JP6416996B1 - Sealing type for resin sealing equipment - Google Patents

Abstract

The present invention provides a sealing mold for a resin sealing device capable of sealing an electronic component with a resin by properly exposing an exposed portion using a film appropriately.
A sealing mold for a resin sealing device of the present invention includes a first mold attached from one of the objects to be sealed and a second mold attached from the other of the objects to be sealed, paired with the first mold. A second formwork to be combined, the sealing object has an electronic component and an exposed member laminated thereon, and the first formwork is resin-sealed around the sealing object A first recess that forms part of the space; the second mold has an outer mold and an intermediate mold; the intermediate mold has a second recess that is paired with the first recess; The intermediate mold is combined with the first mold frame via the sealing object, and the external mold has a convex portion to be inserted into the insertion hole. In combination, the second concave portion forms a part of the resin sealing space on the outer periphery of the object to be sealed, and the surface of the convex portion (the convex portion surface) substantially coincides with the exposed surface of the exposed member.
[Selection] Figure 9

Description

  The present invention relates to a sealing mold for a resin sealing device that is used in a resin sealing device in which an electronic component seals the outside with resin and seals the remainder with resin while exposing a part of the electronic component.

  Many electronic devices, measuring devices, electrical devices, and transportation devices include an electronic board that processes electrical signals. Many electronic components such as semiconductor elements and integrated circuits are mounted on these electronic substrates. A single semiconductor element, a semiconductor integrated element such as a microprocessor, or a power element using a high voltage is mounted on an electronic substrate as an electronic component.

  An electronic board on which electronic components are mounted operates by being stored in an electronic device or a measuring device. At this time, some of the mounted electronic components are not preferable when exposed on the electronic substrate. In some cases, it is necessary that the electronic component is sealed with a resin in order to improve durability and compatibility with impacts.

  As described above, a resin sealing device that seals an electronic component (single or plural) mounted on an electronic substrate with a resin is used in various situations. A normal resin sealing device completely seals an electronic component mounted on an electronic substrate with a resin. Of course, a plurality of different types of electronic components are mounted on the electronic substrate, and some or all of them may be sealed with resin.

  At this time, all the electronic components may be sealed with resin, but some electronic components are often sealed with resin. Resin is often encapsulated in electronic parts that are large and require more adaptability to external impacts, such as semiconductor integrated circuits and power semiconductor elements.

  Here, the electronic component sealed with the resin may be preliminarily sealed with the resin before being mounted on the electronic substrate together with other electronic components. Or after mounting on an electronic substrate with other electronic components etc., only about the said electronic components may be sealed with resin. In this manner, the final electronic substrate is in a state where only necessary electronic components are sealed with resin.

  Normally, the entire front and back surfaces of an electronic component that needs to be sealed with resin are sealed with resin. This is to ensure the protection of electronic components.

  On the other hand, a heat radiating element (a heat sink, a heat radiating plate, a heat pipe, etc.) and a sensor element may be laminated on the surface of the electronic component. In such a case, a heat dissipation element and a sensor element are attached on an electronic component such as a semiconductor integrated circuit. As an example, a heat sink is stacked on a microprocessor. This heat sink may be configured to have fins, but there may be a flat plate without fins. As described above, some electronic components may include a heat dissipation member or a sensor element.

  Even if such a heat radiating member or sensor element is provided in an electronic component that needs to be sealed with a resin, its surface needs not to be sealed with a resin. That is, when the electronic component is sealed with a resin, it is necessary to expose the surface of the laminated heat dissipation member and sensor element without being sealed with the resin. This is because the heat radiation member and the sensor element can exhibit their functions by exposing the surface. Of course, if sealed with resin, the heat radiating member and the sensor element cannot function due to their properties.

  As described above, in an electronic component in which a heat dissipation member and a sensor element are stacked, resin sealing is required to seal the remaining portion with a resin while exposing the surfaces of the heat dissipation member and the sensor element.

  A resin sealing device seals an electronic component with a resin by putting an electronic component to be sealed into a sealing mold and injecting a resin into the sealing mold. At this time, the sealing mold includes an upper mold and an external mold, and the electronic component is sandwiched between the upper mold and the external mold. A space is generated around the sandwiched electronic component by a combination of the upper mold and the external mold. By injecting resin into this space, the periphery of the electronic component is sealed with resin.

  However, when the resin is poured into the space generated by the combination of the upper mold and the external mold, the entire front and back surfaces of the electronic component are sealed with the resin. As described above, when heat dissipation members and sensor elements are stacked on the electronic component, these surfaces are sealed with resin.

  For this reason, various techniques have been proposed in order to expose the surfaces of the laminated heat dissipation members and sensor elements and seal them with resin. One of them is a method of installing a film on the surface of a heat dissipation member or a sensor element and sandwiching an electronic component between an upper mold and an external mold in a sealing frame. Since the film is installed, the resin does not enter the surface of the heat dissipation member or the sensor element. As a result, even when the resin is injected into the sealed internal space and sealed, the surfaces of the heat dissipation member and the sensor element are exposed and the resin is sealed.

  However, the method of installing this film has the following problems.

  The film is placed between the upper mold and the electronic component, or between the external mold and the electronic component. The upper formwork and the external formwork are combined, and the film is sandwiched together with the electronic components to apply pressure. That is, the film is sandwiched between the electronic component and the formwork.

  At this time, when the thickness of the electronic component is increased, the size of the bent film is increased, and a large load is applied to the film together with the applied pressure. In addition, since a plurality of electronic components are collectively sealed with resin, one film is installed on the plurality of electronic components. At this time, the load applied to the film may vary depending on the location due to fine variations in the thickness and mounting angle of the electronic components.

  When such a strong load or a different load is applied depending on the location, the film may be torn during the resin sealing process. If the film is torn, the resin will adhere to the surfaces of the heat dissipation member and the sensor element. Alternatively, there is a problem that a film remains inside the resin.

  As described above, there are various problems in the configuration in which the film is sandwiched between the electronic component and the mold. In order to cope with such a problem, a technique has been proposed in which an external formwork is divided into two members and a film is sandwiched (see, for example, Patent Document 1).

JP 2004-330697 A

  Patent Document 1 discloses that a lower mold 1A and an upper mold 2A provided opposite to each other in a resin mold, an intermediate mold 3 provided with an opening 4 between the lower mold 1A and the upper mold 2A, and having an opening 4; 4 is provided with a clamp portion 9 provided on the upper die 2A so as to surround the upper die 2 and a film 10 stretched between the upper die 2A and the intermediate die 3. The upper mold 2A is lowered, and the convex part 5 of the upper mold 2A pushes the film 10 with the clamp part 9 sandwiching the film 10 before the clamping is completed, and the upper mold 2A is further lowered to clamp the part 9 While the film 10 is fixed, the convex portion 5 pushes and extends the film 10, and the mold clamping is completed in a state where the chip 12 is pressed through the film 10. Thus, a resin sealing mold is disclosed in which wrinkles 15 and sagging 16 of the film 10 are prevented inside the clamp portion 9 and are eliminated even if they occur.

  Patent Document 1 has three configurations of an upper mold, an external mold, and an intermediate mold, unlike a conventional configuration in which an electronic component and a film are sandwiched between two molds of an upper mold and an external mold. A film is placed on the heat dissipation member laminated on the electronic component, and this film is sandwiched between the intermediate mold and the upper mold. That is, the film is clamped by the middle mold and the upper mold to apply pressure.

  With this configuration, the film is not bent by the thickness of the electronic component, and the problem can be solved by the thickness.

  However, Patent Document 1 has the following problems.

  (Problem 1) The width of the film to be installed is extremely larger than the width of the exposed region to be exposed from the resin sealing such as the heat radiating member. For this reason, the amount of film used increases and the cost increases.

  (Problem 2) As in Problem 1, the width of the film to be installed is large, and both ends in the width direction are strongly pulled by the upper mold and the intermediate mold to be clamped. As a result, a strong load is applied to the film, and problems such as film breakage may occur.

  (Problem 3) When the film is removed from the electronic component after the resin is cured, the entire resin surface is covered with the film. For this reason, it is necessary to apply a pressure by pressing a member against a mounting substrate on which an electronic component without a film is mounted. For this reason, there is a problem that the mounting substrate may be damaged.

  Patent document 1 has such a problem.

  In view of the above problems, an object of the present invention is to provide a sealing mold for a resin sealing device that can properly expose an exposed portion and seal an electronic component with a resin by appropriately using a film. .

In view of the above problems, the sealing mold for the resin sealing device of the present invention is a first mold attached from one of the objects to be sealed;
A second mold that is attached from the other of the objects to be sealed and combined with the first mold in a pair;
The sealing object has an electronic component and an exposed member laminated thereon,
The first mold has a first recess that forms part of the resin sealing space around the object to be sealed,
The second mold has an external mold and an intermediate mold,
The intermediate mold has a second recess paired with the first recess and an insertion hole into which the external mold is inserted.
The intermediate mold is combined with the first mold frame via the sealing object,
The external mold has a convex portion that is inserted into the insertion hole, and is combined with the intermediate mold,
A 2nd recessed part forms a part of resin sealing space in the outer periphery of the sealing target object,
The surface of the convex part (convex part surface) substantially coincides with the exposed surface of the exposed member ,
The film is placed between the outer mold and the intermediate mold,
The width of the film is a width that is slightly larger than the width of the exposed surface,
The film is clamped between the convex part and the insertion hole,
When the intermediate mold is combined with the first mold frame via the object to be sealed, the film is placed between the convex surface and the exposed surface, and the film contacts the exposed surface by the convex portion. you.

  The sealing mold for the resin sealing device of the present invention can be resin-sealed after reliably exposing the surfaces of the heat radiating member and the sensor element laminated on the electronic component. Further, the film installed for exposure is not subjected to an excessive load or a biased load, and the film is hardly damaged. Similarly, since the deformation of the film does not occur, it is possible to prevent the resin from entering the film and adhering to the exposed region in the resin sealing space.

  Moreover, the amount of film used can be reduced, and the material cost and process cost concerning resin sealing can be reduced.

  Further, when the film is released after resin sealing, an excessive load is not applied to the mounting substrate, and deformation and damage of the mounting substrate and electronic components can be prevented.

It is a side view of the electronic component which requires an exposed surface. It is a front view of the mounting board | substrate with which the some electronic component was mounted. It is a side view of the electronic component after resin-sealing. It is a side view of the sealing frame for resin sealing devices in prior art 1. It is a side view of the sealing type of the prior art 2. It is a schematic diagram which shows the state by which the film was installed in the mounting board | substrate in the prior art 2. It is a schematic diagram which shows the mode of the electronic component after resin sealing is complete | finished by the prior art 2. It is a side view which shows the sealing target object in Embodiment 1 of this invention. It is a side view of the sealing type in Embodiment 1 of this invention. It is a front view of the 1st formwork in Embodiment 1 of the present invention. It is a side view which shows the state after this resin sealing. It is a front view which shows the state after resin-sealing. It is a schematic diagram which shows the state which removes the film in Embodiment 1 of this invention. It is a side view of the sealing type in Embodiment 2 of this invention. It is a side view of the sealing type in Embodiment 2 of this invention. It is a side view of the sealing type in the state where the extrusion member in Embodiment 2 of the present invention is inserted. It is a side view of the sealing frame which can hold down and fix a sealing target object with the pressing member in Embodiment 2 of this invention. It is a side view of the sealing type | mold of the structure in which the 1st formwork in Embodiment 2 of this invention is equipped with an external type | mold and an intermediate type | mold. It is a schematic diagram of the resin sealing apparatus in Embodiment 3 of this invention.

The sealing mold for the resin sealing device according to the first invention of the present invention is a first mold frame attached from one of the objects to be sealed;
A second mold that is attached from the other of the objects to be sealed and combined with the first mold in a pair;
The sealing object has an electronic component and an exposed member laminated thereon,
The first mold has a first recess that forms part of the resin sealing space around the object to be sealed,
The second mold has an external mold and an intermediate mold,
The intermediate mold has a second recess paired with the first recess and an insertion hole into which the external mold is inserted.
The intermediate mold is combined with the first mold frame via the sealing object,
The external mold has a convex portion that is inserted into the insertion hole, and is combined with the intermediate mold,
A 2nd recessed part forms a part of resin sealing space in the outer periphery of the sealing target object,
The surface of the convex part (convex part surface) substantially coincides with the exposed surface of the exposed member.

  With this configuration, the exposed surface can be reliably exposed, and problems due to film damage can be prevented. Moreover, since the usage-amount of a film can also be reduced, member cost and manufacturing cost can be reduced.

  In the sealing mold for a resin sealing device according to the second invention of the present invention, in addition to the first invention, a film can be installed between the convex surface and the exposed surface.

  With this configuration, the load and stress applied to the film can be reduced. Also, uneven stress such as bending can be reduced.

  In the sealing mold for a resin sealing device according to the third aspect of the present invention, in addition to the second aspect, the film is sandwiched between the convex surface and the exposed surface.

  This configuration can reduce uneven stress on the film. Further, the resin can be reliably prevented from entering the exposed surface to be exposed.

  In the sealing type for a resin sealing device according to the fourth invention of the present invention, in addition to the second or third invention, the width of the film is substantially the same as the width of the exposed surface or a width that is slightly larger than the exposed surface. It is.

  With this configuration, the amount of film used can be reduced.

  In the sealing mold for a resin sealing device according to the fifth aspect of the present invention, in addition to the fourth aspect, the amount is slightly less than 1 mm at both ends of the exposed surface.

  With this configuration, the amount of film used can be reduced while ensuring the installation of the film.

  The sealing mold for a resin sealing device according to the sixth aspect of the present invention further includes a resin inlet for injecting resin into the resin sealing space in addition to any of the first to fifth aspects of the invention.

  With this configuration, the resin can be easily injected into the resin sealing space.

  In the sealing mold for the resin sealing device according to the seventh invention of the present invention, in addition to any of the second to sixth inventions, the external mold passes the blowing air that presses the film against the exposed surface. Air holes are provided.

  With this configuration, it is possible to increase the degree of adhesion to the exposed surface of the film and prevent the resin from entering.

  In the sealing type for a resin sealing device according to the eighth aspect of the present invention, in addition to the seventh aspect, the air hole assists in taking out the object to be sealed from the resin sealing space. Can be sent.

  With this configuration, the film can be reliably removed.

  In the sealing type for a resin sealing device according to the ninth aspect of the present invention, in addition to the seventh aspect, the air hole can be inserted with an extrusion member that takes out the object to be sealed from the sealing space.

  With this configuration, it is easy to take out from the resin sealing space.

  In the sealing mold for a resin sealing device according to the tenth invention of the present invention, in addition to any of the first to ninth inventions, the first mold frame is a sealing object in the resin sealing space. A pressing member insertion portion capable of inserting a pressing member that holds the pressing member.

  With this configuration, the degree of adhesion with the film can be increased while maintaining the posture of the object to be sealed in the resin sealing space.

  In the sealing mold for a resin sealing device according to the eleventh invention of the present invention, in addition to any of the first to tenth inventions, each of the first mold frame and the second mold frame is a sealing object. It may be arranged either above or below the object, and either may be the upper side.

  With this configuration, it is possible to flexibly match the state of the object to be sealed.

  In the sealing mold for a resin sealing apparatus according to the twelfth aspect of the present invention, in addition to any of the first to eleventh aspects, the first mold also has an external mold and an intermediate mold.

  With this configuration, it is possible to cope with a sealing object mounted on both sides.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Analysis by the inventor)
First, the analysis by the inventor will be described for the prior art and its problems.

(Electronic components that require exposed surfaces)
FIG. 1 is a side view of an electronic component that requires an exposed surface. The electronic component 100 is laminated with an exposed member 101 that needs to expose the surface of a heat radiating member, a sensor element, or the like during resin sealing. The exposed member 101 may be a single element as shown in FIG. 1 or a plurality of elements. When the electronic component 100 is sealed with resin, the exposed surface 103 of the exposed member 101 needs to be exposed. The electronic component 100 is mounted on the electronic substrate 102. The mounting substrate 102 is a lead frame, a resin substrate, or the like.

  FIG. 2 is a front view of a mounting board on which a plurality of electronic components are mounted. The plurality of electronic components 100 are mounted on the mounting substrate 102. In a state where a plurality of electronic components 100 are mounted on the mounting substrate 102, each of the electronic components 100 is resin-sealed simultaneously or sequentially. At this time, as described above, the exposed surface 103 of the exposed member 101 is not covered with the resin and needs to be sealed in a state of being exposed from the resin.

  FIG. 3 is a side view of the electronic component after resin sealing. In this state, the resin layer 200 covers the electronic component 100 in the state shown in FIGS. That is, the periphery of the electronic component 100 is sealed with the resin layer 200. At this time, the periphery of the electronic component 100 is covered with the resin layer 200, but the exposed surface 103 of the exposed member 101 is exposed without the resin layer 200.

  As described above, the exposed surface 103 of the exposed member 101 is exposed and the remaining portion is sealed with the resin layer 200, so that it is possible to realize the durability improvement by the resin sealing and the function of the exposed member 101.

(Prior art 1: Use of film)
The prior art 1 described in the prior art, in which the exposed surface 103 of the exposed member 101 is exposed using a film and resin-sealed, will be described with reference to FIG. FIG. 4 is a side view of a sealing frame for a resin sealing device according to the first prior art. The sealing frame 300 has the structure of the first prior art, and FIG. 4 is shown with the necessary internal structure visible so that the inside can be seen.

  The sealing frame 300 includes a first mold 301 and a second mold 302. Each of the first mold 301 and the second mold 302 has a recess in a region where the electronic component 100 is sandwiched. When the first mold 301 and the second mold 302 are combined to sandwich the electronic component 100, the recesses are also combined to form the sealing space 310. The electronic component 100 is in the sealed space 310 so that the front and back surfaces of the electronic component 100 are sealed with resin together with the exposed member 101 that is laminated.

  At this time, the film 330 is in a state of being installed inside the sealing space 310 and is installed in close contact with the exposed surface 103 of the exposed member 101. When the first mold 301 and the second mold 302 are combined in this installed state, the film 330 is sandwiched between the electronic component 100 (exposed member 101) and the first mold 301 and pressure is applied. (Becomes clamped).

  Resin is injected into the sealing space 310. The injected resin 310 is cured by forming a sealing shape by the pressure of the combination of the first mold 301 and the second mold 302. After the curing, when the first mold 301 and the second mold 302 are removed, the electronic component 100 is taken out with the sealing space 310 sealed with resin. When the electronic component is taken out or thereafter, when the film 330 is removed, the exposed surface 103 of the exposed member 101 is in a state where no resin exists.

  However, the film 330 is sandwiched between the electronic component 100 (and the exposed member 101) and the first mold 301 and is under pressure. The film 330 is pulled. In this state, when resin is injected into the sealing space 310 and the internal pressure is increased, a strong load is applied to the film 330 centering on a portion surrounded by a circle in FIG. This is because the amount of bending of the film 330 increases due to the high height of the electronic component 100 and the exposed member 101. Further, the electronic component 100 and the exposed member 101 vary in thickness, shape, corner angle, and the like, and when the film 330 is pulled, a contact portion with the corner of the exposed member 101 in FIG. In this case, a strong load is applied to the film 330.

  Further, before the resin is injected, the film 330 is stuck to the recess of the first mold 301, but the film 330 is not sufficiently adhered at the corner of the first mold 301 and there is no gap. May occur. Here, when the resin is injected, the resin flows while contacting the surface of the film 330 along the internal shape of the first mold. While the resin is flowing, the portion where the film 330 and the resin are in contact does not stretch.

  Immediately before the injection of the resin is completed in this state, the resin is almost filled inside the film 330, but the bent portion of the film 330 (the portion corresponding to the corner of the first mold 301) and If the corners of the first mold 301 are not in close contact, the corners of the first mold 301 can be in a state where the resin is not completely filled.

  After the injection of the resin is completed, the corners of the first mold 301 are filled with the resin while the film 330 is stretched by the pressure of the resin. However, since the resin in the portion that is in close contact with the film 3300 does not expand uniformly, a load is partially applied to the bent portion of the film 330, and the film 330 is torn at a location that exceeds the extension limit of the bent portion of the film 330. End up.

  In particular, there are various shapes and thicknesses of the electronic component 100 and the exposed member 101, and when the sealing mold 300 tries to cope with these, the film 330 may have different bending amounts depending on each of the electronic components 100. , Load may occur. There is a problem that the film is damaged by such bending and load. This is because the film 330 is sandwiched between the electronic components 100 having different thicknesses, shapes, angles, and other differences and variations. In the first prior art, the exposed surface 103 of the exposed member 101 using the film 330 is exposed. However, it was difficult to completely seal the resin.

  If the film 330 is damaged, the resin injected into the sealing space 310 may enter and adhere to the exposed surface 103, and the resin may remain as burrs at the corners of the exposed surface 103. Of course, it is difficult to release the film 330, which leads to a quality problem of the resin-sealed electronic component 100.

(Prior Art 2: Conventional Technology such as Patent Document 1)
As the second prior art, there is a technique such as Patent Document 1 described above. In this second prior art, the first mold is disassembled into two and the film is sandwiched between them. FIG. 5 is a side view of a sealing type of the second prior art. In the sealing mold 320 of the second prior art, the first mold 301 is separated into an upper mold 303 and an intermediate mold 304. A film 330 is installed between the separated upper mold 303 and intermediate mold 304.

  The upper portion of the sealing space 310 formed by the upper mold 303 and the intermediate mold 304 includes the exposed member 101 laminated with the electronic component 100. At this time, the upper mold 303 faces the exposed surface 103 of the exposed member 101. The film 330 is clamped by being sandwiched between the upper mold 303 and the intermediate mold 304. Since the upper mold 303 and the exposed surface 103 face each other in the clamp, the film 330 is in close contact with the exposed surface 103 in this facing.

  The film 330 is clamped to the upper mold 303 and the intermediate mold 304 as a whole while in close contact with the exposed surface 103. For this reason, compared with the prior art 1 shown in FIG. 4, it is reduced that it is clamped depending on the thickness, shape, angle, etc. of the electronic component 100 or the like. For this reason, the problem of the prior art 1 can be reduced.

  However, as shown in FIG. 5, the width of the film 330 is much larger than the width of the exposed surface 103 of the exposed member 101. As shown in FIG. 2, a plurality of electronic components 100 are arranged on the mounting substrate 102, and when the one row of electronic components 100 are collectively sealed with resin, one film is formed on one row of electronic components 100. 330 is installed. The direction orthogonal to the film rows at this time is the width of the film 330, which is much larger than the width of the exposed surface 103 to be exposed.

  FIG. 6 shows this wide state. FIG. 6 is a schematic diagram showing a state in which a film is installed on the mounting substrate in the second prior art.

  Thus, since the width | variety of the film 330 is large, the usage-amount of the film 330 becomes large, and there exists a problem which material cost and manufacturing cost increase. This is the first problem of the second prior art.

  Further, since the film 330 exists in the width indicated by the arrow in FIG. 5, the film 330 spreads larger than the width of the exposed surface 103 to be exposed and is clamped to the upper mold 303 and the intermediate mold 304. . By this clamp, the film 330 is pulled in the width direction, and a load is applied. This is because the pulling pressure is strongly applied due to the width.

  While avoiding the problems due to the thickness of the electronic component 100 and the like, the conventional technique No. 2 still has a problem that the problem caused by applying a strong or biased load to the film 330 cannot be solved.

  Further, after the sealing mold 320 is removed, as shown in FIG. 7, the film 330 remains and the resin sealing is performed. FIG. 7 is a schematic diagram showing a state of the electronic component after the resin sealing is finished in the second prior art. The electronic component 100 is sealed by the resin layer 200 and the film 330 remains. In order to remove (release) the film 330, the pushing member 350 applies pressure. At this time, as shown in FIG. 5, since the film 330 extends over the entire sealing space 310, the film 330 covers the entire width of the resin layer 200.

  For this reason, in order to release the film 330 from the resin layer 200, it is necessary to apply the extrusion member 350 to the mounting substrate 102 without the film 330. As shown in FIG. If pressure is applied to the mounting substrate 102 with the pushing member 350 in this state, the mounting substrate 102 may be damaged such as bending or bending. In order to prevent this, if the releasability of the film 330 is increased, the resin can easily enter the film 330 and the exposed surface 103 when the resin is injected by sealing with the sealing mold 320 as shown in FIG. There are also concerns. In this case, there also arises a problem that the resin adheres to the exposed surface 103 to be exposed.

  As described above, there is also a problem in the prior art 2 due to the fact that the width of the film 330 is extremely larger than the width of the exposed surface 103 to be exposed.

  The inventor has arrived at the present invention as a result of these analyses.

(Embodiment 1)

(Overview)
The overall outline of the sealing mold for the resin sealing apparatus of the first embodiment (hereinafter, abbreviated as “sealing mold” as necessary) will be described with reference to FIGS. FIG. 8 is a side view showing the object to be sealed in Embodiment 1 of the present invention. FIG. 9 is a side view of the sealing mold according to the first embodiment of the present invention. The state which looked at the sealing type | mold 1 from the side surface is shown. FIG. 9 shows an internal cross-sectional state so that the internal structure and the relationship between the elements of the sealing mold 1 can be understood.

  The sealing mold 1 is used when the electronic component 100 mounted on the mounting substrate 102 and the exposed member 101 laminated thereon are combined and sealed with resin. At this time, the outer periphery of the exposed member 101 and the electronic component 100 are sealed with resin, but the exposed surface 103 of the exposed member 101 needs to be resin-sealed in a state where the resin is exposed without being attached. It is. The electronic component 100 and the exposed member 101 (and a part of the mounting substrate 102) are sealed objects that are resin-sealed by the resin-sealing device.

  The sealing mold 1 includes a first mold 2 and a second mold 3. The first mold 2 is attached from one of the objects to be sealed. In FIG. 9, the electronic component 100 which is a sealing object is attached to the mounting substrate 102 side where it is not mounted. Of course, the reverse is also possible.

  The second mold 3 is attached to the object to be sealed from the other side of the first mold 2. In FIG. 9, it is attached from the electronic component 100 side which is a sealing object. The sealing object can be sealed with resin by sandwiching the sealing object such that the first mold 2 and the second mold 3 face each other.

The first mold 2 has a first recess 21 that forms part of the resin sealing space 11 around the object to be sealed. Since FIG. 9 is a side view, in FIG. 9, the first recess 21 is shown as being recessed below the object to be sealed. Actually, as shown in FIG. 10, the vicinity of the central portion of the first mold 2 is indented, so that the resin-encapsulated space 11 can be formed.
FIG. 10 is a front view of the first mold according to Embodiment 1 of the present invention.

  The second mold 3 has an external mold 5 and an intermediate mold 4. In FIG. 9 which is a side view, a state in which the outer die 5 is on the upper side and the intermediate die 4 is arranged on the lower side is shown. The second mold 3 is composed of an external mold 5 and an intermediate mold 4.

  The intermediate mold 4 has a second recess 41 that is paired with the first recess 21 and an insertion hole 42 into which a part of the external mold is inserted. In FIG. 9, the 2nd recessed part 41 makes a pair with the 1st recessed part 21, and a recessed part is formed in each of the both sides of a sealing target object. The resin-encapsulated space 11 is formed by combining the concave portions (the first concave portion 21 and the second concave portion 41) on both sides.

  The intermediate mold 4 is combined with the first mold frame 2 via (sealing) a sealing object. By this combination, the resin sealed space 11 is formed by the first recess 21 and the second recess 41 as described above.

  The external mold 5 includes a convex portion 51 that is inserted into the insertion hole 42. When the intermediate mold 4 and the external mold 5 are combined, the convex portion 51 is inserted into the insertion hole 42. The convex portion 51 approaches the resin sealing space 11 through the insertion hole 42 and forms a part of the outer periphery of the resin sealing space 11.

  When all are combined, as shown in the side view of FIG. 9, the first concave portion 21 and the second concave portion 41 form the resin sealing space 11, while the outer periphery of a part of the resin sealing space 11 is formed as the convex portion 51. Form. The internal space surrounded by these is the resin sealing space 11, and when the resin is poured therein, the electronic component 100, the exposed member 101, and the mounting substrate 102, which are objects to be sealed, are sealed with the resin. .

  Here, the surface (convex surface) of the convex portion 51 substantially coincides with the exposed surface 103 of the exposed member 101. By substantially matching, the exposed surface 103 of the exposed member 101 is exposed together with the film 330. The exposed surface 103 is a surface to be exposed in the exposed member 101 without being sealed with resin.

  The film 330 is placed between the external mold 5 and the intermediate mold 4. FIG. 9 shows this installation state. Since the film 330 is in such an installation state, the film 330 is installed between the surface of the convex portion 51 and the exposed surface 103.

  Even after the resin is injected into the resin sealing space 11, since the exposed surface 103 is covered with the film 330, the resin does not adhere to the exposed surface 103. When the first mold 2 and the second mold 3 are removed after the final resin is cured, the exposed surface 103 covered with the film 330 does not adhere to the resin and corresponds to the resin sealing space 11. Only the portion to be sealed is in a resin-sealed state.

  FIG. 11 is a side view showing a state after the resin sealing. FIG. 12 is a front view showing a state after resin sealing. When the resin 330 is thus sealed and the film 330 is removed, the resin is not attached to the exposed surface 103, and the object to be sealed is sealed with the resin. Since the exposed surface 103 is exposed, a state in which the function of the exposed member 101 can be realized.

  Here, the film 330 is sandwiched between the external mold 5 and the intermediate mold 4 as shown in FIG. The film 330 is in contact with the exposed surface 103 by the convex portion 51 of the external mold 5. At this time, the convex portion 51 substantially coincides with the exposed surface 103 as described above. “Substantially coincident” means that the shape and area of the convex portion 51 substantially coincide with the shape and area of the exposed surface 103.

  Because of this approximate match, the amount of film 330 that needs to cover the exposed surface 103 may be less than in prior art part 2. As a result, member costs and manufacturing costs can be reduced.

  Further, the film 330 is in contact with the exposed surface 103 only by the width of the convex portion 51. After that, it is clamped between the outer die 5 and the intermediate die 4. Unlike the prior arts 1 and 2, it is reduced that the width is too wide and is pulled in the width direction. For this reason, even if it clamps, the stress added to the film 330 becomes small. As a result, the film 330 is hardly damaged or damaged.

  Further, as shown in FIG. 13, when the film 330 is removed after the first mold 2 and the second mold 3 are removed, the film 330 is different from the prior art 2 in that all of the resin layer 200 is removed. It is not covered. It only covers the exposed surface 103 and its periphery. FIG. 13 is a schematic diagram showing a state in which the film according to Embodiment 1 of the present invention is removed.

  For this reason, a region where the film 330 does not exist remains on the surface of the resin layer 200. In the second prior art described with reference to FIG. 7, the extruding member 350 has to be pressed against the mounting substrate 102 in order to remove the film 330. However, as shown in FIG. 13, in the case of the sealing mold 1 of the first embodiment, the surface of the resin layer 200 where the film 330 does not exist remains, so that the pushing member 400 can be pressed against this region. That's fine. As a result, unnecessary stress is not applied to the mounting substrate 102 when the film 330 is removed.

  As described above, the sealing mold 1 according to the first embodiment eliminates the problems and deficiencies analyzed in the prior arts 1 and 2 and reliably exposes the exposed surface 103 of the exposed member 101. The sealing object can be resin-sealed.

  Next, details of each part will be described.

(First formwork 2)
The first mold 2 constitutes one side of the sealing mold 1. As described above, the first mold 2 has the first recess 21, and the first recess 21 can be combined with the second recess 41 to form the resin-encapsulated space 11.

  The first mold 2 may be formed of various materials such as metal, alloy, ceramics, resin, and wood. Any material can be used as long as durability and strength can be sufficiently realized. Further, since the first mold 2 is used together with the second mold 3, the first mold 2 has a shape and size that can be combined with the second mold 3.

(Second formwork 3)
The second mold 3 is used as a set with the first mold. The second mold 3 may be formed of the same material as the first mold 2. Moreover, the shape and size should just also respond | correspond to the combination with the 1st mold frame 2. FIG.

  The second mold 3 has a combination of the external mold 5 and the intermediate mold 4. By combining these two elements, the film 330 can be clamped with few bends. Since it can clamp with few bends, the load on the film 330 can be reduced.

  Further, the combination of the external mold 5 and the intermediate mold 4 depends on the convex portion 51 and the insertion hole 42. At this time, the size of the insertion hole 42 and the convex portion 51 corresponds to the exposed surface 103 of the exposed member 101 to be exposed. As a result, the film 330 sandwiched between the exposed surface 103 and the convex portion 51 is clamped in a range corresponding to the exposed surface 103. As a result, the load on the film 330 is reduced. Further, as described above, the required amount of the film 330 is reduced.

(Film 330)
As shown in FIG. 9, the film 330 is placed between the external mold 5 and the intermediate mold 4. At this time, the film 330 is placed between the surface of the convex portion 51 and the exposed surface 103. That is, the film 330 is sandwiched and clamped between the surface of the convex portion 51 and the exposed surface 103.

  Here, since the convex portion 51 and the exposed surface 103 are substantially the same, the film 330 is clamped in a range that matches the area of the exposed surface 103. For this reason, the required amount of the film 330 is small. Also, the load due to the clamp is reduced.

  The width of the film 330 installed between the external mold 5 and the intermediate mold 4 is substantially the same as the width of the exposure table 103 or a width that is slightly larger. In FIG. 9 and the like, it is shown as a slightly larger width. By using this width, the amount of film 330 used can be reduced. Further, since the film 330 is sandwiched between the surface of the convex portion 51 and the exposed surface 103, this width is sufficient for the film 330.

  Further, since the film 330 is sandwiched between the convex portion 51 and the exposed surface 103, the bent portion of the film 330 is reduced, and it is possible to reduce the extra stress applied to the film 330.

  Here, the amount is preferably 1 mm or less at each of both ends of the exposed surface 103. It is because the usage-amount of the unnecessary film 330 can be suppressed, although sufficient clamping can be performed because it is 1 mm or less. Moreover, it is because bending pressure and tension pressure from both ends can be reduced.

  By these reductions, the film 330 can be prevented from being broken or floated, and the adhesion of the resin to the exposed surface 103 can be reliably prevented.

  As described above, the sealing mold 1 according to the first embodiment can solve the problems of the conventional techniques 1 and 2. As a result, the manufacturing accuracy can be improved while reducing the cost, and the exposed surface 103 of the exposed member 101 can be reliably exposed to seal the sealing object.

(Embodiment 2)

Next, a second embodiment will be described.
(Resin inlet)
FIG. 14 is a side view of a sealing mold according to the second embodiment of the present invention. The sealing mold 1 shown in FIG. 14 further includes a resin injection port 12 for injecting resin into the resin sealing space 11. Resin is injected from the outside through the resin injection port 12. By injecting the resin, the inside of the resin sealing space 11 is filled with the resin. Resin sealing is completed when the filled resin is cured.

  In FIG. 14, the resin injection port 12 is shown in both the first mold 2 and the second mold 3. As long as the resin sealing space 11 can be filled with resin, the resin injection port 12 may be provided in either the first mold 2 or the second mold 3.

  The resin injection port 12 communicates with the outside so that the resin can be injected from the outside. At this time, the resin injection port 12 may be closed so that the resin sealing space 11 is sealed after the resin is filled.

  The resin injection port 12 may be single or plural. For example, a structure in which a plurality of resin injection ports 12 are provided in the first mold 2 may be used. Further, when provided in the second mold 3, it may be provided in either the external mold 5 or the intermediate mold 4. A resin injection port 12 may be provided at the joint of the external mold 5 and the intermediate mold 4.

(Fixing the film with suction air)
FIG. 15 is a side view of the sealing mold according to the second embodiment of the present invention. In the sealing mold 1 shown in FIG. 15, the external mold 5 includes air holes 13. The air hole 13 communicates with the outside and the inside of the external mold 5 and overlaps a portion where the film 330 is installed. The air holes 13 can pass the blown air. The blown air presses the film 330 against the exposed surface 103.

  By this pressing, the film 330 can reliably contact the exposed surface 103 and prevent the resin from entering the exposed surface 103. As a result, resin sealing can be performed with the exposed surface 103 being reliably exposed.

  The air holes 13 are connected to an external air generator, and blown air generated by the air generator is blown onto the film 330. The number of air holes 13 may be singular or plural.

(Suction air through air holes)
The air holes 13 can send not only blown air but also suction air. By sending suction air, the film 330 is drawn to the external mold 5. The film 330 is easily detached from the exposed surface 103 of the exposed member 101 by being attracted to the external mold 5.

  When the first mold 2 and the second mold 3 are removed, the film 330 needs to be removed. This is because the resin sealing is completed. At this time, the film 330 can be easily detached from the exposed surface 103 because the film 330 is attracted to the external mold 5 by suction air from the outside of the external mold 5. That is, removal of the film 330 can be assisted.

(Insert extruded member)
FIG. 16 is a side view of a sealing mold in a state where an extrusion member is inserted according to the second embodiment of the present invention. The external mold 5 of the sealing mold 1 includes the air holes 13 as described above.

  This air hole 13 can be inserted with an extruding member 14 for taking out the object to be sealed from the resin sealing space 11. FIG. 16 shows a state where the pushing member 14 is inserted. In addition, although the extruding member 14 is inserted into only one of the air holes 13 for easy viewing of the drawing, the extruding member 14 may be inserted into both.

  The pushing member 14 can be inserted into the air hole 13 and reach the exposed member 101. When the exposed member 101 can be reached, the pushing member 14 can push the object to be sealed including the exposed member 101. By pushing, the sealed object after sealing is easily removed from the resin sealing space 11.

(Presser member)
FIG. 17 is a side view of a sealing frame that can hold and fix an object to be sealed by a pressing member according to Embodiment 2 of the present invention.

  It is also preferable that the first mold frame 2 includes a pressing member insertion hole 15 into which a pressing member 16 that presses the object to be sealed in the resin sealing space 11 can be inserted. In FIG. 17, a pressing member insertion hole 15 is provided so that the pressing member 16 can be inserted upward from the lower side of the first mold 2.

  The pressing member 16 is inserted into the pressing member insertion hole 15 and presses the object to be sealed. At this time, if the resin is not injected into the resin sealing space 11, the back side of the mounting substrate 102 is pressed like the pressing member 16 on the left side of FIG. That is, the object to be sealed is pressed directly.

  Conversely, after the resin is injected, the resin is pressed from the surface of the resin after the resin is injected, like the pressing member 16 inserted on the right side of FIG.

  In any case, it is possible to strengthen the fixation of the object to be sealed in the resin sealing space, to prevent deformation of the mounting substrate 102 at the time of resin sealing, and to increase the sealing strength and density of the resin sealing.

(First formwork)
Similarly to the second mold 3, the first mold 2 may be constituted by an external mold and an intermediate mold. In this case, the first mold 2 also has the same configuration as the second mold 3 in FIG. In such a case, it is possible to perform sealing even on an object to be sealed on which the electronic component 100 and the exposed member 101 are mounted vertically as shown in FIG.

  FIG. 18 is a side view of a sealing mold having a configuration in which the first mold according to the second embodiment of the present invention includes an external mold and an intermediate mold.

  As shown in FIG. 18, the first mold 2 also includes an external mold 25 and an intermediate mold 24. With this configuration, even if the electronic component 100 and the exposed member 101 are mounted on the first mold 2 side, the film 330 can be installed, and the exposed surface 103 of the exposed member 101 covered with the film 330 is exposed while the resin sealing is performed. You can stop.

  Details and functions of the external mold 25 and the intermediate mold 24 constituting the first mold 2 are the same as those of the external mold 5 and the intermediate mold 4 constituting the second mold 3.

  In any case of the first and second embodiments, the vertical relationship and the horizontal relationship between the first mold 2 and the second mold 3 may be any.

  As described above, the sealing mold of the second embodiment can improve the accuracy of resin sealing and can improve the level of the processing procedure during sealing.

(Embodiment 3)
Next, Embodiment 3 will be described. FIG. 19 is a schematic diagram of a resin sealing device according to Embodiment 3 of the present invention.

  The resin sealing device 500 includes the sealing mold 1 described in the first and second embodiments, a resin supply unit 510, and a pressure applying unit 520. The sealing mold 1 has the configuration and functions as described in the first and second embodiments. In FIG. 19, an example of the sealing mold 1 is illustrated. However, the present invention is not limited to this example, and some of the reference numerals already described are not shown for easy viewing of the drawing.

  The resin supply unit 510 supplies resin to the resin sealing space 11 through the resin injection port 12. There are various methods for supplying the resin, and it is only necessary to supply the resin by a method capable of filling the resin sealing space 11 with the resin.

  The resin supply unit 510 may be close to the sealing mold 1 or may be remote. What is necessary is just to be decided by the installation place and structure of the resin sealing apparatus 500.

  The pressure applying unit 520 combines the first mold 2 and the second mold 3. By this combination, the resin sealing space 11 is formed and the resin can be prevented from entering the exposed surface 103 covered with the film 330. Since the resin does not enter, the exposed surface 103 can be formed in a state where the exposed surface 103 is finally exposed.

  Although not shown in FIG. 19, it is also preferable that a mechanism for installing the film 330 and the sealing target and various sensors for measuring time and temperature are provided as necessary. It is because the function as the resin sealing device 500 is further expanded by further providing necessary elements.

  The resin sealing device 500 according to the third embodiment has the effects as described in the first and second embodiments, and can solve the problems of the prior arts 1 and 2.

  The resin sealing device and the resin sealing system described in the first to third embodiments are examples for explaining the gist of the present invention, and include modifications and modifications without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Sealing mold 2 1st mold frame 21 1st recessed part 3 2nd mold frame 4 Intermediate | middle mold 41 2nd recessed part 42 Insertion hole 5 External type | mold 51 Convex part 11 Resin sealing space 12 Resin inlet 13 Air hole 14 Extrusion member 15 Holding member insertion hole 16 Holding member 100 Electronic component 101 Exposed member 102 Mounting substrate 103 Exposed surface 200 Resin layer 500 Resin sealing device 510 Resin supply unit 520 Pressure applying unit

Claims (8)

A first formwork attached from one of the objects to be sealed;
A second mold that is attached from the other of the objects to be sealed and combined with the first mold in a pair;
The sealing object has an electronic component and an exposed member laminated thereon,
The first mold has a first recess that forms part of a resin sealing space around the object to be sealed;
The second mold has an external mold and an intermediate mold,
The intermediate mold has a second recess paired with the first recess, and an insertion hole into which the external mold is inserted,
The intermediate mold is combined with the first mold frame through the sealing object,
The external mold has a convex portion inserted into the insertion hole, and is combined with the intermediate mold,
The second recess forms a part of the resin sealing space on the outer periphery of the object to be sealed,
The surface of the convex part (convex part surface) substantially coincides with the exposed surface of the exposed member ,
A film is placed between the external mold and the intermediate mold,
The width of the film is a width that is slightly larger than the width of the exposed surface,
The film is clamped between the convex portion and the insertion hole,
When the intermediate mold is combined with the first mold frame via the sealing object, the film is placed between the convex surface and the exposed surface, and the film is the convex portion wherein contact the exposed surface and opposite to, sealing type resin sealing apparatus by. The small amount is 1mm or less in each of both ends of the exposed surface, the sealing mold for resin sealing apparatus according to claim 1. Further comprising a resin injection port for injecting a resin into the resin sealing space, according to claim 1 or 2 sealing type resin sealing apparatus according. The external mold includes air holes through which blown air that presses the film against the exposed surface is passed ,
The air hole inserts an extruding member that is capable of sending suction air and assists in taking out the sealing object from the resin sealing space and takes out the sealing object from the resin sealing space. can Ru der, sealing type resin sealing apparatus according to any one of claims 1 to 3. The first-type frame, the resin sealing in the space the sealing object can be inserted pressing member for pressing a pressing member insertion portion includes, for resin sealing apparatus according to any one of claims 1 to 4 Sealing type. Each of the said 1st formwork and the said 2nd formwork is arrange | positioned in any one of the upper and lower sides of the said sealing object, and any may be an upper side, The resin sealing in any one of Claim 1 to 5 Sealing type for fastening devices. The sealing mold for a resin sealing device according to any one of claims 1 to 6 , wherein the first mold also includes the external mold and the intermediate mold. A sealing mold for a resin sealing device according to any one of claims 1 to 7 ,
A resin supply section for supplying resin to the resin sealing space;
A resin sealing device comprising: a pressure applying unit that applies pressure to the first mold and the second mold.