JP2006007506A5 - - Google Patents
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- JP2006007506A5 JP2006007506A5 JP2004185884A JP2004185884A JP2006007506A5 JP 2006007506 A5 JP2006007506 A5 JP 2006007506A5 JP 2004185884 A JP2004185884 A JP 2004185884A JP 2004185884 A JP2004185884 A JP 2004185884A JP 2006007506 A5 JP2006007506 A5 JP 2006007506A5
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- mold
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- cleaning
- resin
- manufacturing
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Claims (15)
（ａ）第１金型、前記第１金型に形成されたキャビティ、前記キャビティと対向する金型面を有する第２金型、前記金型面に開口する吸引孔、及び前記金型面に形成されたセットピンを備えた成形金型を準備する工程；
（ｂ）半導体チップが搭載された基板を前記第１金型と前記第２金型との間に配置し、前記キャビティ内に封止用樹脂を供給し、前記半導体チップを前記封止用樹脂で封止する工程；
（ｃ）セットピン孔を有するマスク用シートと、クリーニング用シートとを前記第１金型と前記第２金型との間に配置し、前記キャビティ内にクリーニング用樹脂を供給し、前記成形金型をクリーニングする工程；
ここで、前記（ｃ）工程では、以下の工程を有する、
（ｃ１）前記セットピン孔に前記セットピンを挿入することで、前記マスク用シートが前記吸引孔を塞ぐように、前記マスク用シートを前記第１金型と前記第２金型との間に配置する工程；
（ｃ２）前記クリーニング用シートを前記第１金型と前記マスク用シートとの間に配置する工程；
（ｃ３）前記クリーニング用シートを前記第１金型および前記第２金型によりクランプする工程；
（ｃ４）前記キャビティ内に前記クリーニング用樹脂を供給する工程；
（ｃ５）前記（ｃ４）工程の後、硬化した前記クリーニング用樹脂が形成された前記クリーニング用シートと、前記マスク用シートとを前記成形金型から取り出す工程。 A method for manufacturing a semiconductor device comprising the following steps:
(A) a first mold, a cavity formed in the first mold, a second mold having a mold surface facing the cavity, a suction hole opening in the mold surface, and a mold surface Preparing a molding die with the formed set pins;
(B) A substrate on which a semiconductor chip is mounted is disposed between the first mold and the second mold, a sealing resin is supplied into the cavity, and the semiconductor chip is attached to the sealing resin. Sealing with:
(C) A mask sheet having a set pin hole and a cleaning sheet are disposed between the first mold and the second mold, a cleaning resin is supplied into the cavity, and the molding mold is provided. Cleaning the mold;
Here, the step (c) includes the following steps:
(C1) By inserting the set pin into the set pin hole, the mask sheet is placed between the first mold and the second mold so that the mask sheet closes the suction hole. Placing step;
(C2) placing the cleaning sheet between the first mold and the mask sheet;
(C3) clamping the cleaning sheet with the first mold and the second mold;
(C4) supplying the cleaning resin into the cavity;
(C5) After the step (c4), a step of taking out the cleaning sheet on which the cured cleaning resin is formed and the mask sheet from the molding die.
前記（ｃ５）工程の後、前記マスク用シートと前記クリーニング用シートとを分離し、前記マスク用シートを再利用することを特徴とする半導体装置の製造方法。 Oite to claim 1,
After the step (c5), the mask sheet and the cleaning sheet are separated, and the mask sheet is reused .
前記マスク用シートは、紙、樹脂基板、銅、銅合金、または鉄−Ｎｉ合金から成り、
前記クリーニング用シートは、不織布、紙、または樹脂から成ることを特徴とする半導体装置の製造方法。 Oite to claim 2,
The mask sheet is made of paper, resin substrate, copper, copper alloy, or iron-Ni alloy,
The method for manufacturing a semiconductor device, wherein the cleaning sheet is made of nonwoven fabric, paper, or resin .
前記クリーニング用シートの表面には、フッ素系樹脂またはシリコーン系樹脂がコーティングされていることを特徴とする半導体装置の製造方法。 Oite to claim 2,
A method of manufacturing a semiconductor device, wherein a surface of the cleaning sheet is coated with a fluorine resin or a silicone resin .
前記マスク用シートと前記クリーニング用シートとの接触面には、離型剤が塗布されていることを特徴とする半導体装置の製造方法。 Oite to claim 2,
A method of manufacturing a semiconductor device, wherein a release agent is applied to a contact surface between the mask sheet and the cleaning sheet .
前記マスク用シートは、前記クリーニング用樹脂を浸透させない素材から成り、
前記クリーニング用シートは、前記クリーニング用樹脂を浸透させる素材から成ることを特徴とする半導体装置の製造方法。 Oite to claim 1,
The mask sheet is made of a material that does not penetrate the cleaning resin,
The method for manufacturing a semiconductor device , wherein the cleaning sheet is made of a material that allows the cleaning resin to permeate .
前記マスク用シートの外形サイズは、前記クリーニング用シートの外形サイズよりも小さいことを特徴とする半導体装置の製造方法。 Oite to claim 1,
The method for manufacturing a semiconductor device , wherein an outer size of the mask sheet is smaller than an outer size of the cleaning sheet .
前記成形金型は、前記キャビティに繋がるエアーベントを備えており、
前記（ｃ２）工程では、前記クリーニング用シートが前記エアーベントの位置にも介在するように、前記クリーニング用シートを前記第１金型と前記マスク用シートとの間に配置することを特徴とする半導体装置の製造方法。 Oite to claim 1,
The molding die is provided with an air vent connected to the cavity,
In the step (c2), the cleaning sheet is disposed between the first mold and the mask sheet so that the cleaning sheet is also interposed at the position of the air vent. A method for manufacturing a semiconductor device.
前記成形金型は、前記封止用樹脂および前記クリーニング用樹脂を配置するポットを備えており、
前記クリーニング用シートは、ポット用開口孔を有しており、
前記（ｃ２）工程では、前記クリーニング用シートの前記ポット用開口孔が前記成形金型の前記ポットと平面的に重なるように、前記クリーニング用シートを前記第１金型と前記マスク用シートとの間に配置することを特徴とする半導体装置の製造方法。 Oite to claim 1,
The molding die includes a pot for arranging the sealing resin and the cleaning resin,
The cleaning sheet has a pot opening hole,
In the step (c2), the cleaning sheet is placed between the first mold and the mask sheet so that the pot opening hole of the cleaning sheet overlaps the pot of the molding mold in a plane. A method of manufacturing a semiconductor device, comprising:
前記クリーニング用シートは、キャビティ用開口孔を有しており、
前記（ｃ２）工程では、前記クリーニング用シートの前記キャビティ用開口孔が前記成形金型の前記キャビティと平面的に重なるように、前記クリーニング用シートを前記第１金型と前記マスク用シートとの間に配置することを特徴とする半導体装置の製造方法。 Oite to claim 1,
The cleaning sheet has a cavity opening,
In the step (c2), the cleaning sheet is placed between the first mold and the mask sheet such that the cavity opening hole of the cleaning sheet overlaps the cavity of the molding mold in a plane. A method of manufacturing a semiconductor device, comprising:
前記（ｃ）工程は、前記（ｂ）工程を一定のショット数を行った後に行うことを特徴とする半導体装置の製造方法。 Oite to claim 1,
The step (c) is performed after the step (b) is performed after a certain number of shots .
前記（ｃ）工程の後、前記（ｂ）工程を一定のショット数を行うことを特徴とする半導体装置の製造方法。 In claim 1,
After the step (c) , the semiconductor device manufacturing method is characterized in that the step (b) is performed with a certain number of shots .
前記金型面は、凹部を有しており、The mold surface has a recess,
前記（ｃ１）工程では、前記マスク用シートを前記凹部内に配置することを特徴とする半導体装置の製造方法。In the step (c1), the mask sheet is disposed in the recess.
前記凹部内に配置された前記マスク用シートの一部は、前記金型面より突出することを特徴とする半導体装置の製造方法。A part of the mask sheet disposed in the concave portion protrudes from the mold surface.
前記（ｂ）工程では、前記半導体チップが前記キャビティ内に位置するように、前記半導体チップが搭載された前記基板を前記第１金型と前記第２金型との間に配置し、前記吸引孔により前記基板を吸引固定し、前記キャビティ内に封止用樹脂を供給し、前記半導体チップを前記封止用樹脂で封止することを特徴とする半導体装置の製造方法。In the step (b), the substrate on which the semiconductor chip is mounted is disposed between the first mold and the second mold so that the semiconductor chip is located in the cavity, and the suction is performed. A method of manufacturing a semiconductor device, wherein the substrate is sucked and fixed through a hole, sealing resin is supplied into the cavity, and the semiconductor chip is sealed with the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004185884A JP4373291B2 (en) | 2004-06-24 | 2004-06-24 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004185884A JP4373291B2 (en) | 2004-06-24 | 2004-06-24 | Manufacturing method of semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009163477A Division JP2009283955A (en) | 2009-07-10 | 2009-07-10 | Method for manufacturing semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006007506A JP2006007506A (en) | 2006-01-12 |
| JP2006007506A5 true JP2006007506A5 (en) | 2009-06-04 |
| JP4373291B2 JP4373291B2 (en) | 2009-11-25 |
Family
ID=35775284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004185884A Expired - Fee Related JP4373291B2 (en) | 2004-06-24 | 2004-06-24 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4373291B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242924A (en) * | 2006-03-09 | 2007-09-20 | Renesas Technology Corp | Manufacturing method of semiconductor device |
| KR100884733B1 (en) * | 2007-07-31 | 2009-02-19 | 이교안 | Coating method of epoxy release wax on chip package mold and thereby suitable coating seat |
| WO2010093074A1 (en) * | 2009-02-13 | 2010-08-19 | Lee Kyo An | Wax application member for mold and method for applying wax using the same |
| JP5741398B2 (en) * | 2011-11-21 | 2015-07-01 | 日立化成株式会社 | Mold cleaning sheet |
| KR101450152B1 (en) | 2014-03-27 | 2014-10-13 | 임상수 | Formation method of waterproof structure of electronics |
| JP7318927B2 (en) * | 2019-11-15 | 2023-08-01 | 東北物流株式会社 | CLEANING SHEET, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND CLEANING SHEET MANUFACTURING METHOD |
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2004
- 2004-06-24 JP JP2004185884A patent/JP4373291B2/en not_active Expired - Fee Related
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