JP4405429B2 - Resin mold and resin molding method - Google Patents

Description

  The present invention relates to a resin mold and a resin mold method using the resin mold.

  Conventionally, the resin mold apparatus described in Patent Document 1 is publicly known.

  FIG. 5 shows a resin mold 10 described in Patent Document 1.

  Here, when the molded product 30 is resin-molded, the release film 22 is interposed between the upper mold 12 and the resin to be supplied in order to improve the releasability of the molded product.

  In order to fix the release film 22, the upper mold 12 is provided with a plurality of release film suction holes 24 for sucking and fixing the release film 22, and further, an upper part (bottom part) of the resin forming part 20. The cavity suction hole 26 is provided for suction, and the release film 22 conforms to the shape of the resin molding portion.

Japanese Patent No. 3017470 (Japanese Patent Laid-Open No. 11-77734)

  As in the conventional example described above, when the shape of the entire resin molded portion is always constant during the resin molding process, the release film suction is relatively easy due to the presence of the release film suction holes and the cavity suction holes.

  However, the mold that constitutes the resin molding part is composed of, for example, a frame-shaped mold and a compression mold that is slidable in the central through-hole of the frame-shaped mold. In the case of a resin mold in which the compression mold moves and is compressed after being supplied, the same effect cannot be necessarily expected.

  That is, even if the release film is adsorbed in the state before the compression mold moves (before compression) and fixed along the shape of the resin molding part, if the compression mold enters the compression process and moves, As a result, the shape of the entire resin molded part also changes. This change is a change in the direction in which the volume of the resin molding part decreases, so even if the release film is fixed to the release film without any wrinkles before moving, the movement causes a surplus in the release film, resulting in wrinkles and twisting. May occur. This is a problem particularly when the moving stroke of the compression mold is large.

  If the release film is wrinkled or twisted during the compression process in this way, the resin has not yet solidified, so the shape of the wrinkle appears on the surface of the molded product, or the resin wraps around the wrinkled part. Causes problems such as deterioration of releasability.

  The present invention has been made for the purpose of solving these problems, and it is possible to prevent generation of wrinkles of the release film even when the resin molded portion is compressed and the volume thereof changes. It is an issue.

  The present invention provides a resin mold in which resin is supplied into a cavity formed by combining an upper mold and a lower mold constituting a mold, and a product is molded through a release film adsorbed on a clamp surface of the mold. In the mold, at least one of the upper mold and the lower mold is provided with a release film pressing member capable of moving back and forth toward the mating mold, and the release film pressing member is provided on a clamping surface of the mating mold. The above-described problems are solved by providing a recess that can be fitted with the tip of the slab and a suction hole for sucking the release film provided on the outer periphery of the recess.

  Also, a resin molding method in which resin is supplied into a cavity formed by combining an upper mold and a lower mold constituting the mold, and a molded product is molded through a release film adsorbed on the clamp surface of the mold. A release film pressing member capable of moving back and forth toward the mating mold is provided on at least one of the upper mold and the lower mold, and the clamp surface of the mating mold is provided with the release film pressing member. On the clamping surface of the mating mold, using a resin mold having a recess into which the tip can be fitted and a suction hole for sucking the release film provided on the outer periphery of the recess. An adsorption step for adsorbing the release film on the surface, a moving step for moving the mating die toward the holding member while adsorbing and holding the release film, and a front end portion of the holding member A tensioning process for applying tension to the release film by fitting the concave film on the clamping surface of the mating mold through the release film, and the upper mold and the lower mold with the tension applied to the release film The above-mentioned problem is solved by molding by a resin molding method including a clamping step of moving until the mold is completely clamped.

  According to the present invention, for example, even when resin molding is performed using a compression mold having a large stroke amount, it is possible to always apply tension to the release film during the compression process, and the release film accompanying the movement of the compression mold Generation | occurrence | production of soot etc. can be prevented.

  In addition, the maximum effect is exhibited in the case of a resin mold using a compression mold, but even if it is not necessarily a resin mold using a compression mold, it is effective by applying tension to the release film. Generation of wrinkles can be prevented. Moreover, by changing the width of the release film, the present invention can be applied not only to one mold but also to both molds (upper mold and lower mold).

  By this invention, it can prevent that a pattern, such as a wrinkle, appears on the surface of a molded article.

  Further, the wraparound of the resin can be prevented, the deterioration of the mold release property of the molded product can be prevented, and a high quality resin mold can be realized.

  Exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIGS. 1 to 4 are general views of a resin mold 110 showing an example of an embodiment of the present invention, FIG. 1 is a state diagram of each mold before compression molding, and FIG. 2 is a resin mold 110. FIG. 3 is a diagram showing the configuration of the lower mold 114, and FIG. 3 is a diagram showing the state of each mold at the moment when the upper mold 112 and the lower mold 114 are engaged via the pins 134 (tensile process), FIG. 4 is a diagram showing the state of each mold at the moment when the compression mold 118 enters the compression process.

  The resin mold 110 according to the present invention is provided in a resin mold apparatus (not shown).

  The resin mold 110 is composed of an upper mold (one mold) 112 and a lower mold (mating mold) 114, and the lower mold 114 is composed of a frame-shaped mold 116 and a compression mold 118. It is configured.

  The frame-shaped mold 116 is provided with a through-hole (center through-hole) 116A penetrating vertically, and a compression mold 118 is disposed in the through-hole 116A so as to be movable up and down. .

  The through-hole 116A is designed to have a size that allows a slight gap G1 even when the compression mold 118 is inserted, and the gap G1 can function as the cavity suction hole 126.

  Around the through hole 116A, there is provided a recess 132 into which a tip of a pin 134 described later can be fitted. On the further outer peripheral side of the recess 132, there are provided a slip prevention groove 125 composed of a plurality of thin grooves, and a release film suction hole 124 continuous (integrally) with the slip prevention groove 125.

  A negative pressure can be generated in the release film suction hole 124 and the cavity suction hole 126 through suction paths 127 and 128 by a suction device (vacuum generator) (not shown). Note that these suction paths 127 and 128 do not necessarily have to be continuous with each other, and may be configured to generate a negative pressure independently of the other suction path.

  On the other hand, a molded product 130 is set in the upper mold 112.

  Further, the upper mold 112 is provided with a plurality of pin through holes 112A and spring mounting holes 112B corresponding to the pin through holes 112A, and a pin 134 that functions as a pressing member is inserted therein. The tip 134A of the pin 134 protrudes from the clamp surface C1 of the upper mold 112.

  On the other hand, a stop portion 134B is formed on the opposite end side of the pin 134 to limit the protruding amount of the pin 134 from the clamp surface C1 of the upper mold 112.

  Further, a spring (elastic body) 136 is engaged with the stopper 134B, and the pin 134 moves up and down (lower part) by applying a certain reaction force (force to push up the pin 134) to the tip 134A of the pin 134. It is possible to move forward and backward with respect to the mold 114.

  The space formed by clamping the upper mold 112 and the lower mold 114 constitutes a cavity 138, and is formed by the compression mold clamping surface C3 positioned below the frame-shaped mold clamping surface C2. The recessed portion constitutes the resin molded portion 120 (see FIG. 4).

  Next, the operation of the resin mold 110 will be described.

  1 and 2, when the article to be molded 130 is set at a predetermined position by a supply device (not shown), the clamping surface C2 of the frame-shaped mold 116 and the compression mold 118 are driven by a drive mechanism (not shown). Are arranged on the same plane.

  Further, after the release film 122 is supplied onto the clamp surfaces C2 and C3 that are in the same plane by a supply mechanism (not shown), the release film 122 is clamped by the negative pressure generated in the release film suction hole 124 and the cavity suction hole 126. Adsorption is fixed on the surfaces C2 and C3 (adsorption process). At this time, a negative pressure is generated in the recess 132 in the frame-shaped mold 116 along with the negative pressure from the suction holes 124 and 126, and the release film 122 tends to be deformed in accordance with the shape of the recess 132. Since the recess 132 is designed so deep that the release film 122 cannot follow, the release film 122 is fixed in a floating state while being depressed at the portion of the recess 132. In addition, when there is a slack component or the like in the release film 122, it is absorbed by the recess 132.

  Proceeding to FIG. 3, the lower mold 114 moves to the pin 134 side (upper mold 112 side) while maintaining this state (moving step). When contact is made with the pin 132, the tip 134A of the pin 134 pushes the release film 122 down to the bottom 132A side of the recess 132, whereby tension is applied to the release film 122 (tensile process), and further, the compression mold 118 moves. Stops.

  Here, the pin tip portion 134A and the recess 132 are not in direct contact with each other because they are in contact with each other via the release film 122. Further, as described above, the release film is adsorbed in a floating state in the concave portion 132, but the release film 122 can follow the bottom 132A of the concave portion 132 by the pressing force from the pin tip portion 134A. Absent. That is, the elastic coefficient of the spring (elastic body) is set to such an extent that the pin 134 starts to move by the reaction force of the release film 122 before contacting the bottom 132A of the recess 132.

  Subsequently, as shown in FIG. 4, the compression mold 118 is stopped and only the frame-shaped mold 116 is moved until it comes into contact with the upper mold 112 (clamping process). Along with this, the pin 134 continues to move, but the tip end portion 134A of the pin 134 does not reach the bottom 132A of the recess 132, and the release film 122 is kept floating as described above.

  The cavity 138 is formed by this movement (clamping process).

  When only the frame-shaped mold 116 starts to move to the upper mold 112 side, the clamp surfaces C2 and C3 are not the same plane, but even in this state, negative pressure is generated in the cavity suction hole 126. Therefore, the release film 122 tries to follow the shape of the resin molding portion 120. For that purpose, the required amount (required length) of the release film 122 is larger than when it is adsorbed and fixed in the same plane state, but since the slack component of the release film 122 is absorbed in the recess 132, The slack component is released, and it is possible to follow the resin molded portion 120. That is, it means that the force by which the release film 122 is pulled toward the resin molding portion 120 by the negative pressure generated in the resin molding portion is larger than the sum of the forces pressed by the pins 134.

  Subsequently, the resin is supplied into the resin molding portion by a resin supply mechanism (not shown), the compression mold 118 moves to the upper mold 112 side, and the molded product 130 is compression molded.

  Here, the timing at which the resin is supplied does not necessarily have to be after the frame-shaped mold 116 is completely clamped with the upper mold 112, but may start to be supplied little by little before that. Further, the compression process of the compression mold 118 may not be started after the resin is completely supplied, and the compression process may proceed while gradually supplying the resin.

  As the compression mold 118 moves (compresses) toward the upper mold 112, the volume of the cavity 138 decreases, and a loose component is also generated in the release film 122. However, the release film 122 is always tensioned by the action of pushing the release film 122 while the pin 134 is fitted in the recess 132. That is, the loose component of the release film 122 in the resin molding part 120 generated by the compression process can be absorbed here, and the occurrence of wrinkles and twists is prevented.

  In the present embodiment, since a plurality of shift prevention grooves 125 continuous to the release film suction hole 124 are provided on the outer periphery of the recess 132, the release film 122 is further shifted from the outer periphery side of the recess 132. There is no. By making the suction force generated in the release film suction hole 124 stronger than the suction force generated in the cavity suction hole 126, the shift prevention groove 125 is not necessarily required, but the presence of the shift prevention groove 125 makes it more reliable. In addition, it is possible to prevent the release film from being displaced, and the suction device is simpler.

  Thereafter, the upper mold 112 and the lower mold 114 are opened at the timing when the supplied resin is cured, and the molded product is moved to another place, and the next preparation process is started. At this time, due to the presence of the release film 122, the molded product is easily released.

  In the above embodiment, the release film is interposed only on the lower mold side. However, depending on the application or the shape of the molded product, the release film is also provided on the upper mold side (or only on the upper mold side). You may make it interpose. When a release film is interposed between both molds, for example, if release films having different widths are used, the pressing member can be disposed on both sides. In either case, if the present invention is applied to at least one side, it falls within the scope of the present invention.

  The present invention is widely applicable in the technical field of resin molding of various precision parts including semiconductors when it is desired to realize a high-quality resin mold.

1 is an overall view of a resin mold 110 that is an example of an embodiment of the present invention, and shows a state of each mold before compression molding Configuration diagram of a lower mold of a resin mold 110 that is an example of an embodiment of the present invention 1 is an overall view of a resin mold 110 that is an example of an embodiment of the present invention, and shows a state of each mold at the moment when an upper mold and a lower mold are engaged via pins. 1 is an overall view of a resin mold 110 that is an example of an embodiment of the present invention, and shows a state of each mold at the moment when a compression mold enters a compression process. Overall view of conventionally known resin mold 10

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 ... Resin mold metal mold 112 ... Upper metal mold | die 112A ... Pin through-hole 112B ... Spring mounting hole 114 ... Lower metal mold | die 116 ... Frame-shaped metal mold | die 116A ... Through-hole 118 ... Compression mold 120 ... Resin molding part 122 ... Release film 124 ... Release film suction hole 125 ... Slip prevention groove 126 ... Cavity suction hole 127, 128 ... Suction path 130 ... Molded article 132 ... Recess 134 ... Pin 134A ... Pin tip 134B ... Stopper 138 ... Cavity C1, C2, C3 ... Clamp surface

Claims (5)

In a resin mold mold for supplying resin into a cavity formed by combining an upper mold and a lower mold constituting a mold, and molding a molded product via a release film adsorbed on the clamp surface of the mold,
A release film pressing member capable of moving back and forth toward the mating mold side is provided on at least one of the upper mold and the lower mold,
The clamp surface of the mating die is provided with a recess into which the tip of the release film pressing member can be fitted, and an adsorption hole for adsorbing the release film provided on the outer periphery of the recess. Resin mold mold. In claim 1,
The counterpart mold is composed of a frame-shaped mold and a compression mold slidable in a central through hole of the frame-shaped mold, and the compression mold after the resin is supplied into the cavity A mold for resin molding, wherein the mold moves and performs compression molding. In claim 1 or 2,
Furthermore, the clamp surface of the said partner metal mold | die is equipped with the release film shift | offset | difference prevention groove | channel continuous with the said suction hole. The resin mold metal mold | die characterized by the above-mentioned. In any one of Claims 1 thru | or 3,
The pressing member is a pin-shaped member,
The pin-shaped member can be moved back and forth toward the mating mold by an engaging elastic body. A resin molding method in which resin is supplied into a cavity formed by combining an upper mold and a lower mold constituting a mold, and a molded product is molded through a release film adsorbed on a clamp surface of the mold. ,
At least one of the upper mold and the lower mold is provided with a release film pressing member that can be moved back and forth toward the mating mold, and the tip of the release film pressing member is provided on the clamping surface of the mating mold. Using a resin mold mold provided with a recess that can be fitted and an adsorption hole for adsorbing the release film provided on the outer periphery of the recess,
An adsorption step of adsorbing the release film on the clamping surface of the counterpart mold;
A moving step of moving the mating die toward the pressing member while adsorbing and holding the release film;
A tensioning step of applying tension to the release film by inserting the tip of the pressing member into the recess provided on the clamping surface of the mating mold via the release film;
A resin molding method comprising: a clamping step of moving until the upper mold and the lower mold are completely clamped while tension is applied to the release film.

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