device for pressing the film-like material arranged opposite to the resin molded product.

A film-like material sticking and molding method and a film-like material sticking and molding apparatus of the present invention are a resin-shaped product film-like material sticking and molding method in which a resin-shaped product is shaped and a film-like material is stuck on at least one surface thereof. After molding the resin molded product in the cavity of the mold, place the film-like material facing the resin molded product left in the cavity after opening, and use the pressure difference between the upper and lower sides of the film-like product Since the film-like product is pressed and applied to the resin molded product, the film-like product can be applied to the resin molded product with an equal pressure.

It is a front view of the film-form sticking molding apparatus of the resin molded product of this embodiment. It is an arrow line view of the AA line in FIG. 1 of the film-form sticking molding apparatus of the resin molded product of this embodiment. It is explanatory drawing which shows the process at the time of shape | molding a resin molded product in the film-form sticking molding apparatus of the resin molded product of this embodiment. It is explanatory drawing which shows the process at the time of sticking a film-form thing on a resin molded product in the film-form sticking molding apparatus of the resin molded product of this embodiment. It is a graph explaining the control in the film-form sticking molding apparatus of this embodiment.

1 and 2, a film-like product sticking / molding device 11 (hereinafter simply referred to as a film-like material sticking / molding device 11) of a resin molded product according to this embodiment will be described. The film-like material pasting apparatus 11 includes a press device 12, a film-like material supply device 13, a pressurized air supply device 14, a vacuum suction device 15, and the like. In the press device 12, four tie bars 17 are erected on a lower fixed plate 16, and an upper plate 18 is fixed above the four tie bars 17. The upper plate 18 is provided with a hydraulically operated pressure cylinder 19 as a pressure mechanism, and the ram 20 of the pressure cylinder 19 is fixed to the back surface of the movable plate 21. The movable platen 21 is guided by the tie bar 17 between the fixed platen 16 and the upper platen 18 and can move in the vertical direction. A fixed mold 22 (lower mold), which is one mold, is attached to the upper surface of the fixed plate 16 of the press device 12. A movable mold 23 (upper mold), which is the other mold, is attached to the lower surface of the movable platen 21.

The mold composed of the fixed mold 22 and the movable mold 23 is changed in volume by fitting the movable mold 23 having the convex part 25 (core block) to the fixed mold 22 having the concave part 24. The mold is an in-row structure in which a possible cavity 26 is formed. The mold has a cavity in which the outer frame part of the cavity of one mold can move in the mold opening and closing direction and the volume can be changed by the contact surface of the outer frame part contacting the other mold. It may be a mold that is formed and the cavity can be compressed by the outer frame portion being pressed and retracted.

The cavity 26 formed between the fixed mold 22 and the movable mold 23 is isolated from the outside world and can be kept in a high pressure state by a vacuum state or pressurized air. A chamber forming member 27 that is attached to the main body of the movable mold 23 via a spring 32 and is movable in the mold opening / closing direction is provided on the outer periphery of the movable mold 23. Sealing members 28 and 29 such as O-rings are provided on the sliding surface of the main body slidably in contact with the chamber forming member 27 and the contact surface 38 of the outer periphery of the fixed mold 22 in contact with the chamber forming member 27, respectively. And the chamber forming member 27 can isolate the outside from the inside of the mold. An opening 31 a of a pipe 31 is formed on the outer peripheral surface 30 outside the convex portion 25 of the movable mold 23 and inside the chamber forming member 27. The conduit 31 is connected to both the pressurized air supply device 14 (compressor) and the vacuum suction device 15 (vacuum pump) via open / close valves 34, 35, 36, etc. via a hose 33 etc. outside the movable mold 23. Are connected in such a way that they can be connected and disconnected.

In the vicinity of the outer peripheral contact surface 38 of the side surface 37 of the concave portion 24 (cavity mold) of the fixed mold 22, a plurality of openings 39 a of pipes 39 provided inside the mold for vacuum suction are formed. Has been. A filter for preventing suction of carbon fibers may be attached to the opening 39a. The other side of the pipeline 39 passing through the inside of the mold is connected to a vacuum suction device 15 (vacuum pump) via a hose 41 etc. outside the mold. Between the vacuum source such as a vacuum pump of the vacuum suction device 15 and the cavity 26 (including one side of the mold), the open / close valve 36 and the like that can be communicated and blocked as described above are provided.

Pipe lines 42 and 43 through which a heat medium and a refrigerant corresponding to a heating unit and a cooling unit are circulated are formed inside the fixed mold 22 and the movable mold 23, respectively. The pipes 42 and 43 are respectively connected to supply devices (not shown) that can supply the heat medium or the refrigerant under temperature control. In addition, about the heating means of a metal mold | die, various electric heaters (resistance heating element) and an induction heating apparatus may be sufficient. In this case, the cooling means includes a pipe line provided in the mold for circulating cooling water or refrigerant oil and a supply device connected to the pipe line.

The fixed mold 22 is provided with an ejector mechanism (not shown) for projecting a molded product. Further, on the side of the press device 12, there are disposed a take-out device for the resin molded product P1 with a film-like material attached thereto, and a finish molding device (not shown) for trimming the resin molded product P1. ing.

Next, the film supply device 13 will be described. In the film-like material supply device 13, a supply roller 44 around which the film-like material F is wound is disposed on one side of the press device 12. The supply roller 44 includes a brake that controls rotational resistance when the film-like material F is sent out. However, the rotation may be controlled by a servo motor. Further, a film-like material that holds both sides of the film-like material F and moves the film-like material F from the supply roller 44 side to above the cavity 24 of the stationary die 22 to the other side of the stationary die 22 is obtained. A holding and conveying mechanism 45 is provided. The holding and conveying mechanism 45 can be opened and closed by an air cylinder so that the upper and lower chucks 46 can pinch or release the film-like object F. The chucks 46 and 46 are moved by being guided by guide rails 48 and 48 using air cylinders 47 and 47 for advancing and retreating. The height at which the film-like material F is sandwiched and fed by the chucks 46 and 46 is substantially the same height as the contact surface 38 on the outer periphery of the fixed mold 22 (lower mold) or slightly higher than the contact surface 38. ing. Further, a cutting device 49 for the film-like material F is provided between the supply roller 44 and the press device 12. As shown in FIG. 2, in this embodiment, the width w <b> 1 of the film-like object F is provided wider than at least the width w <b> 2 of the cavity 26, and here, seals provided on the contact surfaces 38 on both sides of the fixed mold 22. The width is larger than the interval w <b> 3 of the member 29. Accordingly, the interval w4 between the chucks 46 and 46 of the holding and conveying mechanism 45, the length of the supply roller 44, and the length of the cutter of the cutting device 49 are also provided according to the width w1 of the film-like material F.

Next, the film-form sticking molding method of the resin molded product P of this embodiment will be described with reference to FIGS. 3, 4, and 5. First, as shown in FIG. 3A, a thermoplastic resin sheet R made of a carbon fiber mat C and a thermoplastic resin is placed in the cavity 26 of the fixed mold 22 (lower mold) of the press device 12. The thermoplastic resin which is a matrix resin used in the present embodiment is made of polyamide (PA6) resin as an example, and one or a plurality of thermoplastic resin sheets R having a thickness of 0.5 to 5 mm are used. Polyamide is excellent in fluidity at the time of melting and excellent in impregnation into the carbon fiber mat C. The thermoplastic resin sheet R is preferable because it is easy to handle, but may be a thinner resin film, a resin plate that is harder and thicker than the sheet, or a granular material. The weight percentage ratio of the carbon fibers to the total (total weight of the thermoplastic resin and the carbon fibers) is preferably 25 to 70%, more preferably 35 to 60% as an example.

Then, the pressurizing cylinder 19 is operated, the movable platen 21 and the movable mold 23 are lowered, and the movable mold 23 and the like are once stopped at the position shown in FIG. At this time, the contact surface of the chamber forming member 27 of the movable mold 23 is brought into contact with the contact surface 38 on the outer periphery of the fixed mold 22 via the seal member 29, and the inside of the mold is isolated from the outside. And in this stop position, the convex part 25 of the movable mold 23 is slightly engaged with the concave part 24 of the fixed mold 22, and the opening 39 a of the conduit 39 faces the side surface of the convex part 25. It has become. Next, the vacuum pump of the vacuum suction device 15 is communicated with the cavity 26 to perform vacuum suction in the cavity 26. At this time, as described above, the opening 39 a of the conduit 39 faces the side surface of the convex portion 25, and a slight gap is formed between the concave portion 24 of the fixed mold 22 and the convex portion 25 of the movable mold 23. Therefore, the carbon fiber is hardly sucked from the opening 39a of the suction conduit 39. The temperatures of the fixed mold 22 and the movable mold 23 are equal to or higher than the melting point temperature of the thermoplastic resin (matrix resin) to be molded (for example, the melting point temperature plus 30 ° C.). The degree of vacuum in the cavity 26 at this time is not limited, but is evacuated to 10 hPa to 100 hPa as an example. When the entire pressing device 12 is disposed in the vacuum chamber, the movable mold need not be stopped once. The vacuum in the cavity 26 is not essential.

When the inside of the cavity 26 reaches a predetermined degree of vacuum or a predetermined time elapses, as shown in FIG. 3C, the pressurizing cylinder 19 is restarted to lower the movable mold 23, and the volume in the cavity 26 is reduced. The pressure is applied to the thermoplastic resin sheet R and the carbon fiber mat C. As for the applied pressure, the surface pressure applied to the thermoplastic resin sheet R or the like is desirably 0.3 to 30 MPa. The temperature at the time of pressurization of the thermoplastic resin sheet R and the carbon fiber mat C is not changed from that at the time of vacuum suction. The temperature at the time of pressurization is, for example, preferably in the range of the melting point temperature of the molten thermoplastic resin R to the melting point temperature plus 100 ° C., more preferably the melting point temperature to the melting point + 60 ° C. In this embodiment, the melting point temperature of polyamide (PA6) is 225 ° C., so the temperature during pressurization is preferably 225 ° C. or more and 325 ° C. or less, more preferably 225 ° C. or more and 285 ° C. or less. Then, although it varies depending on the volume and shape of the resin molded product P at the above temperature, the carbon fiber mat C is impregnated with the thermoplastic resin R by continuing the pressurization for 20 to 600 seconds.

Next, the supply of the heat medium to the pipes 42 and 43 of the fixed mold 22 and the movable mold 23 is stopped and switched to the supply of the refrigerant, and the carbon fiber mat C in the cavity 26 is impregnated with the thermoplastic resin R. The resin molded product P is cooled so as to have a melting point or lower. The cooling temperature at this time may be such that the movable mold 23 can be satisfactorily released from the resin molded product P left in the cavity 26 of the fixed mold 22, and the resin molded product P is completely removed from the cavity 26. In some cases, it may not be cooled to a temperature at which no deformation occurs. When the molding of the resin molded product P and the cooling are completed, as shown in FIG. 3D, the pressure cylinder 19 is operated to raise the movable platen 21 and the movable mold 23, thereby opening the cavity 26. At this time, the resin molded product P is held in a state of being left in the cavity 26 of the fixed mold 22 after being opened (in the present invention, the cavity surface of the mold other than the closed space is also referred to as “cavity”). Further, the mold opening amount of the movable mold 23 when the mold is opened may be small as compared with when the resin molded product P1 is taken out, and a mold opening interval for moving the film-like object F described below is secured. Move as much as possible.

Next, the film-like product F is attached to the resin molded product P in the cavity 26. The purpose of sticking the film-like product F to the resin molded product P is diverse, but in this embodiment, the purpose of sticking the film-like product F to the resin molded product P containing fibers such as carbon fibers is resin. This is to make the surface of the molded product P beautiful. The film-like material F is made of a thermoplastic resin having no air permeability, and is made of polyethylene terephthalate as an example. Further, another adhesive layer that is easily melted by heat is formed on the side of the film-like product F of the present embodiment that comes into contact with the resin molded product P. In some cases, the protective film may be peeled off to expose the adhesive layer before use.

As shown in FIG. 2 and FIG. 4 (e), the air cylinders 47, 47 for advancing and retreating of the holding and conveying mechanism 45 of the film-like material supply apparatus 13 are actuated, and at a holding position 50 on one side of the fixed mold 22. The chucks 46, 46 holding the film-like material F and passing over the cavity 26 where the resin molded product P is left are moved to the movement end position 51 on the other side of the fixed mold 22. As a result, the film-like object F can be disposed opposite to the resin molded product P placed in the opened cavity 26 with a predetermined interval. At this time, the film-like object F is in contact with or very close to the contact surface 38 on the outer periphery of the fixed mold 22, and the width w1 of the film-like object F is the width of the cavity 26 and the contact surfaces on both sides. The point wider than the interval w3 between the 38 seal members 29 is as described above.

Next, as shown in FIG. 4 (f), the movable mold 23 is slightly lowered, and the contact surface of the chamber forming member 27 of the movable mold 23 is in contact with the contact surface 38 on the outer periphery of the fixed mold 22. The movable mold 23 is stopped in a state of being in contact with the seal portion 29 via the film-like object F. At this time, the spring 32 of the movable mold 23 is still extended to some extent, and the convex portion 25 of the movable mold 23 and the concave portion 24 of the fixed mold 22 are not yet fitted, and there is a slight gap between them. There is a gap. In this state, the chamber formed between the fixed mold 22 and the movable mold 23 is separated into an upper chamber c1 above and a lower chamber c2 below through a film-like material F stretched with a constant tension. It is divided.

Next, the upper chamber c1 and the lower chamber c2 are vacuum-sucked by the vacuum suction device 15 through the opening 39a of the conduit 39 of the fixed mold 22 and the opening 31a of the conduit 31 of the movable mold 23, respectively. At this time, since the vacuum degree of the upper chamber c1 and the lower chamber c2 is lowered at the same time, the film F is not deformed by receiving physical force. In this case, the temperature of the fixed mold 22 and the movable mold 23 is set to the melting point or higher if the entire resin molded product P or at least a part (surface) of the resin molded product P is melted. However, when melting the entire film-like product F or at least a part of the film-like product F (such as an adhesive layer), the temperature may be raised to a temperature at which the film-like product F or its adhesive layer is melted. In this embodiment, the adhesive layer of the film-like product F is lower than the melting point of the polyamide (PA6) (for example, 80 to 220 ° C.), so that the adhesive layer is Some melting begins. Therefore, it is possible to prevent thermal deterioration of the resin molded product P and the film-like product F, to save energy, and to shorten the cycle by enabling early cooling.

When the upper chamber c1 and the lower chamber c2 reach a predetermined degree of vacuum or when a predetermined time elapses, the vacuum suction is stopped only for the upper chamber c1, and the open / close valves 34 and 35 are operated to pressurize only the upper chamber c1. Supply air. The vacuum suction of the lower chamber c2 by the vacuum suction device 15 is continued. At this time, the pressurized air supplied from the pressurized air supply device 14 is, for example, preferably higher than atmospheric pressure and 2.0 MPa or lower. As a result, a pressure difference occurs between the upper chamber c1 and the lower chamber c2 separated by the film-like material F, and the film-like material F is pressed toward the resin molded product P as shown in FIG. The At this time, since the film-like material F is deformed and pressed from the tensioned state, the film-like material F adhered to the resin molded product P is not wrinkled. Further, since the lower chamber c2 is sucked by vacuum, no void is generated between the film-like material F to be stuck and the resin molded product P. Furthermore, since it presses with pressurized air, each part of the film-form thing F can be pressed to a uniform pressure with respect to the resin molded product P rather than the case where it presses with a press plate. Further, by using the pressurized air supplied from the pressurized air supply device 14, it is possible to pressurize at a stronger pressure than when pressurizing at the atmospheric pressure, and the pressure can be adjusted.

When a predetermined time has elapsed, the supply of pressurized air to the upper chamber c1 is stopped, and the upper chamber c1 is opened to the atmosphere or depressurized to atmospheric pressure or lower. Further, a cooling medium is supplied to the upper and lower fixed molds 22 and the conduits 42 and 43 of the movable mold 23 to lower the mold temperature. Then, as shown in FIG. 4 (h), the pressurizing cylinder 19 is actuated again to further lower the movable mold 23, and the upper surface of the film-like object F is directly pressed by the cavity forming surface of the convex portion 25. At this time, the cooling of the fixed mold 22 and the movable mold 23 may be started before the upper chamber c1 is opened to the atmosphere, or may be after the direct pressing on the film-like object F by the cavity forming surface, Further, switching may be performed at any timing during that time. Then, by directly pressing the resin molded product P1 on which the film-like product is adhered on the cavity forming surface for a predetermined time, the adhesion of the film-like product F to the resin molded product P1 is further ensured. At this time, the cooling proceeds to a temperature at which the resin molded product P can be taken out at a temperature lower than the cooling temperature at the time of mold opening after press molding of the previous resin molded product P, and the cooling is completed. In addition, in this invention, when sticking and forming to the resin molded product P of the film-like thing F, the pressurization by the pressurization cylinder 19 is not essential.

Then, as shown in FIG. 4 (i), in parallel with the cooling of the resin molded product P1 or after the cooling is completed, the cutting device 49 of the film-like material sticking device 13 is operated to continue from the supply roller 44. The film-like material F being fed is cut. Next, the pressurizing cylinder 19 of the press device 12 is actuated again, the movable mold 23 is completely opened, and a resin molded product P1 having a film-like material stuck thereon is ejected by an ejector device (not shown) and a take-out device (not shown). To take out the resin molded product P1. The resin molded product P1 taken out may be trimmed or the like of the surplus portion of the film-like product F by a finishing molding device in a subsequent process.

By performing the film-like material sticking and molding method as described above, conventionally, the film-like material F and the thermoplastic resin are arranged in the cavity from the time of molding the first resin molded product (at the time of impregnation molding) as in Patent Document 2. However, when press-pressing, there is a problem that the film-like material F is thermally deteriorated, or fibers such as carbon fibers penetrate the film-like material F due to the progress of melting of the film-like material F and protrude to the surface side. In the present invention, such a problem hardly occurs. Moreover, since all the processes up to sticking the film-like material F can be performed in the film-like material sticking / molding device 11 of the resin molded product including one press device 12 and the film-like material supply device 13, the pressing device and the film It is possible to avoid an increase in cost, an increase in installation location, an increase in the number of maintenance times, an increase in energy consumption, and the like due to the separate attachment devices.

Further, as a second embodiment of the present invention, the press device 12 may be one in which the lower movable mold rises toward the upper fixed mold in addition to the above. Further, a plurality of molds may be provided, and the resin molded product P may be molded simultaneously with a plurality of cavities. The pressurizing mechanism of the press device 12 is not limited to the pressurizing cylinder 19 and may be driven by an electric motor. Furthermore, the press device 12 may be one in which the lower mold is pulled out from the pressurizing position and the film-like material F is stuck outside the press device.

Further, as a third embodiment of the present invention, the apparatus for molding the resin molded product P in the cavity of the film-like material sticking and molding apparatus for the resin molded product P may be an injection molding machine instead of the press device 12. Good. In the case of an injection molding machine, resin molding is generally performed by injecting molten resin from an injection device into a cavity formed between a fixed mold attached to a fixed plate of a mold clamping device and a movable die attached to a movable platen. The product P is molded. At this time, the resin material to be plasticized by the injection device may be a fiber material such as carbon fiber or glass fiber contained in a thermoplastic resin, and the fiber material or another insert is placed in the cavity and melted. Resin injection may be performed. The injection molding machine may be either a vertical type or a horizontal type. Also in the case of an injection molding machine, the film-shaped product F is placed opposite to the molded resin molded product P by opening the cavity, and the film-shaped product F is pasted on the resin molded product P later using the pressure difference. Perform molding. This prevents thermal degradation of the film-like material F, prevents protrusion of the glass-like material onto the surface of the film-like material, prevents movement or tearing of the film-like material F due to injection (or without concern about tearing of the film-like material F, etc. The injection speed can be increased).

Further, as a fourth embodiment of the present invention, as the film-like product supply device 13 for supplying the film-like product F to the resin molded product P in the cavity of the opened mold, a resin molded product other than the one shown in FIG. The film-like object F stuck to P may be transferred by a carrier film sent from the unwinding roll toward the take-up roll. More specifically, the film-like object F is stuck to the carrier film at every predetermined interval (one pitch interval) and is wound around an unwinding roll. When the carrier film is sent to the cavity such as a press device by 1 pitch, the adhered film-like material F is also moved to a position facing the resin molded product P in the cavity. And the film-like thing F is affixed on the resin molded product P using an atmospheric pressure difference, and only a carrier film is transferred toward a winding roll. In the above, the carrier film portion may define the upper and lower chambers c1 and c2, and the film-like material F portion may define the upper and lower chambers c1 and c2. Note that the carrier film of the fourth embodiment is an obstacle when the resin molded product P is pressure-molded from the carbon fiber mat C and the thermoplastic resin sheet R in the cavity 26 of the press device 12. It is necessary to move from the area.

As the fifth embodiment of the present invention, only the vacuum suction device 15 may be provided for attaching the film-like material F. In that case, first, both the upper chamber c1 and the lower chamber c2 defined by the film-like material F or the carrier film are vacuumed. Then, only the upper chamber c1 is opened to the atmosphere. Then, the film-like article F is pasted and formed with no voids on the resin molded product P using the pressure difference between the upper chamber c1 in the atmospheric pressure state and the lower chamber c2 in the vacuum state. Alternatively, only the lower chamber c2 may be vacuum-sucked from the beginning to perform sticking molding. Since these methods can only pressurize at a surface pressure of 0.1 MPa or less due to a difference in atmospheric pressure, when a relatively thin film-like material F is adhered or when the adhesive force of the film-like material F is strong. Is used.

In addition, as a sixth embodiment of the present invention, it is also possible to perform sticking molding by creating a pressure difference by sending pressurized air only to the upper chamber c1 above the film-like material F. In this case, the lower chamber c2 is at atmospheric pressure, and is used when sticking the film-like material F that is difficult to form voids. Or a device such as a procedure for bonding the film-like product F so that no void is formed between the film-like product F and the resin molded product P is required. Also, instead of supplying the pressurized air directly above the film-like material F in the upper chamber c1, the apparatus provided with the rubber-like bag-like film body or diaphragm is moved to the position facing the film-like material F. In addition, pressurized air may be supplied to the back side of the bag-like film body, the diaphragm, etc., and the bag-like film body, the diaphragm, etc. bulge to pressurize. In this case, it is desirable to vacuum the film-like object F below, but it is not essential. At this time, the mold holding the resin molded product P may be moved to a position facing the diaphragm arranged at another position to perform the sticking molding.

In the above embodiment, the film-like material F is attached only to one side of the resin molded product P. However, as a seventh embodiment of the present invention, any film-like material F may be attached to at least one surface of the resin molded product P. For example, by moving the core in the cavity, the film-like object F can be adhered to the side surface of the resin molded product P. In addition, after the film-like product F is attached to one side, the resin molded product is held in the mold on the film-like product F side, the cavity is reopened, and the pressure difference is utilized after the film-like product F is disposed oppositely. By pressing again, it is possible to obtain a resin molded product P1 having a film-like material attached to both sides.

The present invention is not enumerated one by one, but is not limited to that of the above-described embodiment, and it goes without saying that those skilled in the art also apply modifications made in accordance with the spirit of the present invention. is there. The fiber material used for the resin molded product P to be molded may be other types of fiber materials such as glass fibers, Kepler fibers, metal fibers such as aluminum, natural fibers, in addition to carbon fibers. Further, the thermoplastic resin used is not limited, and typical examples include polypropylene, polyethylene, polystyrene, ABS resin, AS resin, polycarbonate, polyethylene terephthalate, polyamide, polyacetal, polyphenylene sulfide, polyphenylene ether, and thermoplastic polyurethane. Other types of thermoplastic resins may be used. Moreover, the mixed material of a thermoplastic resin and a thermosetting resin may be sufficient. Furthermore, the resin molded product P may be molded only from a resin material (for example, a thermoplastic resin material) without including a fiber material.

The resin molded product may be a circuit board in which a metal material or the like is mixed with a resin material. Moreover, what is shape | molded with the press apparatus of a film-form sticking shaping | molding apparatus may be press-molded articles other than a resin molded article (for example, organic substances other than a metal, an inorganic substance, and resin). Even if it is a press-molded product other than the resin molded product, a film-like product can be bonded and formed on the surface by the same process as the resin molded product.

Moreover, as the film-like object F stuck on the resin molded product P, in addition to a thermoplastic resin, a thermosetting resin, or a mixture of a thermoplastic resin and a thermosetting resin may be used. Further, the film-like material F may be rubber, leather, cloth, paper, metal foil or the like. Further, the film-like material F may be composed of a plurality of layers of various materials. Also, when using a film-like product F that does not melt even at a considerably high temperature, or when using a resin molded product P and film-like product F that are extremely heat-sensitive, use at room temperature without using any heat. You may make it stick the film-form F and the resin molded product P using the possible adhesive agent.

DESCRIPTION OF SYMBOLS 11 Film-form sticking molding apparatus 12 of a resin molded product Press apparatus 13 Film-form supply apparatus 14 Pressurized air supply apparatus 15 Vacuum suction apparatus 19 Pressurization cylinder 22 Fixed mold (lower mold)
23 Movable mold (upper mold)
26 Cavity 27 Chamber forming member C Carbon fiber mat (carbon fiber)
F Film-like product P Resin-molded product P1 Resin-molded product R with a film-like product attached R Thermoplastic resin sheet (thermoplastic resin)
c1 Upper chamber c2 Lower chamber

Claims (4)

A method for forming a resin-molded article, which is a resin-molded article for molding a resin-molded article and affixing a film-like article on at least one surface thereof,
After molding a resin molding in the mold cavity,
Place the film-like object opposite the resin molded product left in the cavity after opening,
A method for pasting and forming a film-like product of a resin-molded product, wherein the film-like product is pressed and pasted to a resin-molded product using a pressure difference between the upper and lower sides of the film-like product. The film of a resin molded product according to claim 1, wherein the film-shaped product is attached to the resin molded product by melting at least a part of the film-shaped product or at least a part of the resin molded product by heat. Form sticking and molding method. The film-like product affixing according to claim 1 or 2, wherein the film-like product is affixed to the resin-molded product by supplying pressurized air at least above the film-like product. Molding method. A resin-molded product film-form pasting device for molding a resin-molded product and pasting a film-form on at least one surface thereof,
An injection molding machine or press machine for molding a resin molded product in the cavity of the mold;
A film-like material supply device for opposingly arranging a film-like material against the resin molded product in the cavity of the mold left in the cavity after opening;
At least one of a pressurized air supply device and a vacuum suction device for pressing a film-like material arranged opposite to the resin-molded product is provided. .