JPH09117931A - Resin encapsulating method and device of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent resin burr from adhering to the molding face of a resin encapsulating part. SOLUTION: Releasing films 17 are spanned over the whole face of the parting line face of a top mold 20, which is not equipped with a pot 22, and over the whole face except a pot 22 part of a bottom mold 21 equipped with a pot 22. At the same time, between the releasing film 17, the closing part 42 of a vacuum packaging film in a vacuum packaging resin material 6 fed in the pot 22 is overlappingly inserted so as to span film members 17 and 42 over the whole face of the molding faces 16 in a device main body and the respective resin encapsulating part 9 of a connector. Then, by heating the vacuum packaging resin material. 6 under pressure, the resin tablet 39 within the material 6 is melted and, at the same time, pushed out of the closing part 42 through a mold passage part 24 under the state being spanned by the film members 14 and 42 in cavities 23 and 31 so as to resin-encapsulate electronic parts 8 on lead frames 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for sealing and molding an electronic component such as an IC, an LSI, a diode and a capacitor mounted on a lead frame with a resin material.

[0002]

2. Description of the Related Art Conventionally, electronic parts have been molded by resin molding by a transfer molding method, and a resin molding apparatus for carrying out this method includes:
Usually, it has the following basic configuration. That is, the resin encapsulation molding apparatus includes a material loading section for loading a lead frame and a resin tablet before molding, and a resin encapsulation molding section (resin encapsulation section for encapsulating an electronic component mounted on the lead frame with a resin material). Molding die), a molded product storage section for storing the sealed lead frame molded by the resin sealing molding section, a material for transferring the lead frame of the material loading section and the resin tablet to the resin sealing molding section A supply mechanism, a molded product transfer mechanism that transfers the sealed lead frame of the resin sealing molding unit to the molded product storage unit, and a resin molded body that is unnecessary as a product connected to the sealed lead frame is cut. The unnecessary resin molded body cutting / removing section for removing, the mold surface cleaning mechanism for removing foreign matters such as resin burrs adhering to the resin molding die surface of the resin sealing molding section, and the respective units Control mechanism or the like for controlling is provided.

[0005] The resin sealing molding of an electronic component using such a resin sealing molding apparatus is performed, for example, as follows. That is, the molds (both upper and lower molds) in the resin encapsulation molding unit are heated in advance to the resin molding temperature by the heating means, and the upper and lower molds are opened. Next, the pre-molding lead frame of the material loading section is supplied and set at a predetermined position on the mold surface of the lower mold via the material supply mechanism, and the resin tablet is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and its surrounding lead frame are fitted and set in the upper and lower cavities facing the mold surfaces of the upper and lower molds, and the resin tablet in the pot is heated. It will be melted sequentially. Next, when the resin material in the pot is pressed by the plunger and the melted resin material is injected and filled into both upper and lower cavities through the passage portion, the electronic components in the both cavities and the lead frame in the periphery thereof are separated. The resin is molded in a resin molded body (mold package) molded according to the shapes of the cavities. Next, after the time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the sealed lead frame (that is, the resin molded body and the lead frame in the upper and lower cavities) and The above-mentioned unnecessary resin molded body in the connected and integrated state is projected between the two molds and released. Next, the sealed lead frame and the unnecessary resin molded body are simultaneously transferred to the unnecessary resin molded body cutting / removal section through the molded product transfer mechanism at the same time as the above-mentioned releasing action, and the unnecessary resin molded body is also removed. Cut off the part. Next, the sealed lead frame from which the unnecessary resin molded body is cut and removed is passed through the molded product transfer mechanism,
Transfer to the molded product storage section for storage. Furthermore, each time the molding cycle described above is completed, a mold surface cleaning mechanism is used to
Foreign substances such as resin burrs adhering to the resin molding die surface of the resin sealing molding part are removed.

In order to automatically resin-mold the electronic parts on the lead frame, the material loading section as described above,
A resin sealing molding section, molded article storage section, material supply mechanism, molded article transfer mechanism, unnecessary resin molded article cutting and removing section, a mold surface cleaning mechanism, and an automatic control mechanism for each of these sections are required. As a basic configuration, the resin encapsulation / molding apparatus for a component is generally provided with a set of each part and each mechanism as described above.

[0005] By the way, using one resin encapsulation molding apparatus, for example, to produce the same kind of products simultaneously and in large quantities, and to produce small quantities of different kinds of products simultaneously, For the purpose of reducing the overall molding cost, the resin sealing molding apparatus is provided with a resin sealing molding apparatus main body and at least a plurality of resin sealing molding sections detachably connected to the apparatus main body. A new structure / form composed of a connected body composed of a resin sealing molding device has been developed. In addition, such a resin encapsulation molding apparatus is mainly equipped with one material supply mechanism, one molded product transfer mechanism, and one mold surface cleaning mechanism from the viewpoint of reduction of molding cost and the like. Therefore, the pre-molding lead frame of the material loading part and the resin tablet are provided to be separately supplied to the plurality of resin sealing molding parts through one material supply mechanism, and
It is provided so as to individually transfer the sealed lead frames in the plurality of resin-sealed molding units to the unnecessary resin-molded body cutting / removing unit and the molded-product storage unit via a single molded-product transfer mechanism. The resin molding die surfaces of the plurality of resin encapsulation molding portions are individually cleaned via one die surface cleaning mechanism. Furthermore, in this resin encapsulation molding device, through the automatic control mechanism,
It is possible to operate all of the resin encapsulation molding parts connected to the main body of the device, or to operate only part of them, so it is possible, for example, to quickly change product types or increase or decrease production volume. There is an advantage in that it is possible to construct a mode of a molding apparatus that can respond immediately.

[0006]

A resin encapsulation molding apparatus having a configuration in which a plurality of resin encapsulation molding sections are detachably connected to the apparatus body and the apparatus body has the above advantages. However, there are the following problems in terms of efficiency of molding work. That is, the above-mentioned material supply mechanism, molded article transfer mechanism, and mold surface cleaning mechanism are controlled by an automatic control mechanism provided in the apparatus main body so that the material loading section and the molded article storage section on the apparatus main body side and the resin sealing molding section are provided. Since they are reciprocally moved between them, there is an advantage that the overall molding cost can be reduced by using these mechanisms as well. However, since the material supply mechanism and the molded product transfer mechanism are, as described above, the operation of supplying the pre-molding lead frame and the resin tablet and the operation of transferring the sealed lead frame and the like, these operations are, for example, This can be easily done by adopting a chucking device that uses de-clawing, but mold surface cleaning work to remove foreign matter such as resin burrs adhering to the resin molding mold surface of each resin encapsulation molding part The material and amount of the resin material to be used, the amount of resin burr generated, and the places where the resin burrs are different are not uniform, and the mold surface cleaning operation is performed while the tip of the brush member is pressed against the mold surface. However, since this is a simple method, the effect of the mold surface cleaning in each resin-sealed molding part is insufficient, and if the mold surface cleaning work is performed reliably, The time required for mold surface cleaning operations in Aburafutome molding part is supposed to be different from each, there is a problem that the overall automatic control becomes very difficult.

In view of the above, the present invention provides a material supply method for a resin encapsulation molding apparatus in which a plurality of resin encapsulation molding sections are detachably connected to the apparatus body and a resin encapsulation molding method using the apparatus. By not only maintaining the function and effect of reducing the molding cost by combining the mechanism and the molded product transfer mechanism, but also reliably preventing resin burrs from adhering to the mold surface in each resin sealing molding part, It is an object of the present invention to provide a resin sealing molding apparatus and method for electronic components, which is capable of omitting the mold surface cleaning mechanism and having a simple structure as a whole and easily performing overall automatic control. It is what

[0008]

In order to solve the above-mentioned technical problems, a resin encapsulation molding method for an electronic component according to the present invention is a method for encapsulating an electronic component such as a semiconductor chip in a plurality of resin encapsulation molding apparatuses. A resin encapsulation molding method for an electronic component, in which each electronic component is encapsulated by a resin material in each resin encapsulation molding unit while not supplying a resin material supply pot. A release film for preventing resin contact is supplied to the entire surface of one mold PL surface and the entire surface of the other mold PL surface excluding the pot portion, and the release film is supplied to substantially the entire surface of the mold PL surface. A step of supplying a release film for tensioning the mold, a forced evacuation step of forcibly discharging the air in the resin filling part and the passage part of the mold to the outside, and a vacuum having a closing part of the vacuum packaging film in the pot. Vacuum packaging resin that supplies packaging resin material Material supply step, lead frame supply step of fitting and setting the lead frame on which the electronic component is mounted at a predetermined position in the cavity of the mold, each of the release film, the vacuum packaging resin material, and the lead frame described above. After performing the supply process, the mold
During the mold clamping process of closing the PL surface and during the mold clamping, the closed part of the vacuum packaging film in the vacuum packaging resin material supplied into the pot is polymerized and inserted between the release films. Thus, by covering the mold pot portion in which a film is stretched over the entire surface of the mold pot portion by the vacuum packaging film closing portion, and a vacuum packaging resin material for heating the vacuum packaging resin material in the pot. A heating step, a film crimping step of pressurizing the vacuum packaging resin material in the pot to crimp a part of the vacuum packaging film of the vacuum packaging resin material and a part of the release film, and The vacuum packaging resin material is heated and pressed to melt the resin material in the vacuum packaging film and open the closing portion of the vacuum packaging film, and also to close the opened vacuum packaging film. A step of extruding a molten resin material for extruding the molten resin material in the vacuum packaging film from the mold, and a molten resin material extruded in the step of extruding the molten resin material, a passage provided between the pot and the cavity of the mold. Resin injection molding step of injecting and filling the cavity through the portion and resin-encapsulating the electronic component on the lead frame set in the cavity with the molten resin material, and the resin of the electronic component After the encapsulation molding step, during the mold opening step of separating the mold PL surface from each other, and during the mold opening step of the mold, the mold PL surface and the release film were pressure bonded to the mold film. A vacuum packaging film, and a mold release step of releasing the resin molded body and the lead frame molded between the mold release film and the vacuum packaging film. Things.

Further, according to the method of resin-sealing and molding an electronic component according to the present invention, compressed air is pressure-fed into the cavity so that the resin-molded body in the cavity is formed before the die opening step is performed. It is characterized in that an air compression step of the resin molded body to be compressed is performed.

Further, a resin encapsulation molding apparatus for electronic parts according to the present invention for solving the above-mentioned technical problem has a resin encapsulation molding part for encapsulating an electronic part such as a semiconductor chip with a resin material. An electronic component configured to detachably mount a main body of a resin sealing molding apparatus for an electronic component provided therein, and a connection body composed of the resin sealing molding apparatus including at least a resin sealing molding unit to the main body. The resin encapsulation molding apparatus of
A release film supply mechanism for supplying a release film for preventing resin contact with the resin molding die surface of the resin sealing molding portion is provided in each resin sealing molding portion of the apparatus main body and the connected body. It is characterized by being configured.

Further, a resin encapsulation molding apparatus for an electronic component according to the present invention is provided with an electronic component supply mechanism for supplying the electronic component to a resin encapsulation molding unit in the resin encapsulation molding apparatus body for the electronic component described above. It is characterized by that.

Further, according to the present invention, there is provided a resin encapsulation molding apparatus for an electronic component, which comprises: It is characterized by having a supply mechanism.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, the resin encapsulation molding apparatus body for electronic parts described above is provided with an electronic part supply mechanism and a vacuum packaging resin material supply mechanism. The electronic component supply mechanism and the vacuum packaging resin material supply mechanism are integrally formed.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, the resin encapsulation molding apparatus main body of the electronic parts and the resin encapsulation molding parts of the coupling body described above are provided with the molten resin material in the mold. The release film elastically deforming means for elastically deforming the release film supplied to the passage portion and the filling portion along the shapes of the passage portion and the filling portion is provided.

In the resin encapsulation molding apparatus for electronic parts according to the present invention, the elastic deformation means of the release film described above is provided in the passage portion and the filling portion of the molten resin material provided in the mold of the resin encapsulation molding portion. It is characterized in that it is a forced exhaust mechanism for exhausting the above air to the outside.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, the resin encapsulation molding apparatus main body of the electronic parts and the resin encapsulation molding parts of the connection body are provided with the molten resin material in the mold. The present invention is characterized in that a resin molding extruding means for pushing out the resin molding molded in the passage portion and the filling portion is arranged.

Further, in the resin encapsulation molding apparatus for electronic parts according to the present invention, the above-mentioned resin molding extruding means is provided in the passage part and the filling part of the molten resin material provided in the mold of the resin encapsulation molding part. It is characterized in that it is a forced air press-in mechanism for press-fitting air.

Further, a resin encapsulation molding apparatus for an electronic component according to the present invention is provided between the mold pot and the cavity in each resin encapsulation molding unit body of the electronic component and each resin encapsulation molding section of the connecting body. In addition to forming a passage portion of the molten resin material, the opening and closing mechanism for the passage portion is installed in the passage portion of the molten resin material.

[0019]

According to the present invention, the entire mold PL surface on the side not provided with the pot for supplying the resin material and the entire mold PL surface excluding the pot portion on the mold side provided with the pot To
A release film for preventing resin contact is stretched, and the closed portion of the vacuum packaging film in the vacuum packaging resin material supplied into the pot is polymerized and inserted between the release films to completely cover the pot portion. A film member for mold release (that is, a mold release film) is formed on the entire PL surface of the resin molding mold PL in each resin sealing molding part of the apparatus main body and the connecting body by stretching the vacuum packaging film closing part on the surface. -The vacuum packaging film can be stretched. Then, in this state, the vacuum packaging resin material in the pot is heated and pressed to melt the resin material in the vacuum packaging film, and further, the molten resin material is pushed out from the closed portion of the vacuum packaging film. , By injecting and filling this into the cavity through the passage part of the mold stretched by the release film member, the electronic component on the lead frame set in the cavity is resin-sealed and molded. can do.

Further, according to the present invention, at the time of resin molding, the release film described above and a part of the vacuum packaging film of the vacuum packaging resin material are pressure-bonded to each other, so that the release film is transferred after the resin molding. , The used vacuum packaging film that is no longer needed and the mold together with the release film
It can be automatically discharged to the outside of the PL surface.

Further, according to the present invention, the above-mentioned release film is formed by the flowing action of the molten resin material when the molten resin material in the mold pot is pressure-transferred to the cavity side.
The molten resin material is efficiently elastically deformed along the shapes of the passage portion and the filling portion of the mold. By using the elastic deformation means together, the release film is transferred under pressure by the molten resin material. It is possible to forcibly and surely elastically deform the shape of the passage portion and the filling portion before.

Further, according to the present invention, the air in the passage portion and the filling portion of the molten resin material is discharged to the outside so that the release film can be elastically deformed, and conversely, the passage portion and the filling portion can be filled. By pressurizing air into the section, it is possible to provide a means for extruding the resin molded body molded in the passage section and the filling section.

Further, according to the present invention, a passage portion of a molten resin material is provided between the mold pot and the cavity in each resin sealing molding portion of the resin sealing molding device main body of the electronic component and each of the connecting bodies. Since the opening and closing mechanism for the passage portion is provided in the passage portion for the molten resin material, the molten resin material in the pot can be simultaneously injected and filled into each cavity. Therefore, the resin encapsulation molding operation of the electronic component in each cavity can be performed under uniform conditions, so that a uniform product having high quality and high reliability can be molded.

Further, according to the present invention, before performing the mold opening step of the mold, an air compression step of the resin molded body is performed in which compressed air is pumped into the cavity to compress the resin molded body in the cavity. As a result, since the resin molded body can be further compressed in addition to the resin sealing molding step, it is possible to further improve the adhesion between the resin molded body and the electronic component and the lead frame sealed inside the resin molded body. it can.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 is a schematic plan view of a resin encapsulation molding apparatus for electronic parts according to the present invention, FIG. 2 is a vertical sectional view taken along the line AA of FIG. 1, and FIG. 3 is a resin encapsulation molding apparatus. FIG. 4 is a vertical cross-sectional view of the molding portion when the mold is clamped along line BB in FIG. 3, FIG. 5 is a vertical cross-sectional view of the mold when opened, and FIGS. There is.

The resin encapsulation molding apparatus for electronic parts according to the present invention, as shown in FIGS.
On the other hand, in the case where a plurality of connecting bodies 2 made of a resin encapsulation molding device having a resin encapsulation molding part are installed in series and detachably (in the example shown, three connections are made to the main body 1). (When the body 2 is connected).

Further, in the apparatus main body 1, a material loading section 4 for loading the lead frame 3 before molding, an aligning section 5 for the lead frame before molding, and a material loading section 7 for loading the vacuum packaging resin material 6. A resin-sealed molded portion 9 for sealing-molding the electronic component 8 mounted on the pre-molded lead frame 3 with a resin material, and a molded product molded by the resin-sealed molded portion (sealed leads). Molded product storage unit 11 that stores the frame 10)
And the lead frame 3 before molding of both material loading parts (4, 7)
And a material supply mechanism 12 for transferring the vacuum-packed resin material 6 to the resin-sealed molding unit 9, and a molded-product transfer for transferring the molded product molded by the resin-sealed molding unit 9 to the molded-product storage unit 11. A mechanism 13, an unnecessary resin molded body cutting / removing section 15 for cutting and removing a resin molded body 14 which is unnecessary as a product connected to the molded article, and a resin molding die in the resin sealing molding section 9. A release film supply mechanism 18 for supplying a release film 17 for preventing resin contact to the surface 16 and a control mechanism 19 for automatically controlling each of these parts are provided.

In addition, a fixed upper die 20 and a movable lower die 21 for resin molding are arranged to face the resin encapsulation molding portion 9 described above. Further, in the lower mold 21, a pot 22 for supplying the vacuum packaging resin material 6 and a cavity 23 for resin molding are provided.
And a passage portion 24 for transferring the molten resin material is provided between the pot 22 and the cavity 23. Further, the passage portion 24 is provided with an appropriate opening / closing mechanism 25 such as an opening / closing pin member for opening / closing the passage portion 24. Further, the pot 22 has a plunger 26 for pressurizing the vacuum packaging resin material 6 supplied into the pot 22.
Is fitted. A fitting set recess 27 for the pre-molding lead frame 3 is provided on the PL surface side of the lower mold cavity 23. Further, a large number of air holes 28 are formed in the bottom surface of the lower mold cavity 23, and the air holes 28 are provided outside through an appropriate air passage 29 and a switching valve (not shown). And a vacuum source (not shown) such as a vacuum pump and an air compression source (not shown) such as a compressor. Therefore, when the lower mold cavity 23 and the vacuum source side are communicatively connected via the switching valve described above, the air in the lower mold cavity 23 can be evacuated (decompressed) to the outside through the air passage 29. Configure a forced exhaust system. On the contrary, when the lower mold cavity 23 and the air compression source are communicatively connected to each other through the switching valve, a forced air press-fitting mechanism capable of sending compressed air into the lower mold cavity 23 through the air passage 29 is configured. .

The lower mold pot of the upper mold 20 described above
A cull portion 30 having a large number of uneven rough surfaces is provided at a position opposed to 22. An upper mold cavity 31 is provided opposite to the lower mold cavity 23 of the upper mold 20, and the upper mold cavity 31 and the outside are communicatively connected to each other through an appropriate air vent 32. . Also,
A large number of air holes 33 are formed in the bottom surfaces of the upper mold cavity 31 and the cull portion 30, and the air holes 33 are exposed to the outside through an appropriate air passage 34 and a switching valve (not shown). It is connected to a vacuum source (not shown) such as a vacuum pump and an air compression source (not shown) such as a compressor, which are arranged. Therefore, when the upper mold cavity 31 and the cull portion 30 are connected in communication with the vacuum source side through the switching valve described above, the air in the upper mold cavity 31 and the cull portion 30 is evacuated to the outside through the air passage 34. Configure a forced exhaust system that can be pulled. On the contrary, when the upper die cavity 31 and the cull portion 30 are connected to the air compression source through the switching valve, compressed air can be forced into the upper die cavity 31 and the cull portion 30 through the air passage 34. Configure a forced air press-fitting mechanism.

The air holes (28, 34) provided in the cavities (23, 31) of the upper and lower molds (20, 21) and the cull part 30 described above.
Shows a large number of straight air vents in the illustrated example, but the air vents (28, 34) only need to have air permeability between the cavity and the cull portion and the outside, and therefore, for example, Alternatively, a porous member (porous material) composed of a large number of open cells may be adopted.

The release film supply mechanism 18 described above is also used.
Is a release film delivery section 35 provided on the release film delivery side of each resin sealing molding section 9, a release film take-up section 36 provided on the take-up side, and the release film delivery section 35. It is composed of a delivery roller 37 provided in the die film delivery section, a take-up roller 38 provided in the release film take-up section, and the like. Then, at the time of resin molding, the release film 17 installed in the release film delivery section 35 is automatically delivered by a required length by rotating the delivery roller 37 and the winding roller 38 by the control mechanism 19 described above. It is provided so that you can

The release film 17 is shown in FIGS.
PL of upper mold 20 without pot 22 as shown in
The release film is a long film member supplied to the entire surface and the entire PL surface of the lower mold 21 excluding the pot 22. The mold release film has a resin molding temperature (for example, a high temperature of 175 ° C or higher). )
Heat resistance to withstand, flexibility that can be elastically deformed to prevent damage during resin molding, and non-adhesiveness (peelability) with the resin that can be peeled from the resin molded body after molding. Anything that you have is sufficient. Further, as shown in FIG. 2, the release film 17 is placed on the PL surface of the upper and lower molds (20, 21) in a state where both ends thereof are stretched by the delivery roller 37 and the winding roller 38 described above. Supplied in close proximity.
Therefore, through the vacuum source in the forced evacuation mechanism, the upper mold cavity from the air passages (34 ・ 29) of both upper and lower molds (20 ・ 21).
By vacuuming the air in the 31 part, the cull part 30 and the lower mold cavity 23 part, the release film 17 which is supplied close to the PL surfaces of the upper and lower molds (20, 21) is elastic by the suction force. As a result of deformation, as shown in FIG. 6, the PL surfaces are stretched along the uneven shapes of the PL surfaces of the upper and lower molds. That is, the forced evacuation mechanism serves as elastic deformation means for forcibly and surely elastically deforming the release film along the shapes of the passage portion and the filling portion before the pressurized transfer of the molten resin material.

The vacuum packaging resin material 6 is formed in a shape corresponding to the shape of the pot 22 (in the illustrated example, a rectangular pot is shown. Therefore, in this case, for example, , It may be formed in the shape of a long plate). Further, the vacuum packaging resin material 6 is a resin tablet obtained by pressing and compacting an amount of resin powder required for one-time resin molding.
39, a packaging body 40 made of a film member having the above heat resistance and the like for accommodating the resin tablet 39, and a lid 41 thereof, and further comprising the packaging body 40 and a lid 41. The inside of the packaging is depressurized to a vacuum state.

When the resin tablet 39 contains air, the residual air forms voids inside and outside the resin molded body and impairs the moisture resistance of the product. It is preferable that the tablet 39 is compression-molded so that it does not contain air at all. However, at the time of resin molding, a predetermined resin pressure is applied to the molten resin material and it is possible to compress the residual air to a negligible level. It may be molded so as to have.

The packaging body 40 has heat resistance to withstand the resin molding temperature, flexibility that can be elastically deformed to prevent damage during resin molding, and non-adhesiveness with resin. Any material may be used, and therefore, for example, a film member (material) of the same quality as or equivalent to the release film 17 may be used for molding. The lid 41 is formed by using the same film member as the packaging body 40. Further, the closing portion 42 between the lid body 41 and the packaging body 40 is sealed so that the vacuum state inside the packaging can be maintained, but by the heating action above the resin molding temperature and / or the plunger 26. It is fixed so as to be peeled and released by the external extrusion action of the molten resin material based on the resin pressure.

A closing portion between the lid 41 and the packaging body 40
42 is fastened in a direction orthogonal to the packaging body 40, and has a required shape-retaining property because both are superposed. Therefore, its fastening posture (see FIG. 5) is Can be held. Therefore, when the packaging body 40 of the vacuum packaging resin material 6 is put into the pot 22, the closing portion 42 is stretched on the PL surface around the opening of the pot 22. Therefore, by inserting the packaging body 40 of the vacuum packaging resin material 6 into the pot 22, the pot 22 portion can be covered with the closing portion 42. In the example shown,
It shows a case where the cavities 23 are arranged on both sides of the pot 22 through the passage portions 24, and a case where the closing portion 42 of the vacuum packaging resin material 6 is provided at the upper end portion of the packaging body 40. There is. Therefore, the lid 41 of the vacuum packaging resin material 6
Are horizontally superposed and fastened to the upper surfaces of the left and right end portions of the packaging body 40 that is bent in the horizontal direction, and are formed to have a T-shaped cross section.

Although the fixed upper die 20 and the movable lower die 21 in the resin sealing molding portion 9 described above are provided with ejector pins 43 for releasing the molded product (see FIG. 5). ), This ejector pin 43 adopts a mold releasing means for causing compressed air to be pressure-fed into the upper and lower cavities (23, 31) and the cull portion 30 via the above-mentioned forced air press-fitting mechanism to eject the air of the molded product. If you do, it is not necessary. However, the auxiliary mold releasing means or the preliminary mold releasing means may be used in combination.

Hereinafter, the case of resin-molding an electronic component using the above apparatus will be described. First, as shown in FIG. 2, a mold opening process of opening the upper and lower molds (20, 21) is performed.
Next, the release roller 37 and the take-up roller 38 in the release film supply mechanism 18 are rotationally operated to release the release film 35.
A release film supplying step is performed in which the release film 17 for preventing resin contact installed inside is automatically fed by a required length required for one resin molding. At this time, the release film 17
Is stretched over the entire PL surface on the upper die 20 side and over the entire PL surface on the lower die 21 side except for the pot 22 (see FIGS. 3 and 5).

Next, the vacuum source of the forced evacuation mechanism (elastic deformation means of the release film 17) is actuated, and the resin filling portions (cavities 31 and 23) and the passage portions (cals) of both upper and lower molds (20 and 21) are activated. Part 30
Etc.) A forced evacuation process is performed in which the air inside is evacuated to the outside through the air passages (34 ・ 29) and forcedly discharged. At this time,
The release film 17, which is supplied close to the PL surfaces of the upper and lower molds (20 and 21), is elastically deformed by the suction force caused by the vacuuming, and as shown in FIG. The PL surface is stretched along the uneven shape (the uneven shape of the cull portion 30, the cavities 31, 23, the passage portion 24, the air vent 32, the recess 27, etc.).

Next, a supply step is carried out in which the pre-molding lead frame 3 and the vacuum packaging resin material 6 are transferred to the resin sealing molding section 9 via the material supply mechanism 12. Since the material supply mechanism 12 in the illustrated example also serves as a supply mechanism for both the pre-molding lead frame 3 and the vacuum packaging resin material 6, the pre-molding lead frame 3
And the vacuum packaging resin material 6 are simultaneously transferred and supplied to the resin sealing molding unit 9. Furthermore, in the case of the illustrated example, the case is shown in which the vacuum packaging resin material 6 is first supplied and then the pre-molding lead frame 3 is supplied while being simultaneously transferred to the resin sealing molding section 9. That is, the supply of the vacuum packaging resin material 6 is such that the vacuum packaging resin material 6 of the material loading unit 7 is engaged by the material supply mechanism 12, and the vacuum packaging resin material 6 is packaged through the material supply mechanism 12. This is performed by putting the main body 40 into the pot 22 in the resin sealing molding portion 9. At this time, as described above, the closing portion 42 of the vacuum packaging resin material 6 is in a state of being stretched on the PL surface around the opening of the pot 22, but the lower mold 21 excluding the pot 22 portion. Since the release film 17 has already been supplied to the entire PL surface, the closing portion 42 is
As shown in FIG. 7, the release film 17 stretched at the position of the lower die passage portion 24 is superposed on the upper surface portion of the release film 17, and therefore, the coating process of the pot 22 portion is thereby performed. Done. When the vacuum packaging resin material 6 is put into the pot 22, the vacuum packaging resin material 6 is heated and melted by the upper and lower molds (20, 21) heated to the molding temperature. The heating process of the vacuum packaging resin material 6 can be performed. Supply of the lead frame 3 before molding
The pre-molded lead frame 3 of the material loading unit 4 is arranged in the alignment unit 5 thereof.
And aligns it in a predetermined direction, the material is supplied to the material supply mechanism 12, and the recess 27 of the lower mold cavity 23 in the resin sealing molding portion 9 is inserted through the material supply mechanism 12. It is done by fitting and setting to. At this time, since the release film 17 and the closing portion 42 of the vacuum packaging resin material 6 are set in the recess 27 in a superposed manner, the release film 17 is attached to one end of the pre-molding lead frame 3. Through the recess
It is fitted in 27 and the release film is on the other end side.
17 and the recess 27 through the closing portion 42 of the vacuum packaging resin material 6.
It will be fitted inside (see FIGS. 7 and 8). It should be noted that the supply operation of both of them to each resin sealing molding portion 9 is different only in the supply position / distance, and the other supply operation is substantially the same as the above case.

Next, after performing the respective supply steps of the release film, the vacuum packaging resin material and the lead frame,
The lower die 21 is moved upward and the upper and lower die (20, 21) is clamped. In addition, after the mold clamping step, or simultaneously with the mold clamping step, an opening / closing mechanism for the passage section provided in the mold passage section 24.
A step of closing the passage portion 24 while pressing the release film 17 on the upper die 20 side stretched in the passage portion 24 and the closing portion 42 of the vacuum packaging resin material 6 through the passage 25; (See FIG. 8).

Next, the above-mentioned plunger 26 pressurizes the vacuum packaging resin material 6 in the pot 22, and a part of the lid 41 of the vacuum packaging resin material 6 and one part of the release film 17 on the upper die side. A film crimping step of crimping the parts is performed (see the crimping part 44 shown in FIG. 8). At this time, the resin tablets 39 in the vacuum packaging resin material 6 are sequentially heated and melted by the heating step, and are subjected to the pressure action by the plunger 26. However, the passage 24
Is in a closed state due to the closing step, the molten resin material passes through the passage portion 24 to form a cavity (23, 31).
It is not transferred to the side.

Next, the release film 17 on the upper die 20 side stretched in the passage portion 24 via the opening / closing mechanism 25 of the passage portion 24.
Then, a process of opening the passage portion 24 for releasing the pressing state of the vacuum packaging resin material 6 against the closing portion 42 is performed (see FIG. 9). At this time, the closed portion 42 of the vacuum packaging resin material 6 receives the release of the pressing state by the opening / closing mechanism 25, the heating action by the heating step and the pressure force by the plunger 26, and the molten resin material 39a inside. Is being pushed out, the fixed state is released and released. Therefore, by this, the molten resin material extruding step of extruding the molten resin material 39a in the packaging body 40 from the closing portion 42 can be performed. Further, the molten resin material 39a extruded in the extrusion process of the molten resin material is passed through the passage portion 24 in a state of being stretched by the above-mentioned release film member (release film 17 / closing portion 42). , A resin encapsulation molding process for the electronic component, in which the electronic component 8 on the lead frame 3 set in the cavity with the molten resin material is resin-encapsulated while being injected and filled into the cavity (23, 31). It can be carried out.

In the resin encapsulation molding process,
As described above, since the release film 17 is stretched on the inner surfaces of the upper and lower cavities (23, 31), the molten resin material 39a
Is injected and filled into the upper and lower cavities through the release film 17, and in this state, a predetermined resin pressure (resin pressure) by the plunger 26 is received. Furthermore,
The mold clamping pressure between the upper and lower molds (20 and 21) is the same as the above release film.
It is added via 17 to the mold surfaces of the upper and lower molds and the surface of the lead frame 3. At this time, the release film 17 interposed between the mold surfaces of the upper and lower molds (20, 21) and between the mold surfaces of the upper and lower molds (20, 21) and the surface of the lead frame 3 is It will act as a buffer between them. Therefore, the upper and lower molds (20, 21) and the upper and lower molds (20, 21) and the lead frame 3 are caused by the mold clamping pressure of the upper and lower molds (20, 21).
And can be closely and reliably adhered,
This is the molten resin material 39a in both upper and lower cavities (23, 31).
There is an advantage that it can be efficiently and effectively acted as a compression molding force against.

Further, the molten resin material 39 is provided between the mold pot 22 and each cavity 23 in each resin sealing molding portion 9 of the resin sealing molding apparatus main body 1 of the electronic parts and the connecting body 2 described above.
Since the passage portion 24 of the a is formed and the opening / closing mechanism 25 for the passage portion is installed in the passage portion 24 of the molten resin material 39a, the molten resin material 39a in the pot 22 is provided in each cavity.
(23 ・ 31) can be injected and filled at the same time. Therefore, the resin encapsulation molding operation of the electronic component in each of the cavities (23, 31) can be performed under uniform conditions, so that it is possible to mold a product having uniform and high quality and high reliability. it can.

Next, after the resin encapsulation molding process for the electronic component, a mold opening process for separating the mold PL surface is performed.

Simultaneously with the mold opening step, the lower mold cavity 23 and the air compression source are connected to each other through the switching valve so that compressed air is passed through the air passage 29.
23, and the upper mold cavity 31 and the cull portion 30 are communicated with the air compression source through the switching valve to send compressed air through the air passage 34 into the upper mold cavity 31 and the cull portion 30. As a result, the upper and lower release films 17, the vacuum packaging film (40 and 41), and the upper and lower release film 17 and the vacuum packaging film (40 and 41) were formed from the mold PL surface. A releasing step is performed to release the sealed lead frame 10 and the unnecessary resin molding 14 at the same time (FIG. 10).
reference). At this time, a part of the release film 17 on the upper mold side and a part of the lid 41 of the vacuum packaging resin material 6 are integrated with each other by the crimping portion 44, and both of them are connected to the sealed lead frame 10. It will be pressure-bonded to the unnecessary resin molding 14. Further, the release film 17 on the lower die side and the packaging body 40 of the vacuum packaging resin material 6 are pressure-bonded to the sealed lead frame 10 and the unnecessary resin molding 14. Therefore, the vacuum packaging film (40, 41) of the vacuum packaging resin material 6 which has become unnecessary can be automatically and surely discharged to the outside of the mold PL surface as the release film 17 is transferred. it can. Sealed lead frame 10
The mold releasing action by the forced air press-in mechanism as described above is sufficient for releasing the mold etc., but the auxiliary mold releasing action by the ejector pin 43 provided on both upper and lower molds (20 ・ 21) is also used. You may do it.

After the mold releasing step, the sealed lead frame 10 and the unnecessary resin molded body 14 are transferred to the unnecessary resin molded body cutting / removing section 15 through the molded product transfer mechanism 13 described above,
The unnecessary resin molded body 14 is cut and removed. Next, the molded product (sealed lead frame 10) obtained by cutting and removing the unnecessary resin molded body 14 is transferred to and housed in the molded product storage section 11 via the molded product transfer mechanism 13.

The present invention is not limited to the above-mentioned embodiments, but may be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

For example, the above-mentioned material supply mechanism 12 includes the pre-molding lead frame 3 loaded and set in the material loading section (4, 7).
Although the case where both supply mechanisms are integrally configured to transfer and supply the vacuum packaging resin material 6 to the predetermined position of the resin sealing molding portion 9 at the same time is shown. The supply mechanism of the lead frame 3 and the supply mechanism of the vacuum packaging resin material 6 may be separately configured.

Since the release film 17 has the required elasticity described above, the molten resin material 39 in the pot 22 is
When a is pressurized and transferred to the cavity (23, 31) side, the molten resin material 39a is efficiently elastically deformed along the shape of the passage portion 24 of the molten resin material and the filling portion such as the cavity due to the flow action of the molten resin material 39a. It will be. Therefore, although it is not always necessary to use the elastically deforming means of the release film by the forced evacuation mechanism as described above, when the forced evacuation mechanism is adopted, the release film is transferred before the pressure transfer of the molten resin material. There is an advantage that the elastic deformation can be performed forcibly and surely along the shapes of the passage portion and the filling portion.

Before performing the above-mentioned mold opening process, the upper and lower air cavities (29, 34) are passed through the upper and lower cavities.
You may make it perform the air compression process of the resin molding which compresses the resin molding in this cavity by sending compressed air into (23 * 31). That is, after performing the resin sealing molding step of the electronic component described above, the air compression step of the resin molding may be performed, and then the die opening step of the mold described above may be performed. In this case, since the resin molded body can be further compressed in addition to the resin sealing molding step, the resin molded body and the electronic component 8 and the lead frame 3 sealed inside the resin molded body can be further compressed.
There is an advantage that the adhesiveness with can be further improved.

[0053]

According to the present invention, in the apparatus main body, the resin sealing molding apparatus in which a plurality of resin sealing molding sections are detachably connected to the apparatus main body, and the resin sealing molding method using this apparatus, It is possible to omit the mold surface cleaning mechanism and the mold surface cleaning operation in each of the resin sealing molding parts. Therefore, in addition to the effect of reducing the molding cost by using both the material supply mechanism and the molded product transfer mechanism, it is possible to simplify the overall configuration and shape of the apparatus by omitting the mold surface cleaning mechanism. At the same time, by simply simplifying the configuration and shape of the device, it is possible to provide a resin encapsulation molding method and device for an electronic component that can easily perform overall automatic control of the device. It has a practical effect.

[Brief description of the drawings]

FIG. 1 is a partially cutaway cross-sectional schematic plan view of a resin encapsulation molding apparatus for an electronic component according to the present invention, which is a resin encapsulation molding apparatus including a resin encapsulation molding unit for a main body of the resin encapsulation molding apparatus. 2 shows a state in which a plurality of connecting bodies made of are connected to each other.

FIG. 2 is a vertical cross-sectional view taken along line AA of FIG. 1 showing the resin encapsulation molding apparatus corresponding to FIG.

FIG. 3 is a schematic cross-sectional plan view showing, in an enlarged manner, a resin encapsulation molding portion of the resin encapsulation molding apparatus corresponding to FIG.

4 is a resin encapsulation molding apparatus corresponding to FIG. 3, which is a partially cutaway vertical sectional view taken along the line BB of FIG. 3, showing a mold clamping state.

5 is a partially cutaway vertical sectional view of the resin sealing molding apparatus corresponding to FIG. 4, showing a mold open state, the mold surface of the mold, a release film, and a lead frame before molding. And the positional relationship of the vacuum packaging resin material.

FIG. 6 is an explanatory view of the operation of the present invention, showing a mold open state of the mold and an elastically deformed state of the release film.

7 is an explanatory view of the operation of the present invention corresponding to FIG.
The mold opening state and the process of supplying the vacuum packaging resin material and the lead frame are shown.

8 is an explanatory view of the operation of the present invention corresponding to FIG.
The mold clamping state and the heating and pressurizing state of the vacuum packaging resin material are shown.

9 is an explanatory view of the operation of the present invention corresponding to FIG.
The mold clamping state and the resin component molding state of the electronic component are shown.

FIG. 10 is an explanatory view of the operation of the present invention, showing a mold open state and a released state of the sealed lead frame and the like.

[Explanation of symbols]

1 Device Main Body 2 Connected Body 3 Pre-Molding Lead Frame 4 Material Loading Section 5 Alignment Section 6 Vacuum Packaging Resin Material 7 Material Loading Section 8 Electronic Component 9 Resin Sealing Molding Section 10 Sealed Lead Frame 11 Molded Product Storage Section 12 Material Supply mechanism 13 Molded product transfer mechanism 14 Unnecessary resin molding 15 Unnecessary resin molding cutting and removing section 16 Mold surface for resin molding 17 Release film 18 Release film supply mechanism 19 Automatic control mechanism 20 Fixed upper mold 21 Movable lower mold 22 Pot 23 Cavity 24 Passage 25 Opening / closing mechanism 26 Plunger 27 Recess for setting 28 Air hole 29 Air passage 30 Cull portion 31 Cavity 32 Air vent 33 Air hole 34 Air passage 35 Release film take-up portion 36 Release film take-up portion 37 Delivery Roller 38 Take-up roller 39 Resin tablet 40 Packaging body 41 Lid 42 Closing part 43 Ejector pin 44 Crimping part

Claims (11)

[Claims] 1. An electronic component such as a semiconductor chip is supplied to a resin encapsulation molding section of a plurality of resin encapsulation molding apparatuses, and each electronic component is encapsulated with a resin material in each resin encapsulation molding section. A resin encapsulation molding method for electronic parts, which prevents resin contact on the entire PL surface of one mold that does not have a pot for supplying resin material and on the entire PL surface of the other die excluding the pot. For supplying mold release film for
Supplying the mold release film by stretching the mold release film on almost the entire PL surface, forced exhaustion process of forcibly exhausting the air in the resin filling part and passage part of the mold to the outside, and in the pot Vacuum packaging resin material supply process that supplies the vacuum packaging resin material with the closed part of the vacuum packaging film, and supply of the lead frame that fits and sets the lead frame on which the electronic parts are mounted in a predetermined position in the cavity of the mold. After performing the above-mentioned process, the release film, the vacuum packaging resin material, and the lead frame supply process, the mold clamping process of closing the mold PL surface, and the mold clamping process, The vacuum packaging film closing portion of the vacuum packaging resin material supplied into the pot is polymerized and inserted between the release films so that the vacuum packaging film closing portion is closed. Thus, a coating step of the mold pot portion in which a film is stretched over the entire surface of the mold pot portion, a heating step of the vacuum packaging resin material for heating the vacuum packaging resin material in the pot, and a vacuum in the pot. A film crimping step of pressurizing the packaging resin material to crimp a part of the vacuum packaging film of the vacuum packaging resin material and a part of the release film, and heating and pressing the vacuum packaging resin material in the pot. hand,
Extrusion of the molten resin material that melts the resin material in the vacuum packaging film and opens the closed portion of the vacuum packaging film, and extrudes the molten resin material in the vacuum packaging film from the opened closed portion of the vacuum packaging film. And the molten resin material extruded in the step of extruding the molten resin material into the cavity through a passage portion provided between the pot of the mold and the cavity and filling the cavity with the molten resin material. After the resin encapsulation molding process of the electronic component for resin-encapsulating the electronic component on the lead frame set in the cavity, and after the resin encapsulation molding process of the electronic component, the mold
A mold opening step of separating the PL surface from each other, and, in the mold opening step of the mold, from the mold PL surface, the release film, a vacuum packaging film crimped thereto, and the release film. A mold releasing step of releasing the resin molded body and the lead frame molded between the vacuum packaging film and the vacuum packaging film. 2. A method of air-compressing a resin molded body for compressing a resin molded body in the cavity by performing compressed air pressure feeding before the mold opening step of the mold. The resin encapsulation molding method for an electronic component according to claim 1. 3. A body of a resin encapsulation molding apparatus for an electronic component, comprising a resin encapsulation molding unit for encapsulating an electronic component such as a semiconductor chip with a resin material, and at least resin encapsulation molding for the body. A resin encapsulation molding apparatus for electronic parts, which is configured to detachably mount a coupling body composed of a resin encapsulation molding apparatus including a portion, wherein A resin-sealing of an electronic component, characterized in that a mold-release film supply mechanism for supplying a mold-release film for preventing resin contact with the surface of the resin-molding die in the resin-sealing molding part is arranged. Molding equipment. 4. The electronic component supply mechanism for supplying an electronic component to a resin-encapsulation molding unit is provided in a main body of the resin-encapsulation molding apparatus for an electronic component. Resin molding equipment. 5. The vacuum packaging resin material supply mechanism for supplying the vacuum packaging resin material to the resin sealing molding section, in the resin sealing molding apparatus main body of the electronic component. Resin molding equipment for electronic components. 6. A resin encapsulation molding apparatus main body for an electronic component is provided with an electronic component supply mechanism and a vacuum packaging resin material supply mechanism, and the electronic component supply mechanism and the vacuum packaging resin material supply mechanism are provided. The resin encapsulation molding apparatus for an electronic component according to claim 3, wherein the resin encapsulation molding apparatus is formed integrally. 7. A mold release film supplied to a passage portion and a filling portion of a molten resin material in a mold of each resin sealing molding portion of a resin sealing molding device main body of an electronic component and a connector. 4. The resin encapsulation molding apparatus for electronic parts according to claim 3, further comprising elastic deformation means of the release film for elastically deforming along the shape of the filling portion. 8. The elastic deformation means of the release film is a forced exhaust mechanism for exhausting the air in the passage portion and the filling portion of the molten resin material provided in the mold of the resin sealing molding portion to the outside. The resin encapsulation molding apparatus for an electronic component according to claim 7. 9. A resin molded body molded at a resin sealing molded device main body of an electronic component and each resin sealing molded part of a connecting body is molded at a passage portion and a filling portion of a molten resin material in the mold to the outside. The resin encapsulation molding apparatus for an electronic component according to claim 3, wherein an extruding means for extruding the resin molding is provided. 10. An extruding means of the resin molded body is a forced air press-fitting mechanism for pressurizing air into the passage portion and the filling portion of the molten resin material provided in the mold of the resin sealing molding portion. Item 10. A resin encapsulation molding apparatus for an electronic component according to Item 9. 11. A molten resin material passage portion is formed between a mold pot and a cavity in each resin sealing molding portion of an electronic component resin sealing molding device main body and a connector, and the molten resin material is formed. The resin encapsulation molding apparatus for an electronic component according to claim 3, wherein an opening and closing mechanism for the passage is installed in the passage.