JP3435092B2 - Resin sealing mold for semiconductor element and resin sealing method for semiconductor element - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element resin encapsulation mold for encapsulating a semiconductor element with a synthetic resin and a method for encapsulating a semiconductor element with a resin.

[0002]

2. Description of the Related Art Generally, in a conventional resin-sealed mold for a semiconductor element, as shown in FIG. 3A, for example, a semiconductor element 10 placed in a cavity 17 of a mold 1 is placed in a lower mold 2. It is mounted on the interposer 4 of No. 3, and the molten resin is injected there. As shown in FIG. 3B, when the molten resin is cured, the mold portion 3 of the semiconductor package is formed.

Since the mold part 3 has a property of closely adhering to the mold due to its characteristic, it is necessary to specially provide a releasing mechanism for removing the mold part 3 from the mold 1. Conventionally, as a mold release mechanism, a system using a plurality of eject pins 5 provided in the upper mold 1 as shown in FIG. 3 and Japanese Patent Laid-Open No. 7-214600, and a mold release shown in FIG. 4 and Japanese Patent Laid-Open No. 9-117931. The method using the film 6 has been used. A mold releasing method using the eject pin 5 will be described with reference to FIG. First,
A plurality of eject pins 5 are arranged in the upper mold 1 having the cavity 17 formed therein. The eject pin 5 is shown in FIG.
As shown in FIG. 3B, when the resin is injection-molded, it is retracted from the cavity 17, and after the resin is cured, the mold 3 part molded in the mold as shown in FIG. While pressing downward with 5, press the upper mold 1 with arrow A
When the mold is lifted in the direction, the mold 3 part comes off the upper mold 1, and the mold release is completed (see FIG. 3D).

Next, with reference to FIG. 4, a method of resin-sealing a semiconductor element using the release film 6 will be described. A vacuum suction hole 9 is formed in the upper mold 1 in which the cavity 17 is formed, and is connected to a suction device (not shown). A film supply reel 7 is provided at one end of the mold, and a film take-up reel 8 is provided at the other end. The release film 6 supplied by the film supply reel 7 is sucked and fixed along the cavity 17 of the upper mold 1 by the vacuum suction hole 9 provided in the upper mold 1 (see FIG. )reference). After closing the molds 1 and 2 in this state, the cavity 1
The molten resin is filled in 7 (FIG. 3B). In this method, the mold release film 6 is inserted between the mold 3 and the upper mold 1 to prevent the mold 3 from directly contacting the upper mold 1. Since the release film 6 does not adhere to the mold 3 part due to its characteristics, the mold 3 part is detached from the release film 6 when the mold is opened, and the release is completed (see FIG. 3C). The release film 6 used once is
The film is taken up by the film take-up reel 8 and new release film 6 is sequentially supplied from the film supply reel 7. Further, since the lower mold 2 and the semiconductor element 10 are arranged via the interposer 4, they do not come into close contact with each other.
Further, as disclosed in Japanese Patent Laid-Open No. 3-193427, there has been proposed a method of releasing the mold from the mold only by air.

[0005]

However, the conventional resin encapsulation mold for semiconductor elements and the conventional resin encapsulation method for semiconductor elements as described above have the following problems, respectively. For example, in the method of releasing from the mold with the eject pins 5, there is a drawback that the structure of the mold becomes complicated because a plurality of eject pins 5 are built in the mold 1. Further, since stress concentrates at the contact portion between the mold 3 and the eject pin 5, the semiconductor element 1 near the eject pin 1
There were cases where cracks occurred at 0. Further, in a method in which a plurality of semiconductor elements are sealed with resin at one time and then cut into individual chips, the eject pin 5 is attached to the mold 3.
Are abutted with each other to generate a pin mark, and the tip of the chip not hit by the eject pin has a different outer shape, which causes a problem in the manufacturing process. Further, when the marks of the eject pins 5 are left on the surface of the mold 3, there is a problem that a printable region without pin marks is reduced.

On the other hand, the method using the release film 6 has a drawback that the running cost becomes high because the release film 6 is consumed each time. Further, the release film 6 is wrinkled, and the wrinkles cause a defective appearance on the surface of the mold 3. Further, there is a drawback that the apparatus becomes complicated because a mechanism for supplying and winding the release film 6 is required. Also, the release film 6
Since it was attached to the upper mold 1 by vacuum adsorption, it was not possible to adopt an encapsulation method such as deaeration molding for controlling the air pressure in the mold.

Further, when the mold portion is thin and large, when the mold is released from the mold only by air, the mold is deformed and released, so that a crack occurs in the sealed semiconductor element. Further, an eject pin is required as an air inlet, and it is difficult to effectively release the mold only with air.

An object of the present invention is to improve the above-mentioned drawbacks of the prior art, and for a semiconductor device which does not require a plurality of eject pins in a mold and does not leave a mark of eject pins or a wrinkle of a film. A resin-sealing die and a method for resin-sealing a semiconductor element.

[0009]

In order to achieve the above-mentioned object, the present invention adopts the following basic technical constitution. That is, as a first mode of the resin-sealed mold for a semiconductor element according to the present invention, a semiconductor element in which a molten resin is introduced into the mold and the semiconductor element mounted inside the mold is resin-sealed. in use the resin-sealing mold, the upper mold having a second air inlet for introducing the compressed air inside the mold, discharging the compressed air from the second air inlet inside the mold A discharge port provided in the upper mold for tightening, and a first air for introducing compressed air into the mold.
With the introduction port, a lower mold provided on the lower side of the upper mold, the first discharge ports compressed air from the air inlet provided on the lower mold allowed to discharge within said mold and , An intermediate mold provided between the upper mold and the lower mold and having a cavity, and a middle mold for guiding compressed air from the discharge port of the lower mold into the mold. and passage, said passage
A gap provided in the intermediate mold for introducing compressed air from the passage into the mold, a thin plate disposed between the upper mold and the intermediate mold, and introduced through the second air introduction port. A first sealing member provided between the upper mold and the thin plate for confining the compressed air that has been compressed into a region sandwiched between the upper mold and the thin plate, and from the first air inlet port. A second seal member provided between the intermediate mold and the thin plate for confining the introduced compressed air in a region sandwiched between the intermediate mold and the thin plate, the upper mold and the intermediate mold. And an urging means for urging the upper die and the intermediate die in a direction in which the upper die and the intermediate die are separated from each other. The biasing means is a spring member, and in the third aspect, the thin plate is And characterized in that sex deformed, or, a fourth aspect is characterized in the provision of the ejector pin on said mold. As a first aspect of the resin sealing method for a semiconductor element according to the present invention, a semiconductor element in which a molten resin is introduced into a mold and the semiconductor element mounted inside the mold is resin-sealed. A second method, which is a resin sealing method, in which compressed air is introduced into the mold.
An upper die provided with an arc introduction port , a discharge port provided in the upper die for discharging compressed air from the second air introduction port into the die, and an inside of the die. comprising a first air inlet for introducing compressed air, allowed to discharge and the lower mold provided on the lower side of the upper mold, the compressed air from the first air inlet inside the mold the A discharge port provided in the lower mold, and arranged between the upper mold and the lower mold,
An intermediate die having a cavity, to guide the compressed air from the lower mold of the discharge port inside the mold, the passage provided in said intermediate form, introducing compressed air from said passageway inside the mold The gap provided in the intermediate mold, the thin plate disposed between the upper mold and the intermediate mold, and the second air guide.
A first sealing member provided between the upper mold and the thin plate for confining compressed air introduced from an inlet into a region sandwiched between the upper mold and the thin plate, and the first air.
-A second sealing member provided between the intermediate mold and the thin plate for confining the compressed air introduced from the introduction port in the region sandwiched between the intermediate mold and the thin plate, and the upper mold. In a resin sealing method for a semiconductor element, which is provided between the intermediate mold and a spring member for urging the upper mold and the intermediate mold in a direction separating from each other, a method of resin sealing a semiconductor element, comprising: An injection step of injecting a molten resin around the semiconductor element placed on it, and a step of slightly raising the upper mold after curing the molten resin to form a gap between the thin plate and the upper mold. , introducing a first air inlet port or <br/> et compressed air of the lower mold, and the thin resin by compressed air ejected from the first gap of the intermediate mold in communication with the air inlet First peeling step of peeling off the The second supply compressed air from the air inlet was, which is characterized by comprising a second separation step which allowed to peel the resin from the intermediate mold by bending the sheet, or, second In the aspect, the step of forming a gap between the thin plate and the upper die is performed by the spring member, and the third aspect is that the resin is peeled from the intermediate die. The peeling step of 2 is characterized in that it is carried out by continuously applying air pressure in a pulsed manner a plurality of times.
4 aspects, an upper mold and a lower mold having a releasing mechanism, an intermediate mold having a cavity, which is arranged between the upper and lower molds, and a thin plate arranged between the upper mold and the intermediate mold. A resin encapsulation method for a semiconductor element using a die including: an injection step of injecting a molten resin around a semiconductor element placed on an interposer in a cavity; and an upper die after curing the resin. A process of slightly raising it to create a gap between the thin plate and the upper mold,
Compressed air is introduced from the first air inlet of the lower mold,
By projecting the first peeling step of peeling sequentially draw said thin plate and a resin by compressed air ejected from the gap of the intermediate mold which communicates with the first air inlet, the eject pin disposed in the upper die, A second peeling step of bending the thin plate and peeling the resin from the intermediate mold is performed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In order to solve the problems in the prior art as described above, a resin-sealed mold for a semiconductor element of the present invention comprises an upper mold having a compressed air discharge port, and a compressed air mold. A lower mold having a discharge port, a middle mold having a cavity and arranged between the upper and lower molds, a thin plate arranged between the upper mold and the middle mold via a seal member, Since the urging means is provided between the mold and the intermediate mold to urge the mold and the intermediate mold away from each other, the mold can be removed from the mold without generating eject pin marks or cracks in the mold part. Can be released.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A concrete structure of a resin element mold for a semiconductor device according to the present invention will be described below with reference to the drawings. Figure 1
(A)-(D) is explanatory drawing which shows the manufacturing order of the semiconductor device by the resin element mold for semiconductor elements which is one Example of this invention. The semiconductor element resin-sealed mold includes an upper mold 1 having a second air introduction port 14 for supplying compressed air and a discharge port 18, and a first air introduction port 1 for supplying compressed air.
A lower mold 2 with two and the discharge port 19, a cavity 17 that will be disposed between the upper and lower molds, the intermediate die 2 having a gap 20
1 and the seal member 22a between the upper die 1 and the intermediate die 21.
a thin plate 16 disposed via d, an upper mold 1 and an intermediate mold 2
And a spring member 15 that is disposed between the spring and the spring to urge the two in a direction to separate them.

The discharge port 18 formed in the upper mold 1 faces the thin plate 16 in a relatively wide area. Also, the spring 15
Are disposed in the recesses 1b formed at both ends of the upper mold 1, and urge the upper mold 1 and the lower mold 2 in a direction to separate them.

The thin plate 16 forms a cavity 17 together with the intermediate mold 21, and contacts the upper surface of the mold 3. Spring 15
When the upper mold 1 rises, the intermediate mold 21 is pushed down to form a gap between the upper mold 1 and the thin plate 16 to move. The first air introduction port 12 formed in the lower mold 2 communicates with the passage 21a of the intermediate mold 21 through the discharge port 19 and is connected to the gap 20 below the thin plate 16. Then, high pressure air can be supplied to the gap from the outside of the mold.

The second air introduction port 14 is connected to the ejection port 18 on the upper side of the thin plate 16 and supplies high pressure air to the ejection port 18 from the outside of the mold. Seal members 11a-11
d prevents the air pressure 13 in the gap above and below the thin plate 16 from decreasing.

Next, with reference to FIGS. 1 and 2, a resin encapsulating method using the resin encapsulating mold for semiconductor elements of the present invention will be described. The upper die 1, the lower die 2 and the intermediate die 21 are closed, and a semiconductor element is placed on the interposer 4 in a cavity 17 formed inside. FIG. 1A shows a procedure of injecting a molten resin around the semiconductor element and taking out the cured mold 3. First, compressed air is supplied from the first air introduction port 12 and the air pressure 13 is applied to a part of the thin plate 16 to slightly raise the upper mold 1 as shown in FIG. 1 (B).

When the upper die 1 is raised, a gap is formed between the thin plate 16 and the upper die 1 by the urging force of the spring 15. At this time, the sealing properties of the thin plate 16 and the upper mold 1 and the intermediate mold 21 are maintained by the seal members 22a to 22d. In this state, when compressed air is injected from the first air inlet 12, the thin plate 16 gradually receives an upward force and elastically deforms from the right side in the figure in which the gap 20 exists as shown in FIG. 1 (C).
The high-pressure air flows into the gap created by the elastic deformation of the thin plate 16 and is separated from the mold 3 by the air pressure 13.
In FIG. 1D, the thin plate 16 is completely separated from the upper surface of the mold 3.

Next, as shown in FIG. 2 (F), compressed air is supplied from the second air introduction port 14 of the upper mold 1. Then, the thin plate 16 is elastically deformed by the downward force by the air pressure 13. The elastically deformed thin plate 16 presses the upper surface of the mold 3 downward.

In this state, when the upper die 1 is slightly raised, the thin plate 16 is elastically deformed and the mold 3 and the interposer 4 are pressed downward from the opening of the intermediate die 21.
The side surface of the mold 3 is separated from the intermediate mold 21, and the mold release is completed.
At this time, if the air pressure 13 is applied in a pulse shape, the mold release can be more effectively performed.

When the upper die 1 is provided with an eject pin as a peeling mechanism, the upper die 1 is raised, compressed air is injected from the first air inlet 12, and the thin plate 16 is elastically deformed to mold. After peeling from 3, the thin plate 16 is curved in the direction opposite to the first peeling step by projecting the eject pin of the upper mold 1. By curving the thin plate 16 in the direction opposite to that of the first peeling step, the side surface of the mold 3 has the intermediate mold 2
The mold release from 1 is completed.

Next, a method for sealing the semiconductor element with resin according to the present invention will be described. First, an upper die 1 and a lower die 2 having a discharge port for compressed air, an intermediate die 21 having a cavity and arranged between the upper and lower dies, and an upper die 1 and an intermediate die 2 are provided. A resin encapsulation method for a semiconductor element, which uses a mold including a thin plate 16 arranged via a seal member 22,
In the injection process, the interposer 4 inside the cavity 17
The melted resin is injected around the semiconductor element placed on.

Next, in the step of forming a gap, the upper mold 1 is slightly lifted after the resin is cured to form a gap between the thin plate 16 and the upper mold 1 (see FIG. 1B). In addition, the compressed air is introduced from the first air introduction port 12 of the lower mold 2 in the first peeling step, and the intermediate mold 21 communicating with the first air introduction port 12 is introduced.
The thin plate 16 and the mold 3 are sequentially peeled off by the compressed air ejected from the gap 20. In particular, since a large semiconductor element is peeled off so that it is rolled from one side, it can be effectively peeled off.

In the second peeling step, compressed air is supplied from the second air introduction port 14 formed in the upper mold 1 to produce the thin plate 1.
6 is curved and the mold 3 is separated from the cavity 17 of the intermediate mold 21. As described above, according to the resin sealing method for a semiconductor element of the present invention, since the eject pin is not necessary, there is no possibility that a pin mark or a crack due to an impact of the pin hitting the resin sealing the semiconductor element occurs.

Next, an eject pin is provided as a releasing mechanism for the upper die, a releasing mechanism using compressed air is provided for the lower die, and an intermediate die having a cavity is provided between the upper and lower die.
A resin sealing method for a semiconductor element using a mold provided with a thin plate arranged between an upper mold and an intermediate mold will be described.

First, a molten resin is injected around the semiconductor element mounted on the interposer 4 in the cavity 17 by an injection process.

Next, in the step of forming a gap, the upper mold 1 is slightly lifted after the resin is cured to form a gap between the thin plate 16 and the upper mold 1. Further, in the first peeling step, compressed air is introduced from the first air introduction port 12 of the lower mold 2, and the thin plate 16 is ejected from the gap 20 of the intermediate mold 21 communicating with the first air introduction port 12. And mold 3 are peeled off one after another. In particular, since a large semiconductor element is peeled off so that it is rolled from one side, it can be effectively peeled off.

In the second peeling step, the eject pin disposed on the upper mold 1 is projected to bend the thin plate 16 in the direction opposite to that of the first peeling step, so that the mold 3 is removed from the cavity 17 of the intermediate mold 21. Peel off. As described above, in the method for sealing a semiconductor element with resin according to the present invention, since the eject pin hits the mold through the thin plate 16, there is no pin mark on the resin for sealing the semiconductor element.

The present invention is not limited to the above embodiments, and various design changes can be made based on the technical idea of the present invention.

[0028]

As described above in detail, according to the present invention, the first effect is that the mold is removed from the mold by the pressure of the discharge air and the deformation of the thin plate which is the elastic body. The structure of the mold can be simplified because there is no need to integrate the mold into the mold. Further, since it is not necessary to provide the eject pin at a portion near the semiconductor element inside the mold, the semiconductor element inside the mold is not cracked. Further, since the mark of the eject pin does not remain on the surface of the mold, the marking area can be enlarged.

Since no release film is used,
The running cost and the manufacturing cost of the device can be reduced. Further, an encapsulation method such as deaeration molding which controls the air pressure in the mold can be adopted. Further, since the release film is not used, the appearance of the mold surface due to the wrinkling of the film does not occur.

[Brief description of drawings]

1A to 1D are explanatory views showing a manufacturing sequence of a semiconductor device using a resin element mold for a semiconductor element, which is an embodiment of the present invention.

2 (E) to 2 (H) are explanatory views showing a continuation of the manufacturing sequence of the semiconductor device shown in FIG.

3A to 3D are explanatory views showing a manufacturing sequence of a semiconductor device by a conventional resin-sealing mold for a semiconductor element.

4A to 4C are explanatory views showing a manufacturing sequence of a semiconductor device by a resin element mold for a semiconductor element using a conventional release film.

[Explanation of symbols]

1 Upper mold 2 Lower mold 3 mold 4 Interposer 5 eject pins 6 Release film 7 Film supply reel 8 film take-up reel 9 Vacuum suction hole 10 Semiconductor element 11 seal 12 First air inlet 13 Air pressure 14 Second air inlet 15 spring 16 thin plates 17 cavities 18, 19 outlet 20 gaps 21 Intermediate type 21a passage 22a-d seal member

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ identification code FI B29L 31:34 B29L 31:34 (58) Fields investigated (Int.Cl. ⁷ , DB name) B29C 45/00-45/84 H01L 21/56

Claims (8)

(57) [Claims] 1. A method in which a molten resin is introduced into a die to form the die
A semiconductor element in which a semiconductor element mounted inside a mold is resin-sealed
Resin mold for Introduce compressed air into the moldSecond air introduction
mouthAn upper die havingSecond air inletPressure from
Installed in the upper mold that discharges compressed air into the mold.
Introduce compressed air into the injection outlet and inside the mold.First
1 air inletIs provided below the upper mold
Lower mold and aboveFirst air inletCompressed air from
Discharge provided in the lower mold for discharging the inside of the mold
A cavity is provided between the mouth and the upper die and the lower die.
And a compression die from the discharge port of the lower die.
Provided in the intermediate mold to guide the arch into the moldaisle
And the aboveaisleIntroduce compressed air from the inside of the mold
Provided in the intermediate moldGapAnd the upper die and the intermediate die
A thin plate disposed between and,Second air inletOr
The compressed air introduced from above is sandwiched between the upper mold and the thin plate.
Between the upper mold and the thin plate in order to confine it in a closed area.
A first seal member provided betweenFirst air introduction
mouthCompressed air introduced from
The intermediate mold and the thin plate for confining in the sandwiched area.
A second seal member provided between the upper mold and the second mold;
It is arranged between the intermediate mold and the upper mold and the intermediate mold.
Urging means for urging in a direction separating from each other
A resin encapsulating mold for a semiconductor element, which is characterized by: 2. The resin-sealed mold for a semiconductor element according to claim 1, wherein the biasing means is a spring member. 3. The resin-sealed mold for a semiconductor element according to claim 1, wherein the thin plate is elastically deformed. 4. The resin-molded mold for a semiconductor element according to claim 1, wherein an eject pin is provided on the upper mold. 5. The molten resin is introduced into the mold to form the metal mold.
A semiconductor element in which a semiconductor element mounted inside a mold is resin-sealed
The resin sealing method of Introduce compressed air into the moldSecond air introduction
mouthAn upper die havingSecond air inletPressure from
Installed in the upper mold that discharges compressed air into the mold.
Introduce compressed air into the injection outlet and inside the mold.First
1 air inletIs provided below the upper mold
Lower mold and aboveFirst air inletCompressed air from
Discharge provided in the lower mold for discharging the inside of the mold
A cavity is provided between the mouth and the upper die and the lower die.
And a compression die from the discharge port of the lower die.
Provided in the intermediate mold to guide the arch into the moldaisle
And the aboveaisleIntroduce compressed air from the inside of the mold
Provided in the intermediate moldGapAnd the upper die and the intermediate die
A thin plate disposed between and,Second air inletOr
The compressed air introduced from above is sandwiched between the upper mold and the thin plate.
Between the upper mold and the thin plate in order to confine it in a closed area.
A first seal member provided betweenFirst air introduction
mouthCompressed air introduced from
The intermediate mold and the thin plate for confining in the sandwiched area.
A second seal member provided between the upper mold and the second mold;
It is arranged between the intermediate mold and the upper mold and the intermediate mold.
A semi-conductor having a spring member for urging the spring members in directions away from each other.
In the resin sealing method of the body element, A semi-conductor mounted on the interposer in the cavity
An injection step of injecting molten resin around the body element, After curing the molten resin, slightly raise the upper mold,
The process of making a gap between the thin plate and the upper mold, Of the lower moldFirst air inletIntroduce compressed air from
The aboveFirst air inletOf the intermediate type in communication withGap
whileCompressed air ejected from the thin plate and the resin in order
The first peeling step of peeling off next, Formed on the upper moldSecond air inletFrom compression d
Is supplied to the thin plate to bend the thin plate from the intermediate mold.
It is characterized by comprising a second peeling step for peeling off the fat.
A method for sealing a semiconductor element with a resin. 6. The resin encapsulation method for a semiconductor element according to claim 5, wherein the step of forming a gap between the thin plate and the upper die is performed by the spring member. 7. The second peeling step of peeling the resin from the intermediate mold is performed by continuously applying air pressure in a pulsed manner a plurality of times. Resin encapsulation method for semiconductor element. 8. An upper die and a lower die having a releasing mechanism,
A method of resin sealing a semiconductor element using an intermediate die having a cavity disposed between upper and lower dies, and a die having a thin plate disposed between an upper die and an intermediate die, An injection step of injecting a molten resin around the semiconductor element placed on the interposer in the cavity, and a step of slightly raising the upper mold after curing the resin to form a gap between the thin plate and the upper mold. and introducing compressed air from the first air inlet of the lower mold, the first peeling step of peeling sequentially draw said thin plate and a resin by compressed air ejected from the gap of the intermediate mold in communication with said first air inlet And a second peeling step of bending the thin plate to peel the resin from the intermediate die by projecting the eject pin arranged on the upper die, the resin encapsulating method for a semiconductor element. .