KR101450152B1 - Formation method of waterproof structure of electronics - Google Patents

Abstract

The present invention relates a method of forming a local waterproof structure of an electronic appliance, and more particularly, to a method of forming a local waterproof structure of an electronic appliance which is capable of preventing foreign substances such as dust or liquid from being introduced into the electronic appliance. A method of forming a local waterproof structure of an electronic appliance according to the present invention includes: a preparing step of preparing a circuit board; a mask sheet attaching step of attaching a mask sheet having a through-hole onto an outer surface of the circuit board; and a seal member forming step of forming a seal member surrounding upper, side, and lower surfaces of the circuit board by filling the through-hole with a waterproof material, wherein, in the mask sheet attaching step, the through-hole is provided on the upper surface between one end and the opposite end of the circuit board, and a width of the through-hole is larger than that of a closely attached portion of the circuit board placed on a low portion of the through-hole.

Description

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a waterproof structure of an electronic product,

The present invention relates to a method of forming a local waterproof structure of an electronic product, and more particularly, to a method of forming a local waterproof structure of an electronic product that can prevent foreign matter such as dust and liquid from entering into the interior of the electronic product.

Portable electronic products, such as mobile phones, smart phones, personal digital assistants (PDAs), tablet PCs, notebook computers, LCD TVs, etc., can be used freely and moving anywhere.

However, these portable electronic products are sometimes exposed to water during transportation, for example, in the case of dropping a portable electronic product in water, or in case of rain and wet, most products are not designed to be waterproof The water is introduced into the circuit parts inside the casing and the circuit parts are brought into contact with the water, so that the function thereof is lost and it is likely to fail.

Therefore, it is necessary to prevent such malfunctions. Further, if the portable electronic device can be carried on the beach or the public bath, convenience of the portable electronic device can be increased. Therefore, even if the portable electronic product is exposed to water, the circuit components prevent the inflow of water or moisture A portable electronic device having a waterproof structure that prevents circuit components and the like from contacting with water is needed.

However, conventional portable electronic products, particularly conventional mobile phones, have not been designed with a waterproofing treatment, and even if exposed to a small amount of water, they fail to function or fail to operate properly.

In consideration of these problems, there are a few products designed to be waterproof, but they are mainly used to seal all the gaps of the casing of the portable electronic device or to apply the sealing member as a whole. The structure is complicated, and the cost is increased.

Korean Patent Publication No. 10-2004-0022161 Korean Patent Publication No. 10-2007-0063858

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a local waterproof structure of an electronic product which can apply a relatively simple waterproof structure to a part of a circuit board constituting an electronic product, And a method of forming the same.

In order to achieve the above object, a local waterproof structure of an electronic product of the present invention comprises: a first housing constituting one surface of an electronic product; A second housing coupled to the first housing to form a second surface of the electronic product; A circuit board electrically connected to an electronic component disposed inside the electronic product, the circuit board being disposed between the first housing and the second housing; And a hollow sealing member which is in close contact with one end of the circuit board exposed to the outside of the electronic product and the other end of the circuit board disposed inside the electronic product while covering the upper surface, Wherein the sealing member is in close contact with the first housing and the second housing so that foreign matter is prevented from moving from one end of the circuit board to the other with reference to the sealing member.

The sealing member is made of a material having elasticity.

A first coupling protrusion is formed in the first housing, a second coupling protrusion is formed in the second housing, and an engagement groove into which the first coupling protrusion and the second coupling protrusion are inserted is formed on the outer circumferential surface of the closure member.

The circuit board includes: a facing portion having a wide width; And a side surface portion having a width narrower than that of the facing surface portion. The sealing member is coupled to the upper surface, the side surface, and the lower surface of the side surface portion while being enclosed.

And a terminal socket portion connected to the external connector is mounted on the facing portion.

According to another aspect of the present invention, there is provided a method of forming a local waterproof structure for an electronic product, comprising: preparing a circuit board; A mask sheet attaching step of attaching a mask sheet having a through hole to an outer surface of the circuit board; And a sealing member filling the through hole with a waterproof material so as to enclose an upper surface, a side surface, and a lower surface of the circuit board. In the step of attaching the mask sheet, the through hole is formed with one end And the width of the through hole is larger than the width of the close contact portion of the circuit board located below the through hole.

In the step of attaching the mask sheet, the mask sheet is adhered to the upper surface of the circuit board.

The mask sheet includes: a first mask sheet disposed on an upper surface of the circuit board; And a second mask sheet disposed on an upper surface of the circuit board, wherein the through-holes are formed in the first mask sheet and the second mask sheet, respectively, and in the step of attaching the mask sheet, The sheets are adhered to each other with the circuit board interposed therebetween.

And an adhesive applying step of applying an adhesive to the contact portion of the circuit board exposed to the outside through the through hole between the mask sheet attaching step and the sealing member forming step.

The sealing member forming step may include: arranging the circuit board with the mask sheet attached between a lower mold and an upper mold; Applying the waterproof material to an upper surface of the mask sheet; A step of filling and curing the waterproof material in the through-hole after the lower mold and the upper mold are in close contact with each other; And a forming step of removing the mask sheet from the circuit board after separating the lower mold and the upper mold to mold the waterproof material filled in the through hole with the sealing member.

Wherein a molding groove for molding an outer circumferential surface of the sealing member is formed on an upper surface of the lower mold and a lower surface of the upper mold, respectively, and a cutting protrusion is protruded on an outer side of the molding groove, When the mask sheet is removed from the circuit board in the forming step, the waterproofing material is disposed in a position where the waterproofing material is disposed at the position where the waterproofing material is formed, The outside of the cutting projection is removed together with the mask sheet with respect to the cutting projection, and the waterproof material present inside the cutting projection forms the sealing member coupled to the circuit board.

When an electronic component is mounted on the circuit board, a three-dimensional mask sheet covering the circuit board and the electronic component is attached to the outer surface of the circuit board in the mask sheet attaching step.

According to the method of forming the local waterproof structure of the electronic product of the present invention as described above, the following effects can be obtained.

A relatively simple waterproof structure can be applied to a part of a circuit board constituting an electronic product to provide a moistureproof, dustproof and waterproof effect at a low cost by mounting a sealing member that covers the upper surface, side surface and lower surface of the circuit board.

In addition, by forming the engaging groove into which the first engaging protrusion of the first housing and the second engaging projection of the second housing are inserted, it is possible to further prevent foreign matter from entering the outer peripheral face of the closure member, And the second housing.

1 is a perspective view of a circuit board to which a local waterproof structure according to an embodiment of the present invention is applied,
FIG. 2 is a cross-sectional structural view of an electronic product to which a local waterproof structure according to an embodiment of the present invention is applied,
3 is a flowchart of a method of forming a local waterproof structure according to an embodiment of the present invention,
FIG. 4 is a process diagram illustrating a preparation step in a method of forming a local waterproof structure according to an embodiment of the present invention.
5 is a process diagram showing a step of attaching a mask sheet in a method of forming a local waterproof structure according to an embodiment of the present invention.
6 is a process diagram showing an adhesive applying step in a method of forming a local waterproof structure according to an embodiment of the present invention.
FIG. 7 is a process diagram illustrating a sealing member forming step in a method of forming a local waterproof structure according to an embodiment of the present invention. FIG.
8 is a perspective view showing a circuit board and a mask sheet formed in a three-dimensional shape in a method of forming a local waterproof structure according to an embodiment of the present invention,

FIG. 1 is a perspective view of a circuit board to which a local waterproof structure is applied according to an embodiment of the present invention, and FIG. 2 is a cross-sectional structural view of an electronic product to which a local waterproof structure is applied according to an embodiment of the present invention.

1 and 2, a local waterproof structure of an electronic product according to the present invention includes a first housing 10, a second housing 20, a circuit board 30, a sealing member 40, .

The first housing 10 forms one side of an electronic product such as a portable terminal.

The second housing 20 forms the other surface of the electronic product and is coupled to the first housing 10.

The circuit board 30 is formed in a flat plate shape, and is electrically connected to an electronic component disposed inside the electronic product.

The circuit board 30 is disposed between the first housing 10 and the second housing 20, as shown in FIG.

In this embodiment, the terminal socket portion 34 connected to the external connector is mounted on the circuit board 30.

The terminal socket portion 34 is a portion where an external connector is inserted for charging, data communication, etc. in a portable terminal or the like.

The circuit board 30 may be formed in a rectangular flat plate shape, or may have a face portion 31 and a face portion 32 as in the present embodiment.

The facing portion 31 is a portion having a wide width, and the terminal socket portion 34 is mounted.

The face portion 32 protrudes in one direction from the facing portion 31 and has a narrower width than the facing portion 31.

The sealing member 40 is made of a material having elasticity such as rubber or silicone, and is tightly bonded to the outer surface of the circuit board 30.

More specifically, between the one end of the circuit board 30 exposed to the outside of the electronic product and the other end of the circuit board 30 disposed inside the electronic product, And has a hollow shape that closely contacts the upper surface, side surface, and lower surface of the substrate 30.

In the present embodiment, the sealing member 40 is coupled to the upper surface, the side surface, and the lower surface of the side surface portion 32 while being enclosed.

By forming the sealing member 40 on the small-sized surface portion 32 having a small width as described above, the size of the sealing member 40 can be reduced.

The outer circumferential surface of the closure member 40 is in close contact with the first housing 10 and the second housing 20 so that dust and dirt are discharged from one end to the other end of the circuit board 30 with respect to the closure member 40, Thereby preventing foreign matter such as liquid from moving.

If only the above function is performed, the sealing member 40 may be inserted into and close to the small-sized surface portion 32 by an O-ring.

However, when the sealing member 40 is made of an O-ring and inserted into the small-sized surface portion 32, the small-sized portion 32 and the O-ring can be lifted, and the O-ring can be inserted into the first and second housings 10, (20).

In order to solve this problem, in the present embodiment, the engaging groove 41 is formed on the outer circumferential surface of the sealing member 40.

More specifically, the first housing 10 is provided with a first engaging projection 11, the second housing 20 is provided with a second engaging projection 21, An engaging groove 41 into which the first engaging protrusion 11 and the second engaging protrusion 21 are inserted is formed on the outer circumferential surface.

The circuit board 30 and the closure member 40 are inserted into the first housing 10 and the second housing 10 by inserting the first coupling protrusion 11 and the second coupling protrusion 21 into the coupling groove 41, It is possible to prevent the foreign matter (dust, liquid) from flowing out of the second housing 20, and the sealing member 40 is brought into close contact with the first housing 10 and the second housing 20, The sealing member 40 can be prevented from flowing into the inside thereof.

The local waterproof structure of the present invention can be applied to a portable terminal (smart phone or the like) to prevent foreign matter such as dust or liquid from entering the portable terminal from the outside.

Hereinafter, a method of forming a local waterproof structure of an electronic product having the above-described structure will be described.

FIG. 3 is a flow chart of a method of forming a local waterproof structure according to an embodiment of the present invention, FIG. 4 is a process diagram showing a preparation step in a method of forming a local waterproof structure according to an embodiment of the present invention, FIG. 6 is a process diagram showing a step of applying an adhesive in a method of forming a local waterproof structure according to an embodiment of the present invention. FIG. 6 is a view illustrating a step of applying an adhesive in a method of forming a local waterproof structure according to an embodiment of the present invention. And FIG. 7 is a process diagram showing a sealing member forming step in a method of forming a local waterproof structure according to an embodiment of the present invention. FIG. 8 is a cross- Fig. 3 is a perspective view showing a three-dimensionally formed sheet.

3 to 8, a method of forming a local waterproof structure of an electronic product according to the present invention includes a preparing step S10, a mask sheet attaching step S20, an adhesive applying step S30, And a forming step S40.

In FIGS. 4 to 7, it is assumed that the circuit board 30 is in a flat state without being coupled to the electronic components.

The preparing step S10 is a step of preparing the circuit board 30 as shown in FIG.

The mask sheet attaching step S20 is a step of attaching the mask sheet 50 having the through holes 51 to the outer surface of the circuit board 30, as shown in FIG.

The first mask sheet 52 and the second mask sheet 53 may be bonded to the upper or lower surface of the circuit board 30, .

The first mask sheet 52 is disposed on the upper surface of the circuit board 30 and the second mask sheet 53 is disposed on the lower surface of the circuit board 30.

The through-holes 51 are formed in the first mask sheet 52 and the second mask sheet 53, respectively.

The through hole 51 formed in the mask sheet 50 in the mask sheet attaching step S20 is attached to the upper and lower surfaces of the circuit board 30 by the mask sheet 50, And is disposed on the top and bottom surfaces of the circuit board 30 between one end and the other end.

The width of the through hole 51 is greater than the width of the contact portion 33 of the circuit board 30 located below the through hole 51.

The first mask sheet 52 and the second mask sheet 53 are adhered to the upper and lower surfaces of the circuit board 30 with the circuit board 30 interposed therebetween.

To this end, the mask sheet 50 is coated with a pressure-sensitive adhesive or the like so as to be adhered to the circuit board 30 or the like.

The adhesive applying step S30 is a step of applying an adhesive 35 to the contact portion 33 of the circuit board 30 exposed to the outside through the through hole 51 as shown in FIG. 6 .

The sealing member 40 disposed in the close contact portion 33 of the circuit board 30 can be more strongly bonded to the circuit board 30 by the above adhesive application step S30.

7, the through-hole 51 is filled with a waterproof material 45 such as rubber or silicone so that the upper surface, the side surface, and the lower surface of the circuit board 30 Thereby forming the sealing member 40 which surrounds the sealing member 40.

The sealing member molding step S40 includes a placement step S41, a coating step S42, a filling and curing step S43, and a molding step S44.

The placement step S41 may include arranging the circuit board 30 on which the mask sheet 50 is attached between the lower mold 61 and the upper mold 62 as shown in FIG. to be.

At this time, a molding groove 63 for molding the outer peripheral surface of the sealing member 40 is formed on the upper surface of the lower mold 61 and the lower surface of the upper mold 62, respectively.

A cutting protrusion 64 is formed on the outer side of the forming groove 63 along the outer circumference of the forming groove 63.

In the placing step S41, the circuit board 30 is disposed on the upper surface of the lower mold 61 so that the through-hole is disposed at a position where the forming groove 63 is formed.

The applying step (S42) is a step of applying the waterproofing material (45) in a gel or liquid state on the upper surface of the mask sheet (50).

At this time, the waterproof material 45 is applied around the through hole 51.

7 (b), the lower mold 61 and the upper mold 62 are brought into close contact with each other so that the waterproof material 45 is filled in the through hole 51 Followed by curing.

More specifically, as the upper mold 62 is lowered, the waterproof material 45 is compressed between the lower mold 61 and the upper mold 62, and part of the waterproof material 45 is filled in the through hole 51 And a part of the mask sheet 50 is applied to the outer surface of the mask sheet 50 and the remaining part of the mask sheet 50 is discharged to the outside of the circuit board 30.

At this time, the waterproof material 45 coated on the upper surface of the first mask sheet 52 flows to the lower surface of the second mask sheet 53 through the through hole 51.

When pressure, heating, or the like is performed in this state, the waterproof material 45 is cured.

The waterproofing material 45 is formed to have the thinnest thickness at the portion where the cutting protrusion 64 is formed and hardened.

The forming step (S44) is a step of molding the sealing member (40) enclosing the circuit board (30).

In the molding step S44, the circuit board 30 is extracted by separating the lower mold 61 and the upper mold 62 as shown in FIG. 7 (c).

7 (d), the mask sheet 50 is removed from the circuit board 30 and the waterproof material 45 filled in the through hole 51 is removed from the sealing member 40, .

When the mask sheet 50 is removed from the circuit board 30 in the forming step S44, the waterproof material 45 is removed from the outside of the cutting projection 64 with respect to the cutting projection 64 The waterproof material 45 existing inside the cutting protrusion 64 is joined to the circuit board 30 to form the sealing member 40. [

This is because the thickness of the waterproofing material 45 is formed to be the thinnest at the portion where the cutting protrusion 64 is formed.

Since the mask sheet 50 is adhered to the circuit board 30 so as to be detachably attached thereto, even if the mask sheet 50 is peeled off from the circuit board 30 and the circuit board 30 is damaged .

Thereafter, an electronic component such as the terminal socket portion 34 is mounted on the upper surface of the circuit board 30.

8, when electronic parts such as the terminal socket portion 34 are mounted on the circuit board 30 at the initial stage, in the mask sheet attaching step S20, the circuit board 30 And a three-dimensional mask sheet 50 covering the electronic parts are attached to the outer surface of the circuit board 30. [

By the local waterproof structure of the electronic product formed by the above-described method, foreign substances such as dust, liquid and the like can be prevented from flowing from the outside to the inside of the circuit board 30.

The method for forming the local waterproof structure of the electronic product of the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope of the technical idea of the present invention.

10: first housing, 11: first engaging projection,
20: second housing, 21: second engaging projection,
The present invention relates to a circuit board, and more particularly, to a circuit board,
40: sealing member, 41: coupling groove, 45: waterproof material,
50: mask sheet, 51: through hole, 52: first mask sheet, 53: second mask sheet,
61: lower mold, 62: upper mold, 63: molding groove, 64: cutting projection,
Step S10: Preparing Step S20: Attaching the mask sheet S30: Applying the adhesive, S40: Molding the sealing member S41: Placing step S42: Applying step S43: Filling curing step S44: Molding step.

Claims (12)

delete delete delete delete delete Preparing a circuit board;
A mask sheet attaching step of attaching a mask sheet having a through hole to an outer surface of the circuit board;
And a sealing member molding step of filling the through hole with a waterproof material to form a sealing member to cover the upper surface, the side surface and the lower surface of the circuit board,
Wherein the through hole is disposed on the upper surface of the circuit board between one end and the other end of the circuit board in the mask sheet attaching step,
Wherein the width of the through hole is larger than the width of the contact portion of the circuit board located below the through hole. The method of claim 6,
Wherein the mask sheet is adhered to the upper surface of the circuit board in the step of attaching the mask sheet. The method of claim 7,
In the mask sheet,
A first mask sheet disposed on an upper surface of the circuit board;
And a second mask sheet disposed on an upper surface of the circuit board,
Wherein the first mask sheet and the second mask sheet each have the through-hole formed therein,
Wherein in the step of attaching the mask sheet, the first mask sheet and the second mask sheet are adhered to each other with the circuit board interposed therebetween. The method of claim 6,
Between the mask sheet attaching step and the sealing member forming step,
Further comprising an adhesive applying step of applying an adhesive to a contact portion of the circuit board exposed through the through hole to the outside. The method of claim 6,
The sealing member forming step may include:
Disposing the circuit board on which the mask sheet is attached between the lower mold and the upper mold;
Applying the waterproof material to an upper surface of the mask sheet;
A step of filling and curing the waterproof material in the through-hole after the lower mold and the upper mold are in close contact with each other;
And a molding step of removing the mask sheet from the circuit board after the lower mold and the upper mold are separated from each other to mold the waterproof material filled in the through hole with the sealing member. A method of forming a local waterproof structure. The method of claim 10,
A molding groove for forming an outer circumferential surface of the sealing member is formed on the upper surface of the lower mold and the lower surface of the upper mold,
A cutting protrusion is formed on the outer side of the forming groove,
Wherein the through hole is disposed at a position where the forming groove is formed,
In the filling and curing step, the waterproof material is formed to have the thinnest thickness by the cutting protrusions,
Wherein when the mask sheet is removed from the circuit board in the forming step, the waterproof material is removed together with the mask sheet from the outside of the cutting projection with respect to the cutting projection, and the waterproofing material existing inside the cutting projection Wherein the material forms the sealing member coupled to the circuit board. ≪ RTI ID = 0.0 > 11. < / RTI > The method of claim 6,
When electronic parts are mounted on the circuit board,
Wherein the step of attaching the mask sheet attaches a three-dimensional mask sheet covering the circuit board and the electronic component to the outer surface of the circuit board.

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