JP6019471B2 - Resin molding apparatus and resin molding method - Google Patents

Description

  The present invention relates to a resin molding apparatus and a resin molding method for molding a molded product having, for example, a convex portion, particularly a lens portion.

When resin molding a workpiece such as a semiconductor device by transfer molding, the ejector pin provided on the resin path of the mold is protruded from the mold clamping surface in accordance with the mold opening operation to release the molded product. ing.
Alternatively, in order to simplify the mold maintenance, omit the ejector pins, and simplify the mold structure, it is also practical to resin mold by adsorbing a release film to the mold clamp surface including the cavity recess.

Further, in order to promote the separation between the release film and the molded product resin-molded with the release film, a mold mold for releasing the molded product from the cavity recess by ejecting compressed air through the release film after the resin molding and A resin molding method has also been proposed (see Patent Document 1).
In addition, since it is difficult to release the molded product only by blowing out air, a thin plate that forms the bottom of the cavity is used, and when opening the mold after resin molding, a gap is created between the upper die and the thin plate. A mold and a resin mold method have also been proposed in which compressed air is introduced and released by air pressure and elastic deformation of a thin plate (see Patent Document 2).

Japanese Patent Laid-Open No. 11-40593 JP 2000-280293 A

  In recent years, there has been a growing need to use LEDs (light emitting devices) with low power consumption and long life as light sources as light sources to replace incandescent bulbs and fluorescent lamps. When an LED equipped with this lens is resin molded by transfer molding, the transparent resin (silicone resin, epoxy resin, urethane resin, acrylic resin, etc.) used is a molded product at the mold temperature immediately after the resin molding. The surface of the product is in a state with tackiness (adhesiveness) that is not completely cured, and curing is not promoted unless the surface temperature of the molded product is lowered to near room temperature. In the transfer molding, the mold is opened and the molded product is taken out until it is heated to the molding temperature. The mold release in the heated state is the mold clamping surface and the release film, and the release film and the molded product. Are stuck and difficult to release.

  There is also a method of releasing using an ejector pin, but in the case of a resilient elastomeric or silicone mold resin, the ejecting effect by the ejecting pin becomes insufficient, and only the periphery of the pin may be broken. . In particular, in an LED lens having a lens, if physical damage such as a dent remains on the lens resin surface, it tends to be a defective product.

  An object of the present invention is to provide a resin molding apparatus and a resin molding method capable of solving the above-described problems of the prior art and smoothly releasing a molded product from a mold after resin molding without impairing molding quality. is there.

In order to achieve the above object, the present invention comprises the following arrangement.
The work clamped with a mold is resin-molded, and when the mold is opened, the molded product after the resin mold is released from the mold, and the mold mold holds the work One mold having a cavity concave portion formed on the mold clamping surface, and the other mold having the mold clamping surface including the cavity concave portion covered with a release film. A first vent hole that surrounds the cavity recess and opens in a circumferential groove formed to face the workpiece, and sucks air to adsorb the release film to the mold clamping surface or ejects air A plurality of second vent holes that open to the mold clamping surface capable of separating the release film from the mold clamping surface, and the one mold has the Constantly urged by the film support members as pressed toward the lease film are projected, the tension of the release film is improved, a circumferential groove the release film by air suction from the first vent hole The mold is opened while adsorbed inside, and after the mold opening operation is started, air is blown out from the second vent hole to release the release film from the other mold surface. To do.

According to the above configuration, after the molded product is resin-molded using the mold, the release film is adsorbed to the circumferential groove by sucking air from the first air hole provided in the other mold. The release film can be peeled off from the molded product by opening the mold.
Also, when the mold is opened, air is blown out from the second vent hole while the release film is adsorbed in the circumferential groove, so that the release film is inflated into a balloon shape and peeled off from the other mold clamping surface. can do.
Further, even if the mold opening progresses and the release film peeled off from the other mold surface is loosened, the film support member can be pressed against and supported by the release film.
Thus, for example, a molded product including a lens portion using a highly adhesive transparent resin can be released from the mold without reducing the molding quality.

After the mold opening operation of the mold is started, air is blown out from the plurality of second air holes provided in the cavity recesses and on the film suction surfaces outside the cavity recesses to inflate the release film, thereby It may be peeled off from the mold surface.
Thereby, air can be ejected from the plurality of second vent holes provided in the film recesses inside and outside the cavity recesses, and the release film can be reliably peeled off from the other mold clamping surface. .

It said film support member is preferably supporting the release film protrusion amount is increased and exfoliation from the other mold surface and the molded article according to the release while mold opening contacts the film progresses .
Thereby, for example, since the release film that has been peeled off and loosened from the other mold surface is supported by the film support member, it is possible to suppress wrinkling and loosening when winding the used release film.

The mold clamping surface of the other mold is provided with a plurality of third vent holes for blowing air together with the mold opening operation toward the molded product and unnecessary resin connected to the molded product when the mold is opened. Also good.
As a result, when opening the mold, not only the molded product but also the unnecessary resin including the molded product cull and the molded product runner are each blown out to cool and accelerate the mold release. can do.

  In the resin molding method, the step of resin-molding the molded product by closing the mold with one mold holding the workpiece and the other mold with the mold clamping surface including the cavity recess covered with the release film, A step of improving the tension of the release film before starting mold opening of the mold after the resin molding, and surrounding the cavity recess of the other mold before opening the mold A step of opening the mold while adsorbing the release film in the circumferential groove formed, and inflating the release film by blowing air from the other mold clamping surface while adsorbing the release film in the circumferential groove The process of peeling from the other mold surface and the mold opening of the mold is advanced to protrude from the mold clamping surface of the one mold Support member is characterized in that and a step of supporting the release film was peeled off from the mold surface remains in contact the other of the release film.

According to the resin molding method, after resin molding of the molded product, before starting the mold opening of the mold, the tension of the release film is improved, and the inside of the circumferential groove formed surrounding the cavity recess of the other mold Since the mold is opened while the release film is adsorbed on the release film, the release film can be peeled off from the molded product using the mold opening operation.
Also, since the release film is inflated by blowing air from the other mold clamping surface while the release film is adsorbed in the circumferential groove, the release film is surely peeled off from the other mold clamping surface including the cavity recess. Can do.
In addition, the mold opening of the mold is advanced, and the film support member protruding from one mold clamping surface supports the release film peeled off from the other mold surface while remaining in contact with the release film. The generation of wrinkles and slack when winding a release film can be suppressed.
Therefore, for example, a molded product including a lens portion using a highly adhesive transparent resin can be reliably released from the mold without lowering the molding quality.

Also, before opening the mold, when the mold is opened while adsorbing the release film in the circumferential groove and the cavity recess of the other mold, the release film is surely peeled off from the molded product. Can do.
In addition, the release film is expanded by blowing air from the plurality of second air holes provided in the cavity recesses and the film recesses outside the cavity recesses while opening the mold. It can be peeled off from the other mold clamping surface.

  If the resin molding apparatus and the resin molding method are used, the molded product can be smoothly released from the mold after resin molding without impairing the molding quality.

It is sectional explanatory drawing of the mold metal mold | die of a mold closed state. It is sectional explanatory drawing of the mold metal mold | die immediately after a mold opening operation | movement start. FIG. 3 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 2. FIG. 4 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 3. FIG. 5 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 4. It is a top view of the upper mold before resin mold. It is a top view of the lower mold before resin mold. It is a top view of the lower mold | type holding the workpiece | work after resin molding. It is explanatory drawing which shows an example of the light-emitting device separated into pieces. It is a section explanatory view of a mold mold in a closed state concerning other examples. It is sectional explanatory drawing of the mold metal mold | die immediately after a mold opening operation | movement start. FIG. 12 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 11. FIG. 13 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 12. FIG. 14 is a cross-sectional explanatory view of the mold during the mold opening operation following FIG. 13.

  Hereinafter, preferred embodiments of a resin molding apparatus and a resin molding method according to the present invention will be described in detail with reference to the accompanying drawings. In the following, a resin molding apparatus that performs transfer molding of a light emitting device (LED) including a lens portion (convex portion) as a workpiece W using a transparent resin (silicone resin, epoxy resin, urethane resin, acrylic resin, etc.) and The resin molding method will be described. The thermosetting resin can be mixed with at least one substance selected from a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and the like in order to cope with high luminance. In addition, as the mold resin, various types of resins such as a liquid resin, a granular resin, a granular resin, a sheet resin, and a tablet resin can be used, but an example using a liquid resin will be described below. In addition, you may provide the reflector (not shown) which prevents the spreading | diffusion of the irradiated light irradiated from the light emitting element 1. FIG.

  FIG. 9 is a plan view showing a single molded product molded on the substrate 2. As shown in FIG. 9, the LED in the present embodiment protrudes from a light emitting element 1 (see FIG. 1), a substrate 2 (base material) on which the light emitting element 1 is placed, and a resin base 3 that covers the light emitting element 1. For example, the lens unit 4 is molded as a surface-mounted light emitting device. A hemispherical lens portion 4 is formed on the resin base portion 3 at a position facing the light emitting element 1. In this embodiment, five light emitting elements 1 (see FIG. 1) per cavity are sealed by the resin base 3 and the lens part 4.

  In FIG. 1, a work W is used in which a light emitting element 1 is flip-chip connected (or wire bonded) in a matrix, for example, on a substrate 2. As the substrate 2 used as a base material, various plate-shaped members such as a resin substrate, a metal (for example, aluminum, copper, etc.) substrate, a ceramic substrate, a lead frame, and a carrier are used. Further, as the workpiece W, a wafer on which bumps are formed, a carrier on which an electronic component is fixed by adhesion, and the like may be used.

  Next, the resin mold apparatus will be described. In addition, since the well-known mechanism is employ | adopted about the mold | die opening / closing mechanism of the resin mold apparatus, suppose that it demonstrates focusing on the structure of the mold release apparatus with which the mold metal mold | die was equipped. FIG. 1 is a schematic cross-sectional view in which pots, calves, runners, gates, and the like are omitted from the mold 6 (the same applies to FIGS. 2 to 5). Further, in FIG. 8, two molded products are connected in series on the substrate 2 and sealed with resin, but FIG. 1 shows a mold 6 for sealing one molded product. A cross-sectional structure is schematically shown.

  In FIG. 1, the mold 6 includes a lower mold 7 (one mold) that holds the workpiece W and an upper mold 8 (the other mold) that clamps the workpiece W. In this embodiment, the upper mold 8 is described as a fixed mold, and the lower mold 7 is described as a movable mold. As the press drive mechanism, a known mechanism is used in which the lower die 7 supported by the platen is moved up and down by a tie bar using a drive transmission mechanism (toggle link or the like) by a drive source (servo motor or the like).

  First, the configuration of the upper mold 8 will be described with reference to FIG. In the upper die 8, an upper die chase block 10 is supported on the upper die base 9. Upper mold cavity inserts 12 are assembled to the upper mold chase block 10 on both sides of the upper mold center insert 11. In the upper mold center insert 11, an upper mold cull 11a and a plurality of (for example, six) upper mold runners 11b connected thereto are engraved. The upper mold cavity insert 12 has an upper mold runner gate 12a connected to each upper mold runner 11b and a plurality of (for example, two) first cavity recesses 13a connected in series via the communication runner 12b. It is carved.

  In FIG. 6, upper end blocks 14 are provided opposite to each other in the longitudinal direction of the upper center insert 11. Further, upper mold end blocks 15 are provided on both sides in the longitudinal direction of the upper mold cavity insert 12 so as to face each other. The upper mold end blocks 14 and 15 are formed with relief of an air blow block of the lower mold 7 described later.

  Further, the upper die base 9 is formed with a circumferential groove 16 surrounding the upper die chase block 10 (the outer peripheral side of the cavity recess) including the upper die cavity insert 12. A plurality of first ventilation holes 16a are provided at predetermined intervals at the bottom of the circumferential groove 16. The first vent hole 16a is connected to an air intake / exhaust device 17a capable of ejecting or sucking air (see FIG. 2). An upper mold seal ring 19 is fitted on the outer peripheral side of the circumferential groove 16 provided in the upper mold base 9. The upper mold seal ring 19 and the lower mold seal ring 32 described later form a sealed space in the mold 6 and can be depressurized.

  In FIG. 6, circular first cavity recesses 13a are formed in a matrix on the clamp surface of the upper cavity insert 12 in plan view. At the bottom of each first cavity recess 13a, a plurality of (for example, five) second cavity recesses 13b corresponding to the lens portion 4 are carved into a hemispherical recess so as to be deeper than the bottom of the first cavity recess 13a. . The first cavity recess 13a accommodates and molds a workpiece W on which a plurality of (for example, five) light emitting elements 1 are mounted in a dotted pattern on the substrate 2 (see FIG. 1).

In addition, a plurality of (for example, four locations) second vent holes 13c are provided in the bottom of the first cavity recess 13a and around the second cavity recess 13b. The second vent 13c is connected to an air intake / exhaust device 17b (see FIG. 3) capable of ejecting or sucking air.
In addition, concave grooves 13d are formed around the first cavity concave portions 13a arranged in series from the upper mold cull 11a so as to partition them. A second ventilation hole 13e is opened at the bottom of the concave groove 13d. The second vent 13e is connected to an air intake / exhaust device 17b (see FIG. 3) capable of ejecting or sucking air.

  Further, as shown in FIG. 6, the release film F is attracted to the upper mold clamp surface or air is blown to the clamp surfaces (work contact surfaces) of the upper mold center insert 11 and the upper mold cavity insert 12 to release the release film. A plurality of second vent holes 18a capable of separating F from the upper clamp surface are provided. Further, the upper mold 11a, the upper mold runner 11b, the upper mold runner gate 12a, and the communication runner 12b corresponding to the resin path are also provided with second vent holes 18b. The second vent holes 18a and 18b are connected to an air intake / exhaust device 17b capable of sucking or ejecting air (see FIG. 3).

  As shown in FIG. 1, the upper mold clamping surface including the first cavity recess 13 a and the second cavity recess 13 b is covered with a release film F. The release film F is adsorbed and held on the upper mold clamping surface. The release film F has a thickness of about 0.5 mm and has heat resistance. The release film F is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP. A single layer or a multi-layer film mainly composed of a film, a fluorine-impregnated glass cloth, a polypropylene film, polyvinyl chloride or the like is preferably used.

  Next, the configuration of the lower mold 7 will be described with reference to FIGS. In FIG. 7, a lower chase block 21 is supported on the lower mold base 20 in the lower mold 7. The lower mold chase block 21 is provided with lower mold inserts 23 on both sides of the lower mold center insert 22. The lower mold center insert 22 is provided with a pot 24 to which mold resin is supplied. A plunger 25 is provided in the pot 24 so as to be movable up and down.

  In FIG. 7, a plurality of through holes are provided at positions corresponding to the molded product cull 34 a and the molded product runner 34 b (unnecessary resin 34; see FIG. 8), which are the pot peripheral region of the lower mold center insert 22. In the through hole, an ejector pin 26 is provided so as to protrude. The ejector pin 26 is erected on an ejector pin plate (not shown). When the mold 6 is in the mold closed state, the ejector pin 26 is retracted from the lower mold clamping surface, and when the mold opening progresses and the ejector pin plate is pressed, the lower mold clamping surface (lower mold center insert 22) The unnecessary resin 34 (see FIG. 8) is released so as to protrude further.

  In addition, through holes are provided in the four corners of the lower mold base 20 and the lower mold center insert 22, and film support pins 27 (film support members) are constantly urged toward the release film F in the through holes. It is projected in the state. The film support pin 27 is biased by a biasing member such as a coil spring provided in the through hole. As an example, the film support pins 27 are provided at four locations on the lower mold center insert 22 corresponding to the central portion along the four corners of the lower mold 7 and the film conveying direction.

  The upper surface portion of the lower mold insert 23 serves as a workpiece holding portion for placing and holding the workpiece W by suction. Further, lower mold end blocks 28 are provided opposite to each other in the longitudinal direction of the lower mold center insert 22. Further, lower mold end blocks 29 are provided on both sides in the longitudinal direction of the lower mold insert 23 so as to face each other.

  An air blow block 30 is provided opposite to the pair of lower mold end blocks 28, and an air blow block 31 is provided opposite to the pair of lower mold end blocks 29. Third air holes are respectively provided on the opposed surfaces of the air blow blocks 30 and 31. The third vent hole is formed so that air is diffused and ejected in a direction parallel to the workpiece W. The height position of the block opening is provided at a height that substantially matches the upper surface of the workpiece W. When the mold is opened from the third vent hole, air is blown between the release film F and the molded product to separate the release film F from the molded product (see FIG. 5). Further, air is ejected from the third vent hole between the unnecessary resin 34 and the lower mold surface so that the unnecessary resin 34 is easily peeled off from the ejector pin 26. The third vent hole is connected to an air intake / exhaust device (not shown) that can suck or blow air.

  The second vent holes 13c, 13e, 18a, 18b may be switched between air suction and air blow by an individual air intake / exhaust device by opening / closing a valve for each vent hole. Moreover, although the air blow blocks 30 and 31 are arranged facing each other, they may be provided only on one side. The air blow blocks 30 and 31 are provided on the lower mold end blocks 28 and 29, but may be provided on one side or both sides of the lower mold chase block 21 in the short direction.

  In FIG. 7, the lower mold base 20 is provided with a lower mold seal ring 32 surrounding the lower mold chase block 21. The lower mold seal ring 32 comes into contact with the upper mold ring 19 of the upper mold base 9 when the upper mold 8 and the lower mold 7 are closed to form a sealed space in the mold 6. Yes. Thereby, the decompression space (or pressurization space) is formed in the mold 6 and the resin molding can be performed so that no void is generated.

Next, an example of the mold release operation using the mold 6 described above will be described with reference to the mold mold opening / closing operation of FIGS.
First, the resin mold operation will be described as a premise. In FIG. 1, after the workpiece W is sucked and held on the lower mold insert 23 of the mold mold 6 that has been opened and the mold resin is supplied to the pot 24 (see FIG. 7), the lower mold 7 is moved upward to perform the first operation. The workpiece W is clamped and resin-molded with the upper mold 8 (see FIG. 6) in which the upper mold clamping surface including the bottom of the cavity concave section 13a and the second cavity concave section 13b is covered with the release film F. The molded product 33 including the lens part is heated and cured at 110 ° C. to 180 ° C., although it varies depending on the mold resin. In addition, since the sealed space is formed in the mold 6 by the upper mold seal ring 19 and the lower mold seal ring 32, the mold is vacuum-sucked by a degassing device (not shown) and the resin molding operation is performed in the decompression space. In addition, the first vent hole 16a and the second vent holes 13c, 13e, 18a, and 18b that open to the clamp surface of the upper die 8 are in a state in which the air suction / discharge devices 17a and 17b are operated to suck the release film F. Yes (Suction ON state) The movable lower mold 7 is in the upper end position (pressure position). Further, the film support pin 27 is pressed against the release film F of the upper mold 7 that protrudes from the lower mold 8 and faces it.

  Next, a few seconds before the curing time of the mold resin elapses, the suction state in the peripheral groove 16 of the release film F through the first ventilation hole 16a by the air suction / discharge device 17a is first destroyed, and the second state by the air suction / discharge device 17b. The adsorption state of the release film F through the two vent holes 13c, 13e, 18a, 18b is destroyed.

Next, as shown in FIG. 2, immediately before the cure time is completed, the suction operation in the peripheral groove 16 of the release film F through the first ventilation hole 16a by the air suction / discharge device 17a is started. In addition, you may perform the adsorption | suction operation | movement of the release film F through the 2nd ventilation holes 13c, 13e, 18a, 18b by the air suction / discharge device 17b.
At the same time, the tension is improved on the upstream side and the downstream side in the transport direction so as to wind up the release film F of the transport device that transports the release film F between the reels (see FIG. 2).
Furthermore, the vacuum space formed by a vacuum suction device (not shown) in the mold mold 6 which is closed is vacuum broken.

  When the curing time is completed, mold opening of the mold 6 is started. That is, the lower mold 7 is lowered by operating the press drive mechanism. At this time, the suction operation in the peripheral groove 16 of the release film F through the first ventilation hole 16a by the air suction / discharge device 17a continues. Therefore, the release film F is peeled from the molded product 33 as the lower mold 7 is lowered while being adsorbed by the upper mold 8.

  Next, an air ejection operation by the air intake / exhaust device 17b is started. As shown in FIG. 3, the air suction operation through the second vent holes 13c, 13e, 18a, and 18b by the air suction / discharge device 17b is performed while the air suction operation through the first vent hole 16a by the air suction / discharge device 17a is continued. Done. For this reason, the lease film F starts to peel from the upper mold clamping surface including the first cavity recess 13a and the second cavity recess 13b.

Next, as shown in FIG. 4, the mold 6 is opened and air is blown from the upper mold clamping surface including the first cavity recess 13a and the second cavity recess 13b to release the film F and the upper mold. Advance peeling from the clamp surface.
In FIG. 5, the film support pin 27 supports and supports the bending of the release film F that is peeled off from the upper mold 8 and swelled in a balloon shape. As the lower mold 7 is lowered, the film support pins 27 protruding from the lower mold clamping surface hold the release film F against the upper mold surface, thereby suppressing the drooping of the release film F.

Further, as shown in FIG. 8, when the mold 6 is opened from the third ventilation holes provided in the air blow blocks 30 and 31 provided in the lower mold 7, the molded product 33 and unnecessary resin connected to the molded product 33 are provided. Air is spouted toward 34.
Accordingly, when the mold 6 is opened, not only the molded product 33 but also the unnecessary resin 34 including the molded product cal 34a and the molded product runner 34b is jetted and cooled, thereby cooling the molded product. 33 mold release can be promoted.

The air ejection from the upper mold 8 and the air ejection operations from the air blocks 30 and 31 of the lower mold 7 are continuously performed until the mold opening is completed, and are finished. Note that the suction operation through the first vent 16a of the air suction / discharge device 17a may be stopped after a predetermined time has elapsed after the start of the air ejection operation by the air suction / discharge device 17b.
Thus, the mold release operation of the molded product 33 is completed.

According to the above configuration, after the molded product is resin-molded using the mold 6, the release film F is adsorbed to the circumferential groove 16 by sucking air from the first ventilation holes 16 a provided in the upper mold 8. The release film F can be peeled off from the molded product 33 by opening the mold in the state where it has been opened.
Further, when the mold 6 is opened, air is blown out from the second ventilation holes 13c, 13e, 18a, and 18b while the release film F is adsorbed in the circumferential groove 16, so that the release film F is moved upward. It can be exfoliated by inflating into a balloon shape from the mold surface.
Further, even when the mold opening progresses and the release film F peeled off from the upper mold surface hangs down, the release film F loosened by the film support pins 27 can be supported while being pressed against the upper mold surface.
Thus, for example, a molded product including a lens portion using a highly adhesive transparent resin can be released from the mold without reducing the molding quality.

Next, another example of the resin molding apparatus will be described with reference to FIGS.
The resin mold apparatus and method described above are configured using a transfer molding method, but may be a resin mold apparatus and method using another method, for example, a compression molding method. still. The mold mold will be described assuming that the upper mold is a movable mold and the lower mold is a fixed mold, and the workpiece W and the mold opening / closing mechanism are the same.

  The configuration of the upper mold 35 will be described with reference to the schematic cross-sectional view of FIG. Through holes are provided at the four corners of the upper die 35, and film support pins 27 (film support members) are provided in the through holes so as to be constantly urged toward the release film F. The film support pin 27 is biased by a biasing member such as a coil spring provided in the through hole.

  The lower surface portion of the upper die 35 serves as a workpiece holding portion that holds the workpiece W by suction. Further, upper mold end blocks (not shown) are provided on both sides in the longitudinal direction of the upper mold insert so as to face each other. An air blow block is provided opposite to the pair of upper mold end blocks. A third ventilation hole is provided on the opposite surface side of each air blow block. The third vent hole is formed so that air is diffused and ejected in a direction parallel to the workpiece W. Air is ejected from the third vent hole between the release film F and the molded product to separate the release film F from the molded product. Although not shown, the upper mold base is also provided with an upper mold seal ring surrounding the upper mold chase block.

  Next, the structure of the lower mold | type 36 is demonstrated with reference to the schematic cross section of FIG. In the lower mold 36, a lower mold chase block is supported by a lower mold base (not shown). A lower mold cavity insert 37 is provided in the lower mold chase block. A first cavity recess 37 a is engraved in the lower mold cavity insert 37. A hemispherical recess is formed at the bottom of each first cavity recess 37a so that a plurality of (for example, five) second cavity recesses 37b corresponding to the lens portion 4 (see FIG. 9) are deeper than the bottom of the first cavity recess 37a. It is carved in. The first cavity recess 37a accommodates and molds a workpiece W on which a plurality of (for example, five) light emitting elements 1 are mounted in a dotted pattern on the substrate 2 (see FIG. 9). In addition, a plurality of (for example, four locations) second vent holes 38a are provided at the bottom of the first cavity recess 37a and around the second cavity recess 37b. The second vent hole 38a is connected to an air intake / exhaust device 17b capable of ejecting or sucking air.

  The lower die 36 is formed with a circumferential groove 39 so as to face the work holding portion and surround the first cavity recess 37a. A plurality of first ventilation holes 39a are provided at predetermined intervals at the bottom of the circumferential groove 39. The first vent 39a is connected to an air intake / exhaust device 17a capable of ejecting or sucking air (see FIG. 11). A lower mold seal ring (not shown) is fitted on the outer circumferential side of the circumferential groove 39. The lower mold seal ring can be decompressed (or pressurized) by forming a sealed space in the mold 6 together with the upper mold seal ring.

  Further, the release film F can be separated from the lower mold clamping surface by adsorbing the release film F to the lower mold clamping surface or blowing air on the clamping surface (work contact surface) of the lower mold cavity insert 37. A plurality of second ventilation holes (not shown) are provided. The release film F has a thickness of about 0.05 mm and has heat resistance, and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP. A film, a fluorine-impregnated glass cloth, a polypropylene film, polyvinyl chloride, etc. are preferably used.

  Next, an example of a mold release operation using the mold 6 will be described with reference to the mold opening / closing operation of FIGS.

  First, the resin mold operation will be described as a premise. In FIG. 10, a lower mold clamp including a work cavity W adsorbed and held on the upper mold clamping surface of the upper mold 35 of the mold mold 6 that has been opened, and including the bottoms of the first cavity recess 37a and the second cavity recess 37b of the lower mold 36. After the release film F is sucked and held on the surface, mold resin (for example, liquid resin) is supplied to the first cavity recess 37a, and then the upper mold 35 is moved downward to clamp the work W with the lower mold 36. Resin mold. In addition, since the sealed space is formed in the mold 6 by the upper mold seal ring and the lower mold seal ring, the mold mold 6 is vacuum-sucked by a degassing device (not shown), and the resin mold operation is performed in the decompression space. In addition, the first vent hole 39a and the second vent hole 38a opened in the clamp surface of the lower die 36 are in a state where the air suction / discharge devices 17a and 17b are operated to suck the release film F (adsorption ON state). . Further, the upper die 35 which is a movable die is in the lower end position (pressurizing position). The film support pins 27 are pressed against the release film F of the lower mold 36 that protrudes from the upper mold 35 and faces the film.

  Next, a few seconds before the cure time of the mold resin elapses, the suction state of the peripheral groove 39 of the release film F through the first ventilation hole 39a by the air suction / discharge device 17a is first destroyed, and the second by the air suction / discharge device 17b. The release film F adsorbed through the vent holes 38a is destroyed.

  Next, as shown in FIG. 11, immediately before the cure time is completed, the suction operation in the peripheral groove 39 of the release film F through the first ventilation hole 39a by the air suction / discharge device 17a is started. In addition, you may perform adsorption | suction operation | movement of the release film F through the 2nd ventilation hole 38a by the air suction / discharge apparatus 17b. At the same time, the tension is improved on the upstream side and the downstream side in the transport direction so as to wind up the release film F of the transport device that transports the release film F between the reels. Furthermore, the vacuum space formed by a vacuum suction device (not shown) in the mold mold 6 which is closed is vacuum broken.

  When the curing time is completed, the mold opening operation of the mold 6 is started. That is, the upper mold 35 is raised by operating the press drive mechanism. At this time, the suction operation in the peripheral groove 39 of the release film F through the first ventilation hole 39a by the air suction / discharge device 17a continues. Therefore, the release film F is peeled from the molded product 33 as the upper die 35 is raised while being adsorbed by the lower die 36.

  Next, an air ejection operation by the air intake / exhaust device 17b is started. As shown in FIG. 12, the air intake / exhaust device 17a continues the air suction operation in the circumferential groove 39 through the first vent hole 39a, and the air intake / exhaust device 17b performs the air ejection operation through the second vent hole 38a. It is. For this reason, the lease film F starts to peel from the lower mold clamping surface.

  Next, as shown in FIG. 13, the mold opening operation of the mold 6 is advanced, and the film support pins 27 protruding from the upper mold clamping surface as the upper mold 35 is raised remain in contact with the release film F. The lift of the release film F peeled off from the lower mold 36 is suppressed.

In FIG. 14, when the mold opening operation of the mold 6 further proceeds, the release film F peeled off from the lower mold 36 as the air is blown from the lower mold clamping surface including the first cavity concave portion 37a is expanded in a balloon shape. Peel from mold 36. When the release film F is lifted, the film support pins 27 are pressed against the lower mold surface. Further, when the mold 6 is opened, air is jetted from the third ventilation hole provided in the air blow block provided in the lower mold 36 toward the molded product 33 and the unnecessary resin 34 connected thereto.
Thus, when the mold 6 is opened, not only the molded product 33 but also the unnecessary resin 34 including the molded product cull and the molded product runner are jetted and cooled, thereby cooling the molded product 33. Release can be promoted.

  The air ejection from the lower mold 36 and the air ejection from the air block continue until the mold opening ends. Note that the suction operation through the first vent 39a of the air suction / discharge device 17a may be stopped after a predetermined time has elapsed after the start of the air ejection operation by the air suction / discharge device 17b. Thus, the mold release operation of the molded product 33 is completed.

In the above-described embodiment, not only when the workpieces W arranged in a matrix on the substrate 2 are resin-molded for each cavity, but also applied to a product of a type in which a molded product including convex portions is collectively molded with a mold resin. be able to. Moreover, although the case where resin molding of the light-emitting device (LED) was demonstrated, if it is a molded article which has a convex part, it will not be limited to this, You may use when resin-sealing a semiconductor element.
The present invention is particularly effective for a resin molding apparatus and a resin molding method for molding a light emitting device in which LED lens portions 4 (convex portions) are arranged at a high density, for example, at a pitch of 0.2 mm on a substrate 2 as a work W. .

  W Work F Release film 1 Light emitting element 2 Substrate 3 Resin base 4 Lens part 6 Mold 7, 36 Lower mold 8, 35 Upper mold 9 Upper mold base 10 Upper mold chase block 11 Upper mold insert 11 a Upper mold 11 b Upper Mold runner 12 Upper mold cavity insert 12a Upper mold runner gate 12b Communicating runner 13a, 37a First cavity recess 13b, 37b Second cavity recess 13c, 13e, 18a, 18b, 38a Second vent 13d Groove 14, 15 Upper Mold end block 16, 39 Circumferential groove 16a, 39a First vent hole 17a, 17b Air intake / exhaust device 19 Upper mold seal ring 20 Lower mold base 21 Lower mold chase block 22 Lower mold center insert 23 Lower mold insert 24 DOO 25 plunger 26 ejector pin 27 film support pin 29 the lower die end block 30 and 31 air blow block 32 lower seal ring 33 molded article 34 unnecessary resin 34a molded article cull 34b moldings runners

Claims (7)

The workpiece clamped by the mold is resin molded, and when the mold is opened, the molded product after the resin mold is released from the mold,
The mold is
One mold for holding the workpiece;
A cavity recess is formed on the mold clamping surface, and the mold clamping surface including the cavity recess is covered with a release film, and the other mold surrounds the cavity recess. A first vent hole opened in a circumferential groove formed facing the workpiece, and air is sucked to adsorb the release film to the mold clamping surface or air is blown to remove the release film from the mold A plurality of second vent holes are provided in the mold clamping surface that can be separated from the mold clamping surface;
The one mold is provided with a film support member that is constantly urged so as to press against the release film ,
The mold is opened in a state where the tension of the release film is improved and air is sucked from the first vent hole so that the release film is adsorbed in the circumferential groove, and after the mold opening operation starts, the second The resin mold apparatus is characterized in that air is ejected from the air vents to release the release film from the other mold surface. After the mold opening operation of the mold is started, air is blown out from the plurality of second air holes provided in the cavity recesses and on the film suction surfaces outside the cavity recesses to inflate the release film, thereby The resin mold apparatus of Claim 1 made to peel from a metal mold | die surface . The said film support member supports the said release film peeled off from said other metal mold | die surface and the said molded product, and the amount of protrusions increased as mold opening progressed with contact | abutting to the said release film. resin molding apparatus according to claim 2, wherein. The mold clamping surface of the other mold is provided with a plurality of third vent holes for ejecting air together with the mold opening operation toward the molded product and unnecessary resin connected thereto when the mold is opened. The resin mold apparatus of any one of Claim 1 thru | or 3. A step of resin-molding the molded product by closing the mold of one mold holding the workpiece and the mold of the mold clamping surface including the cavity recess covered with the release film; and
Improving the tension of the release film before starting the mold opening after the resin molding;
Before opening the mold, opening the mold while adsorbing the release film in a circumferential groove formed around the cavity recess of the other mold; and
With the release film adsorbed in the circumferential groove, air is blown from the other mold clamping surface to inflate the release film and peel from the other mold surface;
A step of opening the mold and supporting the release film peeled off from the other mold surface while the support member protruding from the one mold clamping surface is in contact with the release film; ,
A resin molding method comprising: The resin molding method according to claim 5, wherein the mold is opened while the release film is adsorbed in the peripheral groove and the cavity recess of the other mold before the mold is opened . While opening the mold, the other mold is inflated by blowing air from a plurality of second vent holes provided in the cavity recesses and outside the cavity recesses. The resin molding method of Claim 5 or Claim 6 made to peel from a clamp surface .

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